Light-emitting device and manufacturing method thereof, light-emitting module and electronic equipment

Abstract

The embodiment of the invention provides a light-emitting device and a manufacturing method thereof, a light-emitting module and electronic equipment, and aims to improve the sealing performance of the light-emitting device. According to the light-emitting device, the side plate is connected with the top plate, the top plate is provided with the light outlet, the light transmitting piece covers the light outlet, the light source is located on the base, a light path emitted by the light source can penetrate through the light transmitting piece to be emitted out of the light-emitting device, the end, away from the top plate, of the side plate is connected with the base in a sealed mode, and the light transmitting piece is connected with the top plate in a sealed mode. The light source is located in the containing cavity, the sealing performance of the light-emitting device is improved, and the containing cavity can prevent external water, dust and other impurities from making contact with the light source so that light emitting of the light source can not be affected.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of light-emitting devices, and specifically to a light-emitting device and a manufacturing method thereof, a light-emitting module and an electronic device. Background Art

[0002] The light emitting device includes a housing and a light source. The light source is arranged inside the housing. The housing is provided with a light outlet. The light emitted by the light source is emitted outside the housing through the light outlet. Water, dust and other impurities from the outside can easily enter the housing, thereby affecting the light emission of the light source. Summary of the invention

[0003] The embodiments of the present application provide a light-emitting device and a manufacturing method thereof, a light-emitting module and an electronic device, aiming to improve the sealing performance of the light-emitting device.

[0004] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0005] On the one hand, an embodiment of the present application provides a light-emitting device, including a base, a light source, a sealing cover and a light-transmitting sheet, the light source is located on the base, the sealing cover includes a side panel and a top panel, the side panel is arranged around the edge of the top panel, the side panel is connected to the top panel, the side panel and the top panel form a cavity, and the light source is located in the cavity; one end of the side panel away from the top panel is sealed with the base, the base is used to close the cavity, a light outlet is arranged on the top panel, the light outlet is covered by the light-transmitting sheet, and the light-transmitting sheet and the top panel are sealed.

[0006] The light-emitting device provided in the embodiment of the present application has a side panel connected to a top panel, a light outlet is provided on the top panel, a light-transmitting sheet covers the light outlet, a light source is located on a base, a light path emitted by the light source can pass through the light-transmitting sheet to emit out of the light-emitting device, and one end of the side panel away from the top panel is sealed with the base, and the light-transmitting sheet and the top panel are sealed, so that the light-transmitting sheet, the top panel, the side panel and the base form a completely sealed cavity, and the light source is located in the cavity, thereby improving the sealing of the light-emitting device, and the cavity can prevent external impurities such as water and dust from contacting the light source to avoid affecting the light emission of the light source.

[0007] In some embodiments, the sealing cover further includes a connecting portion, which is disposed at an end of the side plate away from the top plate, extends to the outside of the cavity, covers the base, and is sealingly connected to the base.

[0008] Through the above arrangement, the sealing cover is sealed and connected to the base through the connecting portion, which increases the contact area between the sealing cover and the base, thereby increasing the sealing area between the sealing cover and the base, thereby improving the sealing performance between the sealing cover and the base.

[0009] In some embodiments, the sealing cover comprises a metal cover, and the connecting portion is welded to the base, wherein the welding process may use resistance welding or laser welding.

[0010] Through the above arrangement, the sealed connection between the sealing cover and the base is achieved by welding, which can prevent impurities such as water and dust outside the light-emitting device from entering the inside of the light-emitting device, thereby ensuring that the light source can emit light.

[0011] In an embodiment where the connection portion and the base are welded by resistance welding, a welding protrusion is provided on a surface of the connection portion facing the base, and the welding protrusion is used to form a connection layer connecting the base and the connection portion during welding.

[0012] Through the above arrangement, the contact area between the connecting part and the base becomes smaller, which increases the resistance between the connecting part and the base, thereby increasing the resistance heat generated during resistance welding. The increase in resistance heat can increase the efficiency of the welding protrusion in forming a connecting layer and improve the stability of the connecting layer connecting the base and the connecting part.

[0013] In some embodiments, the side panels and the top panel are an integral structure.

[0014] Through the above arrangement, it is avoided that there is a gap at the connection between the side plate and the top plate, thereby reducing the sealing performance of the light emitting device.

[0015] In the embodiment where the side plate and the top plate are an integrated structure, the metal cover is formed by stamping, which can reduce the difficulty of manufacturing the metal cover and improve the production efficiency of forming the light-emitting device.

[0016] In some embodiments, the light-transmitting sheet includes a glass sheet, the sealing cover includes a metal cover, and the light-transmitting sheet and the metal cover are welded.

[0017] Through the above arrangement, since the glass has an amorphous structure, the influence on the polarization characteristics of the laser can be reduced, thereby avoiding affecting the normal light output of the light source.

[0018] In some embodiments, the top plate includes a bending portion, which is arranged around the light outlet, and the bending portion is used to release stress along a direction perpendicular to the center line of the light outlet.

[0019] Through the above-mentioned arrangement, during the process of sealing connection between the light-transmitting sheet and the top plate, the bent portion can release the stress generated by the connection by deforming itself, thereby avoiding stress damage to the light-transmitting sheet, thereby reducing the influence of the light-transmitting sheet on the light path emitted by the light source, or avoiding the light-transmitting sheet from tilting, resulting in air leakage between the light-transmitting sheet and the top plate, affecting the sealing of the light-emitting device.

[0020] In some embodiments, there are multiple bending portions, and the distance between each bending portion and the light outlet is different.

[0021] Through the above arrangement, the multiple bending portions can further increase the ability to release stress.

[0022] In some embodiments, a first anti-reflection film is disposed on a side of the light-transmitting sheet facing the cavity.

[0023] Through the above arrangement, the first anti-reflection film can reduce or eliminate the reflected light emitted by the light source on the transparent sheet, increase the light transmittance of the transparent sheet, and reduce or eliminate the stray light from the cavity to the transparent sheet, so as to increase the intensity of the light source entering the transparent sheet.

[0024] In some embodiments, a second anti-reflection film is disposed on a side of the light-transmitting sheet facing away from the cavity.

[0025] Through the above arrangement, the second anti-reflection film can reduce or eliminate the reflected light in the light-transmitting sheet that is emitted to the outside of the light-emitting device, thereby increasing the light transmittance of the light-transmitting sheet.

