Surface mounting method, device, equipment and medium

Abstract

The embodiment of the invention discloses a surface mounting method and device, equipment and a medium. The surface mounting method comprises the following steps: coating a first solder paste on a welding contact of one of a surface mounting component and a first bearing circuit board, and heating the first solder paste to form a solder ball; coating a second solder paste on a welding contact of the other one of the surface-mounted component and the first bearing circuit board; assembling the surface-mounted component and the first bearing circuit board, and enabling the corresponding solder balls to be in contact with the second solder paste to form a to-be-welded assembly; and the to-be-welded assembly is heated, and a welded assembly is formed. According to the scheme, bubbles generated in the soldering alloy after welding can be reduced on a large scale, operation is easy, the effect is obvious, and the production cost is greatly reduced.

Description

Technical Field

[0001] The present disclosure relates to the technical field of electronic assembly, and in particular to a surface mounting method, device, equipment and medium. Background Art

[0002] Surface Mount Technology (SMT) is a circuit connection technology that mounts pinless or short-pin surface mount components on the surface of a printed circuit board. After the surface mount technology uses a screen printing process to print solder paste on the printed circuit board, the surface mount components are mounted on the printed circuit board where the solder paste is printed. The reflow soldering process is then used to vaporize and volatilize the flux in the solder paste, and to melt the solder in the solder paste, thereby achieving a welding connection between the contacts of the surface mount components (that is, the aforementioned pins) and the corresponding contacts of the printed circuit board. During the assembly process of surface mount components, the gas formed when the flux vaporizes and volatilizes may remain in the solder paste solder alloy, forming bubble defects; and as the contact area of ​​the surface mount components increases, the gas escape channel becomes smaller, and the probability of bubble defects increases accordingly.

[0003] In order to reduce the formation of bubbles in the solder paste soldering alloy due to the volatilization of flux, the relevant technology proposes to use the solder ball planting process, which reduces the bubble defects by pre-planting solder balls on the solder contact points and using the solder balls to increase the escape channel of the volatilized flux gas. However, the cost of pre-planting solder balls is too high. Considering the cost control issue, pre-planting solder balls has not been widely used in actual applications. Summary of the invention

[0004] In order to solve the above technical problems or at least partially solve the above technical problems, the present disclosure provides a surface mounting method, device, equipment and medium.

[0005] In a first aspect, the present application provides a surface mounting method, the method comprising:

[0006] Applying a first solder paste on solder contacts of one of the surface mount components and the first carrier circuit board, and heating the first solder paste to form solder balls;

[0007] Applying a second solder paste on soldering contacts of the other of the surface mount component and the first load bearing circuit board;

[0008] Assembling the surface mount components and the first load-bearing circuit board so that the corresponding solder balls are in contact with the second solder paste to form a component to be soldered;

[0009] The components to be welded are heated to form welded components.

[0010] Optionally, applying a first solder paste on a solder contact point of one of the surface mount component and the first load-bearing circuit board comprises:

[0011] A first solder paste is applied on soldering contacts of one of the surface mounted components and the first load bearing circuit board by using a screen printing process.

[0012] Optionally, it further includes: the surface mount component is a second carrier circuit board for directly receiving the chip;

[0013] The step of applying the first solder paste on the soldering contacts of one of the surface mounted components and the first load-bearing circuit board comprises: applying the first solder paste on the soldering contacts of one side of the second load-bearing circuit board connected by welding to the first load-bearing circuit board, and heating the first solder paste to form solder balls;

[0014] Before assembling the surface mount components and the first load circuit board, the method further comprises: applying a third solder paste on solder contacts on a side of the second load circuit board used for carrying the chip;

[0015] Mounting the chip on the surface of the second carrier circuit board coated with the third solder paste;

[0016] The third solder paste is heated to enable the chip to be connected to the second carrier circuit board by welding.

[0017] Optionally, applying a third solder paste on the soldering contacts on one side of the second carrier circuit board for carrying the chip further comprises:

[0018] The third solder paste is coated on the soldering contacts on the side of the second carrier circuit board used for carrying the chip by using a screen printing process.

