Wafer laser cutting device based on chip processing

Abstract

The application belongs to the technical field of chip processing, and discloses a wafer laser cutting device based on chip processing, which comprises a vibrating mechanism, the vibrating mechanism comprises four sliding blocks, the inside of the sliding block is fixedly connected with a first motor, and the first motor is rotationally connected with a cam; the cooperation of the cam and the clamping plate and other structures is arranged, so that the laser cutting effect of the wafer is improved; the wafer clamped between the four clamping plates is slightly vibrated in the vertical direction by starting the first motor; the slight vibration promotes the micro-motion of the material in the laser cutting process, is helpful to the better interaction of the laser beam and the material, realizes a more uniform and smoother cutting surface, and the vibration effect can accelerate the melting or crushing process of the material, shorten the cutting time, improve the cutting efficiency, accelerate the airflow on the wafer surface at the same time, play a certain heat dissipation role and reduce the local overheating of the material, avoid the expansion of the heat affected zone, and improve the flatness of the cutting edge.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of chip processing, and particularly relates to a wafer laser cutting device based on chip processing. BACKGROUND

[0002] A wafer is a basic material for manufacturing a semiconductor integrated circuit and plays a vital role. The wafer is made of high-purity silicon and is formed through a series of complex processing procedures, including purification, smelting, growth into a single crystal rod (crystal rod), cutting, grinding, polishing and the like, and finally forms a wafer with a thickness of several hundred microns. In the field of semiconductor manufacturing, wafer laser cutting is a key step for dividing a complete wafer into independent chips.

[0003] The existing wafer laser cutting device based on chip processing mostly only cuts the fixed wafer through laser. In the cutting process, the wafer surface is easily locally overheated, and the heat diffusion of the part easily causes material deformation or cracks, thereby reducing the cutting quality and product qualification rate. Therefore, the wafer laser cutting device based on chip processing is proposed. SUMMARY

[0004] To solve the problem that the wafer is mostly only cut through laser in the prior art, the wafer surface is easily locally overheated in the cutting process, and the heat diffusion of the part easily causes material deformation or cracks, thereby reducing the cutting quality and product qualification rate, the wafer laser cutting device based on chip processing is provided.

[0005] To achieve the above object, the application provides the following technical scheme: a wafer laser cutting device based on chip processing, comprising a vibration mechanism, the vibration mechanism is arranged in the interior of a main body mechanism, the interior of the main body mechanism is provided with an adjusting mechanism, the upper portion of the main body mechanism is provided with a cutting mechanism, and the adjusting mechanism is located below the vibration mechanism.

[0006] The vibration mechanism comprises four sliding blocks, the interior of each sliding block is fixedly connected with a first motor, a cam is rotationally connected to the first motor, the top of the cam abuts against the bottom of a clamping plate, two first sliding grooves are formed in the interior of the clamping plate, an anti-collision pad is fixedly connected to the top of the inner wall of each first sliding groove, a first spring is fixedly connected to the bottom of the inner wall of each first sliding groove, an elastic pad is fixedly connected to the clamping plate, two supporting rods are fixedly connected to the top of each sliding block, a sliding rod is fixedly connected to the bottom of each sliding block, and a limiting block is fixedly connected to the side of each sliding block.

[0007] Preferably, the top of the support rod extends through the bottom of the clamping plate to the inside of the first sliding groove, the top of the support rod abuts against the anti-collision pad, the support rod is elastically connected between the first spring and the inner wall of the first sliding groove, the cam is rotatably connected between the inner wall of the sliding block, the number of the clamping plates is four, and the elastic pads are located on one side of the four clamping plates close to each other.

[0008] Preferably, the main body mechanism comprises a main body shell, four second sliding grooves are uniformly arranged on the top of the main body shell, limit grooves are arranged on the two sides of the inner wall of the second sliding groove, a ventilation hole is arranged on the top of the main body shell, a support air bag is fixedly connected to the top of the main body shell, a folding air bag is fixedly connected to the inner wall of the second sliding groove, a push plate is fixedly connected to the folding air bag, and the push plate is elastically connected between the two second springs and the inner wall of the second sliding groove.

[0009] Preferably, the ventilation hole is located between the four second sliding grooves, the number of the folding air bags is four, the support air bag is communicated with the four folding air bags through the ventilation hole, and the folding air bags are located below the support air bag.

[0010] Preferably, the sliding block is slidably connected with the second sliding groove, the limiting block on the sliding block is slidably connected with the limiting groove, the limiting blocks are fixedly connected to the two sides of the push plate, the side, away from the second spring, of the push plate abuts against the sliding block, the elastic pads are located above the main body shell, the support air bag is located between the four elastic pads, and the four folding air bags are located between the four sliding blocks.

