Electrician or electronic glass fabric laminated insulating plate produced by solvent-free method

Abstract

The invention belongs to the technical field of insulating plates, and particularly relates to an electrical or electronic glass fabric laminated insulating plate produced by a solvent-free method, the electrical or electronic glass fabric laminated insulating plate comprises prepregs and coarsened insulating film layers, a plurality of prepregs are stacked into a prepreg layer, and the coarsened insulating film layers are arranged between the adjacent prepreg layers; the preparation method comprises the following steps: weighing the raw materials according to the mass ratio, and mixing and stirring the raw materials within the room temperature-70 DEG C to prepare the solvent-free heat-resistant epoxy resin insulating glue. Injecting the solvent-free heat-resistant epoxy resin insulating glue into a gluing machine, dipping the solvent-free heat-resistant epoxy resin insulating glue on glass cloth, and heating to form a prepreg; stacking the prepregs according to the required layer number, clamping a plurality of coarsened insulating film layers in the prepregs, feeding the prepregs into a high-temperature and high-pressure laminating machine, and pressing, curing and molding; the insulation plate is large in breakdown voltage margin, interlayer cracking is not prone to occurring, and long-term stable work of the glass fiber cloth insulation laminated insulation plate is better facilitated.

Description

Technical Field

[0001] The present invention relates to the technical field of insulating boards, and in particular to a solvent-free method for producing an electrical or electronic glass fiber cloth laminated insulating board. Background Art

[0002] Insulation laminate is a whole formed by laminating and hot pressing two or more layers of fiber or fabric impregnated with resin. It can be in the shape of plates, tubes, rods or other shapes. Laminated products can be processed into various insulation and structural parts, and are widely used in motors, transformers, high and low voltage electrical appliances, electrical instruments and electronic equipment; the traditional production method of electrical or electronic glass fiber cloth laminate insulation board is: the glass fiber cloth is impregnated with solvent insulation glue to produce semi-cured sheets, after heating to remove the solvent, it is directly stacked in a certain number of layers, and then pressed and cured. The stacking structure has defects such as small breakdown voltage margin and easy interlayer cracking. In addition, there are toxic and harmful chemical solvent emissions during the gluing process. Even if it is put into secondary treatment by environmental protection equipment, the incineration tail gas still has a certain amount of harmful combustion exhaust gas. Summary of the invention

[0003] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a solvent-free method for producing electrical or electronic glass fiber cloth laminated insulation boards, which have a large breakdown voltage margin, are not prone to interlayer cracking, are more conducive to the long-term stable operation of the glass fiber cloth insulation laminated insulation boards, and the production process is more environmentally friendly.

[0004] The object of the present invention is achieved as follows: a solvent-free method for producing an electrical or electronic glass fiber cloth laminated insulation board, comprising a semi-cured sheet and a roughened insulating film layer, wherein a plurality of semi-cured sheets are stacked into a semi-cured layer, and a roughened insulating film layer is arranged between adjacent semi-cured layers.

[0005] The roughened insulating film layer is an electrical insulating polyester film with a roughened surface or an electrical insulating polyimide film with a roughened surface.

[0006] The semi-cured sheet is produced by impregnating alkali-free glass fiber cloth with solvent-free heat-resistant epoxy resin insulating glue.

[0007] The raw materials required for preparing solvent-free heat-resistant epoxy resin insulating adhesive include: E20 epoxy resin, E44 epoxy resin, methyltetrahydrophthalic anhydride, benzylamine, and inorganic filler powder, wherein the weight proportions of each component are respectively: 100 parts of E20 epoxy resin, 20-100 parts of E44 epoxy resin, 80-180 parts of methyltetrahydrophthalic anhydride, 0.1-4 parts of benzylamine, and 10-300 parts of inorganic filler powder.

