Heat conduction device, radiator and vehicle

Abstract

The invention discloses a heat conduction device which comprises a first cooling assembly and a second cooling assembly, the first cooling assembly comprises a first liquid cooling plate, a heat conduction plate and a first air cooling assembly, at least part of the heat conduction plate is attached to the surface of the first liquid cooling plate, and at least part of the heat conduction plate is attached to the surface of a heating electronic device. The first air cooling assembly is installed above the first liquid cooling plate and used for cooling the first liquid cooling plate, the second cooling assembly is detachably connected with the first liquid cooling plate, and heat exchange can be conducted between the second cooling assembly and the first liquid cooling plate. The invention further discloses a radiator and a vehicle. The heat of the heating electronic device can be quickly conducted to the first liquid cooling plate through the heat conducting plate, and the cooling effect can be improved through the first air cooling assembly.

Description

Technical Field

[0001] The present application relates to the technical field of vehicle parts, and in particular to a heat conduction device, a radiator and a vehicle. Background Art

[0002] As the automotive electronics industry is increasingly moving towards the integration of controllers, new challenges have been raised for heat dissipation. The heat dissipation of heat-generating electronic devices per unit volume is getting higher and higher. In the current existing technology, most heat dissipation solutions use a thermal pad-heat-conducting plate-liquid cooling plate-heat exchanger. However, this method has poor heat conduction effect and cannot adapt to the development process of controllers. Summary of the invention

[0003] The purpose of the present application is to overcome the shortcomings of the prior art and provide a heat conduction device, a radiator and a vehicle, which can improve the cooling effect. The technical solution of the present application provides a heat conduction device, including a first cooling component and a second cooling component, the first cooling component includes a first liquid cooling plate, a heat conduction plate and a first air cooling component, at least a portion of the heat conduction plate is bonded to the surface of the first liquid cooling plate, at least a portion of the heat conduction plate is bonded to the surface of the heat generating electronic device, the first air cooling component is installed above the first liquid cooling plate and is used to cool the first liquid cooling plate, the second cooling component is detachably connected to the first liquid cooling plate and heat exchange can be performed between the second cooling component and the first liquid cooling plate.

[0004] Optionally, the heat conducting plate completely covers the first liquid cooling plate.

[0005] Optionally, the heat conducting plate includes a first bonding portion, a second bonding portion and a connecting portion, the connecting portion connects the first bonding portion and the second bonding portion, the first bonding portion, the second bonding portion and the connecting portion are all heat conductive, at least a portion of the first bonding portion is bonded to the lower surface of the first liquid cooling plate, and at least a portion of the second bonding portion is bonded to the upper surface of the first liquid cooling plate.

[0006] Optionally, a buffer is further included, the buffer includes a first buffer portion, the first buffer portion is arranged between the lower surface of the first liquid cooling plate and the first fitting portion, and the first buffer portion at least covers a portion of the heat-generating electronic device projected onto the first fitting portion.

[0007] Optionally, the buffer member further includes a second buffer portion, which is disposed between the upper surface of the first liquid cooling plate and the second fitting portion, and the second buffer portion at least covers a portion of the first air cooling component projected onto the second fitting portion.

[0008] Optionally, the second cooling assembly includes a second liquid cooling plate and a connecting pipe group, and the first liquid cooling plate and the second liquid cooling plate are detachably connected via the connecting pipe group;

[0009] The first liquid cooling plate is provided with a first liquid inlet and a first liquid outlet, the second liquid cooling plate is provided with a second liquid inlet and a second liquid outlet, and the connecting pipe group connects the first liquid outlet and the second liquid inlet and connects the first liquid inlet and the second liquid outlet.

[0010] Optionally, the connecting pipe group includes a first three-way valve, a second three-way valve, a third three-way valve, a fourth three-way valve, a first connecting pipe, a second connecting pipe, a first circulation pipe and a second circulation pipe;

[0011] The first interface of the first three-way valve is connected to the first liquid outlet and is detachably connected to the first liquid outlet, the first interface of the second three-way valve is connected to the first liquid inlet and is detachably connected to the first liquid inlet, the first interface of the third three-way valve is connected to the second liquid inlet and is detachably connected to the second liquid inlet, and the first interface of the fourth three-way valve is connected to the second liquid outlet and is detachably connected to the second liquid outlet;

[0012] The first circulation pipe is connected to the second interface of the first three-way valve and the second interface of the second three-way valve, and the second circulation pipe is connected to the second interface of the third three-way valve and the second interface of the fourth three-way valve;

[0013] The first connecting pipe is connected to the third interface of the first three-way valve and the third interface of the third three-way valve, and the second connecting pipe is connected to the third interface of the second three-way valve and the fourth three-way valve.