[0011] Preferably, the adjusting mechanism comprises a second motor, a screw rod is rotatably connected to the second motor, a gear is engaged with the side surface of the screw rod, a rotating disc is fixedly connected to the top of the gear, and four arc-shaped grooves are uniformly arranged on the top of the rotating disc.

[0012] Preferably, the second motor is fixedly connected with the inner wall of the main body shell, the screw rod and the gear are rotatably connected with the inner wall of the main body shell respectively, and the rotating disc is rotatably connected with the inner wall of the main body shell.

[0013] Preferably, the rotating disc is located below the sliding block, the size of the sliding rod is matched with the size of the arc-shaped groove, and the sliding rod is slidably connected with the arc-shaped groove.

[0014] Preferably, the cutting mechanism comprises a wafer clamped between the four clamping plates, and a laser cutting head is arranged above the wafer.

[0015] Preferably, the bottom of the wafer abuts against the top of the support air bag, and the laser cutting head is located above the clamping plate.

[0016] Compared with the prior art, the present application has the following advantages:

[0017] The present application promotes the laser cutting effect of the wafer by the cooperation of the cam and the clamping plate and the like structure, the wafer clamped between the four clamping plates is slightly vibrated in the vertical direction by starting the first motor, the slight vibration promotes the micro-motion of the material in the laser cutting process, which helps the better interaction of the laser beam and the material, realizes more uniform and smoother cutting surface, and the vibration effect can accelerate the melting or breaking process of the material, shorten the cutting time and improve the cutting efficiency, at the same time, the vibration can accelerate the airflow on the wafer surface, play a certain heat dissipation effect and reduce the local overheating of the material, avoid the expansion of the heat affected zone, improve the flatness of the cutting edge, reduce burrs and cracks, and improve the product quality.

[0018] The present application facilitates clamping of wafers of different sizes by the cooperation of the arc-shaped groove and the slide rod and the like structure, the four clamping plates are moved towards each other by starting the second motor, and finally the elastic pads on the four clamping plates abut against the side surface of the wafer, which is clamped between the four clamping plates, facilitating subsequent micro-vibration and laser cutting, and different specifications of wafers can be clamped and fixed by adjustment, thereby improving the application range of the device.

[0019] The present application facilitates supporting and buffering of the bottom of the wafer by the cooperation of the push plate and the supporting air bag and the like structure, the supporting air bag is gradually filled when the sliding block moves towards the supporting air bag, and the bottom of the wafer is supported and buffered by the elasticity of the supporting air bag, which can avoid the wafer colliding with the top of the main body shell during vibration and causing wear or cracks on the wafer, at the same time, the push plate and the folding air bag sliding in the second sliding groove can shield the second sliding groove part below the wafer, avoiding the particles generated during cutting from entering the main body shell and affecting the device. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of the present application;

[0021] Figure 2 It is a structural relationship cooperation schematic diagram of the air vent and the supporting air bag of the present application;

[0022] Figure 3 It is a structural relationship cooperation schematic diagram of the limiting block and the limiting groove of the present application;

[0023] Figure 4 It is a structural relationship cooperation schematic diagram of the slide rod and the arc-shaped groove of the present application;

[0024] Figure 5 It is a bottom view structural schematic diagram of the adjusting mechanism of the present application;

[0025] Figure 6 It is a top view structural schematic diagram of the adjusting mechanism of the present application;

[0026] Figure 7 For the structure of the invention and the relationship between the push plate and the slider are shown in the schematic diagram;

[0027] Figure 8 For the invention of the vibration mechanism cross section structure schematic diagram.

[0028] In the figure: 1, vibration mechanism; 101, slider; 102, first motor; 103, cam; 104, clamping plate; 105, first sliding groove; 106, first spring; 107, anti-collision pad; 108, support rod; 109, elastic pad; 110, slide rod; 111, limit block; 2, main body mechanism; 201, main body shell; 202, second sliding groove; 203, limiting groove; 204, air hole; 205, support air bag; 206, folding air bag; 207, push plate; 208, second spring; 3, adjusting mechanism; 301, second motor; 302, screw; 303, gear; 304, turntable; 305, arc-shaped groove; 4, cutting mechanism; 401, laser cutting head; 402, wafer. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0030] As Figures 1 to 8 shown, the present application provides a wafer laser cutting device based on chip processing, which comprises a vibration mechanism 1, the vibration mechanism 1 is arranged in the interior of a main body mechanism 2, the interior of the main body mechanism 2 is provided with an adjusting mechanism 3, the upper part of the main body mechanism 2 is provided with a cutting mechanism 4, and the adjusting mechanism 3 is located below the vibration mechanism 1.