[0026] In some embodiments, the light emitting device further includes a collimating lens, and the collimating lens is disposed on the light emitting side of the light transmitting sheet.

[0027] Through the above arrangement, the collimating lens can adjust the incident light into a parallel light beam. In this embodiment, the collimating lens can ensure that the light emitted from the light emitting device is parallel light, thereby improving the directivity of the light emitted by the light source.

[0028] In some embodiments, the base includes a bottom plate and a heat conducting plate, the bottom plate is provided with a heat conducting hole, the heat conducting plate is arranged in the heat conducting hole, the light source is arranged on the heat conducting plate, and the heat conducting plate is used to fit with the circuit board.

[0029] Through the above arrangement, the light source is arranged on the heat conducting plate, and the heat generated by the light source during operation can be directly transferred to the circuit board through the heat conducting plate, thereby improving the heat dissipation efficiency of the light source.

[0030] In some embodiments, the light emitting device further includes a reflector, which is disposed on the base and is used to reflect the light emitted by the light source toward the light outlet.

[0031] Through the above arrangement, the light source can be placed flat on the base, that is, the contact area between the light source and the base is increased, so as to improve the stability of the connection between the light source and the base.

[0032] On the other hand, an embodiment of the present application further provides a light-emitting module, comprising a circuit board and the light-emitting device as described above, wherein the light-emitting device is electrically connected to the circuit board.

[0033] In some embodiments, the base is attached to a circuit board, the circuit board is provided with a heat dissipation hole, a heat dissipation block is provided in the heat dissipation hole, and at least a portion of the base is in contact with the heat dissipation block.

[0034] Through the above arrangement, during the operation of the light emitting device, the heat generated by the light source can be transferred to the heat sink of the circuit board through the base, thereby achieving heat dissipation of the light emitting device.

[0035] On the other hand, an embodiment of the present application further provides an electronic device, including a controller and the light-emitting module as described above, wherein the controller is electrically connected to the light-emitting module.

[0036] On the other hand, the embodiment of the present application further provides a method for manufacturing a light emitting device, comprising:

[0037] The base and the sealing cover are formed by stamping, wherein the sealing cover comprises a metal cover; the sealing cover comprises a side plate and a top plate, wherein the side plate is arranged around the edge of the top plate, the side plate and the top plate are arranged around a cavity, and the side plate and the top plate are connected;

[0038] forming a light outlet on the top plate;

[0039] The light source is mounted on the base and is located in the cavity;

[0040] Cover the light-transmitting sheet on the light-outlet sheet, and connect the light-transmitting sheet and the top plate;

[0041] Buckle the metal cover onto the base to connect the side panels and the base.

[0042] The embodiment of the present application provides a method for manufacturing a light-emitting device, wherein the sealing cover is a metal cover, and a method of stamping the base and the metal cover can improve the production efficiency of manufacturing the base and the metal cover. The sealing cover includes a side panel and a top panel, and a light outlet is simultaneously stamped on the top panel during the stamping process for allowing light emitted by the light source to emit. The side panel and the top panel are combined to form a cavity, the light source is installed on the base, and a light-transmitting sheet is covered on the light outlet, the light-transmitting sheet and the top panel are connected to seal the light outlet, the metal cover is buckled on the base, and the side panel and the base are connected so that the light source is located in the cavity, and the light-transmitting sheet, the top panel, the side panel, and the base form a completely sealed cavity, which improves the sealing of the light-emitting device. The cavity can prevent external impurities such as water and dust from contacting the light source to avoid affecting the light emission of the light source.

[0043] In some embodiments, the metal cover also includes a connecting portion, which is arranged at an end of the side plate away from the top plate, the connecting portion extends to the outside of the cavity, and a welding protrusion is arranged on the surface of the connecting portion facing the base; connecting the side plate and the base includes: connecting the base and the connecting portion by resistance welding, and the welding protrusion forms a connecting layer connecting the base and the connecting portion during welding.

[0044] Through the above arrangement, the end of the welding protrusion away from the connecting part contacts the base first. Compared with the connecting part directly attached to the base, only one end of the welding protrusion contacts the base, which reduces the contact area between the connecting part and the base and increases the resistance between the connecting part and the base, thereby increasing the resistance heat generated during resistance welding. The increase in resistance heat can increase the efficiency of the welding protrusion in forming a connecting layer and improve the stability of the connecting layer connecting the base and the connecting part.

[0045] In other embodiments, the metal cover further includes a connecting portion, which is disposed at an end of the side plate away from the top plate, and extends outside the cavity. Connecting the side plate and the base includes: connecting the base and the connecting portion by laser welding.

[0046] Through the above arrangement, after the connecting part contacts the base, the connecting part is irradiated with a continuous laser or a pulsed laser to weld the connecting part and the base together. Since the laser welding technology can adjust the heat of the welding area to the minimum required amount, the heat generated during the welding process of the sealing cover and the base is reduced and transferred to the light source located on the base, thereby reducing the influence of the high temperature generated by the light-emitting device during the packaging process on the light source, thereby improving the yield rate of the production of light-emitting devices.

[0047] It can be understood that the beneficial effects that can be achieved by the light-emitting module, electronic device and light-emitting device manufacturing method provided in the above embodiments of the present application can refer to the beneficial effects of the light-emitting device mentioned above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] In order to more clearly illustrate the technical solutions in the present application, the following is a brief introduction to the drawings required for use in some embodiments of the present application. Obviously, the drawings described below are only drawings of some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not intended to limit the actual size of the product involved in the embodiments of the present application, the actual process of the method, the actual timing of the signal, etc.

[0049] Figure 1 This is a schematic diagram of the structure of an electronic device in some embodiments of the present application;

[0050] Figure 2 Axonometric view of the light emitting module in some embodiments of the present application Figure 1 ;

[0051] Figure 3 for Figure 2 Sectional view along AA direction;

[0052] Figure 4 Axonometric view of the base of the light emitting device in some embodiments of the present application Figure 1 ;

[0053] Figure 5 Axonometric view of the base of the light emitting device in some embodiments of the present application Figure 2 ;

[0054] Figure 6 An axonometric diagram of a light emitting device in some embodiments of the present application;

[0055] Figure 7 for Figure 6 Cross-sectional view along the BB direction;

[0056] Figure 8 An axonometric view of a sealing cover of a light emitting device in some embodiments of the present application;

[0057] Fig. 9 for Figure 8 Cross-sectional view along the DD direction;

[0058] Fig.10 Axonometric diagrams of light-emitting devices in other embodiments of the present application;

[0059] Fig.11 It is a cross-sectional view of a sealing cover of a light emitting device in some other embodiments of the present application;

[0060] Fig.12 for Figure 7 Enlarged view of point C in the middle;

[0061] Fig.13 An axonometric diagram of a light emitting device in the related art without a sapphire cover;

[0062] Fig.14 It is an axonometric view of a sapphire cover of a light emitting device in the related art;

[0063] Fig.15 is a cross-sectional view of a light emitting device in the related art;

[0064] Fig.16 This is a flow chart of a method for manufacturing a light-emitting device in some embodiments of the present application.

