Adhesive substrate with wiring, laminating apparatus, glass laminate, and method for producing adhesive substrate with wiring

Abstract

Provided is an adhesive substrate with wiring, which can suppress the occurrence of cracks and buckling in a wiring pattern formed on an adhesive layer. An adhesive substrate (1) with wiring according to one embodiment of the present disclosure is provided with a substrate (10), an adhesive layer (11) formed on the substrate (10), and a wiring pattern (12) formed on the adhesive layer (11). The adhesive strength of the adhesive layer (11) with respect to the PET film is 0.01 N / 25 mm or more, the amount of change in layer thickness when the adhesive layer is immersed in isopropanol for 1 minute is 20% or less, and the amount of change in layer thickness when the adhesive layer is immersed in toluene for 1 minute is 18% or less.

Description

Technical Field

[0001] The present disclosure relates to an adhesive substrate with wiring, a lamination device, a glass laminate, and a method for producing the adhesive substrate with wiring. Background Art

[0002] As one of the technologies for forming large electronic devices, there is a tiling technology. The tiling technology is a technology for forming a large electronic device by arranging a plurality of electronic devices on a substrate and electrically connecting adjacent electronic devices. For example, a large-screen display device can be formed by arranging a plurality of display devices on a substrate and electrically connecting these display devices.

[0003] Patent Document 1 discloses a technology related to a transfer film for forming a transparent conductive layer and a method for producing a transparent conductive laminate using the transfer film.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent No. 5430792 Summary of the invention

[0007] When using tiling technology to construct electronic devices, it is necessary to arrange multiple electronic devices on a substrate and use wiring to electrically connect the multiple arranged electronic devices to each other. In order to make the bonding of the arranged electronic devices to each other and the electrical connection based on wiring be carried out at the same time, it is useful to use a component that sets wiring on the above-mentioned substrate via an adhesive layer. Therefore, it is necessary to form wiring for electrically connecting multiple electronic devices on the adhesive layer that adheres multiple electronic devices. In the technology disclosed in Patent Document 1, wiring is formed on the adhesive layer by forming wiring on a transfer substrate and transferring the wiring to the adhesive layer of the tiling substrate.

[0008] However, when such a transfer technique is used, there is a problem that the number of manufacturing steps increases, and there is a problem that the auxiliary consumables used in the manufacturing increase. In addition, when the transfer technique is used, when the wiring pattern is transferred to the adhesive layer, there is a situation where the wiring pattern collapses.

[0009] Therefore, the inventors of the present application have studied a technique for forming a wiring pattern directly on an adhesive layer. However, when a wiring pattern is formed directly on an adhesive layer, it has been newly discovered that the formed wiring may have cracks or buckling.

[0010] In view of the above problems, an object of the present disclosure is to provide an adhesive substrate with wiring, a laminated device, a glass laminate, and a method for producing an adhesive substrate with wiring that can suppress cracking and buckling of a wiring pattern formed on an adhesive layer.

[0011] An adhesive substrate with wiring according to one embodiment of the present disclosure comprises: a substrate, an adhesive layer formed on the substrate, and a wiring pattern formed on the adhesive layer. The adhesive force of the adhesive layer to the PET film is 0.01 N / 25 mm or more, the thickness change of the adhesive layer when immersed in isopropyl alcohol for 1 minute is within 20%, and the thickness change of the adhesive layer when immersed in toluene for 1 minute is within 18%.

[0012] In the above-mentioned adhesive substrate with wiring, the above-mentioned wiring pattern may be composed of a material containing at least one selected from the group consisting of silver, copper, carbon and gold.

[0013] In the above-mentioned adhesive substrate with wiring, the light transmittance of the entire surface of the adhesive substrate with wiring may be 50% or more.

[0014] A laminated device according to one embodiment of the present disclosure includes: the above-mentioned adhesive substrate with wiring, and an electronic device disposed on the above-mentioned adhesive substrate with wiring. The above-mentioned electronic device is electrically connected to the above-mentioned wiring pattern formed on the above-mentioned adhesive layer.

[0015] The laminated device may further include an overcoat layer covering the electronic device and the wiring pattern.

[0016] The glass laminate according to one embodiment of the present disclosure is obtained by sealing the above-mentioned lamination device in a glass plate or bonding it to the surface of a glass plate.

