Cooling equipment for hot press molding of high-toughness brake friction plate

Abstract

The invention discloses a high-toughness brake lining hot-press forming cooling device, and relates to the technical field of hot-press equipment, the high-toughness brake lining hot-press forming cooling device comprises a rack, a processor, a power supply, a feeding module and a temperature control module, the processor is connected with the power supply through a signal line, the temperature control module is connected with the processor through signal transmission, and the processor is installed on the lower portion of the inner wall of the rack; a power source is installed on the lower portion of the inner wall of the rack, a feeding module is installed on the upper portion of the inner wall of the rack, and a temperature control module is installed in the middle of the inner wall of the rack. The temperature control module is installed, so that the function of controlling the temperature of a material for hot press molding in the mold is achieved, and the problems of material deformation, performance reduction, poor fluidity, incomplete curing and product quality reduction caused by local overheating and supercooling of the material in the hot press molding process are solved; according to the invention, the sintering and cracking phenomena can be reduced, the hot press molding efficiency is improved, the equipment maintenance cost is reduced, and the product yield is improved.

Description

Technical Field

[0001] The invention relates to the technical field of hot pressing equipment, in particular to a high-toughness brake friction plate hot pressing molding cooling equipment. Background Art

[0002] With the rapid growth of the light machinery and equipment market, the demand for friction plates has increased significantly, and at the same time, higher requirements have been placed on the performance and environmental protection of friction plates. Hot pressing is a key process in the production of friction plates. The pressed plastic is solidified and formed by heating and pressurizing to obtain a friction plate with a specified shape and performance. The hot pressing machine is electrically controlled and driven by a gas-hydraulic transmission mechanism. The heating unit is heated to a certain temperature before being pressed and formed. During hot pressing, the resin will release moisture and low-molecular substances. If it is not cooled in time, the steam pressure may damage the product. The cooling equipment helps to maintain the shape and performance of the friction plate and improve the qualified rate of the finished product. The process parameters such as the holding time, pressing temperature and post-processing time have a significant impact on the performance of the friction plate and need to be reasonably optimized to improve production efficiency and product quality. The existing brake friction pad hot pressing molding cooling equipment has certain problems in temperature control. Insufficient temperature will lead to poor surface smoothness and dimensional accuracy of the molded product. Excessive temperature will cause the internal structure of the material to rupture, resulting in a rough surface of the molded body. Insufficient equipment manufacturing precision will lead to insufficient size of the molded product, waste of materials and affect the assembly process. During the cooling process, different cooling speeds in different parts or unbalanced cooling equipment will cause the molded product to fail to meet the specification size. The pressure and temperature inside the equipment need to be strictly controlled during operation. Abnormalities in the equipment under high temperature and high pressure conditions can easily lead to equipment explosion and fire, seriously threatening the safety of operators.

[0003] 1. Patent document CN116749569B discloses a brake pad isotropic hot press. The above patent solves the problem in the prior art that the friction material is easy to adhere to the inner wall of the mold after hot pressing, making it inconvenient to remove the material. However, the above patent cannot realize the function of controlling the temperature of the material being hot-pressed in the mold.

[0004] 2. Patent document CN107000354B discloses a brake pad friction material molding device. The above patent realizes automatic and continuous filling of friction material powder into a mold cavity, thereby maximizing the production efficiency and minimizing the defective rate, and reducing production costs. However, the above patent cannot realize the function of controlling the amount of material in the mold.

[0005] 3. Patent document CN112727966B discloses a method for preparing brake friction pads by means of flat die processing. The above patent achieves products with uniform thickness, intact edges and corners, high molding accuracy, and a high pass rate, especially a high pass rate for long curved pads. It is a new method for preparing brake friction pads by means of flat die processing, which is different from the drum die and row die processing methods. However, the above patent cannot realize the function of monitoring various information inside the equipment during the preparation process of the brake friction pads.

[0006] 4. Patent document CN110081107B discloses a friction material, a brake pad made of the friction material and a preparation method. The above patent realizes that the storage, transportation cycle and antioxidant capacity of the friction material in the brake pad can be significantly improved through rust-proof treatment, but the above patent cannot achieve the function of eliminating the internal stress generated during cooling during the product preparation process.

[0007] In summary, the above patent cannot realize the function of controlling the temperature of the material being hot-pressed in the mold, cannot realize the function of controlling the weight of the material in the mold, cannot realize the function of monitoring various information inside the equipment during the preparation of the brake friction pad, and cannot realize the function of eliminating the internal stress generated during cooling during the preparation of the product, resulting in material deformation, performance degradation, poor fluidity, incomplete curing, product quality degradation, mechanical property damage, increased mold loss, reduced production efficiency, equipment damage and safety hazards; To this end, the present application proposes a high-toughness brake friction pad hot pressing molding cooling equipment that can control the temperature of the material being hot pressed in the mold, control the weight of the material in the mold, monitor various information inside the equipment during the preparation process of the brake friction pad, and eliminate the internal stress generated during cooling during the product preparation process. Summary of the invention

[0008] The purpose of the present invention is to provide a high-toughness brake friction pad hot pressing molding cooling equipment to solve the technical problems proposed in the above background technology that the function of controlling the temperature of the material being hot pressed in the mold cannot be realized, the function of controlling the weight of the material in the mold cannot be realized, the function of monitoring various information inside the equipment during the preparation process of the brake friction pad cannot be realized, and the function of eliminating the internal stress generated during cooling during the product preparation process cannot be realized, resulting in material deformation, performance degradation, poor fluidity, incomplete curing, product quality degradation, damage to mechanical properties, increased mold loss, reduced production efficiency, equipment damage and safety hazards.

[0009] To achieve the above object, the present invention provides the following technical solutions: A high-toughness brake friction pad hot pressing molding cooling device, comprising a frame, a processor, a power supply, a feeding module and a temperature control module, wherein the processor is connected to the power supply through a signal line, and the temperature control module is connected to the processor through signal transmission; A processor is installed at the lower part of the inner wall of the rack, a power supply is installed at the lower part of the inner wall of the rack, a feeding module is installed at the upper part of the inner wall of the rack, and a temperature control module is installed at the middle part of the inner wall of the rack; The temperature control module includes: a mixing component and an adjusting component, the mixing component is connected to the processor through signal transmission, and the adjusting component is connected to the processor through signal transmission; A mixing component is installed in the middle of the inner wall of the frame, and an adjusting component is installed on the lower side of the outer wall of the mixing component; The mixing component comprises: a pulley, a mixing sheet, a stopper and a mixing motor, wherein the pulley is connected to the mixing motor via a connecting shaft, and the mixing motor is connected to the processor via signal transmission; A pulley is installed in the middle of the inner wall of the frame, a mixing sheet is installed on the lower side of the outer wall of the pulley, a limiter is installed in the middle of the inner wall of the frame, and a mixing motor is installed in the middle of the inner wall of the frame; The regulating assembly comprises: a first liquid storage tank, a water valve, an evaporator and a compressor, wherein the first liquid storage tank is connected to the evaporator via the water valve, the water valve is connected to the processor via signal transmission, and the compressor is connected to the processor via signal transmission; A first liquid storage tank is installed at the lower part of the inner wall of the frame, a water valve is installed on the upper side of the outer wall of the first liquid storage tank, an evaporator is installed in the middle part of the inner wall of the frame, and a compressor is installed in the middle part of the outer wall of the evaporator.

