Silicon wafer cleaning equipment and cleaning method thereof

Abstract

The invention relates to the technical field of silicon wafer cleaning, in particular to silicon wafer cleaning equipment and a cleaning method thereof.The silicon wafer cleaning equipment comprises a cleaning box, a plurality of baskets, an adjusting mechanism and a circulating stirring mechanism, the baskets are used for bearing silicon wafers, the baskets are sequentially stacked and placed in the cleaning box, and when the silicon wafers are placed in the cleaning box, the baskets are in a first state, and the baskets are in a second state; when the silicon wafer is not placed in the cleaning box and the flower basket is in a second state, the adjusting mechanism is located in the cleaning box and used for adjusting the inclination degree of the flower basket, and the circulating stirring mechanism is located in the cleaning box and located below the adjusting mechanism and used for stirring cleaning liquid in the cleaning box; and the circulating flow of the cleaning liquid in the cleaning box is realized. The silicon wafer in the inclined state can make full use of surface water drop tension, residual water spots on the surface of the silicon wafer are reduced, the circulation amount of cleaning liquid on the lower surface of the basket is larger, and the cleaning efficiency of the silicon wafer can be improved while the cleaning effect of the silicon wafer is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon wafer cleaning, and in particular to a silicon wafer cleaning device and a cleaning method thereof. Background Art

[0002] In order to eliminate pollutants from solar silicon wafers (during the production and processing of silicon wafers (such as slicing, grinding, chamfering and polishing), various impurities (such as particles, metal particles, silicon powder dust and organic impurities, etc.) will be adsorbed on the surface of silicon wafers. If these pollutants are not removed, it will affect the subsequent process and the performance of the battery), improve the photoelectric conversion efficiency (cleaning silicon wafers and making velvet structures (velveting), which can reduce the solar energy reflection on the surface of silicon wafers, increase the number of light refractions on the surface of silicon wafers, and thus improve the light absorption efficiency. Effective velvet structures help to reduce reflectivity and increase short-circuit current (Isc). Ultimately improve the photoelectric conversion efficiency of the battery), ensure the quality of the battery cells (pollutants on the surface of the silicon wafer (such as oil, moisture and dust, etc.) will affect the quality of the solar panel. Cleaning can remove these impurities, improve the insulation and stability of the solar panel, thereby extending its service life), meet the subsequent process requirements (in the production process of solar cells, silicon wafers need to go through multiple processes. Cleaning can ensure the cleanliness of the silicon wafer surface and meet the process requirements of subsequent processes (such as aluminum plating, grading, etc.) to ensure the yield and quality of the battery cells). For this reason, we need to provide a silicon wafer cleaning equipment and a cleaning method thereof.

[0003] Currently, silicon wafers are cleaned by directly placing them into a cleaning tank filled with cleaning liquid and cleaning them by immersion. However, since silicon wafers can only be placed horizontally, in order to ensure the cleaning effect of the silicon wafers, the silicon wafers can only be spread horizontally in the cleaning tank, which will affect the cleaning efficiency of the silicon wafers. Summary of the invention

[0004] The technical problem to be solved by the present invention is: in order to solve the technical problem that the existing method of horizontally spreading out silicon wafers for cleaning will affect the cleaning efficiency of silicon wafers, the present invention provides a silicon wafer cleaning equipment and a cleaning method thereof. By improving the structure of the silicon wafer cleaning equipment, the cleaning efficiency of the silicon wafer can be improved while ensuring the cleaning effect of the silicon wafer.

[0005] The technical solution adopted by the present invention to solve its technical problem is: a silicon wafer cleaning device, including: a cleaning box, multiple flower baskets, an adjustment mechanism and a circulation stirring mechanism, the flower basket is used to carry silicon wafers, and multiple flower baskets are stacked in sequence and placed in the cleaning box, when the silicon wafer is placed in the cleaning box, the flower basket is in a first state, when the silicon wafer is not placed in the cleaning box, the flower basket is in a second state, the adjustment mechanism is located in the cleaning box, and the adjustment mechanism is used to adjust the inclination of the flower basket, the circulation stirring mechanism is located in the cleaning box, and the circulation stirring mechanism is located below the adjustment mechanism, and the circulation stirring mechanism is used to stir the cleaning liquid in the cleaning box and to realize the circulation flow of the cleaning liquid in the cleaning box.

