Display panel, preparation method thereof and display device

Abstract

The invention discloses a display panel, a preparation method thereof and a display device, and the display panel comprises an array substrate which is provided with a plurality of bonding pads; a plurality of light emitting elements disposed on the plurality of pads; wherein the array substrate is provided with a plurality of bonding areas, each bonding area comprises at least one bonding pad, and in the same bonding area, the target potential corresponding to the bonding area is inversely proportional to the target brightness corresponding to the light-emitting element; the target potential corresponding to the bonding area represents the potential of the bonding pad in the bonding area before the light-emitting element is bonded; the target brightness corresponding to the light-emitting element represents the light-emitting brightness of the light-emitting element before the light-emitting element is bonded to the bonding area. According to the design, the display uniformity of the display panel can be improved.

Description

Technical Field

[0001] The present invention belongs to the field of display technology, and in particular, relates to a display panel and a preparation method thereof, and a display device. Background Art

[0002] Display panels have become mainstream products on the market, and there are more and more types of them, such as Mirco-LED display panels, liquid crystal display panels, organic light emitting diode display panels, plasma display panels, etc.

[0003] However, the inventor of the present application has discovered that the current display panel still has a problem of uneven display brightness. Summary of the invention

[0004] The present application provides a display panel and a method for manufacturing the same, and a display device, which can improve display uniformity.

[0005] According to a first aspect of an embodiment of the present application, there is provided a display panel, comprising: an array substrate, provided with a plurality of solder pads; and a plurality of light-emitting elements, arranged on the plurality of solder pads; wherein the array substrate is provided with a plurality of bonding areas, each of the bonding areas comprises at least one of the solder pads, and within the same bonding area, a target potential corresponding to the bonding area is inversely proportional to a target brightness corresponding to the light-emitting element; and the target potential corresponding to the bonding area represents the potential of the solder pads in the bonding area before the light-emitting element is bonded; and the target brightness corresponding to the light-emitting element represents the light-emitting brightness of the light-emitting element before it is bonded to the bonding area.

[0006] A second aspect of an embodiment of the present application provides a display device, which includes the display panel described in any one of the above items.

[0007] A third aspect of an embodiment of the present application provides a method for preparing a display panel, the method comprising: bonding a plurality of light-emitting elements to a plurality of pads of an array substrate; wherein the array substrate is provided with a plurality of bonding areas, each of the bonding areas comprises at least one of the pads, and within the same bonding area, a target potential corresponding to the bonding area is inversely proportional to a target brightness corresponding to the light-emitting element; and the target potential corresponding to the bonding area represents the potential of the pads in the bonding area before the light-emitting element is bonded; and the target brightness corresponding to the light-emitting element represents the light-emitting brightness of the light-emitting element before it is bonded to the bonding area.

[0008] The beneficial effects are as follows: the display panel of the present application includes an array substrate, which is provided with a plurality of pads; a plurality of light-emitting elements are arranged on the plurality of pads; wherein the array substrate is provided with a plurality of bonding areas, each bonding area includes at least one pad, and within the same bonding area, the target potential corresponding to the bonding area is inversely proportional to the target brightness corresponding to the light-emitting element; and the target potential corresponding to the bonding area indicates the potential of the pad in the bonding area before the light-emitting element is bonded; the target brightness corresponding to the light-emitting element indicates the luminous brightness of the light-emitting element before it is bonded to the bonding area. The present application is set in the same bonding area, and the target potential corresponding to the bonding area is inversely proportional to the target brightness of the light-emitting element, that is, the target brightness of the light-emitting element on the bonding area with a low target potential is high, and the target brightness of the light-emitting element on the bonding area with a high target potential is low. This setting can offset the strong and weak, thereby reducing the accumulation of unevenness and ensuring the uniformity of the display brightness. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0010] Figure 1 It is a schematic structural diagram of an embodiment of a display panel of the present application;

[0011] Figure 2 yes Figure 1 A schematic diagram of the structure of the array substrate;

[0012] Figure 3 It is a structural schematic diagram of an embodiment of a display device of the present application;

[0013] Figure 4 It is a schematic diagram of the process of obtaining the target potential corresponding to the bonding area in this application;

[0014] Figure 5 yes Figure 1 A schematic diagram of the structure of the array substrate in an application scenario;

[0015] Figure 6 is a schematic diagram of the process of comparing the thicknesses of multiple light-emitting elements in the present application;

[0016] Figure 7 is a schematic diagram of transferring a plurality of light-emitting elements from a wafer to a temporary substrate in the present application;

[0017] Figure 8 It is a schematic diagram of the structure of the wafer of the present application in an application scenario. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0019] It should be noted that the terms "first" and "second" in this application are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first" and "second" can explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0020] See also Figure 1 and Figure 2 In one embodiment of the present application, the display panel 100 includes an array substrate 10 and a plurality of light emitting elements 20 .

