Solvent-free monocomponent organosilicon conducting resin used in LEDs and preparation method thereof

Abstract

The invention discloses a solvent-free monocomponent organosilicon conducting resin used in LEDs and a preparation method of the conducting resin, comprising the following steps of heating 1 to 10 parts by weight of curing accelerator to a temperature of 60 to 80 DEG C, stirring and adding 0.1 to 5 parts of polymerization inhibitor, uniformly mixing and cooling the solution to a room temperature, adding 10 to 30 parts by weight of ethene silicone oil, 1 to 10 parts by weight of curing agent silicone oil with hydrogen, 0.5 to 5 parts by weight of interface strengthening agent silane coupling agent, 0.5 to 10 parts by weight of silane reinforcing filling material silica, uniformly mixing the solution and adding 60 to 80 parts by weight of silver powder conductive filling material, uniformly mixing the solution and grinding the solution with a three-stick grinder. The conducting resin provided in the invention can be stored for more than 6 months at the temperature of 0 DEG C. The resin can be stored for more than two weeks at the room temperature and the viscosity of the resin increases 25%. The resin does not have solvent volatilization in a solidification process and does not generate pores in the glue-line. The heat decomposition temperature of the resin after solidification is 300 DEG C with 2% heat weight loss. At solidification, the heat weight loss (1%, room temperature small particle thrust) is 5Kgf / die (2*2mm); the volume resistivity is equal or less than 2.0*10-4w.cm; the glass-transition temperature is less than 10 DEG C and the pencil hardness is 7B.

Description

technical field [0001] The invention relates to a solvent-free single-component organic silicon conductive adhesive for LEDs and a preparation method thereof. Background technique [0002] During the LED chip packaging process, the process of laying gold wires on the surface of the chip requires that the conductive adhesive used must have good heat resistance and be able to withstand the processing conditions of 260°C for 1 minute. Although, the epoxy conductive adhesive can adjust the structure and curing agent so that the heat-resistant temperature can meet the process requirements of gold wire. However, the shrinkage stress of the epoxy adhesive is often large after curing, which is easy to damage the chip; the glass transition temperature is often higher than 90 ° C, the hardness of the adhesive layer in the glass state is high, the pencil hardness is often greater than 5H, and there is no certain elasticity. In use, it cannot absorb external shocks, and the chips are l...