Circuit board manufacturing method

Abstract

The invention relates to a manufacturing method for a circuit board. The method comprises the following steps that: an internal layer substrate containing a first internal layer conducting layer is provided; the first internal layer conducting layer is formed into a first internal layer line graph that comprises a groove area and a non-groove area that is beyond the groove area; liquid ink material that covers the whole groove area is printed on an area of the first internal layer line graph, wherein the area of the first internal layer line graph is corresponded to the groove area, and the liquid ink material is solified and a protection layer is formed; a first glue line and a first external layer conducting layer are compressed successively on a surface of an area of the first internallayer line graph and a surface of the protection layer, wherein the area of the first internal layer line graph is corresponded to the non-groove area, and a first external layer conducting layer that the non-groove area corresponding to is manufactured to form a first external layer line graph; the first external layer conducting layer and the first glue line are cut along frontiers of the groove area so as to form an opening; and then areas of the first external layer conducting layer, the first glue line and the protection layer are removed to obtain a groove structure, wherein the areas of the first external layer conducting layer, the first glue line and the protection layer are corresponding to the groove area. According to the manufacturing method provided in the invention, line graphs in the groove can be effectively protected.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to a method for producing a circuit board with a groove structure. Background technique [0002] Printed circuit boards have been widely used due to their advantages such as high assembly density. For the application of the circuit board, please refer to the literature Takahashi, A.Ooki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima, M.Res.Lab, High density multilayer printed circuit board for HITAC M-880, IEEE Trans. on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 418-425. [0003] Due to the need for miniaturization of electronic equipment, a groove structure is usually provided in the circuit board, and the packaging groove is used to cooperate with other packaged or plugged electronic components, thereby reducing the space occupied by the entire circuit board package. However, in the prior art, in the process of making the above-mentioned grooves, it is ne...

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Problems solved by technology

However, in the prior art, in the process of making the above-mentioned grooves, it is necessary to form a corresponding opening in each adhesive layer of the circuit board and then perform steps such as pressing and circuit making, so that the area corresponding to the opening is in the circuit board making process. It is easy to have the problem of inconsistent expansion and shrinkage in the middle, resulting in wrinkles

The adhesive layer turns into a liquid state under the condition of pressure and heating. Although the area of ​​the adhesive layer corresponding to the groove has an opening, the amount of overflowing glue is not easy to control, so the adhesive layer will still flow to the surface of the conductive circuit at the bottom of the groove, which is easy The adhesive layer and the conductive circuit are not easily separated, and the conductive circuit in the groove is easily damaged, thus affecting the performance of the entire circuit board

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