A phase change thermal storage module with high thermal conductivity

Abstract

This invention belongs to the field of phase change thermal control devices and discloses a phase change thermal storage module with high thermal conductivity. The module includes a thermal storage shell, a heat transfer plate assembly, a base plate, and a flow channel cover. The internal structure of the thermal storage shell forms a thermal storage cavity for accommodating the phase change material, and includes a liquid cooling interface, a liquid cooling flow channel, and a heat transfer chamber. The heat transfer plate assembly is arranged close to the heat transfer chamber and includes multiple heat transfer plates that isolate the thermal storage cavity into multiple smaller cavities, thereby allowing heat to diffuse rapidly and uniformly and be transferred to the phase change material. The base plate and flow channel are respectively located on the upper and lower sides of the thermal storage shell. This invention enables the phase change thermal storage module to possess a composite heat dissipation function combining high-efficiency heat transfer, high-efficiency energy storage and heat absorption, and liquid cooling heat dissipation. It effectively solves the technical problems of uneven heat dissipation, low utilization rate of phase change material, and low thermal transient response speed in existing technologies, making it particularly suitable for high-efficiency heat dissipation applications such as active phased array antennas.

Description

Technical Field

[0001] This invention belongs to the field of phase change thermal control devices, and more specifically, relates to a phase change thermal storage module with high thermal conductivity. Background Technology

[0002] Active phased array antennas have been widely used in many fields. With the development and progress of science and technology, the design and development of power amplifier chips for phased array antenna T / R components have a trend towards high power and miniaturization, which has led to increasingly severe heat dissipation problems for active phased array antennas.

[0003] Specifically, in applications with severely limited space and complex thermal environments where heat is difficult to transfer to the outside, structural heat sinks and phase change heat storage are typically chosen for heat dissipation. However, existing structural components, such as aluminum alloys, have small heat sinks and poor heat storage capacity. When the heat dissipation of the phased array antenna is high, it is difficult to dissipate heat through the heat sinks of the structural components themselves. In addition, due to the low thermal conductivity of phase change materials, traditional phase change heat sinks suffer from uneven heat dissipation, low utilization rate of phase change materials, and slow thermal transient response speed, making it difficult to meet the heat dissipation requirements under high power heat dissipation, thus failing to guarantee the temperature environment for the normal operation of the phased array antenna. Summary of the Invention

[0004] To address one or more of the above-mentioned deficiencies or needs of existing technologies, this invention provides a phase change thermal storage module with high thermal conductivity. By studying and improving its internal structure, especially the specific structure and arrangement of key components such as the heat transfer plate assembly and the thermal storage shell, this phase change thermal storage module can combine efficient heat transfer, efficient energy storage and heat absorption, and liquid cooling functions. This effectively solves the technical problems of uneven heat dissipation, low utilization rate of phase change materials, and low thermal transient response speed existing in similar products. Therefore, it is particularly suitable for high-efficiency heat dissipation applications such as active phased array antennas.

[0005] To achieve the above objectives, according to the present invention, a phase change thermal energy storage module with high thermal conductivity is provided, characterized in that the phase change thermal energy storage module includes a thermal energy storage shell, a heat transfer plate assembly, a base plate, and a flow channel cover plate, wherein:

[0006] The internal structure of the thermal storage shell is configured to house the phase change material, and includes a liquid cooling interface, a liquid cooling channel, and a heat transfer cavity. The external liquid cooling working fluid enters through one of the liquid cooling interfaces, flows through the liquid cooling channel and the heat transfer cavity to perform heat exchange, and then flows out from the other liquid cooling interface. The heat transfer cavity serves as the heat input area of ​​the entire phase change thermal storage module, and its wall surface is in contact with external heat transfer devices, forming a heat conduction area within the thermal storage shell and its interior.

[0007] The heat transfer plate assembly is embedded in the heat storage cavity and closely attached to the heat transfer area formed by the heat transfer cavity. It includes multiple heat transfer plates that further isolate the heat storage cavity into multiple small cavities, thereby allowing heat to diffuse rapidly and evenly in the heat storage cavity and be transferred to the phase change material in the heat storage cavity.

