Semiconductor material box conveying device

Abstract

The present invention discloses a semiconductor material box conveying device, which relates to the semiconductor field, including a track frame, a dust-proof and shock-absorbing component, and a conveying component for conveying semiconductor material boxes on a production line; the dust-proof and shock-absorbing component includes a semiconductor material box arranged at the bottom end of the track frame, a plurality of material supporting plates are slidably connected inside the semiconductor material box, one side of the plurality of material supporting plates is rotatably connected to a first rotating convex plate, and the other side is rotatably connected to a second rotating convex plate, a sliding frame is fixedly connected between the first rotating convex plate and the second rotating convex plate, a first spring is fixedly connected at both ends of the sliding frame, a fixed plate is fixedly connected between the first spring and the bottom end in the semiconductor material box, a dust cover is inserted and connected to the top end of the semiconductor material box, the present invention can realize dust-proof and shock-absorbing of the semiconductor material box, prevent pollution and damage, and at the same time can transport semiconductor materials at a rotating angle, thereby improving transportation efficiency.

Description

Technical Field

[0001] The present invention relates to the semiconductor field, and in particular to a semiconductor material box conveying device. Background Art

[0002] Semiconductor refers to a material with conductivity between that of conductors and insulators, such as germanium, silicon, selenium and certain compounds. This material has properties such as unidirectional conductivity.

[0003] In the existing technology, the current semiconductor material semiconductor box is just an ordinary and common semiconductor box. The structure and material selection do not effectively avoid static electricity accumulation and the adhesion of pollutants, which causes the semiconductor material to be contaminated during transportation, thereby affecting product performance and yield. At the same time, during the handling and transfer of the semiconductor box, external impact and vibration will cause damage to internal devices, thereby affecting subsequent production processes. On the other hand, during the current transportation process, the semiconductor box needs to be manually placed on the handling device, but because the handling components are fixed, they cannot be rotated according to the transportation situation to facilitate the placement of the semiconductor box for transportation, which reduces the transportation efficiency. Summary of the invention

[0004] The object of the present invention is to provide a semiconductor material box conveying device to solve the problem that the semiconductor material box is easily impacted and contaminated during the handling and transfer process and has low transportation efficiency.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] A semiconductor material box conveying device comprises a track frame, a dust-proof and shock-absorbing component, and a conveying component for conveying semiconductor material boxes on a production line;

[0007] The transfer assembly includes: a driving assembly, a rotating assembly and a bracket assembly, wherein the driving assembly drives the bracket assembly to rotate through the rotating assembly, so as to drive the semiconductor material box to rotate from the bottom end of the track frame to the outside of the track frame;

[0008] The transfer assembly also includes a push plate assembly, and the driving assembly drives the push plate assembly through the rotating assembly to push the receiving plate to slide inside and outside the track frame at the bottom end of the second connecting plate;

[0009] The transport assembly includes a sliding plate slidably connected to the top of the track frame, a telescopic cylinder is fixedly connected to the top of the sliding plate, a first connecting plate is fixedly connected to the top of the telescopic cylinder, and is used to drive the first connecting plate to move up and down above the position track frame, and a transfer assembly is installed on the upper surface of the first connecting plate; the transfer assembly is used to drive the semiconductor material box to move from the bottom of the track frame to the outside of the track frame;

[0010] The transport assembly includes a sliding plate slidably connected to the top of the track frame, a telescopic cylinder is fixedly connected to the top of the sliding plate, a first connecting plate is fixedly connected to the top of the telescopic cylinder, and is used to drive the first connecting plate to move up and down above the position track frame, and a transfer assembly is installed on the upper surface of the first connecting plate; the transfer assembly is used to drive the semiconductor material box to move from the bottom of the track frame to the outside of the track frame;

[0011] The dustproof and shock-absorbing assembly includes a semiconductor material box arranged at the bottom end of the track frame, and a plurality of supporting plates are slidably connected inside the semiconductor material box, one side of the plurality of supporting plates is rotatably connected to a first rotating convex plate, and the other side is rotatably connected to a second rotating convex plate, a sliding frame is fixedly connected between the first rotating convex plate and the second rotating convex plate, a first spring is fixedly connected at both ends of the sliding frame, a fixed plate is fixedly connected between the first spring and the bottom end inside the semiconductor material box, and a dust cover is inserted into and connected to the top end of the semiconductor material box.