[0006] Therefore, when cleaning the silicon wafers, the flower basket can be placed at an angle, and the flower basket can be placed in a first state. After cleaning, the silicon wafers are placed in a second state. Compared with the existing horizontal placement of the flower basket, this method has a simple structure and is easy to operate. The silicon wafers in the inclined state can make full use of the surface water droplet tension and reduce the residual water stains on the surface of the silicon wafers. At the same time, in the inclined state, the circulation volume of the cleaning liquid on the lower surface of the flower basket is greater, which can improve the cleaning efficiency of the silicon wafers while ensuring the cleaning effect of the silicon wafers. In addition, it can also extend the use time of the cleaning liquid and shorten the subsequent drying time of the silicon wafers.

[0007] Furthermore, the flower basket is provided with a first hook along the first direction, and the flower basket is provided with a second hook along the second direction, wherein: the first direction and the second direction are perpendicular to each other. Thus, the flower basket can be placed in the first state by the first hook, and the flower basket can be placed in the second state by the second hook.

[0008] Furthermore, the number of the first hooks and the number of the second hooks are both two. Thus, the two first hooks and the two second hooks can facilitate the robot arm to grab the flower basket.

[0009] Furthermore, the adjustment mechanism includes: two support plates and a plurality of support columns, the support plates are connected to the cleaning box, and the support columns are located on a side of the support plates away from the circulating stirring mechanism and are threadedly connected to the support plates. Thus, by rotating the support columns, the telescopic movement of the support columns is achieved, thereby achieving the adjustment of the inclination angle of the flower basket.

[0010] Furthermore, the support plate is provided with a limiting groove, the flower basket is inserted into the limiting groove and is slidably connected with the support plate, thereby ensuring that the flower basket moves within the support plate and does not break away from the restraint of the support plate, thereby maintaining stability.

[0011] Furthermore, a baffle is provided inside the cleaning box, and the cleaning box is divided into a cleaning tank and a reflux tank by the baffle; wherein: the cleaning tank is used to place the flower basket and the silicon wafer. Thus, by providing the baffle, the upper layer of liquid overflowing from the cleaning tank is filtered and recycled, so as to realize the recycling of the cleaning liquid.

[0012] Furthermore, the circulation stirring mechanism includes: a reflux pipe and a pump air pipe, wherein the reflux pipe is arranged at the bottom of the cleaning tank and is used to return the cleaning liquid overflowing from the cleaning tank into the reflux tank to the cleaning tank, and the pump air pipe is arranged above the reflux pipe, and the pump air pipe is provided with a plurality of air holes and is used to pump air upward to promote the flow of the cleaning liquid. Thus, the cleaning liquid is disturbed by air flow instead of being stirred by a stirring rod, so that the flow of the cleaning liquid can be controlled to promote the cleaning of the silicon wafer.

[0013] Furthermore, the circulation stirring mechanism further comprises: an air-breaking net, the air-breaking net is located above the pump air pipe, and the distance between the pump air pipe and the air-breaking net is H; wherein: 10mm≤H≤30mm.

[0014] Furthermore, a plurality of guide plates are arranged in the reflow groove along the vertical direction, and the guide plates are provided with a plurality of guide ports.

[0015] A cleaning method for a silicon wafer cleaning device comprises the following steps:

[0016] S1. Adjust the inclination of the flower basket through the adjustment mechanism;

[0017] S2, stacking the plurality of flower baskets in sequence and placing them into a cleaning box by a robot, and placing the flower baskets in a first state;

[0018] S3, starting the circulating stirring mechanism to clean the silicon wafer using the cleaning liquid in a stirring state;

[0019] S4. After the silicon wafers are cleaned, the plurality of flower baskets are sequentially taken out from the cleaning box by a robot, and after being taken out, the flower baskets are in a second state.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] When cleaning the silicon wafers, the flower basket can be placed at an angle, and the flower basket can be placed in a first state. After cleaning, the silicon wafers are placed in a second state. Compared with the existing horizontal placement of the flower basket, this method has a simple structure and is easy to operate. The silicon wafers in the inclined state can make full use of the surface water droplet tension and reduce residual water stains on the surface of the silicon wafers. At the same time, in the inclined state, the circulation volume of the cleaning liquid on the lower surface of the flower basket is greater, which can improve the cleaning efficiency of the silicon wafers while ensuring the cleaning effect of the silicon wafers. In addition, the use time of the cleaning liquid can be extended and the subsequent drying time of the silicon wafers can be shortened. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0023] Figure 1 It is a structural schematic diagram of the silicon wafer cleaning device of the present invention from a first viewing angle;

