Lining and semiconductor processing chamber

Abstract

The invention provides a lining which comprises a lining body and at least one grounding structure arranged on the lining body, the grounding structure comprises a grounding main body, a connecting part and a grounding part, the grounding main body is strip-shaped, the grounding main body and the lower end of the lining body are arranged at an interval, the connecting part is arranged at at least one end of the grounding main body in the extension direction, and the grounding part is arranged at the lower end of the lining body. The connecting part is connected with the lower end of the lining body and is electrically conducted; the grounding part and the connecting part are arranged at an interval along the extension direction of the grounding main body; the grounding part is used for being fixedly connected with a grounding piece in use and is electrically conducted. The invention also provides a semiconductor processing chamber.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing, and in particular to a liner and a semiconductor processing chamber. Background Art

[0002] With the development of semiconductor process technology, a variety of semiconductor processing equipment is widely used in semiconductor processes. Plasma etching or deposition is a key step in the semiconductor process, and plasma equipment has been used in major semiconductor process production lines. The working principle of plasma etching or deposition is to pass the process gas into the vacuum chamber, and dissociate, excite, and ionize the process gas by electrical or optical excitation. The ionized free radicals or ions are accelerated to the wafer surface through free diffusion or field acceleration and interact with the wafer material to perform corresponding etching and deposition.

[0003] In order to obtain an environment with smooth airflow and protect the inner wall of the semiconductor processing chamber from being directly bombarded by plasma, a liner is generally installed on the side wall of the semiconductor processing chamber. The liner can limit and shield the distribution of plasma and is crucial to the process parameters. Among them, the grounding performance of the liner directly affects the stability of the RF circuit, and the stability of the RF circuit plays a decisive role in the stability of the plasma.

[0004] The liner in the prior art usually has problems such as poor contact at the lower end and discontinuity of the RF circuit due to the use of a split liner, which not only causes instability and discontinuity of the RF circuit, but also requires a high maintenance frequency. Summary of the invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a liner and a semiconductor processing chamber, which can solve the problems in the prior art such as poor contact at the lower end of the liner and discontinuity of the RF circuit due to the use of a split liner.

[0006] To achieve the purpose of the present invention, a liner is provided, comprising a liner body and at least one grounding structure arranged on the liner body, wherein the grounding structure comprises a grounding body, a connecting portion and a grounding portion, wherein the grounding body is in a strip shape, and the grounding body is spaced apart from the lower end of the liner body, and the connecting portion is arranged at least at one end of the grounding body in its extension direction, and the connecting portion is connected to the lower end of the liner body and is electrically conductive;

[0007] The grounding portion and the connecting portion are arranged at intervals along the extending direction of the grounding body; when in use, the grounding portion is used to be fixedly connected to the grounding piece and electrically conductive.

[0008] In some embodiments, the connecting portion is disposed at both ends of the grounding body in its extending direction; and the grounding portion is located between the two ends of the grounding body.

[0009] In some embodiments, the grounding body is provided with the connecting portion at one end in the extending direction thereof, and the grounding body is provided with the grounding portion at the other end in the extending direction thereof.

[0010] In some embodiments, the connecting portion is integrally connected to or hinged to the lining body; and / or,

[0011] The connecting portion is integrally connected to or hingedly connected to the grounding body.

[0012] In some embodiments, an extension direction of the grounding body is parallel to a circumferential direction of the lining body.

[0013] In some embodiments, a flange base is disposed at the lower end of the lining body, the flange base is annular, and protrudes toward the axis of the lining body relative to the inner circumferential surface of the lining body;

[0014] The flange base has a boss formed on one side of the inner circumference, the grounding body is spaced apart from the lower surface of the boss, is located inside the inner circumference of the flange base, and is spaced apart from the inner circumference of the flange base; the connecting portion is connected to the lower surface of the boss and is electrically conductive.

[0015] In some embodiments, the connecting portion is a first protrusion formed on the lower surface of the boss, and at least one end of the grounding body is integrally connected to a side surface of the first protrusion.

[0016] In some embodiments, the grounding portion is a second protrusion formed on the lower surface of the grounding body, and the lower surface of the second protrusion is used to electrically contact the grounding member.

[0017] In some embodiments, the grounding body and the second protrusion are correspondingly provided with through holes penetrating in the vertical direction;

[0018] The grounding structure further includes a fastener, which is used to penetrate the through hole when in use, and to fix the grounding body and the second protrusion to the grounding member.

[0019] In some embodiments, the liner further comprises a conductive ring, which is disposed below the liner body and is used to be fixedly connected to the grounding member and electrically conductive when in use;

[0020] The conductive ring is used to support the second protrusion, and a threaded hole is provided on the upper surface of the conductive ring. The threaded hole is provided corresponding to the through hole, and the fastener is threadedly connected to the threaded hole.

