TEC semiconductor-based temperature control method, device and equipment

Through the combination of distributed temperature acquisition, Gaussian hybrid model anomaly detection, virtual control network and mixed integer linear programming model, the data processing load and convergence problems of TEC temperature control system in large-scale scenarios are solved, and high accuracy and reliability temperature control is achieved.

CN119645160AInactive Publication Date: 2025-03-18深圳联钜自控科技有限公司
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Patent Information

Application Number
CN202510166845.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-02-14
Publication Date
2025-03-18
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

The existing TEC temperature control system has problems such as data processing overhead and calculation load significantly improved in large-scale temperature control scenarios, and faces convergence problems in low-temperature fluctuations. It lacks an effective multi-TEC collaborative control framework, resulting in a decrease in temperature stability.

Method used

Through distributed temperature acquisition and preprocessing, the temperature correlation matrix is ​​calculated, the Gaussian hybrid model is used for temperature anomaly detection, the temperature influence range of the TEC controller is divided, the virtual control network is built, the mixed integer linear planning model is used for global temperature optimization, the TEC control parameters are calculated, and the temperature dynamic prediction model is robustly optimized.

Benefits of technology

The reasonable allocation of control resources is achieved, the mutual interference between TEC controllers is reduced, the accuracy and reliability of temperature control is improved, and the anti-interference ability and control stability of the system are enhanced.

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Abstract

The invention relates to the technical field of TEC semiconductors, and discloses a temperature control method, device and equipment based on a TEC semiconductor, and the method comprises the steps: carrying out the distributed temperature collection and preprocessing of a region to be subjected to temperature control, and obtaining a temperature correlation matrix; performing temperature anomaly detection to obtain a temperature anomaly feature matrix; calculating a temperature influence range of the TEC controller, and mapping the control group to a virtual control network; performing global temperature optimization to obtain a global optimal control variable, and dividing the global optimal control variable into local control instructions according to control groups; a temperature control cost function is constructed, and TEC control parameters are obtained through gradient iteration optimization calculation; and TEC control parameters are input into the temperature dynamic prediction model, robust optimization is carried out in a rolling prediction interval to obtain a local optimal control sequence, and temperature closed-loop control is executed. According to the invention, reasonable distribution of control resources is realized, mutual interference among TEC controllers is reduced, and accuracy and reliability of temperature control are ensured.
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