Wafer laser cutting device based on chip processing

Abstract

The invention belongs to the technical field of chip processing, and discloses a wafer laser cutting device based on chip processing, which comprises a vibration mechanism, the vibration mechanism comprises four sliding blocks, the interiors of the sliding blocks are fixedly connected with first motors, and the first motors are rotatably connected with cams; through cooperation of the cam, the clamping plates and other structures, the laser cutting effect of the wafer is improved, the first motor is started to enable the wafer clamped among the four clamping plates to generate slight vibration in the vertical direction, the slight vibration promotes micro movement of a material in the laser cutting process, better interaction between a laser beam and the material is facilitated, and the laser cutting efficiency is improved. A more uniform and smoother cutting face is achieved, the vibration effect can accelerate the melting or crushing process of materials, the cutting time is shortened, the cutting efficiency is improved, meanwhile, vibration can accelerate airflow on the surface of a wafer, a certain heat dissipation effect is achieved, local overheating of the materials is reduced, expansion of a heat affected zone is avoided, and the flatness of the cutting edge is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip processing, and in particular is a wafer laser cutting device based on chip processing. Background Art

[0002] Wafers are the basic materials for the manufacture of semiconductor integrated circuits and play a vital role. They are made of high-purity silicon and go through a series of complex processing steps, including purification, melting, growing into single crystal rods (crystal rods), cutting, grinding, polishing and other steps, and finally form round wafers with a thickness of usually several hundred microns. In the field of semiconductor manufacturing, wafer laser cutting is a key step in dividing a complete wafer into independent chips.

[0003] Most of the existing wafer laser cutting devices based on chip processing only cut the fixed wafer by laser, which can easily cause local overheating of the wafer surface during the cutting process. At the same time, when the heat diffuses, it can easily cause material deformation or cracks, resulting in reduced cutting quality and product qualification rate. Therefore, a wafer laser cutting device based on chip processing is proposed. Summary of the invention

[0004] In order to solve the problem proposed in the above background technology that most of the fixed wafers are cut only by laser, which may easily cause local overheating of the wafer surface during the cutting process, and the diffusion of this part of heat may easily cause material deformation or cracks, resulting in reduced cutting quality and product qualification rate, the present invention provides a wafer laser cutting device based on chip processing.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solution: a wafer laser cutting device based on chip processing, comprising a vibration mechanism, the vibration mechanism is arranged inside a main body mechanism, an adjustment mechanism is arranged inside the main body mechanism, a cutting mechanism is arranged above the main body mechanism, and the adjustment mechanism is located below the vibration mechanism;

[0006] The vibration mechanism includes four sliders, a first motor is fixedly connected inside the slider, a cam is rotatably connected to the first motor, the top of the cam is against the bottom of the clamp, two first slide grooves are provided inside the clamp, an anti-collision pad is fixedly connected to the top of the inner wall of the first slide groove, a first spring is fixedly connected to the bottom of the inner wall of the first slide groove, an elastic pad is fixedly connected to the clamp, two support rods are fixedly connected to the top of the slider, a slide rod is fixedly connected to the bottom of the slider, and limiting blocks are fixedly connected to both sides of the slider.

[0007] Preferably, the top of the support rod passes through the bottom of the splint and extends to the inside of the first slide groove, the top of the support rod is against the anti-collision pad, the support rod is elastically connected to the inner wall of the first slide groove through the first spring, the cam is rotationally connected to the inner wall of the slider, there are four splints, and the elastic pad is located on the side where the four splints are close to each other.

[0008] Preferably, the main mechanism includes a main shell, four second slide grooves are evenly opened on the top of the main shell, limiting grooves are opened on both sides of the inner wall of the second slide groove, a vent hole is opened on the top of the main shell, a supporting airbag is fixedly connected to the top of the main shell, a folding airbag is fixedly connected to the inner wall of the second slide groove, a push plate is fixedly connected to the folding airbag, and the push plate is elastically connected to the inner wall of the second slide groove through two second springs.

[0009] Preferably, the vent hole is located between four second slide grooves, the number of the folding airbags is four, the supporting airbag is connected with the four folding airbags through the vent hole, and the folding airbag is located below the supporting airbag.

[0010] Preferably, the slider is slidably connected to the second slide groove, the limit block on the slider is slidably connected to the limit groove, both sides of the push plate are fixedly connected to the limit blocks, the side of the push plate away from the second spring is abutted against the slider, the elastic pad is located above the main shell, the support airbag is located between the four elastic pads, and the four folding airbags are located between the four sliders.