[0021] In some embodiments, at least one electromagnetic coil is disposed between the upper surface of the conductive ring and the lower surface of the second protrusion.

[0022] In some embodiments, the grounding structure is multiple and is distributed along the circumference of the liner body at intervals.

[0023] As another technical solution, the present invention also provides a semiconductor processing chamber, comprising a chamber body and a chuck disposed in the chamber body, the chuck being used to carry a wafer; and further comprising the above-mentioned liner provided by the present invention, the liner body being disposed around the inner side of the chamber body, and the upper end of the liner body being connected to the chamber body and electrically conductive;

[0024] The chuck is provided with the grounding member.

[0025] The present invention has the following beneficial effects:

[0026] The lining provided by the present invention has an integral lining body with no disconnection in the middle, so that it can be ensured that there is no potential difference between the upper and lower ends of the lining body when in use, so that the voltage distribution on the lining body can be uniform, and the problem of discontinuity of the RF loop can be avoided. On this basis, at least one grounding structure is provided on the lining body, in which the grounding body is in a strip shape and is spaced apart from the lower end of the lining body, and a connecting portion is provided at least at one end of the grounding body in its extension direction, and the connecting portion is connected to the lower end of the lining body; the grounding portion and the connecting portion are spaced apart along the extension direction of the grounding body; the grounding portion is used to be fixedly connected to the grounding piece when in use, and is electrically conductive. The lining body can be electrically conductive with the grounding piece through the connecting portion, the grounding body and the grounding portion in sequence, thereby realizing grounding of the lining body. Moreover, by making the grounding body in a strip shape, and the grounding part and the connecting part are spaced apart along the extension direction of the grounding body, when the lining body expands due to heat or contracts due to cold, the connecting part will expand and contract along the axial direction of the lining body with the lining body, while the grounding part is fixedly connected to the grounding piece and remains stationary. In this case, the strip-shaped grounding body can produce elastic deformation to release the deformation internal stress brought by the lining body, avoiding damage due to frequent deformation, while ensuring that the connecting part remains connected to the lining body, and the grounding part remains connected to the grounding piece, thereby ensuring that the lining is always fully grounded during the temperature alternation process, improving the connection reliability and safety, ensuring the grounding performance of the lining, and having a longer service life, and not prone to poor contact, thereby reducing the frequency of lining maintenance.

[0027] The semiconductor processing chamber provided by the present invention can avoid the problem of discontinuity of the RF circuit and avoid damage due to frequent deformation by adopting the above-mentioned lining provided by the present invention. At the same time, it can ensure that the lining is always fully grounded during the temperature alternation process, improve the connection reliability and safety, ensure the grounding performance of the lining, and have a longer service life. It is not easy to have poor contact, thereby reducing the maintenance frequency of the lining. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a lining structure diagram of related technology 1;

[0029] Figure 2 A structural diagram of a flexible connector of related art 1;

[0030] Figure 3 A partial structural diagram of a liner of related art 2 installed in a semiconductor processing chamber;

[0031] Figure 4 A cross-sectional schematic diagram of a semiconductor processing chamber provided by an embodiment of the present invention;

[0032] Figure 5 A partial structural diagram of a liner provided by an embodiment of the present invention at a viewing angle;

[0033] Figure 6 A partial cross-sectional view of a liner provided by an embodiment of the present invention;

[0034] Figure 7 A partial structural diagram of the liner provided by an embodiment of the present invention at another viewing angle;

[0035] Figure 8 A partial cross-sectional view of the liner provided in an embodiment of the present invention at the grounding structure;

[0036] Fig. 9 A schematic diagram of a grounding structure used in an embodiment of the present invention;

[0037] Fig.10 A schematic diagram of another grounding structure used in an embodiment of the present invention;

[0038] Fig.11 A structural diagram of a conductive ring used in an embodiment of the present invention;

[0039] Fig.12 for Fig.11 Magnified view of region I. DETAILED DESCRIPTION

[0040] In order to enable those skilled in the art to better understand the technical solution of the present invention, the liner and the semiconductor processing chamber provided by the present invention are described in detail below with reference to the accompanying drawings.