[0008] The base plate is disposed at the bottom of the thermal storage shell and is welded to the thermal storage shell to form a sealed integrated structure;

[0009] The flow channel cover is disposed on the top of the thermal storage shell and welded to make the liquid cooling flow channel a sealed flow channel.

[0010] As a further preferred embodiment of the present invention, the heat transfer plate assembly preferably includes a first heat transfer plate, a second heat transfer plate, a third heat transfer plate, and a fourth heat transfer plate, wherein:

[0011] The first heat transfer plate and the second heat transfer plate are positioned opposite each other. Each of them includes a heat-conducting substrate, a plurality of direct heat pipes, and a plurality of bent heat pipes. The heat-conducting substrate is a flat plate structure with a plurality of parallel ribs on its side. A plurality of circular grooves are respectively formed in each of the parallel ribs along the vertical direction, thereby mounting the plurality of direct heat pipes and enhancing axial heat conduction. In addition, a plurality of shaped grooves with different bending forms are arranged at intervals on the flat plate structure, thereby mounting the plurality of bent heat pipes and simultaneously enhancing circumferential and radial heat conduction.

[0012] The third and fourth heat transfer plates are arranged adjacent to each other between the first and second heat transfer plates. They are all flat plate structures, with multiple grooves of different bending processes arranged at intervals on the flat plate structure, and corresponding bent heat pipes are installed.

[0013] As a further preferred embodiment of the present invention, the first heat transfer plate includes a first heat-conducting substrate, a plurality of first straight heat pipes, a bent heat pipe I, a bent heat pipe II, a bent heat pipe III, and a bent heat pipe IV. The first heat-conducting substrate has a flat plate structure with a plurality of parallel ribs on its side. A plurality of first circular grooves are respectively formed in each of the parallel ribs along the vertical direction, thereby mounting the plurality of first straight heat pipes. In addition, a plurality of first-shaped grooves formed by bending in different forms are arranged at intervals on the flat plate structure, thereby mounting the bent heat pipes I, II, III, and IV, and simultaneously enhancing circumferential and radial heat conduction.

[0014] The second heat transfer plate is positioned in front of and behind the first heat transfer plate and is a structural mirror image of the first heat transfer plate, and includes a corresponding second heat-conducting substrate, a direct heat pipe, and a bent heat pipe.

[0015] The third heat transfer plate includes a third heat-conducting substrate, a bent heat pipe V, a bent heat pipe VI, and a bent heat pipe VII. The third heat-conducting substrate has a flat plate structure, and multiple grooves are arranged on the third heat-conducting substrate at intervals, thereby mounting the bent heat pipe V, the bent heat pipe VI, and the bent heat pipe VII.

[0016] The fourth heat transfer plate includes a fourth heat-conducting substrate and a bent heat pipe VIII. The fourth heat-conducting substrate has a flat plate structure, and multiple grooves are arranged on the fourth heat-conducting substrate at intervals, thereby mounting the bent heat pipe VIII.

[0017] As a further preferred embodiment of the present invention, the top and bottom plates of the first, second, third, and fourth thermally conductive substrates are preferably provided with notches, which are used to promote the flow of the molten phase change material in the heat storage cavity and fill the entire heat storage cavity.

[0018] As a further preferred embodiment of the present invention, the heat-conducting substrates of each of the first heat transfer plate, the second heat transfer plate, the third heat transfer plate, and the fourth heat transfer plate are preferably welded together with the heat pipe by soldering.

[0019] As a further preferred embodiment of the present invention, the thermal storage shell preferably further includes a reinforcing support and a limiting boss, wherein the reinforcing support is disposed in the inner cavity of the thermal storage shell to enhance the overall structural rigidity, and at the same time enhance the connection between the thermal storage shell and the base plate and the axial thermal conductivity; the limiting boss is used to limit the heat transfer plate assembly and to provide a welding area to ensure that the heat transfer plate assembly and the thermal storage shell are fitted together as one unit.

