Display device

By adopting a design with a specific structure in the OLED display device, including a specific lower electrode, rib layer, partition wall and organic layer layout, the improvement space for the existing OLED display device in terms of output and display quality is solved, and a higher sub-pixel opening rate and a more uniform laminated film thickness are achieved, and the overall display performance is improved.

CN119630187APending Publication Date: 2025-03-14MAGNOLIA WHITE CORP
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
CN202411269753.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-09-13
Filing Date
2024-09-11
Publication Date
2025-03-14

AI Technical Summary

Technical Problem

There is room for improvement in the output and display quality of existing OLED display devices.

Method used

A display device having a specific structure is adopted, including a lower electrode having the first and second ends, a rib layer covering the lower electrode, a partition wall arranged above the rib layer, an organic layer contacts the lower electrode through a pixel opening and emits light, and an upper electrode covering the organic layer.

Benefits of technology

With this structure, the output and display quality of the display device can be improved, which is specifically manifested in improving the opening rate of the sub-pixels and the thickness distribution of the laminated film, thereby improving the overall display performance.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN119630187A_ABST
    Figure CN119630187A_ABST
Patent Text Reader

Abstract

The invention provides a display device. According to one embodiment, a display device includes: a first lower electrode having a first end portion; a second lower electrode having a second end portion separated from the first end portion; a rib layer having first and second pixel openings overlapping the first and second lower electrodes, respectively, and covering the first and second end portions; a partition wall having a lower portion located between the first and second pixel openings and disposed above the rib layer, and an upper portion having an end portion protruding from a side surface of the lower portion; a first organic layer that passes through the first pixel opening and is in contact with the first lower electrode; a second organic layer that passes through the second pixel opening and is in contact with the second lower electrode; a first upper electrode covering the first organic layer; and a second upper electrode covering the second organic layer. The first end portion overlaps the lower portion in a plan view, and the second end portion does not overlap the lower portion in a plan view.
Need to check novelty before this filing date? Find Prior Art

Description

[0001] Cross-references to related applications

[0002] This application claims priority based on Japanese Patent Application No. 2023-148307 filed on September 13, 2023, and cites all the contents described in the Japanese Patent Application. Technical Field

[0003] An embodiment of the present invention relates to a display device. Background Art

[0004] In recent years, display devices using organic light emitting diodes (OLEDs) as display elements have been put into practical use. In such display devices, technology that can improve yield and display quality is required. Summary of the invention

[0005] In general, according to an embodiment, a display device includes: a first lower electrode having a first end; a second lower electrode having a second end separated from the first end; a rib layer having a first pixel opening overlapping the first lower electrode and a second pixel opening overlapping the second lower electrode, and covering the first end and the second end; a partition wall including a lower portion located between the first pixel opening and the second pixel opening and arranged above the rib layer, and an upper portion having an end protruding from a side surface of the lower portion; a first organic layer passing through the first pixel opening and contacting the first lower electrode, and emitting light by applying a voltage; a second organic layer passing through the second pixel opening and contacting the second lower electrode, and emitting light by applying a voltage; a first upper electrode covering the first organic layer; and a second upper electrode covering the second organic layer. Moreover, the first end overlaps with the lower portion in a plan view, and the second end does not overlap with the lower portion in a plan view.

[0006] According to another aspect of the embodiment, the display device comprises: a lower electrode having a first end and a second end; a rib layer having a pixel opening overlapping with the lower electrode and covering the first end and the second end; a partition wall surrounding the pixel opening, comprising a lower portion arranged above the rib layer and an upper portion having an end protruding from a side surface of the lower portion; an organic layer passing through the pixel opening and contacting the lower electrode, emitting light by applying a voltage; and an upper electrode covering the organic layer. Moreover, the first end overlaps with the lower portion in a plan view, and the second end does not overlap with the lower portion in a plan view.

[0007] According to these structures, it is possible to improve the yield of the display device or enhance the display quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 This is a diagram showing a configuration example of a display device according to the first embodiment.

[0009] Figure 2 This is a schematic plan view showing an example of the layout of sub-pixels according to the first embodiment.

[0010] Figure 3 It is along Figure 2 A schematic cross-sectional view of the display device taken along line AB in FIG.

[0011] Figure 4 It is along Figure 2 Schematic cross-sectional view of the display device along line CD.

[0012] Figure 5 This is a diagram showing an example of a layer structure that can be applied to an organic layer.

[0013] Figure 6 yes Figure 2 A schematic enlarged top view of a sub-pixel is shown.

[0014] Figure 7 yes Figure 3 A schematic enlarged cross-sectional view of the lower electrode, rib layer and partition wall is shown on the left.

[0015] Figure 8 yes Figure 3 A schematic enlarged cross-sectional view showing the vicinity of both end portions of the lower electrode.

[0016] Fig. 9 It is a schematic cross-sectional view of the structure of a comparative example.

[0017] Fig.10 This is a schematic cross-sectional view of the structure of another comparative example.

[0018] Fig.11 It is a schematic cross-sectional view of a display device according to the second embodiment.

[0019] Fig.12 It is a schematic enlarged plan view of a sub-pixel according to the third embodiment.

[0020] Fig.13 It is a schematic enlarged plan view of a sub-pixel according to the fourth embodiment.

[0021] Fig.14 It is a schematic enlarged plan view of a sub-pixel according to the fifth embodiment.

[0022] Fig.15 This is a schematic enlarged top view of a sub-pixel according to the sixth embodiment. DETAILED DESCRIPTION

[0023] Several embodiments will be described with reference to the drawings.

[0024] The present disclosure is only an example, and appropriate changes that maintain the main purpose of the invention and that are easily conceivable by those skilled in the art are of course included in the scope of the present invention. In addition, in order to make the description clearer, the width, thickness, shape, etc. of each part of the drawings are sometimes schematically shown compared to the actual method, but this is only an example and does not limit the interpretation of the present invention. In addition, in this specification and each figure, the same figure mark is sometimes used to mark the constituent elements that perform the same or similar functions as the constituent elements described in the drawings that appeared in the previous text, and repeated detailed descriptions are appropriately omitted.