[0041] In the related art 1, in order to realize the grounding of the lower end of the liner, as Figure 1 As shown, a plurality of flexible connectors 02 are arranged at the lower end of the liner 01, and the plurality of flexible connectors 02 are evenly distributed along the circumference of the liner 01, as shown in FIG. Figure 2 As shown, each flexible connector 02 includes an upper connector 021, a lower connector 022 and a curved structure 023 connected therebetween, wherein the upper contact surface 021a of the upper connector 021 is connected to the lower end of the liner and is in electrical contact; the side contact surface 022a of the lower connector 022 is connected to the side of a grounding member (e.g., an interface plate of a chuck) and is in electrical contact. The upper connector 021 and the lower connector 022 are electrically connected through the curved structure 023, which includes two curved metal sheets arranged opposite to each other in a horizontal direction, and the middle portion of each metal sheet protrudes in a direction away from the other metal sheet relative to the upper and lower edge portions. The flexible connector 02 can achieve a flexible connection between the liner 01 and the grounding member 02. However, the curved structure 023 will generate eddy currents due to bending when power is applied, thereby generating an induced magnetic field, which affects the stability of the lower electrode loop. Moreover, if the metal sheet is in a high temperature environment (for example, around 120°C) for a long time, it is easy to age and lose its elasticity, which not only affects the service life of the flexible connector 02, but also easily leads to poor contact, which in turn leads to a high frequency of maintenance of the lining and difficult to troubleshoot the problem.

[0042] In the related art 2, in order to realize that both the upper and lower ends of the liner are grounded, as Figure 3 As shown, the liner 04 includes an upper liner 041 and a lower liner 042, the upper end 041a of the upper liner 041 is connected to the chamber wall 06 and is electrically conductive, and the lower end 042b of the lower liner 042 is connected to the grounding member (such as the interface plate 051 of the chuck 05) and is electrically conductive. A disconnect opening is formed between the lower end 041b of the upper liner 041 and the upper end 042a of the lower liner 042. Although it is possible to achieve grounding of both the upper and lower ends of the liner 04, the related art 2 uses a split liner, which will cause the RF circuit to be discontinuous, thereby affecting the stability of the RF circuit, and further affecting the stability of the plasma.

[0043] In order to solve the problem of the above-mentioned related technology 2, in this embodiment, the lining body adopts an integral structure with no disconnected surface in the middle, so as to ensure that there is no potential difference between the upper and lower ends of the lining body during use, so that the voltage on the lining body can be evenly distributed, thereby avoiding the problem of discontinuity of the RF circuit.

[0044] In order to solve the problem of the above-mentioned related technology, please refer to Figure 4The embodiment of the present invention provides a liner 200, which includes a liner body 210 and at least one grounding structure 220 disposed on the liner body 210, and the grounding structure 220 is used to ground the lower end of the liner body 210. In some embodiments, in order to improve the uniformity of voltage distribution of the liner body 210, there are multiple grounding structures 220, which are distributed at intervals along the circumference of the liner body 210.

[0045] Specifically, the liner body 210 is annular and is disposed on the inner side of the side wall of the chamber body 101 of the semiconductor processing chamber 100 when in use, and is used to limit and shield the distribution of plasma, protect the inner wall of the chamber body 101 of the semiconductor processing chamber 100, and prevent it from being directly bombarded by plasma. In this embodiment, the liner body 210 adopts an integral structure with no disconnection surface in the middle, so that it can be ensured that there is no potential difference between the upper and lower ends of the liner body 210 when in use, so that the voltage on the liner body 210 can be evenly distributed, thereby avoiding the problem of discontinuity of the RF circuit.

[0046] In some embodiments, in order to ensure that there is no potential difference between the upper end and the lower end of the liner body 210, when in use, the upper end of the liner body 210 is grounded, for example, through the side wall of the chamber body 101 of the semiconductor processing chamber 100, and the lower end of the liner body 210 is grounded through at least one grounding structure 220. The upper end of the liner body 210 is connected to the side wall of the chamber body 101 of the semiconductor processing chamber 100, and the electrical conduction is, for example, that the upper end of the liner body 210 is provided with an annular flange 211 protruding relative to the outer peripheral surface of the liner body 210, and the annular flange 211 overlaps the upper end surface of the side wall of the chamber body 101 when in use, and the annular flange 211 is fixedly connected to the side wall of the chamber body 101 by a fastener (not shown in the figure). The side wall of the semiconductor processing chamber 100 is grounded, thereby achieving the grounding of the upper end of the liner body 210. Further, in some embodiments, a receiving groove (not shown in the figure) is provided on the lower surface of the annular flange 211 or the upper end surface of the side wall of the chamber body 101, and an induction coil (not shown in the figure) is installed in the receiving groove, and the induction coil is used to strengthen the electrical contact effect between the lower surface of the annular flange 211 and the upper end surface of the side wall of the chamber body 101. The induction coil includes, for example, an elastic spiral tube. In addition, a sealing ring (not shown in the figure) is also provided between the lower surface of the annular flange 211 and the upper end surface of the side wall of the chamber body 101 to seal the gap between the two to achieve the sealing of the semiconductor processing chamber 100. When the interior of the chamber body 101 switches between the atmospheric state and the vacuum state, the sealing ring will be deformed, and the deformation will directly act on the liner body 210 and be absorbed by the liner body 210.