[0031] The vibration mechanism 1 comprises four sliders 101, the interior of each slider 101 is fixedly connected with a first motor 102, the first motor 102 is rotationally connected with a cam 103, the top of the cam 103 abuts against the bottom of a clamping plate 104, two first sliding grooves 105 are formed in the interior of the clamping plate 104, an anti-collision pad 107 is fixedly connected to the top of the inner wall of each first sliding groove 105, a first spring 106 is fixedly connected to the bottom of the inner wall of each first sliding groove 105, an elastic pad 109 is fixedly connected to the clamping plate 104, two support rods 108 are fixedly connected to the top of each slider 101, a slide rod 110 is fixedly connected to the bottom of each slider 101, and a limit block 111 is fixedly connected to the two sides of each slider 101.

[0032] The top of the support rod 108 extends through the bottom of the clamping plate 104 to the inside of the first sliding groove 105, the top of the support rod 108 abuts against the anti-collision pad 107, the support rod 108 is elastically connected between the first spring 106 and the inner wall of the first sliding groove 105, the cam 103 is rotationally connected with the inner wall of the sliding block 101, the number of the clamping plate 104 is four, and the elastic pad 109 is located on one side of the four clamping plates 104 close to each other.

[0033] The cutting mechanism 4 includes a wafer 402 clamped between the four clamping plates 104, a laser cutting head 401 is arranged above the wafer 402, the bottom of the wafer 402 abuts against the top of the support air bag 205, and the laser cutting head 401 is located above the clamping plate 104.

[0034] By adopting the above scheme, the cooperation of the cam 103 and the clamping plate 104 and the like is arranged, so as to improve the laser cutting effect of the wafer 402, the first motor 102 is started to rotate the cam 103, when the protruding part on the cam 103 abuts against the bottom of the clamping plate 104, the clamping plate 104 is lifted and presses the first spring 106, when the protruding part on the cam 103 does not abut against the bottom of the clamping plate 104, the clamping plate 104 is reset under the action of gravity and the elastic force of the first spring 106, the wafer 402 clamped between the four clamping plates 104 slightly vibrates in the vertical direction, the slight vibration promotes the micro-motion of the material in the laser cutting process, which is helpful for better interaction between the laser beam and the material, so as to realize more uniform and smoother cutting surface, the vibration action can accelerate the melting or crushing process of the material, shorten the cutting time and improve the cutting efficiency, at the same time, the vibration can accelerate the airflow on the surface of the wafer 402, play a certain heat dissipation role and reduce the local overheating of the material, avoid the expansion of the heat affected zone, improve the flatness of the cutting edge, reduce burrs and cracks, and improve the product quality.

[0035] As shown in Figures 2 to 6 The main body mechanism 2 includes a main body shell 201, four second sliding grooves 202 are uniformly arranged on the top of the main body shell 201, limit grooves 203 are arranged on the two sides of the inner wall of the second sliding groove 202, an air hole 204 is arranged on the top of the main body shell 201, a support air bag 205 is fixedly connected to the top of the main body shell 201, folding air bags 206 are fixedly connected to the inner wall of the second sliding groove 202, a push plate 207 is fixedly connected to the folding air bag 206, the push plate 207 is elastically connected between the second spring 208 and the inner wall of the second sliding groove 202, the air hole 204 is located between the four second sliding grooves 202, the number of the folding air bag 206 is four, the support air bag 205 communicates with the four folding air bags 206 through the air hole 204, and the folding air bag 206 is located below the support air bag 205.

[0036] The sliding block 101 is in sliding connection with the second sliding groove 202, the limiting block 111 on the sliding block 101 is in sliding connection with the limiting groove 203, the two sides of the push plate 207 are fixedly connected with the limiting block 111, the side, away from the second spring 208, of the push plate 207 is in abutment with the sliding block 101, the elastic pad 109 is located above the main body shell 201, the supporting air bag 205 is located between the four elastic pads 109, and the four folding air bags 206 are located between the four sliding blocks 101.