[0011] Preferably, the adjustment mechanism includes a second motor, a screw rod is rotatably connected to the second motor, a gear is meshed on the side of the screw rod, a turntable is fixedly connected to the top of the gear, and four arc grooves are evenly arranged on the top of the turntable.

[0012] Preferably, the second motor is fixedly connected to the inner wall of the main shell, the screw rod and the gear are rotatably connected to the inner wall of the main shell respectively, and the turntable is rotatably connected to the inner wall of the main shell.

[0013] Preferably, the turntable is located below the slider, the size of the slide bar matches the size of the arc-shaped groove, and the slide bar is slidably connected to the arc-shaped groove.

[0014] Preferably, the cutting mechanism comprises a wafer clamped between four clamping plates, and a laser cutting head is arranged above the wafer.

[0015] Preferably, the bottom of the wafer abuts against the top of the supporting airbag, and the laser cutting head is located above the clamping plate.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The present invention improves the laser cutting effect of the wafer by arranging the cooperation of structures such as cams and clamping plates, and starts the first motor to make the wafer clamped between the four clamping plates produce slight vibration in the vertical direction. The slight vibration promotes the micro-movement of the material during the laser cutting process, which helps to better interact between the laser beam and the material, and achieve a more uniform and smoother cutting surface. The vibration can accelerate the melting or crushing process of the material, shorten the cutting time, and improve the cutting efficiency. At the same time, the vibration can accelerate the airflow on the surface of the wafer, play a certain role in heat dissipation and reduce local overheating of the material, avoid the expansion of the heat-affected zone, improve the flatness of the cutting edge, reduce burrs and cracks, and improve product quality.

[0018] The present invention facilitates the clamping of wafers of different sizes by arranging the coordination of structures such as arc grooves and sliding rods, and starts the second motor to move the four clamping plates toward each other, so that the elastic pads on the four clamping plates are finally against the side of the wafer, clamping it between the four clamping plates, which is convenient for subsequent micro-vibration and laser cutting. At the same time, wafers of different specifications can be clamped and fixed by adjustment, thereby improving the application range of the device.

[0019] The present invention facilitates the support and cushioning of the bottom of the wafer by arranging the cooperation of structures such as the push plate and the support airbag. When the slider moves toward the direction close to the support airbag, the support airbag will gradually fill up. The bottom of the wafer is supported and cushioned by the elasticity of the support airbag, which can prevent the wafer from colliding with the top of the main shell during vibration and causing wear or cracks to the wafer. At the same time, the push plate and folded airbag sliding inside the second slide groove can block the second slide groove portion under the wafer, preventing particles generated during the cutting process from entering the main shell and affecting the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the structure of the present invention;

[0021] Figure 2 A schematic diagram of the structural relationship between the vent hole and the support airbag of the present invention;

[0022] Figure 3 A schematic diagram of the structural relationship between the limit block and the limit groove of the present invention;

[0023] Figure 4 A schematic diagram of the structural relationship between the slide bar and the arc groove of the present invention;

[0024] Figure 5 It is a bottom view structural diagram of the adjustment mechanism of the present invention;

[0025] Figure 6 It is a schematic diagram of the top view of the adjustment mechanism of the present invention;

[0026] Figure 7 It is a schematic diagram of the structural relationship between the push plate and the slider of the present invention;

[0027] Figure 8 It is a schematic diagram of the cross-sectional structure of the vibration mechanism of the present invention.

[0028] In the figure: 1. vibration mechanism; 101. slider; 102. first motor; 103. cam; 104. clamping plate; 105. first slide groove; 106. first spring; 107. anti-collision pad; 108. support rod; 109. elastic pad; 110. slide rod; 111. limit block; 2. main body mechanism; 201. main body shell; 202. second slide groove; 203. limit groove; 204. vent; 205. support airbag; 206. folding airbag; 207. push plate; 208. second spring; 3. adjustment mechanism; 301. second motor; 302. screw rod; 303. gear; 304. turntable; 305. arc groove; 4. cutting mechanism; 401. laser cutting head; 402. wafer. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] like Figures 1 to 8 As shown, the present invention provides a wafer laser cutting device based on chip processing, comprising a vibration mechanism 1, the vibration mechanism 1 is arranged inside a main body mechanism 2, an adjustment mechanism 3 is arranged inside the main body mechanism 2, a cutting mechanism 4 is arranged above the main body mechanism 2, and the adjustment mechanism 3 is located below the vibration mechanism 1;