[0024] Figure 2 It is a structural schematic diagram of the silicon wafer cleaning device of the present invention from a second viewing angle;

[0025] Figure 3 For the present invention Figure 1 A is an enlarged schematic diagram of the local structure at center A;

[0026] Figure 4 It is a structural schematic diagram of the flower basket of the present invention in the first state;

[0027] Figure 5 It is a structural schematic diagram of the flower basket of the present invention in the second state;

[0028] Figure 6 is a cross-sectional view of a silicon wafer cleaning device of the present invention;

[0029] Figure 7 It is a structural schematic diagram of the reflux pipe of the present invention;

[0030] Figure 8 The present invention is a flow chart of a cleaning method for a silicon wafer cleaning device.

[0031] In the figure: 1. cleaning box; 101. baffle; 102. cleaning trough; 103. reflux trough; 104. guide plate; 105. guide port; 2. flower basket; 201. first hook; 202. second hook; 3. silicon wafer; 4. adjustment mechanism; 401. support plate; 4011. limit groove; 402. support column; 5. circulation stirring mechanism; 501. reflux pipe; 502. pump air pipe; 503. air breaking net; 504. side plate; 505. notch; 506. round hole; 6. water inlet pipe; 7. drain pipe. DETAILED DESCRIPTION

[0032] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention.

[0033] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0034] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] like Figures 1 to 7As shown, a silicon wafer cleaning device includes: a cleaning box 1, multiple flower baskets 2, an adjustment mechanism 4 and a circulation stirring mechanism 5, the flower basket 2 is used to carry silicon wafers 3, and multiple flower baskets 2 are stacked in sequence and placed in the cleaning box 1. When the silicon wafers 3 are placed in the cleaning box 1, the flower basket 2 is in a first state, and when the silicon wafers 3 are not placed in the cleaning box 1, the flower basket 2 is in a second state. The adjustment mechanism 4 is located in the cleaning box 1, and the adjustment mechanism 4 is used to adjust the inclination of the flower basket 2. The circulation stirring mechanism 5 is located in the cleaning box 1, and the circulation stirring mechanism 5 is located below the adjustment mechanism 4. The circulation stirring mechanism 5 is used to stir the cleaning liquid in the cleaning box 1 and to realize the circulation flow of the cleaning liquid in the cleaning box 1. Therefore, when cleaning the silicon wafer 3, the flower basket 2 can be placed at an angle, and the flower basket 2 can be placed in the first state. After cleaning, the silicon wafer 3 is placed in the second state. Compared with the existing horizontal placement of the flower basket 2, this method has a simple structure and is easy to operate. The silicon wafer 3 in the inclined state can make full use of the surface water droplet tension to reduce the residual water stains on the surface of the silicon wafer 3. At the same time, in the inclined state, the circulation volume of the cleaning liquid on the lower surface of the flower basket 2 is greater, which can improve the cleaning efficiency of the silicon wafer 3 while ensuring the cleaning effect of the silicon wafer 3. In addition, it can also extend the use time of the cleaning liquid and shorten the subsequent drying time of the silicon wafer 3.

[0036] Specifically, as shown in Figures 10 and 11, the first state refers to a state in which multiple layers of silicon wafers 3 are stacked in a vertical direction and placed on the flower basket 2 in sequence. In this way, it can be ensured that multiple layers of silicon wafers 3 are placed in the cleaning box 1 to improve the cleaning efficiency of the silicon wafers 3; as shown in Figures 10 and 11, the second state refers to a state in which multiple layers of flower baskets 2 are spread out in a horizontal direction and placed on the flower basket 2 in sequence. In this way, compared with the first state, this state can prevent the residual water stains on the upper silicon wafer 3 from dripping onto the lower silicon wafer 3, thereby shortening the drying time of subsequent silicon wafers 3.

