Substrate processing apparatus mounted with heating portion

Abstract

The present invention relates to a substrate processing apparatus equipped with a heat generating unit, comprising: a chuck base which rotates together with a drive shaft in a state of being connected to the drive shaft, and which comprises a rotary chuck having an annular shape and having a chuck pin for supporting a substrate provided at the upper part thereof, and a chuck support part provided at the lower part of the inner side of the rotary chuck; a fluid supply unit for supplying a processing liquid to the upper surface of the substrate; the rear nozzle assembly is arranged in a hollow part formed in the center of the chuck base and used for spraying the processing liquid to the lower surface of the substrate; a cover glass disposed between the rotary chuck and the rear nozzle assembly; the heating part is positioned between the glass cover plate and the chuck supporting part and is arranged between the rotary chuck and the rear nozzle assembly; and a heat sink disposed in contact with the bottom surface of the heat-generating part, and the heat sink is disposed in contact with the bottom surface of the heat-generating part for transferring heat to the substrate, so that heat generated from the heat-generating part can be effectively released to the outside.

Description

Technical Field

[0001] The present invention relates to a substrate processing device equipped with a heating portion, and more particularly, to a substrate processing device equipped with a heating portion capable of heating a substrate to improve productivity and reduce the amount of processing liquid used. Background Art

[0002] The substrate processing apparatus refers to an apparatus that uses a processing liquid to perform vapor deposition, development, etching or cleaning on substrates such as semiconductor wafers, display substrates, optical disk substrates, magnetic disk substrates, photomask substrates, ceramic substrates, and solar cell substrates.

[0003] The cleaning process is used to remove foreign matter or particles present on the substrate, and typically refers to a process of supplying a processing liquid to the surface or back side of the substrate while rotating the substrate at high speed while being supported by a chuck base (spinning head).

[0004] In this case, if a heating portion is installed under the substrate and the substrate is rotated in a heated state to process the substrate, the amount of processing liquid used can be reduced due to the rapid reaction. This not only minimizes environmental pollution, but also shortens the processing time. Therefore, there is an advantage of improving productivity and significantly reducing power consumption.

[0005] For this reason, various technologies related to a substrate processing apparatus for rotating a substrate in a heated state are being studied.

[0006] On the other hand, when the heat generating portion is a light emitting diode (LED) or an infrared (IR) lamp, etc., a cover glass is used to seal the printed circuit board etc. in order to prevent the printed circuit board etc. from being contaminated by the processing liquid.

[0007] However, when a large amount of heat is generated and accumulated in the heating portion due to the above-mentioned sealing structure, the durability of the heating portion and its surrounding structural elements is reduced. Therefore, it is necessary to take measures in advance to achieve sufficient heat dissipation.

[0008] In the conventional method, although a structure is adopted in which a cooling passage is separately formed at the lower part of the above-mentioned heat generating part to allow the cooling gas to pass through, this method not only has the problem of complex structure, but also has the disadvantage of reduced cooling efficiency because only convection is used when there is no contact with the heat generating part.

[0009] Furthermore, in the conventional method, the processing liquid may penetrate between the cover glass and the chuck base, causing the heating unit to malfunction.

[0010] Prior art literature

[0011] Patent Literature

[0012] Patent Document 1: Korean Patent Gazette No. 10-2186337 (November 27, 2020)

[0013] Patent Document 2: Korean Patent Publication No. 10-2023-0035275 (March 13, 2023) Summary of the invention

[0014] In order to solve the above-mentioned problems of the prior art, an object of the present invention is to provide a substrate processing device equipped with a heat generating portion, which can improve the cooling efficiency of the heat generating portion to make the durability excellent and prevent the occurrence of malfunctions caused by the inflow of processing liquid.

[0015] In order to achieve the above-mentioned purpose, the substrate processing device equipped with a heating part of the present invention includes: a chuck base, which rotates together with the driving shaft when connected to it, and includes a rotating chuck and a chuck support part, the rotating chuck is annular and is provided with a chuck pin for supporting the substrate at the upper part, and the chuck support part is arranged at the inner lower part of the rotating chuck; a fluid supply unit, which is used to supply processing liquid to the upper surface of the substrate; a rear nozzle assembly, which is provided with a hollow part, and is used to spray processing liquid to the lower surface of the substrate, and the hollow part is formed at the center of the chuck base; a glass cover, which is arranged between the rotating chuck and the rear nozzle assembly; a heating part, which is located between the glass cover and the chuck support part, and is arranged between the rotating chuck and the rear nozzle assembly; and a heat sink, which is arranged in contact with the bottom surface of the heating part.