[0010] Preferably, the processor is connected to the module via baseband transmission, the module comprises: a heating component, a cooling component and a moving component, the heating component is connected to the processor via baseband transmission, the cooling component is connected to the processor via baseband transmission, and the moving component is connected to the processor via baseband transmission; A heating component is installed in the middle of the inner wall of the rack, a cooling component is installed in the middle of the inner wall of the rack, and a moving component is installed in the middle of the inner wall of the rack; The heating component includes: a heater, an induction block, a heat transfer unit and a heat pipe. The heating component is connected to the mold through the heat transfer unit and the heat pipe, and the heater is connected to the processor through baseband transmission. A heater is installed in the middle of the inner wall of the rack, an induction block is installed in the middle of the inner wall of the rack, a heat transfer unit is installed in the middle of the inner wall of the rack, and a heat pipe is installed in the middle of the inner wall of the rack; The cooling component includes: a second liquid storage tank, a water feeder, a water spray pipe and a cooling motor, and the cooling motor is connected to the processor via baseband transmission; A second liquid storage tank is installed at the lower part of the inner wall of the frame, a water feeder is installed at the middle part of the inner wall of the frame, a water spray pipe is installed at the middle part of the inner wall of the frame, and a cooling motor is installed at the middle part of the inner wall of the frame; The moving assembly includes: a moving motor, a connecting rod, a buckle, a rotator and a telescopic rod, the moving motor is connected to the processor through baseband transmission, and the moving motor is connected to the rotator through a connecting shaft; A moving motor is installed at the lower part of the inner wall of the frame, a connecting rod is installed at the middle part of the inner wall of the frame, a buckle is installed at the middle part of the inner wall of the frame, a rotator is installed at the middle part of the inner wall of the frame, and a telescopic rod is installed at the middle part of the inner wall of the frame.

[0011] Preferably, the feeding module comprises: a mold, a material storage box, a connecting pipe, a regulating valve, an adjustment motor and a fan blade, the material storage box is connected to the mold through the connecting pipe, the regulating valve is connected to the processor through a signal line, the adjustment motor is connected to the processor through a signal line, and the adjustment motor is connected to the fan blade through a connecting shaft; A mold is installed in the middle of the inner wall of the frame, a material storage box is installed on the upper part of the inner wall of the frame, a connecting pipe is installed on the upper part of the inner wall of the frame, a regulating valve is installed on the upper part of the inner wall of the frame, an adjustment motor is installed on the upper part of the inner wall of the frame, and fan blades are installed on the inner wall of the frame.

[0012] Preferably, the processor is connected to the sensing module via wireless transmission, and the sensing module includes: a temperature sensor, a weight sensor and a stress sensor, the temperature sensor is connected to the processor via wireless transmission, the weight sensor is connected to the processor via wireless transmission, and the stress sensor is connected to the processor via wireless transmission; A temperature sensor is installed at the upper part of the inner wall of the rack, a weight sensor is installed at the middle part of the inner wall of the rack, and a stress sensor is installed at the middle part of the inner wall of the rack.

[0013] Preferably, the processor is connected to the stress module via wireless transmission, the stress module includes a cooling component and a rapping component, the cooling component is connected to the processor via wireless transmission, and the rapping component is connected to the processor via wireless transmission; A cooling assembly is installed at the lower part of the inner wall of the frame, and a rapping assembly is installed on the left side of the outer wall of the cooling assembly; The cooling assembly includes: a water tank, a circulation pump, an exchanger, a cooling motor and a fan. The water tank is connected to the exchanger through the circulation pump, the cooling motor is connected to the processor through wireless transmission, and the cooling motor is connected to the fan through a connecting shaft. A water tank is installed at the lower part of the inner wall of the frame, a circulating pump is installed at the lower part of the inner wall of the frame, an exchanger is installed on the upper side of the outer wall of the water tank, a cooling motor is installed on the upper part of the inner wall of the circulating pump, and a fan is installed on the upper part of the inner wall of the circulating pump.

[0014] Preferably, the water valve comprises: a valve body, a valve seat, a valve flap, a valve stem and a controller, and the controller is connected to the processor via signal transmission; A valve body is installed in the middle of the inner wall of the frame, a valve seat is installed in the middle of the inner wall of the frame, a valve disc is installed in the middle of the inner wall of the frame, a valve stem is installed in the middle of the inner wall of the frame, and a controller is installed in the middle of the inner wall of the frame.

[0015] Preferably, the regulating valve comprises: a fixed block, a movable block, a spring, a magnetic induction coil and a baffle; A fixed block is installed on the upper part of the inner wall of the frame, a moving block is installed on the upper part of the inner wall of the frame, a spring is installed on the upper part of the inner wall of the frame, a magnetic induction coil is installed on the upper part of the inner wall of the frame, and a baffle is installed on the upper part of the inner wall of the frame.

[0016] Preferably, the rapping assembly comprises: a control unit, a vibration exciter and an amplifying unit, the control unit is connected to the processor via wireless transmission, and the vibration exciter is connected to the control unit via the amplifying unit; A control unit is installed at the lower part of the inner wall of the frame, a vibration exciter is installed at the upper side of the outer wall of the control unit, and an amplification unit is installed at the upper side of the outer wall of the control unit.

[0017] Preferably, the method of using the high-toughness brake friction pad hot pressing molding cooling equipment is: S1: The processor controls the feeding module to feed materials into the mold, and the weight sensor monitors the weight of the material in the mold; S2: When the weight is abnormal, the processor controls the feeding module to adjust the weight of the material in the mold; S3: After the weight of the material in the mold is correct, hot pressing is performed; S4: During the hot pressing process, the processor controls the temperature control module to adjust the mold temperature; S5: After the hot pressing is completed, the processor controls the stress module to cool the product and remove stress; S6: Finish the product to obtain the finished product.

[0018] Preferably, the S4 further includes: S41: After the material enters the mold, the processor controls the mixing motor to drive the mixing sheet to move in the mold to balance the temperature of the material; S42: the processor controls the regulating component to cool the mold, thereby cooling the material in the mold; S43: After the temperature sensor transmits information and the processor compares it, the material temperature reaches the preset value, the temperature control module operation is stopped, and hot pressing is performed.

[0019] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention realizes the function of controlling the temperature of the material being hot-pressed in the mold by installing a temperature control module and a temperature sensor, solves the problems of material deformation, performance degradation, poor fluidity, incomplete curing and product quality degradation caused by local overheating and overcooling of the material during the hot-pressing process, can reduce the occurrence of sintering and cracking, improve the efficiency of hot-pressing, reduce the cost of maintaining equipment, improve the yield rate of products, and improve the economic benefits of the equipment; 2. The present invention realizes the function of controlling the weight of the material in the mold by installing a weight sensor and a feeding module, solves the problems of reduced quality of finished products, damaged mechanical properties, increased mold loss and reduced production efficiency, ensures the shape and size accuracy of the product, improves the hardness and toughness of the product, reduces the wear of the mold during the preparation process, prolongs the service life of the mold, and improves the production efficiency of the equipment; 3. The present invention realizes the function of monitoring various information inside the equipment during the preparation process of the brake friction pad by installing a sensing module, solves the problem of reduced production efficiency, equipment damage and reduced product quality caused by lack of understanding of equipment information during the production process, and can promptly feedback abnormalities occurring during the operation of the equipment to the operator, thereby extending the service life of the equipment, improving the quality of the product and improving the processing efficiency of the equipment; 4. The present invention realizes the function of eliminating the internal stress generated during cooling in the product preparation process by installing a stress module and a stress sensor, solves the problems of performance degradation and safety hazards caused by internal stress, can avoid cracks and breakages in the product, improves the wear resistance and heat resistance of the product, extends the service life of the product, and improves the safety index of user use. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a front view structural schematic diagram of the present invention; Figure 2 It is a schematic diagram of the front structure of the present invention; Figure 3 It is a schematic diagram of the stress module structure of the present invention; Figure 4 It is a schematic diagram of the water valve structure of the present invention; Figure 5 It is a schematic diagram of the structure of the regulating valve of the present invention; Figure 6 It is a schematic diagram of the structure of the heating component of the present invention; Figure 7 It is a schematic diagram of the structure of the cooling component of the present invention; Figure 8 It is a schematic diagram of the structure of the mobile component of the present invention.