[0037] The adjusting mechanism 3 comprises a second motor 301, the second motor 301 is rotatably connected with a lead screw 302, the side surface of the lead screw 302 is engaged with a gear 303, the top of the gear 303 is fixedly connected with a rotating disc 304, four arc-shaped grooves 305 are uniformly formed in the top of the rotating disc 304, the second motor 301 is fixedly connected with the inner wall of the main body shell 201, the lead screw 302 and the gear 303 are rotatably connected with the inner wall of the main body shell 201, the rotating disc 304 is rotatably connected with the inner wall of the main body shell 201, the rotating disc 304 is located below the sliding block 101, the size of the sliding rod 110 is matched with the size of the arc-shaped groove 305, and the sliding rod 110 is in sliding connection with the arc-shaped groove 305.

[0038] By matching the arc-shaped groove 305 and the sliding rod 110, different sizes of wafers 402 can be conveniently clamped, the second motor 301 is started to drive the lead screw 302 to rotate, the lead screw 302 rotates to drive the rotating disc 304 to rotate through the gear 303, the rotating disc 304 rotates to apply stress to the sliding rod 110 in the arc-shaped groove 305 through the arc-shaped groove 305, and because the sliding block 101 is in sliding connection with the second sliding groove 202 through the limiting block 111, the sliding rod 110 is stressed to drive the sliding block 101 to move towards the supporting air bag 205, so that the four clamping plates 104 move towards each other, and finally the elastic pads 109 on the four clamping plates 104 abut against the side surface of the wafer 402, so that the wafer 402 is clamped between the four clamping plates 104, which is convenient for subsequent micro-vibration and laser cutting, and different specifications of wafers 402 can be clamped and fixed through adjustment, so that the application range of the device is improved.

[0039] Through the cooperation of the push plate 207 and the supporting air bag 205 and other structures, the bottom of the wafer 402 is conveniently supported and buffered, when the sliding block 101 moves towards the direction close to the supporting air bag 205, the push plate 207 is pushed to move towards the direction close to the second spring 208, the folding air bag 206 and the gas inside are extruded, the second spring 208 is compressed, the gas inside the air hole 204 is pressurized and enters the inside of the supporting air bag 205 through the air hole 204, the supporting air bag 205 is gradually filled, the bottom of the wafer 402 is supported and buffered through the elasticity of the supporting air bag 205, the wafer 402 can be prevented from colliding with the top of the main body shell 201 in the vibration process to cause wear or crack of the wafer 402, meanwhile, the push plate 207 and the folding air bag 206 inside the second sliding groove 202 can shield the second sliding groove 202 part below the wafer 402, the particles generated in the cutting process can be prevented from entering the inside of the main body shell 201 to affect the device.

[0040] The working principle and use process of the wafer cutting device are as follows: firstly, the wafer 402 is placed at the center position of the top of the main body shell 201, then the second motor 301 is started to rotate the lead screw 302, the rotation of the lead screw 302 drives the rotating disc 304 to rotate through the gear 303, the rotating disc 304 rotates to apply stress to the sliding rod 110 inside the arc-shaped groove 305, because the sliding block 101 is slidably connected between the limiting block 111 and the second sliding groove 202, the sliding rod 110 is stressed to drive the sliding block 101 to move towards the direction close to the supporting air bag 205, the four clamping plates 104 move towards each other, the elastic pads 109 on the four clamping plates 104 abut against the side surface of the wafer 402, and the wafer 402 is clamped between the four clamping plates 104, when the sliding block 101 moves towards the direction close to the supporting air bag 205, the push plate 207 is pushed to move towards the direction close to the second spring 208, the folding air bag 206 and the gas inside are extruded, the second spring 208 is compressed, the gas inside the air hole 204 is pressurized and enters the inside of the supporting air bag 205 through the air hole 204, the supporting air bag 205 is gradually filled, and the bottom of the wafer 402 is supported;

[0041] Subsequently, the laser cutting head 401 is moved above the wafer 402 by the external mechanical arm and emits laser, and the wafer 402 is cut according to the system specified route. In this process, the first motor 102 is started to rotate the cam 103. When the convex part on the cam 103 rotates to the bottom of the clamping plate 104, the clamping plate 104 will go up and press the first spring 106. When the convex part on the cam 103 rotates to not abut the bottom of the clamping plate 104, the clamping plate 104 will reset under the action of gravity and the elastic force of the first spring 106, so that the wafer 402 clamped between the four clamping plates 104 will vibrate slightly in the vertical direction. The slight vibration promotes the micro-motion of the material in the laser cutting process, which helps the laser beam to interact with the material better, realizes a more uniform and smooth cutting surface, and can improve the cutting effect.