[0025] It should be noted that in the drawings, mutually orthogonal X-axis, Y-axis and Z-axis are recorded as needed for easy understanding. The direction along the X-axis is called the X-direction, the direction along the Y-axis is called the Y-direction, and the direction along the Z-axis is called the Z-direction. The Z-direction is the normal direction of the plane including the X-direction and the Y-direction. In addition, observing various elements parallel to the Z-direction is called a top view.

[0026] The display device of each embodiment is an organic electroluminescent display device having an organic light emitting diode (OLED) as a display element, and can be mounted on various electronic devices such as televisions, personal computers, vehicle-mounted equipment, tablet terminals, smartphones, mobile phone terminals, wearable terminals, etc.

[0027] [First embodiment]

[0028] Figure 1 1 is a diagram showing a configuration example of a display device DSP according to the first embodiment. The display device DSP has an insulating substrate 10. The substrate 10 has a display area DA for displaying an image and a peripheral area SA around the display area DA. The substrate 10 may be glass or a flexible resin film.

[0029] In the present embodiment, the shape of the substrate 10 in a plan view is a rectangle, but the shape of the substrate 10 in a plan view is not limited to a rectangle, and may be other shapes such as a square, a circle, or an ellipse.

[0030] The display area DA includes a plurality of pixels PX arranged in a matrix in the X direction and the Y direction. The pixel PX includes a plurality of sub-pixels SP that display different colors. In the present embodiment, it is assumed that the pixel PX includes a blue sub-pixel SP1, a green sub-pixel SP2, and a red sub-pixel SP3. However, the pixel PX may also include a sub-pixel SP of another color such as white in addition to the sub-pixels SP1, SP2, and SP3, or in place of one of the sub-pixels SP1, SP2, and SP3.

[0031] The sub-pixel SP includes a pixel circuit 1 and a display element DE driven by the pixel circuit 1. The pixel circuit 1 includes a pixel switch 2, a driving transistor 3, and a capacitor 4. The pixel switch 2 and the driving transistor 3 are switching elements composed of, for example, thin film transistors.

[0032] In the display area DA, a plurality of scanning lines GL for supplying scanning signals to the pixel circuits 1 of the sub-pixels SP, a plurality of signal lines SL for supplying video signals to the pixel circuits 1 of the sub-pixels SP, and a plurality of power supply lines PL are arranged. Figure 1 In the example of FIG. 5 , the scanning lines GL and the power lines PL extend in the X direction, and the signal lines SL extend in the Y direction.

[0033] The gate electrode of the pixel switch 2 is connected to the scanning line GL. The source electrode of the pixel switch 2 is connected to the signal line SL. The drain electrode of the pixel switch 2 is connected to the gate electrode of the driving transistor 3 and the capacitor 4. The source electrode of the driving transistor 3 is connected to the power line PL and the capacitor 4. The drain electrode of the driving transistor 3 is connected to the display element DE.

[0034] In addition, the structure of the pixel circuit 1 is not limited to the example shown in the figure. For example, the pixel circuit 1 may include more thin film transistors and capacitors.

[0035] Figure 2 is a schematic top view showing an example of the layout of sub-pixels SP1, SP2, and SP3. Figure 2 In the example of FIG. 1 , there are formed columns in which sub-pixels SP2 and SP3 are alternately arranged in the Y direction, and columns in which a plurality of sub-pixels SP1 are repeatedly arranged in the Y direction. These columns are alternately arranged in the X direction.

[0036] For example, the widths of the sub-pixels SP1 , SP2 , and SP3 in the X direction are equal. Also, the width of the sub-pixel SP1 in the Y direction is equal to the total width of the sub-pixels SP2 and SP3 in the Y direction.

[0037] The layout of the sub-pixels SP1, SP2, SP3 or the sizes of the sub-pixels SP1, SP2, SP3 are not limited to Figure 2 As another example, the sub-pixels SP1, SP2, and SP3 may be arranged in the X direction. In addition, at least two sizes of the sub-pixels SP1, SP2, and SP3 may be equal.

[0038] The rib layer 5 is disposed in the display area DA. The rib layer 5 has pixel openings AP1, AP2, and AP3 in the sub-pixels SP1, SP2, and SP3, respectively. Figure 2In the example, the pixel opening AP1 is larger than the pixel opening AP2, and the pixel opening AP2 is larger than the pixel opening AP3. That is, among the sub-pixels SP1, SP2, and SP3, the sub-pixel SP1 has the largest aperture ratio, and the sub-pixel SP3 has the smallest aperture ratio.

[0039] The partition wall 6 is disposed in the display area DA. The partition wall 6 is located above the rib layer 5 and overlaps with the rib layer 5 as a whole. Figure 2 In the example of , the partition wall 6 has the same planar shape as the rib layer 5. That is, the partition wall 6 has openings in the sub-pixels SP1, SP2, and SP3. From another point of view, the partition wall 6 is lattice-shaped in a plan view, surrounding each of the pixel openings AP1, AP2, and AP3.

[0040] The sub-pixel SP1 has a display element DE1 including a lower electrode LE1 overlapping the pixel opening AP1. The sub-pixel SP2 has a display element DE2 including a lower electrode LE2 overlapping the pixel opening AP2. The sub-pixel SP3 has a display element DE3 including a lower electrode LE3 overlapping the pixel opening AP3.

[0041] The pixel circuits 1 of the sub-pixels SP1, SP2, and SP3 are respectively arranged below the lower electrodes LE1, LE2, and LE3. The lower electrode LE1 passes through the contact hole CH1 and is connected to the pixel circuit 1 of the sub-pixel SP1. The lower electrode LE2 passes through the contact hole CH2 and is connected to the pixel circuit 1 of the sub-pixel SP2. The lower electrode LE3 passes through the contact hole CH3 and is connected to the pixel circuit 1 of the sub-pixel SP3.