[0020] As a further preferred embodiment of the invention, the thermal storage shell preferably further includes a welding step, which is disposed at the weld points between the inner cavity sidewall of the thermal storage shell, the reinforcing support, and the liquid cooling channel with the base plate and the channel cover plate, to ensure overlapping with the required gap. Accordingly, the thermal storage shell is preferably welded to the base plate and the channel cover plate by a locally heated vacuum electron beam.

[0021] As a further preferred embodiment of the present invention, the heat storage shell is preferably made of aluminum alloy, and the heat transfer plate assembly is preferably made of copper alloy; correspondingly, the heat storage shell and the heat transfer plate assembly are preferably welded together by soldering.

[0022] As a further preferred embodiment of the present invention, the liquid cooling interface is preferably located on the bottom outer side of the heat storage shell and isolated from the heat storage cavity; the liquid cooling channel is preferably located on the top surface of the heat storage shell and arranged around the heat transfer cavity.

[0023] As a further preferred embodiment of the present invention, the liquid cooling interface preferably employs a double sealing ring structure for sealing.

[0024] As a further preferred embodiment of the present invention, the phase change material is preferably filled into the heat storage cavity by vacuum filling in the molten state.

[0025] As a further preferred embodiment of the present invention, the above-mentioned phase change thermal storage module is used in high-efficiency heat dissipation applications for products such as active phased array antennas.

[0026] In summary, the technical solutions conceived by this invention have the following main technical advantages compared with the prior art:

[0027] (1) By setting a heat transfer plate assembly in the heat storage cavity, and making targeted improvements to the arrangement and working mechanism of the heat transfer plate assembly in the heat storage cavity, this invention can effectively solve the problem of low thermal conductivity of phase change materials, making it difficult for heat to be transferred quickly and fully absorbed, and meet the heat dissipation requirements under instantaneous high power heat consumption.

[0028] (2) The present invention further optimizes the specific structure and material selection of the heat transfer plate. Many actual tests show that it has the characteristics of high heat dissipation efficiency, compact structure and low contact thermal resistance, which can meet the heat dissipation requirements of high power, high heat flux density and multiple heat sources.

[0029] (3) The present invention also makes a targeted design on the specific structural composition and setting method of the heat storage shell, which can not only realize the integrated design of liquid cooling heat dissipation and phase change heat storage, but also meet the heat dissipation requirements of the equipment during long-term ground joint commissioning, and further improve the heat dissipation capacity of the heat storage module.

[0030] (4) The present invention uses a local heating vacuum electron beam welding method to weld the cavity and flow channel, which can effectively solve the welding problems of incompatibility between copper alloy and thin-walled aluminum alloy and heat pipe is not suitable for vacuum brazing.

[0031] (5) In addition, by using vacuum filling, the present invention can ensure that no gas remains in the heat storage cavity, and ensure that the molten phase change material fills the entire heat storage cavity. Attached Figure Description

[0032] Figure 1 This is an exploded perspective view of the phase change thermal energy storage module provided in this application;

[0033] Figure 2 This is a cross-sectional view of the overall structure of the phase change thermal energy storage module provided in this application;

[0034] Figure 3This is a diagram showing the arrangement of the heat transfer plate assembly in the heat storage cavity according to a preferred embodiment of this application;

[0035] Figure 4 This is a three-dimensional structural view of a heat storage shell according to a preferred embodiment of this application;

[0036] Figure 5 This is another structural perspective view of the heat storage shell according to a preferred embodiment of this application;

[0037] Figure 6 This is a schematic diagram of the inner cavity of the heat storage shell according to a preferred embodiment of this application;

[0038] Figure 7 This is a schematic diagram of the flow channel arrangement of the heat storage shell according to a preferred embodiment of this application;

[0039] Figure 8 This is a schematic diagram of the double-sealed structure of the liquid cooling interface according to a preferred embodiment of this application;

[0040] Figure 9 This is a schematic diagram of the heat transfer plate assembly according to a preferred embodiment of this application;

[0041] Figure 10 This is an exploded view of the structure of the first heat transfer plate according to a preferred embodiment of this application;

[0042] Figure 11 yes Figure 10 A schematic diagram of the structure of the heat-conducting substrate of the first heat transfer plate shown in the figure;

[0043] Figure 12 This is an exploded view of the structure of the second heat transfer plate according to a preferred embodiment of this application;

[0044] Figure 13 This is a schematic diagram of the structure of the third heat transfer plate according to a preferred embodiment of this application.