[0021] The array substrate 10 is provided with a plurality of pads 11. Specifically, the array substrate 10 includes a plurality of signal lines (not shown) and pads 11, the pads 11 are connected by signal lines, the array substrate 10 communicates with the outside world through the plurality of pads 11, and the array substrate 10 is used to carry signal lines, pads 11 and light-emitting elements 20. Among them, the array substrate 10 also includes a substrate (not shown) and a driving circuit (not shown) disposed on the substrate for driving the light-emitting elements 20 to emit light, wherein the substrate may be a flexible substrate or an inflexible substrate, which is not limited here. Among them, the arrangement of the pads 11 on the array substrate 10 is arranged and combined according to actual needs, and this application does not limit it.

[0022] A plurality of light emitting elements 20 are arranged on a plurality of pads 11. Specifically, the light emitting elements 20 are electrically connected to the pads 11, and the light emitting elements 20 emit light under the drive of the array substrate 10. The plurality of light emitting elements 20 and the plurality of pads 11 can be arranged in a one-to-one correspondence, and the light emitting elements 20 are arranged on the corresponding pads 11.

[0023] At the same time, the array substrate 10 is provided with a plurality of bonding areas 12, each bonding area 12 includes at least one pad 11, and within the same bonding area 12, the target potential corresponding to the bonding area 12 is inversely proportional to the target brightness of the light-emitting element 20. The target potential corresponding to the bonding area 12 indicates the potential of the pad 11 in the bonding area 12 before the light-emitting element 20 is bonded; the target brightness corresponding to the light-emitting element 20 indicates the light-emitting brightness of the light-emitting element 20 before it is bonded to the bonding area 12.

[0024] Specifically, the bonding area 12 includes one pad 11 or a plurality of pads 11 , and different bonding areas 12 may include the same number of pads 11 or different numbers of pads 11 , and the shapes of the bonding areas 12 may be the same or different.

[0025] Before the array substrate 10 is bonded with the light emitting element 20, a test signal is input to the array substrate 10 to obtain the potential of each pad 11 in each bonding area 12, and for any bonding area 12, a target potential of the bonding area 12 is obtained according to the potential of each pad 11 in the bonding area 12, and the target potential can represent the overall potential of the pads 11 in the bonding area 12 when the test signal is input. It can be understood that if the same light emitting element 20 is bonded to two different bonding areas 12 successively, the higher the target potential of the bonding area 12, the stronger the luminous brightness of the light emitting element 20.

[0026] At the same time, the target brightness corresponding to the light emitting element 20 indicates the light emitting brightness of the light emitting element 20 in the bonding area 12 before bonding to the bonding area 12, that is, the higher the target brightness corresponding to the bonding area 12, the greater the light emitting brightness of the light emitting element 20 in the area before bonding. Before bonding the light emitting element 20 to the array substrate 10, the light emitting brightness of the plurality of light emitting elements 20 is also compared, and the plurality of light emitting elements 20 are bonded to the array substrate 10 according to the comparison result.

[0027] In this embodiment, in the same bonding area 12, the target potential corresponding to the bonding area 12 is inversely proportional to the target brightness of the light-emitting element 20, that is, the higher the target potential corresponding to the bonding area 12, the lower the luminous brightness of the light-emitting element 20 in the area before bonding to the array substrate 10, and the lower the target potential corresponding to the bonding area 12, the higher the luminous brightness of the light-emitting element 20 in the area before bonding to the array substrate 10.

[0028] To facilitate understanding of the above solution, the following is an introduction with examples:

[0029] Combination Figure 1Assuming that there are two bonding areas 12, namely the first bonding area 121 and the second bonding area 122, the target potential corresponding to the first bonding area 121 is higher than the target potential corresponding to the second bonding area 122, then the target brightness corresponding to the light-emitting element 20 in the first bonding area 121 is less than the target brightness corresponding to the light-emitting element 20 in the second bonding area 122, that is, before bonding to the array substrate 10, the luminous brightness of the light-emitting element 20 in the first bonding area 121 is less than the luminous brightness of the light-emitting element 20 in the second bonding area 122, that is, during bonding, the light-emitting element 20 with smaller luminous brightness is bonded to the first bonding area 121, and the light-emitting element 20 with larger luminous brightness is bonded to the second bonding area 122.