[0065] Explanation of the reference numerals: 1. electronic device; 2. light-emitting module; 3. reflector group; 4. image display chip; 5. beam combiner; 6. projection objective lens; 7. light source; 8. color wheel; 9. circuit board; 10. light-emitting device; 11. base; 12. heat sink; 13. bottom plate; 14. heat conducting plate; 17. conductive structure; 18. conductive column; 19. insulating layer; 20. sealing cover; 21. light-transmitting sheet; 22. side plate; 23. top plate; 24. light outlet; 25. collimating lens; 26. reflector; 27. connecting part; 28. welding protrusion; 29. ​​packaging shell; 30. sapphire cover plate; 31. bottom sealing plate; 32. side sealing plate; 33. light-transmitting port; 34. bending part. DETAILED DESCRIPTION

[0066] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0067] Please refer to Figure 1 , an embodiment of the present application provides an electronic device 1, which may include a device that requires a light source, such as a projector and a digital projection lamp, and this embodiment does not limit the electronic device 1. The electronic device 1 may include a housing and a light-emitting module 2 disposed in the housing, and the light-emitting module 2 may be used to emit laser or spontaneous radiation, etc. The housing may be surrounded by an installation cavity (not shown), and the electronic device 1 may also include a controller, a power supply and other devices, and the controller, the power supply and other devices are installed in the installation cavity, and the controller is electrically connected to the light-emitting module 2. In the electronic device 1, the controller may include a motherboard and a CPU, etc.

[0068] Continue to refer to Figure 1 In the implementation mode where the electronic device 1 includes a projector, the projector may include a light emitting module 2, a reflector group 3, an image display chip 4, a beam combiner 5, and a projection lens 6. During the operation of the projector, the light emitting module 2 may emit multiple laser beams, wherein the laser beams emitted by the light emitting module 2 are expanded by the reflector group 3 and the image display chip 4 and then projected to the beam combiner 5. The beam combiner 5 integrates the multiple laser beams, and then the projection lens 6 projects the integrated laser beams onto the projection screen to realize display imaging. The image display chip 4 may include a DLP (Digital Light Processing) chip, an LCD chip, or an LCoS chip. The DLP chip is provided with millions to tens of millions of mirrors. The DLP chip can control the reflection angle of each mirror to change the brightness of the laser after being reflected by the mirror on the mirror DLP chip.

[0069] Continue to refer to Figure 1 In the above implementation, the light emitting module 2 may be provided with a light source 7 (such as Figure 2 and Figure 3As shown), the light source 7 may include a laser diode (LD). In some embodiments, the light source 7 may include a monochromatic laser light source, a two-color laser light source, and a three-color laser light source, wherein the three-color laser light source may simultaneously emit three lasers having red, green, and blue colors, and the brightness of the red laser, the green laser, and the blue laser may be controlled respectively by the DLP chip to achieve a combination of different colors of the three primary colors, so that the laser projected onto the projection screen displays various colors. It is understandable that the monochromatic laser light source may emit a laser having one color, and the two-color laser light source may emit a laser having two colors. In the implementation mode in which the laser light source includes a monochromatic laser light source and a two-color laser light source, the projector further includes a color wheel 8, which is in the shape of a disk, and is provided with a dyeing area and a non-dyeing area. When the laser is irradiated on the non-dyeing area, the color of the laser will not be changed after passing through the color wheel 8; when the laser is irradiated on the dyeing area, the color of the laser will change after passing through the color wheel 8. The color of the laser after the change is related to the color of the dyeing area. For example, the laser emitted by the monochromatic laser light source is usually a blue laser. The dyeing area on the color wheel 8 corresponding to the monochromatic laser light source includes a red dyeing area and a green dyeing area. It can be understood that the red dyeing area does not mean that the red dyeing area appears red on the color wheel 8, but means that the color of the laser is changed to red after the monochromatic laser passes through the red dyeing area, and the same is true for the green dyeing area. In the implementation method of the projector including the color wheel 8, the color wheel 8 can rotate around the axial direction, and the laser passing through the color wheel 8 alternately displays the three colors of red, green and blue on the screen, thereby realizing different colors through the phenomenon of visual persistence. It can be understood that the light source 7 can also be an LED light source, wherein the LED light source can have three colors of red, green and blue.

[0070] Please refer to Figure 2 and Figure 3 The light-emitting module 2 may include a circuit board 9 and a light-emitting device 10. The light-emitting device 10 includes the light source 7 described above and is used to emit laser light. The light-emitting device 10 may be located on one side of the circuit board 9. The circuit board 9 is electrically connected to the light-emitting device 10. The circuit board 9 is provided with a wire and pads at both ends of the wire. Figure 1 In the implementation of the light emitting module 2 shown in FIG. 1 , the pad at one end of the wire on the circuit board 9 is connected to the controller, and the other end of the wire is connected to the light emitting device 10. The wire on the circuit board 9 can replace the wire used to connect the light emitting device 10 and the controller, which can reduce the volume of the light emitting module 2 and further reduce the volume of the electronic device 1. The circuit board 9 can include an FPC (Flexible Printed Circuit), a PCB (Printed Circuit Board), etc.

[0071] Continue to refer to Figure 3The light emitting device 10 may further include a base 11, which is attached to the circuit board 9. The light source 7 is arranged on the side of the base 11 away from the circuit board 9. A heat dissipation hole may be arranged on the circuit board 9, and a heat dissipation block 12 is arranged in the heat dissipation hole. At least part of the base 11 is in contact with the heat dissipation block 12.

[0072] Through the above arrangement, during the operation of the light emitting device 10 , the heat generated by the light source 7 can be transferred to the heat sink 12 of the circuit board 9 through the base 11 , thereby achieving heat dissipation for the light emitting device 10 .