[0045] Figure 14 This is a schematic diagram of the structure of the fourth heat transfer plate according to a preferred embodiment of this application;

[0046] In all the accompanying drawings, the same reference numerals are used to denote the same elements or structures, wherein:

[0047] 1. Heat storage shell; 11. Liquid cooling interface; 111. Fluid connector; 112. Sealing ring; 12. Liquid cooling channel; 13. Reinforcing support; 14. Welding step; 15. Limiting boss; 16. Heat transfer cavity; 2. Heat transfer plate assembly; 21. First heat transfer plate; 211. First heat-conducting substrate; 2111. First circular groove; 2112. First groove; 2113. First notch; 212. First straight heat pipe; 213. Bent heat pipe I ; 214, Bending heat pipe II; 215, Bending heat pipe III; 216, Bending heat pipe IV; 22, Second heat transfer plate; 221, Second heat-conducting substrate; 23, Third heat transfer plate; 231, Third heat-conducting substrate; 232, Bending heat pipe V; 233, Bending heat pipe VI; 234, Bending heat pipe VII; 24, Fourth heat transfer plate; 241, Fourth heat-conducting substrate; 242, Bending heat pipe VIII; 3, Base plate; 4, Flow channel cover plate; 5, Phase change material. Detailed Implementation

[0048] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0049] It should be understood that expressions such as "comprising" and "may include" as used in this application indicate the existence of the disclosed functions, operations, or constituent elements, and do not limit one or more additional functions, operations, and constituent elements. In this application, terms such as "comprising" and / or "having" may be interpreted as indicating a specific characteristic, number, operation, constituent element, component, or combination thereof, but should not be interpreted as excluding the existence or possibility of adding one or more other characteristics, numbers, operations, constituent elements, components, or combinations thereof.

[0050] It should be understood that the terms “center,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “inner,” “outer,” “clockwise,” “counterclockwise,” “axial,” “radial,” and “circumferential” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0051] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0052] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0053] Figure 1 This is an exploded perspective view of the phase change thermal energy storage module provided in this application. Figure 2 This is a cross-sectional view of the overall structure of the phase change thermal energy storage module provided in this application. The following will be combined with... Figure 1 and Figure 2 To explain the invention in more detail.

[0054] This invention provides a phase change thermal energy storage module with high thermal conductivity. The phase change thermal energy storage module mainly includes components such as a thermal energy storage shell 1, a heat transfer plate assembly 2, a base plate 3, and a flow channel cover plate 4. The key components such as the thermal energy storage shell 1 and the heat transfer plate assembly 2 have been redesigned and optimized.

[0055] like Figure 1 and Figure 2 As shown, the heat storage shell 1 is the main body of the heat storage module. The heat transfer plate assembly 2 is arranged in the inner cavity of the heat storage shell 1 and can be welded together, for example, by soldering. The heat storage shell 1 and the base plate 3 can be welded together by vacuum electron beam welding to form a sealed space. The heat storage shell 1 and the flow channel cover plate 4 are combined to form a cooling flow channel, which provides liquid cooling heat dissipation for the equipment after being connected to an external liquid cooling source. The phase change material 5 can be filled into the inner cavity of the heat storage shell 1 by vacuum filling in the molten state, ensuring that the molten phase change material fills the entire heat storage inner cavity. The phase change material 5 is used to absorb the heat of the product. When it absorbs heat and the temperature reaches the melting point of the phase change material, the phase change material undergoes a phase change. During the phase change process, the latent heat of phase change plays a role and can absorb a large amount of heat.