[0008] The weight portions of raw materials required for preparing solvent-free heat-resistant epoxy resin insulating adhesive are: 100 parts of E20 epoxy resin, 20 parts of E44 epoxy resin, 80 parts of methyltetrahydrophthalic anhydride, 0.1 parts of benzylamine, and 50 parts of inorganic filler powder.

[0009] The weight portions of raw materials required for preparing solvent-free heat-resistant epoxy resin insulating adhesive are respectively: 100 parts of E20 epoxy resin, 60 parts of E44 epoxy resin, 130 parts of methyltetrahydrophthalic anhydride, 2 parts of benzylamine, and 180 parts of inorganic filler powder.

[0010] The weight portions of raw materials required for preparing solvent-free heat-resistant epoxy resin insulating adhesive are: 100 parts of E20 epoxy resin, 100 parts of E44 epoxy resin, 180 parts of methyltetrahydrophthalic anhydride, 4 parts of benzylamine, and 300 parts of inorganic filler powder.

[0011] A method for preparing an electrical or electronic glass fiber cloth laminated insulation board by a solvent-free method comprises the following steps: Preparation of solvent-free heat-resistant epoxy resin insulating adhesive: weigh the above raw materials according to the mass ratio, and mix and stir the raw materials in the range of room temperature to 70° C. for 0.5 to 5 hours to prepare solvent-free heat-resistant epoxy resin insulating adhesive for standby use; Laminated insulation board pressing: inject solvent-free heat-resistant epoxy resin insulation glue into the glue applicator, impregnate the glass cloth with the solvent-free heat-resistant epoxy resin insulation glue, and heat it to form a semi-cured sheet; then stack the semi-cured sheets according to the required number of layers, and sandwich several roughened insulation film layers between them, and send them into a high-temperature and high-pressure laminator to press and solidify them into shape; Mechanical processing: according to customer requirements, use machining equipment to perform cutting, deburring and other mechanical processing on the laminated insulation board after compression molding; Waxing: Paraffin is applied to the side of the machined laminated insulation board to complete the processing of the laminated insulation board.

[0012] Compared with the prior art, the present invention has the following beneficial effects: 1. The new process produces electrical or electronic glass fiber cloth laminated insulation boards. There is no emission of toxic and harmful chemical solvents during the gluing process, less investment in environmental protection equipment, no incineration exhaust gas, which is conducive to green and environmentally friendly production 2. The laminated insulation board produced by the stacking structure has a large breakdown voltage margin and is not prone to interlayer cracking, which is more conducive to the long-term stable operation of the glass fiber cloth insulation laminated insulation board. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments of the present invention or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0014] Figure 1 The present invention is a schematic diagram of the stacking structure of a solvent-free method for producing electrical or electronic glass fiber cloth laminated insulation boards.

[0015] In the figure: 1. Prepreg; 2. Roughened insulating film layer. DETAILED DESCRIPTION

[0016] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0017] In the description of the present invention, it is necessary to understand that the terms "length", "width", "up", "down", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0018] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0019] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0020] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0021] In one embodiment of the present invention, Figure 1 As shown, a solvent-free method for producing an electrical or electronic glass fiber cloth laminated insulation board includes a prepreg 1 and a roughened insulating film layer 2. Several prepregs 1 are stacked into a prepreg layer, and a roughened insulating film layer 2 is arranged between adjacent prepreg layers.

[0022] In one embodiment of the present invention, the roughened insulating film layer 2 is made of an electrical insulating polyester film with a roughened surface or an electrical insulating polyimide film with a roughened surface.

[0023] In one embodiment of the present invention, the prepreg 1 is produced by impregnating alkali-free glass fiber cloth with solvent-free heat-resistant epoxy resin insulating glue.

[0024] In one embodiment of the present invention, the raw materials required for preparing solvent-free heat-resistant epoxy resin insulating adhesive include: E20 type epoxy resin, E44 type epoxy resin, methyltetrahydrophthalic anhydride, benzylamine, and inorganic filler powder, wherein the weight proportions of each component are: 100 parts of E20 type epoxy resin, 20-100 parts of E44 type epoxy resin, 80-180 parts of methyltetrahydrophthalic anhydride, 0.1-4 parts of benzylamine, and 10-300 parts of inorganic filler powder.