[0047] It should be noted that in actual applications, according to specific needs, the upper end of the lining body 210 may not be provided with a structure for connecting to the side wall of the chamber body 101 of the semiconductor processing chamber 100, that is, the upper end of the lining body 210 is grounded through other components when in use, or is not grounded, and the embodiment of the present invention has no limitation to this.

[0048] Please also read Figures 5 to 8 The grounding structure 220 includes a grounding body 221, a connecting portion 222 and a grounding portion 223, wherein the grounding body 221 is strip-shaped and is spaced apart from the lower end of the lining body 210. In some embodiments, the strip-shaped grounding body 221 can extend in a straight line direction, which is, for example, parallel to the tangent direction of the circumference of the lining body 210; or Figures 5 to 8 As shown, it can also extend along an arc direction, and the arc direction is, for example, parallel to the circumferential direction of the lining body 210. The above-mentioned straight line direction and arc direction can be parallel to the horizontal plane, or form a certain angle with the horizontal plane.

[0049] It should be noted that the strip-shaped grounding body 221 means that the size of the grounding body 221 in the extension direction is significantly larger than the cross-sectional size of the grounding body 221 perpendicular to its extension direction. In some embodiments, the cross-sectional shape of the grounding body 221 perpendicular to its extension direction includes a rectangle or a square, and the size of the strip-shaped grounding body 221 in the extension direction is significantly larger than the side length of the rectangle or the square. Alternatively, the cross-sectional shape of the grounding body 221 perpendicular to its extension direction may also include a circle or an ellipse, and the size of the strip-shaped grounding body 221 in the extension direction is significantly larger than the diameter of the circle or the major axis and minor axis of the ellipse. In a specific example, the cross-sectional shape of the grounding body 221 perpendicular to its extension direction is a rectangle, and the width direction of the rectangle is parallel to the axial direction of the lining body 210, which is conducive to the grounding body 221 being more easily elastically deformed in the axial direction of the lining body 210.

[0050] The grounding body 221 is provided with a connecting portion 222 at at least one end thereof in the extending direction, and the connecting portion 222 is connected to the lower end of the lining body 210 and is electrically conductive. In an embodiment where the grounding structure 220 is provided with a plurality of Figure 5 and Figure 6 As shown, the adjacent ends of each two adjacent grounding structures 220 may share a connecting portion 222 . In other words, the connecting portions 222 disposed at the adjacent ends of each two adjacent grounding structures 220 are connected as one body.

[0051] The grounding portion 223 and the connecting portion 222 are spaced apart from each other along the extending direction of the grounding body 221; the grounding portion 223 is used to connect with the grounding member 102 (eg Figure 4The grounding plate 102 of the chuck shown is fixedly connected and electrically connected. In this way, the lining body 210 can be electrically connected to the grounding piece 102 through the connecting portion 222, the grounding body 221 and the grounding portion 223 in sequence, thereby achieving the grounding of the lining body 210. Moreover, by making the grounding body 221 strip-shaped, and the grounding portion 223 and the connecting portion 222 spaced apart along the extension direction of the grounding body 221, when the lining body 210 expands due to heat or contracts due to cold, the connecting portion 222 will expand and contract along the axial direction of the lining body 210 along with the lining body 210, while the grounding portion 223 is fixedly connected to the grounding piece 102 and remains stationary. In this case, the strip-shaped grounding body 221 can produce elastic deformation to release the deformation internal stress brought by the lining body 210, avoiding its damage due to frequent deformation, while ensuring that the connecting portion 222 remains connected to the lining body 210, and the grounding portion 223 remains connected to the grounding piece 102, thereby ensuring that the lining 200 is always fully grounded during the temperature alternation process, improving the connection reliability and safety, and ensuring the grounding performance of the lining 200.

[0052] Compared with the prior art 1, the grounding body 221 used in the embodiment of the present invention is in a strip shape, which will not generate eddy current when powered on, and thus will not affect the stability of the lower electrode loop. Moreover, under the condition of ensuring that elastic deformation can be generated, the strip-shaped grounding body 221 is thicker than a metal sheet and is not easy to age in a high temperature environment, so that the service life is longer and poor contact is not likely to occur, thereby reducing the maintenance frequency of the liner 200.

[0053] The liner 200 provided in the embodiment of the present invention adopts an integral structure with no disconnection in the middle, so that it can be ensured that there is no potential difference between the upper end and the lower end of the liner body 210 when in use, so that the voltage distribution on the liner body 210 can be uniform, thereby avoiding the problem of discontinuity of the RF circuit. On this basis, it can also ensure that the liner 200 is always fully grounded during the temperature alternation process, improve the connection reliability and safety, ensure the grounding performance of the liner 200, and have a longer service life, and it is not easy to have poor contact, thereby reducing the maintenance frequency of the liner 200.