[0042] Figure 3 It is along Figure 2 A schematic cross-sectional view of the display device DSP taken along line AB in FIG. Figure 4 It is along Figure 2 A schematic cross-sectional view of the display device DSP taken along line CD in FIG.

[0043] like Figure 3 as well as Figure 4 As shown, a circuit layer 11 is disposed on the substrate 10. The circuit layer 11 includes Figure 1 The illustrated components include pixel circuits 1 , scanning lines GL, signal lines SL, power lines PL, and other various circuits and wirings.

[0044] The circuit layer 11 is covered with an organic insulating layer 12. The organic insulating layer 12 functions as a planarizing film that planarizes the unevenness generated in the circuit layer 11. Figure 2 The contact holes CH1 , CH2 , and CH3 shown are provided in the organic insulating layer 12 .

[0045] The lower electrodes LE1, LE2, LE3 are arranged on the organic insulating layer 12. The rib layer 5 is arranged on the organic insulating layer 12 and the lower electrodes LE1, LE2, LE3. The end portions of the lower electrodes LE1, LE2, LE3 are covered by the rib layer 5.

[0046] The partition wall 6 includes a conductive lower portion 61 disposed on the rib layer 5, and an upper portion 62 disposed on the lower portion 61. The upper portion 62 has a greater width than the lower portion 61. Thus, both ends of the upper portion 62 protrude further than the side surfaces of the lower portion 61. This shape of the partition wall 6 is called an overhanging shape.

[0047] exist Figure 3 In the example of FIG. 5 , the lower portion 61 includes a base layer 63 and a shaft layer 64. The base layer 63 is located between the shaft layer 64 and the rib layer 5 and is formed thinner than the shaft layer 64. For example, both ends of the base layer 63 protrude from the side surfaces of the shaft layer 64.

[0048] In addition, Figure 3 In the example of , the upper portion 62 has a first top layer 65 and a second top layer 66. The first top layer 65 is arranged on the shaft layer 64. The second top layer 66 is arranged on the first top layer 65. As shown in the figure, the second top layer 66 can be formed thinner than the first top layer 65. In addition, the second top layer 66 can have a smaller width than the first top layer 65.

[0049] like Figure 3 As shown in FIG. 1 , a laminated film FL1 and a sealing layer SE11 are disposed in the sub-pixel SP1, and a laminated film FL2 and a sealing layer SE12 are disposed in the sub-pixel SP2. Figure 4 As shown in FIG. 1 , a stacked film FL3 and a sealing layer SE13 are disposed in the sub-pixel SP3 .

[0050] The laminated film FL1 includes an organic layer OR1, an upper electrode UE1, and a cap layer CP1. The laminated film FL2 includes an organic layer OR2, an upper electrode UE2, and a cap layer CP2. The laminated film FL3 includes an organic layer OR3, an upper electrode UE3, and a cap layer CP3.

[0051] The organic layer OR1 covers the rib layer 5 and contacts the lower electrode LE1 through the pixel opening AP1. The organic layer OR2 covers the rib layer 5 and contacts the lower electrode LE2 through the pixel opening AP2. The organic layer OR3 covers the rib layer 5 and contacts the lower electrode LE3 through the pixel opening AP3.

[0052] The upper electrodes UE1, UE2, UE3 cover the organic layers OR1, OR2, OR3 respectively. The upper electrodes UE1, UE2, UE3 are in contact with at least one of the bottom layer 63 and the shaft layer 64 of the partition 6. The cap layers CP1, CP2, CP3 cover the upper electrodes UE1, UE2, UE3 respectively.

[0053] The lower electrode LE1 and the portion of the laminated film FL1 that overlaps with the pixel opening AP1 constitute the display element DE1 of the sub-pixel SP1. The lower electrode LE2 and the portion of the laminated film FL2 that overlaps with the pixel opening AP2 constitute the display element DE2 of the sub-pixel SP2. The lower electrode LE3 and the portion of the laminated film FL3 that overlaps with the pixel opening AP3 constitute the display element DE3 of the sub-pixel SP3.

[0054] A portion of the laminate film FL1 is located above the upper portion 62. This portion is separated from the portion around the partition wall 6 located in the laminate film FL1 (the portion constituting the display element DE1). Similarly, a portion of the laminate film FL2 is located above the upper portion 62, and this portion is separated from the portion around the partition wall 6 located in the laminate film FL2 (the portion constituting the display element DE2). Furthermore, a portion of the laminate film FL3 is located above the upper portion 62, and this portion is separated from the portion around the partition wall 6 located in the laminate film FL3 (the portion constituting the display element DE3).

[0055] The sealing layers SE11, SE12, SE13 are formed thicker than the laminated films FL1, FL2, FL3. The sealing layers SE11, SE12, SE13 are not separated by the partition walls 6, and continuously cover the laminated films FL1, FL2, FL3 or the side portions of the partition walls 6.

[0056] exist Figure 3 In the example of FIG. 1 , the laminated film FL1 and the sealing layer SE11 on the partition wall 6 between the sub-pixels SP1 and SP2 are separated from the laminated film FL2 and the sealing layer SE12 on the partition wall 6 . Figure 4 In the example of FIG. 1 , the stacked film FL1 and the sealing layer SE11 on the partition wall 6 between the sub-pixels SP2 and SP3 are separated from the stacked film FL3 and the sealing layer SE13 on the partition wall 6 .

[0057] like Figure 3 as well as Figure 4 As shown, the sealing layers SE11, SE12, and SE13 are covered by the resin layer RS1. The resin layer RS1 is covered by the sealing layer SE2. The sealing layer SE2 is covered by the resin layer RS2. The resin layers RS1, RS2, and the sealing layer SE2 are continuously provided at least in the entire display area DA, and a part of them is also provided in the peripheral area SA.

[0058] A covering member such as a polarizing plate, a protective film, or a cover glass may be disposed on the resin layer RS2. Such a covering member may be bonded to the resin layer RS2 via an adhesive layer such as OCA (Optical Clear Adhesive).