[0014] Optionally, a second air cooling component is further included, wherein the second air cooling component is installed above the second liquid cooling plate and is used to cool the second liquid cooling plate.

[0015] Optionally, the heat conducting plate is made of graphene material.

[0016] Optionally, a mounting shell is further included, wherein the mounting shell is provided with a receiving opening for receiving the heat-generating electronic device, and the first liquid cooling plate and the heat conducting plate are detachably mounted in the receiving opening.

[0017] The invention also discloses a radiator, comprising the above-mentioned heat conducting device.

[0018] The invention also discloses a vehicle, comprising the radiator.

[0019] After adopting the above technical solution, the following beneficial effects are achieved:

[0020] The heat conduction device disclosed in the present application can quickly transfer the heat of the heat-generating electronic device to the first liquid cooling plate through the heat conduction plate. The first liquid cooling plate can be quickly cooled by water cooling, and the first liquid cooling plate can be cooled by the first air cooling component. The cooling effect can be effectively improved by using the combined effect of air cooling and water cooling to adapt to the application of electronic devices with higher power and energy efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The disclosure of the present application will become easier to understand with reference to the accompanying drawings. It should be understood that these drawings are only for illustrative purposes and are not intended to limit the scope of protection of the present application. In the drawings:

[0022] Figure 1 is a schematic diagram of the overall structure of a heat conducting device in one embodiment of the present invention;

[0023] Figure 2 is an exploded view of a heat conducting device in one embodiment of the present invention;

[0024] Figure 3 is a schematic diagram of a heat conducting plate in one embodiment of the present invention;

[0025] Figure 4 is a schematic diagram of a buffer member in one embodiment of the present invention;

[0026] Figure 5 It is a schematic diagram of the internal structure of a heat conducting device in one embodiment of the present invention.

[0027] Reference table of reference numerals:

[0028] A first liquid cooling plate 10;

[0029] Heat conducting plate 20: first laminating portion 201, second laminating portion 202, connecting portion 203;

[0030] A first air cooling assembly 30;

[0031] Buffer 40: a first buffer portion 401 and a second buffer portion 402;

[0032] A second liquid cooling plate 50;

[0033] The connecting pipe group 60 includes a first three-way valve 601, a second three-way valve 602, a third three-way valve 603, a fourth three-way valve 604, a first connecting pipe 605, a second connecting pipe 606, a first circulation pipe 607, and a second circulation pipe 608;

[0034] A second air cooling assembly 70;

[0035] The mounting shell 80 includes a receiving opening 801 and a mounting cavity 802 . DETAILED DESCRIPTION

[0036] The specific implementation of the present application is further described below with reference to the accompanying drawings.

[0037] It is easy to understand that according to the technical solution of the present application, without changing the essential spirit of the present application, a variety of structural modes and implementation modes that can be replaced by those skilled in the art can be replaced with each other. Therefore, the following specific implementation modes and drawings are only exemplary descriptions of the technical solution of the present application, and should not be regarded as the entirety of the present application or as a limitation or restriction on the technical solution of the application.

[0038] The directional terms such as up, down, left, right, front, back, front, back, top, bottom, etc. mentioned or may be mentioned in this specification are defined relative to the structures shown in the drawings. They are relative concepts and may change accordingly according to their different positions and different usage conditions. Therefore, these or other directional terms should not be interpreted as restrictive terms. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0039] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above-mentioned in this application can be understood according to the specific circumstances.

[0040] In one embodiment of the present invention, a heat conducting device is disclosed, such as Figure 1 and Figure 2 As shown, it includes a first cooling component and a second cooling component, the first cooling component includes a first liquid cooling plate 10, a heat conducting plate 20 and a first air cooling component 30, at least a portion of the heat conducting plate 20 is bonded to the surface of the first liquid cooling plate 10, at least a portion of the heat conducting plate 20 is bonded to the surface of the heat generating electronic device, the first air cooling component 30 is installed above the first liquid cooling plate 10 and is used to cool the first liquid cooling plate 10, the second cooling component is detachably connected to the first liquid cooling plate 10 and heat exchange can be achieved between the second cooling component and the first liquid cooling plate 10.