[0016] A coolant flow path through which coolant flows is formed inside the radiator.

[0017] When viewed from a plan view, the inlet and outlet of the coolant flow path are arranged inside the drive shaft, and the inlet and outlet are connected to an external coolant circulation line.

[0018] When observed from a top view, the above-mentioned coolant flow path is composed of a first coolant flow path and a second coolant flow path, which are arranged on both sides of a straight line passing through the center of the above-mentioned drive shaft, and the first coolant flow path and the second coolant flow path are connected by a connecting coolant flow path arranged on the outermost side in the radial direction.

[0019] A purge gas injection hole is formed along a circumferential direction at a location in the length direction of the rear nozzle assembly above the heat generating portion, and a first purge gas supply passage communicating with the purge gas injection hole is formed inside the rear nozzle assembly.

[0020] A coupling hole for inserting the glass cover is formed on the outer peripheral surface of the rear nozzle assembly, and a second purge gas supply passage communicating with the coupling hole is arranged inside the rear nozzle assembly.

[0021] The upper surface of the glass cover and the upper surface of the coupling hole are formed to be inclined upward toward the center of the driving shaft at a portion adjacent to an inner peripheral surface of a through hole of the glass cover through which the rear nozzle assembly penetrates.

[0022] The heat generating portion and the heat sink are capable of reciprocating in the up-and-down direction.

[0023] The present invention having the above structure has the following effect. That is, since the present invention includes a heat sink and the heat sink is arranged in contact with the bottom surface of the heat generating portion for transferring heat to the substrate, the heat generated from the heat generating portion can be effectively released to the outside.

[0024] Furthermore, in the present invention, since a coolant flow path for flowing the coolant is formed inside the radiator, the heat of the radiator can be further effectively released to the outside.

[0025] Furthermore, in the present invention, since the inlet and outlet of the coolant flow path are arranged on the inner side of the drive shaft and the inlet and outlet are connected to the external coolant circulation pipeline, it is possible to improve the heat dissipation effect while preventing the waste of coolant.

[0026] Furthermore, in the present invention, the coolant flow path is composed of a first coolant flow path and a second coolant flow path, which are respectively arranged on both sides with a straight line passing through the center of the drive shaft as the center, and the first coolant flow path and the second coolant flow path are connected by a connecting coolant flow path arranged at the outermost side in the radial direction. Therefore, as the coolant starts from the periphery of the drive shaft and flows evenly through half of the heat generating part through the first coolant flow path to absorb heat and flows evenly through the remaining half of the heat generating part through the second coolant flow path to release heat, the cooling efficiency can be further improved.

[0027] Furthermore, in the present invention, since a purge gas injection hole is formed along the circumferential direction at a point in the length direction of the above-mentioned rear nozzle assembly above the above-mentioned heat generating portion, a first purge gas supply passage connected to the above-mentioned purge gas injection hole is formed inside the above-mentioned rear nozzle assembly. Therefore, as the purge gas flows through the above-mentioned heat generating portion through the above-mentioned purge gas injection hole, the above-mentioned heat generating portion can be further effectively cooled by convection.

[0028] Furthermore, in the present invention, since a coupling hole for inserting the above-mentioned glass cover piece is formed on the outer peripheral surface of the rear nozzle assembly, and a second purge gas supply passage connected to the above-mentioned coupling hole is arranged inside the above-mentioned rear nozzle assembly, the purge gas can be discharged through the second gap between the glass cover piece and the coupling hole to prevent the occurrence of malfunctions in the heating part etc. caused by the backflow of the processing liquid discharged from the rear nozzle assembly through the above-mentioned second gap.

[0029] Furthermore, in the present invention, since the upper surface of the glass cover sheet and the upper surface of the combining hole are formed to be inclined upward toward the center of the driving shaft at a portion adjacent to the inner circumferential surface of the through hole of the glass cover sheet that penetrates the rear nozzle assembly, the purge gas can press the processing liquid through the inclined portion while converting the inflow path of the processing liquid, thereby further effectively preventing the processing liquid from flowing through the second gap and infiltrating.

[0030] Furthermore, in the present invention, the heat generating part and the heat sink can reciprocate in the vertical direction. Therefore, after the high temperature treatment of the heat generating part, the heat generating part can be moved downward to prevent unnecessary residual heat from being transferred to the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a front cross-sectional view showing a substrate processing apparatus of the present invention.

[0032] Figure 2 To show Figure 1 Main sectional view of the main parts.

[0033] Figure 3 It is a perspective view of the main parts of the substrate processing apparatus of the present invention.