[0059] The organic insulating layer 12 is formed of an organic insulating material such as polyimide. The rib layer 5 and the sealing layers SE11, SE12, SE13, SE2 are formed of inorganic insulating materials such as silicon nitride (SiNx), silicon oxide (SiOx), or silicon oxynitride (SiON). In one example, the rib layer 5 is formed of silicon oxynitride, and the sealing layers SE11, SE12, SE13, SE2 are formed of silicon nitride. The resin layers RS1 and RS2 are formed of resin materials (organic insulating materials) such as epoxy resin and acrylic resin.

[0060] The lower electrodes LE1, LE2, and LE3 have a reflective layer and a pair of conductive oxide layers covering the upper and lower surfaces of the reflective layer, respectively. The reflective layer can be formed using a metal material such as silver that has excellent light reflectivity. Each conductive oxide layer can be formed of a transparent conductive oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or IGZO (Indium Gallium Zinc Oxide).

[0061] The upper electrodes UE1, UE2, UE3 are formed of a metal material such as an alloy of magnesium and silver (MgAg), etc. For example, the lower electrodes LE1, LE2, LE3 correspond to anodes, and the upper electrodes UE1, UE2, UE3 correspond to cathodes.

[0062] Figure 5 : is a diagram showing an example of a layer structure applicable to the organic layers OR1, OR2, and OR3. The organic layers OR1, OR2, and OR3 are composed of a plurality of thin films including a light-emitting layer EML. In the present embodiment, it is assumed that the organic layers OR1, OR2, and OR3 have a structure in which a hole injection layer HIL, a hole transport layer HTL, an electron blocking layer EBL, a light-emitting layer EML, a hole blocking layer HBL, an electron transport layer ETL, and an electron injection layer EIL are sequentially stacked in the Z direction. However, the organic layers OR1, OR2, and OR3 may also have other structures such as a so-called series structure including a plurality of light-emitting layers EML.

[0063] The cover layers CP1, CP2, and CP3, for example, have a stacked structure in which a plurality of transparent layers are overlapped. These transparent layers may include layers formed of inorganic materials and layers formed of organic materials. In addition, these transparent layers have different refractive indices from each other. For example, the refractive indices of these transparent layers are different from the refractive indices of the upper electrodes UE1, UE2, and UE3 and the refractive indices of the sealing layers SE11, SE12, and SE13. The cover layers CP1, CP2, and CP3 respectively have the function of serving as optical adjustment layers that improve the efficiency of obtaining light emitted from the organic layers OR1, OR2, and OR3. In addition, at least one of the cover layers CP1, CP2, and CP3 may be omitted.

[0064] The bottom layer 63 and the shaft layer 64 of the partition wall 6 are formed of, for example, different metal materials. As the metal material of the bottom layer 63, for example, molybdenum (Mo), titanium (Ti), titanium nitride (TiN), molybdenum-tungsten alloy (MoW) or molybdenum-niobium alloy (MoNb) can be used. As the metal material (Al) of the shaft layer 64, for example, aluminum, aluminum-neodymium alloy (AlNd), aluminum-yttrium alloy (AlY) or aluminum-silicon alloy (AlSi) can be used. In addition, at least one of the bottom layer 63 and the shaft layer 64 may have a stacked structure of multiple layers. In addition, the shaft layer 64 may include a layer formed of an insulating material.

[0065] For example, the first top layer 65 of the partition wall 6 is formed of a metal material, and the second top layer 66 is formed of a transparent conductive oxide. As the metal material of the first top layer 65, for example, titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy, or molybdenum-niobium alloy can be used. As the conductive oxide of the second top layer 66, for example, ITO or IZO can be used. In addition, the upper portion 62 may have a single-layer structure formed of a specific material. In addition, the upper portion 62 may include a layer formed of an insulating material.

[0066] A common voltage is supplied to the partition wall 6. The common voltage is supplied to the upper electrodes UE1, UE2, and UE3 respectively in contact with the lower portion 61. That is, the partition wall 6 functions as a wiring for supplying a common voltage to the upper electrodes UE1, UE2, and UE3. Pixel voltages corresponding to the image signals of the signal lines SL are supplied to the lower electrodes LE1, LE2, and LE3 respectively through the pixel circuits 1 of the sub-pixels SP1, SP2, and SP3.

[0067] The organic layers OR1, OR2, and OR3 emit light by applying a voltage. Specifically, if a potential difference is formed between the lower electrode LE1 and the upper electrode UE1, the light-emitting layer EML of the organic layer OR1 emits light in a blue wavelength range. If a potential difference is formed between the lower electrode LE2 and the upper electrode UE2, the light-emitting layer EML of the organic layer OR2 emits light in a green wavelength range. If a potential difference is formed between the lower electrode LE3 and the upper electrode UE3, the light-emitting layer EML of the organic layer OR3 emits light in a red wavelength range.

[0068] As another example, the light-emitting layers EML of the organic layers OR1, OR2, and OR3 may also emit light of the same color (for example, white). In this case, the display device DSP may also include a color filter that converts the light emitted by the light-emitting layer EML into light of a color corresponding to the sub-pixels SP1, SP2, and SP3. In addition, the display device DSP may also include a layer including quantum dots that are excited by the light emitted by the light-emitting layer EML to generate light of a color corresponding to the sub-pixels SP1, SP2, and SP3.

[0069] Figure 6 yes Figure 2 The schematic enlarged top view of the sub-pixels SP1, SP2, and SP3 shown in FIG. These sub-pixels SP1, SP2, and SP3 constitute the above-mentioned pixel PX. Figures 4 to 6 , details of the shapes of the rib layer 5, the partition wall 6, and the lower electrodes LE1, LE2, and LE3 are described.

[0070] like Figure 6 As shown, the lower electrode LE1 has ends E1a, E1b, E1c, and E1d. The lower electrode LE2 has ends E2a, E2b, E2c, and E2d. The lower electrode LE3 has ends E3a, E3b, E3c, and E3d. The ends E1a, E1b, E2a, E2b, E3a, and E3b extend parallel to the Y direction. In addition, the ends E1c, E1d, E2c, E2d, E3c, and E3d extend parallel to the X direction. Each end is covered by the rib layer 5.