[0017] A method for manufacturing an adhesive substrate with wiring according to one embodiment of the present disclosure comprises: a step of forming an adhesive layer on a substrate, and a step of forming a wiring pattern on the adhesive layer using a conductive ink material. The adhesive layer uses a material having an adhesive force of 0.01 N / 25 mm or more to a PET film, a thickness change within 20% when the adhesive layer is immersed in isopropyl alcohol for 1 minute, and a thickness change within 18% when the adhesive layer is immersed in toluene for 1 minute.

[0018] In the method for producing the adhesive substrate with wiring, the step of forming the wiring pattern may be a step of forming the wiring pattern by printing the conductive ink material on the adhesive layer using an inkjet technique.

[0019] In the method for producing the adhesive substrate with wiring, the step of forming the wiring pattern may be a step of printing the conductive ink material on the adhesive layer using a screen printing technique to form the wiring pattern.

[0020] According to the present disclosure, it is possible to provide an adhesive substrate with wiring, a laminated device, a glass laminate, and a method for producing an adhesive substrate with wiring, which can suppress cracking and buckling of a wiring pattern formed on an adhesive layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a cross-sectional view showing a configuration example of an adhesive substrate with wiring according to an embodiment.

[0022] Figure 2 It is a plan view showing a configuration example of a stacking device according to an embodiment.

[0023] Figure 3 It is a cross-sectional view showing a configuration example of a stacking device according to an embodiment.

[0024] Figure 4 It is a cross-sectional view showing a configuration example of a stacking device according to an embodiment.

[0025] Figure 5 It is a cross-sectional view showing a configuration example of a glass laminate according to an embodiment.

[0026] Figure 6 This is a cross-sectional view for explaining a method for measuring a layer thickness variation.

[0027] Figure 7 These are microscopic photographs of samples of Examples 1 to 6.

[0028] Figure 8 These are microscopic observation photographs of the samples of Examples 7 to 13. DETAILED DESCRIPTION

[0029] Hereinafter, embodiments will be described with reference to the drawings.

[0030] Figure 1 2 is a cross-sectional view showing a configuration example of an adhesive substrate with wiring according to an embodiment. Figure 1 As shown, the adhesive substrate with wiring 1 of this embodiment includes a substrate 10, an adhesive layer 11, and a wiring pattern 12. In addition, the wiring pattern 12 may be simply referred to as wiring 12 in this specification.

[0031] The substrate 10 is used to support a plurality of electronic devices 15 bonded by the adhesive layer 11 (see Figure 2 ) component. The substrate 10 may be made of a rigid material or a flexible material. In addition, the substrate 10 may be made of a transparent material or a material with a small retardation value to prevent rainbow spots during observation. For example, the substrate 10 may be made of TAC (triacetylcellulose), acrylic resin, COP (cyclo olefin polymer), CPI (colorless and transparent polyimide), etc.

[0032] The thickness of the substrate 10 is, for example, about 12 μm to 250 μm. The thickness of the substrate 10 can be changed according to the processability of subsequent processes such as laminated glass sealing. In addition, a functional layer can also be provided on the substrate 10. For example, the functional layer is an easy-adhesion layer, an oxygen barrier layer, a water vapor barrier layer, a non-visual layer, an antistatic layer, etc.

[0033] The adhesive layer 11 is formed on the substrate 10 and is used to connect a plurality of electronic devices 15 (see Figure 2 ) is a member bonded to the substrate 10. For example, a transparent adhesive material, that is, an optical adhesive material (OCA: Optical Clear Adhesive) can be used for the adhesive layer 11. The thickness of the adhesive layer 11 is, for example, 5 μm to 200 μm. The details of the adhesive layer 11 will be described later.

[0034] The wiring pattern 12 is formed on the adhesive layer 11. For example, the wiring pattern 12 can be formed by drawing directly on the adhesive layer 11. Specifically, the wiring pattern 12 can be formed by printing a conductive ink material on the adhesive layer 11 using an inkjet technique. In addition, the wiring pattern 12 can also be formed by printing a conductive ink material on the adhesive layer 11 using a screen printing technique.

