Gluing device and method

A gluing device and gluing technology, applied in the direction of surface coating liquid devices, coatings, adhesives, etc., can solve the problems of broken glue line, thinning, etc., achieve uniform flow speed, solve glue breaking and glue line thinning effect

Active Publication Date: 2014-07-09
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the technical solution of the present invention is to provide a gluing device and a gluing method, which are used to control the outflow speed of the glue mater

Method used

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  • Gluing device and method
  • Gluing device and method

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Embodiment Construction

[0039] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0040] The gluing device according to the specific embodiment of the present invention includes:

[0041] A dripping head for guiding the adhesive along the dripping direction, the adhesive added with a magnetic material;

[0042] The magnetic field generating structure is used for applying an induced magnetic field to the dripping head, and the magnetic material is applied with the same or opposite force as the dripping direction through the induced magnetic field.

[0043] The gluing device according to the specific embodiment of the present invention adds a magnetic material to the adhesive to be dripped, and uses the induced magnetic field applied to the dripping head to apply the same or opposite force to the magnetic material as the dripping direc...

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Abstract

The invention provides a gluing device and method. The gluing device comprises an instilling head and a magnetic field generation structure, wherein the instilling head is used for guiding adhesives along the instilling direction, and magnetic materials are added in the adhesives; the magnetic field generation structure is used for applying an induction magnetic field to the instilling head, and the same or opposite acting force is applied to the instilling direction to the magnetic materials by the induction magnetic field. According to the invention, the acting force same with or opposite to the instilling direction is applied to the magnetic materials by adding the magnetic materials into to-be-instilled adhesives and applying the induction magnetic field into the instilling head, so that aim of controlling the flowing speed of the adhesives toward the instilling direction is achieved by the acting force to the adhesives by the magnetic materials; the adhesives in the gluing device can be instilled successfully; the flowing speed is more uniform; the problem that glue breaking or glue line thinning which is caused by insufficient air pressure or pressure in gluing in the prior art is solved.

Description

Technical field [0001] The invention relates to the technical field of packaging equipment, in particular to a gluing device and a gluing method. Background technique [0002] At present, in the field of display production, component packaging is an indispensable process. For example, in the production of organic light-emitting diodes, also known as organic electroluminescence displays (OLEDs), better packaging of OLEDs has become one of the key issues in extending their service life. [0003] In traditional OLED packaging, devices are generally encapsulated by UV-curing epoxy resin. When OLED devices are packaged, it is often necessary to coat a wide range of epoxy resin adhesives to bond each layer of the board. In order to improve production efficiency, most of the work is done with a glue spreader. The traditional glue applicator generally uses air pressure or screw pressure to coat the adhesive on the cover glass. Through downward force, the adhesive drips smoothly. However...

Claims

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Application Information

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IPC IPC(8): B05C5/00B05C11/10B05D1/26
CPCB05D1/26B05C5/0225B05D3/20H01F1/0578C09J11/04H01F7/206H10K50/8426H10K71/00C09J9/00H01F1/0571
Inventor 全威张家豪廖金龙
Owner BOE TECH GRP CO LTD
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