[0054] In some embodiments, the grounding body 221 is provided with connecting parts 222 at both ends of the grounding body 221 in its extension direction; the grounding part 223 is located between the two ends of the grounding body 221. In this way, the strip-shaped grounding body 221 and the connecting parts 222 at both ends constitute a suspended bridge structure as a whole. Fig. 9 As shown, when the lining body 210 is in the initial state, the two ends of the grounding body 221 respectively connected to the two connecting parts 222 and the position connected to the grounding part 223 (for example, the middle position) are located at the same height position in the horizontal direction, that is, each position of the grounding body 221 in its extension direction is located at the same height position in the horizontal direction.

[0055] When the liner body 210 is heated and expanded (i.e. in a thermal expansion state), Fig. 9 As shown, since the upper end of the lining body 210 is fixed to the side wall of the semiconductor processing chamber 100, the lower end of the lining body 210 will expand and deform downward, driving the connecting parts 222 at both ends of the grounding body 221 to move downward. At the same time, the grounding part 223 is fixed due to its fixed connection with the grounding piece 102, and the position where the grounding body 221 is connected to the grounding part 223 remains unchanged. At this time, the two ends of the grounding body 221 move downward relative to the position where they are connected to the grounding part 223, so that the grounding body 221 will produce an elastic deformation of bending upward relative to the two ends at the position where it is connected to the grounding part 223, so as to release the deformation internal stress brought by the lining body 210.

[0056] When the liner body 210 is cold-shrunk (i.e., in a cold-shrunk state), Fig. 9 As shown, since the upper end of the lining body 210 is fixed to the side wall of the semiconductor processing chamber 100, the lower end of the lining body 210 will shrink and deform upward, driving the connecting parts 222 at both ends of the grounding body 221 to move upward. At the same time, the grounding part 223 is fixed due to its fixed connection with the grounding piece 102, and the position where the grounding body 221 is connected to the grounding part 223 remains unchanged. At this time, the two ends of the grounding body 221 move upward relative to the position where they are connected to the grounding part 223, so that the grounding body 221 will produce an elastic deformation of bending downward relative to the two ends at the position where it is connected to the grounding part 223, so as to release the deformation internal stress brought by the lining body 210.

[0057] Furthermore, in some embodiments, the grounding portion 223 is located in the middle position between the two ends of the grounding body 221, that is, the distance between the grounding portion 223 and the two ends of the grounding body 221 is the same, so that the grounding body 221 can form a symmetrical structure, ensuring that the grounding body 221 is evenly stressed, thereby further improving the service life of the grounding body 221.

[0058] In other embodiments, the grounding body 221 is provided with a connecting portion 222 at one end in the extending direction, and the grounding body 221 is provided with a grounding portion 223 at the other end in the extending direction. In this way, the end of the grounding body 221 connected to the grounding portion 223 is a stationary end, and the other end connected to the connecting portion 222 is a moving end. Fig.10 As shown, when the lining body 210 is in the initial state, the movable end of the grounding body 221 connected to the connecting part 222 and the stationary end connected to the grounding part 223 are located at the same height position in the horizontal direction, that is, each position of the grounding body 221 in its extension direction is located at the same height position in the horizontal direction.

[0059] When the liner body 210 is heated and expanded (i.e. in a thermal expansion state), Fig.10 As shown, since the upper end of the lining body 210 is fixed to the side wall of the semiconductor processing chamber 100, the lower end of the lining body 210 will expand and deform downward, driving the connecting portion 222 to move downward. At the same time, the grounding portion 223 is fixed due to its fixed connection with the grounding piece 102, and the moving end of the grounding body 221 connected to the connecting portion 222 moves downward, while the stationary end of the grounding body 221 connected to the grounding portion 223 maintains its original position, so that the stationary end of the grounding body 221 connected to the grounding portion 223 will produce an elastic deformation to bend upward relative to the moving end to release the deformation internal stress brought by the lining body 210.

[0060] When the liner body 210 is cold-shrunk (i.e., in a cold-shrunk state), Fig.10 As shown, since the upper end of the lining body 210 is fixed to the side wall of the semiconductor processing chamber 100, the lower end of the lining body 210 will shrink and deform upward, driving the connecting portion 222 to move upward. At the same time, the grounding portion 223 is fixed due to its fixed connection with the grounding piece 102, and the moving end of the grounding body 221 connected to the connecting portion 222 moves upward, while the stationary end of the grounding body 221 connected to the grounding portion 223 maintains its original position, so that the stationary end of the grounding body 221 connected to the grounding portion 223 will produce an elastic deformation to bend downward relative to the moving end to release the deformation internal stress brought by the lining body 210.