[0056] As one of the key components of this invention, the internal structure of the heat storage shell 1 is configured to accommodate the phase change material 5 and includes structures such as a liquid cooling interface 11, a liquid cooling channel 12, and a heat transfer cavity 16. The external liquid cooling working fluid enters through one of the liquid cooling interfaces 11, flows through the liquid cooling channel 12 and the heat transfer cavity 16 to perform heat exchange, and then flows out from the other liquid cooling interface 11. The heat transfer cavity 16 serves as the heat input area of ​​the entire phase change heat storage module, its wall surface is in contact with the external heat transfer device, and it forms a heat conduction area in the heat storage shell 1 and its interior.

[0057] More specifically, see also Figures 4 to 7 The thermal storage shell 1 may specifically include components such as a liquid cooling interface 11, a liquid cooling flow channel 12, a reinforcing support 13, a welding step 14, a limiting boss 15, and a heat transfer cavity 16. External heat is introduced into the thermal storage shell 1 and its interior via heat conduction through the heat transfer cavity 16. The heat is then rapidly and uniformly diffused within the thermal storage cavity by the heat transfer plate assembly 2 fixed to the thermal storage shell 1, and transferred to the phase change material 5. The reinforcing support 13, welding step 14, and limiting boss 15 are structural features that enhance the welding effect of the thermal storage shell 1.

[0058] According to a preferred embodiment of the present invention, the reinforcing support 13 can be located at a point where the distance between the heat storage cavity and the side wall is relatively large. This serves to enhance the structural rigidity and ensure the pressure resistance of the heat storage cavity, preventing bulging caused by an increased span in the welding area. It also enhances the connection with the base plate 3 and the axial heat conduction capability. The welding step 14 can be located at the welding points of the heat storage shell 1 cavity side wall, the reinforcing support 13, the liquid cooling channel 12, etc., where welding to the base plate 3 and the channel cover plate 4 is required. This ensures the cavity and cover plate overlap and maintains a precise gap between them, guaranteeing the welding effect of vacuum electron beam welding. Furthermore, the limiting boss 15 provides a limiting position for the heat transfer plate assembly 2 and provides a soldering area for soldering the heat transfer plate assembly 2 together, allowing the heat transfer plate assembly 2 to fit snugly against the heat storage shell 1, reducing contact thermal resistance and improving heat transfer efficiency.

[0059] According to another preferred embodiment of the present invention, both the liquid cooling channel 12 and the liquid cooling interface 11 are disposed on the outside of the heat storage shell, isolated from the heat storage cavity. The channel cover plate 4 is welded to form a sealed channel. To avoid forming a multi-layer welded structure, the liquid cooling channel 12 is preferably arranged on the top surface of the heat storage shell 1 and mainly around the heat transfer cavity 16 to reduce the heat transfer path. The liquid cooling interface 11 is used to connect with an external fluid connector and can adopt a double sealing ring structure to increase the sealing reliability of the liquid cooling interface. When the heat storage module is connected to an external liquid cooling source through the external fluid connector, the liquid cooling working fluid enters from the liquid cooling interface 11 and flows through the heat transfer cavity 16 surrounded by the liquid cooling channel 12. A large amount of heat can be carried away through heat exchange, and finally enters and exits from the other liquid cooling interface 11. The heat transfer cavity 16 is the heat input area of ​​the heat storage module. Its wall surface is in contact with the external heat transfer device, and the heat is transferred to the inside of the heat storage module through heat conduction.

[0060] As another key component of the present invention, the heat transfer plate assembly 2 is embedded in the heat storage cavity and closely attached to the heat transfer area formed by the heat transfer cavity 16. It includes multiple heat transfer plates that further isolate the heat storage cavity into multiple small cavities, thereby enabling heat to diffuse rapidly and uniformly in the heat storage cavity and be transferred to the phase change material 5 in the heat storage cavity.

