Detection dust removal method, detection dust removal equipment and electronic equipment

Abstract

The invention discloses a detection dust removal method, detection dust removal equipment and electronic equipment. Gold thread detection and chip tiny dust detection are performed on a camera module; if the camera modules are detected to be defective products through the gold threads, the camera modules are distributed to a defective product bin; and if the camera module is detected to be a good product by the gold thread and the chip dust is detected to be a defective product by the dust removal mechanism, the camera module is subjected to dust removal operation by the dust removal mechanism. Thus, gold thread connection can be effectively discriminated, chip dust detection and dust removal can be realized at the same time, gold thread detection and dust removal operations can be performed together, the defective product rate of camera module packaging is reduced, procedures are saved, the production efficiency is improved, the production cost is reduced, and additional turnover of materials is avoided at the same time.

Description

Technical Field

[0001] The present invention relates to the technical field of camera packaging, and in particular to a dust removal detection method, dust removal detection equipment and electronic equipment. Background Art

[0002] In the camera module packaging process, the chip is first placed on the top surface of the PCB, connected to the PCB with gold wires. Next, the PCB is connected to an external control circuit board, and then the infrared filter is packaged. Common infrared filter packaging involves injection molding a bracket on the PCB, with the infrared filter mounted on the bracket. The infrared filter is then positioned above the chip, which is then located within a cavity enclosed by the bracket fixed to the PCB.

[0003] Currently, before the infrared filter packaging process, the gold wires connecting the chip to the PCB board and the chip surface are not inspected or only undergo manual microscope screening. Only after the infrared filter is packaged will a full manual microscope inspection be performed. At this time, since the infrared filter and chip have already been packaged, if there are problems with the chip or the gold wires connecting the chip to the PCB board, such as dust on the chip or poor connection of the gold wires between the chip and the PCB, it will lead to an increase in the defective product rate. Although the camera module packaging process is mostly carried out in a low-dust environment, it is still inevitable that dust will fly onto the top surface of the chip during the camera module packaging process, resulting in poor chip performance and poor packaging of the entire camera module product.

[0004] Therefore, how to reduce the defective rate of camera module packaging is the problem we need to solve at present. Summary of the Invention

[0005] In view of the above problems, the present invention is proposed to provide a dust removal detection method, dust removal detection device and electronic device that overcome the above problems or at least partially solve the above problems.

[0006] According to a first aspect of the present invention, a method for detecting dust removal is provided, comprising:

[0007] Perform gold wire detection and chip dust detection on camera modules;

[0008] If the gold wire of the camera module is detected as a defective product, the camera module is diverted to the defective product warehouse;

[0009] If the gold wire of the camera module is detected as a good product and the chip dust is detected as a defective product, the dust removal mechanism performs dust removal on the camera module.

[0010] Optionally, before performing gold wire detection and chip dust detection on the camera module, the method further includes:

[0011] Scan the QR code of the camera module to obtain product information of the camera module;

[0012] The product information of the camera module is sent to a work order management system.

[0013] Optionally, before the camera module is diverted to a defective product warehouse, the method further includes:

[0014] Send the test results of the gold wire test to the marking agency;

[0015] The identification mechanism marks a preset position of the camera module according to the detection result.

[0016] Optionally, the dust removal mechanism performs dust removal on the camera module, including:

[0017] Send the dust position coordinates and dust size to the dust removal mechanism;

[0018] The dust removal mechanism removes the dust on the camera module according to the dust coordinates.

[0019] Optionally, the method further includes:

[0020] The chip of the camera module is inspected for dust removal. If there is no dust exceeding a preset size, the inspection result is a good product and the dust removal operation is stopped. If there is dust exceeding a preset size, the inspection result is a defective product and the dust removal mechanism repeats the dust removal operation on the camera module.

[0021] Optionally, if the dust removal operation is repeated more than or equal to 3 times, the dust removal operation is stopped and the camera module is diverted to a defective product warehouse.