[0021] In the figure: 1, rack; 2, processor; 3, power supply; 4, mold; 5, storage box; 6, first liquid storage tank; 7, water tank; 8, feeding module; 9, temperature control module; 10, mixing component; 11, adjustment component; 12, pulley; 13, mixing sheet; 14, limiter; 15, mixing motor; 16, water valve; 17, evaporator; 18, compressor; 19, connecting pipe; 20, regulating valve; 21, adjustment motor; 22, fan blade; 23, temperature sensor; 24, weight sensor; 25, stress sensor; 26, stress module; 27, cooling component; 28, vibration component; 29, circulation pump; 30, exchanger; 31 , cooling motor; 32, fan; 33, valve body; 34, valve seat; 35, valve disc; 36, valve stem; 37, controller; 38, fixed block; 39, moving block; 40, spring; 41, magnetic induction coil; 42, baffle; 43, control unit; 44, exciter; 45, amplification unit; 46, telescopic rod; 47, heating component; 48, cooling component; 49, moving component; 50, heater; 51, induction block; 52, heat transfer unit; 53, heat pipe; 54, second liquid storage tank; 55, water feeder; 56, water spray pipe; 57, cooling motor; 58, moving motor; 59, connecting rod; 60, buckle; 61, rotator. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0024] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] Example 1 See also Figure 1 , Figure 2 and Figure 4 , a high-toughness brake friction pad hot pressing molding cooling equipment, including a frame 1, a processor 2, a power supply 3, a feeding module 8 and a temperature control module 9, the processor 2 is connected to the power supply 3 through a signal line, and the temperature control module 9 is connected to the processor 2 through signal transmission; A processor 2 is installed at the lower part of the inner wall of the rack 1, a power supply 3 is installed at the lower part of the inner wall of the rack 1, a feeding module 8 is installed at the upper part of the inner wall of the rack 1, and a temperature control module 9 is installed at the middle part of the inner wall of the rack 1; The temperature control module 9 includes: a mixing component 10 and an adjusting component 11, wherein the mixing component 10 is connected to the processor 2 via signal transmission, and the adjusting component 11 is connected to the processor 2 via signal transmission; A mixing component 10 is installed in the middle of the inner wall of the frame 1, and an adjusting component 11 is installed on the lower side of the outer wall of the mixing component 10; The mixing component 10 includes: a pulley 12, a mixing sheet 13, a stopper 14 and a mixing motor 15, wherein the pulley 12 is connected to the mixing motor 15 via a connecting shaft, and the mixing motor 15 is connected to the processor 2 via signal transmission; A pulley 12 is installed in the middle of the inner wall of the frame 1, a mixing plate 13 is installed on the lower side of the outer wall of the pulley 12, a limiter 14 is installed in the middle of the inner wall of the frame 1, and a mixing motor 15 is installed in the middle of the inner wall of the frame 1; The regulating assembly 11 includes: a first liquid storage tank 6, a water valve 16, an evaporator 17 and a compressor 18, wherein the first liquid storage tank 6 is connected to the evaporator 17 via the water valve 16, the water valve 16 is connected to the processor 2 via signal transmission, and the compressor 18 is connected to the processor 2 via signal transmission; A first liquid storage tank 6 is installed at the lower part of the inner wall of the frame 1, a water valve 16 is installed on the upper side of the outer wall of the first liquid storage tank 6, an evaporator 17 is installed at the middle part of the inner wall of the frame 1, and a compressor 18 is installed at the middle part of the outer wall of the evaporator 17; The water valve 16 includes: a valve body 33, a valve seat 34, a valve flap 35, a valve stem 36 and a controller 37, and the controller 37 is connected to the processor 2 through signal transmission; A valve body 33 is installed in the middle of the inner wall of the frame 1, a valve seat 34 is installed in the middle of the inner wall of the frame 1, a valve disc 35 is installed in the middle of the inner wall of the frame 1, a valve stem 36 is installed in the middle of the inner wall of the frame 1, and a controller 37 is installed in the middle of the inner wall of the frame 1; The processor 2 is connected to the sensing module via wireless transmission. The sensing module includes: a temperature sensor 23, a weight sensor 24 and a stress sensor 25. The temperature sensor 23 is connected to the processor 2 via wireless transmission, the weight sensor 24 is connected to the processor 2 via wireless transmission, and the stress sensor 25 is connected to the processor 2 via wireless transmission. A temperature sensor 23 is installed on the upper part of the inner wall of the rack 1, a weight sensor 24 is installed in the middle part of the inner wall of the rack 1, and a stress sensor 25 is installed in the middle part of the inner wall of the rack 1; Further, the feeding module 8 controls the material to enter the mold 4, the processor 2 controls the mixing motor 15 to drive the pulley 12 to move, the mixing sheet 13 stirs back and forth in the mold 4 to balance the temperature of the material, and the processor 2 monitors the temperature of the mold 4 and the material in the mold 4 according to the information transmitted in real time by the temperature sensor 23. When the temperature does not reach the hot pressing molding temperature, the processor 2 controls the water valve 16 to open, connects the first liquid storage tank 6 and the evaporator 17, controls the compressor 18 and the evaporator 17 to cool the mold 4, and the mixing sheet 13 stirs the material in the mold 4 to exchange heat with the mold 4, while ensuring that the temperature of the material is uniform. After the processor 2 receives the information transmitted by the temperature sensor 23, it compares After determining that the current material temperature has reached the hot pressing temperature, the processor 2 controls the compressor 18, the evaporator 17 and the water valve 16 to stop cooling, and controls the pulley 12 through the mixing motor 15 to drive the mixing sheet 13 to leave the mold 4, and perform subsequent processing on the material, thereby realizing the function of controlling the temperature of the material being hot pressed in the mold 4, and solving the problems of material deformation, performance degradation, poor fluidity, incomplete curing and product quality degradation caused by local overheating and overcooling of the material during the hot pressing process, which can reduce the occurrence of sintering and cracking, improve the efficiency of hot pressing, reduce the cost of maintaining equipment, improve the yield rate of products, and improve the economic benefits of equipment.