[0030] It is understandable that if two light-emitting elements 20 with the same luminous brightness are bonded to the first bonding area 121 and the second bonding area 122 respectively, when the display panel is normally luminous, the luminous brightness of the light-emitting element 20 in the first bonding area 121 will be greater than the luminous brightness of the light-emitting element 20 in the second bonding area 122. However, in this embodiment, the light-emitting element 20 with a smaller luminous brightness is bonded to the first bonding area 121, and the light-emitting element 20 with a larger luminous brightness is bonded to the second bonding area 122, which can reduce the difference in luminous brightness between the light-emitting element 20 in the first bonding area 121 and the light-emitting element 20 in the second bonding area 122 when the display panel is normally displayed, thereby improving the uniformity of the display panel.

[0031] In the prior art, the array substrate 10 and the light-emitting element 20 are unevenly prepared due to process fluctuations and production equipment, that is, the potentials of the multiple pads 11 on the array substrate 10 are different, and the luminous brightness of different light-emitting elements 20 is also different, which easily causes the unevenness of the array substrate 10 to be superimposed on the unevenness of the light-emitting element 20 after the light-emitting element 20 is transferred to the array substrate 10, thereby causing uneven luminescence of the display panel. However, it can be seen from the above content of the present application that the present application is set in the same bonding area 12, and the target potential corresponding to the bonding area 12 is inversely proportional to the target brightness of the light-emitting element 20. During the transfer, the light-emitting element 20 with weaker luminous brightness is transferred to the bonding area 12 with a higher potential of the pad 11, and the light-emitting element 20 with stronger luminous brightness is transferred to the bonding area 12 with a lower potential of the pad 11, so that the strong and weak can be offset, the accumulation of unevenness can be reduced, and the uniformity of the display brightness can be ensured.

[0032] In one embodiment of the present application, the target potential corresponding to the bonding area 12 represents the average potential of the pad 11 in the bonding area 12 before the light-emitting element 20 is bonded; the target brightness corresponding to the light-emitting element 20 represents the average light-emitting brightness before the light-emitting element 20 is bonded to the bonding area 12.

[0033] Specifically, before the light emitting element 20 is transferred to the array substrate 10, a test signal may be input to the array substrate 10 to obtain the potential of each pad 11 on the array substrate 10, and then for each bonding area 12, the average value of the potential of the pads 11 in the bonding area 12 is calculated to determine the target potential corresponding to the bonding area 12. Of course, in other embodiments, the median, average, mode, range, variance and standard deviation of the potentials of all pads 11 in the bonding area 12 may be calculated to obtain the target potential corresponding to the bonding area 12.

[0034] Among them, the test fixture can be placed on the array substrate 10 so that the multiple probes on the test fixture are electrically connected to the multiple pads 11 in a one-to-one correspondence, and then the test signal is input to the test point on the array substrate 10, and the potential of the multiple pads 11 is obtained according to the potential measured by the multiple probes. At the same time, during the transfer, the luminous brightness of each light-emitting element 20 is determined, so as to ensure that after the transfer, for any bonding area 12, the average luminous brightness of the light-emitting elements 20 included therein before being bonded to the bonding area 12 is inversely proportional to the target brightness of the bonding area 12. Of course, in other embodiments, it can also be ensured that the median value of the luminous brightness of the light-emitting elements 20 included in the bonding area 12 before being bonded to the bonding area 12, or the mode value of the luminous brightness, etc. is inversely proportional to the target brightness of the bonding area 12. In an application scenario, if the target potential is the average value of the potential, the target brightness is also the average value of the luminous brightness, if the target potential is the median value of the potential, then the target brightness is also the median value of the luminous brightness, and so on.

[0035] Of course, in other application scenarios, if the target potential is the average potential, the target brightness can also be the median luminous brightness or the mode value of the luminous brightness, etc. If the target potential is the median potential, the target brightness can also be the average luminous brightness or the mode value of the luminous brightness, and so on.