[0022] According to a second aspect of the present invention, there is provided a detection and dust removal device, comprising: a control unit and a conveying platform, a grasping mechanism, a gold wire detection mechanism, a dust detection mechanism, and a dust removal mechanism electrically connected to the control unit; the control unit executes the aforementioned detection and dust removal method;

[0023] The transmission platform is used to transmit the camera module to be inspected to the gold wire inspection mechanism; the gold wire inspection mechanism is used to scan the QR code of the camera module, determine the product information of the camera module, and send it to the work order management system; the gold wire inspection mechanism is also used to perform gold wire inspection on the camera module to determine whether the gold wire inspection of the camera module is good;

[0024] If the gold wire of the camera module is detected as defective, the grabbing mechanism grabs the camera module and diverts it to the defective product bin;

[0025] If the gold wire detection of the camera module is good, the conveying platform conveys the camera module to the dust detection mechanism, and the dust detection mechanism is used to perform chip dust detection on the camera module. When the chip dust detection is defective, the dust removal mechanism performs dust removal on the camera module.

[0026] Optionally, the detection and dust removal equipment further includes a marking mechanism, which is used to mark a preset position of the camera module according to the detection result of the gold wire detection.

[0027] Optionally, the dust removal mechanism includes a cleaning turntable, a dust sticking stick provided on the cleaning turntable, and a dust removal gripper for grabbing the dust stick to perform dust removal operations on the camera module.

[0028] According to a third aspect of the present invention, an electronic device is provided, comprising: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the aforementioned dust removal detection method when executing the computer program.

[0029] The above one or more technical solutions in the embodiments of this specification have at least the following technical effects:

[0030] The embodiments of this specification provide a detection and dust removal method, detection and dust removal device, and electronic device. These methods perform gold wire detection and chip dust detection on camera modules. If the gold wire detection indicates a defective product, the camera module is diverted to a defective product bin. If the gold wire detection indicates a good product and the chip dust detection indicates a defective product, a dust removal mechanism removes dust from the camera module. This effectively identifies gold wire connections while simultaneously detecting and removing chip dust. This allows gold wire detection and dust removal to be combined, reducing the defective rate of camera module packaging while saving steps, improving production efficiency, and reducing production costs, while avoiding additional material turnover.

[0031] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are specifically listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present invention. Throughout the drawings, the same reference figures denote the same components. In the drawings:

[0033] Figure 1 A flow chart of a dust removal detection method according to an embodiment of the present invention is shown.

[0034] Figure 2 A schematic diagram of a camera module in an embodiment of the present invention is shown.

[0035] Figure 3 A block diagram of a dust removal detection device according to an embodiment of the present invention is shown.

[0036] Figure 4 A schematic diagram of a dust removal mechanism in an embodiment of the present invention is shown.

[0037] icon:

[0038] 10-gold wire detection mechanism; 11-dust detection mechanism; 12-dust removal mechanism; 13-grabbing mechanism; 14-feeding box mechanism; 15-marking mechanism; 16-cleaning turntable; 17-dust stick; 18-dust removal gripper. DETAILED DESCRIPTION

[0039] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0040] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are intended to fall within the scope of protection of the present invention.

[0041] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0042] In the description of the present invention, it should also be noted that, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to mechanical connections or electrical connections; they may refer to direct connections or indirect connections through an intermediate medium; and they may refer to internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0043] Combine Figure 1 、 Figure 2 As shown, this embodiment provides a dust removal detection method, which is applied to a dust removal detection device. The dust removal detection device includes: a control unit and a conveying platform, a grasping mechanism, a gold wire detection mechanism, a dust detection mechanism, and a dust removal mechanism electrically connected to the control unit.

[0044] The dust removal detection method of the present application includes steps 101 to 103:

[0045] Step 101: Perform gold wire detection and chip dust detection on the camera module;

[0046] In this embodiment, gold wire detection refers to the detection of the gold wires connecting the chip and the PCB in the camera module to be detected. In this embodiment, the camera module to be detected is transmitted to the gold wire detection mechanism through the transmission platform, and the gold wire detection mechanism performs gold wire detection on the camera module.

[0047] The wire detection mechanism includes a high-precision camera that takes photos of the camera module being inspected and sends the photos to the control unit, which uses image recognition technology to detect and identify the wire connection status. For example, it can detect whether the wire connection is broken.

[0048] Chip dust detection involves using a dust detection mechanism to detect dust particles on the camera module's chip. The dust detection mechanism includes a high-precision camera that takes photos of the camera module to be tested and transmits the captured photos to a control unit, which uses image recognition technology to detect dust particles on the chip. It should be noted that in this embodiment, the camera module to be tested refers to a camera module that does not yet have an infrared filter installed, meaning that the camera module has not yet been fully packaged.

[0049] In this embodiment, before installing the infrared filter, gold wire detection and chip dust detection are completed, and then the infrared filter installation process is carried out according to the traditional packaging process.

