Micro-fluidic chip, preparation method thereof and micro-fluidic system

Abstract

The invention relates to a microfluidic chip (1001), a preparation method thereof and a microfluidic system (1000). The micro-fluidic chip (1001) comprises a first substrate (100), a second substrate (200) and a gap control layer (300) located between the first substrate (100) and the second substrate (200), and the gap control layer (300) comprises a glue line (301) and a plurality of gap beads (302) which are located in the glue line (301), are arranged at intervals and are basically the same in size. The high-precision control of the gap between the first substrate (100) and the second substrate (200) can be realized by arranging a plurality of gap beads (302) with basically the same size in the glue line (301) at intervals.

Description

Microfluidic chip and preparation method thereof, and microfluidic system

[0001] Cross-references

[0002] This application refers to Chinese patent application No. 202211176002.7 filed on September 26, 2022, entitled “Microfluidic chip, preparation method thereof, and microfluidic system”, which is incorporated herein by reference in its entirety. Technical Field

[0003] The present disclosure relates to the field of microfluidics, and in particular to a microfluidics chip and a preparation method thereof, and a microfluidics system. Background Art

[0004] Microfluidics integrates the fundamental operational elements of biological, chemical, and medical analysis, including sample preparation, reaction, separation, and detection, onto a micron-scale chip, automating the entire analytical process. Due to its enormous potential in biology, chemistry, and medicine, it has developed into a new research field that intersects disciplines such as biology, chemistry, medicine, fluidics, electronics, materials, and mechanics.

[0005] The fluid control principle of microfluidic chips is based on electrowetting. This technique uses an electric potential to manipulate the surface energy of solids and liquids, and exploits the asymmetry of the droplet's contact angle to generate tangential thrust. This creates asymmetric deformation at both ends of the droplet, leading to a pressure differential within the droplet, thereby achieving precise manipulation of the microfluidic flow. With breakthrough advances in materials science, micro-nanofabrication, and microelectronics, microfluidic chips have rapidly developed. However, manufacturing remains a bottleneck hindering the development of microfluidic technology. Improving the manufacturing precision of microfluidic chips to achieve precise control and analysis of droplets is a key development direction for microfluidic chips. During the charge and discharge process, battery cells swell, affecting battery safety. Furthermore, as batteries cycle, electrolyte is continuously consumed, shortening their lifespan.

[0006] Summary of the Invention

[0007] The present disclosure aims to solve at least one of the technical problems existing in the prior art. To this end, one purpose of the present disclosure is to provide a microfluidic chip and a manufacturing method thereof, and a microfluidic system to improve the manufacturing accuracy of the microfluidic chip.

[0008] An embodiment of the first aspect of the present disclosure provides a microfluidic chip, comprising: a first substrate, a second substrate and a gap control layer, wherein the second substrate is arranged relative to the first substrate, the gap control layer is located between the first substrate and the second substrate, and the gap control layer includes a glue line and a plurality of gap beads of substantially the same size arranged at intervals within the glue line.

[0009] By placing multiple gap beads within the glue line between the first and second substrates, the gap between the first and second substrates is controlled based on the size of the gap beads. Because the gap beads ensure dimensional consistency by improving machining accuracy, the gap between the first and second substrates can also be kept consistent, enabling precise control and detection analysis of droplets, improving the yield rate and detection accuracy of the microfluidic chip.

[0010] In some embodiments, the first substrate includes a hydrophobic dielectric functional layer, the glue line is disposed along an outer edge of the hydrophobic dielectric functional layer, and the outer edge of the hydrophobic dielectric functional layer falls within the range of the glue line.

[0011] By setting the glue line along the outer edge of the hydrophobic dielectric functional layer and setting the outer edge of the hydrophobic dielectric functional layer to fall within the area of ​​the glue line, the glue line can seal the edge of the hydrophobic dielectric functional layer, preventing leakage of dielectric oil or reaction reagents or entry of external impurities, which would affect the detection effect, and at the same time preventing the hydrophobic dielectric functional layer from falling off due to liquid immersion, thereby improving the quality stability of the microfluidic chip.

[0012] In some embodiments, the interstitial beads are positioned beyond the outer edge of the hydrophobic dielectric functional layer.

[0013] Arranging the gap beads at a position staggered from the hydrophobic dielectric functional layer can avoid some gap beads being placed on the hydrophobic dielectric functional layer, which may cause a deviation in the gap height, and also avoid the insufficient surface precision of the hydrophobic dielectric functional layer affecting the consistency of the gap.

[0014] In some embodiments, the first substrate includes a circuit substrate and a hydrophobic dielectric functional layer, the circuit substrate includes a substrate and an electrode located on the substrate, and the hydrophobic dielectric functional layer is arranged on the surface of the electrode close to the second substrate; the second substrate includes a conductive cover and a hydrophobic layer, the hydrophobic layer and the hydrophobic dielectric functional layer are opposite to each other, and a droplet movement space is formed between the hydrophobic dielectric functional layer and the hydrophobic layer.

[0015] By arranging the droplet movement space between the hydrophobic dielectric functional layer of the first substrate and the hydrophobic layer of the second substrate, the surface tension of the droplets can be reduced, facilitating the precise movement of the droplets under the control of the electrodes, thereby improving the efficiency of detection.

[0016] In some embodiments, the hydrophobic dielectric functional layer is a single-layer hydrophobic dielectric composite layer, and the hydrophobic dielectric composite layer is adhered to the surface of the electrode close to the second substrate via an adhesive layer.

[0017] The functions of the hydrophobic layer and the dielectric layer are realized through a single layer of membrane, which reduces the number and thickness of the membrane layers on the electrode surface, shortens the time for membrane preparation, and avoids the degradation of flatness caused by the stacking of multiple membranes, which affects the movement and detection of droplets.

[0018] In some embodiments, the hydrophobic dielectric functional layer has a first pattern, the hydrophobic layer has a second pattern that is a mirror image of the first pattern, and the first pattern and the second pattern together define a space for liquid droplet movement.

[0019] By setting the mirror image of the first and second patterns, the area of ​​the droplet movement space can be limited, and a glue line area is reserved outside the droplet movement space to facilitate guiding subsequent glue dispensing and avoid glue leakage causing insufficient sealing.