[0012] Preferably, the transport assembly comprises a sliding plate slidably connected to the top of the track frame, a telescopic cylinder is fixedly connected to the top of the sliding plate, a first connecting plate is fixedly connected to the top of the telescopic cylinder, and is used to drive the first connecting plate to move up and down above the position track frame, and a transfer assembly is installed on the upper surface of the first connecting plate; the transfer assembly is used to drive the semiconductor material box to move from the bottom of the track frame to the outside of the track frame;

[0013] The transport assembly also includes: a driving motor, a rotating gear, a guide rack, a first bearing component and a second bearing component. The driving motor is on the side of the sliding plate, and the output end of the driving motor is fixedly connected to the rotating gear. The side gear of the rotating gear is meshed with a guide rack fixed on the inner side of the track frame. A first bearing component is arranged on one side of the first connecting plate, and a second bearing component corresponding to the first bearing component is arranged on the other side.

[0014] Preferably, the driving assembly comprises: a servo motor, a first rotating rod and a first rotating wheel, the servo motor is fixedly connected to both sides of the top of the first connecting plate, the output end of the servo motor passes through the first bearing member and is fixedly connected to the first rotating rod, and the bottom end of the first rotating rod is fixedly connected to the first rotating wheel;

[0015] The rotating assembly includes: a second rotating wheel, a third rotating wheel, a second rotating rod, and a third rotating rod. The first rotating wheel is belt-connected to the third rotating wheel, the third rotating wheel is belt-connected to the second rotating wheel, the third rotating wheel is fixedly connected to the third rotating rod, and the side of the third rotating rod is provided with a second rotating rod fixedly connected to the second rotating wheel.

[0016] Preferably, the bracket assembly includes: a second connecting plate, a receiving plate, an air pressure tube and an air pump. The bottom end of the third rotating rod is fixedly connected to the second connecting plate, the bottom end of the second connecting plate is slidably connected to the receiving plate, the bottom end of the receiving plate is fixedly connected to the air pressure tube, and one end of the air pressure tube is connected to an external air pump pipeline.

[0017] Preferably, the push plate assembly includes: a driving gear, a rack push plate, a movable frame and a second spring. The upper surface of the second rotating rod is fixedly connected with a driving gear, and the side gear of the driving gear is meshed with a rack push plate. One end of the rack push plate is extruded and fitted with a movable frame, and the bottom end of the movable frame is fixedly connected to the receiving plate. The movable frame is fixedly connected to the inside of the second connecting plate by a second spring.

[0018] Preferably, a plurality of material discharging troughs are provided at the top ends of the plurality of supporting plates.

[0019] Preferably, a plurality of filter holes are provided on the surface of the dust cover.

[0020] Preferably, a clamping rod is threadedly connected between the first rotating convex plate and the second rotating convex plate and the plurality of supporting plates respectively.

[0021] Preferably, the first bearing member comprises a first rotating disk fixedly connected to the output end of the servo motor, and a first rolling bearing is fixedly connected to the bottom end of the first rotating disk;

[0022] The second bearing member comprises a second rotating disk fixedly connected to one end of the second rotating rod, and a second rolling bearing is fixedly connected to the bottom end of the second rotating disk.

[0023] Preferably, a positioning seat is fixedly connected between the sliding plate and the top end of the first connecting plate.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] 1. Through the setting of the convex plate and dust cover, when the transport box shakes, the internal support plate is shock-absorbing through the convex plate and the telescopic spring, and the dust cover is dust-proof. When taking out the semiconductor material, it is necessary to pull out the dust cover, loosen the clamping rod, and lift the support plate, so as to realize dust and shock absorption of the semiconductor box and prevent pollution and damage.