[0050] In the existing technology, some inspection work is often carried out after the infrared filter is installed. If problems with the gold wire connection or large dust particles on the chip are detected at this time, it will be more difficult to solve the problem because the infrared filter has already been packaged, which will affect the quality of the camera module.

[0051] Step 102: If the gold wire of the camera module is detected as defective, the camera module is diverted to the defective product warehouse;

[0052] In this embodiment, the gold wire inspection generates two test results: good and defective. If the control unit detects a defective gold wire on the camera module, it sends control information to the gripping mechanism, instructing it to grab the camera module and divert it to the defective bin. If the control unit detects a good gold wire on the camera module, the transport platform transports the camera module to the dust detection mechanism for chip dust inspection.

[0053] It should be noted that before the capture mechanism captures and diverts the camera module to the defective product bin, the gold wire detection results can also be sent to the marking mechanism. The marking mechanism will mark the preset position of the camera module based on the detection results for identification. The preset position of this embodiment can be set to meet the needs of different products, and the marking will not cause pollution. The marking pen uses a special oil-based pen that will not fade after washing or baking, and can be wiped with alcohol to leave no marks.

[0054] Step 103: If the gold wire detection of the camera module is good and the chip dust detection is bad, the dust removal mechanism performs dust removal on the camera module.

[0055] Among them, the camera module that passes the gold wire detection, that is, the camera module that is qualified by the gold wire detection, will be transmitted by the transmission platform to the dust detection mechanism for chip dust detection.

[0056] Chip dust detection primarily identifies and detects dust particles on the chip that exceed a preset size. Specifically, the control unit is connected to the dust detection mechanism. The dust detection mechanism sends a photo of the chip to the control unit, which then detects and identifies dust particles on the chip based on the photo, determining their location coordinates and size.

[0057] The control unit compares the dust particle size with the preset size, wherein the dust particle size includes a first size in the X-axis direction and a second size in the Y-axis direction; and the preset size includes a preset first size and a preset second size.

[0058] If the first size does not exceed the preset first preset size, and the second size does not exceed the preset second preset size, the chip dust detection is good. At this time, the camera module can flow directly to the discharge tray grabbing position, and then the unloading box mechanism can directly perform subsequent streamline operations on the camera module and continue the packaging process; the camera module can also be stored in the good product warehouse.

[0059] If the first size exceeds a preset first size and / or the second size exceeds a preset second size, the chip dust is detected as defective, and the control unit controls the dust removal mechanism to perform a dust removal operation. The dust removal operation refers to the dust removal mechanism removing dust from the chip.

[0060] In summary, the detection and dust removal method of this embodiment can effectively identify gold wire connections and realize the detection and dust removal of chip dust. In this way, the gold wire detection and dust removal operations can be combined together, saving processes, improving production efficiency, reducing production costs, and reducing additional material turnover to avoid contamination during turnover.

[0061] In addition, it should be explained that when performing chip dust detection, even if dust is detected, not all dust removal operations are performed. This is because some dust particles are very small, so small that they have almost no effect on the camera module. Or, the dust particles are located in non-critical areas of the chip and have almost no effect on the camera module. In these cases, dust removal operations are not required. If the detected dust particle size does not meet the requirements, for example, the dust particle size exceeds the preset size, or the diameter of the circumscribed circle of the dust particles in the chip photo taken by the dust detection mechanism is greater than the preset threshold, the dust removal mechanism is required to perform dust removal operations on the camera module.

[0062] In an actual example, the steps of the dust removal mechanism performing dust removal on the camera module may include:

[0063] Send the dust position coordinates and dust size to the dust removal mechanism;

[0064] The dust removal mechanism removes dust from the chip of the camera module according to the dust position coordinates and dust size.

[0065] In this embodiment, as mentioned above, when the chip dust is detected as a defective product, the control unit will send the dust position coordinates and the dust size to the dust removal mechanism, and then the dust removal mechanism will locate the position of the dust according to the dust position coordinates, and then perform dust removal operations according to the dust size. If the dust size is large, multiple dust collection operations may be required.

[0066] In an optional embodiment, after completing a dust removal operation, to ensure dust removal effectiveness, the camera module can be returned to perform a chip dust detection. If the chip dust detection indicates a good product, the dust removal operation can be completed; if the chip dust detection indicates a defective product, the chip dust removal operation needs to be repeated.