[0031] The vibration mechanism 1 includes four sliders 101, the interior of the slider 101 is fixedly connected to a first motor 102, the first motor 102 is rotatably connected to a cam 103, the top of the cam 103 is against the bottom of a clamping plate 104, the interior of the clamping plate 104 is provided with two first sliding grooves 105, the top of the inner wall of the first sliding groove 105 is fixedly connected to an anti-collision pad 107, the bottom of the inner wall of the first sliding groove 105 is fixedly connected to a first spring 106, an elastic pad 109 is fixedly connected to the clamping plate 104, the top of the slider 101 is fixedly connected to two support rods 108, the bottom of the slider 101 is fixedly connected to a slide rod 110, and both sides of the slider 101 are fixedly connected to limit blocks 111.

[0032] The top of the support rod 108 passes through the bottom of the splint 104 and extends to the inside of the first slide groove 105. The top of the support rod 108 is against the anti-collision pad 107. The support rod 108 is elastically connected to the inner wall of the first slide groove 105 through the first spring 106. The cam 103 is rotationally connected to the inner wall of the slider 101. There are four splints 104, and the elastic pad 109 is located on the side where the four splints 104 are close to each other.

[0033] The cutting mechanism 4 includes a wafer 402 clamped between four clamps 104 , a laser cutting head 401 is arranged above the wafer 402 , the bottom of the wafer 402 abuts against the top of the supporting airbag 205 , and the laser cutting head 401 is located above the clamps 104 .

[0034] The above scheme is adopted: by setting the cooperation of the cam 103 and the clamping plate 104 and other structures, the laser cutting effect of the wafer 402 is improved, the first motor 102 is started to rotate the cam 103, and when the raised part on the cam 103 rotates to abut against the bottom of the clamping plate 104, the clamping plate 104 will move upward and squeeze the first spring 106. When the raised part on the cam 103 rotates to not abut against the bottom of the clamping plate 104, the clamping plate 104 will reset under the action of gravity and the elastic force of the first spring 106, so that the clamping plate 104 clamped between the four clamping plates 10 4. The wafer 402 generates slight vibration in the vertical direction. The tiny vibration promotes the micro-movement of the material during the laser cutting process, which helps to better interact between the laser beam and the material, and achieve a more uniform and smoother cutting surface. The vibration can accelerate the melting or crushing process of the material, shorten the cutting time, and improve the cutting efficiency. At the same time, the vibration can accelerate the airflow on the surface of the wafer 402, play a certain role in heat dissipation and reduce local overheating of the material, avoid the expansion of the heat-affected zone, improve the flatness of the cutting edge, reduce burrs and cracks, and improve product quality.

[0035] like Figures 2 to 6 As shown, the main body mechanism 2 includes a main body shell 201, four second slide grooves 202 are evenly opened on the top of the main body shell 201, and limiting grooves 203 are opened on both sides of the inner wall of the second slide groove 202. A vent 204 is opened on the top of the main body shell 201, and a support airbag 205 is fixedly connected to the top of the main body shell 201, and a folding airbag 206 is fixedly connected to the inner wall of the second slide groove 202. A push plate 207 is fixedly connected to the folding airbag 206, and the push plate 207 is elastically connected to the inner wall of the second slide groove 202 through two second springs 208. The vent 204 is located between the four second slide grooves 202, and there are four folding airbags 206. The support airbag 205 is communicated with the four folding airbags 206 through the vent 204, and the folding airbag 206 is located below the support airbag 205.

[0036] The slider 101 is slidably connected to the second slide groove 202, the limit block 111 on the slider 101 is slidably connected to the limit groove 203, both sides of the push plate 207 are fixedly connected to the limit blocks 111, the side of the push plate 207 away from the second spring 208 is against the slider 101, the elastic pad 109 is located above the main shell 201, the support airbag 205 is located between the four elastic pads 109, and the four folding airbags 206 are located between the four sliders 101.