[0026] 2. By setting up the driving assembly, rotating assembly, bracket assembly and push plate assembly, the driving assembly is arranged above the track frame, and all the components of the transport assembly except the driving assembly are arranged below it, so that the center of gravity of the transport assembly is closer to the track frame, so that the driving assembly stably drives the rotating assembly and the bracket assembly to rotate at an angle, which is convenient for the installation and use of the material box, realizes the transportation of semiconductor materials at a rotating angle, and improves the transportation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0028] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed by the present invention.

[0029] Figure 1 A schematic diagram of the overall structure of the semiconductor material box and the semiconductor conveying device provided in this application;

[0030] Figure 2 A schematic diagram of the structure of a semiconductor material box and a material box and a dust cover in a semiconductor conveying device provided in the present application;

[0031] Figure 3 A schematic diagram of the structure of the second rotating convex plate, the supporting plate, the first rotating convex plate and other components in the semiconductor material box and the semiconductor conveying device provided in the present application;

[0032] Figure 4 for Figure 3 A schematic diagram of the enlarged local structure at point A in the middle;

[0033] Figure 5 A schematic diagram of the structure of components such as a servo motor, a first rotating rod, and a first rotating wheel in a semiconductor material box and a semiconductor conveying device provided in the present application;

[0034] Figure 6 for Figure 5 A schematic diagram of the enlarged local structure at B in the middle;

[0035] Figure 7 for Figure 5 The enlarged schematic diagram of the local structure at C in the middle;

[0036] Figure 8 for Figure 5 Schematic diagram of the enlarged local structure at point D in the middle.

[0037] Illustration: 1. Track frame; 2. Dust-proof and shock-absorbing assembly; 3. Transport assembly; 201. Semiconductor material box; 202. Material support plate; 203. First rotating convex plate; 204. Second rotating convex plate; 205. Sliding frame; 206. First spring; 207. Fixed plate; 208. Dust cover; 301. Sliding plate; 302. Driving motor; 303. Rotating gear; 304. Guide rack; 305. Telescopic cylinder; 306. First connecting plate; 307. Servo motor; 308. 08. First rotating rod; 309. First rotating wheel; 310. Second rotating wheel; 311. Second rotating rod; 312. Third rotating rod; 313. Third rotating wheel; 314. Second connecting plate; 315. Moving frame; 316. Driving gear; 317. Rack push plate; 318. Second spring; 319. Supporting plate; 320. Air pressure tube; 4. First turntable; 5. First rolling bearing; 6. Second turntable; 7. Second rolling bearing; 8. Positioning seat; 9. Connecting rod. DETAILED DESCRIPTION

[0038] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] In the description of the present invention, it should be understood that the terms "upper", "lower", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.

[0040] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0041] refer to Figures 1 to 8 As shown, an embodiment of the present invention provides a semiconductor material box conveying device, which includes a track frame 1, a dust-proof and shock-absorbing component 2 and a transport component 3;

[0042] The transport assembly 3 includes a rotating assembly installed above the track frame 1 and capable of sliding along the track frame 1, and the rotating end of the rotating assembly extends to the bottom of the track frame 1 and is connected to a receiving assembly;

[0043] The transfer assembly includes: a driving assembly, a rotating assembly and a bracket assembly, wherein the driving assembly drives the bracket assembly to rotate through the rotating assembly, so as to drive the semiconductor material box 201 to rotate from the bottom end of the track frame 1 to the outside of the track frame 1;

[0044] The transfer assembly also includes a push plate assembly, and the driving assembly drives the push plate assembly through the rotating assembly to push the receiving plate 319 to slide inside and outside the track frame 1 at the bottom end of the second connecting plate 314;

