A vacuum parallel seam welding device

Abstract

The present invention relates to the field of parallel seam welding equipment, and particularly to a vacuum parallel seam welding equipment, which includes a vacuum unit and a welding unit. The vacuum unit includes a chamber and a vacuum system, and the welding unit is arranged in the chamber. The welding unit includes a workbench and a parallel seam welding equipment. An getter activation assembly is arranged on the workbench, and the getter activation assembly includes an activation tooling and a power supply assembly; the activation tooling is loaded on the workbench to form a plurality of activation units for placing the devices to be encapsulated. The equipment of the present invention can complete the getter activation and parallel seam welding processes together, can significantly improve the transfer efficiency of MEMS devices, and can greatly reduce the risk of performance degradation or failure of MEMS devices compared with the equipment for activating getters by high-temperature heating of the entire MEMS device, ensuring the long-term reliability and stability of MEMS devices.

Description

Technical Field

[0001] The present invention relates to the field of parallel seam welding equipment, and particularly to a vacuum parallel seam welding equipment. Background Art

[0002] Microelectromechanical system (MEMS) vacuum packaging technology plays a crucial role in multiple application fields, especially in high-performance devices such as infrared detectors, inertial sensors, pressure sensors, magnetometers, and microphones. Since MEMS devices usually have tiny sizes and high performance requirements, they often need to operate in a vacuum environment.

[0003] Parallel seam welding is a commonly used MEMS device packaging method. A parallel seam welding equipment can evacuate an MEMS device. In a vacuum state, when a thin-shell cover plate in the MEMS device is accurately aligned with the package case and placed on the package case, the welding head of the parallel welding equipment descends, presses the parallel welding wheel onto the weld seam at the welding joint of the cover plate and the package case, and moves horizontally along the weld seam to achieve the welding of the cover plate and the package case.

[0004] Currently, in order to improve the transfer efficiency of MEMS devices, the vacuum seam welding equipment on the market is changing from a single machine to a device capable of performing multiple processes. For example, the Chinese patent application with the application number CN202010855120.5 provides a high-speed fully automatic vacuum annealing seam welder, which can realize the annealing and welding processes of MEMS devices.

[0005] During the use of MEMS devices, residual gases and released gases may affect the performance and reliability of the devices. By arranging a getter in the cavity of the MEMS device, the residual gases that cannot be completely discharged during the packaging process can be continuously adsorbed, thereby maintaining a long-term vacuum environment. Currently, there is no relevant report on a device that can simultaneously activate the getter and perform parallel seam welding of MEMS devices.

[0006] Since the effect of the getter is easily affected by external gas pollution or its own oxidation reaction, therefore, how to effectively activate the getter and prevent its oxidation during the packaging process is a difficult point that needs to be overcome in the current technology. Traditionally, the activation of the getter is completed through high-temperature treatment. The usual method is to expose the entire packaged MEMS device to a high-temperature vacuum environment and activate the adsorption capacity of the getter inside the MEMS device by heating for a long time. However, the disadvantage of this method is that the high temperature may have an adverse effect on the MEMS device and its other components, and some devices need to avoid the direct influence of high temperature on the entire packaging system;

[0007] To overcome this problem, some researchers in the industry have proposed using cryosorb getters. However, cryosorb getters have strict requirements for the type of getter, so their popularization is limited to a certain extent. In addition, some studies have proposed using special tooling designs. For example, Yang Kaijun et al. mentioned in "Research on the Vacuum Packaging Process of MEMS Devices" that the getter can be fixed on the cover plate. In a vacuum environment, the cover plate and the shell are pre-separated, and only the cover plate is heated to activate the getter. When the required activation temperature and time are reached, the cover plate is moved down to closely contact the shell, and then welded and packaged to reduce the impact on other components. This method activates the getter by heating the cover plate, ensuring that the getter fully functions without affecting other components. However, most of these reported methods or toolings are for eutectic soldering packaging processes. Since these toolings will obstruct the welding track of the parallel welding equipment, they cannot be directly applied to vacuum parallel welding equipment. Summary of the Invention

[0008] The present invention aims to solve the deficiencies in the prior art and provides a vacuum parallel seam welding device, which has both the function of activating the getter and the seam welding function, and can avoid potential damage to the entire MEMS device caused by traditional high-temperature treatment.