[0037] The adjustment mechanism 3 includes a second motor 301, which is rotatably connected to a screw rod 302, a gear 303 is meshed on the side of the screw rod 302, a turntable 304 is fixedly connected to the top of the gear 303, and four arc grooves 305 are evenly opened on the top of the turntable 304. The second motor 301 is fixedly connected to the inner wall of the main shell 201, the screw rod 302 and the gear 303 are respectively rotatably connected to the inner wall of the main shell 201, the turntable 304 is rotatably connected to the inner wall of the main shell 201, the turntable 304 is located below the slider 101, the size of the slide bar 110 is matched with the size of the arc groove 305, and the slide bar 110 is slidably connected to the arc groove 305.

[0038] The above scheme is adopted: by setting the coordination of the arc groove 305 and the slide bar 110 and other structures, it is convenient to clamp the wafers 402 of different sizes, start the second motor 301 to rotate the screw rod 302, the rotation of the screw rod 302 will drive the turntable 304 to rotate through the gear 303, the rotation of the turntable 304 will apply stress to the slide bar 110 inside the arc groove 305 through the arc groove 305, and because the slider 101 is slidably connected to the second slide groove 202 through the limit block 111, the slide bar 110 will drive the slider 101 to move in the direction close to the support airbag 205 after being stressed, so that the four clamping plates 104 move in the direction close to each other, and finally the elastic pads 109 on the four clamping plates 104 are against the side of the wafer 402, clamping it between the four clamping plates 104, so as to facilitate the subsequent micro-vibration and laser cutting, and at the same time, the wafers 402 of different specifications can be clamped and fixed by adjustment, thereby improving the scope of application of the device;

[0039] By setting up the push plate 207 and the support airbag 205 and other structures, it is convenient to support and cushion the bottom of the wafer 402. When the slider 101 moves in the direction close to the support airbag 205, it will push the push plate 207 to move in the direction close to the second spring 208, squeeze the folded airbag 206 and the gas inside it, and compress the second spring 208 at the same time, so that the gas inside the vent 204 is pressurized and enters the support airbag 205 through the vent 204, so that the support airbag 205 is gradually filled. The bottom of the wafer 402 is supported and cushioned by the elasticity of the support airbag 205, which can prevent the wafer 402 from colliding with the top of the main shell 201 during the vibration process and causing wear or cracks to the wafer 402. At the same time, the push plate 207 and the folded airbag 206 sliding in the second slide groove 202 can block the second slide groove 202 part below the wafer 402, so as to prevent particles generated during the cutting process from entering the main shell 201 and affecting the device.

[0040] The working principle and use process of the present invention are as follows: first, the wafer 402 is placed at the center of the top of the main housing 201, and then the second motor 301 is started to rotate the screw rod 302. The screw rod 302 rotates to drive the turntable 304 to rotate through the gear 303. The turntable 304 rotates to apply stress to the slide bar 110 inside the arc groove 305 through the arc groove 305. Since the slide bar 101 is slidably connected to the second slide groove 202 through the limit block 111, the slide bar 110 is forced to drive the slide bar 101 to move in the direction close to the support airbag 205, so that the four clamping plates 1 04 move in the direction of approaching each other, and finally the elastic pads 109 on the four clamping plates 104 abut against the side of the wafer 402, clamping it between the four clamping plates 104, and at the same time, when the slider 101 moves in the direction of approaching the supporting airbag 205, it pushes the push plate 207 to move in the direction of approaching the second spring 208, squeezing the folded airbag 206 and the gas inside it, and compressing the second spring 208, so that the gas inside the vent hole 204 is pressurized and enters the supporting airbag 205 through the vent hole 204, so that the supporting airbag 205 is gradually filled to support the bottom of the wafer 402;

[0041] Subsequently, the laser cutting head 401 is driven by an external robotic arm to move to the top of the wafer 402 and emit a laser. The wafer 402 is cut by the laser according to the route specified by the system. During this process, the first motor 102 is started to rotate the cam 103. When the raised part on the cam 103 rotates to abut against the bottom of the clamp 104, the clamp 104 will move upward and squeeze the first spring 106. When the raised part on the cam 103 rotates to not abut against the bottom of the clamp 104, the clamp 104 will reset under the action of gravity and the elastic force of the first spring 106, causing the wafer 402 clamped between the four clamps 104 to vibrate slightly in the vertical direction. The tiny vibration promotes the micro-movement of the material during the laser cutting process, helps to better interact between the laser beam and the material, and achieve a more uniform and smoother cutting surface, which can improve the cutting effect.