[0045] The dustproof and shock-absorbing assembly 2 includes a semiconductor material box 201 arranged at the bottom end of the track frame 1, and a plurality of supporting plates 202 are slidably connected inside the semiconductor material box 201. One side of the plurality of supporting plates 202 is rotatably connected to a first rotating convex plate 203, and the other side is rotatably connected to a second rotating convex plate 204. A sliding frame 205 is fixedly connected between the first rotating convex plate 203 and the second rotating convex plate 204. First springs 206 are fixedly connected at both ends of the sliding frame 205. A fixed plate 207 is fixedly connected between the first spring 206 and the bottom end of the semiconductor material box 201, and a dust cover 208 is inserted into the top end of the semiconductor material box 201.

[0046] When the semiconductor material box 201 is shaken during transportation, the multiple support plates 202 inside the semiconductor material box 201 begin to shake up and down inside the semiconductor material box 201, so that the multiple support plates 202 drive the convex plates to rotate up and down by shaking up and down, and then the first rotating convex plate 203 and the second rotating convex plate 204 drive the sliding frame 205 to move up and down by rotating to squeeze the first spring 206. The first spring 206 is in a compressed and stretched state and exchanges back and forth, so that the tension and elastic force of the first spring 206 offset the support plate On the other hand, the dust cover 208 inserted on the top of the semiconductor material box 201 blocks the dust particles in the outside air through the filter holes. When the semiconductor material needs to be taken out from the semiconductor material box 201, the dust cover 208 is manually pulled out from the top of the semiconductor material box 201, and then the clamping rod 9 is manually turned to loosen and take it out, and then the supporting plate 202 is lifted up in turn, so that the supporting plate 202 slides upward and separates from the semiconductor material box 201, so that the semiconductor material in the material discharge trough is taken out in turn.

[0047] Further, such as Figure 1 , Figure 5 , Figure 6 and Figure 7As shown, the transport component 3 includes a sliding plate 301 slidably connected to the top of the track frame 1, a telescopic cylinder 305 is fixedly connected to the top of the sliding plate 301, and a first connecting plate 306 is fixedly connected to the top of the telescopic cylinder 305, which is used to drive the first connecting plate 306 to move up and down above the position track frame 1, and a transfer component is installed on the upper surface of the first connecting plate 306, and the transfer component is used to drive the semiconductor material box 201 to move from the bottom of the track frame 1 to the outside of the track frame 1. The transport component 3 can accurately lift and move the semiconductor material box 201 to a specified position outside the track frame 1 through the synergistic effect of the sliding plate 301, the telescopic cylinder 305, the transfer component, etc.

[0048] The transport assembly 3 also includes: a driving motor 302, a rotating gear 303, a guide rack 304, a first bearing member and a second bearing member. The driving motor 302 is on the side of the sliding plate 301, and the output end of the driving motor 302 is fixedly connected to the rotating gear 303. The side gear of the rotating gear 303 is meshed with a guide rack 304 fixed to the inner side of the track frame 1. The first connecting plate 306 is provided with a first bearing member on one side, and a second bearing member corresponding to the first bearing member is provided on the other side. The sliding plate 301 cooperates with the driving motor 302 and the guide rack 304 to make the sliding plate 301 run more smoothly on the track frame 1, reduce the damage to the semiconductor material inside the semiconductor material box 201 caused by vibration during transportation, thereby improving the stability of the device and the protection effect of the material. In addition, the telescopic cylinder 305 realizes the up and down movement function of the semiconductor material box 201 through the linkage with the first connecting plate 306, making the operation more flexible and improving the work efficiency and convenience of operation.

[0049] The driving assembly includes: a servo motor 307, a first rotating rod 308 and a first rotating wheel 309. The servo motor 307 is fixedly connected to both sides of the top of the first connecting plate 306. The output end of the servo motor 307 passes through the first bearing member and is fixedly connected to the first rotating rod 308. The bottom end of the first rotating rod 308 is fixedly connected to the first rotating wheel 309.