[0061] From the above, it can be seen that when the lining body 210 expands due to heat or contracts due to cold, the strip-shaped grounding body 221 can produce elastic deformation to release the deformation internal stress brought by the lining body 210, avoiding its damage due to frequent deformation, while ensuring that the connecting part 222 remains connected to the lining body 210, and the grounding part 223 remains connected to the grounding piece 102, thereby ensuring that the lining 200 is always fully grounded during the temperature alternation process, improving the connection reliability and safety, and ensuring the grounding performance of the lining 200.

[0062] There are many ways to connect the connection part 222 to the lining body 210. In some embodiments, the connection part 222 is connected to the lining body 210 as a whole, that is, the connection part 222 is a part of the lining body 210, which can not only improve the stability and reliability of the connection between the connection part 222 and the lining body 210, but also make processing more convenient. In other embodiments, the connection part 222 is hinged to the lining body 210, so that when the lining body 210 expands due to heat or contracts due to cold, the connection part 222 can move with the lining body 210 while being able to rotate relative to the lining body 210, thereby further improving the stability and reliability of the connection between the connection part 222 and the lining body 210.

[0063] There are many ways to connect the connecting portion 222 to the grounding body 221. In some embodiments, the connecting portion 222 and the grounding body 221 are connected as one body, which not only improves the stability and reliability of the connection between the connecting portion 222 and the grounding body 221, but also makes processing more convenient. Preferably, the connecting portion 222 and the grounding body 221 are connected as one body, and the connecting portion 222 and the lining body 210 are connected as one body, so that the connecting portion 222 and the grounding body 221 are both part of the lining body 210, which makes processing more convenient. In other embodiments, the connecting portion 222 and the grounding body 221 are hinged, so that when the lining body 210 expands due to heat or contracts due to cold, the connecting portion 222 can move with the lining body 210 while being able to rotate relative to the grounding body 221, thereby further improving the stability and reliability of the connection between the connecting portion 222 and the lining body 210.

[0064] In some embodiments, in order to further improve the connection stability and reliability between the grounding structure 220 and the liner body 210, a flange base 230 is provided at the lower end of the liner body 210. The flange base 230 is annular and protrudes toward the axis of the liner body 210 relative to the inner circumference of the liner body 210; the flange base 230 is formed with a boss 231 on one side of the inner circumference, and the grounding body 221 is spaced apart from the lower surface of the boss 231, and is located on the inner side of the inner circumference of the flange base 230, and is spaced apart from the inner circumference of the flange base 230; Figures 6 to 8 As shown, there is a first interval A between the grounding body 221 and the boss 231, and a second interval B between the grounding body 221 and the inner circumference of the flange base 230. The first interval A and the second interval B are used to provide space for the elastic deformation of the grounding body 221, and at the same time make the grounding body 221 in an independent suspended bridge state to prevent other components from hindering the elastic deformation of the grounding body 221.

[0065] The connecting portion 222 is connected to the lower surface of the boss 231 and is electrically conductive. The flange base 230 provides a mounting base for at least one grounding structure 220. The boss 231 is used to connect with the connecting portion 222. The boss 231 increases the radial dimension of the lower end of the lining body 210, thereby facilitating the processing and installation of the grounding structure 220, and can increase the strength of the lower end of the lining body 210, further improving the stability and reliability of the connection between the lining body 210 and the grounding structure 220. Furthermore, in some embodiments, the flange base 230, the boss 231 and the lining body 210 are all integrally formed.

[0066] In some embodiments, the connection portion 222 is a first protrusion formed on the lower surface of the boss 231, and at least one end of the grounding body 221 along its extension direction is connected to the side surface of the first protrusion as a whole. That is, the connection portion 222 and the boss 231 are integrally formed, and the grounding body 221 and the first protrusion are integrally formed, so that not only the stability and reliability of the connection between the connection portion 222 and the grounding body 221 can be improved, but also the processing is more convenient, thereby simplifying the structure and reducing the cost.

[0067] In some embodiments, the grounding portion 223 is a second protrusion formed on the lower surface of the grounding body 221, and the lower surface of the second protrusion is used to electrically contact the grounding member 102. That is, the grounding portion 223 and the grounding body 221 are integrally formed, so that not only the stability and reliability of the connection between the grounding portion 223 and the grounding body 221 can be improved, but also the processing is more convenient, thereby simplifying the structure and reducing the cost. Further, in some embodiments, the lower surface of the second protrusion is nickel-plated to form a conductive layer that can enhance the conductive effect.

