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428 results about "Glue line" patented technology

Manufacture method for Micro LED (Light Emitting Diode) display substrate

The invention relates to the technical field of display, in particular to a manufacture method for a Micro LED (Light Emitting Diode) display substrate. The manufacture method comprises the followingstep of transferring Micro LEDs in array distribution according to set gaps on an epitaxial wafer to a bonding pad corresponding to a driving substrate through a transfer substrate component. The stepof transferring comprises the following steps that: carrying out butt joint on the transfer substrate component and the epitaxial wafer to transfer the Micro LEDs on the epitaxial wafer to the glue line of the transfer substrate component, carrying out butt joint on the transfer substrate component and the driving substrate, and carrying out stickiness failure processing on the glue line on the transfer substrate component to release the Micro LED on the corresponding position in the transfer substrate component to the bonding pad on the corresponding position of the driving substrate. By useof the manufacture method, transfer equipment and assorted facilities do not need to be specially designed, batch fetching and transfer of the Micro LEDs can be realized to manufacture the Micro LEDdisplay substrate, and therefore, the manufacture method has the advantages of low cost, high transfer efficiency and the like.
Owner:HEFEI BOE OPTOELECTRONICS TECH +1

Polyurethane composite rubber roll and manufacture method thereof

The invention discloses a polyurethane rubber roll and a manufacture method thereof, and belongs to the technical field of rubber roll. The polyurethane composite rubber roll comprises bonding layers and a polyurethane rubber layer. A five-layer structure comprises a core layer, a first bonding layer, a glass fiber reinforced plastic layer, a second bonding layer and a polyurethane rubber layer from inside to outside. The core layer and the glass fiber reinforced plastic layer are connected through a bonding layer; the glass fiber reinforced plastic layer and the polyurethane rubber layer are connected by the second bonding layer. A manufacture method comprises steps of: (1) cladding the first interface bonding layer; (2) cladding the glass fiber reinforced plastic layer; (3) cladding the second interface bonding layer; (4) cladding the polyurethane rubber layer. The polyurethane composite rubber roll with a five-layer structure of the invention can eliminate influences on the interface bonding layers caused by surface dark fringes on a cast iron core, sand holes and graphite migration, avoid reduction of core external diameter caused by reprocessing and preclude integral disengaging of a glue line. The invention enhances usefulness of the polyurethane rubber roll and prolongs usage life of the core.
Owner:南京金三力橡塑有限公司

Circuit board manufacturing method

The invention relates to a manufacturing method for a circuit board. The method comprises the following steps that: an internal layer substrate containing a first internal layer conducting layer is provided; the first internal layer conducting layer is formed into a first internal layer line graph that comprises a groove area and a non-groove area that is beyond the groove area; liquid ink material that covers the whole groove area is printed on an area of the first internal layer line graph, wherein the area of the first internal layer line graph is corresponded to the groove area, and the liquid ink material is solified and a protection layer is formed; a first glue line and a first external layer conducting layer are compressed successively on a surface of an area of the first internallayer line graph and a surface of the protection layer, wherein the area of the first internal layer line graph is corresponded to the non-groove area, and a first external layer conducting layer that the non-groove area corresponding to is manufactured to form a first external layer line graph; the first external layer conducting layer and the first glue line are cut along frontiers of the groove area so as to form an opening; and then areas of the first external layer conducting layer, the first glue line and the protection layer are removed to obtain a groove structure, wherein the areas of the first external layer conducting layer, the first glue line and the protection layer are corresponding to the groove area. According to the manufacturing method provided in the invention, line graphs in the groove can be effectively protected.
Owner:HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD +1

Environment-friendly type urea-formaldehyde resin adhesive and production method thereof

An environment-friendly type urea-formaldehyde resin adhesive and a production method thereof. The method comprises the following steps: mixing glyoxal with urea in a container according to a certain mol ratio; adding a 10% polyvinyl alcoholic solution prepared in advance and urea under agitation, adjusting the pH value of the solution to be 7.5 to 8.5, and heating the solution to a temperature of 80 to 90 DEG C for reaction; adding a proper amount of urea for reaction for 40 minutes, adjusting the pH value of the solution to be 5 to 6, subjecting the solution to reaction at a temperature of 70 to 80 DEG C, and stopping the reaction when opacified sticky liquid appears or when cloudy sticky liquid appears under the condition that a droplet of the reaction solution is added into a glass with water at a temperature of 40 DEG C; cooling the solution to a temperature less than 40 DEG C and packaging the discharged products so as to obtain finished products. The adhesive provided in the invention belongs to excellent environment-friendly decoration materials, has remarkable adhesive properties, little smell, great initial adhesion, high final strength, good endurance and appropriate viscosity, is easy to paint and stable to store, and enables a glue film to be tough and tensile. Woodwork glued by the adhesive has no obvious glue lines, has excellent water tolerance, and produces no cracking in long-term usage.
Owner:王喆