[0061] More specifically, according to another preferred embodiment of the invention, such as Figure 9 As shown, the heat transfer plate assembly 2 preferably includes a first heat transfer plate 21, a second heat transfer plate 22, a third heat transfer plate 23, and a fourth heat transfer plate 24. The first heat transfer plate 21 and the second heat transfer plate 22 are positioned opposite each other, each including a heat-conducting substrate, a plurality of direct heat pipes, and a plurality of bent heat pipes. The heat-conducting substrate is a flat plate structure with a plurality of parallel ribs on its sides. A plurality of circular grooves are respectively formed vertically in each of the parallel ribs, thereby mounting the plurality of direct heat pipes and enhancing axial heat conduction. Furthermore, a plurality of shaped grooves with different bending forms are arranged at intervals on the flat plate structure, thereby mounting the plurality of bent heat pipes and simultaneously enhancing circumferential and radial heat conduction. Additionally, the third heat transfer plate 23 and the fourth heat transfer plate 24 are arranged adjacent to each other between the first heat transfer plate 21 and the second heat transfer plate 22. They are both flat plate structures, with a plurality of shaped grooves with different bending forms arranged at intervals on these flat plate structures, and correspondingly mounting bent heat pipes.

[0062] See also Figures 10 to 14The first heat transfer plate 21 may specifically include a first heat-conducting substrate 211, a plurality of first straight heat pipes 212, bent heat pipe I 213, bent heat pipe II 214, bent heat pipe III 215, and bent heat pipe IV 216. The first heat-conducting substrate 211 has a flat plate structure with a plurality of parallel ribs on its side. A plurality of first circular grooves 2111 are respectively opened in each of the parallel ribs along the vertical direction, thereby installing the plurality of first straight heat pipes 212. In addition, a plurality of first grooves 2112 bent in different forms are arranged at intervals on the flat plate structure, thereby installing the bent heat pipes I 213, bent heat pipe II 214, bent heat pipe III 215, and bent heat pipe IV 216, and playing the role of simultaneously enhancing circumferential heat conduction and radial heat conduction. The second heat transfer plate 22 is positioned in front of and behind the first heat transfer plate 21 and is a structural mirror image of each other, and includes a corresponding second heat-conducting substrate 221, as well as a direct heat pipe and a bent heat pipe.

[0063] The third heat transfer plate 23 includes a third heat-conducting substrate 231, bent heat pipes V 232, VI 233, and VII 234. The third heat-conducting substrate 231 has a flat plate structure, with multiple grooves spaced apart on it for mounting the bent heat pipes V 232, VI 233, and VII 234. The fourth heat transfer plate 24 includes a fourth heat-conducting substrate 241 and bent heat pipe VIII 242. The fourth heat-conducting substrate 241 has a flat plate structure, with multiple grooves spaced apart on it for mounting the bent heat pipe VIII 242. Furthermore, the top and bottom plates of the first heat-conducting substrate 211, second heat-conducting substrate 221, third heat-conducting substrate 231, and fourth heat-conducting substrate 241 preferably also have notches.

[0064] Through the above design, the straight pipe enhances the axial heat conduction of the thermal storage module, and the bent pipe enhances the axial heat conduction of the thermal storage module. Simultaneously, it also enhances the radial heat conduction of the thermal storage module, thereby improving the overall thermal conductivity within the module, resulting in a more uniform temperature distribution and increased overall utilization of the phase change material. Furthermore, since the heat transfer plate assembly 2 isolates the inner cavity of the thermal storage shell 1 into multiple small cavities, the notches 2113 at the top and bottom of the heat-conducting substrate facilitate the flow of the molten phase change material 5 within the thermal storage cavity, ensuring that the phase change material 5 fills the entire thermal storage cavity.

[0065] Revisit Figure 1 and Figure 2The base plate 3 is disposed at the bottom of the heat storage shell 1 and welded to the heat storage shell 1 to form a sealed integrated structure; the flow channel cover plate 4 is disposed at the top of the heat storage shell 1 and welded so that the liquid cooling flow channel 12 constitutes a sealed flow channel.

[0066] According to another preferred embodiment of the present invention, the liquid cooling interface 11 is preferably disposed on the bottom outer side of the heat storage shell 1 and isolated from the heat storage cavity; the liquid cooling channel 12 is preferably disposed on the top surface of the heat storage shell 1 and arranged around the heat transfer cavity 16. In this way, not only can the integrated design of liquid cooling heat dissipation and phase change heat storage be realized, but the heat dissipation requirements during long-term ground commissioning of the equipment can also be met, further improving the heat dissipation capacity of the heat storage module.