[0025] In one embodiment of the present invention, the inorganic filler is one or a mixture of aluminum hydroxide, silicon dioxide, aluminum oxide and aluminum nitride. In one embodiment of the present invention, the weight portions of raw materials required for preparing solvent-free heat-resistant epoxy resin insulating adhesive are: 100 parts of E20 epoxy resin, 20 parts of E44 epoxy resin, 80 parts of methyltetrahydrophthalic anhydride, 0.1 parts of benzylamine, and 50 parts of inorganic filler powder.

[0026] In one embodiment of the present invention, the weight portions of raw materials required for preparing solvent-free heat-resistant epoxy resin insulating adhesive are: 100 parts of E20 epoxy resin, 60 parts of E44 epoxy resin, 130 parts of methyltetrahydrophthalic anhydride, 2 parts of benzylamine, and 180 parts of inorganic filler powder.

[0027] In one embodiment of the present invention, the weight portions of raw materials required for preparing solvent-free heat-resistant epoxy resin insulating adhesive are: 100 parts of E20 epoxy resin, 100 parts of E44 epoxy resin, 180 parts of methyltetrahydrophthalic anhydride, 4 parts of benzylamine, and 300 parts of inorganic filler powder.

[0028] A method for preparing an electrical or electronic glass fiber cloth laminated insulation board by a solvent-free method comprises the following steps: Preparation of solvent-free heat-resistant epoxy resin insulating adhesive: weigh the above raw materials according to the mass ratio, and mix and stir the raw materials in the range of room temperature to 70° C. for 0.5 to 5 hours to prepare solvent-free heat-resistant epoxy resin insulating adhesive for standby use; Laminated insulation board pressing: injecting solvent-free heat-resistant epoxy resin insulation glue into the glue applicator, impregnating the solvent-free heat-resistant epoxy resin insulation glue on the glass cloth, and heating to form a prepreg 1; then stacking the prepregs 1 according to the required number of layers, and sandwiching a number of roughened insulation film layers 2 therein, and sending them into a high-temperature and high-pressure laminator to press and solidify them into shape; Mechanical processing: according to customer requirements, use machining equipment to perform cutting, deburring and other mechanical processing on the laminated insulation board after compression molding; Waxing: Paraffin is applied to the side of the machined laminated insulation board to complete the processing of the laminated insulation board.

[0029] The present invention adopts a roughened surface electrical insulation polyester film or a roughened surface electrical insulation polyimide film, and sandwiches one or more sheets when the semi-cured sheets are stacked, and then sent to a high-temperature and high-pressure laminator for pressing and curing. The glass fiber cloth insulation laminated insulation board produced by the stacking structure has a large breakdown voltage margin, is not prone to interlayer cracking, and is more conducive to the long-term stable operation of the glass fiber cloth insulation laminated insulation board.

[0030] The new process for producing electrical or electronic glass fiber cloth laminated insulation boards does not emit toxic and harmful chemical solvents during the gluing process, requires less investment in environmental protection equipment, and has no incineration exhaust gas, which is conducive to green and environmentally friendly production.

[0031] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning understood by a person of ordinary skill in the field to which the invention belongs. The use of "one" or "an" and other similar words in the specification and claims of this application does not necessarily indicate a quantitative limitation. "Include" or "comprises" and other similar words mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and other similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

[0032] The exemplary implementation modes of the present invention are described in detail above with reference to the preferred embodiments. However, it can be understood by those skilled in the art that, without departing from the concept of the present invention, various modifications and variations can be made to the above-mentioned specific embodiments, and various combinations of the technical features and structures proposed in the present invention can be made without exceeding the protection scope of the present invention.