[0019] Optionally, the method further includes: heating the first solder paste to form solder balls, including:

[0020] The first solder paste is heated in a reflow oven to form solder balls.

[0021] Optionally, the method further comprises: applying the first solder paste on the solder contact points of one of the surface mount components and the first load-bearing circuit board, comprising: applying the first solder paste on the solder contact points of one of the surface mount components and the first load-bearing circuit board according to a first coating thickness;

[0022] The step of applying the second solder paste on the soldering contact points of the other one of the surface mount component and the first load bearing circuit board comprises: applying the second solder paste on the soldering contact points of the other one of the surface mount component and the first load bearing circuit board according to a second coating thickness;

[0023] In a second aspect, the present application provides a surface mount control device, comprising:

[0024] A coating control unit, used for controlling the coating of a first solder paste on a soldering contact point of one of the surface mount components and the first load bearing circuit board;

[0025] A heating control unit, used for controlling the heating of the first solder paste to form solder balls;

[0026] The coating control unit is further used to coat a second solder paste on the soldering contact points of the other of the surface mount component and the first load-bearing circuit board;

[0027] An assembly control unit, used for controlling the assembly of the surface mount components and the first load-bearing circuit board, so that the corresponding solder balls contact the second solder paste to form the assembly to be soldered;

[0028] The heating control unit is also used to heat the assembly to be welded to form the welded assembly.

[0029] Optionally, it further includes: the surface mount component is a second carrier circuit board for directly receiving the chip;

[0030] The coating control unit is also used to control coating of a third solder paste on the soldering contacts on one side of the second carrier circuit board carrying the chip;

[0031] The assembly control unit is also used to control the chip to be mounted on the surface of the second carrier circuit board coated with the third solder paste, so that the third solder paste on the second carrier circuit board is in contact with the soldering points corresponding to the chip;

[0032] The heating control unit is further used to heat the third solder paste so that the chip is connected to the second load-bearing circuit board by welding.

[0033] In a third aspect, the present application provides a surface mount device, comprising a processor and a memory, wherein the memory is used to store a computer program; when the computer program is loaded by the processor, the processor executes the surface mount method as described above.

[0034] In a fourth aspect, the present application provides a computer-readable storage medium, wherein the storage medium stores a computer program. When the computer program is executed by a processor, the processor implements the surface mounting method as described above.

[0035] The solution provided by the embodiment of the present disclosure is to pre-coat solder paste on the soldering contacts of the surface mount components or the first carrier circuit board, and then heat the solder paste to form solder balls. After assembling the surface mount components with solder paste on the soldering contacts and the other of the first carrier circuit board, a component to be welded is formed. When heating and welding are then performed, a larger gap is created between the surface mount components and the first carrier circuit board, so that the gas volatilized from the flux in the solder paste can be more easily dissipated, thereby greatly reducing the problem of bubble defects generated in the solder alloy after welding is completed, and increasing the welding yield of the surface mount technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0037] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0038] Figure 1 A flow chart of a surface mounting method according to an embodiment of the present disclosure;

[0039] Figure 2 This is a flow chart of another surface mounting method described in an embodiment of the present disclosure;

[0040] Figure 3 This is a schematic diagram of a module for pre-tinning balls according to an embodiment of the present disclosure;

[0041] Figure 4 It is a schematic diagram of the structure of the assembly to be welded according to the embodiment of the present disclosure;

[0042] Figure 5 It is a schematic diagram of the cross-sectional structure of the assembly to be welded according to the embodiment of the present disclosure;

[0043] Figure 6 A schematic diagram of a surface mount control device according to an embodiment of the present disclosure;

[0044] Figure 7 It is a schematic diagram of another surface mount control device according to an embodiment of the present disclosure;

[0045] Figure 8 A schematic diagram of the device structure provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0046] In order to more clearly understand the above-mentioned objectives, features and advantages of the present disclosure, the scheme of the present disclosure will be further described below. It should be noted that the embodiments of the present disclosure and the features in the embodiments can be combined with each other without conflict.

[0047] In the following description, many specific details are set forth to facilitate a full understanding of the present disclosure, but the present disclosure may also be implemented in other ways different from those described herein; it is obvious that the embodiments in the specification are only part of the embodiments of the present disclosure, rather than all of the embodiments.