[0026] Example 2 See also Figure 1 , Figure 2 and Figure 5, a high-toughness brake friction pad hot pressing molding cooling equipment, the feeding module 8 includes: a mold 4, a storage box 5, a connecting pipe 19, a regulating valve 20, an adjustment motor 21 and a fan blade 22, the storage box 5 is connected to the mold 4 through the connecting pipe 19, the regulating valve 20 is connected to the processor 2 through a signal line, the adjustment motor 21 is connected to the processor 2 through a signal line, and the adjustment motor 21 is connected to the fan blade 22 through a connecting shaft; A mold 4 is installed in the middle of the inner wall of the frame 1, a material storage box 5 is installed on the upper part of the inner wall of the frame 1, a connecting pipe 19 is installed on the upper part of the inner wall of the frame 1, a regulating valve 20 is installed on the upper part of the inner wall of the frame 1, an adjustment motor 21 is installed on the upper part of the inner wall of the frame 1, and a fan blade 22 is installed on the inner wall of the frame 1; The regulating valve 20 includes: a fixed block 38, a movable block 39, a spring 40, a magnetic induction coil 41 and a baffle 42; A fixed block 38 is installed on the upper part of the inner wall of the frame 1, a moving block 39 is installed on the upper part of the inner wall of the frame 1, a spring 40 is installed on the upper part of the inner wall of the frame 1, a magnetic induction coil 41 is installed on the upper part of the inner wall of the frame 1, and a baffle 42 is installed on the upper part of the inner wall of the frame 1; The processor 2 is connected to the sensing module via wireless transmission. The sensing module includes: a temperature sensor 23, a weight sensor 24 and a stress sensor 25. The temperature sensor 23 is connected to the processor 2 via wireless transmission, the weight sensor 24 is connected to the processor 2 via wireless transmission, and the stress sensor 25 is connected to the processor 2 via wireless transmission. A temperature sensor 23 is installed on the upper part of the inner wall of the rack 1, a weight sensor 24 is installed in the middle part of the inner wall of the rack 1, and a stress sensor 25 is installed in the middle part of the inner wall of the rack 1; Furthermore, the weight sensor 24 monitors the weight of the material added to the mold 4 and transmits the information to the processor 2. After the processor 2 compares the received data information with the preset information, it performs subsequent processing on the material if the weight is correct. When the weight is low, the processor 2 controls the regulating valve 20 to open and calculates the weight of the material added to the mold 4 according to G=S*h*ρ, where G is the weight of the material, S is the cross-sectional area of ​​the connecting pipe 19, h=v*t, h is the height of the material, v is the flow speed of the material in the connecting pipe 19, t is the time for the material to flow through the regulating valve 20, and ρ is the density of the material. The processor 2 calculates the weight of the material to be added and controls the feeding module 8 to add the material of this weight to the mold 4. When the weight is too high, the processor 2 controls the adjustment motor 21 to drive the fan blades 22 to suck the material in the mold 4 back to the storage box 5 through the connecting pipe 19, thereby realizing the function of controlling the weight of the material in the mold 4, solving the problems of reduced quality of finished products, damaged mechanical properties, increased loss of the mold 4 and reduced production efficiency, ensuring the shape and size accuracy of the product, improving the hardness and toughness of the product, reducing the wear on the mold 4 during the preparation process, extending the service life of the mold, and improving the production efficiency of the equipment.

[0027] Example 3 See also Figure 1 and Figure 2 , a high-toughness brake friction pad hot pressing molding cooling equipment, the processor 2 is connected to the perception module through wireless transmission, the perception module includes: a temperature sensor 23, a weight sensor 24 and a stress sensor 25, the temperature sensor 23 is connected to the processor 2 through wireless transmission, the weight sensor 24 is connected to the processor 2 through wireless transmission, and the stress sensor 25 is connected to the processor 2 through wireless transmission; A temperature sensor 23 is installed on the upper part of the inner wall of the rack 1, a weight sensor 24 is installed in the middle part of the inner wall of the rack 1, and a stress sensor 25 is installed in the middle part of the inner wall of the rack 1; Furthermore, the temperature sensor 23 is internally provided with an optical system, a photodetector, a signal amplifier and a signal processor, and uses infrared radiation from an object to measure temperature. When the temperature of an object is higher than absolute zero, the object radiates infrared radiation outward, and the optical system collects the infrared radiation and guides it to the photodetector. After the photodetector converts the infrared radiation into an electrical signal, the signal amplifier and the signal processor amplify, filter, perform analog-to-digital conversion and process the electrical signal, and then transmit the temperature information of the measured object to the processor 2. The weight sensor 24 is internally provided with a sensitive element, a conversion element and a measuring element, and converts the load borne by the force carrier into a corresponding electrical signal. The signal transmitted by the sensitive element due to the external force is converted into a signal that is easy to measure through the conversion element, and then converted into a point signal by the measuring unit and further transmitted and processed. After the weight change is measured, the data information is transmitted to the processor 2. The stress sensor 25 is internally provided with a piezoelectric chip and an electronic circuit. Based on the acoustic elasticity theory, the stress state of the object is indirectly calculated by measuring the propagation time of ultrasound in the object. The piezoelectric chip undergoes mechanical vibration under the stimulation of the electrical signal to emit ultrasound. The emitted ultrasound propagates inside the object. When the ultrasound encounters different media and stress changes, it will be reflected and refracted. The electronic circuit analyzes the reflected ultrasound signal received, measures the time difference from the emission to the reception of the ultrasound, and indirectly measures the stress state inside the object in combination with the known speed of sound. After amplification and processing by the electronic circuit, the information is transmitted to the processor 2, realizing the function of monitoring various information inside the equipment during the preparation of the brake friction pad, solving the problem of reduced production efficiency, equipment damage and reduced product quality caused by lack of understanding of equipment information during the production process, and being able to promptly feedback abnormalities in the equipment operation to the operator, thereby extending the service life of the equipment, improving the quality of the product, and improving the processing efficiency of the equipment. Example 4 See also Figure 1 , Figure 2 and Figure 3 , a high-toughness brake friction pad hot pressing molding cooling equipment, the processor 2 is connected to the perception module through wireless transmission, the perception module includes: a temperature sensor 23, a weight sensor 24 and a stress sensor 25, the temperature sensor 23 is connected to the processor 2 through wireless transmission, the weight sensor 24 is connected to the processor 2 through wireless transmission, and the stress sensor 25 is connected to the processor 2 through wireless transmission; A temperature sensor 23 is installed on the upper part of the inner wall of the rack 1, a weight sensor 24 is installed in the middle part of the inner wall of the rack 1, and a stress sensor 25 is installed in the middle part of the inner wall of the rack 1; The processor 2 is connected to the stress module 26 via wireless transmission, the stress module 26 includes a cooling component 27 and a rapping component 28, the cooling component 27 is connected to the processor 2 via wireless transmission, and the rapping component 28 is connected to the processor 2 via wireless transmission; A cooling assembly 27 is installed at the lower part of the inner wall of the frame 1, and a rapping assembly 28 is installed on the left side of the outer wall of the cooling assembly 27; The cooling assembly 27 includes: a water tank 7, a circulation pump 29, an exchanger 30, a cooling motor 31 and a fan 32. The water tank 7 is connected to the exchanger 30 through the circulation pump 29, the cooling motor 31 is connected to the processor 2 through wireless transmission, and the cooling motor 31 is connected to the fan 32 through a connecting shaft. A water tank 7 is installed at the lower part of the inner wall of the frame 1, a circulating pump 29 is installed at the lower part of the inner wall of the frame 1, an exchanger 30 is installed on the upper side of the outer wall of the water tank 7, a cooling motor 31 is installed at the upper part of the inner wall of the circulating pump 29, and a fan 32 is installed at the upper part of the inner wall of the circulating pump 29; The rapping assembly 28 includes: a control unit 43, a vibration exciter 44 and an amplifying unit 45, the control unit 43 is connected to the processor 2 via wireless transmission, and the vibration exciter 44 is connected to the control unit 43 via the amplifying unit 45; A control unit 43 is installed at the lower part of the inner wall of the frame 1, a vibration exciter 44 is installed at the upper side of the outer wall of the control unit 43, and an amplification unit 45 is installed at the upper side of the outer wall of the control unit 43; Furthermore, after completing the hot pressing molding, the processor 2 controls the cooling motor 31 to drive the fan 32 to rotate, controls the circulating pump 29 to connect the water tank 7 and the exchanger 30, and cools the molded product. The stress sensor 25 detects the internal stress distribution of the product during the cooling process, and transmits the data to the processor 2. The processor 2 controls the exciter 44 and the amplifier unit 45 through the control unit 43 to vibrate the product to eliminate the stress inside the product, thereby realizing the function of eliminating the internal stress generated during cooling during the product preparation process, solving the problems of performance degradation and safety hazards caused by internal stress, avoiding cracks and breakages in the product, improving the wear resistance and heat resistance of the product, extending the service life of the product, and improving the safety index of user use.