[0036] In one embodiment, the display panel 100 is a Micro-LED display panel or a Mini-LED display panel. Of course, in other embodiments, the display panel 100 may also be other types of display panels, such as an OLED (Organic Light-Emitting Diode) display panel, etc., which is not limited here.

[0037] See also Figure 3 The present application also includes a display device 200, including the display panel 100 in any of the above-mentioned embodiments. The specific structure thereof can be found in the above-mentioned related content and will not be described in detail here.

[0038] The display device 200 may be a mobile phone, a computer, a television, or other device, and this application does not limit its type.

[0039] Combine the following Figure 1 and Figure 2 , a method for preparing a display panel 100 is introduced, the method comprising:

[0040] S100 : bonding a plurality of light emitting elements 20 to a plurality of pads 11 of an array substrate 10 .

[0041] Among them, the array substrate 10 is provided with multiple bonding areas 12, each bonding area 12 includes at least one soldering pad 11, and within the same bonding 12, the target potential corresponding to the bonding area 12 is inversely proportional to the target brightness of the light-emitting element 20; and the target potential corresponding to the bonding area 12 represents the potential of the soldering pad 11 in the bonding area 12 before the light-emitting element 20 is bonded; the target brightness corresponding to the light-emitting element 20 represents the luminous brightness of the light-emitting element 20 before being bonded to the bonding area 12.

[0042] Specifically, in the same bonding area 12, the target potential corresponding to the bonding area 12 is inversely proportional to the target brightness of the light-emitting element 20. During the transfer, the light-emitting element 20 with weaker brightness is transferred to the bonding area 12 with higher potential of the pad 11, and the light-emitting element 20 with stronger brightness is transferred to the bonding area 12 with lower potential of the pad 11, thereby offsetting the strength and the weakness, reducing the accumulation of unevenness, and ensuring the uniformity of the display brightness.

[0043] In one embodiment, the target potential corresponding to each bonding area 12 is determined before step S100. Figure 4 , the process includes:

[0044] S111 : placing the test fixture 13 on the array substrate 10 , and electrically connecting a plurality of probes (not shown) on the test fixture 13 to a plurality of pads 11 in a one-to-one correspondence.

[0045] S112 : inputting a test signal to the test point on the array substrate 10 .

[0046] S113: Obtaining the potentials of the plurality of pads 11 according to the potentials measured by the plurality of probes.

[0047] S114 : For each bonding area 12 , according to the potential of the pad 11 in the bonding area 12 , determine the target potential corresponding to the bonding area 12 .

[0048] Specifically, the test fixture 13 includes a plurality of probes (not shown), and the plurality of probes correspond to the plurality of pads 11 on the array substrate 10. During measurement, the test fixture 13 is placed on the array substrate 10 so that the plurality of probes on the test fixture 13 are electrically connected to the plurality of pads 11 in a one-to-one correspondence, and then a test signal is input to the test point on the array substrate 10, and then the potentials measured by the plurality of probes are collected to obtain the potentials of the plurality of pads 11, and then for each bonding area 12, the target potential corresponding to the bonding area 12 is determined according to the potentials of the plurality of pads 11 in the bonding area 12.

[0049] In an application scenario, step S114 specifically includes: determining the average potential of the pads 11 in the bonding area 12 as the target potential corresponding to the bonding area 12 .

[0050] Specifically, the average value of the potentials of all pads 11 in the bonding area 12 is calculated to determine the target potential corresponding to the bonding area 12 .

[0051] Of course, in other implementations, the median value or mode value of the potentials of all pads 11 in the bonding area 12 may be calculated to obtain the target potential corresponding to the bonding area 12 .

[0052] In an application scenario, such as Figure 5 As shown, the array substrate 10 includes three bonding areas 12, and the target potentials corresponding to the three bonding areas 12 are different. For the convenience of explanation, the three bonding areas 12 are defined as a strong potential area 123, an intermediate potential area 124 and a weak potential area 125 in order from high to low target potentials.

[0053] In one embodiment, the light emitting brightness of the plurality of light emitting elements 20 is compared before step S100 , and then the light emitting elements 20 are transferred to the corresponding bonding area 12 according to the comparison result.

[0054] In one application scenario, the light-emitting element 20 is an LED chip; the step of comparing the luminous brightness of multiple light-emitting elements 20 includes: comparing the thicknesses of multiple light-emitting elements 20, thereby obtaining the result of comparing the luminous brightness of multiple light-emitting elements 20.

