The invention belongs to the technical field of
wafer production, and particularly relates to a
wafer de-bonding device and method. The
wafer de-bonding device comprises a rotary adsorption platform, a height measurement module, at least two jacking plug-in mechanisms and a carrying mechanism, the jacking and opposite-inserting mechanism comprises a jacking
assembly, a cutter transverse moving
assembly and a cutter, wherein the cutter transverse moving
assembly and the cutter are installed on the jacking assembly. The jacking assembly is used for adjusting the height of the cutter so that the cutter can be aligned with a
glue line of a product to be de-bonded. The tool transverse moving assembly is used for driving a tool to be inserted into a
glue line by a preset depth; the rotary adsorption platform drives the product to be de-bonded to rotate by a preset angle after the cutter is inserted into the
glue line by a preset depth; and when the carrying mechanism drives the de-bonded wafer to ascend, the jacking assembly drives the cutter to synchronously jack the wafer. According to the wafer de-bonding device, the deviation of the thickness of a product and an
adhesive layer can be compensated through the jacking assembly, and accurate
insertion and fragmentation are ensured; after the wedge-shaped cutter separates the
insertion pry, the rotary adsorption platform rotates for one circle, upper and lower wafers and slide glass can be separated, and the influence of glue performance is avoided.