[0048] Before introducing a surface mounting method proposed in an embodiment of the present disclosure, a relevant introduction is first made to welding technology and the most popular surface mounting technology in the electronic assembly industry, so as to make it easier to understand the present solution later.

[0049] Because welding technology is one of the basic steps in surface mount technology, we first briefly introduce chip welding technology. Welding technology is to heat high-temperature welding materials to melt the solder to connect chip pins, contacts and circuit boards.

[0050] Next, we will introduce surface mount technology. Surface mount technology, referred to as SMT, can mount some pinless or short-pin surface mount components on the surface of a printed circuit board or other substrate, and then fix them through welding technology to connect the circuits. The basic process components of surface mount technology include: solder paste coating, mounting or curing of parts, reflow soldering, cleaning, testing and rework.

[0051] As analyzed above, surface mount technology uses solder paste as a welding material. Here is a brief introduction to the composition and function of solder paste. Solder paste is a gray paste mixture formed by mixing solder powder, flux and other surfactants, thixotropic agents, etc. Solder paste has a certain viscosity at room temperature and can initially stick electronic components to a predetermined position. At a specific high temperature, the flux, surfactant and thixotropic agent in the solder paste volatilize, and the solder powder melts to achieve the welding connection between the components to be soldered and the printed circuit board.

[0052] When certain surface mount components are soldered to a printed circuit board or other substrate using surface mount technology in the related art, the finished product soldering yield is low. Through analysis, it is found that the reason for this result is that the density of soldering contacts on the surface mount components that need to be soldered to the printed circuit board or other substrate is relatively large, and the distance between each soldering contact is too close. Because the flux, surfactant and thixotropic agent in the solder paste evaporate into gas at high temperature, during the surface mount soldering process, the gas volatilized by the flux will accumulate in large quantities in the gap between the surface mount components and the printed circuit board. Since the gas volatilized by the flux is not easy to be discharged, it will remain in the solder alloy as the soldering is completed to form a large number of bubbles, which ultimately leads to a decrease in the yield of soldering components using surface mount technology.

[0053] At present, the most common method to solve the problem of bubbles generated in the solder alloy after welding in surface mount technology is to plant tin balls on surface mount components. The specific process of planting tin balls is: clean the printed circuit board, select a tin planting screen that matches the solder contacts of the printed circuit board and place it on the printed circuit board. The mesh holes of the tin planting screen need to correspond to the solder contacts on the printed circuit board one by one. Use a scraper to evenly apply solder paste on the tin planting screen, and then heat and cool it to make the solder paste applied on the solder contacts of the printed circuit board form a ball and adhere to the solder contacts. This method of planting tin balls on surface mount components can indeed effectively reduce the bubbles generated in the solder alloy during the welding process, but the use of this method requires that the specifications of the tin planting screen and the printed circuit board are the same, and the solder contacts on the printed circuit board need to be made into a circle with the same size as the mesh holes of the tin planting screen, so it has great limitations. If there are other size and shape requirements for the printed circuit board and the solder contacts, it will not be possible to use the solder ball planting method on the bottom of the circuit board to reduce the bubbles in the solder alloy when the surface mount components are soldered. In addition, the use of solder ball planting technology requires professional equipment and processes, and the cost is relatively high. Therefore, many manufacturers will not use this method to save costs.

[0054] The disclosed embodiment provides a surface mounting method. This solution has no restrictions on the size and shape of the printed circuit board and the solder contact point, and does not require the use of corresponding professional equipment for solder ball planting. It is a low-cost, simple to operate and effective method for solving the problem of a large number of bubbles generated during welding in the component after welding.

[0055] Figure 1 A flow chart of a surface mounting method provided by an embodiment of the present disclosure. Figure 1 As shown, a surface mounting method provided by an embodiment of the present disclosure includes S101-S104.

[0056] The surface mounting method provided by the embodiment of the present disclosure can be controlled by a computer program and executed by a control device, and the corresponding components can be transported to the corresponding machine to execute the corresponding operation steps.

