Liquid metal heat dissipation-based high-power LED (Light Emitting Diode) light source with threaded connection structure

Abstract

The invention discloses a high-power LED (Light Emitting Diode) light source based on room-temperature liquid metal micropore heat conduction, comprising LED chips, a microporous packaging base plate, a fluorescent glue line, room-temperature liquid metal, a sealing layer, a heat radiator, gold threads, LED chip electrodes and micro pores, wherein the sealing layer and the microporous packaging base plate are arranged on the heat radiator in sequence; the LED chips are arranged on the micro pores of the microporous packaging base plate; the room-temperature liquid metal is filled in the micro pores of the microporous packaging base plate; the LED chips are provided with the LED chip electrodes which are connected with the gold threads; and the fluorescent glue line covers on the LED chips. In the invention, the bottoms of the LED chips are directly contacted with the liquid meal with excellent heat conductivity; the liquid metal is closely contacted with the microporous base plate; as the LED chips are directly and closely contacted with the heat radiator through the liquid metal, the heat generated by the LED chips during working can be effectively radiated; therefore, the heat radiation effect of the high-power LED is better; the die bond processes of the LED packaging is reduced; the reflectivity of the bottoms of the LED chips is increased; and the light efficiency is greatly promoted.

Description

technical field [0001] The invention relates to an illumination light source, in particular to a high-power LED light source based on room temperature liquid metal micropore heat conduction. Background technique [0002] LED light source is a new generation of green lighting source. Its power consumption is only one tenth of that of ordinary incandescent lamps, but its life is more than ten times longer. In addition, LED light sources also have the advantages of small size, durability, and rich colors. In order to meet the requirements of higher light intensity, the LED light source is realized by increasing the output power of a single chip or using an LED array. Under ideal conditions, matching optical materials and appropriate packaging structures can give full play to the efficient light-emitting performance of LEDs and convert most of the electrical energy into light. However, due to the very small area of ​​the LED chip, a large amount of heat cannot be dissipated in...

AI Technical Summary

Problems solved by technology

However, in that invention, there is still a problem of heat conduction at the thermal interface that has not been completely solved, that is, between the chip and the package substrate.

This interface is currently connected by using silver glue to solidify the crystal. The thermal conductivity of silver glue is not large (about 20W / K / m). What is more complicated is that silver glue needs to be cured at high temperature for a long time, which is complicated in process and affects the chip. heat damage

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