[0028] Example 5 See also Figure 1 , Figure 2 and Figure 5 , a high-toughness brake friction pad hot pressing molding cooling equipment, including a frame 1, a processor 2, a power supply 3, a feeding module 8 and a temperature control module 9, the processor 2 is connected to the power supply 3 through a signal line, and the temperature control module 9 is connected to the processor 2 through signal transmission; A processor 2 is installed at the lower part of the inner wall of the rack 1, a power supply 3 is installed at the lower part of the inner wall of the rack 1, a feeding module 8 is installed at the upper part of the inner wall of the rack 1, and a temperature control module 9 is installed at the middle part of the inner wall of the rack 1; The temperature control module 9 includes: a mixing component 10 and an adjusting component 11, wherein the mixing component 10 is connected to the processor 2 via signal transmission, and the adjusting component 11 is connected to the processor 2 via signal transmission; A mixing component 10 is installed in the middle of the inner wall of the frame 1, and an adjusting component 11 is installed on the lower side of the outer wall of the mixing component 10; The mixing component 10 includes: a pulley 12, a mixing sheet 13, a stopper 14 and a mixing motor 15, wherein the pulley 12 is connected to the mixing motor 15 via a connecting shaft, and the mixing motor 15 is connected to the processor 2 via signal transmission; A pulley 12 is installed in the middle of the inner wall of the frame 1, a mixing plate 13 is installed on the lower side of the outer wall of the pulley 12, a limiter 14 is installed in the middle of the inner wall of the frame 1, and a mixing motor 15 is installed in the middle of the inner wall of the frame 1; The regulating assembly 11 includes: a first liquid storage tank 6, a water valve 16, an evaporator 17 and a compressor 18, wherein the first liquid storage tank 6 is connected to the evaporator 17 via the water valve 16, the water valve 16 is connected to the processor 2 via signal transmission, and the compressor 18 is connected to the processor 2 via signal transmission; A first liquid storage tank 6 is installed at the lower part of the inner wall of the frame 1, a water valve 16 is installed on the upper side of the outer wall of the first liquid storage tank 6, an evaporator 17 is installed at the middle part of the inner wall of the frame 1, and a compressor 18 is installed at the middle part of the outer wall of the evaporator 17; The water valve 16 includes: a valve body 33, a valve seat 34, a valve flap 35, a valve stem 36 and a controller 37, and the controller 37 is connected to the processor 2 through signal transmission; A valve body 33 is installed in the middle of the inner wall of the frame 1, a valve seat 34 is installed in the middle of the inner wall of the frame 1, a valve disc 35 is installed in the middle of the inner wall of the frame 1, a valve stem 36 is installed in the middle of the inner wall of the frame 1, and a controller 37 is installed in the middle of the inner wall of the frame 1; The feeding module 8 includes: a mold 4, a material storage box 5, a connecting pipe 19, a regulating valve 20, an adjustment motor 21 and a fan blade 22, the material storage box 5 is connected to the mold 4 through the connecting pipe 19, the regulating valve 20 is connected to the processor 2 through a signal line, the adjustment motor 21 is connected to the processor 2 through a signal line, and the adjustment motor 21 is connected to the fan blade 22 through a connecting shaft; A mold 4 is installed in the middle of the inner wall of the frame 1, a material storage box 5 is installed on the upper part of the inner wall of the frame 1, a connecting pipe 19 is installed on the upper part of the inner wall of the frame 1, a regulating valve 20 is installed on the upper part of the inner wall of the frame 1, an adjustment motor 21 is installed on the upper part of the inner wall of the frame 1, and a fan blade 22 is installed on the inner wall of the frame 1; The regulating valve 20 includes: a fixed block 38, a movable block 39, a spring 40, a magnetic induction coil 41 and a baffle 42; A fixed block 38 is installed on the upper part of the inner wall of the frame 1, a moving block 39 is installed on the upper part of the inner wall of the frame 1, a spring 40 is installed on the upper part of the inner wall of the frame 1, a magnetic induction coil 41 is installed on the upper part of the inner wall of the frame 1, and a baffle 42 is installed on the upper part of the inner wall of the frame 1; The processor 2 is connected to the sensing module via wireless transmission. The sensing module includes: a temperature sensor 23, a weight sensor 24 and a stress sensor 25. The temperature sensor 23 is connected to the processor 2 via wireless transmission, the weight sensor 24 is connected to the processor 2 via wireless transmission, and the stress sensor 25 is connected to the processor 2 via wireless transmission. A temperature sensor 23 is installed on the upper part of the inner wall of the rack 1, a weight sensor 24 is installed in the middle part of the inner wall of the rack 1, and a stress sensor 25 is installed in the middle part of the inner wall of the rack 1; Furthermore, the weight sensor 24 detects that the weight of the material inside the mold 4 is too low, and the processor 2 controls the feeding module 8 to feed material into the mold 4. The processor 2 controls the mixing motor 15 to drive the mixing plate 13 to re-stir the material in the mold 4 to make the temperature of the material uniform. The temperature of the material and the mold 4 is detected by the temperature sensor 23. When the temperature does not meet the standard, the processor 2 controls the temperature control module 9 to cool down the material, thereby realizing the function of balancing the internal temperature of the material after adding material to the mold 4, and solving the problem of poor finished product quality, reduced processing efficiency and equipment damage caused by local temperature abnormality of the material in the mold 4 after adding material.

