A sputtering apparatus for substrate with public and private rotation
By designing a multi-motor driven substrate rotation device, combined with a ball and limit bolt structure, the problems of substrate damage and film inhomogeneity were solved, enabling convenient substrate replacement and stable rotation, and improving sputtering quality and equipment efficiency.
Patent Information
- Application Number
- CN202411847252.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2044-12-16
AI Technical Summary
Existing resistive substrate sputtering rotation devices are prone to damage and contamination after prolonged use, resulting in high maintenance costs and reduced sputtering quality. Furthermore, traditional integrated installation leads to uneven thin film deposition.
A device comprising a sputtering chamber, a guiding mechanism, a vacuum pump, an auxiliary frame, a bonding plate, and a motor was designed. By driving the substrate to rotate around its own axis with multiple motors, and combining a ball bearing and a limiting bolt structure, the substrate can be detached, installed, and rotated, reducing friction and ensuring uniform film deposition.
It improves the stability of substrate rotation and revolution efficiency, reduces maintenance costs, enables convenient substrate replacement and uniform thin film deposition, and reduces downtime.
Smart Images
Figure CN119640218B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application belongs to the technical field of resistance substrate, and particularly relates to a sputtering common-rotation device for a resistance substrate. BACKGROUND
[0002] Sputtering is a kind of physical vapor deposition. In the sputtering process, gas is accelerated and hits the surface of a target material, causing target atoms to be ejected from the surface of the target material. These ejected atoms and molecules then deposit onto the surface of a substrate to form a thin film. In order to ensure uniform deposition of the thin film, the substrate is usually rotated during the sputtering process. The self-rotation device controls the rotational movement of the substrate to ensure that the sputtering source uniformly covers the entire surface of the substrate, thereby avoiding uneven deposition of the thin film and the occurrence of areas with uneven thickness.
[0003] However, the existing sputtering common-rotation device for a resistance substrate is not perfect and still has some defects.
[0004] The conventional device is integrally installed with the substrate. During the sputtering process, the substrate may be damaged, contaminated and degraded in performance due to long-term use and improper operation. Scratches and contamination on the surface of the substrate require replacement of the entire device, increasing maintenance costs and downtime. The contaminated substrate may result in a decrease in sputtering quality. SUMMARY
[0005] The application aims to provide a sputtering common-rotation device for a resistance substrate to solve the problems in the background art.
[0006] To achieve the above-mentioned purpose, the application provides the following technical scheme: a sputtering common-rotation device for a resistance substrate, comprising a sputtering box body, a sealing cover is arranged on the front surface of the sputtering box body, a first motor is arranged on the top of the sputtering box body, an auxiliary frame body is drivingly connected to the output shaft of the first motor, a reinforcing sleeve is arranged on the bottom of the auxiliary frame body, a wrapping sleeve is arranged on one end of the reinforcing sleeve, a guide mechanism is arranged on one side of the sputtering box body, a collecting box is arranged on the other side of the sputtering box body, a vacuum pump is arranged on one side of the collecting box, a plurality of second motors are arranged on the top of the auxiliary frame body, an auxiliary cylinder is drivingly connected to the output shaft of each of the plurality of second motors, a plurality of abutting plates are arranged on the outer wall of each of the plurality of auxiliary cylinders, a substrate is arranged on one side of each of the plurality of abutting plates, and a pressure-resistant seat is arranged in the sputtering box body.
[0007] Preferably, a suction pipe is arranged on the top of the collecting box, one end of the suction pipe is penetratingly connected to the other side of the sputtering box body, a reinforcing groove is formed in the middle of the top end of the pressure-resistant seat, and a reinforcing column is arranged on the bottom of the reinforcing sleeve.
[0008] Preferably, the bottom of the reinforcing column rotates inside the reinforcing groove, one end of the wrapping sleeve is sleeved with the reinforcing sleeve, and the bottom of the wrapping sleeve is provided with a plurality of vertical rods.