[0071] Figure 6 The illustrated partition wall 6 (the portion marked with a dot pattern) corresponds to the shape of the lower portion 61, more specifically, to the shape of the shaft layer 64. The lower portion 61 has substantially the same width as a whole. However, a portion 61X of the lower portion 61 extending along the X direction between the sub-pixels SP2 and SP3 has a greater width than other portions.

[0072] In the present embodiment, a portion (first end) of each end of the lower electrodes LE1, LE2, LE3 overlaps with the shaft layer 64, and the remaining portion (second end) does not overlap with the shaft layer 64. Here, the ends of the lower electrodes LE1, LE2, LE3 overlap with the lower portion 61, which means that these ends are located below the lower portion 61.

[0073] Specifically, the ends E1a and E1c of the lower electrode LE1 overlap with the lower portion 61, while the ends E1b and E1d do not overlap with the lower portion 61. In addition, the ends E2a, E2c, and E2d of the lower electrode LE2 overlap with the lower portion 61, while the end E2b does not overlap with the lower portion 61. In addition, the ends E3a and E3c of the lower electrode LE3 overlap with the lower portion 61, while the ends E3b and E3d do not overlap with the lower portion 61.

[0074] For example, focusing on the lower electrodes LE1, LE2 and the lower portion 61 therebetween, one of the ends of the lower electrodes LE1, LE2 overlaps with the lower portion 61, and the other does not overlap with the lower portion 61. In this way, the relationship that the lower portion 61 overlaps with one end (first end) of the adjacent lower electrode and does not overlap with the other end (second end) is established in most of the lower portion 61. However, the portion 61X overlaps with both the end E2d of the lower electrode LE2 and the end E3c of the lower electrode LE3.

[0075] exist Figure 6 In the example, the partition wall 6 (lower portion 61) overlapping the end E1a has a convex portion P1 protruding toward the pixel opening AP1. In addition, the pixel opening AP1 has a concave portion R recessed into a shape corresponding to the convex portion P1. The contact hole CH1 is located between the end E1a and the pixel opening AP1 and overlaps the convex portion P1.

[0076] The end E2d of the lower electrode LE2 has a convex portion P2 protruding toward the lower electrode LE3. In addition, the end E3c of the lower electrode LE3 has a convex portion P3 protruding toward the lower electrode LE2. These convex portions P2 and P3 overlap with the portion 61X. The contact hole CH2 overlaps with the convex portion P2 and the portion 61X. In addition, the contact hole CH3 overlaps with the convex portion P3 and the portion 61X.

[0077] In addition, the positions of the contact holes CH1, CH2, and CH3 are not limited to Figure 6 For example, the contact hole CH1 may be provided between the end E1c and the pixel opening AP1. In this case, the partition wall 6 overlapping the end E1c may have the protrusion P1.

[0078] like Figure 3 as well as Figure 4 As shown in FIG. 1 , a step portion ST corresponding to the end of the lower electrodes LE1, LE2, and LE3 is generated on the upper surface of the rib layer 5. Figure 3 as well as Figure 4 As shown in the end portions E1a, E2a, E2c, E2d, and E3c, the step portion ST (first step portion) generated at the end portion below the partition wall 6 is covered by the bottom layer 63 and the shaft layer 64. The upper surfaces of the shaft layer 64, the first top layer 65, and the second top layer 66 can be deformed according to the step portion ST.

[0079] On the other hand, for example Figure 3 as well as Figure 4 As shown in the end portions E1b, E2b, and E3d, the step portion ST (second step portion) generated by the end portions not being located below the partition wall 6 is not covered by the base layer 63 and the shaft layer 64. The laminated films FL1, FL2, and FL3 can be deformed by the step portion ST.

[0080] Figure 7 yes Figure 3 The schematic enlarged cross-sectional view of the lower electrodes LE1 and LE2, the rib layer 5 and the partition wall 6 shown on the left side of FIG. The following describes the details of the structure that can be applied to a pair of adjacent lower electrodes, the rib layer 5 overlapping with the pair of lower electrodes, and the partition wall 6 overlapping with the end of one side of the pair of lower electrodes, using this figure as a representative.

[0081] Figure 7 The rib layer 5 shown has a width Wa. The partition wall 6 has a width Wb smaller than the width Wa (Wa>Wb). The width Wa corresponds to the distance between the pixel openings AP1 and AP2. The width Wb corresponds to the width of the upper portion 62, more specifically, the width of the first cap layer 65.

[0082] The distance Da between the lower electrodes LE1 and LE2 is smaller than the width Wa (Da<Wa). The distance Da is equal to the width Wb, for example. In one example, the width Wa is 8 to 10 μm, and the width Wb and the distance Da are 4 to 5 μm, respectively.

[0083] The end E2b of the lower electrode LE2 is separated from the upper portion 62 in a plan view. The distance Db between the end E2b and the upper portion 62 in a plan view is, for example, not less than 1 / 2 of the total thickness T of the rib layer 5 and the lower portion 61 (the base layer 63 and the shaft layer 64).

[0084] In this embodiment, the distance Dc1 (first distance) between the end E1a and the pixel opening AP1 in a plan view is greater than the distance Dc2 (second distance) between the end E2b and the pixel opening AP2 in a plan view (Dc1>Dc2). Figure 7 The width of the area of ​​the middle and lower electrodes LE1 covered by the rib layer 5. The distance Dc2 is equivalent to Figure 7 The width of the area of ​​the middle lower electrode LE2 covered by the rib layer 5.

[0085] Figure 7 The structure shown can also be applied to the structure near the adjacent lower electrodes LE1 and LE3, the structure near the adjacent lower electrodes LE2 and LE3, and the structure near the adjacent two lower electrodes LE1. Figure 6 The structure near the portion 61X shown is as follows Figure 4 As shown on the left, Figure 7 The structure is different.