[0035] For example, the wiring pattern 12 may be made of a material containing at least one selected from silver, copper, carbon, and gold. That is, the wiring pattern 12 may be formed using a conductive ink material (wiring ink material) containing at least one selected from silver, copper, carbon, and gold. The wiring width of the wiring pattern 12 is, for example, 1.5 μm to 10 mm.

[0036] The adhesive substrate 1 with wiring of this embodiment may be transparent. For example, the light transmittance of the entire surface of the adhesive substrate with wiring of this embodiment may be 50% or more, preferably 60% or more, and more preferably 80% or more. Here, the light transmittance of the entire surface of the adhesive substrate with wiring refers to the average value of the total light transmittance of the total area of ​​the substrate regardless of the location of the wiring.

[0037] Next, a stacked device in which a plurality of electronic devices are mounted on an adhesive substrate with wiring will be described. Figure 2 It is a plan view showing a configuration example of the stacking device 2 according to the embodiment. Figure 3 It is a cross-sectional view showing a configuration example of the stacking device 2 according to the embodiment.

[0038] like Figure 2 , Figure 3As shown, a plurality of electronic devices 15 are arranged on an adhesive substrate 1 with wiring. Specifically, a plurality of electronic devices 15 are bonded to an adhesive layer 11 of an adhesive substrate 1 with wiring. Thus, a plurality of electronic devices 15 are fixed to a substrate 10. At this time, the electronic device 15 is electrically connected to a wiring pattern 12 formed on the adhesive layer 11. For example, the electronic device 15 is a display device, an optical device, a sensor device, a heating device, etc., and may also be connected to connection components such as FPC (Flexible Printed Circuits). It should be noted that in the present embodiment, the electronic device 15 may also be an electronic device other than these.

[0039] In addition, the stacking device of this embodiment can also be Figure 4 The laminated device 3 shown in FIG. 1 is provided with an outer coating 16 and a substrate 17. The outer coating 16 is a component that covers and protects a plurality of electronic devices 15 and wiring patterns 12. Specifically, by providing the outer coating 16, chemical degradation such as oxidation and corrosion of the electronic devices 15 and the wiring patterns 12 can be suppressed. In addition, when the outer coating 16 is provided, mechanical degradation such as disconnection due to local pressure applied to the edge portion of the adhesive substrate 1 with wiring and the electronic device 15 in contact can be suppressed. For example, a curable resin, OCR (Optical Clear Resin, optically transparent resin), etc. can be used for the outer coating 16.

[0040] The substrate 17 is a component for protecting the plurality of electronic devices 15. By sandwiching the plurality of electronic devices 15 between the lower substrate 10 and the upper substrate 17, the plurality of electronic devices 15 can be effectively protected. The substrate 17 can be made of the same material as the substrate 10. The outer coating 16 has adhesiveness, and the substrate 17 can be bonded to the outer coating 16 by arranging the substrate 17 on the outer coating 16. In addition, a functional layer can be separately provided on the substrate 17 in the same manner as the substrate 10. For example, the functional layer is an easy-adhesion layer, an oxygen barrier layer, a water vapor barrier layer, a non-visual layer, an antistatic layer, and the like.

[0041] In addition, in this embodiment, it is also possible to Figure 4 The laminating device 3 shown is sealed in a glass plate or attached to the surface of a glass plate to form a glass laminate. Figure 5 2 is a cross-sectional view showing a configuration example of a glass laminate according to an embodiment. Figure 5 As an example, Figure 4 The illustrated lamination device 3 is an example in which it is sealed in a glass plate to constitute a glass laminate 4 .

[0042] Figure 5The glass laminate 4 shown in the figure has intermediate adhesive layers 21a and 21b on the upper and lower surfaces of the laminating device 3. For example, polyvinyl butyral (PVB), ethylene-vinyl acetate copolymer (EVA), etc. can be used for the intermediate adhesive layers 21a and 21b.

[0043] Glass plates 22a and 22b are provided on the outer surfaces of the intermediate adhesive layers 21a and 21b. The glass plates 22a and 22b may be made of inorganic glass, for example. Examples of inorganic glass include soda-lime glass, aluminosilicate glass, borosilicate glass, alkali-free glass, and quartz glass. In addition, organic glass (resin) may be used for the glass plates 22a and 22b. Examples of organic glass include acrylic resins such as polycarbonate and polymethyl methacrylate, polyvinyl chloride, and polystyrene.