[0050] The rotating assembly includes: a second rotating wheel 310, a third rotating wheel 313, a second rotating rod 311, and a third rotating rod 312. The first rotating wheel 309 is connected to the third rotating wheel 313 by a belt, the third rotating wheel 313 is connected to the second rotating wheel 310 by a belt, the third rotating wheel 313 is fixedly connected to the third rotating rod 312, and the side of the third rotating rod 312 is provided with a second rotating rod 311 fixedly connected to the second rotating wheel 310. The first rotating rod 308 is driven by the servo motor 307, so that the multiple rotating wheels and rotating rods in the rotating assembly work together, and the angle of the bracket assembly can be flexibly adjusted, so that the movement of the semiconductor material box 201 is not limited to a single direction, but has multi-directional and multi-angle transportation capabilities, thereby improving the adaptability and space utilization of the equipment;

[0051] The bracket assembly includes: a second connecting plate 314, a receiving plate 319, an air pressure tube 320 and an air pump. The bottom end of the third rotating rod 312 is fixedly connected to the second connecting plate 314, the bottom end of the second connecting plate 314 is slidably connected to the receiving plate 319, the bottom end of the receiving plate 319 is fixedly connected to the air pressure tube 320, one end of the air pressure tube 320 is connected to the external air pump pipeline, through the sliding connection between the second connecting plate 314 and the receiving plate 319, and the adsorption effect of the air pressure tube 320 and the air pump, the fixity and safety of the semiconductor material box 201 are further improved. During the rotation and transportation process, the receiving plate 319 can firmly support the semiconductor material box 201 to prevent the semiconductor material box 201 from falling and being damaged due to shaking or displacement. At the same time, the adsorption of the air pressure tube 320 ensures the close contact between the semiconductor material box 201 and the receiving plate 319, effectively preventing accidental falling off during transportation;

[0052] The push plate assembly includes: a driving gear 316, a rack push plate 317, a movable frame 315 and a second spring 318. The upper surface of the second rotating rod 311 is fixedly connected with a driving gear 316, and the side gear of the driving gear 316 is meshed with a rack push plate 317. One end of the rack push plate 317 is pressed and matched with a movable frame 315. The bottom end of the movable frame 315 is fixedly connected to a receiving plate 319. The movable frame 315 is fixedly connected to the inside of the second connecting plate 314 through a second spring 318. The driving gear 316 is connected to the rack push plate 317 through a rack push plate 318. 17 drives the synchronous sliding of the movable frame 315 and the receiving plate 319, which effectively solves the problem of jamming or error in the process of structural movement, thereby significantly improving the operating accuracy and stability of the device during the transportation of the semiconductor material box 201. At the same time, the elastic reset function of the second spring 318, when the rack push plate 317 slides to the limit position, the reverse elastic force of the second spring 318 can quickly reset the movable frame 315 and the receiving plate 319 to the initial position, forming an automatic cycle of pushing and resetting process, thereby improving the automation degree and operation efficiency of the overall device.