[0020] In some embodiments, the gap control layer further includes at least one supporting rubber block located within the outer edge of the hydrophobic dielectric functional layer and abutting the first substrate and the second substrate, and the projection of the at least one supporting rubber block on the first substrate is staggered with the electrode on the first substrate.

[0021] By placing support rubber blocks within the droplet movement space, better support can be provided between the first and second substrates, making the microfluidic chip more evenly stressed and structurally stable, thereby increasing its service life. Staggering the support rubber blocks from the electrodes can prevent interference with droplet movement and ensure precise control of droplet movement.

[0022] In some embodiments, the hydrophobic dielectric functional layer further has a third pattern, which is at least one hollow area for accommodating at least one supporting rubber block, and at least one gap bead is disposed in any one of the at least one supporting rubber block.

[0023] By forming a hollow area on the hydrophobic dielectric functional layer to arrange the support glue block and placing gap beads in the support glue block, better support can be provided for the microfluidic chip, which can to a certain extent prevent the middle part of the first substrate of the droplet movement space from deforming to form a bulge, thereby affecting the consistency of the gap height.

[0024] In some embodiments, the interstitial beads within the at least one support glue block are substantially the same size as the interstitial beads within the glue line.

[0025] Setting the size of the gap beads in the supporting rubber block and the gap beads in the rubber line to be basically the same is conducive to controlling the gap height at the location of the supporting rubber block to be basically consistent with the size of the gap beads, and then consistent with the gap height at other locations of the microfluidic chip, while achieving uniform force on the microfluidic chip and further ensuring the consistency of the gap height.

[0026] In some embodiments, the edge of the third pattern is at least partially located within the range of the corresponding at least one supporting glue block, and the projection of the interstitial beads arranged in any one of the at least one supporting glue block on the first substrate is located outside the range of the hydrophobic dielectric functional layer.

[0027] In some embodiments, the interstitial beads have a diameter of 800 ± 5 microns.

[0028] In some embodiments, the height of the droplet moving space is greater than or equal to 710 micrometers and less than or equal to 740 micrometers.

[0029] According to the detection accuracy requirements and droplet flux needs of the microfluidic chip, selecting the appropriate gap bead size and tolerance range can not only ensure the functional needs of the microfluidic chip, but also take into account the manufacturing cost and manufacturing process, thereby improving the economic efficiency of mass production.

[0030] An embodiment of the second aspect of the present disclosure provides a method for preparing a microfluidic chip, comprising:

[0031] providing a first substrate,

[0032] A gap control layer is prepared on one side surface of the first substrate, wherein the gap control layer includes a glue line and a plurality of gap beads of substantially the same size spaced apart and arranged in the glue line;

[0033] providing a second substrate,

[0034] placing the second substrate on the gap control layer and aligning it with the first substrate to form a box;

[0035] Cure the gap control layer.

[0036] By spacing multiple gap beads of substantially the same size within the glue line, high-precision control of the gap between the first substrate and the second substrate can be achieved, thereby improving the manufacturing accuracy of the microfluidic chip and ensuring the controllability of droplet movement and the accuracy of detection results.

[0037] In some embodiments, preparing the gap control layer on one side surface of the first substrate includes: dispensing glue along one side surface of the first substrate to form a glue line; and placing a plurality of gap beads of substantially the same size at intervals within the glue line.

[0038] Compared to first mixing the gap beads with the glue and then applying them together to the surface of the first substrate, the glue is first applied on the surface of the first substrate to form a glue line, and then gap beads of substantially the same size are spaced within the glue line. On the one hand, the position of the glue line can provide positioning for the placement of the gap beads, and the viscosity of the glue line can ensure that the gap beads are not easily shifted after placement, thereby achieving a roughly stable distribution of the gap beads within the entire glue line. On the other hand, the position of the gap beads can be arranged subjectively and can be flexibly adjusted as needed, avoiding the inability to control the arrangement of the gap beads during mixing and application, thereby improving the consistency of the droplet movement space gap of the entire microfluidic chip.

[0039] In some embodiments, providing a first substrate includes:

[0040] providing a circuit substrate,

[0041] preparing a hydrophobic dielectric functional layer on a circuit substrate;

[0042] Providing a second substrate includes:

[0043] providing a conductive cover,

[0044] preparing a hydrophobic layer on a conductive cover;

[0045] Placing the second substrate on the gap control layer and aligning it with the first substrate to form a box includes:

[0046] The side of the second substrate where the hydrophobic layer is located is covered on the gap beads of the gap control layer in a manner that the side where the hydrophobic dielectric functional layer is located faces the side where the hydrophobic dielectric functional layer of the first substrate is located, and a droplet movement space is formed between the hydrophobic dielectric functional layer and the hydrophobic layer.

[0047] By preparing the first substrate and the second substrate separately and then aligning them into a box, the production efficiency of the microfluidic chip can be improved. Covering the second substrate on the gap beads can ensure the consistency of the gap size. After the box is formed, the droplet movement space is located between the hydrophobic dielectric functional layer and the hydrophobic layer, which can achieve smooth movement of the droplets and improve the droplet detection efficiency.

[0048] In some embodiments, the glue line formed by dispensing glue along one side surface of the first substrate includes: dispensing glue along the outer edge of the hydrophobic dielectric functional layer on one side surface of the first substrate to form a glue line, and the outer edge of the hydrophobic dielectric functional layer falls within the range of the glue line.

[0049] By placing adhesive lines along the outer edges of the hydrophobic dielectric functional layer to form a sealed cavity within the liquid flow space, the adhesive lines can seal the edges of the hydrophobic dielectric functional layer, preventing leakage of dielectric oil or reaction reagents or the ingress of external impurities that could affect detection results, thereby improving the quality and stability of the microfluidic chip. Furthermore, by covering the outer edges of the hydrophobic dielectric functional layer with adhesive lines, the edges can be effectively sealed, preventing the outer edges from being exposed to liquid droplets and causing the hydrophobic dielectric functional layer to fall off.

[0050] In some embodiments, the interstitial beads are positioned beyond the outer edge of the hydrophobic dielectric functional layer.

[0051] Arranging the gap beads outside the range of the hydrophobic dielectric functional layer can ensure that the gap is not affected by the thickness of the hydrophobic dielectric functional layer, thereby improving the uniformity of the gap of the microfluidic chip.

