Continuous nickel plating device for nickel-plated copper wire

By introducing purification components and stable components into the nickel-plated copper wire continuous nickel plating device, the nickel liquid composition is monitored and adjusted in real time, the problem of the need to suspend nickel plating when replacing nickel plating liquid is solved, improving work efficiency and ensuring the plating quality.

CN119640377APending Publication Date: 2025-03-18ZHANGJIAGANG LUCKY METAL HANDICRAFT
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Patent Information

Application Number
CN202411901628.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-23
Publication Date
2025-03-18

AI Technical Summary

Technical Problem

The existing nickel-plated copper wire continuous nickel plating device needs to suspend nickel plating of copper wire when the nickel plating liquid needs to be replaced, resulting in a reduced working efficiency.

Method used

A nickel-plated copper wire continuous nickel plating device is designed, including purification components and stabilizing components. The purification component removes impurities in the nickel liquid through leaking hole buckets and ion exchange resins. The stabilizing component monitors and adjusts the components of the nickel liquid in real time through components such as temporary storage buckets, servo motors, stirring rods, conductivity sensors and laser-induced breakdown spectrometers to ensure the stability of the nickel liquid.

Benefits of technology

Real-time monitoring and adjustment of nickel liquid components is achieved, which avoids pause during nickel liquid replacement, improves the working efficiency of nickel-plated copper wires, and ensures the stability of the coating quality.

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Abstract

The invention discloses a nickel-plated copper wire continuous nickel plating device, and relates to the technical field of nickel-plated copper wire processing, the nickel-plated copper wire continuous nickel plating device comprises a mounting plate, winding assemblies are arranged at the positions, close to the edges of the two sides, of the top of the mounting plate, and a purification assembly is arranged at the position, close to one winding assembly, of the top of the mounting plate. According to the continuous nickel plating device for the nickel-plated copper wire, when the copper wire needs to be subjected to nickel plating treatment, firstly, the copper wire penetrates through a nickel plating pool, and a driving pump is started, so that a nickel plating solution enters a temporary storage barrel through an output pipe; firstly, a conductivity sensor and a laser-induced breakdown spectrometer are used for detecting whether the content of each substance in the nickel liquid meets the standard or not, when it is detected that the content of a certain substance in the nickel plating liquid is reduced, a signal is transmitted to a controller, and an electromagnetic valve on the surface of a storage tank storing the substance is opened through the controller; therefore, the stability of the content of the nickel liquid is ensured.
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