[0009] Preferably, the top end of the anti-pressure seat is provided with a circular groove, one end of the plurality of vertical rods is fixedly installed with a plurality of rolling balls, and the plurality of rolling balls rotate inside the circular groove.
[0010] Preferably, one side of the plurality of abutting plates is provided with a protective plate, one side of the protective plate is provided with two arc-shaped blocks, and one side of the plurality of base plates is provided with two first limiting holes.
[0011] Preferably, one side of the plurality of arc-shaped blocks is provided with a first limiting bolt, one side of the plurality of abutting plates is provided with two second limiting holes, and one end of the plurality of first limiting bolts is respectively screwed into the plurality of first limiting holes.
[0012] Preferably, the other side of the plurality of arc-shaped blocks is fixedly installed with a plurality of fixed plates, one side of the plurality of fixed plates is movably hinged with a plurality of movable plates, one side of the plurality of movable plates is provided with a second limiting bolt, and one end of the plurality of second limiting bolts is respectively screwed into the plurality of second limiting holes.
[0013] Preferably, the bottom of the sputtering box is provided with a wear-resistant seat, and the plurality of base plates are movably arranged on one side of the plurality of abutting plates.
[0014] The beneficial effects of the present application are as follows:
[0015] 1、The cooperation of the wrapping sleeve, the vertical rod, the rolling ball, the anti-pressure seat, the circular groove, the reinforcing groove and the reinforcing column, the argon gas is introduced into the inside of the sputtering box through the guide mechanism, when the argon ion collides with the target material, the surface atoms of the target material will be excited and fly out to form sputtering particles, which can be guided to the surface of the base plate, gradually deposited and formed into a thin film, under the action of the first motor, the auxiliary frame body and the reinforcing sleeve rotate synchronously, which can drive the plurality of base plates to rotate circumferentially, the plurality of rolling balls can move circumferentially inside the circular groove, the reinforcing column rotates inside the reinforcing groove, the rolling ball at the bottom of the wrapping sleeve can assist rotation, reduce friction, reduce energy loss during rotation, improve rotation stability, effectively reduce the starting and running resistance of the device, and improve the revolution efficiency of the device.
[0016] 2、The arc-shaped block, the first limiting bolt, the first limiting hole, the movable plate, the second limiting bolt, the second limiting hole and the protective plate are matched, the first motor is started, the fitting plate and the base plate are driven to revolve, under the starting of the second motor, the fitting plate is driven to rotate, two first limiting bolts are reversely rotated in turn, the first limiting bolt is separated from the inside of the first limiting hole, then two second limiting bolts are reversely rotated, one end of the second limiting bolt is separated from the inside of the second limiting hole, the fitting plate and the base plate can be disassembled, and then the damaged base plate is replaced, the base plate is replaced to adjust the deposition process of the film and test different materials.
[0017] 3、The collecting box, the vacuum pump, the suction pipe, the wear-resistant seat, the second motor, the auxiliary cylinder and the first motor are matched, the second motor is started, the auxiliary cylinder connected with the output shaft is driven to rotate, the fitting plate connected with the auxiliary cylinder can rotate around, the base plate can revolve and rotate, the vacuum pump is started, the suction pipe can pump the gas in the sputtering box to the inside of the collecting box, the gas pressure in the sputtering cavity is reduced to the vacuum level, the gas control system is arranged, the argon gas is introduced into the sputtering cavity by the guiding mechanism, the argon gas is ionized and accelerated by the ion source, the argon ion is formed, the argon ion is guided to impact the target surface, the target surface atom is excited and flies out, the sputtering particle is formed, the sputtering particle is guided to the base plate, gradually deposits and forms the film, and the rotation prevents the film thickness from being uneven due to the geometric position asymmetry between the target and the base plate. BRIEF DESCRIPTION OF DRAWINGS
[0018] Figure 1 It is a front view structural schematic diagram of the application;
[0019] Figure 2 It is a side view structural schematic diagram of the application;
[0020] Figure 3 It is a front view structural schematic diagram of the application;
[0021] Figure 4 It is a front view structural schematic diagram of the application; Figure 3 It is an enlarged view of A in the application;
[0022] Figure 5 It is a front view structural schematic diagram of the application;
[0023] Figure 6 It is a partial exploded view of the application.