[0041] Furthermore, the heat conducting plate 20 is in contact with the surface of the first liquid cooling plate 10 , thereby increasing the contact area between the heat conducting plate 20 and the first liquid cooling plate 10 , thereby improving the heat transfer efficiency.

[0042] The first liquid cooling plate 10 can be filled with cooling liquid to achieve cooling, thereby achieving the effect of cooling the heat-generating electronic components.

[0043] In addition, the heat conduction device disclosed in the present application also discloses that the first cooling component in the heat conduction device includes a first air cooling component 30, and the first air cooling component 30 can cool the first liquid cooling plate 10 by air to further remove the heat of the first liquid cooling plate 10, thereby further improving the cooling efficiency. A second cooling component is also provided in the present application, wherein the second cooling component is detachably connected to the first liquid cooling plate 10 and can exchange heat with the first liquid cooling plate 10, so that when the cooling effect of the first cooling component is insufficient, the cooling efficiency and effect can be improved by connecting the second cooling component to the first liquid cooling plate 10.

[0044] In some embodiments of the present invention, the heat conducting plate 20 completely covers the first liquid cooling plate 10 .

[0045] Among them, the heat conducting plate 20 is completely covered on the first liquid cooling plate 10 to increase the contact area between the heat conducting plate 20 and the first liquid cooling plate 10, thereby improving the heat conduction efficiency between the first liquid cooling plate 10 and the heat conducting plate 20, so that the heat of the chip can be quickly transferred to the first liquid cooling plate 10 through the heat conducting plate 20, thereby improving the cooling effect.

[0046] In some embodiments of the present invention, Figure 3 As shown, the heat conducting plate 20 includes a first bonding portion 201, a second bonding portion 202 and a connecting portion 203, the connecting portion 203 connects the first bonding portion 201 and the second bonding portion 202, the first bonding portion 201, the second bonding portion 202 and the connecting portion 203 are all heat conductive, at least a portion of the first bonding portion 201 is bonded to the lower surface of the first liquid cooling plate 10, and at least a portion of the second bonding portion 202 is bonded to the upper surface of the first liquid cooling plate 10.

[0047] Further, such as Figure 3 As shown, the first bonding portion 201, the second bonding portion 202 and the connecting portion 203 are a U-shaped structure formed by bending and forming an integral body, and the heat conducting plate 20 wraps at least a portion of the first liquid cooling plate 10, wherein at least a portion of the first bonding portion 201 and the second bonding portion 202 are respectively bonded to the upper surface and the lower surface of the first liquid cooling plate 10, thereby increasing the contact area between the heat conducting plate 20 and the first liquid cooling plate 10 and improving the heat conduction efficiency. Compared with the prior art in which the contact area between the heat generating electronic device and the liquid cooling plate can generally only be the area projected onto the liquid cooling plate by the heat generating electronic device, the present application can achieve the effect of improving the cooling efficiency by increasing the bonding area between the first bonding portion 201 and the second bonding portion 202 and the first liquid cooling plate 10.

[0048] Furthermore, when heat transfer is performed, the heat transfer path is: heat-generating electronic device-heat conducting plate 20-first liquid cooling plate 10. Therefore, the heat conducting plate 20 in the present application is designed as a U-shaped structure, which can perform air cooling on the heat conducting plate 20 when the first air cooling component 30 blows air to the first liquid cooling plate 10, so as to better improve the heat dissipation efficiency.

[0049] In some embodiments of the present invention, Figure 2 and Figure 5 As shown, a buffer member 40 is also included. Figure 4 As shown, the buffer member 40 includes a first buffer portion 401 , which is disposed between the lower surface of the first liquid cooling plate 10 and the first bonding portion 201 , and at least covers a portion of the heat-generating electronic device projected onto the first bonding portion 201 .

[0050] Furthermore, the first buffer portion 401 is foam, and the first buffer portion 401 is arranged between the first bonding portion 201 and the lower surface of the first liquid cooling plate 10, and at least a portion of the first bonding portion 201 remains directly bonded to the lower surface of the first liquid cooling plate 10. The first buffer portion 401 is arranged at the portion where the heat-generating electronic device is projected to the first bonding portion 201, thereby being able to protect the heat-generating electronic device to prevent the heat-generating electronic device from being damaged by greater pressure.