[0057] S101: Apply a first solder paste on solder contacts of one of a surface mounted component and a first carrier circuit board, and heat the first solder paste to form solder balls.

[0058] In a specific implementation, one of the surface mounted components and the first carrier circuit board is selected, and the first solder paste is coated on the solder contact points on its surface using a screen printing process, and then heated using a reflow soldering technology to form solder balls on the first solder paste on the solder contact points on its surface.

[0059] S102: Apply a second solder paste on solder contact points of the other of the surface mount component and the first load bearing circuit board.

[0060] If the first solder paste is applied on the surface mounted components in S101, then in this step, the second solder paste is applied on the solder contacts on the surface of the first load bearing circuit board by using a screen printing process;

[0061] If the first solder paste is applied on the first carrier circuit board in S101, then in this step, the second solder paste is applied on the soldering contacts on the surface of the surface mounted components by using a screen printing process.

[0062] S103: Assembling surface mount components and the first carrier circuit board so that the corresponding solder balls are in contact with the second solder paste to form a component to be soldered.

[0063] The corresponding solder balls on the surface mount components and the first carrier circuit board are brought into contact with each other with the second solder paste, so that the surface mount components and the first carrier circuit board are assembled together to form a component to be soldered, thus preparing for the next step of soldering operation.

[0064] S104: heating the assembly to be welded to form a welded assembly.

[0065] The assembly to be welded, which is composed of surface mounted components and a first load-bearing circuit board, is heated by reflow welding technology, so that the surface mounted components and the first load-bearing circuit board are connected and fixed together to form a welded assembly.

[0066] By adopting the solution provided by the above-mentioned embodiment of the present application, the first solder paste is pre-coated on the soldering contact points of the surface mount components or the first carrier circuit board through the screen printing process, and the first solder paste layer is heated by the reflow soldering technology to form solder balls. In this way, when assembling the components to be welded, since the solder balls are pre-coated on the surface mount components or the first carrier circuit board, the gap between the surface mount components and the first carrier circuit board is increased, so that the gas volatilized by the heat in the solder paste has a larger escape space, which greatly reduces the bubbles in the solder alloy after the welding is completed, reduces the bubble defect problem in the solder alloy, and increases the welding yield of the surface mount technology.

[0067] In the solutions provided in the above-mentioned embodiments of the present application, the surface mount components may be chips or grid array packaging modules, etc.

[0068] In actual production applications, surface mount components can also be a second carrier circuit board for directly receiving chips or electronic modules, so the embodiment of the present application also provides another surface mount method to meet more practical application needs.

[0069] Figure 2 Another surface mounting method flow chart provided by the embodiment of the present disclosure. Figure 2 As shown, another surface mounting method provided by an embodiment of the present disclosure includes S201-S207.

[0070] Another surface mounting method provided by an embodiment of the present disclosure can be controlled by a computer program and executed by a control device, and the corresponding components are transported to a corresponding machine to execute corresponding operation steps.

[0071] S201: applying a first solder paste on soldering contacts on one side of the second carrier circuit board to be soldered to the first carrier circuit board, and heating the first solder paste to form solder balls.

[0072] The first solder paste is coated on the soldering contact points on one side of the second carrier circuit board to be soldered to the first carrier circuit board by using a screen printing process, and the first solder paste is heated to form solder balls, so as to prepare for subsequent soldering with the first carrier circuit board.

[0073] S202: Apply a third solder paste on the soldering contacts on one side of the second carrier circuit board for carrying the chip.

[0074] The third solder paste is applied on the soldering contacts on one side of the second carrier circuit board for carrying the chip by using a screen printing process, so as to prepare for subsequent soldering with the chip.

[0075] S203: Mounting the chip on the surface of the second carrier circuit board coated with the third solder paste.

[0076] The third solder paste on the second carrier circuit board is brought into contact with the soldering contacts corresponding to the chip, and the chip is assembled on the second carrier circuit board.

[0077] S204: heating the third solder paste so that the chip is connected to the second carrier circuit board by welding.

[0078] The second carrier circuit board is heated by reflow soldering technology so that the chip is connected to the second carrier circuit board by soldering.