[0073] In the above implementation, the heat sink 12 can be made of metal. For example, the heat sink 12 can be made of copper, aluminum, etc., so as to improve the efficiency of heat absorption and heat release of the heat sink 12, thereby improving the heat dissipation effect of the light-emitting device 10.

[0074] In the above implementation, the base 11 may include a bottom plate 13 and a heat conducting plate 14, the bottom plate 13 is provided with a heat conducting hole, the heat conducting plate 14 is arranged in the heat conducting hole, one side of the heat conducting plate 14 is in contact with the circuit board 9, and the light source 7 is arranged on the side of the heat conducting plate 14 away from the circuit board 9. Through the above arrangement, the light source 7 is arranged on the heat conducting plate 14, and the heat generated by the light source 7 during operation can be directly transferred to the circuit board 9 through the heat conducting plate 14, thereby improving the heat dissipation efficiency of the light source 7. In some embodiments, the heat conducting hole is arranged opposite to the heat dissipation hole, so that the heat conducting plate 14 is arranged opposite to the heat dissipation block 12, that is, the heat conducting plate 14 is in contact with the heat dissipation block 12, and the light source 7 is arranged on the side of the heat conducting plate 14 away from the heat dissipation block 12, which can further improve the heat dissipation efficiency of the light source 7.

[0075] Among them, the material of the base plate 13 may include metal, so that the base plate 13 has good strength to support and protect the entire light-emitting device 10. Exemplarily, the base plate 13 may include steel, iron-cobalt-nickel alloy, etc.; the material of the heat-conducting plate 14 may include metal or diamond copper or high thermal conductivity ceramic, so that the heat-conducting plate 14 has good thermal conductivity, which facilitates the heat-conducting plate 14 to transfer the heat generated by the light source 7 to the heat sink 12. Exemplarily, the heat-conducting plate 14 may include pure copper, copper alloy, etc.

[0076] In an implementation in which both the bottom plate 13 and the heat conducting plate 14 are made of metal material, the bottom plate 13 and the heat conducting plate 14 can be formed by stamping to simplify the production process of the base 11 and improve production efficiency; illustratively, the formed base 11 may include a rectangle or a quasi-rectangle, wherein the connection between two adjacent sides of the quasi-rectangle is rounded.

[0077] Please refer to Figure 4 The light emitting device 10 provided in the embodiment of the present application may include a plurality of light sources 7, and the plurality of light sources 7 may be arranged in an array. For example, Figure 4In the figure, each row can be provided with 5 light sources 7, and there are two rows in total, so that 10 light sources 7 are arranged in an array. It should be noted that the present application does not limit the number of light sources 7 provided in each row and the number of rows, that is, each row can also be provided with 3, 4, 6, or 7 light sources 7, and the number of rows can include 3, 4, 5, 6, etc.

[0078] Please refer to Figure 4 , a plurality of first conductive holes and a plurality of second conductive holes are provided on the base 11, wherein the first conductive holes are located on one side of the light source 7, and the second conductive holes are located on the side of the light source 7 away from the first conductive holes, that is, the first conductive holes and the second conductive holes are arranged opposite to each other. In the implementation method in which the base 11 includes a bottom plate 13 and a heat conducting plate 14, the first conductive holes and the second conductive holes can be arranged on the bottom plate 13. The light-emitting device 10 can also include a conductive structure 17, and a plurality of conductive structures 17 are provided, each conductive structure 17 is correspondingly arranged in a first conductive hole or a second conductive hole, and the conductive structure 17 includes a conductive column 18 and an insulating layer 19, wherein the conductive column 18 is located in the first conductive hole or in the second conductive hole, and the insulating layer 19 is located between the conductive column 18 and the bottom plate 13, that is, the insulating layer 19 is arranged around the conductive column 18. The conductive column 18 is close to the circuit board 9 (such as Figure 3 One end of the conductive column 18 (as shown) is connected to the pad on the circuit board 9, and one end of the conductive column 18 away from the circuit board 9 extends out of the bottom plate 13 and is connected to the light source 7 through a gold wire to achieve electrical connection between the light source 7 and the circuit board 9.

[0079] Please refer to Figure 5 The conductive column 18 in the first conductive hole and the conductive column 18 in the corresponding second conductive hole can be connected to the light source 7 through gold wire, or multiple light sources 7 can be indirectly connected through gold wire to achieve electrical connection between multiple light sources 7 and the circuit board 9.

[0080] In the above implementation, the insulating layer 19 may include insulating materials such as glass and ceramics.

[0081] Please refer to Figure 6 and Figure 7 The embodiment of the present application provides a light emitting device 10 which may further include a sealing cover 20 and a light-transmitting sheet 21. The sealing cover 20 includes a side plate 22 and a top plate 23. The side plate 22 is arranged around the edge of the top plate 23. The side plate 22 is connected to the top plate 23 to form a cover body of the sealing cover 20. The side plate 22 and the top plate 23 are arranged to form a cavity. The light source 7 is located in the cavity. One end of the side plate 22 away from the top plate 23 is sealed and connected to the base 11. The top plate 23 is provided with a light outlet 24. The light-transmitting sheet 21 covers the light outlet 24. The light-transmitting sheet 21 and the top plate 23 are sealed and connected. The base 11 and the light-transmitting sheet 21 seal the cavity.

[0082] The light-emitting device 10 provided in the embodiment of the present application has a side panel 22 connected to a top panel 23, a light outlet 24 is provided on the top panel 23, a light-transmitting sheet 21 covers the light outlet 24, a light source 7 is located on the base 11, and the laser emitted by the light source 7 can pass through the light-transmitting sheet 21 and emit out of the light-emitting device 10, and one end of the side panel 22 away from the top panel 23 is sealedly connected to the base 11, and the light-transmitting sheet 21 and the top panel 23 are sealedly connected, so that the light-transmitting sheet 21, the top panel 23, the side panel 22, and the base 11 form a completely sealed cavity, and the light source 7 is located in the cavity, thereby improving the sealing of the light-emitting device 10, and the cavity can prevent external impurities such as water and dust from contacting the light source to avoid affecting the light emission of the light source 7.

[0083] In the implementation mode in which the light-transmitting sheet 21 covers the light-exiting opening 24, the light-transmitting sheet 21 may cover the light-exiting opening 24 on the side of the sealing cover 20 facing away from the cavity (eg Figure 7 As shown, the light-transmitting sheet 21 is located above the light-emitting port 24); the light-transmitting sheet 21 may also cover the light-emitting port 24 on the side of the sealing cover 20 facing the cavity (as shown in FIG. Fig.11 As shown, the light-transmitting sheet 21 is located below the light outlet 24).