[0051] In some embodiments of the present invention, Figure 4 and Figure 5 As shown, the buffer member 40 further includes a second buffer portion 402 , which is disposed between the upper surface of the first liquid cooling plate 10 and the second fitting portion 202 , and the second buffer portion 402 at least covers a portion of the first air cooling assembly 30 projected onto the second fitting portion 202 .

[0052] Furthermore, the second buffer portion 402 is foam, and the first buffer portion 401 and the second buffer portion 402 are bent and integrally formed to form a U-shaped structure matching the heat conducting plate 20 . The second buffer portion 402 can reduce the squeezing of the first air cooling component 30 on the first liquid cooling plate 10 , thereby protecting the first liquid cooling plate 10 .

[0053] Furthermore, the first air cooling component 30 is a fan, wherein the fan is detachably connected to the upper surface of the first liquid cooling plate 10 by means of buckles or screws, so that the first air cooling component 30 can be modularly designed for easy replacement and maintenance.

[0054] Optionally, since the first air cooling assembly 30 is detachably connected to the first liquid cooling plate 10, it is convenient to select fans of different powers or first air cooling assemblies 30 of different types according to the situation, such as replacing them with heat dissipation fins, to meet different heat dissipation scenarios.

[0055] In some embodiments of the present invention, Figure 1 and Figure 2 As shown, the second cooling assembly includes a second liquid cooling plate 50 and a connecting pipe group 60, and the first liquid cooling plate 10 and the second liquid cooling plate 50 are detachably connected via the connecting pipe group 60;

[0056] The first liquid cooling plate 10 is provided with a first liquid inlet and a first liquid outlet, the second liquid cooling plate 50 is provided with a second liquid inlet and a second liquid outlet, and the connecting pipe group 60 connects the first liquid outlet and the second liquid inlet and connects the first liquid inlet and the second liquid outlet.

[0057] Furthermore, the first liquid cooling plate 10 and the second liquid cooling plate 50 both include a metal plate and a cooling pipe, and at least a portion of the heat conducting plate 20 is bonded to the surface of the metal plate.

[0058] There are multiple groups of cooling pipes, which are arranged in parallel and spaced apart, and adjacent cooling pipes are connected end to end in sequence, so that a closed loop is formed between the multiple groups of cooling pipes, so as to extend the length of the cooling pipes and improve the heat dissipation effect. The cooling pipes are arranged inside the metal plate and conduct heat with the metal plate. The cooling pipes are filled with low-boiling-point coolant. When the heat of the heat-generating electronic device is transferred to the metal plate and the cooling pipes through the heat-conducting plate 20, the low-boiling-point liquid in the cooling pipes undergoes a phase change reaction to boil, thereby being able to quickly take away a large amount of heat.

[0059] Furthermore, if the cooling efficiency of the first liquid cooling plate 10 is insufficient, the coolant in the first liquid cooling plate 10 can flow into the second liquid cooling plate 50 through the connecting pipe group 60, so that the heat can be transferred to the second liquid cooling plate 50 to improve the heat dissipation efficiency.

[0060] The first liquid cooling plate 10 and the second liquid cooling plate 50 can be detachably connected via a connecting pipe group 60. Therefore, when the cooling effect of the first cooling assembly is insufficient, the first liquid cooling plate 10 and the second liquid cooling plate 50 can be connected via the connecting pipe group 60, so that the liquids in the first liquid cooling plate 10 and the second liquid cooling plate 50 can flow mutually to achieve a heat exchange effect, thereby improving the cooling effect. In some embodiments of the present invention, such as Figure 1 As shown, the connecting pipe group 60 includes a first three-way valve 601, a second three-way valve 602, a third three-way valve 603, a fourth three-way valve 604, a first connecting pipe 605, a second connecting pipe 606, a first circulation pipe 607 and a second circulation pipe 608;

[0061] The first interface of the first three-way valve 601 is connected to the first liquid outlet and is detachably connected to the first liquid outlet, the first interface of the second three-way valve 602 is connected to the first liquid inlet and is detachably connected to the first liquid inlet, the first interface of the third three-way valve 603 is connected to the second liquid inlet and is detachably connected to the second liquid inlet, and the first interface of the fourth three-way valve 604 is connected to the second liquid outlet and is detachably connected to the second liquid outlet;

[0062] The first connecting pipe 605 connects the third port of the first three-way valve 601 and the third port of the third three-way valve 603 , and the second connecting pipe 606 connects the third port of the second three-way valve 602 and the fourth three-way valve 604 .