[0024] In the figure: 1, sputtering box; 2, airtight cover; 3, guide mechanism; 4, collection box; 5, vacuum pump; 6, suction pipe; 7, auxiliary frame; 8, first motor; 9, second motor; 10, auxiliary cylinder; 11, fit board; 12, protection plate; 13, arc block; 14, first limiting bolt; 15, base plate; 16, first limiting hole; 17, fixed plate; 18, movable plate; 19, second limiting bolt; 20, second limiting hole; 21, reinforcing sleeve; 22, wrapping sleeve; 23, vertical rod; 24, rolling ball; 25, reinforcing column; 26, pressure resistance seat; 27, circular groove; 28, reinforcing groove; 29, wear-resistant seat. DETAILED DESCRIPTION
[0025] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0026] As Figures 1 to 6 shown, the embodiments of the present application provide a technical solution of a sputtering common and self-rotating device for resistive substrates: Embodiment one
[0027] As Figures 1-2 shown, a sputtering common and self-rotating device for resistive substrates comprises a sputtering box 1, the front surface of the sputtering box 1 is provided with an airtight cover 2, the top of the sputtering box 1 is provided with a first motor 8, the output shaft of the first motor 8 is drivingly connected with an auxiliary frame 7, the bottom of the auxiliary frame 7 is provided with a reinforcing sleeve 21, one end of the reinforcing sleeve 21 is sleeved with a wrapping sleeve 22, one side of the sputtering box 1 is provided with a guide mechanism 3, the other side of the sputtering box 1 is provided with a collection box 4, one side of the collection box 4 is provided with a vacuum pump 5, the top of the auxiliary frame 7 is provided with a plurality of second motors 9, the output shafts of the plurality of second motors 9 are drivingly connected with a plurality of auxiliary cylinders 10, the outer walls of the plurality of auxiliary cylinders 10 are provided with a plurality of fit boards 11, one side of the plurality of fit boards 11 is provided with a base plate 15, the inside of the sputtering box 1 is provided with a pressure resistance seat 26, the bottom of the reinforcing column 25 rotates in the inside of the reinforcing groove 28, the wrapping sleeve 22 and one end of the reinforcing sleeve 21 are fixedly sleeved, the bottom of the wrapping sleeve 22 is provided with a plurality of vertical rods 23, when the first motor 8 starts, the auxiliary frame 7 and the reinforcing sleeve 21 rotate synchronously, which can drive the plurality of base plates 15 to rotate circumferentially, the plurality of rolling balls 24 can move circumferentially in the inside of the circular groove 27, the reinforcing column 25 rotates in the inside of the reinforcing groove 28, the rolling balls 24 at the bottom of the wrapping sleeve 22 can assist rotation, reduce friction, reduce energy loss during rotation, and improve rotation stability. Embodiment two
[0028] On the basis of example one, as shown in Figures 2-4 The top end of the pressure-resistant seat 26 is provided with a circular groove 27, one end of each of the plurality of vertical rods 23 is fixedly installed with a rolling ball 24, the plurality of rolling balls 24 rotate inside the circular groove 27, one side of each of the plurality of abutting plates 11 is provided with a protective plate 12, one side of each of the plurality of protective plates 12 is provided with two arc-shaped blocks 13, one side of each of the plurality of base plates 15 is provided with two first limiting holes 16, the start of the first motor 8 drives the abutting plate 11 and the base plate 15 to revolve, under the start of the second motor 9, the abutting plate 11 is driven to rotate, two first limiting bolts 14 are reversely rotated in turn, and are separated from the inside of the first limiting hole 16, and then two second limiting bolts 19 are reversely rotated, and one end of the second limiting bolt 19 is separated from the inside of the second limiting hole 20. Example three