[0029] Example 6 See also Figure 1 , Figure 2 , Figure 6 , Figure 7 and Figure 8 , a high-toughness brake friction pad hot pressing molding cooling device, comprising a frame 1, a processor 2 and a power supply 3, wherein the processor 2 is connected to the power supply 3 through signal transmission; A processor 2 is installed at the lower part of the inner wall of the rack 1, and a power supply 3 is installed at the lower part of the inner wall of the rack 1; The processor 2 is connected to the local processing module via baseband transmission, and the local processing module includes: a heating component 47, a cooling component 48 and a moving component 49, the heating component 47 is connected to the processor 2 via baseband transmission, the cooling component 48 is connected to the processor 2 via baseband transmission, and the moving component 49 is connected to the processor 2 via baseband transmission; A heating component 47 is installed in the middle of the inner wall of the rack 1, a cooling component 48 is installed in the middle of the inner wall of the rack 1, and a moving component 49 is installed in the middle of the inner wall of the rack 1; The heating assembly 47 includes: a heater 50, an induction block 51, a heat transfer unit 52 and a heat pipe 53. The heating assembly 47 is connected to the mold 4 through the heat transfer unit 52 and the heat pipe 53, and the heater 50 is connected to the processor 2 through baseband transmission; A heater 50 is installed in the middle of the inner wall of the rack 1, an induction block 51 is installed in the middle of the inner wall of the rack 1, a heat transfer unit 52 is installed in the middle of the inner wall of the rack 1, and a heat pipe 53 is installed in the middle of the inner wall of the rack 1; The cooling component 48 includes: a second liquid storage tank 54, a water feeder 55, a water spray pipe 56 and a cooling motor 57, and the cooling motor 57 is connected to the processor 2 via baseband transmission; A second liquid storage tank 54 is installed at the lower part of the inner wall of the frame 1, a water supply device 55 is installed at the middle part of the inner wall of the frame 1, a water spray pipe 56 is installed at the middle part of the inner wall of the frame 1, and a cooling motor 57 is installed at the middle part of the inner wall of the frame 1; The moving assembly 49 includes: a moving motor 58, a connecting rod 59, a buckle 60 and a rotator 61. The moving motor 58 is connected to the processor 2 via baseband transmission, and the moving motor 58 is connected to the rotator 61 via a connecting shaft. A moving motor 58 is installed at the lower part of the inner wall of the frame 1, a connecting rod 59 is installed at the middle part of the inner wall of the frame 1, a buckle 60 is installed at the middle part of the inner wall of the frame 1, a rotator 61 is installed at the middle part of the inner wall of the frame 1, and a telescopic rod 46 is installed at the middle part of the inner wall of the frame 1; The processor 2 is connected to the sensing module via wireless transmission. The sensing module includes: a temperature sensor 23, a weight sensor 24 and a stress sensor 25. The temperature sensor 23 is connected to the processor 2 via wireless transmission, the weight sensor 24 is connected to the processor 2 via wireless transmission, and the stress sensor 25 is connected to the processor 2 via wireless transmission. A temperature sensor 23 is installed on the upper part of the inner wall of the rack 1, a weight sensor 24 is installed in the middle part of the inner wall of the rack 1, and a stress sensor 25 is installed in the middle part of the inner wall of the rack 1; Further, the temperature sensor 23 detects that the temperature of the mold 4 is locally low, and the processor 2 controls the moving motor 58 to drive the rotator 61 to move, and connects with the induction block 51 through the connecting rod 59 and the buckle 60. The rotator 61 and the telescopic rod 46 drive the connecting rod 59 to move to the position where the temperature is low, and the induction block 51 is controlled to approach the mold 4. After the heat transfer unit 52 receives the information that the induction block 51 is approaching, the heater 50 starts to heat and transfers heat to the heat transfer unit 52 through the heat pipe 53, so as to heat the local part of the mold 4. When the local temperature is high, the processor 2 controls the connecting rod 59 and The buckle 60 connects the water spray pipe 56, and the moving motor 58 controls the rotator 61 and the telescopic rod 46 to move the water spray pipe 56 to a location where the temperature is relatively high. The cooling motor 57 drives the water feeder 55 to transport the coolant inside the second liquid storage tank 54 to the water spray pipe 56 for local cooling, thereby realizing the function of regulating the local temperature of the mold 4, solving the problem of reduced quality of the molded product, reduced production efficiency and shortened life of the mold 4 caused by local temperature imbalance of the mold 4 and the material, avoiding defects and deformation on the surface of the molded product, reducing production costs, speeding up the production efficiency of the equipment, and avoiding deformation and cracking of the mold 4.

[0030] Example 7 See also Figure 1 , Figure 2 , Figure 3 , Figure 6 , Figure 7 and Figure 8 , a high-toughness brake friction pad hot pressing molding cooling device, comprising a frame 1, a processor 2 and a power supply 3, wherein the processor 2 is connected to the power supply 3 through signal transmission; A processor 2 is installed at the lower part of the inner wall of the rack 1, and a power supply 3 is installed at the lower part of the inner wall of the rack 1; The processor 2 is connected to the local processing module via baseband transmission, and the local processing module includes: a heating component 47, a cooling component 48 and a moving component 49, the heating component 47 is connected to the processor 2 via baseband transmission, the cooling component 48 is connected to the processor 2 via baseband transmission, and the moving component 49 is connected to the processor 2 via baseband transmission; A heating component 47 is installed in the middle of the inner wall of the rack 1, a cooling component 48 is installed in the middle of the inner wall of the rack 1, and a moving component 49 is installed in the middle of the inner wall of the rack 1; The heating assembly 47 includes: a heater 50, an induction block 51, a heat transfer unit 52 and a heat pipe 53. The heating assembly 47 is connected to the mold 4 through the heat transfer unit 52 and the heat pipe 53, and the heater 50 is connected to the processor 2 through baseband transmission; A heater 50 is installed in the middle of the inner wall of the rack 1, an induction block 51 is installed in the middle of the inner wall of the rack 1, a heat transfer unit 52 is installed in the middle of the inner wall of the rack 1, and a heat pipe 53 is installed in the middle of the inner wall of the rack 1; The cooling component 48 includes: a second liquid storage tank 54, a water feeder 55, a water spray pipe 56 and a cooling motor 57, and the cooling motor 57 is connected to the processor 2 via baseband transmission; A second liquid storage tank 54 is installed at the lower part of the inner wall of the frame 1, a water supply device 55 is installed at the middle part of the inner wall of the frame 1, a water spray pipe 56 is installed at the middle part of the inner wall of the frame 1, and a cooling motor 57 is installed at the middle part of the inner wall of the frame 1; The moving assembly 49 includes: a moving motor 58, a connecting rod 59, a buckle 60 and a rotator 61. The moving motor 58 is connected to the processor 2 via baseband transmission, and the moving motor 58 is connected to the rotator 61 via a connecting shaft. A moving motor 58 is installed at the lower part of the inner wall of the frame 1, a connecting rod 59 is installed at the middle part of the inner wall of the frame 1, a buckle 60 is installed at the middle part of the inner wall of the frame 1, a rotator 61 is installed at the middle part of the inner wall of the frame 1, and a telescopic rod 46 is installed at the middle part of the inner wall of the frame 1; The processor 2 is connected to the stress module 26 via wireless transmission, the stress module 26 includes a cooling component 27 and a rapping component 28, the cooling component 27 is connected to the processor 2 via wireless transmission, and the rapping component 28 is connected to the processor 2 via wireless transmission; A cooling assembly 27 is installed at the lower part of the inner wall of the frame 1, and a rapping assembly 28 is installed on the left side of the outer wall of the cooling assembly 27; The cooling assembly 27 includes: a water tank 7, a circulation pump 29, an exchanger 30, a cooling motor 31 and a fan 32. The water tank 7 is connected to the exchanger 30 through the circulation pump 29, the cooling motor 31 is connected to the processor 2 through wireless transmission, and the cooling motor 31 is connected to the fan 32 through a connecting shaft. A water tank 7 is installed at the lower part of the inner wall of the frame 1, a circulating pump 29 is installed at the lower part of the inner wall of the frame 1, an exchanger 30 is installed on the upper side of the outer wall of the water tank 7, a cooling motor 31 is installed at the upper part of the inner wall of the circulating pump 29, and a fan 32 is installed at the upper part of the inner wall of the circulating pump 29; The rapping assembly 28 includes: a control unit 43, a vibration exciter 44 and an amplifying unit 45, the control unit 43 is connected to the processor 2 via wireless transmission, and the vibration exciter 44 is connected to the control unit 43 via the amplifying unit 45; A control unit 43 is installed at the lower part of the inner wall of the frame 1, a vibration exciter 44 is installed at the upper side of the outer wall of the control unit 43, and an amplification unit 45 is installed at the upper side of the outer wall of the control unit 43; Further, after completing the hot pressing molding, the processor 2 controls the moving motor 58 to drive the connecting rod 59 and the buckle 60 to connect with the induction block 51 through the rotator 61, and move close to the heat transfer unit 52. The processor 2 controls the heater 50 to heat, and transfers the heat to the heat transfer unit 52 through the heat pipe 53, so as to perform secondary heating on the product, and eliminate the internal stress of the product by heating. After completing the secondary heating, the processor 2 controls the stress module 26 to cool the product. During the cooling process, the processor 2 controls the vibration assembly 28 to vibrate the product, thereby realizing the function of eliminating the internal stress of the product, solving the problem of reduced service life and reduced reliability caused by internal stress in the product production process, and can ensure the user experience and safety of use, improve the economic benefits of the product, and improve the quality of the product.