[0037] In this embodiment, the flower basket 2 is provided with a first hook 201 along the first direction, and the flower basket 2 is provided with a second hook 202 along the second direction; wherein: the first direction and the second direction are perpendicular to each other, and there are two first hooks 201 and two second hooks 202. Thus, the flower basket 2 can be placed in the first state through the first hook 201, and the flower basket 2 can be placed in the second state through the second hook 202; the two first hooks 201 and the two second hooks 202 can facilitate the robot to grab the flower basket 2.

[0038] In this embodiment, the adjustment mechanism 4 includes: two support plates 401 and a plurality of support columns 402. The support plates 401 are connected to the cleaning box 1. The support columns 402 are located on the side of the support plates 401 away from the circulating stirring mechanism 5 and are threadedly connected to the support plates 401. The support plates 401 are provided with limiting grooves 4011. The flower basket 2 is inserted into the limiting grooves 4011 and is slidably connected to the support plates 401. Thus, by rotating the support columns 402 to achieve the telescopic movement of the support columns 402, the inclination angle of the flower basket 2 can be adjusted; it can ensure that the flower basket 2 moves in the support plates 401 and will not break away from the restraint of the support plates 401, thereby maintaining stability.

[0039] In this embodiment, a baffle 101 is provided inside the cleaning box 1, and the cleaning box 1 is divided into a cleaning tank 102 and a reflux tank 103 by the baffle 101; wherein: the cleaning tank 102 is used to place the flower basket 2 and the silicon wafer 3; a plurality of guide plates 104 are provided along the vertical direction in the reflux tank 103, and the guide plates 104 are provided with a plurality of guide ports 105. Therefore, by providing the baffle 101, the upper layer of liquid overflowing from the cleaning tank 102 is filtered and recycled, so as to realize the recycling of the cleaning liquid.

[0040] Specifically, the cleaning liquid that flows back from the cleaning tank 102 to the reflux tank 103 flows layer by layer through the guide plate 104, blocking impurities in the cleaning liquid on the guide plate 104, thereby intercepting the impurities on the guide plate 104 located in a detachable and easy-to-clean position to prevent the impurities from reaching the bottom of the cleaning box 1.

[0041] Specifically, the top of the baffle 101 is arranged in a wave shape, and the wave-shaped baffle 101 can intercept impurities on the top of the cleaning tank 102 to prevent these impurities from entering the reflux tank 103; a drain pipe is arranged at the bottom of the cleaning box 1, and the drain pipe is opposite to the reflux tank 103. The drain pipe is connected to the water flow pipe through a water pump, and a concentration sensor is arranged on the water pump; a water inlet pipe 6 is also arranged on the side wall of the cleaning box 1, and the water inlet pipe 6 is used to replenish cleaning liquid into the cleaning box 1.

[0042] It should be noted that there are four baffles 101, which are interconnected in the cleaning box 1 to form a cleaning groove 102. The reflux groove 103 is surrounded by the outside of the cleaning groove 102. There is a gap between the bottom of the baffle 101 and the bottom of the cleaning box 1, so that the cleaning groove 102 is connected to the reflux groove 103.

[0043] In this embodiment, the circulation stirring mechanism 5 includes: a reflux pipe 501, a pump air pipe 502 and an air-breaking net 503. The reflux pipe 501 is arranged at the bottom of the cleaning tank 102 and is used to return the cleaning liquid overflowing from the cleaning tank 102 to the reflux tank 103 to the cleaning tank 102. The pump air pipe 502 is arranged above the reflux pipe 501. The pump air pipe 502 is provided with a plurality of air holes and is used to pump air upward to promote the flow of the cleaning liquid. The air-breaking net 503 is located above the pump air pipe 502. The distance between the pump air pipe 502 and the air-breaking net 503 is H; wherein: 10mm≤H≤30mm. Thus, the cleaning liquid is disturbed by air flow instead of stirring with a stirring rod, so that the flow of the cleaning liquid can be controlled to promote the cleaning of the silicon wafer 3.

[0044] Specifically, the larger the spacing H is, the better the circulation effect and the faster the speed. After actual testing, when the spacing H is within the above range, the speed-up effect of the entire cleaning system can be significantly improved by 5S-15S. This design method not only optimizes the performance of the system, but also ensures the efficiency and reliability of the operation.