[0052] In some embodiments, preparing a hydrophobic dielectric functional layer on a circuit substrate includes: preparing a thin film for forming a hydrophobic dielectric functional layer on a surface of the circuit substrate on which an electrode is provided, and patterning the thin film to form the hydrophobic dielectric functional layer;

[0053] Preparing the hydrophobic layer on the conductive cover plate includes: preparing the hydrophobic layer on one side of the conductive cover plate, wherein the outer edge of the pattern of the hydrophobic layer is a mirror image of the outer edge of the pattern of the hydrophobic dielectric functional layer.

[0054] In some embodiments, preparing a hydrophobic dielectric functional layer on a circuit substrate further comprises:

[0055] The formed hydrophobic dielectric functional layer has a first pattern and a third pattern staggered with the first pattern and the electrode, wherein the third pattern is at least one hollow area;

[0056] The method comprises preparing a hydrophobic layer on the conductive cover plate, wherein the hydrophobic layer has a second pattern, the second pattern is a mirror image of the first pattern, and defines a space for liquid droplet movement together with the first pattern.

[0057] The preparation of the gap control layer further includes: dispensing glue in at least one hollow area of ​​the third pattern to form at least one supporting glue block, and placing at least one gap bead on any one of the at least one supporting glue block.

[0058] By forming a hollow area on the hydrophobic dielectric functional layer to arrange the support glue block and placing gap beads in the support glue block, better support can be provided for the microfluidic chip, avoiding the deformation of the middle part of the first substrate in the droplet movement space to form a bulge, thereby affecting the consistency of the gap height.

[0059] In some embodiments, the interstitial beads within the at least one support glue block are substantially the same size as the interstitial beads within the glue line.

[0060] Setting the size of the gap beads in the support rubber block and the gap beads in the rubber line to be basically the same is conducive to controlling the gap height at the location of the support rubber block to be consistent with the size of the gap beads, and then consistent with the gap height at other locations of the microfluidic chip, while achieving uniform force on the microfluidic chip and further ensuring the consistency of the gap height.

[0061] In some embodiments, an edge of the third pattern is at least partially located within the range of the corresponding at least one supporting glue block, and a projection of the gap beads on the first substrate is located outside the range of the hydrophobic dielectric functional layer.

[0062] Arranging the gap beads at a position staggered from the hydrophobic dielectric functional layer can avoid gap height deviation caused by positional misalignment of different gap beads, and at the same time avoid the influence of insufficient surface precision of the hydrophobic dielectric functional layer on the consistency of the gap.

[0063] In some embodiments, before curing the gap control layer, the method further includes: applying a preset pressure to outer surfaces of the first substrate and the second substrate.

[0064] After the first substrate and the second substrate are aligned and before the gap control layer is cured, a preset pressure is applied to the outer surfaces of the first substrate and the second substrate, and the gap beads are squeezed toward the first substrate and the second substrate to ensure the consistency of the gap between the first substrate and the second substrate of the entire microfluidic chip.

[0065] An embodiment of the third aspect of the present disclosure provides a microfluidic system, comprising a control module and a microfluidic chip described in any of the above embodiments or a microfluidic chip prepared according to any embodiment of the above method; the control module is electrically connected to the microfluidic chip to control the electrical signal provided to the microfluidic chip.

[0066] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0067] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar components or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0068] Figures 1 and 2 are schematic diagrams of the structure of a microfluidic chip provided in some embodiments of the present disclosure;

[0069] FIG3 is a schematic structural diagram of a microfluidic chip provided in some embodiments of the present disclosure from another perspective;

[0070] FIG4 is a schematic structural diagram of a first substrate of a microfluidic chip provided in some embodiments of the present disclosure;

[0071] FIG5 is a schematic structural diagram of a second substrate of a microfluidic chip provided in some embodiments of the present disclosure;

[0072] FIG6 is a schematic diagram of a process for preparing a microfluidic chip according to some embodiments of the present disclosure;

[0073] FIG7 is a schematic diagram of the structure of a microfluidic system provided in some embodiments of the present disclosure.

[0074] Explanation of the accompanying numbers: 1000-microfluidic system, 1001-microfluidic chip, 1002-control module, 100-first substrate, 101-circuit substrate, 1011-substrate, 1012-electrode, 102-hydrophobic dielectric functional layer, 1021-first pattern, 1022-third pattern, 103-adhesive layer, 200-second substrate, 201-conductive cover plate, 202-hydrophobic layer, 2021-second pattern, 300-gap control layer, 301-glue line, 302-gap bead, 303-droplet moving space, 304-support glue block. DETAILED DESCRIPTION

[0075] The following embodiments of the technical solution of the present disclosure are described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present disclosure and are therefore only examples and are not intended to limit the scope of protection of the present disclosure.

[0076] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which the present disclosure belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure; the terms "including" and "having" and any variations thereof in the specification and claims of the present disclosure and the above-mentioned figure descriptions are intended to cover non-exclusive inclusions.

[0077] In the description of the embodiments of the present disclosure, technical terms such as "first" and "second" are used solely to distinguish between different objects and should not be understood to indicate or imply relative importance or to implicitly specify the quantity, specific order, or primary and secondary relationship of the technical features indicated. In the description of the embodiments of the present disclosure, "plurality" means more than two, unless otherwise specifically defined.

[0078] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present disclosure. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0079] In the description of the embodiments of the present disclosure, the term "and / or" is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0080] In the description of the embodiments of the present disclosure, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0081] In the description of the embodiments of the present disclosure, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present disclosure and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the embodiments of the present disclosure.

[0082] In the description of the embodiments of the present disclosure, unless otherwise expressly specified or limited, technical terms such as "installed," "connected," "connect," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and can refer to internal connectivity between two components or interaction between two components. Those skilled in the art can understand the specific meanings of the above terms in the embodiments of the present disclosure based on specific circumstances.

[0083] The chip base and chip cover of a microfluidic chip together form a space for liquid movement. The height of this space—the gap between the lower surface of the hydrophobic layer of the chip cover and the upper surface of the hydrophobic layer of the chip base—is crucial for liquid manipulation. This gap must be maintained consistently across the entire chip; otherwise, the uneven gap will cause the liquid area to vary, preventing it from aligning with the electrodes and leading to failed liquid manipulation.