[0009] To solve the above technical problems, the present invention adopts the following technical solution: A vacuum parallel seam welding device includes a vacuum unit and a welding unit. The vacuum unit includes a closable chamber and a vacuum system for generating negative pressure in the chamber. The welding unit is disposed in the chamber. The welding unit includes a workbench and a parallel seam welding device. An getter activation assembly is further disposed in the welding unit. The getter activation assembly includes an activation tooling and a power supply assembly electrically connected to the activation tooling. The activation tooling is disposed on the workbench. An activation unit is formed on the activation tooling. The activation unit is used to place the device to be packaged. The device to be packaged placed in the activation unit is within the welding track of the parallel seam welding device. The activation unit is configured such that the preparatory weld or the welding part of the device to be packaged placed in the activation unit is directly exposed to the parallel seam welding device, and a pair of leads in the device to be packaged are separately led out, and the separately led out pair of leads are electrically connected to the power supply assembly.

[0010] As a preferred embodiment, the activation unit is configured such that a pair of leads in the device to be packaged placed on the activation tooling are separately led out, and the separately led out leads are electrically connected to the power supply assembly.

[0011] As a preferred embodiment, the activation unit includes a deep cavity formed on the top surface of the activation tooling. The depth of the deep cavity is matched with the height of the device to be packaged, and the device to be packaged is placed in the deep cavity.

[0012] As a preferred embodiment, a pair of grooves and a pair of through holes are formed at the bottom end of the deep cavity. The grooves and the through holes are independently arranged. A pair of pins on the device to be encapsulated are separately led out through the through holes, and the remaining pins are arranged in the grooves.

[0013] As a preferred embodiment, the activation tooling includes a patch panel and a fixing plate having the deep cavity. The patch panel includes multiple pairs of connectors and a wiring terminal electrically connected to the power supply assembly. The connectors are inserted into the through holes.

[0014] As a preferred embodiment, the depth of the groove is greater than the height of the pin. A boss is formed between the two grooves, and the height of the boss is matched with the depth of the groove.

[0015] As a preferred embodiment, a recessed area is formed on the boss. The height of the recessed area is less than the depth of the groove, so that the device to be encapsulated is suspended at the corresponding area of the boss.

[0016] As a preferred embodiment, the deep cavity is square-shaped. The outer periphery of the deep cavity is matched with the outer diameter or the outer peripheral dimension of the device to be encapsulated. An outer edge area communicating with the deep cavity is formed at the corner of the deep cavity, and the radial dimension of the outer edge area is greater than the outer perimeter of the deep cavity.

[0017] As a preferred embodiment, the power supply assembly is a DC power supply.

[0018] As a preferred embodiment, the vacuum system includes a fore pump and a backing pump. The fore pump can control the vacuum degree in the chamber to reach 1×10 -1 Pa, and the backing pump can control the vacuum degree in the chamber to reach 9×10 -5 Pa on the basis of the fore pump. Specifically, the fore pump is a Roots pump combined with a screw pump, and the backing pump is a molecular pump.

[0019] The present invention also provides a method for device encapsulation using the above-mentioned vacuum parallel seam welding equipment, including the following steps:

[0020] 1) Provide a device to be encapsulated, including a package and a cover plate. At least a cavity is formed in the package, and a getter is pre-fixed in the cavity. The getter is formed on an electrically heatable substrate, and both ends of the substrate are electrically connected to two pins on the package;

[0021] 2) In the chamber, place the package on the activation unit. The pins on the package electrically connected to the substrate are separately led out and electrically connected to the power supply assembly; close the chamber, and adjust the vacuum degree in the chamber through the vacuum system;

[0022] 3) After the target vacuum degree is reached in the chamber, an electric current is applied to the activation tooling through the power supply assembly, and the getter is activated by being electrified; after the activation of the getter is completed, the vacuum degree in the chamber is maintained, and the parallel seam welding equipment is started to perform seam welding on the device to be encapsulated.