[0045] Specifically, a side plate 504 is provided at the end of the return pipe 501 . The side plate 504 is located between the cleaning box 1 and the air-breaking net 503. A notch 505 is provided at the bottom of the side plate 504. The pump air pipe 502 passes through the notch 505, and the shape of the notch 505 is adapted to the shape of the pump air pipe 502. The pump air pipe 502 is rotatably arranged in the cleaning box 1. A scale line for displaying an angle is provided along the edge of the notch 505 on the side plate 504. The scale line is used to display the direction of the air hole. A plurality of circular holes 506 are provided on the side plate 504, and the aperture of the circular hole 506 in the middle part is smaller than the aperture of the circular hole 506 at the two end parts. The rotating pump air pipe 502 can adjust the direction of the water flow to achieve directional cleaning, and can promote circulation without dead angles. The pump air disturbs the water flow. When the bubbles in the water flow pass through the air-breaking net 503, they are squeezed and broken by the through holes on the air-breaking net 503, thereby preventing the bubbles from contacting the flower basket 2 and the silicon wafer 3.

[0046] It should be noted that: 1. The circular hole 506 is trumpet-shaped, that is, the aperture of the circular hole 506 in the middle part is smaller than the aperture of the circular hole 506 in the two end parts. When the cleaning liquid flows from the side of the side plate 504 away from each other toward the space between the two side plates 504, since the aperture of the end of the circular hole 506 is larger, the aperture of the middle part of the circular hole 506 is reduced by increasing the flow rate of the side plate 504, thereby increasing the circulation speed of the cleaning liquid, and the aperture of the circular hole 506 on the side facing the inside of the cleaning tank 102 is increased, so that the cleaning liquid diffuses and flows, improving the circulation of the cleaning liquid, avoiding the formation of dead corners due to the partition of the cleaning liquid, and improving the uniformity of the flow of the cleaning liquid;

[0047] 2. First, the used cleaning liquid in the cleaning tank 102 overflows from the cleaning tank 102, and the impurities in the overflowing cleaning liquid are intercepted by the top of the wave-shaped baffle 101, and further, are blocked on the guide plate 104, thereby preventing the impurities from entering the bottom of the cleaning box 1; finally, the water pump draws water from the bottom of the reflux tank 103 through the discharge pipe 7, and then returns it to the cleaning tank 102 through the return pipe. A pump air pipe 502 is arranged above the return pipe. The pump air pipe 502 pumps out nitrogen to return the liquid in the return pipe to the cleaning tank 102 toward the gas breaking net 503, so that the liquid flows in the cleaning tank 102, further improving the stirring effect and the liquid circulation effect. Furthermore, rotating the pump air pipe 502 can adjust the direction of the water flow, realize directional cleaning, and promote circulation without dead ends.

[0048] like Figure 8 As shown, a cleaning method for a silicon wafer cleaning device comprises the following steps:

[0049] S1, adjusting the inclination of the flower basket 2 by adjusting the mechanism 4;

[0050] S2, stacking a plurality of flower baskets 2 in sequence and placing them into the cleaning box 1 by a robot, and placing the flower baskets 2 in a first state;

[0051] S3, starting the circulating stirring mechanism 5, and using the cleaning liquid in a stirring state to clean the silicon wafer 3;

[0052] S4, after the silicon wafers 3 are cleaned, the plurality of flower baskets 2 are sequentially taken out from the cleaning box 1 by a robot, and the flower baskets 2 are in the second state after being taken out.

[0053] In summary, the present invention can place the flower basket 2 at an angle when cleaning the silicon wafer 3, and can place the flower basket 2 in a first state. After cleaning, the silicon wafer 3 is placed in a second state. Compared with the existing horizontal placement of the flower basket 2, this method has a simple structure and is easy to operate. The silicon wafer 3 in the inclined state can make full use of the surface water droplet tension to reduce the residual water stains on the surface of the silicon wafer 3. At the same time, in the inclined state, the circulation volume of the cleaning liquid on the lower surface of the flower basket 2 is greater, which can improve the cleaning efficiency of the silicon wafer 3 while ensuring the cleaning effect of the silicon wafer 3. In addition, it can also extend the use time of the cleaning liquid and shorten the subsequent drying time of the silicon wafer 3.