[0086] Figure 8 yes Figure 3 FIG. 1 is a schematic enlarged cross-sectional view of the vicinity of the end portions E1a and E1b of the lower electrode LE1. Figure 7 In the figure, the structure is described focusing on the ends of two adjacent lower electrodes. Figure 8As illustrated, this structure also occurs when focusing on the end portion of one lower electrode.

[0087] That is, in Figure 8 In the example, the end E1b of the lower electrode LE1 and the upper portion 62 are separated from each other in a plan view. The distance Db between the end E1b and the upper portion 62 in a plan view is, for example, greater than 1 / 2 of the total thickness T of the rib layer 5 and the lower portion 61. In addition, the distance Dc1 between the end E1a and the pixel opening AP1 is greater than the distance Dc2 between the end E1b and the pixel opening AP1 (Dc1>Dc2).

[0088] For example, the structures of the ends E1c and E1d of the lower electrode LE1, the ends E2a and E2b of the lower electrode LE2, the ends E3a and E3b of the lower electrode LE3, and the ends E3c and E3d of the lower electrode LE3 are also similar to those of the lower electrode LE1. Figure 8 Same as shown.

[0089] Fig. 9 as well as Fig.10 are schematic cross-sectional views of the structures of the comparative examples. Figure 7 Similarly, attention is paid to the end portions E1 a and E2 b of the lower electrodes LE1 and LE2 , the rib layers 5 , and the barrier ribs 6 .

[0090] exist Fig. 9 In the embodiment, the end E1a of the lower electrode LE1 and the end E2b of the lower electrode LE2 are not located below the partition wall 6 . Therefore, the step portion ST generated by these end portions E1a and E2b is exposed from the lower portion 61 .

[0091] When forming the partition wall 6, the layers for processing into the bottom layer 63, the shaft layer 64, the first top layer 65, and the second top layer 66 are formed on the entire display area DA. These layers are deformed according to the step portion ST. Assuming that a design is adopted in which the step portion ST is close to the lower portion 61, the end of the upper portion 62 (the first top layer 65 and the second top layer 66) protruding from the lower portion 61 includes a portion that is deformed due to the influence of the step portion ST. Specifically, there is a possibility that the end of the upper portion 62 is warped upward.

[0092] The layers constituting the stacked films FL1, FL2, and FL3 are formed by evaporation on the entire display area DA, and are partitioned by the overhanging partition wall 6. If the end of the upper portion 62 is warped upward, for example, the organic layers OR1, OR2, and OR3 may adhere to a wide range of the lower portion 61, which may hinder the contact between the upper electrodes UE1, UE2, and UE3 formed later and the lower portion 61.

[0093] Therefore, in Fig. 9In the structure, the ends E1a and E2b of the lower electrodes LE1 and LE2 need to be sufficiently separated from the partition wall 6. For example, by setting the distance Db between the upper portion 62 and the ends E1a and E2b in a plan view to be greater than 1 / 2 of the total thickness T of the rib layer 5 and the lower portion 61 (Db ≥ T / 2) as described above, the shape defects of the ends of the upper portion 62 can be suppressed.

[0094] But in Fig. 9 In the structure of the present invention, it is necessary to ensure a distance Db on both sides of the partition 6. As a result, the width Wa of the rib layer 5 becomes larger. As an example, when the width Wb of the partition 6 is 4 to 5 μm, Fig. 9 In the configuration, the width Wa of the rib layer 5 must be set to 10 to 12 μm. As the width Wa of the rib layer 5 increases, the pixel openings AP1, AP2, and AP3 decrease accordingly, and the aperture ratio of the sub-pixels SP1, SP2, and SP3 decreases.

[0095] exist Fig.10 In the embodiment, both ends E1a and E2b of the lower electrodes LE1 and LE2 are located below the lower portion 61. Thus, both step portions ST caused by the ends E1a and E2b are covered by the lower portion 61. In this case, shape defects of the end of the upper portion 62 caused by the step portions ST can be suppressed.

[0096] The distance Da between the lower electrodes LE1, LE2, and LE3 is difficult to be less than, for example, 4 to 5 μm. Fig.10 In the structure of , it is necessary to increase the width Wb of the partition wall 6.

[0097] In addition, near the partition wall 6, the evaporation material emitted by the evaporation source is blocked by the upper portion 62, thereby reducing the thickness of the laminated films FL1, FL2, and FL3. Therefore, in order to form the laminated films FL1, FL2, and FL3 with a good thickness at the pixel openings AP1, AP2, and AP3, the partition wall 6 must be separated from the pixel openings AP1, AP2, and AP3 to a certain extent. Considering this margin, Fig.10 In the example of FIG. 1 , the width Wa of the rib layer 5 also needs to be 10 to 12 μm.

[0098] Compared with these comparative examples, if Figure 7 The structure of this embodiment shown can suppress the shape defect of the upper portion 62 and reduce the width Wa of the rib layer 5 to increase the aperture ratio of the sub-pixels SP1, SP2, and SP3. This can improve the yield of the display device DSP and improve the display quality.

[0099] Specifically, in Figure 7In the structure of , the step portion ST generated by the end E1a of the lower electrode LE1 is covered by the lower portion 61, thereby suppressing the shape defect of the upper portion 62 caused by the step portion ST. In addition, by setting the distance Db to be greater than 1 / 2 of the total thickness T, the shape defect of the upper portion 62 caused by the step portion ST generated by the end E2b of the lower electrode LE2 is also suppressed.

[0100] Moreover, in Figure 7 In the configuration of FIG. 1 , in order to ensure the distance Db, even if the distance Dc2 between the end E2b and the pixel opening AP2 is reduced, a laminated film FL2 having a good thickness can be formed in the pixel opening AP2. Fig. 9 as well as Fig.10 Compared with the comparative example, the width Wa of the rib layer 5 can be reduced.