[0067] According to another preferred embodiment of the present invention, the heat storage shell 1 is preferably made of aluminum alloy, and the heat transfer plate assembly 2 is preferably made of copper alloy; correspondingly, the heat storage cavity is welded by a vacuum electron beam with localized heating. In this way, the welding problems of incompatibility between copper alloy and thin-walled aluminum alloy and the unsuitability of heat pipes for vacuum brazing can be effectively solved.

[0068] More specifically, because a heat transfer plate is installed inside the heat storage shell, but the heat transfer plate (copper alloy) and the heat storage shell (aluminum alloy) have significantly different specific heat capacities and inconsistent coefficients of expansion, brazing in a multi-layered structure is difficult, easily leading to perforation at the thin-walled aluminum alloy shell and causing welding failure. Therefore, the internal components of the heat storage module (between the heat-conducting substrate and the heat pipe, and between the heat transfer components and the heat storage shell) are soldered using tin soldering; the external components (between the heat storage shell and the base plate, and between the heat storage shell and the flow channel cover) are welded using vacuum electron beam welding. Vacuum electron beam welding, through electron beam emission, focusing, molten pool control, and adjustment of the welding process, allows for precise control and high-quality welding. Furthermore, vacuum electron beam welding is a localized heating welding method, effectively solving the welding problem where the built-in heat pipe components cannot withstand high temperatures (<200℃) and are therefore unsuitable for vacuum brazing.

[0069] According to another preferred embodiment of the present invention, the phase change material 5 is preferably filled into the heat storage cavity by vacuum filling while in a molten state. This ensures that no gas remains in the heat storage cavity, guaranteeing that the molten phase change material fills the entire heat storage cavity. Furthermore, it is also preferable to use friction stir welding to seal the filling port without leaving a trace, thereby ensuring airtightness.

[0070] In summary, the phase change thermal energy storage module according to the present invention enables the phase change thermal energy storage module to have a composite heat dissipation function that combines high-efficiency heat transfer, high-efficiency energy storage and heat absorption, and liquid cooling. It effectively solves the technical problems of uneven heat dissipation, low utilization rate of phase change materials, and low thermal transient response speed that exist in existing similar products. Therefore, it is particularly suitable for high-efficiency heat dissipation applications such as active phased array antennas, and has good practical value and application prospects.

[0071] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A phase change thermal energy storage module with high thermal conductivity, characterized in that, The phase change thermal storage module includes a thermal storage shell (1), a heat transfer plate assembly (2), a base plate (3), and a flow channel cover plate (4), wherein: The interior of the heat storage shell (1) is configured to accommodate the phase change material (5) and includes a liquid cooling interface (11), a liquid cooling channel (12), and a heat transfer cavity (16). The external liquid cooling working fluid enters through one of the liquid cooling interfaces (11), flows through the liquid cooling channel (12) and the heat transfer cavity (16) to perform heat exchange, and then flows out from the other liquid cooling interface (11). The heat transfer cavity (16) serves as the heat input area of ​​the entire phase change heat storage module. Its wall is in contact with the external heat transfer device and forms a heat conduction area in the heat storage shell (1) and its interior. The heat transfer plate assembly (2) is fitted into the heat storage cavity and closely adheres to the heat conduction area formed by the heat transfer cavity body (16). It includes multiple heat transfer plates that further isolate the heat storage cavity into multiple small cavities, thereby allowing heat to diffuse rapidly and uniformly within the heat storage cavity and be transferred to the phase change material (5) within the heat storage cavity. The heat transfer plate assembly (2) includes a first heat transfer plate (21), a second heat transfer plate (22), a third heat transfer plate (23), and a fourth heat transfer plate (24), wherein: The first heat transfer plate (21) and the second heat transfer plate (22) are positioned opposite each other and are structural mirror images of each other; the first heat transfer plate (21) includes a first heat-conducting substrate (211), a plurality of first straight heat pipes (212), bent heat pipe I (213), bent heat pipe II (214), bent heat pipe III (215) and bent heat pipe IV (216), wherein the first heat-conducting substrate (211) has a flat plate structure with a plurality of parallel ribs on its side, and a plurality of first circular grooves (2111) are respectively opened along the vertical direction on each of the parallel ribs. In this section, the plurality of first direct heat pipes (212) are thus installed; in addition, a plurality of first type grooves (2112) bent in different forms are arranged at intervals on the flat plate structure, thereby installing the bent heat pipes I (213), II (214), III (215) and IV (216), and serving to simultaneously enhance circumferential and radial heat conduction; the second heat transfer plate (22) includes a corresponding second heat conduction substrate (221) as well as direct heat pipes and bent heat pipes; The third heat transfer plate (23) and the fourth heat transfer plate (24) are arranged adjacent to each other between the first heat transfer plate (21) and the second heat transfer plate (22); the third heat transfer plate (23) includes a third heat-conducting substrate (231), a bent heat pipe V (232), a bent heat pipe VI (233) and a bent heat pipe VII (234), wherein the third heat-conducting substrate (231) has a flat plate structure, and multiple grooves are arranged on the third heat-conducting substrate (231) at intervals, thereby installing the bent heat pipe V (232), the bent heat pipe VI (233) and the bent heat pipe VII (234); the fourth heat transfer plate (24) includes a fourth heat-conducting substrate (241) and a bent heat pipe VIII (242), wherein the fourth heat-conducting substrate (241) has a flat plate structure, and multiple grooves are arranged on the fourth heat-conducting substrate (241) at intervals, thereby installing the bent heat pipe VIII (242); The base plate (3) is disposed at the bottom of the heat storage shell (1) and is welded to the heat storage shell (1) to form a sealed integrated structure; The flow channel cover (4) is disposed on the top of the heat storage shell (1) and welded so that the liquid cooling flow channel (12) forms a sealed flow channel.