[0031] Working principle: the weight sensor 24 monitors the weight of the material added to the mold 4 and transmits the information to the processor 2. After the processor 2 compares the received data information with the preset information, it performs subsequent processing on the material if the weight is correct. When the weight is low, the processor 2 controls the regulating valve 20 to open, and calculates the weight of the material added to the mold 4 according to G=S*h*ρ, where G is the weight of the material, S is the cross-sectional area of ​​the connecting pipe 19, h=v*t, h is the height of the material, v is the flow speed of the material in the connecting pipe 19, t is the time for the material to flow through the regulating valve 20, and ρ is the density of the material. After the data information transmitted by the weight sensor 24, the processor 2 calculates the weight of the material to be added, and controls the feeding module 8 to add the material of this weight to the mold 4. When the weight is high, the processor 2 controls the adjustment motor 21 to drive the fan blades 22 to suck the material in the mold 4 back to the storage box 5 through the connecting pipe 19; The feeding module 8 controls the material to enter the mold 4, the processor 2 controls the mixing motor 15 to drive the pulley 12 to move, and the mixing sheet 13 stirs back and forth in the mold 4 to balance the temperature of the material. The processor 2 monitors the temperature of the mold 4 and the material in the mold 4 according to the information transmitted in real time by the temperature sensor 23. When the temperature does not reach the hot pressing molding temperature, the processor 2 controls the water valve 16 to open, connects the first liquid storage tank 6 and the evaporator 17, controls the compressor 18 and the evaporator 17 to cool the mold 4, and the mixing sheet 13 stirs the material in the mold 4 to exchange heat with the mold 4, while ensuring that the temperature of the material is uniform. After the processor 2 receives the information transmitted by the temperature sensor 23, after comparing and judging that the current material temperature reaches the hot pressing molding temperature, the processor 2 controls the compressor 18, the evaporator 17 and the water valve 16 to stop cooling, and controls the pulley 12 through the mixing motor 15 to drive the mixing sheet 13 to leave the mold 4, and perform subsequent processing on the material; The temperature sensor 23 collects infrared rays through an optical system and guides them to a photodetector. After the photodetector converts the infrared radiation into an electrical signal, the signal amplifier and the signal processor amplify, filter, convert the analog-to-digital signal and process the electrical signal, and then transmit the temperature information of the object to be measured to the processor 2. The weight sensor 24 converts the signal transmitted by the sensitive element due to the external force into a signal that is easy to measure through a conversion element, and further transmits and processes it after converting it into a point signal through a measuring unit. After measuring the weight change, the data information is transmitted to the processor 2. The stress sensor 25 emits ultrasonic waves through the piezoelectric chip under the stimulation of the electrical signal, and the electronic circuit analyzes the ultrasonic wave signal reflected back and measures the time difference from the emission to the reception of the ultrasonic wave. After amplification and processing by the electronic circuit, the information is transmitted to the processor 2. After completing the hot pressing molding, the processor 2 controls the cooling motor 31 to drive the fan 32 to rotate, controls the circulating pump 29 to connect the water tank 7 and the exchanger 30, and cools the molded product. The stress sensor 25 detects the internal stress distribution of the product during the cooling process and transmits the data to the processor 2. The processor 2 controls the exciter 44 and the amplification unit 45 through the control unit 43 to vibrate the product to eliminate the stress inside the product.

[0032] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A high-toughness brake friction pad hot pressing molding cooling equipment, characterized in that: It comprises a rack (1), a processor (2), a power supply (3), a feeding module (8) and a temperature control module (9), wherein the processor (2) is connected to the power supply (3) via a signal line, and the temperature control module (9) is connected to the processor (2) via signal transmission; A processor (2) is installed at the lower part of the inner wall of the rack (1), a power supply (3) is installed at the lower part of the inner wall of the rack (1), a feeding module (8) is installed at the upper part of the inner wall of the rack (1), and a temperature control module (9) is installed at the middle part of the inner wall of the rack (1); The temperature control module (9) comprises: a mixing component (10) and a regulating component (11); the mixing component (10) is connected to the processor (2) via signal transmission; and the regulating component (11) is connected to the processor (2) via signal transmission; A mixing component (10) is installed at the middle of the inner wall of the frame (1), and an adjustment component (11) is installed at the lower side of the outer wall of the mixing component (10); The mixing component (10) comprises: a pulley (12), a mixing sheet (13), a stopper (14) and a mixing motor (15); the pulley (12) is connected to the mixing motor (15) via a connecting shaft; and the mixing motor (15) is connected to the processor (2) via signal transmission; A pulley (12) is installed in the middle of the inner wall of the frame (1), a mixing plate (13) is installed on the lower side of the outer wall of the pulley (12), a limiter (14) is installed in the middle of the inner wall of the frame (1), and a mixing motor (15) is installed in the middle of the inner wall of the frame (1); The regulating component (11) comprises: a first liquid storage tank (6), a water valve (16), an evaporator (17) and a compressor (18); the first liquid storage tank (6) is connected to the evaporator (17) via the water valve (16); the water valve (16) is connected to the processor (2) via signal transmission; and the compressor (18) is connected to the processor (2) via signal transmission; A first liquid storage tank (6) is installed at the lower part of the inner wall of the frame (1), a water valve (16) is installed at the upper side of the outer wall of the first liquid storage tank (6), an evaporator (17) is installed at the middle part of the inner wall of the frame (1), and a compressor (18) is installed at the middle part of the outer wall of the evaporator (17).