[0034] Figure 4 for Figure 3 Top view of the .

[0035] Figure 5 It is an exploded perspective view showing the structure of the heat generating portion and the heat sink of the substrate processing apparatus of the present invention.

[0036] Figure 6 The graph is a graph showing the change in residual heat of the substrate after high-temperature processing by the heat generating portion, comparing the state in which the height of the heat generating portion is maintained in an ascending state and a descending state. DETAILED DESCRIPTION

[0037] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0038] like Figures 1 to 4As shown, a substrate processing device 1000 according to an embodiment of the present invention comprises: a chuck base 200, which rotates together with a driving shaft 800 driven by a motor M, and comprises a rotating chuck 210 and a chuck support 220, wherein the rotating chuck 210 is annular and has a chuck pin 250 for supporting the substrate W at the upper portion, and the chuck support 220 is arranged at the inner lower portion of the rotating chuck 210; a fluid supply unit 300 for supplying a processing liquid to the upper surface of the substrate W; a rear spray The nozzle assembly 400 is provided with a hollow portion 240 for spraying a processing liquid onto the lower surface of the substrate W, and the hollow portion 240 is formed at the center of the chuck base 200; the glass cover 500 is arranged between the rotating chuck 210 and the rear nozzle assembly 400; the heating portion 600 is located between the glass cover 500 and the chuck support portion 220, and is arranged between the rotating chuck 210 and the rear nozzle assembly 400; and the heat sink 700 is arranged in contact with the bottom surface of the heating portion 600.

[0039] When viewed from a top view, the spin chuck 210 is in a circular ring shape. Preferably, when a circular substrate W is placed and rotated, weight imbalance in the circumferential direction should be prevented.

[0040] The heating unit 600 may be composed of a heater 610 such as a light emitting diode or an infrared lamp and a printed circuit board 620 provided with a plurality of the heaters 610 . Various parameters such as turning on and off the light or light intensity may be adjusted through a control function on the printed circuit board 620 .

[0041] Furthermore, the heating portion 600 may be fixedly coupled to the rear nozzle assembly 400 or relatively rotatably coupled to the rear nozzle assembly 400 or liftably coupled to the rear nozzle assembly 400 .

[0042] In this case, the printed circuit board 620 constituting the heat generating unit 600 has a circular outer shape facing the inner side of the spin chuck 210 , and preferably, the substrate W can be uniformly heated.

[0043] However, there is no particular limitation on the shape of the printed circuit board 620 as long as a plurality of heaters 610 can be arranged in a predetermined structure.

[0044] On the other hand, in order to prevent the processing liquid ejected from the rear nozzle assembly 400 from flowing into the heating portion 600 , the cover glass 500 needs to have a structure that prevents the processing liquid from flowing into the spin chuck 210 and the rear nozzle assembly 400 .

[0045] To this end, the outer peripheral surface and the periphery of the cover glass 500 may be fixedly coupled to the upper surface of the spin chuck 210 in close contact to prevent the inflow of the processing liquid.

[0046] Furthermore, the rear nozzle assembly 400 constitutes a non-rotating portion, and the glass cover 500 is fixed to the rotating chuck 210 and constitutes a rotating portion. Therefore, when the inner circumferential surface of the glass cover 500 and its surroundings are inserted into the following coupling hole 470 of the rear nozzle assembly 400, the inflow of the processing liquid can be prevented by spraying a purge gas.

[0047] Preferably, the glass cover 500 has a circular outer shape to prevent weight imbalance in the surrounding direction, and a setting groove 510 may be formed at a portion where the chuck pin 250 is configured.

[0048] The heat sink 700 is disposed in contact with the bottom surface of the heat generating unit 600 and can release the heat generated by the heat generating unit 600 to the outside.

[0049] Preferably, in order to release heat quickly, the heat sink 700 is made of a material with excellent thermal conductivity, such as aluminum.

[0050] In particular, Figure 2 and Figure 5 As shown, a coolant flow path 710 for allowing coolant to flow is formed inside the radiator 700 , and the heat of the radiator 700 can be released to a relatively cool outside through the coolant flow path 710 .

[0051] Preferably, when viewed from a plan view, the inlet 711 and the outlet 712 of the coolant flow path 710 are disposed inside the drive shaft 800 , and the inlet 711 and the outlet 712 may be connected to an external coolant circulation line 750 .

[0052] Specifically, the coolant circulation line 750 is provided with a pump 751 and a valve 752 , and the flow rate of the coolant can be appropriately adjusted according to the strength of the heat generating part 600 so that the coolant flows inside the radiator 700 and releases heat.