[0067] In another optional embodiment, during the first chip dust removal test, if the dust particle size exceeds a standard threshold, n dust removal operations may be performed on the dust particles, where n is an integer greater than 2 and the standard threshold is greater than a preset size. For example, the dust particle size includes a first dimension in the X direction and a second dimension in the Y direction. If the first dimension is greater than the standard threshold or the second dimension is greater than the standard threshold, the dust particle location coordinates and dust particle size are transmitted to the dust removal mechanism, and the dust removal mechanism is controlled to perform n repeated dust removal operations on the chip. Furthermore, the dust particle location coordinates may be used to determine whether multiple dust removal operations are necessary. For example, during the first chip dust removal test, if the dust particle size exceeds the standard threshold and the dust particle location coordinates are located in the target center area of ​​the chip, n repeated dust removal operations may be performed on the dust particles. That is, if the dust particle's first dimension is greater than the standard threshold or the second dimension is greater than the standard threshold and the dust particle is located in the target center area of ​​the chip, multiple repeated dust removal operations may be performed on the dust particles. The target center area is a designated critical area on the chip, generally referring to the center of the chip. Correspondingly, the non-target center area refers to the non-important area close to the edge of the chip.

[0068] In one embodiment, the number of times the dust removal operation can be repeated can also be limited. That is, when the dust removal operation is repeated three times or more, the dust removal operation is stopped regardless of whether the dust on the chip has been removed. Furthermore, if dust is still detected on the chip, the camera module is diverted to the defective product bin.

[0069] In addition, it is worth mentioning that the camera modules produced in the workshop will be marked with a QR code on the surface of the circuit board. The QR code contains the category, model and other information corresponding to the product. Before performing gold wire detection and chip dust detection on the camera module, the gold wire detection mechanism will scan the QR code of the camera module to obtain the product information of the camera module, and then send the product information of the camera module to the work order management system to facilitate subsequent traceability and analysis operations.

[0070] In summary, the embodiments of this specification provide a detection and dust removal method that performs gold wire inspection and chip dust inspection on camera modules. If the gold wire inspection of the camera module indicates a defective product, the camera module is captured and diverted to a defective product bin. If the gold wire inspection of the camera module indicates a good product and the chip dust inspection indicates a defective product, a dust removal mechanism performs dust removal on the camera module. This effectively identifies gold wire connections and simultaneously detects and removes chip dust. This allows the gold wire inspection and dust removal operations to be combined, reducing the defective rate of camera module packaging, while also saving steps, improving production efficiency, and lowering production costs. It also reduces the amount of material that needs to be recycled, preventing contamination during transportation.

[0071] Based on the same inventive concept, combined Figure 3 As shown, an embodiment of the present invention also provides a detection and dust removal device, which applies the detection and dust removal method as described above; the detection and dust removal device includes: a control unit and a conveying platform, a gripping mechanism 13, a gold wire detection mechanism 10, a dust detection mechanism 11, a dust removal mechanism 12, and a material box mechanism 14, which are electrically connected to the control unit respectively.

[0072] The transmission platform is used to transmit the camera module to be inspected to the gold wire inspection mechanism 10; the gold wire inspection mechanism 10 is used to scan the QR code of the camera module, determine the product information of the camera module, and send it to the work order management system; the gold wire inspection mechanism 10 is also used to perform gold wire inspection on the camera module to determine whether the gold wire inspection of the camera module is good.

[0073] If the gold wire of the camera module is detected as defective, the grabbing mechanism 13 grabs the camera module and diverts it to the defective product bin;

[0074] If the gold wire detection of the camera module is good, the conveying platform conveys the camera module to the dust detection mechanism 11. The dust detection mechanism 11 is used to perform chip dust detection on the camera module. When the chip dust detection is defective, the dust removal mechanism 12 performs dust removal on the camera module.

[0075] Among them, the dust detection mechanism 11 can accurately confirm the dust on the surface of the chip through the photographic function of the high-precision camera. The visual computing system connected to it will calculate the size of the dust to determine the degree of its impact and determine whether dust removal is needed; and if the dust removal is not completed, the dust removal operation will be performed again, and then the above actions will be repeated after inspection; defective products that have not completed dust removal will be marked and the product information will be uploaded so that no further process operations will be arranged later.