[0101] In addition, here, Figure 7 , Fig. 9 as well as Fig.10 As shown, the effect of the present embodiment is described with focus on the structure near the ends of adjacent lower electrodes LE1 and LE2, but the same effect can be obtained based on the structure near the ends of adjacent lower electrodes LE1 and LE3, the structure near the ends of adjacent lower electrodes LE2 and LE3, and the structure near the ends of two adjacent lower electrodes LE1.

[0102] The following describes the second to sixth embodiments. The configuration of the display device DSP not mentioned in each embodiment is the same as that of the first embodiment.

[0103] [Second embodiment]

[0104] Fig.11 is a schematic cross-sectional view of the display device DSP according to the second embodiment. Figure 2 as well as Figure 3 The sub-pixel SP1 is shown cut along the X direction. In this figure, the substrate 10, the circuit layer 11, the resin layers RS1 and RS2, and the sealing layer SE2 are omitted.

[0105] As in the first embodiment, the end E1a (first end) of the lower electrode LE1 is located below the lower portion 61 of the partition wall 6, and the end E1b (second end) is separated from the partition wall 6 in the X direction. Thus, the step ST of the rib layer 5 generated by the end E1a is covered by the lower portion 61, while the step ST generated by the end E1b is exposed from the lower portion 61.

[0106] The upper electrode UE1 has ends Ea and Eb in the X direction. The end Ea (third end) is located on the end E1a side of the lower electrode LE1. The end Eb (fourth end) is located on the end E1b side of the lower electrode LE1.

[0107] exist Fig.11 In the example of FIG. 1 , the end Ea is in contact with the lower portion 61 (bottom layer 63 and shaft layer 64). On the other hand, the end Eb is separated from the lower portion 61. This configuration makes it possible, for example, to tilt the evaporation source of the upper electrode UE1 relative to the Z direction. By tilting the evaporation source, the upper electrode UE1 can be formed in a manner that at least the end Ea is in good contact with the lower portion 61.

[0108] In addition, the upper electrode UE1 is thin, and therefore may be cut off by the step portion ST generated by the end E1b. On the other hand, the step portion ST generated by the end E1a is covered by the lower portion 61. Therefore, the cut off of the upper electrode UE1 by the step portion ST is suppressed, and the lower portion 61 and the upper electrode UE1 can be well connected.

[0109] In addition, although the structure of the sub-pixel SP1 is described here, the same structure can be applied to the sub-pixels SP2 and SP3. That is, the upper electrodes UE2 and UE3 may have ends in contact with the lower portion 61 and ends separated from the lower portion 61. In one example, the upper electrodes UE1 and UE2 are at least Figure 6 Portion 61X contact is shown.

[0110] [Third Embodiment]

[0111] Fig.12 FIG. 1 is a schematic enlarged plan view of sub-pixels SP1, SP2, and SP3 according to the third embodiment. Fig.12 In the example, the ends E1b and E1c of the lower electrode LE1, the ends E2b, E2c and E2d of the lower electrode LE2, and the ends E3b and E3c of the lower electrode LE3 overlap with the lower portion 61. On the other hand, the ends E1a and E1d of the lower electrode LE1, the end E2a of the lower electrode LE2, and the ends E3a and E3d of the lower electrode LE3 do not overlap with the lower portion 61.

[0112] In addition, Fig.12 In the example, the partition wall 6 (lower portion 61) overlapping the end E1b has a convex portion P1 protruding toward the pixel opening AP1. In addition, the pixel opening AP1 has a concave portion R recessed into a shape corresponding to the convex portion P1. The contact hole CH1 is located between the end E1b and the pixel opening AP1 and overlaps the convex portion P1.

[0113] [Fourth embodiment]

[0114] Fig.13 FIG. 1 is a schematic enlarged plan view of sub-pixels SP1, SP2, and SP3 according to the fourth embodiment. Fig.13In the example, the ends E1a and E1d of the lower electrode LE1, the ends E2a, E2c and E2d of the lower electrode LE2, and the ends E3a and E3c of the lower electrode LE3 overlap with the lower portion 61. On the other hand, the ends E1b and E1c of the lower electrode LE1, the end E2b of the lower electrode LE2, and the ends E3b and E3d of the lower electrode LE3 do not overlap with the lower portion 61.

[0115] [Fifth embodiment]

[0116] Fig.14 FIG. 1 is a schematic enlarged plan view of sub-pixels SP1, SP2, and SP3 according to the fifth embodiment. Fig.14 In the example, the ends E1a and E1d of the lower electrode LE1, the ends E2a and E2d of the lower electrode LE2, and the ends E3a, E3c and E3d of the lower electrode LE3 overlap with the lower portion 61. On the other hand, the ends E1b and E1c of the lower electrode LE1, the ends E2b and E2c of the lower electrode LE2, and the end E3b of the lower electrode LE3 do not overlap with the lower portion 61.

[0117] [Sixth embodiment]

[0118] Fig.15 FIG. 1 is a schematic enlarged plan view of sub-pixels SP1, SP2, and SP3 according to the fifth embodiment. Fig.15 In the example of FIG. 1 , the end E1c of the lower electrode LE1, the end E2a, E2b, and E2d of the lower electrode LE2, and the end E3a, E3b, E3c, and E3d of the lower electrode LE3 overlap with the lower portion 61. That is, in Fig.15 In the example of FIG. 1 , the lower electrode LE3 overlaps the lower portion 61 over the entire circumference. On the other hand, the end portions E1 a , E1 b , and E1 d of the lower electrode LE1 and the end portion E2 c of the lower electrode LE2 do not overlap the lower portion 61 .

[0119] In the configurations of the third to sixth embodiments described above, it is also possible to realize a configuration in which one of the ends of the adjacent lower electrodes overlaps with the lower portion 61, and the other does not overlap, except for the ends E2d and E3c. Therefore, the same effect as in the first embodiment can be achieved. In the third to sixth embodiments, the use of the rib layer 5 covering the ends of the two adjacent lower electrodes and the lower portion 61 thereon can be applied. Figure 7 Description of the composition.