[0084] In the above implementation, the side plate 22 and the top plate 23 are an integral structure, that is, the sealing cover 20 is integrally formed. Through the above arrangement, a gap is avoided at the connection between the side plate 22 and the top plate 23, thereby reducing the sealing of the light emitting device 10.

[0085] Continue to refer to Figure 7 In some embodiments, the light emitting device 10 further includes a collimating lens 25, and the collimating lens 25 is arranged on the light emitting side of the light transmitting sheet 21. Through the above arrangement, the collimating lens 25 can adjust the incident light into a parallel light beam. In this embodiment, the collimating lens 25 can realize that the light emitted from the light emitting device 10 is parallel light, thereby improving the directivity of the light emitted by the light source 7. In the implementation mode in which the light source includes multiple light sources, the collimating lenses 25 can include multiple collimating lenses 25, wherein each collimating lens 25 is arranged corresponding to a light source 7. Exemplarily, the multiple light sources 7 are arranged in an array, and the multiple collimating lenses 25 are also arranged in an array.

[0086] Continue to refer to Figure 7In some embodiments, the light emitting device 10 further includes a reflector 26, which is disposed on the base 11 and located at the light outlet 24 of the light source 7. The reflector 26 is used to reflect the light emitted by the light source 7 toward the light outlet 24. It can be understood that in the implementation mode in which the light emitting device 10 includes the reflector 26, the laser emitted by the light source 7 is parallel to the upper surface of the base 11. Through the above-mentioned configuration, the light source 7 can be placed flat on the base 11, that is, the contact area between the light source 7 and the base 11 is increased to improve the stability of the connection between the light source 7 and the base 11. At the same time, in the implementation mode in which the base 11 includes the heat conducting plate 14, the light source 7 is connected to the heat conducting plate 14. Increasing the contact area between the light source 7 and the heat conducting plate 14 can also increase the efficiency of the light source 7 transferring heat to the heat conducting plate 14, thereby improving the heat dissipation efficiency of the light source 7.

[0087] Continue to refer to Figure 7 In some embodiments, the sealing cover 20 further includes a connecting portion 27, which is disposed at one end of the side plate 22 away from the top plate 23, and extends to the outside of the cavity, and covers the base 11, and the connecting portion 27 is sealed and connected to the base 11. Through the above arrangement, the sealing cover 20 is sealed and connected to the base 11 through the connecting portion 27, which increases the contact area between the sealing cover 20 and the base 11, and further increases the sealing area between the sealing cover 20 and the base 11, thereby improving the sealing performance between the sealing cover 20 and the base 11.

[0088] Please refer to Figure 8 and Fig. 9 In one embodiment, the projection of the connecting portion 27 on the sealing cover 20 on the base 11 is circular, so that the connecting portion 27 is in contact with the base 11 (such as Figure 7 During the process of sealing connection of the sealing cover 20 (as shown in the figure), the stress received by the sealing cover 20 can be dispersed in all directions to improve the connection stability between the sealing cover 20 and the base 11; the projection of the light outlet 24 on the sealing cover 20 on the base 11 is also circular, and the light-transmitting sheet 21 is also circular. Similarly, during the process of sealing connection between the light-transmitting sheet 21 and the sealing cover 20, the stress received by the light-transmitting sheet 21 can be dispersed in all directions to improve the connection stability between the light-transmitting sheet 21 and the sealing cover 20.

[0089] Please refer to Fig.10 and Fig.11 In another embodiment, the projection of the connection portion 27 on the sealing cover 20 on the base 11 is rectangular, so that the sealing cover 20 can cover the light source 7 (such as Figure 4As shown), the space utilization rate in the sealed cavity is improved. Compared with the previous embodiment, when the number of light sources 7 is the same, the volume of the light-emitting device 10 in this embodiment is smaller, and the integration of the light-emitting device 10 is improved; correspondingly, in this embodiment, the projection of the light outlet 24 on the sealing cover 20 on the base 11 is also rectangular, and the light-transmitting sheet 21 is also rectangular, so that the laser emitted by the light sources 7 arranged in the array can be emitted from the light-emitting device 10 through the light outlet 24 and the light-transmitting sheet 21 covering the light outlet 24.

[0090] Please refer to Figure 7 In some embodiments, the sealing cover 20 may include a metal cover, and the sealing cover 20 may be integrally formed by stamping, casting, etc., which can simplify the production process of the metal cover and improve production efficiency; the integral structure of the side panel 22 and the top panel 23 may be formed by stamping. For example, the metal cover may include a sheet metal part, which can reduce the mass of the metal cover.

[0091] In the implementation mode where the bottom plate 13 and the heat conducting plate 14 are both made of metal materials, the sealing cover 20 includes a metal cover, and the connecting portion 27 of the sealing cover 20 can be welded to the bottom plate 13 on the base 11, thereby achieving a sealed connection between the sealing cover 20 and the base 11, wherein the welding process can use resistance welding or laser welding. Through the above configuration, the sealed connection between the sealing cover 20 and the base 11 by welding can prevent impurities such as water and dust outside the light-emitting device 10 from entering the inside of the light-emitting device 10, thereby ensuring that the light source 7 can emit light.

[0092] In the implementation of welding the sealing cover 20 and the base 11 , the sealing cover 20 and the base 11 may be welded by arc welding or resistance welding.

[0093] Continue to refer to Figure 7 In the implementation method of the sealing cover 20 and the base 11 by resistance welding, since the resistance welding uses the resistance heat generated by the current passing through the connecting part 27 and the contact between the connecting part 27 and the bottom plate 13 as a heat source to locally heat the sealing cover 20 and the base 11, the heat generated during the welding process of the sealing cover 20 and the base 11 is avoided from being transferred to the light source 7 located on the base 11, thereby reducing the influence of the high temperature generated by the light-emitting device 10 during the packaging process on the light source 7, and improving the yield rate of the production of the light-emitting device 10.