[0044] For example, when a display device is used as the electronic device 15, a glass laminate 4 in which the display device is sealed in the glass plates 22a and 22b can be formed. For example, by using such a glass laminate 4 in a windshield of a vehicle, a windshield with a built-in display device can be formed. In addition, by using such a glass laminate 4 in a window glass of a building, a window glass with a built-in display device can be formed.

[0045] As described above, in this embodiment, the wiring pattern 12 is formed by drawing directly on the adhesive layer 11. Therefore, in order to suppress cracks and buckling of the wiring pattern 12 formed on the adhesive layer 11, the properties of the adhesive layer 11 are very important. In view of this, in this embodiment, the adhesive layer 11 having the following properties is used.

[0046] In the present embodiment, the adhesive force of the adhesive layer 11 to the PET film is greater than 0.01N / 25mm. In addition, when the wiring pattern 12 is formed on the adhesive layer 11 using inkjet technology, the adhesive force of the adhesive layer 11 to the PET film can be made 0.01~50N / 25mm. In addition, when the wiring pattern 12 is formed on the adhesive layer 11 using screen printing technology, the adhesive force of the adhesive layer 11 to the PET film can be made 0.01~0.20N / 25mm. That is, when using screen printing technology, it is preferred to weaken the adhesive force of the adhesive layer 11 compared to when using inkjet technology. The adhesive force to the PET film can be measured by performing a 180° peel test (sample width 25mm) using a tensile testing machine.

[0047] In addition, in the present embodiment, the adhesive layer 11 uses a material whose thickness variation when the adhesive layer is immersed in isopropyl alcohol (IPA) for 1 minute is within 20% and whose thickness variation when the adhesive layer is immersed in toluene for 1 minute is within 18%. At this time, the thickness variation when the adhesive layer is immersed in isopropyl alcohol (IPA) for 1 minute is preferably within 20%, more preferably within 14%, and further preferably within 7%. In addition, the thickness variation when the adhesive layer is immersed in toluene for 1 minute is preferably within 18%, more preferably within 13%, and further preferably within 11%.

[0048] Here, the “layer thickness variation” is Figure 6 As shown, the thickness of the side of the adhesive layer 11 before being immersed in the solvent is d1, and the thickness of the side of the adhesive layer 11 after being immersed in the solvent for 1 minute is d2, which is expressed by (d2-d1) / d1×100(%). It should be noted that the measurement of the layer thickness change can be performed using a sample in which the PET substrate 30 is attached to both sides of the adhesive layer 11. For a sample that becomes a laminate, a sample in a laminate state is used, and the cut surface of the sample can be cut out by cutting with a razor, a tungsten steel knife, a diamond knife, or the like, or can be formed by processing such as ion milling.

[0049] For example, when the adhesive layer 11 is easily affected by the solvent, the adhesive layer 11 is affected by the solvent when the sample is immersed in the solvent and the adhesive layer 11 swells. If the adhesive layer 11 swells in this way, the thickness d2 of the adhesive layer 11 after immersion increases, so the thickness change becomes larger. In addition, since the solvent returns to a state close to the original thickness d1 of the adhesive layer when it dries after immersion for a period of time, the thickness change of the shrinkage after swelling also becomes larger. That is, when the material of the adhesive layer 11 uses a material with a large thickness change, it is easily affected by the solvent, low molecular components, etc. contained in the conductive ink material. Therefore, the adhesive layer directly below the wiring after the wiring pattern is printed will produce a large swelling and shrinkage, so it will directly accept the size change, and it is easy to cause cracks and buckling in the wiring pattern 12. In particular, when the material of the adhesive layer has a high solubility in the conductive ink solvent, the shape of the adhesive layer collapses due to the dissolution of the material of the adhesive layer into the conductive ink, and it is difficult to form normal wiring on the adhesive layer. Therefore, sometimes the wiring is formed in a shape containing cracks and buckling in the wiring pattern 12.