[0068] In a specific example, the flange base 230, the boss 231, the lining body 210, the first protrusion (i.e., the connecting portion 222) and the second protrusion (i.e., the grounding portion 223) are all integrally formed. In this way, the grounding structure 220 and the lining body 210 are an integral component, and the lower end of the lining 200 can be grounded without the need to set up other components, thereby improving the grounding stability and reliability of the lining 200. Moreover, the processing is convenient, and the specific processing method is, for example: before processing, the flange base 230 is a ring body protruding relative to the inner circumferential surface of the lining body 210, and a cutting edge 231b is arranged on the upper surface of the ring body, and the depth of the cutting edge 231b in the vertical direction is less than the thickness of the flange base 230 in the vertical direction (for example, about 10 mm), and one end of the cutting edge 231b in the radial direction of the flange base 230 is located on the inner circumferential surface of the flange base 230, and the depth of the cutting edge 231b in the radial direction of the flange base 230 is less than the width of the flange base 230 in its radial direction; then, a tool with a rectangular cross-section of 2mm×5mm is used to cut off the flange base 230 through the cutting edge 231b and rotate 20° along the circumference of the flange base 230, and the grooves formed after cutting constitute the above-mentioned first interval A and second interval B. Then, a milling cutter with a preset profile is used to remove a preset thickness (e.g., 4 mm) of a portion of the lower surface of the flange base 230, and the portion of the lower surface of the flange base 230 that is not removed forms a second convex portion (i.e., a grounding portion 223). The portion of the flange base 230 located below the first interval A and inside the second interval B is the grounding body 221. The portion of the flange base 230 located above the first interval A and the second interval B is the boss 231. The portion of the flange base 230 located between two adjacent first intervals A is the connecting portion 222.

[0069] In some embodiments, Figure 6 As shown, the grounding body 221 and the second protrusion (ie, the grounding portion 223) are correspondingly provided with a through hole 223a penetrating in the vertical direction; Figure 7 and Figure 8 As shown, the grounding structure 220 further includes a fastener 240, which is used to penetrate the through hole 223a when in use, and fix the grounding body 221 and the second protrusion (i.e., the grounding portion 223) to the grounding member 102. The fastener 240 can fix the grounding body 221, the second protrusion (i.e., the grounding portion 223) and the grounding member 102 together, and the fastener 240 is, for example, a fastening screw.

[0070] Furthermore, in some embodiments, Figure 7 and Figure 8 As shown, in order to facilitate the connection between the grounding structure 220 and the grounding member 102, the liner 200 also includes a conductive ring 250, which is arranged below the liner body 210. In an embodiment in which a flange base 230 is provided, in order to meet the deformation amount of the grounding body 221, the lower surface of the flange base 230 (i.e., the lower surface of the connecting portion 222) and the upper surface of the conductive ring 250 are spaced apart, and the spacing is, for example, about 4 mm.

[0071] The conductive ring 250 is used to be fixedly connected to the grounding member 102 and electrically connected when in use; the grounding member 102 is, for example, a chuck for carrying a wafer disposed in the semiconductor processing chamber 100. Fig.11 and Fig.12 As shown, the conductive ring 250 is used to support the second protrusion (i.e., the grounding portion 223), and a threaded hole 252 is provided on the upper surface of the conductive ring 250, and the threaded hole 252 is provided corresponding to the through hole 223a, and the fastener 240 is threadedly connected with the threaded hole 252. The fastener 240 can fix the grounding body 221, the second protrusion (i.e., the grounding portion 223) and the conductive ring 250 together. Since the conductive ring 250 is fixed to the grounding member 102, the grounding body 221 and the second protrusion (i.e., the grounding portion 223) can be fixedly connected to the grounding member 102 through the conductive ring 250. The grounding member 102 is, for example, an interface disk of a chuck. In this case, the conductive ring 250 is provided at the edge area of ​​the upper surface of the interface disk. However, the embodiments of the present invention are not limited to this. In actual applications, the conductive ring 250 can also be applied to the case where the grounding member 102 is arranged in other components in the semiconductor processing chamber 100, or the conductive ring 250 can be omitted, and the second protrusion (i.e., the grounding portion 223) can be directly in electrical contact with the grounding member 102.

[0072] In some embodiments, in order to enhance the contact effect between the upper surface of the conductive ring 250 and the lower surface of the second protrusion (ie, the grounding portion 223), as shown in FIG. Fig.11 and Fig.12 As shown, at least one electromagnetic coil 251 is disposed between the upper surface of the conductive ring 250 and the lower surface of the second protrusion (ie, the grounding portion 223 ). Specifically, for example, at least one electromagnetic coil 251 is disposed on the upper surface of the conductive ring 250 .