[0053] The drive motor 302 is started manually, so that the output end of the drive motor 302 drives the rotating gear 303 to rotate, and then the rotating gear 303 rotates and moves along the guide rack 304 through gear meshing, and then the rotating gear 303 drives the sliding plate 301 to slide on the top of the track frame 1 through rotation, so that the sliding plate 301 drives the telescopic cylinder 305, the first bearing member, the second bearing member, the receiving plate 319, and the servo motor 307 to slide synchronously, and then the telescopic cylinder 305 is started, so that the telescopic end of the telescopic cylinder 305 pushes the first connecting plate 306 upward to move upward, so that the first connecting plate 306 drives the receiving plate 319 to move upward, so that the receiving plate 319 pulls up the semiconductor material box 201, and at the same time the second connecting plate 306 is started. The servo motor 307 at the top side of the connecting plate 306 drives the servo motor 307 to drive the first rotating rod 308 to rotate on the positioning seat 8, so that the first rotating rod 308 drives the first rotating wheel 309, the first rotating disk 4 and the first rolling bearing 5 to rotate, and the first rotating wheel 309 drives the second rotating wheel 310 and the third rotating wheel 313 to rotate through the belt, and then the third rotating wheel 313 drives the third rotating rod 312 to rotate, so that the third rotating rod 312 drives the second connecting plate 314 and the receiving plate 319 to rotate, and at the same time, the second rotating wheel 310 drives the second rotating rod 311, the second rotating disk 6, the second rolling bearing 7, and the driving gear 316 to rotate on the positioning seat 8, so that the driving gear 316 is pushed by the gear meshing. The movable rack push plate 317 is pushed toward the moving frame 315, and the pushing end width and thickness of the rack push plate 317 are larger than the moving frame 315, so that the rack push plate 317 pushes the moving frame 315 to drive the receiving plate 319 to slide on the second connecting plate 314 to squeeze the spring. When the third rotating rod 312 drives the bracket assembly to rotate, its rack push plate 317 slowly becomes out of correspondence with one end of the moving frame 315, so that the rack push plate 317 begins to be in front of the other end of the moving frame 315, and cannot continue to push the moving frame 315 to slide on the second connecting plate 314 through the gear meshing, so that the spring pushes the moving frame 315 in the opposite direction through the rebound force to reset, and then the moving frame 315 drives the receiving plate 319 to slide out of the track frame 1 to face the working The staff then turns off the servo motor 307, manually places the semiconductor material box 201 containing the semiconductor material on the receiving plate 319, and starts the external air pump at the same time, so that the external air pump adsorbs the bottom of the semiconductor material box 201 on the receiving plate 319 through the air pressure tube 320, and then manually turns on the servo motor 307 again, so that the servo motor 307 rotates in the reverse direction to continue to drive the receiving plate 319 to rotate, and at the same time, the driving gear 316 drives the rack push plate 317 to push the other end of the moving frame 315 in the reverse direction to squeeze the second spring 318, so that the moving frame 315 drives the receiving plate 319 to slide into the track frame 1, so that the receiving plate 319 rotates to correspond to the receiving plate 319 on the other side, thereby turning off the servo motor 307.

[0054] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features thereof may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A semiconductor material box conveying device, characterized in that: It comprises a track frame (1), a dust-proof and shock-absorbing component (2), and a transport component (3) for transporting semiconductor material boxes on a production line; The transfer assembly comprises: a driving assembly, a rotating assembly and a support assembly, wherein the driving assembly drives the support assembly to rotate via the rotating assembly, so as to drive the semiconductor material box (201) to rotate from the bottom end of the track frame (1) to the outside of the track frame (1); The transfer assembly also includes a push plate assembly, and the drive assembly drives the push plate assembly through the rotating assembly to push the receiving plate (319) to slide inside and outside the track frame (1) at the bottom end of the second connecting plate (314); The transport assembly (3) comprises a sliding plate (301) slidably connected to the top of the track frame (1); a telescopic cylinder (305) is fixedly connected to the top of the sliding plate (301); a first connecting plate (306) is fixedly connected to the top of the telescopic cylinder (305) and is used to drive the first connecting plate (306) to move up and down above the track frame (1); a transfer assembly is installed on the upper surface of the first connecting plate (306); the transfer assembly is used to drive the semiconductor material box (201) to move from the bottom of the track frame (1) to the outside of the track frame (1); The dustproof and shock-absorbing assembly (2) comprises a semiconductor material box (201) arranged at the bottom end of a track frame (1); a plurality of material supporting plates (202) are slidably connected inside the semiconductor material box (201); one side of the plurality of material supporting plates (202) is rotatably connected to a first rotating convex plate (203); the other side is rotatably connected to a second rotating convex plate (204); a sliding frame (205) is fixedly connected between the first rotating convex plate (203) and the second rotating convex plate (204); both ends of the sliding frame (205) are fixedly connected to a first spring (206); a fixed plate (207) is fixedly connected between the first spring (206) and the bottom end of the semiconductor material box (201); and a dust cover (208) is inserted into and connected to the top end of the semiconductor material box (201).