[0023] Compared with the prior art, the present application has at least the following beneficial effects:

[0024] First, the equipment of the present application can complete the getter activation and parallel seam welding processes together, improving the transfer efficiency of MEMS devices. Compared with the equipment that activates the getter by high-temperature heating of the entire MEMS device, the risk of performance degradation or failure of MEMS devices can be greatly reduced, ensuring the long-term reliability and stability of MEMS devices.

[0025] Second, by integrating the getter activation and the parallel seam welding process of MEMS devices in the same chamber, the equipment of the present application reduces the equipment switching and the interruption of multiple processes, thus significantly improving the production efficiency; the activation and encapsulation processes of MEMS devices are carried out synchronously, reducing the time consumption of device transfer and adjustment between different devices in the traditional process.

[0026] Third, the equipment of the present application can complete the getter activation in the high-vacuum environment in the chamber before the seam welding of MEMS devices. Compared with activating the getter after encapsulation, it can better prevent the getter from being oxidized and contaminated, and give full play to the maximum energy efficiency of the getter, which makes the equipment of the present application have significant advantages in the encapsulation of high-vacuum MEMS devices.

[0027] Fourth, compared with the traditional conventional vacuum parallel seam welding equipment, the equipment of the present application can complete the getter activation before the encapsulation of MEMS devices, and can verify in advance whether the getter is effectively activated, directly screen out the MEMS devices with activation failure, avoid the MEMS devices with activation failure from entering the encapsulation process, and reduce production costs and waste. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0029] Figure 1 It is a schematic structural diagram of one embodiment of the vacuum parallel seam welding equipment of the present application;

[0030] Figure 2 For Figure 1 the enlarged view at A in

[0031] Figure 3 Schematic structural diagram of one embodiment of the activation tooling provided for the vacuum parallel seam welding equipment of the present application;

[0032] Figure 4 Schematic structural diagram of one embodiment of the activation unit provided for the vacuum parallel seam welding equipment of the present application;

[0033] Figure 5 Schematic structural diagram of one embodiment of the fixed plate and the lead plate provided for the vacuum parallel seam welding equipment of the present application;

[0034] Figure 6 Schematic structural diagram of the device to be encapsulated provided in the first embodiment of the present application;

[0035] Figure 7 Cross-sectional view of the mating part between the device to be encapsulated and the fixed plate provided in the first embodiment of the present application;

[0036] Figure 8 Schematic structural diagram of another embodiment of the vacuum parallel seam welding equipment of the present application. Detailed implementation manners

[0037] The technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without making creative efforts shall fall within the protection scope of the present invention.

[0038] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the inventive product is usually placed during use. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0039] In addition, terms such as "horizontal" and "vertical" do not mean that the components are required to be absolutely horizontal or hanging vertically, but may be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but may be slightly inclined.

[0040] In the description of the present invention, it should also be noted that, unless otherwise clearly specified and defined, the terms "arrangement", "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] Embodiment 1, please refer to Figures 1 - 8 , a vacuum parallel seam welding device, including a vacuum unit 100 and a welding unit 200. The vacuum unit 100 includes a chamber 110 and a vacuum system 120. The chamber 110 includes an openable and closable sealing door 111. An observation window 112 is provided on the sealing door 111 or at the side end of the chamber 110. The observation window 112 is used to observe the internal situation of the chamber 110.

[0042] Please refer to Figure 2 , the welding unit 200 is arranged in the chamber 110. The welding unit 200 includes a workbench 210 and a parallel seam welding device 220. The parallel seam welding device 220 includes two parallel welding wheels 221 and a driving member 222. The two welding wheels 221 can be pressed onto the weld seam between the shell and the cover plate of the device to be encapsulated on the workbench 310 under the drive of the driving member 221 and move horizontally along the weld seam to realize the welding of the cover plate and the shell.