[0050] Therefore, in this embodiment, a material whose thickness variation is within 20% when the adhesive layer is immersed in isopropyl alcohol (IPA) for 1 minute and whose thickness variation is within 18% when the adhesive layer is immersed in toluene for 1 minute is used as the adhesive layer 11. When a material having such properties is used for the adhesive layer 11, when the wiring pattern 12 is directly drawn on the adhesive layer 11, the solvent contained in the conductive ink material can be suppressed from penetrating into the adhesive layer 11, thereby suppressing cracks and buckling of the wiring pattern 12.

[0051] That is, when the wiring pattern 12 is directly drawn on the adhesive layer 11, the dimensional change caused by the adhesive layer 11 swelling due to the solvent contained in the conductive ink material and the adhesive layer 11 shrinking when the solvent dries can be suppressed. Therefore, the generation of cracks and buckling caused by such dimensional changes can be suppressed.

[0052] In the present embodiment, isopropanol is used as a representative of polar solvents, and toluene is used as a representative of non-polar solvents. That is, a material whose layer thickness change when immersed in both polar solvents and non-polar solvents satisfies the above conditions is used as the adhesive layer 11. The adhesive layer 11 that satisfies the above conditions can be said to be a material with less solvent penetration to a wide range of solvents. As other examples of polar solvents, alcohol solvents such as methanol, ethanol, 1-propanol, and 1-butanol, ketone solvents such as methyl ethyl ketone, methyl isobutyl ketone, cyclopentanone, and cyclohexanone, acetate solvents such as methyl acetate, ethyl acetate, propyl acetate, and butyl acetate, glycol ether solvents such as propylene glycol monomethyl ether and propylene glycol monomethyl ether acetate, etc. can be cited. As other examples of non-polar solvents, hydrocarbon solvents such as xylene, n-hexane, cyclohexane, and benzene can be cited.

[0053] In this embodiment, the adhesive layer (OCA) 11 can be made of acrylic, silicone, epoxy, urethane acrylate, or other materials that satisfy the prescribed solvent permeability characteristics. In addition, the adhesive layer 11 can have post-curing properties such as thermosetting and UV curing properties. In addition, the adhesive layer 11 can have the property of softening and bonding by heating (hot melting).

[0054] In addition, in the present embodiment, the thickness of the adhesive layer 11 may be 5 μm to 200 μm. In addition, when the wiring pattern 12 is formed on the adhesive layer 11 using inkjet technology, the thickness of the adhesive layer 11 may be 10 μm to 200 μm. In addition, when the wiring pattern 12 is formed on the adhesive layer 11 using screen printing technology, the thickness of the adhesive layer 11 may be 5 μm to 20 μm. That is, when screen printing technology is used, it is preferred to make the thickness of the adhesive layer 11 thinner than when inkjet technology is used.

[0055] In addition, in this embodiment, the adhesive layer 11 can be made of a material having a contact angle of 30° or less, preferably 20° or less, and more preferably 10° or less after 1 minute when the solvent is dropped onto the adhesive layer. The dropped solvent can be a mixed solvent of isopropyl alcohol and toluene in a mixing ratio of 1:1. When the contact angle is small, the wiring can be printed with good wettability.

[0056] Example

[0057] Hereinafter, examples will be described.

[0058] Hereinafter, a wiring pattern drawing test was conducted on the samples of Examples 1 to 13. Specifically, the physical properties of the OCA (adhesive layer) of Examples 1 to 13 were investigated, and the drawing test was conducted using a screen printing technique or an inkjet printing technique. Table 1 shows the manufacturer, model, and thickness of the samples (OCA) of Examples 1 to 13.

[0059] In addition, the adhesive strength of the OCAs of Examples 1 to 13 was measured. Specifically, the 180° peeling adhesive strength of the OCAs was measured at room temperature using an AUTOGRAPH (AG-Xplus) apparatus manufactured by Shimadzu Corporation with a sample width of 25 mm and a tensile speed of 300 mm / min. The results of the adhesive strength measurements of the various OCAs are shown in Table 1.

[0060] In addition, the change in layer thickness after solvent immersion was measured by the following method.