[0084] The following further describes the embodiments of the present disclosure in conjunction with the accompanying drawings, but the present disclosure is not limited to the following embodiments.

[0085] As shown in Figure 1, some embodiments of the first aspect of the present disclosure provide a microfluidic chip 1001, including a first substrate 100 and a second substrate 200 arranged relatively spaced apart, and a gap control layer 300 located between the first substrate 100 and the second substrate 200, the gap control layer 300 including a glue line 301 and a plurality of gap beads 302 located within the glue line 301, the plurality of gap beads 302 having substantially the same size and being spaced apart.

[0086] It is understood that the gap beads can be, for example, hard spheres made of metals such as steel, gold, and titanium. Substantially identical dimensions include situations where the gap beads have the same nominal dimensions, but with allowable variations due to manufacturing or processing precision. Multiple gap beads with identical dimensions should still be considered within the scope of substantially identical dimensions as defined in this embodiment and should be covered by the protection scope of this embodiment.

[0087] By placing multiple gap beads within the glue line between the first and second substrates, the gap between the first and second substrates is controlled based on the size of the gap beads. Because the gap beads ensure dimensional consistency by improving machining accuracy, the gap between the first and second substrates can also be kept consistent, enabling precise control and detection analysis of droplets, improving the yield rate and detection accuracy of the microfluidic chip.

[0088] In some embodiments, the first substrate 100 includes a hydrophobic dielectric functional layer 102 , and the glue line 301 is disposed along an outer edge of the hydrophobic dielectric functional layer 102 , and the outer edge of the hydrophobic dielectric functional layer 102 falls within the range of the glue line 301 .

[0089] In some embodiments, the gap beads 302 are placed outside the outer edge of the hydrophobic dielectric function 102 layer to avoid uneven height of the gap between the first substrate and the second substrate due to uneven thickness of the hydrophobic dielectric function 102 layer.

[0090] In some embodiments, the first substrate 100 further includes a circuit substrate 101. For example, as shown in Figures 1-2, the first substrate 100 includes the circuit substrate 101 and the hydrophobic dielectric functional layer 102, arranged sequentially from bottom to top. A portion of the bottom of the adhesive line 301 is disposed on the hydrophobic dielectric functional layer, while another portion is disposed on the circuit substrate 101, such that the outer edge of the hydrophobic dielectric functional layer 102 falls within the range of the adhesive line 301. The adhesive line 301 serves to bond the circuit substrate 101 to the second substrate 200 while reducing the risk of the hydrophobic dielectric functional layer falling off due to liquid immersion.

[0091] As shown in Figures 1 and 2, the second substrate 200 includes a conductive cover plate 201 and a hydrophobic layer 202, arranged sequentially from top to bottom. A portion of the top of the adhesive line 301 contacts the conductive cover plate 201, while another portion contacts the hydrophobic layer 202. The adhesive line 301 thus bonds the conductive cover plate 201 to the circuit substrate 101. The area enclosed by the adhesive line 301 between the hydrophobic dielectric functional layer 102 and the hydrophobic layer 202 forms a droplet migration space 303. Furthermore, the adhesive line 301 prevents liquid from soaking into the hydrophobic layer and hydrophobic dielectric functional layer at their outer edges.

[0092] As shown in FIG. 1-2 , the gap beads 302 are placed outside the outer edges of the hydrophobic dielectric function layer 102 and the hydrophobic layer 202 to avoid uneven gap height between the hydrophobic dielectric function layer 102 and the hydrophobic layer 202 due to uneven gap thickness.

[0093] Illustratively, the circuit substrate 101 includes a substrate 1011 and electrodes 1012 located on the substrate 1011. The substrate is used to support other functional film layers of the microfluidic chip and is typically made of non-conductive materials, such as plastic, glass, or PCB substrates. The electrodes can be arranged according to the flow path design and detection function of the microfluidic chip. The electrode material can be a conductive material, such as a metal material such as copper, gold, silver, or titanium, or a transparent conductive material such as indium tin oxide (ITO). The electrodes can be produced using industrial printed circuit board processes. The conductive cover material can be glass or PET coated with indium tin oxide (ITO). The hydrophobic dielectric functional layer is used to isolate the electrodes from the liquid to prevent current from being conducted to the liquid; the hydrophobic dielectric functional layer also works together with the hydrophobic layer to provide a smooth surface for liquid movement to reduce motion resistance. The hydrophobic dielectric functional layer can be a single functional film layer or a multilayer functional film layer formed by stacking a dielectric layer and a hydrophobic layer. The hydrophobic layer can be made of a fluoride coating with hydrophobic properties such as Teflon or Cytop.

[0094] By arranging the droplet movement space between the hydrophobic dielectric functional layer 102 of the first substrate 100 and the hydrophobic layer 202 of the second substrate 200, the surface tension of the droplets can be reduced, facilitating the precise movement of the droplets under the control of the electrodes, thereby improving the detection efficiency.

[0095] In some embodiments, as shown in FIG. 2 , the hydrophobic dielectric functional layer 102 is a single-layer hydrophobic dielectric composite layer, which is adhered to the surface of the electrode 1012 on the substrate 1011 close to the second substrate 200 via an adhesive layer 103 .

[0096] For example, the hydrophobic dielectric composite layer is a polytetrafluoroethylene (PTFE) film or a perfluoroethylene propylene copolymer (FEP) film.

[0097] The functions of the hydrophobic layer and the dielectric layer are realized through a single layer of membrane, which reduces the number and thickness of the membrane layers on the electrode surface, shortens the time for membrane preparation, and avoids the degradation of flatness caused by the stacking of multiple membranes, which affects the movement and detection of droplets.

[0098] In some embodiments, as shown in Figures 3-5, the hydrophobic dielectric functional layer 102 has a first pattern 1021, and the hydrophobic layer 202 has a second pattern 2021 that is a mirror image of the first pattern 1021. The first pattern 1021 and the second pattern 2021 correspond exactly to each other after the first substrate 100 and the second substrate 200 are aligned, and the two together define the area of ​​the droplet movement space.

[0099] It is understood that the first pattern 1021 and the second pattern 2021 are patterns formed by retaining the film layer, and the film layer is not retained outside the outer boundaries of the first pattern 1021 and the second pattern 2021. The first pattern 1021 can be prepared by laser engraving or punching, and the second pattern 2021 can be prepared by mask spraying.