2. The phase change thermal energy storage module as described in claim 1, characterized in that, The top and bottom plates of the first thermally conductive substrate (211), the second thermally conductive substrate (221), the third thermally conductive substrate (231), and the fourth thermally conductive substrate (241) are respectively provided with notches. These notches are used to promote the flow of the molten phase change material (5) in the heat storage cavity and to fill the entire heat storage cavity.

3. The phase change thermal energy storage module as described in claim 2, characterized in that, The heat storage shell (1) also includes a reinforcing support (13) and a limiting boss (15). The reinforcing support (13) is disposed in the inner cavity of the heat storage shell (1) to enhance the overall structural rigidity and enhance the connection and axial thermal conductivity between the heat storage shell (1) and the base plate (3). The limiting boss (15) is used to limit the heat transfer plate assembly (2) and provide a welding area to ensure that the heat transfer plate assembly (2) and the heat storage shell (1) are fitted together.

4. The phase change thermal energy storage module as described in claim 3, characterized in that, The heat storage shell (1) also includes a welding step (14), which is provided at the welding points between the inner cavity sidewall of the heat storage shell (1), the reinforcing support (13), and the liquid cooling channel (12) and the base plate (3) and the channel cover plate (4) to ensure that the overlap is made with the required gap; accordingly, the heat storage shell (1) is welded to the base plate (3) and the channel cover plate (4) by means of local heating vacuum electron beam.

5. The phase change thermal energy storage module as described in claim 4, characterized in that, The heat storage shell (1) is made of aluminum alloy, and the heat transfer plate assembly (2) is made of copper alloy; accordingly, the heat storage shell (1) and the heat transfer plate assembly (2) are welded together by soldering.

6. The phase change thermal energy storage module as described in claim 5, characterized in that, Each of the liquid cooling interfaces (11) is located on the bottom outer side of the heat storage shell (1) and is isolated from the heat storage cavity; the liquid cooling channel (12) is located on the top surface of the heat storage shell (1) and is arranged around the heat transfer cavity (16).

7. The phase change thermal energy storage module as described in claim 6, characterized in that, The phase change material (5) is filled into the heat storage cavity in a molten state using a vacuum filling method.

8. The phase change thermal energy storage module as described in any one of claims 1-7, characterized in that, The aforementioned phase change thermal storage module is used for high-efficiency heat dissipation applications of active phased array antennas.

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