Liquid metal heat dissipation-based high-power LED (Light Emitting Diode) light source with threaded connection structure

The invention discloses a high-power LED (Light Emitting Diode) light source based on room-temperature liquid metal micropore heat conduction, comprising LED chips, a microporous packaging base plate, a fluorescent glue line, room-temperature liquid metal, a sealing layer, a heat radiator, gold threads, LED chip electrodes and micro pores, wherein the sealing layer and the microporous packaging base plate are arranged on the heat radiator in sequence; the LED chips are arranged on the micro pores of the microporous packaging base plate; the room-temperature liquid metal is filled in the micro pores of the microporous packaging base plate; the LED chips are provided with the LED chip electrodes which are connected with the gold threads; and the fluorescent glue line covers on the LED chips. In the invention, the bottoms of the LED chips are directly contacted with the liquid meal with excellent heat conductivity; the liquid metal is closely contacted with the microporous base plate; as the LED chips are directly and closely contacted with the heat radiator through the liquid metal, the heat generated by the LED chips during working can be effectively radiated; therefore, the heat radiation effect of the high-power LED is better; the die bond processes of the LED packaging is reduced; the reflectivity of the bottoms of the LED chips is increased; and the light efficiency is greatly promoted.
Owner:符建

Fireproof liquid of composite fireproof glass and preparation method thereof and composite fireproof glass

The invention discloses a fireproof liquid of composite fireproof glass and a preparation method thereof and a composite fireproof glass, relates to a field of safety glass, and solves the problems that a fireproof glue-line has micro bubbles and bad flame resistance. The main method of the invention is as follows: polyol, a functional monomer, deionized water and an auxiliary agent are mixed for obtaining a first mixed emulsion, silica is added, and a silica dispension emulsion is obtained; styrene, methyl methacrylate and butyl acrylate monomer are mixed, a second mixed monomer emulsion is obtained, a cross-linking agent, deionized water, the silica dispersion emulsion and an initiator are added, and a soap-free seeded emulsion is obtained after reaction; acrylic acid, styrene, methyl methacrylate and butyl acrylate monomer are mixed, a third mixed monomer emulsion is obtained, deionized water, the initiator, the cross-linking agent and the soap-free seeded emulsion are added, and a soap-free emulsion with core-shell structure is obtained after reaction; a potassium hydroxide solution and an auxiliary agent are added, after mixing, standing and refiltering, an obtained filtrate is the fireproof liquid of composite fireproof glass. The fireproof liquid provided by the invention can be solidified into a fireproof glue, which has good fireproof performance without micro bubbles.
Owner:CHINA BUILDING MATERIALS ACAD

Solvent-free monocomponent organosilicon conducting resin used in LEDs and preparation method thereof

The invention discloses a solvent-free monocomponent organosilicon conducting resin used in LEDs and a preparation method of the conducting resin, comprising the following steps of heating 1 to 10 parts by weight of curing accelerator to a temperature of 60 to 80 DEG C, stirring and adding 0.1 to 5 parts of polymerization inhibitor, uniformly mixing and cooling the solution to a room temperature, adding 10 to 30 parts by weight of ethene silicone oil, 1 to 10 parts by weight of curing agent silicone oil with hydrogen, 0.5 to 5 parts by weight of interface strengthening agent silane coupling agent, 0.5 to 10 parts by weight of silane reinforcing filling material silica, uniformly mixing the solution and adding 60 to 80 parts by weight of silver powder conductive filling material, uniformly mixing the solution and grinding the solution with a three-stick grinder. The conducting resin provided in the invention can be stored for more than 6 months at the temperature of 0 DEG C. The resin can be stored for more than two weeks at the room temperature and the viscosity of the resin increases 25%. The resin does not have solvent volatilization in a solidification process and does not generate pores in the glue-line. The heat decomposition temperature of the resin after solidification is 300 DEG C with 2% heat weight loss. At solidification, the heat weight loss (1%, room temperature small particle thrust) is 5Kgf/die (2*2mm); the volume resistivity is equal or less than 2.0*10-4w.cm; the glass-transition temperature is less than 10 DEG C and the pencil hardness is 7B.
Owner:上海本诺电子材料有限公司
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