[0100] By setting the mirror image of the first pattern 1021 and the second pattern 2021, the area of ​​the droplet movement space can be limited, and a glue line area is reserved outside the droplet movement space to facilitate guiding subsequent glue dispensing and avoid glue leakage causing insufficient sealing.

[0101] In some embodiments, as shown in FIG. 3 , the glue line 301 is disposed along the outer edge of the first pattern 1021 of the hydrophobic dielectric functional layer 102 , and the outer edge of the hydrophobic dielectric functional layer 102 falls within the range of the glue line 301 .

[0102] By setting the glue line 301 along the outer edge of the hydrophobic dielectric functional layer 102 so that the liquid movement space forms a sealed cavity, and at the same time setting the outer edge of the hydrophobic dielectric functional layer 102 to fall into the area of ​​the glue line 301, the glue line 301 can seal the edge of the hydrophobic dielectric functional layer 102, preventing leakage of dielectric oil or reaction reagents or entry of external impurities that affect the detection effect, and also preventing the hydrophobic dielectric functional layer from falling off due to liquid immersion, thereby improving the quality stability of the microfluidic chip.

[0103] In some embodiments, as shown in Figures 3 and 4, the gap control layer 300 also includes at least one supporting glue block 304 located within the outer edge of the hydrophobic dielectric functional layer 102 and abutting the first substrate 100 and the second substrate 200, and the projection of the at least one supporting glue block 304 on the first substrate 100 is staggered with the first pattern 1021 and the electrode 1012.

[0104] For example, as shown in FIG3 , the supporting glue block 304 is arranged in the central portion of the microfluidic chip 1001 , or in other portions thereof, and the number thereof may be one or more.

[0105] The support rubber block 304 can be, for example, a rubber block with certain supporting and adhesive capabilities, or a rubber block formed by placing a supporting object (e.g., interstitial beads) within the rubber. By placing the support rubber block within the droplet movement space, better support can be provided between the first substrate 100 and the second substrate 200, resulting in more uniform force distribution and a more stable structure for the microfluidic chip 1001, thereby increasing the service life of the microfluidic chip. Staggering the support rubber block 304 relative to the first pattern 1021 and the electrode 1012 can avoid affecting the movement of the droplets and ensure accurate control of the droplet movement.

[0106] In some embodiments, the hydrophobic dielectric functional layer 102 further has a third pattern 1022 . The third pattern 1022 is at least one hollow area for accommodating the supporting rubber block 304 . At least one interstitial bead 302 is disposed in any supporting rubber block 304 .

[0107] By forming a hollow area on the hydrophobic dielectric functional layer 102 to arrange the support glue block 304, and placing the gap beads 302 in the support glue block 304, better support can be provided for the microfluidic chip 1001, especially the middle area of ​​the droplet movement space, and to a certain extent, the middle part of the first substrate 100 of the droplet movement space can be prevented from deforming to form a bulge, thereby affecting the consistency of the gap height.

[0108] In some embodiments, the size of the gap beads 302 disposed in the support glue block 304 is substantially the same as the size of the gap beads 302 disposed in the glue line 301 .

[0109] It is understandable that the thickness of the hydrophobic layer is only at the nanometer level and is not a rigid coating. The effect of its thickness on the gap height between the first substrate 100 and the second substrate 200 can be ignored. Setting the size of the gap beads 302 in the support glue block 304 and the gap beads 302 in the glue line 304 to be substantially the same is conducive to controlling the gap height at the location of the support glue block 304 to be consistent with the size of the gap beads 302, and then consistent with the gap height at other locations of the microfluidic chip 1001. While achieving uniform force on the microfluidic chip 1001, it further improves the consistency of the gap height and prevents deformation of the middle of the substrate in the droplet movement space, thereby affecting the consistency of the gap height. The arrangement of the support glue block 304 is staggered with the electrode 1012, which can also prevent the gap beads 302 from contacting the electrode 1012.

[0110] Furthermore, the edge of the hollow area can partially or completely fall into the area of ​​the supporting rubber block 304, which can achieve partial or complete sealing of the edge of the hollow area, prevent liquid leakage, and improve the sealing performance of the entire microfluidic chip 1001.

[0111] In some embodiments, as shown in Figure 3, the projections of all gap beads 302 (including gap beads arranged in the glue line 301 and the supporting glue block 304) on the first substrate 100 are staggered with the projection of the hydrophobic dielectric functional layer 102 on the first substrate 102, that is, the gap beads 302 are placed outside the hydrophobic dielectric functional layer 102.

[0112] In order to ensure the consistency of the gap height, the dimensional accuracy of the gap beads 302 itself will have relatively high requirements, and the thickness of the hydrophobic dielectric functional layer 102 and the thickness of the adhesive layer 103 added together is a value that cannot be easily ignored. If some gap beads 302 are in contact with the hydrophobic dielectric functional layer 102 and some gap beads are not in contact with the hydrophobic dielectric functional layer 10, then the corresponding gap height dimensions cannot be kept consistent. In particular, since the electrode 1012 is usually also arranged in a patterned form on the surface of the substrate 1011, the surface flatness of the hydrophobic dielectric functional layer 102 arranged on the surface of the electrode 1012 is often difficult to maintain a high level. Then, the gap error when the gap beads 302 are arranged on the surface of the hydrophobic dielectric functional layer 102 is also difficult to be well controlled. Relatively speaking, the processing of the substrate 1011 is simple and precise, which can well meet the precision requirements, and the consistency of the gap height can also be well achieved when the gap beads 302 are arranged.

[0113] In some embodiments, the diameter of the interstitial beads 302 is 800 ± 5 microns.

[0114] In some embodiments, the height of the droplet moving space is greater than or equal to 710 micrometers and less than or equal to 740 micrometers.

[0115] According to the detection accuracy requirements and droplet flux needs of the microfluidic chip 1001, selecting the appropriate gap bead size and tolerance range can not only ensure the functional needs of the microfluidic chip, but also take into account the manufacturing cost and manufacturing process, thereby improving the economic efficiency of mass production.

[0116] In some embodiments, the plurality of interstitial beads 302 may be evenly distributed, that is, the spacing between adjacent interstitial beads 302 is substantially equal. Evenly distributed interstitial beads 302 are more conducive to maintaining uniformity of the gaps at various locations, and preventing inconsistent gaps from affecting droplet control.