[0079] S205: Apply a second solder paste on the soldering contacts of the first carrier circuit board.

[0080] The second solder paste is applied on the soldering contacts of the first carrier circuit board by screen printing.

[0081] S206: Assemble the second carrier circuit board and the first carrier circuit board so that the corresponding solder balls are in contact with the second solder paste to form a component to be soldered.

[0082] The corresponding solder balls and second solder pastes on the second carrier circuit board and the first carrier circuit board are brought into contact with each other, so that the second carrier circuit board and the first carrier circuit board are assembled together to form a component to be welded, thereby preparing for the next welding operation.

[0083] S207: heating the assembly to be welded to form a welded assembly.

[0084] The assembly to be welded, which is composed of the second load circuit board and the first load circuit board, is heated by reflow welding technology, so that the second load circuit board and the first load circuit board are connected and fixed together to form a welded assembly.

[0085] By adopting the solution provided by the above-mentioned embodiment of the present application, when welding the second carrier circuit board carrying the chip to the first carrier circuit board, tin balls can be pre-plated on the second carrier circuit board to increase the gap between the second carrier circuit board and the first carrier circuit board. The gas volatilized by the heat in the solder paste can also have a larger escape space, which can greatly reduce the bubble defect problem in the solder alloy between the second carrier circuit board and the first carrier circuit board after the welding is completed, and increase the welding yield of the surface mounting technology. And the solution provided by the present application is not limited by the shape and size of the electronic components and the circuit board welding contacts, which greatly solves the limitations of hardware design. At the same time, the embodiment of the present application takes into account the various situations such as the surface mounting components can be chips or carrier circuit boards, which expands the scope of application of the solution provided by the present application, so that electronic products can be assembled and produced in a low-cost, simple-to-operate, and high-yield manner.

[0086] Figure 3 Schematic diagram of the module of the pre-tinned balls according to the embodiment of the present disclosure. Figure 3As shown, its main structure includes: a solder ball carrying module 301 and a solder ball 302 .

[0087] The solder ball bearing module 301 is used to bear the solder balls on the surface of the solder contact points. The solder ball bearing module 301 can be a surface mounted component, a first bearing circuit board, or a second bearing circuit board.

[0088] The solder balls 302 are used to increase the distance between the boards when connecting the components to be soldered, so that the gas volatilized by the heat in the solder paste has a larger escape space, which greatly reduces the bubble defect problem in the solder alloy after soldering.

[0089] In the two surface mounting methods provided in the embodiments of the present application, the first load circuit board and the second load circuit board can be printed circuit boards. The advantages of using printed circuit boards as load circuit boards in the embodiments of the present application include: achieving high integration of electronic components, improving the complexity and functionality of the circuit; and having higher reliability and lower production costs due to the special manufacturing process.

[0090] In the surface mounting method provided in the embodiment of the present application, a screen printing process is used when applying solder paste, and a screen printing machine is used in actual production.

[0091] In the surface mounting method provided in the embodiment of the present application, reflow soldering technology is used to implement heating and other operations. Reflow soldering technology mainly uses a reflow soldering furnace to heat and cool solder paste and other soldering materials. The reflow soldering furnace is a device with a heating circuit inside, which heats the air or nitrogen to a sufficiently high temperature and blows it toward the printed circuit board on which the electronic components have been attached, so that the soldering materials on both sides of the electronic components melt and bond to the printed circuit board. The advantage of this process is that the temperature is easy to control, oxidation can be avoided during the welding process, and the manufacturing cost is also easier to control.

[0092] Figure 4 This is a schematic diagram of the structure of the assembly to be soldered according to the embodiment of the present disclosure. This figure shows the situation where the first solder paste is applied on the surface mount component or the second load circuit board according to the first coating thickness; and the second solder paste is applied on the first load circuit board according to the second coating thickness. The surface mount component or the second load circuit board can also be interchanged with the first load circuit board, and this application does not limit this; Figure 5 is a schematic diagram of the cross-sectional structure of the corresponding component to be welded. Figure 4 As shown, its main structure includes:

[0093] 401 may be a surface mounted component or a second carrier circuit board;

[0094] 402 is a first carrier circuit board; 403 is a solder ball; 404 is a second solder paste;

[0095] h1 is the distance from the surface of the solder contact of the surface mounted component or the second carrier circuit board to the top of the solder ball;

[0096] h2 is the second coating thickness: the distance from the solder contact surface of the first carrier circuit board to the top of the second solder paste;

[0097] h is the distance from the surface of the surface mounted component or the solder contact point of the second load bearing circuit board to the surface of the solder contact point of the first load bearing circuit board.