[0063] When the cooling efficiency of the first liquid cooling plate 10 is sufficient, the first three-way valve 601 and the second three-way valve 602 are closed so that the coolant in the first liquid cooling plate 10 can flow through the first circulation pipe 607 for circulation. When the cooling efficiency of the first liquid cooling plate 10 is insufficient, by opening the first three-way valve 601, the second three-way valve 602, the third three-way valve 603 and the fourth three-way valve 604, the boiling coolant in the first liquid cooling plate 10 can flow to the second liquid cooling plate 50 through the first connecting pipe 605, and circulate to the first liquid cooling plate 10 through the second connecting pipe 606, so as to improve the cooling efficiency.

[0064] In some embodiments of the present invention, Figure 1 and Figure 2 As shown, a second air cooling assembly 70 is also included. The second air cooling assembly 70 is installed above the second liquid cooling plate 50 and is used to blow air toward the second liquid cooling plate 50 .

[0065] The second air cooling component 70 is a fan, which is detachably connected to the upper surface of the second liquid cooling plate 50 by means of buckles or screws, so that the second air cooling component 70 can be modularly designed for easy replacement and maintenance. The second air cooling component 70 can improve the heat dissipation efficiency of the second liquid cooling plate 50 to meet higher heat dissipation requirements.

[0066] Optionally, since the second air cooling assembly 70 is detachably connected to the second liquid cooling plate 50, it is convenient to select fans of different powers or different types of second air cooling assemblies 70 according to the situation, such as replacing them with heat dissipation fins, to meet different heat dissipation scenarios.

[0067] In some embodiments of the present invention, Figure 2 As shown, it also includes a mounting shell 80 , in which a receiving opening 801 for receiving a heat-generating electronic device is provided, and the first liquid cooling plate 10 and the heat conducting plate 20 are detachably mounted in the receiving opening 801 .

[0068] Further, such as Figure 5 As shown, the mounting shell 80 is further provided with a mounting cavity 802 for accommodating a circuit board, wherein the mounting cavity 802 is communicated with the accommodating opening 801 through an opening, and the heat-generating electronic device mounted on the circuit board can extend from the opening into the accommodating opening 801. The heat-generating electronic device is generally a chip, and the accommodating opening 801 matches the shape of the first liquid cooling plate 10 and the heat conducting plate 20, wherein the first liquid cooling plate 10 and the heat conducting plate 20 can be detachably mounted in the accommodating opening 801, so as to facilitate disassembly, assembly and replacement, so that different first liquid cooling plates 10 and heat conducting plates 20 can be replaced when different heat dissipation requirements are required, thereby achieving modularization to adapt to different heat dissipation scenarios.

[0069] Furthermore, the first liquid cooling plate 10 and the mounting shell 80 are detachably connected by means of snaps or screws. When the first liquid cooling plate 10 and the mounting shell 80 are fixed, the first liquid cooling plate 10 has a force acting in the direction of the heat-generating electronic device, so that the heat-conducting plate 20 can be tightly pressed between the heat-generating electronic device and the first liquid cooling plate 10, thereby ensuring that the heat-conducting plate 20 can be firmly fitted with the heat-generating electronic device and the first liquid cooling plate 10, respectively, to ensure the heat transfer effect.

[0070] In some embodiments of the present invention, the heat conducting plate 20 is made of graphene material.

[0071] Furthermore, graphene is a sp 2 Graphene is a new material in which hybrid connected carbon atoms are tightly stacked into a single-layer two-dimensional honeycomb lattice structure, and has very good thermal conductivity. The thermal conductivity of pure defect-free single-layer graphene is as high as 5300W / mK, which is the carbon material with the highest thermal conductivity so far, higher than 3500W / mK of single-walled carbon nanotubes and 3000W / mK of multi-walled carbon nanotubes. Therefore, in this application, heat conduction is carried out by using a heat-conducting plate 20. Compared with the prior art that uses a heat-conducting gasket or a heat-conducting gel to achieve heat conduction between a heat-generating electronic device and a liquid cooling plate, the heat-conducting plate 20 used in this application has a thermal conductivity much higher than that of a heat-conducting gasket or a heat-conducting gel, so that the heat conduction efficiency can be greatly improved, so that the heat of the heat-generating electronic device can be quickly transferred to the first liquid cooling plate 10, and the first liquid cooling plate 10 is used for liquid cooling to achieve the effect of quickly cooling the heat-generating electronic device.