[0117] An embodiment of the second aspect of the present disclosure provides a method for preparing a microfluidic chip, as shown in FIG6 , the method comprising:

[0118] Step S601: providing a first substrate 100;

[0119] Step S602: preparing a gap control layer 300 on the surface of the first substrate 100, wherein the gap control layer 300 includes a glue line 301 and a plurality of gap beads 302 of substantially the same size spaced apart and spaced within the glue line 301;

[0120] Step S603: providing a second substrate 200;

[0121] Step S604: placing the second substrate 200 on the gap control layer 300 and aligning it with the first substrate 100 to form a box;

[0122] Step S605 : solidifying the gap control layer 300 .

[0123] For example, the gap control layer 300 may be cured by light curing, heat curing or other feasible curing methods to cure the applied glue.

[0124] By spacing multiple gap beads of substantially the same or similar size within the glue line, high-precision control of the gap between the first substrate and the second substrate can be achieved, thereby improving the manufacturing accuracy of the microfluidic chip, ensuring the controllability of droplet movement, and the accuracy of the detection results.

[0125] In some embodiments, as shown in FIG1-FIG3 , step S601 includes:

[0126] A circuit substrate 101 is provided.

[0127] A hydrophobic dielectric functional layer 102 is formed on a circuit substrate 101 .

[0128] Providing a second substrate 200 includes:

[0129] Providing a conductive cover plate 201;

[0130] A hydrophobic layer 202 is formed on the conductive cover plate 201 .

[0131] In some embodiments, step S604 includes:

[0132] The side of the second substrate 200 where the hydrophobic layer 202 is located is covered on the gap beads 302 of the gap control layer 300 in a manner facing the side of the first substrate 100 where the hydrophobic dielectric functional layer 102 is located, and the area between the hydrophobic dielectric functional layer 102 and the hydrophobic layer 202 surrounded by the glue line 301 forms a droplet movement space 303.

[0133] 1 , the circuit substrate 101 includes a substrate 1011 and electrodes 1012 located on the substrate 1011. The substrate 1011 is used to support other functional membrane layers of the microfluidic chip 1001.

[0134] By preparing the first substrate 100 and the second substrate 200 separately and then aligning them into a box, the production efficiency of the microfluidic chip 1001 can be improved. Covering the second substrate 200 on the gap beads 302 can improve the consistency of the gap size. After the box is formed, the droplet movement space is located between the hydrophobic dielectric functional layer 102 and the hydrophobic layer 202, which can achieve smooth movement of the droplets and improve the droplet detection efficiency.

[0135] In some embodiments, dispensing glue along one side of the surface of the first substrate 100 to form the glue line 301 includes:

[0136] Glue is dispensed along the outer edge of the hydrophobic dielectric functional layer 102 on one side of the first substrate 100 to form a glue line 301 , and the outer edge of the hydrophobic dielectric functional layer 102 falls within the range of the glue line 301 .

[0137] By placing the glue line 301 along the outer edge of the hydrophobic dielectric functional layer 102, the liquid movement space forms a sealed cavity. Simultaneously, the outer edge of the hydrophobic dielectric functional layer 102 is positioned within the area of ​​the glue line 301. This allows the glue line 301 to seal the edge of the hydrophobic dielectric functional layer 102, preventing leakage of dielectric oil or reaction reagents or the ingress of external impurities that could affect detection results, thereby improving the quality stability of the microfluidic chip 1001. Furthermore, this prevents the hydrophobic dielectric functional layer 102 from being soaked in liquid and falling off.

[0138] In some embodiments, preparing the hydrophobic dielectric functional layer 102 on the circuit substrate 101 includes:

[0139] A hydrophobic dielectric functional layer 102 is prepared on the surface of the circuit substrate 101 on the side where the electrode 1012 is provided.

[0140] The hydrophobic dielectric functional layer 102 is patterned.

[0141] For example, a layer of adhesive is first evenly applied to the surface of the circuit substrate 101 on the side where the electrode 1012 is provided. A film for preparing the hydrophobic dielectric functional layer 102 is then covered on the surface of the circuit substrate 101 on the side where the electrode 1012 is provided through a coating process. The film is then engraved into a desired shape, such as a first pattern and a third pattern, by laser engraving or other methods, thereby forming a patterned hydrophobic dielectric functional layer 102.

[0142] Optionally, the patterned hydrophobic dielectric functional layer 102 is prepared by other processes. For example, a film for preparing the hydrophobic dielectric functional layer 102 is first provided, and the film is punched out into the described shape by a process such as punching to obtain the patterned hydrophobic dielectric functional layer 102. Then, the hydrophobic dielectric functional layer 102 is bonded to the side surface of the circuit substrate 101 where the electrode 1012 is provided.

[0143] In some embodiments, forming the hydrophobic layer 202 on the conductive cover plate 201 includes:

[0144] A hydrophobic layer 202 is formed on one side of the conductive cover plate 201 . The outer edge of the hydrophobic layer 202 is a mirror image of the outer edge of the pattern of the hydrophobic dielectric functional layer 102 , and together with the pattern of the hydrophobic dielectric functional layer 102 , defines a region for droplet movement.

[0145] By setting the mirror image of the first pattern 1021 and the second pattern 2021, the area of ​​the droplet movement space can be limited, and a glue line area is reserved outside the droplet movement space to facilitate guiding subsequent glue dispensing and avoid glue leakage causing insufficient sealing.

[0146] For example, the hydrophobic layer 202 is prepared by using a shielding spraying process, where a portion of the conductive cover plate 201 is shielded and sprayed to form the hydrophobic layer 202 , so that the outer edge of the cured hydrophobic layer 202 is a mirror image of the outer edge of the pattern of the hydrophobic dielectric functional layer 102 .

[0147] In some embodiments, preparing the gap control layer 300 on the surface of the first substrate 100 includes:

[0148] Dispensing glue along the edge of the first pattern 1021 of the first substrate 100 to form a glue line 301;

[0149] A plurality of gap beads 302 are placed at intervals within the glue line 301 .