[0094] Please refer to Figure 7 and Fig.12In the above implementation, a welding protrusion 28 is provided on the surface of the connection part 27 facing the base 11, and the welding protrusion 28 is used to form a connection layer connecting the base 11 and the connection part 27 during welding. Before the connection part 27 is welded to the base 11, the sealing cover 20 is buckled on the base 11, so that the end of the welding protrusion 28 on the connection part 27 away from the connection part 27 first contacts the base 11. Compared with the connection part 27 directly attached to the base 11, only one end of the welding protrusion 28 contacts the base 11, which reduces the contact area between the connection part 27 and the base 11. In the process of resistance welding, the resistance heat Q generated by resistance welding is Q = I2Rt. It can be seen that the resistance heat is proportional to the resistance in unit time.

[0095] Through the above-mentioned arrangement, the contact area between the connecting part 27 and the base 11 becomes smaller, which increases the resistance between the connecting part 27 and the base 11, thereby increasing the resistance heat generated during resistance welding. The increase in resistance heat can increase the melting speed of the connection between the connecting part 27 and the base 11, thereby increasing the welding speed, increasing the efficiency of the welding protrusion 28 in forming a connecting layer, avoiding overheating of the base 11 and affecting the light source 7, and improving the stability of the connecting layer connecting the base 11 and the connecting part 27.

[0096] Please refer to Fig.13 , Fig.14 and Fig.15 In the related art, the light-emitting device includes a light source 7, a packaging shell 29 and a sapphire cover plate 30. The packaging shell 29 includes a bottom sealing plate 31 and four side sealing plates 32. The four side sealing plates 32 are all located on one side of the bottom sealing plate 31 and are sealed and connected to the bottom sealing plate 31. Adjacent side sealing plates 32 are sealed and connected. A bottom sealing plate 31 and four side sealing plates 32 are enclosed to form a sealed cavity. The ends of the four side sealing plates 32 away from the bottom sealing plate 31 are enclosed to form a light-transmitting opening 33. The light source 7 is located on the side of the bottom sealing plate 31 facing the sealed cavity, and the sapphire cover plate 30 covers the light-transmitting opening 33. The packaging shell 29 is made of ceramic material. It can be understood that the bottom sealing plate 31 and the side sealing plate 32 are both made of ceramic material, and the end of the side sealing plate 32 away from the bottom sealing plate 31 is inlaid with metal material. Exemplarily, the metal material may include gold-tin alloy. The sapphire cover plate 30 is also provided with a metal coating around the side facing the packaging shell 29. Exemplarily, the metal coating may include gold-tin alloy. The metal coating on the sapphire cover plate 30 is welded to the metal material on the side sealing plate 32. However, the heat generated during the welding of the gold-tin alloy will be transferred to the position where the bottom sealing plate 31 is connected to the light source 7, which may easily cause damage to the light source 7 and affect the yield of the light-emitting device.

[0097] Compared to related technologies, please refer to Figure 7In the embodiment of the present application, the light-transmitting sheet 21 can first cover the light outlet 24 on the sealing cover 20, and connect the light-transmitting sheet 21 and the sealing cover 20, and then seal the sealing cover 20 and the base 11 to achieve the sealing of the light source 7. In addition, since the welding method between the sealing cover 20 and the base 11 in the embodiment of the present application is resistance welding, and resistance welding can achieve local heating, it avoids the heat generated during the welding process of the sealing cover 20 and the base 11 from being transferred to the light source 7 located on the base 11, thereby reducing the influence of the high temperature generated by the light-emitting device 10 during the packaging process on the light source 7, and improving the yield of the light-emitting device 10.

[0098] Please compare Figure 7 and Fig.15 In the related art, the packaging shell 29 is made of ceramic material, which is costly and not conducive to adjustment and increase. However, in the embodiment of the present application, the sealing cover 20 and the base 11 can be formed by a stamping process, which has a simple manufacturing method and can adjust the size and shape according to the number of light sources 7 to be assembled.

[0099] Continue to compare references Figure 7 and Fig.15 In the related art, the metal material on the side sealing plate 32 and the metallized coating on the sapphire cover plate 30 are easily oxidized before welding, which can easily cause welding defects in the welding area after welding, thereby destroying the sealing between the packaging shell 29 and the sapphire cover plate 30, and impurities outside the light-emitting device are easy to enter the interior of the light-emitting device, thereby affecting the light emission of the light source 7.

[0100] Compared with the related art, in the embodiment of the present application, a protective layer is provided on the surface of the connection portion 27 where the welding protrusion 28 is provided, and a protective layer is also provided on the surface of the base plate 13 corresponding to the welding protrusion 28, wherein the protective layer may include a nickel-plated layer to prevent oxidation at the connection between the sealing cover 20 and the base 11 during welding.

[0101] Please compare Figure 7 and Fig.15 In the related art, since the welding temperature of the gold-tin alloy reaches 280°C, a cover plate made of sapphire is used to cover the light-transmitting port 33, which increases the cost of the light-emitting device. In addition, since the sapphire material is a single crystal structure and has a birefringence property, in the implementation method in which the light source 7 in the light-emitting device includes a laser diode, the birefringence property of sapphire will affect the polarization property of the laser, thereby affecting the normal light emission of the light source 7.

[0102] Compared with the related art, in the embodiment of the present application, the light-transmitting sheet 21 includes a glass sheet, and the light-transmitting sheet 21 is welded to the metal cover. Through the above arrangement, since the glass is a non-crystalline structure, the influence on the polarization characteristics of the laser can be reduced, thereby avoiding affecting the normal light emission of the light source 7. At the same time, the cost of the glass sheet is less than that of the sapphire cover plate 30, thereby reducing the cost of the entire light-emitting device 10.

[0103] In the implementation mode where the light-transmitting sheet 21 includes a glass sheet, the glass sheet can be welded to the metal cover by using glass powder as solder. Since the glass powder and the glass sheet are made of the same material, the glass sheet can be prevented from being broken when welded with metal solder.

[0104] Please refer to Figure 7 In some embodiments, a first anti-reflection film (not shown) may be further provided on the side of the light-transmitting sheet 21 facing the cavity. The first anti-reflection film may reduce or eliminate the reflected light of the laser emitted by the light source 7 on the light-transmitting sheet 21, increase the light transmittance of the light-transmitting sheet 21, and reduce or eliminate the stray light from the cavity toward the light-transmitting sheet 21, so as to increase the intensity of the light source 7 entering the light-transmitting sheet 21.