[0055] Specifically, when the light emitting element 20 is an LED chip, the thickness of the light emitting element 20 is related to the light emitting brightness. Specifically, the thicker the light emitting element 20 is, the stronger the light emitting brightness is. Conversely, the thinner the light emitting element 20 is, the weaker the light emitting brightness is. Therefore, the thicknesses of multiple light emitting elements 20 can be compared to obtain the intensity of the light emitting brightness comparison.

[0056] Among them, combined Figure 6 The process of comparing the thicknesses of the plurality of light emitting elements 20 includes:

[0057] (a) Incident light 21 of the same wavelength is emitted to a plurality of light emitting elements 20 from the same angle.

[0058] (b) The reflected light 22 reflected by the plurality of light emitting elements 20 is collected respectively.

[0059] (c) Based on the reflected light 22 reflected by the plurality of light emitting elements 20, the thicknesses of the plurality of light emitting elements 20 are compared.

[0060] Specifically, considering that light emitting elements 20 of different thicknesses have different reflectivities to incident light 21 at the same angle, the thicknesses of multiple light emitting elements 20 can be compared based on the reflected light 22 of multiple light emitting elements 20 to incident light 21 at the same angle and with the same wavelength. A polarized light machine can be used to emit incident light 21 at the same angle and with the same wavelength to multiple light emitting elements 20, and a light collection machine can be used to collect reflected light 22 reflected by multiple light emitting elements 20. For each light emitting element 20, the light collection machine calculates the reflection angle of the reflected light 22 based on the reflected light 22, so that the angle between the incident light 21 and the reflected light 22 of each light emitting element 20 can be determined based on the incident angle of the incident light 21 and the reflection angle of the reflected light 22.

[0061] Among them, the larger the angle between the incident light 21 and the reflected light 22, the thinner the light emitting element 20 is, and the weaker the light brightness is; the smaller the angle between the incident light 21 and the reflected light 22, the thicker the light emitting element 20 is, and the stronger the light brightness is.

[0062] Among them, combined Figure 7 In another application scenario, the step of comparing the light emitting brightness of a plurality of light emitting elements 20 includes:

[0063] (d) The plurality of light emitting elements 20 are transferred from the wafer 23 to the temporary substrate 24, wherein after power is applied, the potentials of the plurality of bonding points on the temporary substrate 24 are the same.

[0064] (e) After the temporary substrate 24 is powered on, the light emission brightness of the plurality of light emitting elements 20 is collected respectively, and the light emission brightness of the plurality of light emitting elements 20 is compared.

[0065] Specifically, after power is turned on, the potentials of different bonding points on the temporary substrate 24 are the same. If two completely identical light-emitting elements 20 are transferred to two bonding points on the temporary substrate 24, the light-emitting brightness of the two light-emitting elements 20 is exactly the same.

[0066] Therefore, in this application scenario, after transferring multiple light-emitting elements 20 from the wafer 23 to multiple bonding points on the temporary substrate 24, after power is turned on, if the luminous brightness of two light-emitting elements 20 is different, it means that under the same potential, the luminous brightness of the two light-emitting elements 20 is different. Therefore, the luminous brightness of multiple light-emitting elements 20 can be compared through the temporary substrate 24.

[0067] Among them, a visual inspection machine can be used to collect the luminous brightness of multiple light-emitting elements 20. Specifically, the visual inspection machine photographs multiple light-emitting elements 20 to obtain images, and then uses image recognition technology to process the photographed images to obtain the luminous brightness of each light-emitting element 20, and compare the luminous brightness of multiple light-emitting elements 20.

[0068] After comparing the luminous brightness of the plurality of light emitting elements 20 by using any of the above methods, the plurality of light emitting elements 20 on the wafer 23 may be divided into a plurality of light emitting regions, such as Figure 8 As shown, in an application scenario, the multiple light-emitting elements 20 on the wafer 23 are divided into three light-emitting areas, and the three light-emitting areas are defined as a strong light-emitting area 41, a middle light-emitting area 42 and a weak light-emitting area 43 according to the light brightness from strong to weak.

[0069] Among them, when Figure 8 The light emitting element 20 is transferred to Figure 5 When the array substrate 10 is in the middle, the light-emitting element 20 in the strong light-emitting area 41 can be transferred to the weak potential area 125, the light-emitting element 20 in the middle light-emitting area 42 can be transferred to the middle potential area 124, and the light-emitting element 20 in the weak light-emitting area 43 can be transferred to the strong potential area 123, thereby reducing the accumulation of unevenness by offsetting the strong and the weak, thereby ensuring the uniformity of display brightness.