[0054] The above description is based on the ideal embodiment of the present invention. Through the above description, relevant personnel can make various changes and modifications without departing from the technical concept of the present invention. The technical scope of the present invention is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A silicon wafer cleaning device, characterized in that: include: a cleaning tank (1), and A plurality of flower baskets (2), the flower baskets (2) being used to carry silicon wafers (3), the plurality of flower baskets (2) being stacked in sequence and placed in the cleaning box (1), the flower baskets (2) being in a first state when the silicon wafers (3) are placed in the cleaning box (1), and the flower baskets (2) being in a second state when the silicon wafers (3) are not placed in the cleaning box (1); An adjusting mechanism (4), the adjusting mechanism (4) being located in the cleaning box (1), and the adjusting mechanism (4) being used to adjust the inclination of the flower basket (2); A circulating stirring mechanism (5), the circulating stirring mechanism (5) is located in the cleaning box (1), and the circulating stirring mechanism (5) is located below the regulating mechanism (4), the circulating stirring mechanism (5) is used to stir the cleaning liquid in the cleaning box (1), and is used to realize the circulating flow of the cleaning liquid in the cleaning box (1).

2. The silicon wafer cleaning equipment according to claim 1, characterized in that: The flower basket (2) is provided with a first hook (201) along a first direction, and the flower basket (2) is provided with a second hook (202) along a second direction; Wherein: the first direction and the second direction are perpendicular to each other.

3. The silicon wafer cleaning equipment according to claim 2, characterized in that: The number of the first hooks (201) and the number of the second hooks (202) are both two.

4. The silicon wafer cleaning equipment according to claim 1, characterized in that: The regulating mechanism (4) comprises: Two support plates (401) and a plurality of support columns (402), wherein the support plates (401) are connected to the cleaning box (1), and the support columns (402) are located on a side of the support plates (401) away from the circulating stirring mechanism (5) and are threadedly connected to the support plates (401).

5. The silicon wafer cleaning equipment according to claim 4, characterized in that: The support plate (401) is provided with a limiting groove (4011), and the flower basket (2) is inserted into the limiting groove (4011) and is slidably connected to the support plate (401).

6. The silicon wafer cleaning equipment according to claim 1, characterized in that: A baffle (101) is provided inside the cleaning box (1), and the cleaning box (1) is divided into a cleaning tank (102) and a reflow tank (103) by the baffle (101); Wherein: the cleaning tank (102) is used to place the flower basket (2) and the silicon wafer (3).

7. The silicon wafer cleaning equipment according to claim 6, characterized in that: The circulating stirring mechanism (5) comprises: A reflux pipe (501) and a pump air pipe (502), wherein the reflux pipe (501) is arranged at the bottom of the cleaning tank (102) and is used to return the cleaning liquid overflowing from the cleaning tank (102) into the reflux tank (103) to the cleaning tank (102), and the pump air pipe (502) is arranged above the reflux pipe (501), and is provided with a plurality of air holes and is used to pump air upwards to promote the flow of the cleaning liquid.

8. The silicon wafer cleaning equipment according to claim 7, characterized in that: The circulating stirring mechanism (5) further comprises: An air-breaking net (503), wherein the air-breaking net (503) is located above the pump air pipe (502), and the distance between the pump air pipe (502) and the air-breaking net (503) is H; Among them: 10mm≤H≤30mm.

9. The silicon wafer cleaning device according to claim 6, characterized in that: A plurality of guide plates (104) are arranged in the reflow groove (103) along the vertical direction, and the guide plates (104) are provided with a plurality of guide ports (105).

10. A cleaning method for a silicon wafer cleaning device according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1. Adjust the inclination of the flower basket (2) by means of the adjusting mechanism (4); S2, stacking the plurality of flower baskets (2) in sequence and placing them into the cleaning box (1) by means of a robot, and placing the flower baskets (2) in a first state; S3, starting the circulating stirring mechanism (5) to clean the silicon wafer (3) using the cleaning liquid in a stirring state; S4, after the silicon wafer (3) is cleaned, the plurality of flower baskets (2) are sequentially taken out from the cleaning box (1) by a robot, and after being taken out, the flower baskets (2) are in a second state.

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