[0105] In the implementation mode where the light-transmitting sheet 21 is a glass sheet, the first anti-reflection film is made of a material having a refractive index between that of glass and air. When light is incident on the first anti-reflection film, the first anti-reflection film can reduce the reflected light reflected back to the sealed cavity, and it can be considered that the first anti-reflection film increases the light incident on the light-transmitting sheet 21 to achieve the anti-reflection effect. In the above implementation mode, a plurality of first anti-reflection films can be provided, and the plurality of first anti-reflection films can further increase the light incident on the light-transmitting sheet 21, wherein the refractive index of each first anti-reflection film is between the refractive indexes of the two adjacent first anti-reflection films.

[0106] Continue to refer to Figure 7 In some embodiments, a second anti-reflection film (not shown) may be provided on the side of the light-transmitting sheet 21 facing away from the cavity. The second anti-reflection film may reduce or eliminate the reflected light from the light-transmitting sheet 21 that is emitted to the outside of the light-emitting device 10 , thereby increasing the light transmittance of the light-transmitting sheet 21 .

[0107] In the implementation mode where the light-transmitting sheet 21 is a glass sheet, the second anti-reflection film is made of a material with a refractive index between glass and air. The anti-reflection principle of the second anti-reflection film is the same as that of the first anti-reflection film, and will not be described again. In the above implementation mode, multiple second anti-reflection films can also be provided, and multiple second anti-reflection films can further increase the light incident on the light-transmitting sheet 21, wherein the refractive index of each second anti-reflection film is between the refractive indexes of the two adjacent second anti-reflection films.

[0108] Continue to refer to Figure 7In some embodiments, the light-transmitting sheet 21 covers the light outlet 24, and the light outlet 24 is disposed on the top plate 23. That is, the edge of the light-transmitting sheet 21 is connected to the top plate 23, and the top plate 23 includes a bending portion 34, which is disposed around the light outlet 24. Taking the implementation method in which the projection of the light outlet 24 on the base 11 is circular as an example, the extension direction of the groove formed by the bending portion 34 is always perpendicular to the radial direction of the light outlet 24.

[0109] Through the above arrangement, during the process of sealing the light-transmitting sheet 21 and the top plate 23, the bent portion 34 can release the stress generated by the connection by deforming itself, thereby preventing the stress from damaging the light-transmitting sheet 21, thereby reducing the influence of the light-transmitting sheet 21 on the light path emitted by the light source 7, or preventing the light-transmitting sheet 21 from tilting, thereby causing air leakage between the light-transmitting sheet 21 and the top plate 23, and affecting the sealing of the light-emitting device 10. The direction of the stress may include a direction perpendicular to the center line of the light outlet 24.

[0110] In the above implementation, there are multiple bent portions 34. Taking the implementation in which the projection of the light outlet 24 on the base 11 is circular as an example, the distance between each bent portion 34 and the light outlet 24 is different, and each bent portion 34 can form a groove surrounding the axial direction of the light outlet 24, and the opening directions of the grooves formed by two adjacent bent portions 34 are opposite. In the cross section in the radial direction of the light outlet 24, the multiple bent portions 34 are wavy. Through the above arrangement, the multiple bent portions 34 can further increase the ability to release stress.

[0111] Please refer to Fig.16 The present application also provides a method for manufacturing a light emitting device, comprising:

[0112] S1: stamping to form a base and a sealing cover, wherein the sealing cover includes a metal cover.

[0113] Please refer to Figure 7 The sealing cover 20 includes a side plate 22 and a top plate 23 . The side plate 22 is arranged around the edge of the top plate 23 . The side plate 22 and the top plate 23 are arranged to form a cavity. The side plate 22 and the top plate 23 are connected.

[0114] In step S1, the base 11 and the metal cover are formed by stamping, which can improve the production efficiency of the base 11 and the metal cover, and the size of the base 11 and the metal cover can be adjusted according to the number of light sources 7 that need to be assembled in the light-emitting device 10, thereby improving the applicability of the light-emitting device 10.

[0115] S2: A light outlet is formed on the top plate.

[0116] In step S2 , the light outlet 24 may also be formed by stamping. Exemplarily, step S2 may be completed simultaneously with step S1 .

[0117] S3: Install the light source on the base and place it in the cavity.

[0118] In an implementation in which the light emitting device 10 includes a conductive structure 17 , step S3 may further include connecting the conductive structure 17 and the light source 7 via a gold wire.

[0119] S4: Cover the light-transmitting sheet on the light-outlet sheet, and connect the light-transmitting sheet and the top plate.

[0120] In step S4, the light-transmitting sheet 21 and the top plate 23 are connected to seal the light outlet 24. In the implementation mode where the light-transmitting sheet 21 is a glass sheet, the glass sheet can be welded to the top plate by using glass powder as solder. Since the glass powder and the glass sheet are made of the same material, the glass sheet can be prevented from being broken when welding with metal solder. Alternatively, the glass sheet and the top plate 23 can be directly sintered together at high temperature.

[0121] S5: Buckle the metal cover onto the base, and connect the side panel and the base.

[0122] Please refer to Figure 7 and Fig.12 In the implementation mode where the light-transmitting sheet 21 and the top plate 23 are connected by welding, step S4 before step S5 can prevent the high temperature generated during the welding process of the light-transmitting sheet 21 and the top plate 23 from affecting the light source 7 located on the base 11.

[0123] In an implementation of step S5, the metal cover further includes a connecting portion 27, which is disposed at one end of the side plate 22 away from the top plate 23, and extends to the outside of the cavity. A welding protrusion 28 is disposed on the surface of the connecting portion 27 facing the base 11;

[0124] Connecting the side plate 22 and the base 11 includes: connecting the base 11 and the connecting portion 27 by resistance welding, and the welding protrusion 28 forms a connecting layer connecting the base 11 and the connecting portion 27 during welding.

[0125] Through the above arrangement, the end of the welding protrusion 28 away from the connecting part 27 contacts the base 11 first. Compared with the connecting part 27 directly attached to the base 11, only one end of the welding protrusion 28 contacts the base 11, which reduces the contact area between the connecting part 27 and the base 11 and increases the resistance between the connecting part 27 and the base 11, thereby increasing the resistance heat generated during resistance welding. The increase in resistance heat can increase the efficiency of the welding protrusion 28 in forming a connecting layer and improve the stability of the connecting layer connecting the base 11 and the connecting part 27.

[0126] In another implementation of step S5, the metal cover also includes a connecting portion 27, which is arranged at one end of the side plate 22 away from the top plate 23, and the connecting portion 27 extends to the outside of the cavity. Connecting the side plate 22 and the base 11 includes: connecting the base 11 and the connecting portion 27 by laser welding.