[0043] Please refer to Figures 2 - 3 , an getter activation assembly is arranged on the workbench 210. The getter activation assembly includes an activation tooling 300 and a power supply assembly (not shown in the figure). The power supply assembly is electrically connected to the activation tooling 300 by a wire. A plurality of activation units 400 are formed on the activation tooling 300. One function of the activation unit 400 is to activate the getter in the device to be encapsulated, and another function of the activation unit 400 is to properly position the device to be encapsulated, so that after the getter is activated, the final encapsulation can be carried out by using the parallel seam welding device 220.

[0044] Therefore, in order to avoid excessive interference of the arrangement of the getter activation assembly on the welding track of the parallel seam welding device 220, the device to be encapsulated placed in the activation unit 400 is directly located within the welding track of the parallel seam welding device, and there is no any shielding object outside the preparatory weld seam or welding position of the device to be encapsulated placed on the activation tooling 300, and it is directly exposed below the parallel seam welding device. Thus, the parallel seam welding device 220 in the present application can be any type of parallel seam welding device within the knowledge scope of those skilled in the art, and the structure of the parallel seam welding device is not particularly limited in the present application.

[0045] Please refer to Figures 2 - 3 , in a specific embodiment of the present application, the activation tooling 300 sequentially includes a support plate 310, a lead plate 320, and a fixing plate 330 from bottom to top. The support plate 310 is loaded on the workbench 210 and is used to provide overall support; Please refer to Figure 4 , a plurality of deep cavities 311 for fixing the tube shell are formed on the fixing plate 330. The deep cavity 311 is a part of the above-mentioned activation unit 400. The outer periphery of the deep cavity 311 is equal to the outer diameter or the outer peripheral dimension of the device to be encapsulated. The tube shell can be correspondingly clamped in the deep cavity 311 to prevent the tube shell 311 from moving during vacuum pumping or seam welding;

[0046] Please refer to Figure 4 , a pair of grooves 312 are formed at the bottom end of the deep cavity 311 on the fixing plate 330, and independent through holes 313 are respectively formed at the end parts of the grooves 312. When the tube shell is placed in the deep cavity 311, a pair of pins on the tube shell can be inserted into the through holes 313. The pins that can be inserted into the through holes 313 are electrically connected to the power supply assembly, and the remaining pins are placed in the grooves 312 to prevent the pins from interfering with each other during the activation process of the getter; The depth of the groove 312 is greater than the height of the pins on the tube shell, so that the pins in the groove can be suspended. The pins suspended in the groove help to avoid the pins directly contacting the bottom of the groove when subjected to external forces, reducing the risk of pin bending or damage;

[0047] Please refer to Figure 5 , in a specific embodiment of the present application, the lead plate 320 is provided with a wiring terminal 321 and a connector 322. The connector 322 can be inserted into the through hole 313 from below the through hole 313. Each connector 322 is electrically connected to the wiring terminal 321. When the tube shell is placed on the activation unit, the pins are electrically connected to the power supply assembly through the connector 322. In order to better cooperate with the through hole 313, the connector 322 is generally cylindrical, and the top end of the connector 322 abuts against the pin in the through hole 313. In order to better connect the connector 322 with the pin, the top end of the connector 322 can also be provided with a groove for the pin to insert, so that the contact between the pin and the connector 322 is closer, enhancing the stability of the electrical connection; In some embodiments of this embodiment, since the size of the through hole 313 easily limits the shape of the connector 322, a notch can also be made from bottom to top at the position corresponding to the through hole 313 below the fixing plate 330 to shorten the height of the through hole 313, so that the pin can pass through the through hole 313 and then be connected to the connector 322 below;

[0048] The beneficial effects of the present application will be further described below in combination with the usage method of the equipment of the present application:

[0049] 1) Please refer to Figures 6 - 7 , a device to be encapsulated is provided, including a package case 500 and a cover plate 600. At least a cavity for placing MEMS devices is formed in the package case 500. An getter 700 is pre-fixed at one side end of the cavity. The getter 700 is formed on a base material that can be electrically heated. Two ends of the base material are respectively electrically connected to two pins 510 on the package case 500;

[0050] 2) Please refer to Figure 7 , in the chamber, place the package case 500 on the fixing plate 330. The pins 510 on the package case 500 that are electrically connected to the base material are inserted into the through holes 313. After ensuring good contact between the pins 510 and the connectors 322, close the sealing door 111, and adjust the vacuum degree in the chamber 110 through the vacuum system. The vacuum degree can be specifically set according to the device encapsulation requirements;

[0051] 3) After the target vacuum degree is reached in the chamber 110, apply current to the activation tooling 300 through the power supply assembly. The pair of pins 510 connected to the activation tooling 300 are electrically connected to the power supply assembly, forming a circuit for electrically heating the getter 700. After the getter 700 is activated, start the parallel seam welding equipment to complete the encapsulation.

[0052] Different from the conventional vacuum parallel seam welding equipment where the activation of the getter and the seam welding of the device are completed by two independent devices respectively, the equipment in this embodiment integrates the functions of the two devices through an integrated design, and can complete the getter activation and seam welding processes at one time, and both operations are completed in the same chamber, which can significantly improve the transfer efficiency of the encapsulated device; and compared with the traditional device that activates the getter by heating the entire encapsulated device at a high temperature, the equipment in this application can greatly reduce the risk of performance degradation or failure of the encapsulated device, ensuring the long-term reliability and stability of the encapsulated device; in addition, since the equipment in this application can complete the activation of the getter before device encapsulation, the equipment in this application can verify in advance whether the getter is effectively activated, directly screen out the devices with failed activation, avoid them from entering the encapsulation process, reduce production costs and waste, and contribute to optimizing the encapsulation process.

[0053] Embodiment 2, please refer to Figure 8 , on the basis of Embodiment 1, the vacuum system 120 includes a fore pump 121 and a backing pump 122. The fore pump 121 is a Roots pump combined with a screw pump, which can control the vacuum degree in the chamber at 1*10 - 1 Pa; the backing pump 122 is a molecular pump, which can control the vacuum degree in the chamber at 9*10 -5Pa; Based on this, the following will further explain the usage method of the device of the present application in combination with the activation process of a specific getter (in this embodiment, the activation temperature of the getter used is 300 °C, and this activation temperature is a conventional getter activation temperature in the art):

[0054] 1) Place the pre-welded getter tube shell in the activation unit to ensure good contact with the device to be encapsulated;

[0055] 2) Gradually evacuate the gas in the vacuum chamber to make the pressure in the chamber reach 5*10 -3 Pa, to avoid the contamination of the getter by oxygen or other gases; during the evacuation process, use a vacuum gauge to monitor the vacuum degree in the chamber;

[0056] 3) After reaching the target vacuum degree, maintain this state, start to apply 1.5 A of electricity to the getter, gradually increase the current, and make the getter slowly heat up to avoid local overheating or unevenness caused by rapid heating; and use an infrared temperature sensor to monitor the temperature of the getter in real time to ensure that the temperature rise conforms to the process curve until the getter reaches the required activation temperature of 300 °C;

[0057] 4) When the getter reaches the activation temperature, maintain this temperature for 30 minutes. During this period, the surface and internal structure of the getter will change, thereby enhancing its gas adsorption capacity; during the activation process, continuously monitor the vacuum degree and temperature to ensure that there is no air leakage or temperature fluctuation, and avoid the oxidation of the getter at high temperature or contamination by other gases.