[0053] If a heat exchanger 753 is additionally provided in the cooling liquid circulation line 750 , colder cooling liquid can be supplied to the heat generating portion 600 to improve the heat dissipation effect.

[0054] The coolant circulation pipeline 750 may extend to the outside through between the driving shaft 800 and the outer peripheral surface of the rear nozzle assembly 400 to prevent exposure to the outside and interference with surrounding structures.

[0055] The coolant circulation pipeline 750 can improve the heat dissipation effect and prevent the waste of coolant.

[0056] When observed from a top view, the above-mentioned coolant flow path 710 is composed of a first coolant flow path 715 and a second coolant flow path 716, which are arranged on both sides with a straight line passing through the center of the above-mentioned drive shaft 800 as the center. The first coolant flow path 715 and the second coolant flow path 716 can be connected by a connecting coolant flow path 718 arranged on the outermost side in the radial direction.

[0057] Based on the above structure, the coolant flows uniformly from around the driving shaft 800 through the first coolant flow path 715 through half of the heating part 600 to absorb heat and flows uniformly through the remaining half of the heating part 600 through the second coolant flow path 716 to release heat.

[0058] When viewed from a plan view, the coolant flow path 710 is a continuous meander (snaking) with a portion forming an arc shape, but the shape of the coolant flow path 710 is not particularly limited.

[0059] For example, a double spiral type that spirally expands toward the outside in the radial direction and spirally contracts again toward the inside may be formed, and the inlet 711 and the outlet 712 may be connected to the coolant circulation line 750 disposed inside the drive shaft 800 .

[0060] The heat generating unit 600 and the heat sink 700 may reciprocate in an up-and-down direction.

[0061] Thus, after the high temperature treatment by the heat generating unit 600 , the heat generating unit 600 may be moved downward to prevent unnecessary residual heat from being transferred to the substrate.

[0062] That is, as the coolant flowing through the heat sink 700 cools the heater 610 and the printed circuit board 620 , the heater 610 body can be quickly separated from the substrate W to prevent the residual heat from being transferred to the substrate and causing adverse effects.

[0063] Of course, in the case of actual high temperature processing, the heat generating portion 600 and the heat sink 700 can be quickly moved upward to a specified position.

[0064] In order to make the heating part 600 and the heat sink 700 reciprocate in the up-down direction, they may be connected to a pneumatic cylinder or a hydraulic cylinder.

[0065] Figure 6 Graphs showing changes in residual heat of the substrate W after high-temperature processing by the heat generating portion when the height of the heat generating portion 600 is maintained in an elevated state and a lowered state.

[0066] The measured value indicates the temperature measured at a position 75 mm away from the center of the substrate W in the radial direction.

[0067] As shown in the figure, when the heat generating unit 600 is lowered, the residual heat of the substrate W is reduced by about 20% compared to when the height is maintained in the raised state.

[0068] A purge gas injection hole 410 is formed along a circumferential direction at one position in the length direction of the rear nozzle assembly 400 above the heat generating portion 600 .

[0069] Therefore, as the purge gas flows over the heat generating portion 600 through the purge gas injection holes 410 , the heat generating portion 600 may be further effectively cooled by convection.

[0070] The purge gas flowing through the heat generating portion 600 may be discharged to the outside through the first gap 230 between the spin chuck 210 and the chuck supporting portion 220 .

[0071] In this case, additional means may also be provided for recovering the above-mentioned exhausted purge gas.

[0072] A receiving groove 450 is formed inside the rear nozzle assembly 400 along the length (up and down) direction. A first purge gas supply passage 460 may be formed in the receiving groove 450 along the length direction and communicated with the purge gas injection hole 410 .

[0073] However, the first purge gas supply passage 460 may also be connected to the purge gas injection hole 410 by other appropriate means.

[0074] The first purge gas supply passage 460 may be formed in the receiving groove 450 along a length direction, and may allow the purge gas to be delivered from an external purge gas supply source (not shown) to the purge gas injection hole 410 .

[0075] The first purge gas supply passage 460 may be a pipe, but may also be a passage in any shape and manner that communicates with the purge gas injection hole 410 .

[0076] As the cover glass 500 is inserted into the coupling hole 470 formed on the outer circumferential surface of the rear nozzle assembly 400 , a second purge gas supply passage 480 communicating with the coupling hole 470 may be disposed inside the rear nozzle assembly 400 .

[0077] Similar to the first purge gas supply passage 460 , the second purge gas supply passage 480 may be formed in the receiving groove 450 along a length direction, so that the purge gas may be delivered from an external purge gas supply source (not shown) to the coupling hole 470 .