[0029] On the basis of example one and example two, as shown in Figure 1 , Figure 5 and Figure 6 One side of each of the plurality of arc-shaped blocks 13 is provided with a first limiting bolt 14, one side of each of the plurality of abutting plates 11 is provided with two second limiting holes 20, one end of each of the plurality of first limiting bolts 14 is respectively screwed into the inside of each of the plurality of first limiting holes 16, the other side of each of the plurality of arc-shaped blocks 13 is fixedly installed with a fixed plate 17, one side of each of the plurality of fixed plates 17 is movably hinged with a movable plate 18, one side of each of the plurality of movable plates 18 is provided with a second limiting bolt 19, one end of each of the plurality of second limiting bolts 19 is respectively screwed into the inside of each of the plurality of second limiting holes 20, after the vacuum pump 5 is started, the suction pipe 6 can pump the gas inside the sputtering box 1 into the collecting box 4, and the gas pressure in the sputtering cavity is reduced to a vacuum level, through the gas control system, the argon gas is introduced into the sputtering cavity by the guiding mechanism 3, the argon gas is ionized and accelerated by the ion source, forming argon ions, the argon ions are guided to impact the target surface, which can excite the target surface atoms and make them fly out, forming sputtering particles.
[0030] The working principle and use process of the application: sputtering is a physical vapor deposition, in the sputtering process, gas is accelerated and hits the target surface, causing target atoms to pop out from the target surface, these flying atoms and molecules then deposit on the substrate surface to form a thin film, in order to ensure uniform deposition of the thin film, the substrate usually needs to be rotated during sputtering, the self-rotating device controls the rotation of the substrate to ensure that the sputtering source uniformly covers the entire substrate surface, avoiding uneven deposition of the thin film and the appearance of areas with uneven thickness, the traditional device is installed in one piece with the substrate, during sputtering, the substrate may be damaged, contaminated and performance degraded due to long-term use and improper operation, scratches and contamination on the substrate surface require replacement of the entire equipment, increasing maintenance costs and downtime, and contaminated substrates can cause sputtering quality to decline, argon gas is introduced into the inside of the sputtering box 1 through the guide mechanism 3, when argon ions hit the target, the atoms on the surface of the target will be excited and fly out, forming sputtering particles, which can be guided to the surface of the substrate 15, gradually deposited and formed into a thin film, under the action of the first motor 8, the auxiliary frame 7 and the reinforcing sleeve 21 rotate synchronously, which can drive the multiple substrates 15 to rotate in a circle, the multiple balls 24 can move in a circle in the inside of the circular groove 27, and the reinforcing column 25 rotates in the inside of the reinforcing groove 28, the balls 24 arranged at the bottom of the reinforcing sleeve 22 can assist in rotation, reduce friction, reduce energy loss during rotation, improve rotation stability, effectively reduce the starting and running resistance of the device, and improve the revolution efficiency of the device, the starting of the first motor 8 drives the fitting plate 11 and the substrate 15 to revolve, under the action of the second motor 9, the fitting plate 11 rotates, the two first limiting bolts 14 are rotated in reverse order and separated from the inside of the first limiting hole 16, then the two second limiting bolts 19 are rotated in reverse and separated from the inside of the second limiting hole 20, so that the fitting plate 11 and the substrate 15 can be disassembled, and then the damaged substrate 15 can be replaced, the replacement of the substrate 15 is to adjust the deposition process of the thin film and test different materials, after the second motor 9 is started, the auxiliary cylinder 10 connected with the output shaft of the second motor 9 rotates, the fitting plate 11 connected therewith can rotate in a circle, so that the substrate 15 can revolve and rotate, after the vacuum pump 5 is started, the suction pipe 6 can pump the gas in the inside of the sputtering box 1 to the inside of the collecting box 4, so as to reduce the gas pressure in the sputtering cavity to a vacuum level, through the gas control system, argon gas is introduced into the sputtering cavity through the guide mechanism 3, argon gas is ionized and accelerated through the ion source, forming argon ions, the argon ions are guided to hit the target surface, causing the atoms on the surface of the target to be excited and fly out, forming sputtering particles, the sputtering particles are guided to the substrate 15, gradually deposited and formed into a thin film, and the problem of uneven thickness of the thin film caused by the geometric position asymmetry between the target and the substrate 15 is solved.