[0042] It should be noted that the relational terms herein such as first and second and the like are used solely to distinguish one entity or action from another, without necessarily requiring or implying any such actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0043] Although embodiments of the present application have been shown and described, it is to be understood that various modifications, substitutions, replacements and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A wafer laser cutting device based on chip processing, comprising a vibrating mechanism (1), characterized in that: The vibration mechanism (1) is arranged in the inside of the main body mechanism (2), the inside of the main body mechanism (2) is provided with the adjusting mechanism (3), the top of the main body mechanism (2) is provided with the cutting mechanism (4), the adjusting mechanism (3) is below the vibration mechanism (1); The vibration mechanism (1) includes four sliding blocks (101), the inside of the sliding block (101) is fixedly connected with a first motor (102), the first motor (102) is rotatably connected with a cam (103), the top of the cam (103) abuts with the bottom of a clamping plate (104), the inside of the clamping plate (104) is provided with two first sliding grooves (105), the top of the inner wall of the first sliding groove (105) is fixedly connected with a bump pad (107), the bottom of the inner wall of the first sliding groove (105) is fixedly connected with a first spring (106), the clamping plate (104) is fixedly connected with an elastic pad (109), the top of the sliding block (101) is fixedly connected with two supporting rods (108), the bottom of the sliding block (101) is fixedly connected with a sliding rod (110), the two sides of the sliding block (101) are both fixedly connected with a limiting block (111); The main body mechanism (2) includes a main body shell (201); The adjusting mechanism (3) includes a second motor (301), the second motor (301) is rotatably connected with a lead screw (302), the side surface of the lead screw (302) is engaged with a gear (303), the top of the gear (303) is fixedly connected with a rotating disc (304), the top of the rotating disc (304) is uniformly provided with four arc grooves (305), the second motor (301) and the inner wall of the main body shell (201) are fixedly connected, the lead screw (302) and the gear (303) are rotatably connected with the inner wall of the main body shell (201) respectively, the rotating disc (304) is rotatably connected with the inner wall of the main body shell (201), the rotating disc (304) is below the sliding block (101), the size of the sliding rod (110) is matched with the size of the arc groove (305), the sliding rod (110) and the arc groove (305) are slidably connected.

2. The chip processing based wafer laser dicing apparatus according to claim 1, wherein: The top of the supporting rod (108) extends to the inside of the first sliding groove (105) through the bottom of the clamping plate (104), the top of the supporting rod (108) abuts with the bump pad (107), the supporting rod (108) is elastically connected between the first spring (106) and the inner wall of the first sliding groove (105), the cam (103) and the inner wall of the sliding block (101) are rotatably connected, the number of the clamping plate (104) is four, the elastic pad (109) is located on the side where the four clamping plates (104) are close to each other.

3. The chip processing based wafer laser dicing apparatus of claim 1, wherein: The top of the main body shell (201) is uniformly provided with four second sliding grooves (202), the inner wall of the second sliding groove (202) is provided with a limiting groove (203) on both sides, the top of the main body shell (201) is provided with a ventilation hole (204), the top of the main body shell (201) is fixedly connected with a supporting air bag (205), the inner wall of the second sliding groove (202) is fixedly connected with a folding air bag (206), the folding air bag (206) is fixedly connected with a push plate (207), and the push plate (207) is elastically connected between the inner wall of the second sliding groove (202) through two second springs (208).

4. The chip processing based wafer laser dicing apparatus of claim 3, wherein: The ventilation hole (204) is located between the four second sliding grooves (202), the number of the folding air bags (206) is four, the supporting air bag (205) communicates with the four folding air bags (206) through the ventilation hole (204), and the folding air bags (206) are located below the supporting air bag (205).

5. The chip processing based wafer laser dicing apparatus of claim 3, wherein: The sliding block (101) is in sliding connection with the second sliding groove (202), the limiting block (111) on the sliding block (101) is in sliding connection with the limiting groove (203), the two sides of the push plate (207) are fixedly connected with the limiting block (111), the side, away from the second spring (208), of the push plate (207) abuts against the sliding block (101), the elastic pad (109) is located above the main body shell (201), the supporting air bag (205) is located between the four elastic pads (109), and the four folding air bags (206) are located between the four sliding blocks (101).

6. The chip processing based wafer laser dicing apparatus of claim 1, wherein: The cutting mechanism (4) comprises a wafer (402) clamped between four clamping plates (104), and the wafer (402) is provided with a laser cutting head (401) above.

7. The chip processing based wafer laser dicing apparatus of claim 6, wherein: The bottom of the wafer (402) abuts against the top of the supporting air bag (205), and the laser cutting head (401) is located above the clamping plate (104).

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