[0150] Compared to first mixing the gap beads 302 with the glue and then applying them together to the surface of the first substrate 100, first applying glue on the surface of the first substrate 100 to form a glue line 301, and then placing gap beads 302 of substantially the same size at intervals within the glue line 301 is more conducive to ensuring the consistency of the gaps. On the one hand, the position of the glue strip can provide positioning for the placement of the gap beads, and the viscosity of the glue strip can ensure that the gap beads do not shift after placement, thereby achieving a roughly stable distribution of the gap beads 302 within the entire glue line. On the other hand, the position of the gap beads 302 can be arranged subjectively and can be flexibly adjusted as needed to avoid the inability to control the arrangement of the gap beads 302 during mixed application, thereby improving the consistency of the droplet movement space gap of the entire microfluidic chip 1001.

[0151] In some embodiments, as shown in FIG. 2-FIG . 3 , the edge of the first pattern 1021 in the hydrophobic dielectric functional layer 102 falls within the range of the glue line 301 , and the projection of the gap beads 302 on the first substrate 100 is outside the range of the hydrophobic dielectric functional layer 102 .

[0152] Covering the edge of the first pattern 1021 in the hydrophobic dielectric functional layer 102 with glue line 301 effectively seals the edge, preventing the patterning process from exposing the edge to droplets and causing the hydrophobic dielectric functional layer 102 to fall off. It also prevents droplets from penetrating and contacting the electrode 1012. Placing the gap beads 302 outside the hydrophobic dielectric functional layer 102 ensures that the gap is not affected by the film thickness, thereby improving the uniformity of the gap in the microfluidic chip 1001.

[0153] In some embodiments, forming a hydrophobic dielectric functional layer 102 on a circuit substrate 101 further includes patterning the hydrophobic dielectric functional layer 102 to form a first pattern 1021 and a third pattern 1022 staggered from the first pattern 1021 and the electrode 1012, wherein the third pattern 1022 comprises at least one hollowed-out region. The hydrophobic layer 202 includes a second pattern 2021, which is a mirror image of the first pattern 1021 and, together with the first pattern 1021, defines a space for droplet movement.

[0154] In some embodiments, preparing the gap control layer 300 further includes:

[0155] At least one supporting glue block 304 is formed by dispensing glue in at least one hollow area.

[0156] At least one gap bead 302 is placed on any one of the at least one support glue block 304 .

[0157] In some embodiments, the size of the gap beads 302 disposed in the support glue block 304 is substantially the same as the size of the gap beads 302 disposed in the glue line 301 .

[0158] By forming a hollow area on the hydrophobic dielectric functional layer 102 to accommodate the support glue block 304 and placing gap beads 302 within the support glue block 304, better support can be provided for the microfluidic chip 1001, particularly the central region of the droplet movement space. This can, to a certain extent, prevent the central portion of the first substrate 100 in the droplet movement space from deforming and forming a protrusion, thereby affecting the consistency of the gap height. Setting the gap beads 302 within the support glue block 304 to be substantially the same size as the gap beads within the glue line 301 helps to control the gap height at the location of the support glue block 304 to be substantially consistent with the size of the gap beads 302, and thus substantially consistent with the gap height at other locations on the microfluidic chip 1001. This further improves the consistency of the gap height while achieving uniform stress on the microfluidic chip. The staggered arrangement of the support glue block 304 and the electrode 1012 can also prevent the gap beads 302 from contacting the electrode 1012.

[0159] In some embodiments, the edge of the third pattern 1022 is at least partially located within the range of the corresponding at least one supporting glue block 304 , and the projection of the gap beads 302 on the first substrate 100 is located outside the range of the hydrophobic dielectric functional layer 102 .

[0160] By utilizing the sealing property of the supporting rubber block 304 to cover at least part of the edge of the third pattern 1022, the patterned edge of the hydrophobic dielectric functional layer 102 can be sealed. Arranging the gap beads 302 at a position staggered from the hydrophobic dielectric functional layer 102 can avoid gap height deviation caused by positional misalignment of different gap beads 302, and at the same time avoid the influence of insufficient surface precision of the hydrophobic dielectric functional layer 102 on the consistency of the gap.

[0161] In some embodiments, before curing the gap control layer 300 , the method further includes applying a preset pressure to outer surfaces of the first substrate 100 and the second substrate 200 .

[0162] After the first substrate 100 and the second substrate 200 are aligned and before the gap control layer 300 is cured, a preset pressure is applied to the outer surfaces of the first substrate 100 and the second substrate 200. In this way, when a small number of gap beads 302 are offset and come into contact with the hydrophobic dielectric functional layer 102, under the action of this preset pressure, these gap beads 302 will be squeezed and moved away from the hydrophobic dielectric functional layer 102 to improve the consistency of the gap between the first substrate 100 and the second substrate 200 of the entire microfluidic chip 1001.

[0163] The third aspect of the present disclosure further provides a microfluidic system 1000, as shown in Figures 1 and 7. The microfluidic system 1000 includes a microfluidic chip 1001 and a control module 1002. The microfluidic chip 1001 is any of the microfluidic chips described in any of the aforementioned embodiments, or a microfluidic chip produced by the method for producing such a microfluidic chip. The control module 1002 is electrically connected to the microfluidic chip 1001 to control the electrical signals provided to the microfluidic chip 1001.

[0164] It can be understood that the electrical signal provided to the microfluidic chip 1001 can be an electrical signal provided to the first substrate 100 in the microfluidic chip 1001, or an electrical signal provided to the second substrate 200, or an electrical signal provided to both the first substrate 100 and the second substrate 200 at the same time.

[0165] The control module 1002 controls the electrical signals provided to the first substrate 100 and the second substrate 200 of the microfluidic chip 1001, thereby controlling the potential difference between the first substrate 100 and the second substrate 200, thereby realizing multiple functions such as driving, separating and detecting droplets in the microfluidic chip 1001, thereby improving the controllability and application range of the microfluidic system 1000.

[0166] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present disclosure, and they should all be included in the scope of the claims and specification of the present disclosure. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present disclosure is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A microfluidic chip comprising: a first substrate, a second substrate, spaced apart from the first substrate, and a gap control layer, located between the first substrate and the second substrate, The gap control layer includes a rubber line and a plurality of gap beads of substantially the same size spaced apart and arranged in the rubber line.