[0031] While embodiments of the application have been shown and described, it is to be understood that the embodiments described are merely exemplary of the principles and application of the present application. Numerous modifications and adaptions can be effected without departing from the spirit and scope of the present application, which is not limited to the exact construction and arrangement described. It is intended, therefore, to cover all modifications and adaptions that fall within the scope of the claims and their equivalents.
Claims
1. A device for substrate rotation during sputtering, comprising a sputtering chamber (1), characterized in that: The front of the sputtering box (1) is provided with a sealing cover (2), the top of the sputtering box (1) is provided with a first motor (8), the output shaft of the first motor (8) is drivingly connected with an auxiliary frame body (7), the bottom of the auxiliary frame body (7) is provided with a reinforcing sleeve (21), one end of the reinforcing sleeve (21) is sleeved with a wrapping sleeve (22), one side of the sputtering box (1) is provided with a guide mechanism (3), the other side of the sputtering box (1) is provided with a collecting box (4), one side of the collecting box (4) is provided with a vacuum pump (5), the top of the auxiliary frame body (7) is provided with a plurality of second motors (9), the output shafts of the plurality of second motors (9) are drivingly connected with auxiliary cylinders (10), the outer walls of the plurality of auxiliary cylinders (10) are provided with a plurality of abutting plates (11), one side of the plurality of abutting plates (11) is provided with a base plate (15), the inside of the sputtering box (1) is provided with a pressure-resistant seat (26), one side of the plurality of abutting plates (11) is provided with a protective plate (12), one side of the plurality of protective plates (12) is provided with two arc-shaped blocks (13), one side of the plurality of base plates (15) is provided with two first limiting holes (16), one side of the plurality of arc-shaped blocks (13) is provided with a first limiting bolt (14), one side of the plurality of abutting plates (11) is provided with two second limiting holes (20), one end of the plurality of first limiting bolts (14) is respectively screwed into the inside of the plurality of first limiting holes (16), the other side of the plurality of arc-shaped blocks (13) is fixedly installed with a fixed plate (17), one side of the plurality of fixed plates (17) is movably hinged with a movable plate (18), one side of the plurality of movable plates (18) is provided with a second limiting bolt (19), one end of the plurality of second limiting bolts (19) is respectively screwed into the inside of the plurality of second limiting holes (20), the bottom of the sputtering box (1) is provided with a wear-resistant seat (29), and the plurality of base plates (15) are movably arranged on one side of the plurality of abutting plates (11).
2. A substrate sputtering apparatus according to claim 1, wherein: The top of the collecting box (4) is provided with a suction pipe (6), one end of the suction pipe (6) is penetratingly connected with the other side of the sputtering box (1), the middle of the top of the pressure-resistant seat (26) is provided with a reinforcing groove (28), and the bottom of the reinforcing sleeve (21) is provided with a reinforcing column (25).
3. A substrate sputtering apparatus according to claim 2, wherein: The bottom of the reinforcing column (25) rotates in the inside of the reinforcing groove (28), the wrapping sleeve (22) is fixedly sleeved with one end of the reinforcing sleeve (21), and the bottom of the wrapping sleeve (22) is provided with a plurality of vertical rods (23).
4. A substrate sputter co-rotating device according to claim 3, wherein: The top of the pressure-resistant seat (26) is provided with a circular groove (27), one end of the plurality of vertical rods (23) is fixedly installed with a rolling ball (24), and the plurality of rolling balls (24) rotate in the inside of the circular groove (27).
Citation Information
Patent Citations
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