[0120] In addition, the positional relationship between the ends of the lower electrodes LE1, LE2, and LE3 and the lower portion 61 is not limited to the relationship exemplified in each embodiment. For example, in each embodiment, the end E2d of the lower electrode LE2 and the end E3c of the lower electrode LE3 overlap with the lower portion 61 (portion 61X), but at least one of the ends E2d and E3c may not overlap with the lower portion 61.

[0121] Based on the display devices disclosed in the above embodiments, any display devices that can be implemented by those skilled in the art by appropriately changing the design also belong to the scope of the present invention as long as they include the gist of the present invention.

[0122] In the scope of the concept of the present invention, those skilled in the art may think of various variations, which should be understood to also fall within the scope of the present invention. For example, variations obtained by those skilled in the art appropriately adding, deleting, or changing the design of constituent elements, or adding, omitting, or changing the conditions of processes relative to the above-mentioned embodiments are also included within the scope of the present invention as long as they have the gist of the present invention.

[0123] In addition, other effects and functions brought about by the forms described in the above embodiments that are clearly inferred from the description of this specification or that can be appropriately thought of by a person skilled in the art should of course be understood to be brought about by the present invention.

Claims

1. A display device, characterized in that: have: a first lower electrode having a first end; a second lower electrode having a second end separated from the first end; a rib layer having a first pixel opening overlapping the first lower electrode and a second pixel opening overlapping the second lower electrode, and covering the first end portion and the second end portion; a partition wall including a lower portion and an upper portion, wherein the lower portion is located between the first pixel opening and the second pixel opening and is arranged above the rib layer, and the upper portion has an end portion protruding from a side surface of the lower portion; a first organic layer passing through the first pixel opening and contacting the first lower electrode, and emitting light by applying a voltage; a second organic layer passing through the second pixel opening and contacting the second lower electrode, and emitting light by applying a voltage; a first upper electrode covering the first organic layer; and a second upper electrode covering the second organic layer, The first end portion overlaps the lower portion in a plan view, The second end portion does not overlap with the lower portion in a plan view.

2. The display device according to claim 1, characterized in that The second end portion is separated from the upper portion in a plan view.

3. The display device according to claim 2, characterized in that: A distance between the second end portion and the upper portion in a plan view is equal to or greater than 1 / 2 of a total thickness of the rib layer and the lower portion.

4. The display device according to claim 1, characterized in that The upper surface of the rib layer has a first step portion generated by the first end portion, The lower portion covers the first step portion.

5. The display device according to claim 4, characterized in that: The upper surface of the rib layer has a second step portion generated by the second end portion, The lower portion does not cover the second step portion.

6. The display device according to claim 1, characterized in that: A first distance between the first end and the first pixel opening in a plan view is greater than a second distance between the second end and the second pixel opening in a plan view.

7. The display device according to claim 1, characterized in that: Also available: a pixel circuit disposed below the first lower electrode; and an organic insulating layer disposed between the first lower electrode and the pixel circuit, The first lower electrode is connected to the pixel circuit through a contact hole provided in the organic insulating layer. The contact hole is located between the first end portion and the first pixel opening in a plan view.

8. The display device according to claim 7, characterized in that: The partition wall has a convex portion protruding toward the first pixel opening in a plan view, The contact hole overlaps with the protrusion in a plan view.

9. The display device according to claim 1, characterized in that: The lower part comprises: a shaft layer formed of a metallic material; and The bottom layer is formed of a metal material different from that of the shaft layer and is located between the shaft layer and the rib layer.

10. The display device according to claim 1, characterized in that: The upper part comprises: a first top layer formed of a metal material; and The second top layer is formed of a transparent conductive oxide and is disposed on the first top layer.

11. A display device, characterized in that: have: A lower electrode having a first end and a second end; a rib layer having a pixel opening overlapping with the lower electrode and covering the first end and the second end; a partition wall surrounding the pixel opening, comprising a lower portion and an upper portion, the lower portion being arranged above the rib layer, the upper portion having an end portion protruding from a side surface of the lower portion; an organic layer that passes through the pixel opening to contact the lower electrode and emits light by applying a voltage; as well as an upper electrode covering the organic layer, The first end portion overlaps the lower portion in a plan view, The second end portion does not overlap with the lower portion in a plan view.

12. The display device according to claim 11, characterized in that: The second end portion is separated from the upper portion in a plan view.

13. The display device according to claim 12, characterized in that: A distance between the second end portion and the upper portion in a plan view is equal to or greater than 1 / 2 of a total thickness of the rib layer and the lower portion.

14. The display device according to claim 11, characterized in that: The upper surface of the rib layer has a first step portion generated by the first end portion, The lower portion covers the first step portion.

15. The display device according to claim 14, characterized in that: The upper surface of the rib layer has a second step portion generated by the second end portion, The lower portion does not cover the second step portion.

16. The display device according to claim 11, characterized in that: A first distance between the first end and the pixel opening in a plan view is greater than a second distance between the second end and the pixel opening in a plan view.

17. The display device according to claim 11, characterized in that: Also available: a pixel circuit disposed below the lower electrode; and an organic insulating layer disposed between the lower electrode and the pixel circuit, The lower electrode is connected to the pixel circuit through a contact hole provided in the organic insulating layer. The contact hole is located between the first end portion and the pixel opening in a plan view.

18. The display device according to claim 17, characterized in that: The partition wall has a convex portion protruding toward the pixel opening in a plan view, The contact hole overlaps with the protrusion in a plan view.

19. The display device according to claim 11, characterized in that: The upper electrode has a third end portion on the first end portion side and a fourth end portion on the second end portion side, The third end portion is in contact with the lower portion, The fourth end portion is separated from the lower portion.

20. The display device according to claim 11, characterized in that The lower part comprises: a shaft layer formed of a metallic material; and The bottom layer is formed of a metal material different from that of the shaft layer and is located between the shaft layer and the rib layer.

Citation Information

Patent Citations

  • Aqueous coating material

    JP2023148307A