2. The high-toughness brake friction pad hot pressing molding cooling equipment according to claim 1 is characterized by: The processor (2) is connected to the local processing module via baseband transmission, and the local processing module includes: a heating component (47), a cooling component (48) and a moving component (49), the heating component (47) is connected to the processor (2) via baseband transmission, the cooling component (48) is connected to the processor (2) via baseband transmission, and the moving component (49) is connected to the processor (2) via baseband transmission; A heating component (47) is installed in the middle of the inner wall of the frame (1), a cooling component (48) is installed in the middle of the inner wall of the frame (1), and a moving component (49) is installed in the middle of the inner wall of the frame (1); The heating component (47) comprises: a heater (50), an induction block (51), a heat transfer unit (52) and a heat pipe (53); the heating component (47) is connected to the mold (4) via the heat transfer unit (52) and the heat pipe (53); and the heater (50) is connected to the processor (2) via baseband transmission; A heater (50) is installed in the middle of the inner wall of the frame (1), a sensor block (51) is installed in the middle of the inner wall of the frame (1), a heat transfer unit (52) is installed in the middle of the inner wall of the frame (1), and a heat pipe (53) is installed in the middle of the inner wall of the frame (1); The cooling component (48) comprises: a second liquid storage tank (54), a water feeder (55), a water spray pipe (56) and a cooling motor (57), wherein the cooling motor (57) is connected to the processor (2) via baseband transmission; A second liquid storage tank (54) is installed at the lower part of the inner wall of the frame (1), a water supply device (55) is installed at the middle part of the inner wall of the frame (1), a water spray pipe (56) is installed at the middle part of the inner wall of the frame (1), and a cooling motor (57) is installed at the middle part of the inner wall of the frame (1); The moving assembly (49) includes: a moving motor (58), a connecting rod (59), a buckle (60), a rotator (61) and a telescopic rod (46); the moving motor (58) is connected to the processor (2) via baseband transmission, and the moving motor (58) is connected to the rotator (61) via a connecting shaft; A moving motor (58) is installed at the lower part of the inner wall of the frame (1), a connecting rod (59) is installed at the middle part of the inner wall of the frame (1), a buckle (60) is installed at the middle part of the inner wall of the frame (1), a rotator (61) is installed at the middle part of the inner wall of the frame (1), and a telescopic rod (46) is installed at the middle part of the inner wall of the frame (1).

3. The high-toughness brake friction pad hot pressing molding cooling equipment according to claim 1 is characterized by: The feeding module (8) comprises: a mold (4), a material storage box (5), a connecting pipe (19), a regulating valve (20), an adjustment motor (21) and a fan blade (22); the material storage box (5) is connected to the mold (4) via the connecting pipe (19); the regulating valve (20) is connected to the processor (2) via a signal line; the adjustment motor (21) is connected to the processor (2) via a signal line; and the adjustment motor (21) is connected to the fan blade (22) via a connecting shaft; A mold (4) is installed in the middle of the inner wall of the frame (1), a material storage box (5) is installed on the upper part of the inner wall of the frame (1), a connecting pipe (19) is installed on the upper part of the inner wall of the frame (1), a regulating valve (20) is installed on the upper part of the inner wall of the frame (1), an adjustment motor (21) is installed on the upper part of the inner wall of the frame (1), and a fan blade (22) is installed on the inner wall of the frame (1).

4. The high-toughness brake friction pad hot pressing molding cooling equipment according to claim 1 is characterized by: The processor (2) is connected to the sensing module via wireless transmission, the sensing module comprises: a temperature sensor (23), a weight sensor (24) and a stress sensor (25), the temperature sensor (23) is connected to the processor (2) via wireless transmission, the weight sensor (24) is connected to the processor (2) via wireless transmission, and the stress sensor (25) is connected to the processor (2) via wireless transmission; A temperature sensor (23) is installed on the upper part of the inner wall of the frame (1), a weight sensor (24) is installed in the middle part of the inner wall of the frame (1), and a stress sensor (25) is installed in the middle part of the inner wall of the frame (1).

5. The high-toughness brake friction pad hot pressing molding cooling equipment according to claim 1 is characterized by: The processor (2) is connected to the stress module (26) via wireless transmission, the stress module (26) comprises a cooling component (27) and a rapping component (28), the cooling component (27) is connected to the processor (2) via wireless transmission, and the rapping component (28) is connected to the processor (2) via wireless transmission; A cooling assembly (27) is installed at the lower part of the inner wall of the frame (1), and a rapping assembly (28) is installed on the left side of the outer wall of the cooling assembly (27); The cooling assembly (27) comprises: A water tank (7), a circulation pump (29), an exchanger (30), a cooling motor (31) and a fan (32), wherein the water tank (7) is connected to the exchanger (30) via the circulation pump (29), the cooling motor (31) is connected to the processor (2) via wireless transmission, and the cooling motor (31) is connected to the fan (32) via a connecting shaft; A water tank (7) is installed at the lower part of the inner wall of the frame (1), a circulating pump (29) is installed at the lower part of the inner wall of the frame (1), an exchanger (30) is installed on the upper side of the outer wall of the water tank (7), a cooling motor (31) is installed at the upper part of the inner wall of the circulating pump (29), and a fan (32) is installed at the upper part of the inner wall of the circulating pump (29).

6. The high-toughness brake friction pad hot pressing molding cooling equipment according to claim 1 is characterized by: The water valve (16) comprises: a valve body (33), a valve seat (34), a valve flap (35), a valve stem (36) and a controller (37); the controller (37) is connected to the processor (2) via signal transmission; A valve body (33) is installed in the middle of the inner wall of the frame (1), a valve seat (34) is installed in the middle of the inner wall of the frame (1), a valve disc (35) is installed in the middle of the inner wall of the frame (1), a valve stem (36) is installed in the middle of the inner wall of the frame (1), and a controller (37) is installed in the middle of the inner wall of the frame (1).

7. The high-toughness brake friction pad hot pressing molding cooling equipment according to claim 3 is characterized by: The regulating valve (20) comprises: a fixed block (38), a movable block (39), a spring (40), a magnetic induction coil (41) and a baffle (42); A fixed block (38) is installed on the upper part of the inner wall of the frame (1), a moving block (39) is installed on the upper part of the inner wall of the frame (1), a spring (40) is installed on the upper part of the inner wall of the frame (1), a magnetic induction coil (41) is installed on the upper part of the inner wall of the frame (1), and a baffle (42) is installed on the upper part of the inner wall of the frame (1).

8. The high-toughness brake friction pad hot pressing molding cooling equipment according to claim 5 is characterized by: The rapping assembly (28) comprises: a control unit (43), a vibration exciter (44) and an amplifying unit (45); the control unit (43) is connected to the processor (2) via wireless transmission, and the vibration exciter (44) is connected to the control unit (43) via the amplifying unit (45); A control unit (43) is installed at the lower part of the inner wall of the frame (1), a vibration exciter (44) is installed at the upper side of the outer wall of the control unit (43), and an amplification unit (45) is installed at the upper side of the outer wall of the control unit (43).

9. The high-toughness brake friction pad hot pressing molding cooling equipment according to claim 1, characterized in that: The method for using the high-toughness brake friction pad hot pressing molding cooling device is as follows: S1: The processor (2) controls the feeding module (8) to feed material into the mold (4), and the weight sensor (24) monitors the weight of the material in the mold (4); S2: When a weight abnormality occurs, the processor (2) controls the feeding module (8) to adjust the weight of the material in the mold (4); S3: After the weight of the material in the mold (4) is correct, hot pressing is performed; S4: During the hot pressing process, the processor (2) controls the temperature control module (9) to adjust the temperature of the mold (4); S5: After the hot pressing forming is completed, the processor (2) controls the stress module (26) to cool the product and remove stress; S6: Finish the product to obtain the finished product.

10. The high-toughness brake friction pad hot pressing molding cooling equipment according to claim 9, characterized in that: The S4 further comprises: S41: After the material enters the mold (4), the processor (2) controls the mixing motor (15) to drive the mixing plate (13) to move in the mold (4) to balance the temperature of the material; S42: the processor (2) controls the regulating component (11) to cool the mold (4), thereby cooling the material in the mold (4); S43: After the temperature sensor (23) transmits information and the processor (2) compares it, if the material temperature reaches a preset value, the temperature control module (9) stops operating and hot pressing is performed.

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