[0072] The invention also discloses a radiator, comprising the above-mentioned heat conducting device.

[0073] The invention also discloses a vehicle, comprising the radiator.

[0074] The above description is only the principle and preferred embodiment of the present application. It should be pointed out that, for ordinary technicians in this field, on the basis of the principle of the present application, several other modifications can be made, which should also be regarded as the protection scope of the present application.

Claims

1. A heat conduction device, characterized in that: The invention comprises a first cooling component and a second cooling component, wherein the first cooling component comprises a first liquid cooling plate, a heat conducting plate, and a first air cooling component, wherein at least a portion of the heat conducting plate is in contact with a surface of the first liquid cooling plate, and at least a portion of the heat conducting plate is in contact with a surface of a heat generating electronic device, and the first air cooling component is installed above the first liquid cooling plate and is used to cool the first liquid cooling plate, and the second cooling component is detachably connected to the first liquid cooling plate and heat exchange can be performed between the second cooling component and the first liquid cooling plate.

2. The heat conducting device according to claim 1, characterized in that: The heat conducting plate completely covers the first liquid cooling plate.

3. The heat conducting device according to claim 2, characterized in that: The heat conducting plate includes a first bonding portion, a second bonding portion and a connecting portion, the connecting portion connects the first bonding portion and the second bonding portion, the first bonding portion, the second bonding portion and the connecting portion are all heat conductive, at least a portion of the first bonding portion is bonded to the lower surface of the first liquid cooling plate, and at least a portion of the second bonding portion is bonded to the upper surface of the first liquid cooling plate.

4. The heat conducting device according to claim 3, characterized in that: It also includes a buffer, which includes a first buffer portion, which is arranged between the lower surface of the first liquid cooling plate and the first fitting portion, and the first buffer portion at least covers a portion of the heat-generating electronic component projected onto the first fitting portion.

5. The heat conducting device according to claim 4, characterized in that: The buffer member further includes a second buffer portion, which is disposed between the upper surface of the first liquid cooling plate and the second fitting portion, and the second buffer portion at least covers a portion of the first air cooling component projected onto the second fitting portion.

6. The heat conducting device according to claim 1, characterized in that: The second cooling assembly includes a second liquid cooling plate and a connecting pipe group, and the first liquid cooling plate and the second liquid cooling plate are detachably connected through the connecting pipe group; The first liquid cooling plate is provided with a first liquid inlet and a first liquid outlet, the second liquid cooling plate is provided with a second liquid inlet and a second liquid outlet, and the connecting pipe group connects the first liquid outlet and the second liquid inlet and connects the first liquid inlet and the second liquid outlet.

7. The heat conducting device according to claim 6, characterized in that: The connecting pipe group includes a first three-way valve, a second three-way valve, a third three-way valve, a fourth three-way valve, a first connecting pipe, a second connecting pipe, a first circulation pipe and a second circulation pipe; The first interface of the first three-way valve is connected to the first liquid outlet and is detachably connected to the first liquid outlet, the first interface of the second three-way valve is connected to the first liquid inlet and is detachably connected to the first liquid inlet, the first interface of the third three-way valve is connected to the second liquid inlet and is detachably connected to the second liquid inlet, and the first interface of the fourth three-way valve is connected to the second liquid outlet and is detachably connected to the second liquid outlet; The first circulation pipe is connected to the second interface of the first three-way valve and the second interface of the second three-way valve, and the second circulation pipe is connected to the second interface of the third three-way valve and the second interface of the fourth three-way valve; The first connecting pipe is connected to the third interface of the first three-way valve and the third interface of the third three-way valve, and the second connecting pipe is connected to the third interface of the second three-way valve and the fourth three-way valve.

8. The heat conducting device according to claim 6, characterized in that: It also includes a second air cooling component, which is installed above the second liquid cooling plate and is used to cool the second liquid cooling plate.

9. The heat conducting device according to any one of claims 1 to 8, characterized in that: The heat conducting plate is made of graphene material.

10. The heat conducting device according to any one of claims 1 to 8, characterized in that: It also includes a mounting shell, in which a receiving opening for receiving the heat-generating electronic device is provided, and the first liquid cooling plate and the heat conducting plate are detachably mounted in the receiving opening.

11. A radiator, characterized in that: The heat conducting device comprises the heat conducting device according to any one of claims 1 to 10.

12. A vehicle, characterized in that: Comprising the heat sink as claimed in claim 11.

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