[0127] Through the above-mentioned arrangement, after the connecting portion 27 contacts the base 11, the connecting portion 27 is irradiated with a continuous laser or a pulsed laser to weld the connecting portion 27 and the base 11 together. Since the laser welding technology can adjust the heat of the welding area to the minimum required amount, the heat generated during the welding process between the sealing cover and the base 11 is reduced and transferred to the light source 7 located on the base 11, thereby reducing the influence of the high temperature generated by the light-emitting device 10 during the packaging process on the light source 7, thereby improving the yield rate of the production of the light-emitting device 10.

[0128] The embodiment of the present application provides a method for manufacturing a light-emitting device, in which the sealing cover 20 is a metal cover, and the method of stamping the base 11 and the metal cover can improve the production efficiency of manufacturing the base 11 and the metal cover. The sealing cover 20 includes a side panel 22 and a top panel 23. During the stamping process, a light outlet 24 is stamped on the top panel 23 to allow light emitted by the light source 7 to emit. The side panel 22 and the top panel 23 are enclosed to form a cavity, the light source 7 is installed on the base 11, and the light-transmitting sheet 21 is covered on the light outlet 24, the light-transmitting sheet 21 and the top panel 23 are connected to seal the light outlet 24, the metal cover is buckled on the base 11, and the side panel 22 and the base 11 are connected so that the light source 7 is located in the cavity, and the light-transmitting sheet 21, the top panel 23, the side panel 22, and the base 11 form a completely sealed cavity, which improves the sealing of the light-emitting device 10. The cavity can prevent external impurities such as water and dust from contacting the light source to avoid affecting the light emission of the light source 7.

[0129] It should be noted that in the description of the embodiments of the present application, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or an integral connection; it can also be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0130] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A light emitting device, characterized in that: include: Base; A light source, wherein the light source is located on the base; A sealing cover, the sealing cover comprises a side plate and a top plate, the side plate is arranged around the edge of the top plate, the side plate is connected to the top plate, the side plate and the top plate are arranged to form a cavity, the light source is located in the cavity; one end of the side plate away from the top plate is sealed and connected to the base, the base is used to close the cavity, and a light outlet is arranged on the top plate; A light-transmitting sheet covers the light outlet, and the light-transmitting sheet is sealed and connected to the top plate.

2. The light emitting device according to claim 1, characterized in that: The sealing cover also includes a connecting portion, which is arranged at an end of the side plate away from the top plate, extends to the outside of the cavity, covers the base, and is sealed and connected to the base.

3. The light emitting device according to claim 2, characterized in that: The sealing cover comprises a metal cover, and the connecting portion is welded to the base.

4. The light emitting device according to claim 3, characterized in that: A welding protrusion is arranged on the surface of the connecting portion facing the base, and the welding protrusion is used to form a connecting layer connecting the base and the connecting portion during welding.

5. The light emitting device according to any one of claims 1 to 4, characterized in that: The side plate and the top plate are an integrated structure.

6. The light emitting device according to any one of claims 1 to 5, characterized in that: The light-transmitting sheet comprises a glass sheet, the sealing cover comprises a metal cover, and the light-transmitting sheet is welded to the metal cover.

7. The light emitting device according to claim 6, characterized in that: The top plate includes a bending portion, which is arranged around the light outlet, and the bending portion is used to release stress along a direction perpendicular to the center line of the light outlet.

8. The light emitting device according to claim 7, characterized in that: There are a plurality of bending portions, and the distances between each bending portion and the light outlet are different.

9. The light emitting device according to any one of claims 1 to 8, characterized in that: A first anti-reflection film is disposed on a side of the light-transmitting sheet facing the cavity.

10. The light emitting device according to any one of claims 1 to 9, characterized in that: A second anti-reflection film is disposed on a side of the light-transmitting sheet facing away from the cavity.

11. The light emitting device according to any one of claims 1 to 10, characterized in that: The light emitting device further comprises a collimating lens, and the collimating lens is arranged on the light emitting side of the light transmitting sheet.

12. The light emitting device according to any one of claims 1 to 11, characterized in that: The base includes a bottom plate and a heat conducting plate. The bottom plate is provided with a heat conducting hole. The heat conducting plate is arranged in the heat conducting hole. The light source is arranged on the heat conducting plate. The heat conducting plate is used to be attached to the circuit board.

13. The light emitting device according to any one of claims 1 to 12, characterized in that: The light emitting device further comprises a reflector, which is arranged on the base and is used for reflecting the light emitted by the light source toward the light outlet.

14. A light emitting module, characterized in that: The invention comprises a circuit board and a light-emitting device as claimed in any one of claims 1 to 13, wherein the light-emitting device is electrically connected to the circuit board.

15. The light emitting module according to claim 14, characterized in that: The base is attached to the circuit board, the circuit board is provided with a heat dissipation hole, a heat dissipation block is provided in the heat dissipation hole, and at least a part of the base is in contact with the heat dissipation block.

16. An electronic device, characterized in that: It comprises a controller and a light-emitting module as claimed in claim 14 or 15, wherein the controller is electrically connected to the light-emitting module.

17. A method for manufacturing a light emitting device, characterized in that: include: The base and the sealing cover are formed by stamping, wherein the sealing cover comprises a metal cover; the sealing cover comprises a side plate and a top plate, wherein the side plate is arranged around the edge of the top plate, the side plate and the top plate are arranged to form a cavity, and the side plate is connected to the top plate; forming a light outlet on the top plate; Mounting a light source on the base and locating the light source in the cavity; Covering the light-transmitting sheet on the light-exiting sheet, and connecting the light-transmitting sheet and the top plate; The metal cover is buckled on the base to connect the side plate and the base.

18. The method for manufacturing a light emitting device according to claim 17, characterized in that: The metal cover further comprises a connecting portion, the connecting portion is arranged at one end of the side plate away from the top plate, the connecting portion extends to the outside of the cavity, and a welding protrusion is arranged on the surface of the connecting portion facing the base; Connecting the side plate and the base includes: connecting the base and the connecting portion by resistance welding, and the welding protrusion forms a connecting layer connecting the base and the connecting portion during welding.

19. The method for manufacturing a light emitting device according to claim 17, characterized in that: The metal cover also includes a connecting portion, which is arranged at an end of the side plate away from the top plate, and extends to the outside of the cavity. Connecting the side plate and the base includes: connecting the base and the connecting portion by laser welding.

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