[0098] Considering that the surface mount component can be the second carrier circuit board, in the surface mount method provided in the embodiment of the present application, the first solder paste is applied to the solder contact point of one of the surface mount component and the second carrier circuit board according to the first coating thickness. The first coating thickness of the solder paste is controlled by a screen printer so that the first coating thickness is approximately between 0.15-0.6 mm. After the heating treatment of reflow soldering, the shape height of the first solder paste when it becomes a solder ball will change slightly, so h1 should be between 0.15-0.6 mm.

[0099] In the surface mounting method provided in the embodiment of the present application, the second solder paste is applied to the solder contacts of the first load-bearing circuit board according to the second coating thickness. The second coating thickness of the solder paste is controlled by a screen printer so that the second coating thickness h2 is approximately between 0.08-0.3 mm.

[0100] In the surface mounting method provided by the above-mentioned embodiment of the present application, the first coating thickness is greater than the second coating thickness, that is, h1 is greater than h2. So that h is approximately between 0.2-0.8mm. The distance h from the surface of the solder contact of the surface mounted component or the second supporting circuit board to the surface of the solder contact of the first supporting circuit board can determine the specific value of h according to the density of the solder contacts on the surface mounted component or the circuit board. After the thickness of the solder paste and solder balls is specified in this way, the melted solder paste will not flow out of the solder contacts during the heating process, affecting the performance of the finished soldering product. And the height h determined by the thickness of the solder paste and solder balls and the density of the solder contacts allows the gas volatilized by the flux to be discharged as fully as possible during the welding process, which greatly reduces the problem of bubble defects in the solder alloy.

[0101] The embodiment of the present application also provides a surface mount control device. Figure 6 FIG. 1 is a schematic diagram of a surface mount control device according to an embodiment of the present disclosure. Figure 6 As shown, the surface mounting control device includes: a coating control unit 601 , a heating control unit 602 , a coating control unit 603 , an assembly control unit 604 , and a heating control unit 605 .

[0102] The coating control unit 601 is used to control the coating of the first solder paste on the solder contact points of one of the surface mounted components and the first load circuit board. One of the surface mounted components and the first load circuit board is selected, and the first solder paste is coated on the solder contact points on the surface thereof by using a screen printing process according to a first coating thickness.

[0103] The heating control unit 602 is used to control the heating of the first solder paste to form solder balls. The first solder paste is heated by the reflow soldering technology so that the first solder paste on the solder contact points on the surface forms solder balls.

[0104] The coating control unit 603 is used to control the coating of the second solder paste on the solder contact points of the other of the surface mount components and the first load circuit board. The second solder paste is coated on the solder contact points on the surface of the surface mount components or the first load circuit board using a screen printing process according to a second coating thickness, so that the first coating thickness is greater than the second coating thickness.

[0105] The assembly control unit 604 is used to control the assembly of the surface mount components and the first load circuit board, so that the corresponding solder balls and the second solder paste are in contact with each other to form a component to be welded. The surface mount components and the corresponding solder balls and the second solder paste on the first load circuit board are in contact with each other, so that the surface mount components and the first load circuit board are assembled together to form a component to be welded, and prepare for the next step of welding operation.

[0106] The heating control unit 605 is used to control the heating of the assembly to be welded to form a welded assembly. The assembly to be welded consisting of the surface mount components and the first load circuit board is heated by the reflow soldering technology so that the surface mount components and the first load circuit board are connected and fixed together to form a welded assembly.