[0042] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0043] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer laser cutting device based on chip processing, comprising a vibration mechanism (1), characterized in that: The vibration mechanism (1) is arranged inside the main body mechanism (2), an adjustment mechanism (3) is arranged inside the main body mechanism (2), a cutting mechanism (4) is arranged above the main body mechanism (2), and the adjustment mechanism (3) is located below the vibration mechanism (1); The vibration mechanism (1) comprises four sliders (101), wherein a first motor (102) is fixedly connected inside the slider (101), a cam (103) is rotatably connected to the first motor (102), the top of the cam (103) abuts against the bottom of a clamping plate (104), two first sliding grooves (105) are provided inside the clamping plate (104), an anti-collision pad (107) is fixedly connected to the top of the inner wall of the first sliding groove (105), a first spring (106) is fixedly connected to the bottom of the inner wall of the first sliding groove (105), an elastic pad (109) is fixedly connected to the clamping plate (104), two support rods (108) are fixedly connected to the top of the slider (101), a sliding rod (110) is fixedly connected to the bottom of the slider (101), and both sides of the slider (101) are fixedly connected to limit blocks (111).

2. The wafer laser cutting device based on chip processing according to claim 1, characterized in that: The top of the support rod (108) passes through the bottom of the splint (104) and extends to the inside of the first slide groove (105). The top of the support rod (108) is against the anti-collision pad (107). The support rod (108) is elastically connected to the inner wall of the first slide groove (105) through the first spring (106). The cam (103) is rotationally connected to the inner wall of the slider (101). There are four splints (104), and the elastic pad (109) is located on the side where the four splints (104) are close to each other.

3. The wafer laser cutting device based on chip processing according to claim 1, characterized in that: The main body mechanism (2) comprises a main body shell (201), four second slide grooves (202) are evenly arranged on the top of the main body shell (201), both sides of the inner wall of the second slide groove (202) are arranged with limit grooves (203), a vent hole (204) is arranged on the top of the main body shell (201), a support airbag (205) is fixedly connected to the top of the main body shell (201), a folding airbag (206) is fixedly connected to the inner wall of the second slide groove (202), a push plate (207) is fixedly connected to the folding airbag (206), and the push plate (207) is elastically connected to the inner wall of the second slide groove (202) through two second springs (208).

4. The wafer laser cutting device based on chip processing according to claim 3 is characterized in that: The vent hole (204) is located between the four second slide grooves (202), the number of the folding airbags (206) is four, the supporting airbag (205) is connected to the four folding airbags (206) through the vent hole (204), and the folding airbag (206) is located below the supporting airbag (205).

5. The wafer laser cutting device based on chip processing according to claim 3, characterized in that: The slider (101) is slidably connected to the second slide groove (202), the limit block (111) on the slider (101) is slidably connected to the limit groove (203), both sides of the push plate (207) are fixedly connected to the limit blocks (111), the side of the push plate (207) away from the second spring (208) is in contact with the slider (101), the elastic pad (109) is located above the main shell (201), the support airbag (205) is located between the four elastic pads (109), and the four folding airbags (206) are located between the four sliders (101).

6. The wafer laser cutting device based on chip processing according to claim 3, characterized in that: The adjustment mechanism (3) comprises a second motor (301), the second motor (301) is rotatably connected to a screw rod (302), a side surface of the screw rod (302) is meshed with a gear (303), a top of the gear (303) is fixedly connected to a rotating disk (304), and four arc-shaped grooves (305) are evenly arranged on the top of the rotating disk (304).

7. The wafer laser cutting device based on chip processing according to claim 6, characterized in that: The second motor (301) is fixedly connected to the inner wall of the main housing (201), the screw rod (302) and the gear (303) are respectively rotatably connected to the inner wall of the main housing (201), and the turntable (304) is rotatably connected to the inner wall of the main housing (201).

8. The wafer laser cutting device based on chip processing according to claim 6, characterized in that: The rotating disk (304) is located below the slider (101), the size of the sliding rod (110) is matched with the size of the arc-shaped groove (305), and the sliding rod (110) and the arc-shaped groove (305) are slidably connected.

9. The wafer laser cutting device based on chip processing according to claim 6, characterized in that: The cutting mechanism (4) comprises a wafer (402) clamped between four clamping plates (104), and a laser cutting head (401) is arranged above the wafer (402).

10. The wafer laser cutting device based on chip processing according to claim 9, characterized in that: The bottom of the wafer (402) abuts against the top of the supporting airbag (205), and the laser cutting head (401) is located above the clamping plate (104).

Images