Claims

1. A solvent-free method for producing electrical or electronic glass fiber cloth laminated insulation board, characterized in that: It comprises a prepreg (1) and a roughened insulating film layer (2), wherein a plurality of prepregs (1) are stacked to form a prepreg layer, and a roughened insulating film layer (2) is provided between adjacent prepreg layers.

2. The solvent-free method for producing electrical or electronic glass fiber cloth laminated insulation board according to claim 1, characterized in that: The roughened insulating film layer (2) is an electrical insulating polyester film with a roughened surface or an electrical insulating polyimide film with a roughened surface.

3. The solvent-free method for producing electrical or electronic glass fiber cloth laminated insulation board according to claim 1, characterized in that: The prepreg (1) is produced by impregnating alkali-free glass fiber cloth with solvent-free heat-resistant epoxy resin insulating glue.

4. The solvent-free method for producing electrical or electronic glass fiber cloth laminated insulation board according to claim 3, characterized in that: The raw materials required for preparing solvent-free heat-resistant epoxy resin insulating adhesive include: E20 epoxy resin, E44 epoxy resin, methyltetrahydrophthalic anhydride, benzylamine, and inorganic filler powder, wherein the weight proportions of each component are respectively: 100 parts of E20 epoxy resin, 20-100 parts of E44 epoxy resin, 80-180 parts of methyltetrahydrophthalic anhydride, 0.1-4 parts of benzylamine, and 10-300 parts of inorganic filler powder.

5. The solvent-free method for producing electrical or electronic glass fiber cloth laminated insulation board according to claim 4, characterized in that: The weight portions of raw materials required for preparing solvent-free heat-resistant epoxy resin insulating adhesive are: 100 parts of E20 epoxy resin, 20 parts of E44 epoxy resin, 80 parts of methyltetrahydrophthalic anhydride, 0.1 parts of benzylamine, and 50 parts of inorganic filler powder.

6. The solvent-free method for producing electrical or electronic glass fiber cloth laminated insulation board according to claim 4, characterized in that: The weight portions of raw materials required for preparing solvent-free heat-resistant epoxy resin insulating adhesive are respectively: 100 parts of E20 epoxy resin, 60 parts of E44 epoxy resin, 130 parts of methyltetrahydrophthalic anhydride, 2 parts of benzylamine, and 180 parts of inorganic filler powder.

7. The solvent-free method for producing electrical or electronic glass fiber cloth laminated insulation board according to claim 4, characterized in that: The weight portions of raw materials required for preparing solvent-free heat-resistant epoxy resin insulating adhesive are: 100 parts of E20 epoxy resin, 100 parts of E44 epoxy resin, 180 parts of methyltetrahydrophthalic anhydride, 4 parts of benzylamine, and 300 parts of inorganic filler powder.

8. A method for producing electrical or electronic glass fiber cloth laminated insulation board by a solvent-free method, characterized in that: The following steps are involved: Preparation of solvent-free heat-resistant epoxy resin insulating adhesive: weigh the above raw materials according to the mass ratio, and mix and stir the raw materials in the range of room temperature to 70° C. for 0.5 to 5 hours to prepare solvent-free heat-resistant epoxy resin insulating adhesive for standby use; Pressing of laminated insulation board: injecting solvent-free heat-resistant epoxy resin insulation glue into a glue applicator, impregnating the glass cloth with the solvent-free heat-resistant epoxy resin insulation glue, and heating to form a semi-cured sheet (1); then stacking the semi-cured sheets (1) according to the required number of layers, and sandwiching a plurality of roughened insulation film layers (2) therebetween, and sending them into a high-temperature and high-pressure laminating machine for pressing and curing to form; Mechanical processing: according to customer requirements, use machining equipment to perform cutting, deburring and other mechanical processing on the laminated insulation board after compression molding; Waxing: Paraffin is applied to the side of the machined laminated insulation board to complete the processing of the laminated insulation board.

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