The invention discloses a
solvent-free monocomponent
organosilicon conducting resin used in LEDs and a preparation method of the conducting resin, comprising the following steps of heating 1 to 10 parts by weight of curing accelerator to a temperature of 60 to 80 DEG C, stirring and adding 0.1 to 5 parts of
polymerization inhibitor, uniformly mixing and cooling the solution to a
room temperature, adding 10 to 30 parts by weight of ethene
silicone oil, 1 to 10 parts by weight of curing agent
silicone oil with
hydrogen, 0.5 to 5 parts by weight of interface strengthening agent
silane coupling agent, 0.5 to 10 parts by weight of
silane reinforcing filling material silica, uniformly mixing the solution and adding 60 to 80 parts by weight of silver
powder conductive filling material, uniformly mixing the solution and
grinding the solution with a three-stick grinder. The conducting resin provided in the invention can be stored for more than 6 months at the temperature of 0 DEG C. The resin can be stored for more than two weeks at the
room temperature and the
viscosity of the resin increases 25%. The resin does not have
solvent volatilization in a solidification process and does not generate pores in the glue-line. The heat
decomposition temperature of the resin after solidification is 300 DEG C with 2% heat
weight loss. At solidification, the heat
weight loss (1%,
room temperature small particle thrust) is 5Kgf / die (2*2mm); the volume resistivity is equal or less than 2.0*10-4w.cm; the glass-
transition temperature is less than 10 DEG C and the pencil
hardness is 7B.