[0058] 5) To ensure that the environment in the chamber remains in a non-oxidizing state during the activation process, continuously monitor the vacuum degree of the chamber through a vacuum sensor. If the vacuum degree fluctuates, it is necessary to adjust it in time. When necessary, start the supplementary vacuum pump to maintain a stable high-vacuum environment;

[0059] 6) When the activation of the getter is completed, gradually reduce the power supply voltage, control the cooling rate of the getter, and avoid damage caused by excessive stress concentration due to rapid cooling. On the premise of maintaining vacuum in the chamber, start the flat seam welding equipment to complete the encapsulation operation.

[0060] Some traditional devices usually activate the getter after encapsulation. Due to the differences in the residual gases and the released gases in each tube shell, it is difficult to keep the activation states of the getters in each device consistent, and the maximum activation effect cannot be achieved. As can be seen from the above discussion of the device in this embodiment, before seam welding, the getters are uniformly activated in the high-vacuum environment in the chamber, and the activation is directly completed in the vacuum chamber. Compared with activating the getter after encapsulation, it can better prevent the oxidation and contamination of the getter, exert the maximum energy efficiency of the getter, thereby improving the quality and consistency of the encapsulated device. This makes the device of the present application have significant advantages in the encapsulation of MEMS devices with high-vacuum requirements.

[0061] In a specific embodiment of the present application, the power supply component is a DC power supply, and the temperature of the getter can be adjusted by the magnitude of the energizing current. Compared with the overall heating and temperature rise of traditional equipment or the use of an AC power supply, the activation process of the getter can be more precisely controlled.

[0062] Please refer to Figure 4 , in a specific embodiment of the present application, in the activation unit 400, an outer edge region 314 communicating with the deep cavity 311 may also be formed at the corner of the deep cavity 311. The radial dimension of the outer edge region 314 is slightly larger than the outer peripheral dimension of the deep cavity 311, so as to facilitate the better placement and removal of the shell 500 fitted in the deep cavity 311 through the outer edge region 314; in addition, by setting the outer edge region 314, during the vacuum pumping stage in the chamber, it is more convenient for the residual gas in the deep cavity to be discharged upward through the outer edge region, ensuring the quality of getter activation.

[0063] Please refer to Figure 4 , in a specific embodiment of the present application, in the activation unit 400, a boss 315 is formed between the two grooves 312. The boss 315 is a part of the deep cavity 311, and the top end of the boss 315 is flush with the bottom end of the deep cavity 311. When the shell 500 is placed in the deep cavity 311, the contact part between the boss 315 and the shell 500 provides more support. Further, a recessed area 316 is formed on the top surface of the boss 315. The setting of the recessed area 316 makes the bottom part of the shell 500 suspended, which helps the shell 500 to dissipate heat better when the getter is energized and activated, improving the packaging efficiency. In order to reduce the interference of the getter temperature rise on other devices in the shell 500, the setting of the recessed area 316 makes at least most of the central area of the shell 500 suspended.

[0064] Please refer to Figure 3 and Figure 5 , in a specific embodiment of the present application, screw holes 340 are provided on the fixing plate 330. A plurality of first fixing holes and second fixing holes are respectively formed on the support plate 310 and the lead plate 320. The first fixing holes and the second fixing holes respectively correspond to the screw holes 340 on the fixing plate 330 one by one, that is, from the top end to the bottom end of the activation tooling 300, the screw holes 340, the first fixing holes and the second fixing holes are connected. Screws or bolts are inserted into the screw holes 340 from the top of the fixing plate 330 to fix the support plate 310, the lead plate 320 and the fixing plate 330; in addition, third fixing holes are provided on the surface of the workbench corresponding to the inner screw holes 340. The screw holes 340, the first fixing holes, the second fixing holes and the third fixing holes are connected. Screws or bolts are inserted into the third fixing holes from the top of the fixing plate to fix the activation tooling 300 to the workbench 210.