[0070] In summary, the present application confirms the uniformity of the array substrate 10 and the light emitting element 20 in advance before transferring the light emitting element 20 to the array substrate 10, and transfers the light emitting element 20 by means of strong and weak offset, which can effectively improve the phenomenon of uneven display brightness. The present application is simple to operate and has high reliability, and can be widely used in various electronic devices.

[0071] The above description is only an embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A display panel, characterized in that: The display panel comprises: An array substrate is provided with a plurality of pads; A plurality of light emitting elements are arranged on the plurality of pads; The array substrate is provided with a plurality of bonding areas, each of the bonding areas includes at least one bonding pad, and within the same bonding area, the target potential corresponding to the bonding area is inversely proportional to the target brightness corresponding to the light-emitting element; Furthermore, the target potential corresponding to the bonding area indicates the potential of the pad in the bonding area before the light-emitting element is bonded; and the target brightness corresponding to the light-emitting element indicates the brightness of the light-emitting element before it is bonded to the bonding area.

2. The display panel according to claim 1, characterized in that: The target potential corresponding to the bonding area represents the average potential of the pad in the bonding area before the light-emitting element is bonded; the target brightness corresponding to the light-emitting element represents the average light-emitting brightness of the light-emitting element before it is bonded to the bonding area.

3. The display panel according to claim 1, characterized in that: The number of pads included in the plurality of bonding areas is equal; Preferably, the display panel is a Micro-LED display panel or a Mini-LED display panel.

4. A display device, characterized in that: The invention comprises a display panel as claimed in any one of claims 1 to 3.

5. A method for preparing a display panel, characterized in that: The method comprises: Bonding a plurality of light emitting elements to a plurality of pads of an array substrate; The array substrate is provided with a plurality of bonding areas, each of the bonding areas includes at least one bonding pad, and within the same bonding area, the target potential corresponding to the bonding area is inversely proportional to the target brightness corresponding to the light-emitting element; Furthermore, the target potential corresponding to the bonding area indicates the potential of the pad in the bonding area before the light-emitting element is bonded; and the target brightness corresponding to the light-emitting element indicates the brightness of the light-emitting element before it is bonded to the bonding area.

6. The method according to claim 5, characterized in that Before bonding the plurality of light emitting elements to the plurality of pads of the array substrate, the method further comprises: Placing a test fixture on the array substrate, and electrically connecting a plurality of probes on the test fixture to a plurality of pads in a one-to-one correspondence; Inputting a test signal to a test point on the array substrate; Obtaining potentials of the plurality of pads according to the potentials measured by the plurality of probes; For each of the bonding regions, the target potential corresponding to the bonding region is determined according to the potential of the pad in the bonding region.

7. The method according to claim 6, characterized in that The step of determining the target potential corresponding to the bonding area according to the potential of the pad in the bonding area comprises: The average potential of the pads in the bonding area is determined as the target potential corresponding to the bonding area.

8. The method according to claim 5, characterized in that Before bonding the plurality of light emitting elements to the plurality of pads of the array substrate, the method further comprises: The light emission brightness of the plurality of light emitting elements is compared.

9. The method according to claim 8, characterized in that The light emitting element is an LED chip; the step of comparing the light emitting brightness of a plurality of the light emitting elements comprises: Comparing the thicknesses of the plurality of light emitting elements, thereby obtaining a result of comparing the light emitting brightness of the plurality of light emitting elements; Preferably, the step of comparing the thicknesses of the plurality of light emitting elements comprises: emitting incident light of the same wavelength to the plurality of light emitting elements from the same angle; respectively collecting reflected light reflected by a plurality of the light emitting elements; The thicknesses of the plurality of light emitting elements are compared based on the reflected light reflected by the plurality of light emitting elements.

10. The method according to claim 8, characterized in that The step of comparing the light emitting brightness of the plurality of light emitting elements comprises: Transferring the plurality of light-emitting elements to a temporary substrate, wherein after power is applied, the potentials of the plurality of bonding points on the temporary substrate are the same; After the temporary substrate is powered on, the light luminances of the plurality of light emitting elements are collected respectively, so as to compare the light luminances of the plurality of light emitting elements.

Images