[0078] However, the second purge gas supply passage 480 may also be connected to the coupling hole 470 in other appropriate manners.

[0079] Therefore, if Figure 2 As shown, the purge gas can be discharged through the second gap 471 between the glass cover 500 and the coupling hole 470 to prevent the processing liquid discharged from the rear nozzle assembly 400 from flowing back through the second gap 471 and causing the heating unit 600 to malfunction.

[0080] As shown in the figure, the upper surface of the glass cover 500 and the upper surface of the coupling hole 470 may be formed to be inclined upward toward the center of the driving shaft 800 at a portion adjacent to the inner circumference of the through hole 590 of the glass cover 500 penetrating the rear nozzle assembly 400 .

[0081] Based on the above structure, the inflow path of the processing liquid can be changed while the purge gas can press the processing liquid through the inclined portion to further effectively prevent the processing liquid from flowing through the second slit 471 .

[0082] The second purge gas supply passage 480 may be a pipe, but may also be a passage in any shape and manner that communicates with the coupling hole 470 .

[0083] Furthermore, the purge gas injection hole 410 and the coupling hole 470 may be connected, and the first purge gas supply passage 460 and the second purge gas supply passage 480 may also be connected, thereby receiving the purge gas from one purge gas supply source.

[0084] The above-mentioned rear nozzle assembly 400 may include: a main body 490; a processing liquid supply passage 420 formed in the above-mentioned main body 490; a rear nozzle 430 connected to the above-mentioned processing liquid supply passage 420; and a nozzle guard 440, which is formed with the above-mentioned rear nozzle 430 and is formed at the upper end of the above-mentioned main body 490.

[0085] The nozzle guard 440 is detachably coupled to the main body 490 .

[0086] It should be understood that the embodiments of the present invention are merely examples, and a person skilled in the art can implement various modifications and other equivalent embodiments within the scope of protection claimed by the invention.

Claims

1. A substrate processing device equipped with a heating unit, characterized in that: include: The chuck base rotates together with the driving shaft when connected to the driving shaft, and comprises a rotating chuck and a chuck support portion, wherein the rotating chuck is annular and is provided with a chuck pin for supporting the substrate at the upper portion, and the chuck support portion is provided at the inner lower portion of the rotating chuck; A fluid supply unit, used for supplying a processing liquid to the upper surface of the substrate; a rear nozzle assembly, provided with a hollow portion, for spraying a processing liquid toward a lower surface of the substrate, the hollow portion being formed at a center of the chuck base; A glass cover sheet is disposed between the rotating chuck and the rear nozzle assembly; A heating portion, located between the glass cover and the chuck support portion, and disposed between the rotating chuck and the rear nozzle assembly; and The heat sink is arranged in contact with the bottom surface of the heat generating portion.

2. The substrate processing device equipped with a heat generating unit according to claim 1, wherein: A coolant flow path through which coolant flows is formed inside the radiator.

3. The substrate processing device equipped with a heat generating unit according to claim 2, wherein: When viewed from above, the inlet and outlet of the coolant flow path are arranged inside the drive shaft, and the inlet and outlet are connected to an external coolant circulation line.

4. The substrate processing device equipped with a heat generating unit according to claim 3, characterized in that: When viewed from above, the coolant flow path is composed of a first coolant flow path and a second coolant flow path, which are arranged on both sides of a straight line passing through the center of the drive shaft, and the first coolant flow path and the second coolant flow path are connected by a connecting coolant flow path arranged at the outermost side in the radial direction.

5. The substrate processing device equipped with a heat generating unit according to any one of claims 1 to 4, characterized in that: A purge gas injection hole is formed along a circumferential direction at a location in the length direction of the rear nozzle assembly above the heat generating portion, and a first purge gas supply passage communicating with the purge gas injection hole is formed inside the rear nozzle assembly.

6. The substrate processing device equipped with a heat generating unit according to any one of claims 1 to 4, characterized in that: A coupling hole for inserting the glass cover is formed on the outer peripheral surface of the rear nozzle assembly, and a second purge gas supply passage communicating with the coupling hole is arranged inside the rear nozzle assembly.

7. The substrate processing device equipped with a heat generating unit according to claim 6, characterized in that: The upper surface of the glass cover and the upper surface of the coupling hole are formed to be inclined upward toward the center of the driving shaft at a portion adjacent to an inner peripheral surface of a through hole of the glass cover through which the rear nozzle assembly penetrates.

8. The substrate processing device equipped with a heat generating unit according to any one of claims 1 to 4, characterized in that: The heat generating portion and the heat sink are capable of reciprocating in the up-and-down direction.

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