Thin film packaging method

A technology of thin film packaging and packaging film, which is applied in the fields of electrical components, electrical solid devices, semiconductor/solid device manufacturing, etc., and can solve the problem of not being able to bind the driver chip to the flexible circuit board point screen.

Active Publication Date: 2017-01-11
KUNSHAN NEW FLAT PANEL DISPLAY TECH CENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] This application provides a thin film packaging method, which effectively solves the problem that the existing thin film packaging method cannot bind the driver chip (IC) / flexible circuit board (FPC) and point screen on the film.

Method used

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Embodiment Construction

[0028] The present application will be described in further detail below through specific embodiments and in conjunction with the accompanying drawings. "Front", "rear", "left", "right", "upper" and "lower" in the text all refer to the placed state of the device in the drawings.

[0029] Existing thin-film packaging is basically an inorganic-organic composite structure, and it is the inorganic layer that plays the role of water-oxygen barrier. Therefore, improving the water-oxygen barrier effect of the inorganic layer is crucial to the packaging effect of thin-film packaging. The inorganic layer of the existing thin-film packaging mainly adopts the CVD / ALD film-forming method, but most of the films formed by the above-mentioned film-forming methods are film-formed on the entire surface. Perform operations such as binding driver chips / flexible circuit boards (IC / FPC) and dot screens on the film.

[0030] In order to solve the above technical problems, the application provides ...

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Abstract

The application relates to a thin film packaging method, and the devices to be packaged comprises the lead area, wherein the packaging method comprises the steps of (1) coating organic glue line on the lead area of the devices to be packaged, to form the first intermediate; (2) packaging for the first intermediate is implemented by the upward side of the intermediate, so that to form the second intermediate after covering the packaging film on the upward side of the first intermediate; (3) removing the the packaging film and organic glue line covered at the upward side of the lead area of the second intermediate, to reveal the lead are. The thin film packaging method offered by the application implements the method of installing organic glue line in the lead area and removing organic glue line after thin film packaging to reveal the lead area, which can be used in the operations such as binding drive chip / flexible printed circuit board, point screen etc.

Description

technical field [0001] The present application relates to the field of OLED device packaging, in particular to a thin film packaging method. Background technique [0002] There are many thin-film packaging methods, and at present, the formation of organic-inorganic composite structure is mainly used as the basic thin-film packaging method. In the thin film encapsulation structure obtained by this thin film encapsulation method, it is the inorganic layer that plays the role of water and oxygen barrier. Therefore, improving the water and oxygen barrier effect of the inorganic layer is very important for the encapsulation effect of the thin film encapsulation. In the early stage, the inorganic layer was formed by physical vapor deposition (PVD), and the film density was relatively poor, and the foreign matter coverage performance was not good, so it was gradually replaced by other film formation methods. At present, the films obtained by atomic layer deposition (ALD) and chemi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L51/56
CPCH10K50/844H10K71/00
Inventor 赵长征刘金强周斯然敖伟罗志忠
Owner KUNSHAN NEW FLAT PANEL DISPLAY TECH CENT
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