[0061] First, if Figure 6 As shown, prepare the sample for measurement, and use Cosmoshine A4160 (manufactured by Toyobo Co., Ltd., 125μ thick, single-sided easy adhesion) as the PET substrate 30, respectively adhered to the upper and lower surfaces of the OCA (adhesive layer 11) so that the non-easy adhesion surface is the OCA side. Then, cut the sample for measurement, and use the BEIST replacement blade manufactured by Kai Co., Ltd. to cut out the cross section of the sample for measurement (cut out the slice). The size of the sample for measurement after cutting is 10mm×5mm. Then, use a laser microscope (LEXTOLS4000, manufactured by OLYMPUS) to observe the side (cross section) of the sample for measurement under high-precision photography, and by measuring the average value of the distance between parallel lines at 3 points, the thickness d1 of the OCA before immersion is calculated.

[0062] Next, immerse the measurement sample in isopropyl alcohol (IPA) for 1 minute. Then, observe the side (cross section) of the measurement sample after immersion using a laser microscope in the same way as d1, and find the thickness d2 of the OCA after immersion. Then, use the formula of thickness change = (d2-d1) / d1×100(%) to find the thickness change of each OCA. Similarly, find the thickness change when immersing the OCA in toluene. The measurement results of the thickness change of each OCA are shown in Table 1.

[0063] In addition, a drawing test was conducted by forming a wiring pattern on the surface of the OCA of Examples 1 to 6 using screen printing technology. The wiring pattern was formed using a screen plate for wiring printing and a scraper for screen printing. The conductive ink material used was silver paste RA FS 059S manufactured by Toyo Ink Co., Ltd. and silver nano ink S-CS21303 manufactured by GenesInk Co., Ltd. The calcination condition after printing was 30 minutes at 120°C. The drawing test results of each OCA are shown in Table 1. The results of microscopic observation of samples with wiring patterns printed on the surface of the OCA of Examples 1 to 6 are shown in Table 1. Figure 7 .

[0064] In addition, a drawing test was conducted by forming a wiring pattern on the surface of the OCA of Examples 7 to 13 bonded to KC4UA (manufactured by Konica Minolta, 40 μm thick) as a TAC substrate using inkjet printing technology. DNS-0169I manufactured by Daicel Corporation was used as a silver nano-ink as the conductive ink material. The calcination conditions after printing were 30 minutes at 120°C. The drawing test results of each OCA are shown in Table 1. The results of microscopic observation of the samples with wiring patterns printed on the surface of the OCA of Examples 7 to 13 are shown in Table 1. Figure 8 .

[0065]

[0066] In Table 1, Examples 1 to 7 are examples, and Examples 8 to 13 are comparative examples. As shown in Table 1, in the OCAs of Examples 1 to 7, the thickness change after solvent immersion is low in both isopropyl alcohol (IPA) and toluene. Therefore, it is considered that the drawing test also shows good results. Figure 7 As shown, for example, in the OCA of Example 7, a wiring pattern without cracks or buckling can be formed on the surface of the OCA.

[0067] On the other hand, in the OCA of Examples 8 and 10 to 12, the change in layer thickness when immersed in isopropyl alcohol (IPA) for 1 minute was greater than 20%. In addition, in the OCA of Example 13, the OCA was dissolved when immersed in isopropyl alcohol (IPA) for 1 minute. In addition, in the OCA of Examples 9 and 11, the change in layer thickness when immersed in toluene for 1 minute was greater than 18%. In addition, in the OCA of Examples 8, 12, and 13, the OCA was dissolved when immersed in toluene for 1 minute. Therefore, it is considered that the drawing test in the OCA of Examples 8 to 13 did not show good results. Figure 7 As shown, for example, in the OCAs of Examples 9 and 11, cracks and buckling occurred in the wiring patterns formed on the surface of the OCAs.

[0068] In addition, using the adhesive substrate with wiring formed on the OCA (ST75) of Example 1, a Figure 3 The laminated device of the structure shown in the figure was used as the electronic device. The electronic device used was an electronic device with wiring separately made on the film. The terminal of the resistance meter was pressed against the wiring part of the adhesive substrate with wiring to check the continuity. As a result, it was confirmed that there was conduction between the electronic device and the adhesive substrate with wiring.