[0073] In some embodiments, in order to improve the uniformity of voltage distribution of the liner body 210, there are multiple grounding structures 220, which are spaced apart along the circumference of the liner body 210. In an embodiment where the liner 200 includes a conductive ring 250, the conductive ring 250 is used to support the second protrusions (i.e., the grounding portions 223) in the multiple grounding structures 220, thereby facilitating the connection between the multiple grounding structures 220 and the grounding member 102.

[0074] As another technical solution, Figure 1 As shown, an embodiment of the present invention further provides a semiconductor processing chamber 100, including a chamber body 101 and a chuck (not shown in the figure) arranged in the chamber body 101, the chuck is used to carry a wafer; it also includes the above-mentioned liner 200 provided in an embodiment of the present invention, the liner body 210 is arranged around the inner side of the chamber body 101, and the upper end of the liner body 210 is connected to the chamber body 101 and is electrically conductive; the chuck is provided with a grounding piece 102.

[0075] The grounding member 102 is, for example, an interface plate of a chuck.

[0076] The semiconductor processing chamber 100 provided by the embodiment of the present invention can avoid the problem of discontinuity of the RF circuit and avoid damage due to frequent deformation by adopting the above-mentioned liner 200 provided by the embodiment of the present invention. At the same time, it can ensure that the liner 200 is always fully grounded during the temperature alternation process, improve the connection reliability and safety, ensure the grounding performance of the liner 200, and have a longer service life. It is not easy to have poor contact, thereby reducing the maintenance frequency of the liner 200.

[0077] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A lining, characterized in that: The invention comprises a lining body and at least one grounding structure arranged on the lining body, wherein the grounding structure comprises a grounding body, a connecting portion and a grounding portion, wherein the grounding body is in a strip shape and is spaced apart from the lower end of the lining body, and the connecting portion is arranged at least at one end of the grounding body in its extending direction, and the connecting portion is connected to the lower end of the lining body and is electrically conductive; The grounding portion and the connecting portion are arranged at intervals along the extending direction of the grounding body; when in use, the grounding portion is used to be fixedly connected to the grounding piece and electrically conductive.

2. The liner according to claim 1, characterized in that The connecting parts are arranged at both ends of the grounding body in the extending direction; and the grounding part is located between the two ends of the grounding body.

3. The liner according to claim 1, characterized in that The grounding body is provided with the connection portion at one end in the extending direction thereof, and the grounding portion is provided at the other end in the extending direction thereof.

4. The liner according to claim 1, characterized in that The connecting portion is integrally connected to or hinged to the lining body; and / or, The connecting portion is integrally connected to or hingedly connected to the grounding body.

5. The liner according to claim 1, characterized in that The extending direction of the grounding body is parallel to the circumferential direction of the lining body.

6. The liner according to any one of claims 1 to 5, characterized in that: A flange base is provided at the lower end of the lining body, the flange base is annular and protrudes toward the axis of the lining body relative to the inner circumferential surface of the lining body; The flange base has a boss formed on one side of the inner circumference, the grounding body is spaced apart from the lower surface of the boss, is located inside the inner circumference of the flange base, and is spaced apart from the inner circumference of the flange base; the connecting portion is connected to the lower surface of the boss and is electrically conductive.

7. The liner according to claim 6, characterized in that The connecting portion is a first protrusion formed on the lower surface of the boss, and at least one end of the grounding body is integrally connected to a side surface of the first protrusion.

8. The liner according to claim 1, characterized in that The grounding portion is a second protrusion formed on the lower surface of the grounding body, and the lower surface of the second protrusion is used to electrically contact with the grounding member.

9. The liner according to claim 8, characterized in that The grounding body and the second protrusion are correspondingly provided with through holes penetrating in the vertical direction; The grounding structure further includes a fastener, which is used to penetrate the through hole when in use, and to fix the grounding body and the second protrusion to the grounding member.

10. The liner according to claim 9, characterized in that The liner also includes a conductive ring, which is disposed below the liner body and is used to be fixedly connected to the grounding member and electrically conductive when in use; The conductive ring is used to support the second protrusion, and a threaded hole is provided on the upper surface of the conductive ring. The threaded hole is provided corresponding to the through hole, and the fastener is threadedly connected to the threaded hole.

11. The liner according to claim 10, characterized in that At least one electromagnetic coil is disposed between the upper surface of the conductive ring and the lower surface of the second protrusion.

12. The liner according to any one of claims 1 to 5, characterized in that: The grounding structures are multiple and are distributed at intervals along the circumference of the lining body.

13. A semiconductor processing chamber, comprising a chamber body and a chuck disposed in the chamber body, wherein the chuck is used to carry a wafer; characterized in that: Also comprising the liner according to any one of claims 1 to 12, wherein the liner body is disposed around the inner side of the chamber body, and the upper end of the liner body is connected to the chamber body and electrically conductive; The chuck is provided with the grounding member.

Images