[0065] Please participate in Figure 8 Figure 8 In a specific embodiment of the present application, the vacuum parallel seam welding equipment further includes a control system component 800 and a display system component 900. The control system component 800 is used for the automatic control of equipment parameters such as the vacuum system and the getter activation component. It can be understood that through the control system component, process parameters such as the target vacuum degree and the temperature curve can be set, and relevant parameters can be automatically adjusted according to the real-time monitoring results to ensure the smooth progress of the getter activation and the seam welding process. The display system component 900 is used for real-time display of various operating parameters of the equipment, including the vacuum degree, temperature, energized current, etc., and provides an operation interface for the operator to monitor and adjust the operating state of the equipment. Figure 8

[0066] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A vacuum parallel seam welding device, characterized in that, It includes a vacuum unit and a welding unit. The vacuum unit includes an enclosable chamber and a vacuum system for generating negative pressure in the chamber; The welding unit is arranged in the chamber. The welding unit includes a workbench and a parallel seam welding device. An getter activation assembly is also arranged in the welding unit. The getter activation assembly includes an activation tooling and a power supply assembly electrically connected to the activation tooling; The activation tooling is arranged on the workbench. An activation unit is formed on the activation tooling. The activation unit is used to place the device to be encapsulated. The device to be encapsulated placed in the activation unit is within the welding track of the parallel seam welding device, The preparatory weld or welding area of the device to be encapsulated placed in the activation unit is directly exposed to the parallel seam welding device. The activation unit includes a deep cavity formed on the top surface of the activation tooling. The depth of the deep cavity matches the height of the device to be encapsulated. The device to be encapsulated is placed in the deep cavity; A pair of grooves and a pair of through holes are formed at the bottom end of the deep cavity. The grooves and the through holes are independently arranged. A pair of pins on the device to be encapsulated are separately led out through the through holes and electrically connected to the power supply assembly. The remaining pins are placed in the grooves; The deep cavity is square-shaped. An outer edge area communicating with the deep cavity is formed at the corner of the deep cavity. The radial dimension of the outer edge area is larger than the radial dimension of the deep cavity.

2. The vacuum parallel seam welding equipment according to claim 1, wherein The activation tooling includes a patch panel and a fixing plate with the deep cavity. The patch panel includes a connector and a wiring terminal electrically connected to the power supply assembly. The connector is inserted into the through hole or arranged below the through hole.

3. The vacuum parallel seam welding equipment according to claim 2, wherein The depth of the groove is greater than the height of the pin, so that the pins in the groove are suspended. A boss is formed between the two grooves. The height of the boss matches the depth of the groove. The boss is part of the deep cavity.

4. The vacuum parallel seam welding equipment according to claim 3, characterized in that, A recessed area is formed on the top surface of the boss, so that the bottom surface of the device to be encapsulated corresponding to the recessed area is suspended.

5. The vacuum parallel seam welding equipment according to claim 1, characterized in that, The power supply assembly is a DC power supply.

6. The vacuum parallel seam welding equipment according to claim 1, characterized in that, The vacuum system includes a roughing pump and a backing pump. The roughing pump can control the vacuum degree in the chamber to reach 1*10 -1 Pa; based on the roughing pump, the backing pump can control the vacuum degree in the chamber to reach 9*10 -5 Pa.

7. A method for device packaging using the vacuum parallel seam welding equipment according to any one of claims 1-6, characterized in that, It includes: 1) Provide a device to be encapsulated, including a shell and a cover plate. At least a cavity is formed in the shell. A getter is pre-fixed in the cavity. The getter is formed on an electrically heatable substrate. Both ends of the substrate are electrically connected to two pins on the shell; 2) In the chamber, place the shell on the activation unit. The pins on the shell electrically connected to the substrate are separately led out and electrically connected to the power supply assembly; Close the chamber and adjust the vacuum degree in the chamber through the vacuum system; 3) After the target vacuum degree is reached in the chamber, apply current to the activation tooling through the power supply assembly to activate the getter by power-on; After the getter is activated, maintain the vacuum degree in the chamber and start the parallel seam welding device to perform seam welding on the device to be encapsulated.

Images