[0107] The embodiment of the present application also proposes another surface mount control device, taking into account the situation where the surface mount component is a second carrier circuit board for directly receiving the chip. Figure 7 FIG. 1 is a schematic diagram of another surface mount control device according to an embodiment of the present disclosure. Figure 7 As shown, the surface mount control device includes: a coating control unit 701, a heating control unit 702, a coating control unit 703, an assembly control unit 704, a heating control unit 705, a coating control unit 706, an assembly control unit 707, and a heating control unit 708.

[0108] The coating control unit 701 is used to control the coating of the first solder paste on the soldering contact points on one side of the second carrier circuit board and the first carrier circuit board. The first solder paste is controlled to be coated on the soldering contact points on one side of the second carrier circuit board and the first carrier circuit board by a screen printing process, so as to prepare for subsequent welding with the first carrier circuit board.

[0109] The heating control unit 702 is used to control the heating of the first solder paste to form solder balls;

[0110] The coating control unit 703 is used to control the coating of the third solder paste on the soldering contacts on one side of the second carrier circuit board used to carry the chip. The third solder paste is coated on the soldering contacts on one side of the second carrier circuit board used to carry the chip using a screen printing process to prepare for subsequent welding with the chip.

[0111] The assembly control unit 704 is used to control the chip to be mounted on the surface of the second carrier circuit board coated with the third solder paste, so that the third solder paste on the second carrier circuit board contacts the soldering points corresponding to the chip, and the chip is assembled on the second carrier circuit board.

[0112] The heating control unit 705 is used to control the heating of the third solder paste so that the chip is connected to the second carrier circuit board by welding.

[0113] The coating control unit 706 is used to control coating of the second solder paste on the solder contacts of the first load circuit board. The second solder paste is coated on the solder contacts of the first load circuit board by screen printing process, so that the first coating thickness is greater than the second coating thickness.

[0114] The assembly control unit 707 is used to control the assembly of the second carrier circuit board and the first carrier circuit board, so that the corresponding solder balls and the second solder paste are in contact with each other to form a component to be welded. The corresponding solder balls and the second solder paste on the second carrier circuit board and the first carrier circuit board are in contact with each other, so that the second carrier circuit board and the first carrier circuit board are assembled together to form a component to be welded, and prepare for the next step of welding operation.

[0115] The heating control unit 708 is used to control the heating of the assembly to be welded to form a welded assembly. The assembly to be welded consisting of the second load circuit board and the first load circuit board is heated by the reflow soldering technology so that the second load circuit board and the first load circuit board are connected and fixed together to form a welded assembly.

[0116] Figure 8 This is a schematic diagram of the device structure provided by the embodiment of the present disclosure. Figure 8 , which shows a schematic diagram of the structure of a control device suitable for implementing the embodiments of the present disclosure. Figure 8 The control device shown is only an example and should not bring any limitation to the functions and scope of use of the embodiments of the present disclosure.

[0117] like Figure 8As shown, the control device may include a processing device 801 (e.g., a central processing unit, a graphics processing unit, etc.), which can perform various appropriate actions and processes according to a program stored in a read-only memory ROM 802 or a program loaded from a storage device 808 to a random access memory RAM 803. In RAM 803, various programs and data required for the operation of the control device are also stored. The processing device 801, ROM 802, and RAM 803 are connected to each other via a bus 804. In addition, an I / O interface 805, an input device 806, and an output device 807 are also connected to the bus 804.

[0118] In particular, according to an embodiment of the present disclosure, the process described above with reference to the flowchart can be implemented as a computer software program. For example, an embodiment of the present disclosure includes a computer program product, which includes a computer program carried on a non-transitory computer-readable medium, and the computer program contains program code for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from a network through a communication device 809, or installed from a storage device 808, or installed from a ROM 802. When the computer program is executed by the processing device 801, the above-mentioned functions defined in the method of the embodiment of the present disclosure are executed.

[0119] It should be noted that the computer-readable medium disclosed above may be a computer-readable signal medium or a computer-readable storage medium or any combination of the above two. The computer-readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or device, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present disclosure, a computer-readable storage medium may be any tangible medium containing or storing a program, which may be used by or in combination with an instruction execution system, device or device.

[0120] The computer-readable medium may be included in the control device, or may exist independently without being assembled into the control device.

[0121] The embodiments of the present disclosure further provide a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the method of any of the above method embodiments can be implemented.

