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Manufacture method for Micro LED (Light Emitting Diode) display substrate

A manufacturing method and display substrate technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc.

Active Publication Date: 2019-03-15
HEFEI BOE OPTOELECTRONICS TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, it is a major technical difficulty to realize the array arrangement of Micro LEDs at the pixel level in the prior art, and there is no simple and easy technical solution at present.

Method used

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  • Manufacture method for Micro LED (Light Emitting Diode) display substrate
  • Manufacture method for Micro LED (Light Emitting Diode) display substrate
  • Manufacture method for Micro LED (Light Emitting Diode) display substrate

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Embodiment 1

[0048] refer to Figure 2 to Figure 11In the manufacturing method of the Micro LED104 display substrate provided in this embodiment, the transfer substrate assembly includes a transfer substrate 102, and the glue layer used to adhere the Micro LED104 to the transfer substrate 102 is UV photolytic glue 103, such as figure 2 As shown, the production method includes the following steps:

[0049] Step S11, refer to image 3 , docking the surface of the transfer substrate 102 with the UV photolytic glue 103 and the outer edge sheet 101 with the Micro LED 104, so that the Micro LED 104 is transferred to the transfer substrate 102 due to the adhesion of the UV photolytic glue 103, Figure 4 It is shown that the Micro LED 104 has been transferred onto the UV photoresist 103 of the transfer substrate 102 .

[0050] Wherein, the transfer substrate 102 is made of a transparent material, and a layer of the above-mentioned UV photoresist 103 is coated on the surface of the transfer subs...

Embodiment 2

[0069] refer to Figure 12 to Figure 19 , in the manufacturing method of the Micro LED104 display substrate provided in this embodiment, the transfer substrate assembly includes an auxiliary transfer substrate 105 and a transfer substrate 102, the auxiliary transfer substrate 105 has an organic glue 106, and the transfer substrate 102 has a UV curable glue 107. The method first transfers the Micro LED 104 on the outer edge sheet 101 to the auxiliary transfer substrate 105, and then transfers the Micro LED 104 on the auxiliary transfer substrate 105 to the driving substrate 301, as Figure 12 As shown, it specifically includes the following steps:

[0070] Step S21, refer to Figure 13 , the auxiliary transfer substrate 105 is docked with the outer edge sheet 101 to adhere the Micro LED 104 on the outer edge sheet 101 to the organic glue 106 .

[0071] After the auxiliary transfer substrate 105 is docked with the outer edge sheet 101, the Micro LED 104 on the outer edge sheet...

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Abstract

The invention relates to the technical field of display, in particular to a manufacture method for a Micro LED (Light Emitting Diode) display substrate. The manufacture method comprises the followingstep of transferring Micro LEDs in array distribution according to set gaps on an epitaxial wafer to a bonding pad corresponding to a driving substrate through a transfer substrate component. The stepof transferring comprises the following steps that: carrying out butt joint on the transfer substrate component and the epitaxial wafer to transfer the Micro LEDs on the epitaxial wafer to the glue line of the transfer substrate component, carrying out butt joint on the transfer substrate component and the driving substrate, and carrying out stickiness failure processing on the glue line on the transfer substrate component to release the Micro LED on the corresponding position in the transfer substrate component to the bonding pad on the corresponding position of the driving substrate. By useof the manufacture method, transfer equipment and assorted facilities do not need to be specially designed, batch fetching and transfer of the Micro LEDs can be realized to manufacture the Micro LEDdisplay substrate, and therefore, the manufacture method has the advantages of low cost, high transfer efficiency and the like.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a method for manufacturing a Micro LED display substrate. Background technique [0002] LED (Light Emitting Diode) production size tends to be more and more miniaturized. Therefore, the fabrication of display substrates with Micro LED array arrangement as pixels proposed in recent years has become possible. Compared with OLED (Organic Light Emitting Diode), LED has reliability. Therefore, Micro LED (miniature light-emitting diode) display technology is a new type of display technology that surpasses OLED display technology in the future. [0003] However, in the prior art, it is a major technical difficulty to realize the array arrangement of Micro LEDs at the pixel level, and there is no simple and feasible technical solution at present. Contents of the invention [0004] The invention discloses a method for manufacturing a Micro LED display substrate, which is used ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L21/67
CPCH01L33/48H01L21/67144H01L2933/0033H01L25/0753H01L21/6835H01L33/62H01L2221/68354H01L2221/68368H01L2221/68381H01L2933/0066
Inventor 韩波秦建伟吕磊谢东妹
Owner HEFEI BOE OPTOELECTRONICS TECH
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