2. The microfluidic chip according to claim 1, wherein The first substrate includes a hydrophobic dielectric functional layer, the glue line is arranged along an outer edge of the hydrophobic dielectric functional layer, and the outer edge of the hydrophobic dielectric functional layer falls within the range of the glue line.

3. The microfluidic chip according to claim 2, wherein: The interstitial beads are positioned outside the outer edge of the hydrophobic dielectric functional layer.

4. The microfluidic chip according to claim 2 or 3, wherein: The first substrate further includes a circuit substrate, the circuit substrate including a substrate and an electrode located on the substrate, and the hydrophobic dielectric functional layer is disposed on a surface of the electrode close to the second substrate; The second substrate includes a conductive cover plate and a hydrophobic layer. The hydrophobic layer and the hydrophobic dielectric functional layer are opposite to each other, and a droplet movement space is formed between the hydrophobic dielectric functional layer and the hydrophobic layer.

5. The microfluidic chip according to claim 4, wherein: The hydrophobic dielectric functional layer is a single-layer hydrophobic dielectric composite layer, and the hydrophobic dielectric composite layer is adhered to the surface of the electrode close to the second substrate through an adhesive layer.

6. The microfluidic chip according to claim 4, wherein: The hydrophobic dielectric functional layer has a first pattern, and the hydrophobic layer has a second pattern that is a mirror image of the first pattern. The first pattern and the second pattern together define the liquid droplet movement space.

7. The microfluidic chip according to claim 2 or 3, wherein: The gap control layer further includes at least one supporting rubber block located within the outer edge of the hydrophobic dielectric functional layer and abutting the first substrate and the second substrate, wherein a projection of the at least one supporting rubber block on the first substrate is staggered with the electrode on the first substrate.

8. The microfluidic chip according to claim 7, wherein: The hydrophobic dielectric functional layer further has a third pattern, which is at least one hollow area for accommodating the at least one supporting rubber block, and at least one gap bead is provided in any one of the at least one supporting rubber block.

9. The microfluidic chip according to claim 8, wherein: The interstitial beads within the at least one supporting glue block have substantially the same size as the interstitial beads within the glue line.

10. The microfluidic chip according to claim 9, wherein: The edge of the third pattern is at least partially located within the range of the corresponding at least one supporting rubber block, and the orthographic projection of the interstitial beads arranged in any one of the at least one supporting rubber block on the first substrate is located outside the range of the hydrophobic dielectric functional layer.

11. The microfluidic chip according to claim 4, wherein: The diameter of the interstitial beads is 800±5 microns.

12. The microfluidic chip according to claim 11, wherein: The height of the droplet moving space is greater than or equal to 710 micrometers and less than or equal to 740 micrometers.

13. A method for preparing a microfluidic chip, comprising: providing a first substrate, A gap control layer is prepared on one side surface of the first substrate, wherein the gap control layer includes a glue line and a plurality of gap beads of substantially the same size spaced apart and arranged in the glue line; providing a second substrate, placing the second substrate on the gap control layer and aligning it with the first substrate to form a box; The gap control layer is cured.

14. The method according to claim 13, wherein The step of preparing a gap control layer on one side surface of the first substrate includes: Dispensing glue along one side surface of the first substrate to form a glue line; A plurality of interstitial beads of substantially the same size are spaced apart and placed into the glue line.

15. The method according to claim 14, wherein Providing a first substrate includes: providing a circuit substrate, preparing a hydrophobic dielectric functional layer on the circuit substrate; Providing a second substrate includes: providing a conductive cover, preparing a hydrophobic layer on the conductive cover plate; Placing the second substrate on the gap control layer and aligning the second substrate with the first substrate to form a box includes: The side of the second substrate where the hydrophobic layer is located is covered on the gap beads of the gap control layer in a manner that faces the side of the first substrate where the hydrophobic dielectric functional layer is located, and a droplet movement space is formed between the hydrophobic dielectric functional layer and the hydrophobic layer.

16. The method according to claim 14 or 15, wherein: The glue line formed by dispensing glue along one side surface of the first substrate includes: Glue is dispensed along the outer edge of the hydrophobic dielectric functional layer on one side surface of the first substrate to form the glue line, and the outer edge of the hydrophobic dielectric functional layer falls within the range of the glue line.

17. The method according to claim 16, wherein The interstitial beads are positioned outside the outer edge of the hydrophobic dielectric functional layer.

18. The method according to claim 15, wherein The step of preparing a hydrophobic dielectric functional layer on the circuit substrate comprises: A thin film for forming a hydrophobic dielectric functional layer is prepared on a surface of the circuit substrate on one side where an electrode is provided, performing patterning on the film to form the hydrophobic dielectric functional layer; The step of preparing a hydrophobic layer on the conductive cover plate comprises: A hydrophobic layer is prepared on one side surface of the conductive cover plate, and an outer edge of a pattern of the hydrophobic layer is a mirror image of an outer edge of a pattern of the hydrophobic dielectric functional layer.

19. The method according to claim 18, wherein The step of preparing a hydrophobic dielectric functional layer on the circuit substrate further comprises: The formed hydrophobic dielectric functional layer has a first pattern and a third pattern staggered with the first pattern and the electrode, wherein the third pattern is at least one hollow area; The step of preparing a hydrophobic layer on the conductive cover plate comprises: The formed hydrophobic layer has a second pattern, which is a mirror image of the first pattern and defines the droplet movement space together with the first pattern; The preparation of the gap control layer further comprises: At least one supporting glue block is formed by applying glue to the at least one hollow area. At least one interstitial bead is placed on any one of the at least one support glue block.

20. The method according to claim 19, wherein The interstitial beads within the at least one supporting glue block have substantially the same size as the interstitial beads within the glue line.

21. The method according to claim 19, wherein The edge of the third pattern is at least partially located within the range of the corresponding at least one supporting rubber block, and the projection of the interstitial beads arranged in the at least one supporting rubber block on the first substrate is located outside the range of the hydrophobic dielectric functional layer.

22. The method according to any one of claims 13 to 15, wherein Before curing the gap control layer, the method further comprises: A preset pressure is applied to outer surfaces of the first substrate and the second substrate.

23. A microfluidic system comprising a control module and a microfluidic chip according to any one of claims 1 to 12 or prepared according to the method of any one of claims 13 to 22, wherein: The control module is electrically connected to the microfluidic chip to control the electrical signal provided to the microfluidic chip.

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