2. A semiconductor material box conveying device according to claim 1, characterized in that: The transport assembly (3) further comprises: a drive motor (302), a rotating gear (303), a guide rack (304), a first bearing member and a second bearing member; the drive motor (302) is disposed on the side of the sliding plate (301); the output end of the drive motor (302) is fixedly connected to the rotating gear (303); a side gear of the rotating gear (303) is meshed with a guide rack (304) fixed to the inner side of the track frame (1); a first bearing member is disposed on one side of the first connecting plate (306); and a second bearing member corresponding to the first bearing member is disposed on the other side.

3. A semiconductor material box conveying device according to claim 2, characterized in that: The driving assembly comprises: a servo motor (307), a first rotating rod (308) and a first rotating wheel (309); the servo motor (307) is fixedly connected to both sides of the top of the first connecting plate (306); the output end of the servo motor (307) passes through the first bearing member and is fixedly connected to the first rotating rod (308); the bottom end of the first rotating rod (308) is fixedly connected to the first rotating wheel (309); The rotating assembly comprises: a second rotating wheel (310), a third rotating wheel (313), a second rotating rod (311), and a third rotating rod (312); the first rotating wheel (309) is connected to the third rotating wheel (313) by a belt; the third rotating wheel (313) is connected to the second rotating wheel (310) by a belt; the third rotating wheel (313) is fixedly connected to the third rotating rod (312); and a second rotating rod (311) fixedly connected to the second rotating wheel (310) is provided on a side surface of the third rotating rod (312).

4. A semiconductor material box conveying device according to claim 3, characterized in that: The bracket assembly comprises: a second connecting plate (314), a receiving plate (319), an air pressure tube (320) and an air pump; the bottom end of the third rotating rod (312) is fixedly connected to the second connecting plate (314); the bottom end of the second connecting plate (314) is slidably connected to the receiving plate (319); the bottom end of the receiving plate (319) is fixedly connected to the air pressure tube (320); one end of the air pressure tube (320) is connected to an external air pump pipeline.

5. A semiconductor material box conveying device according to claim 4, characterized in that: The push plate assembly comprises: a driving gear (316), a rack push plate (317), a movable frame (315) and a second spring (318); the upper surface of the second rotating rod (311) is fixedly connected with the driving gear (316); the side gear of the driving gear (316) is meshed with the rack push plate (317); one end of the rack push plate (317) is pressed and fitted with the movable frame (315); the bottom end of the movable frame (315) is fixedly connected to the receiving plate (319); the movable frame (315) is fixedly connected to the inside of the second connecting plate (314) via the second spring (318).

6. A semiconductor material box conveying device according to claim 1, characterized in that: A plurality of material discharge troughs are provided at the top ends of the plurality of material support plates (202).

7. A semiconductor material box conveying device according to claim 6, characterized in that: A plurality of filtering holes are provided on the surface of the dust cover (208).

8. A semiconductor material box conveying device according to claim 7, characterized in that: A clamping rod (9) is threadedly connected between the first rotating convex plate (203) and the second rotating convex plate (204) and the plurality of supporting plates (202).

9. A semiconductor material box conveying device according to claim 3, characterized in that: The first bearing component comprises a first rotating disk (4) fixedly connected to the output end of the servo motor (307), and a first rolling bearing (5) is fixedly connected to the bottom end of the first rotating disk (4); The second bearing member comprises a second rotating disk (6) fixedly connected to one end of the second rotating rod (311), and a second rolling bearing (7) is fixedly connected to the bottom end of the second rotating disk (6).

10. The semiconductor material box conveying device according to claim 2, characterized in that: A positioning seat (8) is fixedly connected between the sliding plate (301) and the top end of the first connecting plate (306).

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