[0069] Using the OCA (ST75) of Example 1 on which wiring is formed, an adhesive substrate with wiring is prepared. Figure 4 A laminated device of the structure shown. The electronic device uses an electronic device in which wiring is separately made on the film. The outer coating is applied by coating PHOTOLEC A784-60 (manufactured by Sekisui Chemical Co., Ltd.) and laminating A4160 (manufactured by Toyobo Co., Ltd., 125μm thick) as a PET substrate, and irradiating with 1000mj / □ of light for UV curing to bond. The terminal of the resistance meter was pressed on the wiring part of the adhesive substrate with wiring to confirm the conduction, and the result confirmed that there was conduction between the electronic device and the adhesive substrate with wiring.

[0070] Using the OCA (ST75) of Example 1 on which wiring is formed, an adhesive substrate with wiring is prepared. Figure 5 A glass laminate having the structure shown. An electronic device using wiring separately made on the film is used. The outer coating is bonded by applying PHOTOLEC A784-60 (manufactured by Sekisui Chemical Co., Ltd.) and laminating A4160 (manufactured by Toyobo Co., Ltd., 125μm thick) as a PET substrate and UV curing. PVB sheets (15mil thick) are laminated on both sides of the laminate film and sealed in laminated glass. The terminals of the resistance meter are pressed on the wiring part of the adhesive substrate with wiring to confirm the conduction, and the result confirms that there is conduction between the electronic device and the adhesive substrate with wiring.

[0071] The present invention has been described above based on the above-mentioned embodiments, but the present invention is not limited to the configuration of the above-mentioned embodiments, but of course includes various deformations, modifications, and combinations that can be made by those skilled in the art within the scope of the invention of the technical solution within the scope of protection requested in this application.

[0072] This application claims the benefit of priority based on Japanese patent application No. 2022-128817 filed on August 12, 2022, and all the disclosed contents are incorporated herein.

[0073] Explanation of symbols

[0074] 1 Adhesive substrate with wiring

[0075] 2.3 stacking equipment

[0076] 4 Glass laminate

[0077] 10. Base Material

[0078] 11 Adhesive layer

[0079] 12Wiring pattern (wiring)

[0080] 15 Electronic devices

[0081] 16 Outer coating

[0082] 17 Base material

[0083] 21a, 21b intermediate bonding layer

[0084] 22a, 22b glass plate

Claims

1. An adhesive substrate with wiring, comprising a substrate, an adhesive layer formed on the substrate, and a wiring pattern formed on the adhesive layer, The adhesive force of the adhesive layer to the PET film is greater than 0.01 N / 25 mm, the thickness change of the adhesive layer when immersed in isopropyl alcohol for 1 minute is within 20%, and the thickness change of the adhesive layer when immersed in toluene for 1 minute is within 18%.

2. The adhesive substrate with wiring according to claim 1, wherein The wiring pattern is composed of a material containing at least one selected from the group consisting of silver, copper, carbon and gold.

3. The adhesive substrate with wiring according to claim 1 or 2, wherein: The light transmittance of the entire surface of the adhesive substrate with wiring is 50% or more.

4. A laminated device comprising the adhesive substrate with wiring according to claim 1 or 2 and an electronic device arranged on the adhesive substrate with wiring, The electronic device is electrically connected to the wiring pattern formed on the adhesive layer.

5. The stacking device according to claim 4, wherein: The laminated device further includes an overcoat layer covering the electronic device and the wiring pattern. 6 . A glass laminate, wherein the lamination device according to claim 4 is sealed in a glass plate or bonded to the surface of a glass plate.

7. A method for manufacturing an adhesive substrate with wiring, comprising the following steps: forming an adhesive layer on a substrate, and forming a wiring pattern on the adhesive layer using a conductive ink material; The adhesive layer has an adhesive strength of 0.01 N / 25 mm or more to the PET film, and a thickness change within 20% when the adhesive layer is immersed in isopropyl alcohol for 1 minute and a thickness change within 18% when the adhesive layer is immersed in toluene for 1 minute.

8. The method for producing an adhesive substrate with wiring according to claim 7, wherein: The process of forming the wiring pattern forms the wiring pattern by printing the conductive ink material on the adhesive layer using an inkjet technique.

9. The method for producing an adhesive substrate with wiring according to claim 8, wherein: The process of forming the wiring pattern forms the wiring pattern by printing the conductive ink material on the adhesive layer using a screen printing technique.

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