[0122] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0123] The above description is only a specific embodiment of the present disclosure, so that those skilled in the art can understand or implement the present disclosure. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure will not be limited to the embodiments described herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A surface mounting method, characterized in that: include: Applying a first solder paste on solder contacts of one of the surface mount components and the first carrier circuit board, and heating the first solder paste to form solder balls; Applying a second solder paste on soldering contacts of the other of the surface mount component and the first load bearing circuit board; Assembling the surface mount components and the first load-bearing circuit board so that the corresponding solder balls are in contact with the second solder paste to form a component to be soldered; The components to be welded are heated to form welded components.

2. The method according to claim 1, characterized in that The step of applying a first solder paste on a soldering contact point of one of the surface mounted components and the first load bearing circuit board comprises: A first solder paste is applied on soldering contacts of one of the surface mounted components and the first load bearing circuit board by using a screen printing process.

3. The method according to claim 1, characterized in that The surface mount components are second carrier circuit boards for directly receiving chips; The step of applying the first solder paste on the soldering contacts of one of the surface mounted components and the first load-bearing circuit board comprises: applying the first solder paste on the soldering contacts of one side of the second load-bearing circuit board connected by welding to the first load-bearing circuit board, and heating the first solder paste to form solder balls; Before assembling the surface mount components and the first load circuit board, the method further comprises: applying a third solder paste on solder contacts on a side of the second load circuit board used for carrying the chip; Mounting the chip on the surface of the second carrier circuit board coated with the third solder paste; The third solder paste is heated to enable the chip to be connected to the second carrier circuit board by welding.

4. The method according to claim 3, characterized in that Applying a third solder paste on the soldering contacts on one side of the second carrier circuit board for carrying the chip comprises: The third solder paste is coated on the soldering contacts on the side of the second carrier circuit board used for carrying the chip by using a screen printing process.

5. The method according to claim 3, characterized in that: The step of heating the first solder paste to form solder balls comprises: The first solder paste is heated in a reflow oven to form solder balls.

6. The method according to claim 1, characterized in that The step of applying a first solder paste on a soldering contact point of one of a surface mounted component and a first load bearing circuit board comprises: Applying a first solder paste on soldering contacts of one of the surface mount component and the first load bearing circuit board according to a first coating thickness; The step of applying the second solder paste on the soldering contact points of the other one of the surface mount component and the first load bearing circuit board comprises: applying the second solder paste on the soldering contact points of the other one of the surface mount component and the first load bearing circuit board according to a second coating thickness; The first coating thickness is greater than the second coating thickness.

7. A surface mount control device, characterized in that: include: A coating control unit, used for controlling the coating of a first solder paste on a soldering contact point of one of the surface mount components and the first load bearing circuit board; A heating control unit, used for controlling the heating of the first solder paste to form solder balls; The coating control unit is further used to coat a second solder paste on the soldering contact points of the other of the surface mount component and the first load-bearing circuit board; An assembly control unit, used for controlling the assembly of the surface mount components and the first load-bearing circuit board, so that the corresponding solder balls contact the second solder paste to form the assembly to be soldered; The heating control unit is also used to heat the assembly to be welded to form the welded assembly.

8. The device according to claim 7, characterized in that The surface mount components are second carrier circuit boards for directly receiving chips; The coating control unit is also used to control coating of a third solder paste on the solder contact points on one side of the second carrier circuit board carrying the chip; The assembly control unit is also used to control the chip to be mounted on the surface of the second carrier circuit board coated with the third solder paste, so that the third solder paste on the second carrier circuit board is in contact with the soldering points corresponding to the chip; The heating control unit is further used to heat the third solder paste so that the chip is connected to the second load-bearing circuit board by welding.

9. A surface mount device, characterized in that: It comprises a processor and a memory, wherein the memory is used to store a computer program; when the computer program is loaded by the processor, the processor executes the surface mounting method according to any one of claims 1 to 6.

10. A computer-readable storage medium, characterized in that: The storage medium stores a computer program, and when the computer program is executed by the processor, the processor implements the surface mounting method according to any one of claims 1 to 6.

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