[0076] Combine Figure 4As shown, the dust removal mechanism 12 is used to remove dust from the camera module when a chip is detected as defective due to dust. The dust removal mechanism 12 includes a cleaning turntable 16, a sticky stick 17 mounted on the cleaning turntable 16, and a dust removal gripper 18 for grabbing the sticky stick and removing dust from the chip on the camera module. The sticky stick 17 can be set to a specific usage cycle, either based on usage time or the number of uses, for easy management and control. The cleaning turntable 16 can hold one to twenty sticky sticks 17 at a time, allowing for repetitive use without manual replacement. The cleaning turntable 16 rotates 360 degrees, facilitating easy access to the sticky sticks 17. The unloading cassette mechanism 14 is used to divert the camera module through a gripper based on the inspection results of the gold wire detection mechanism 10. The unloading cassette mechanism 14 has separate channels for good and bad products. Good products can be directly processed or stored in the good product bin, while bad products are returned to the bad product bin, preventing the outflow of bad products.

[0077] Specifically, the inspection and dust removal equipment also includes an XY motion platform and an XY inspection platform. The XY motion platform is driven by a linear motor, offering high reliability and stability, capable of maintaining long distances along the X and Y axes. The XY inspection platform features a vacuum suction feature, which traps the carrier while it is operating on the inspection platform, enhancing inspection accuracy. The inspection platform is also adjustable, with upper and lower fixing screws allowing for height adjustments to accommodate different products under test.

[0078] In addition, the detection and dust removal equipment further includes a marking mechanism 15, which is used to mark a preset position of the camera module according to the detection result of the gold wire detection.

[0079] In summary, the embodiments of this specification provide a detection and dust removal device that performs gold wire inspection and chip dust inspection on camera modules. If the gold wire inspection of the camera module indicates a defective product, a material loading and grabbing mechanism grabs the camera module and diverts it to a defective product bin. If the gold wire inspection of the camera module indicates a good product and the chip dust inspection indicates a defective product, a dust removal mechanism performs dust removal on the camera module. This effectively identifies gold wire connections and simultaneously detects and removes chip dust, allowing gold wire inspection and dust removal to be combined, saving steps, improving production efficiency, reducing production costs, and avoiding additional material turnover.

[0080] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the dust removal equipment described above can refer to the corresponding process in the aforementioned method, and will not be elaborated here.

[0081] This embodiment also provides an electronic device, which may include a memory, a processor and a communication unit. The memory stores machine-readable instructions executable by the processor. When the electronic device is running, the processor and the memory communicate through a bus, and the processor 30 executes the machine-readable instructions and performs a dust removal detection method.

[0082] The memory, processor, and communication unit are electrically connected to each other, directly or indirectly, to enable signal transmission or interaction. For example, these components may be electrically connected to each other via one or more communication buses or signal lines. The processor is configured to execute the dust removal detection method stored in the memory.

[0083] Among them, the memory can be, but is not limited to, random access memory (RAM), read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable read-only memory (EEPROM), etc.

[0084] In some embodiments, the processor is used to perform one or more functions described in this embodiment. In some embodiments, the processor may include one or more processing cores (eg, a single-core processor (S) or a multi-core processor (S)).

[0085] For ease of explanation, only one processor is described in the electronic device. However, it should be noted that the electronic device in this embodiment may also include multiple processors, so the steps performed by one processor described in this embodiment may also be performed jointly or individually by multiple processors. For example, if the processor of the server performs steps A and B, it should be understood that steps A and B may also be performed jointly by two different processors or individually in one processor. For example, a processor performs step A and a second processor performs step B, or the processor and the second processor perform steps A and B together.

[0086] In this embodiment, the memory is used to store the program, and the processor is used to execute the program after receiving the execution instruction. The process definition method disclosed in any implementation of this embodiment can be applied to the processor or implemented by the processor.

[0087] The communication unit is used to establish a communication connection between the electronic device and other devices through a network, and to send and receive data through the network.

[0088] In some embodiments, the communication unit connection network may be any type of wired or wireless network, or a combination thereof.

[0089] The above are merely various embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A dust removal detection method, characterized in that: include: Conduct gold wire inspection and chip dust inspection on camera modules; If the gold wire of the camera module is detected as a defective product, the camera module is diverted to a defective product warehouse; If the gold wire of the camera module is detected as a good product and the chip dust is detected as a defective product, the dust removal mechanism performs dust removal on the camera module.

2. The dust removal detection method according to claim 1, characterized in that: Before the gold wire detection and chip dust detection are performed on the camera module, the method further includes: Scan the QR code of the camera module to obtain product information of the camera module; The product information of the camera module is sent to a work order management system.

3. The dust removal detection method according to claim 1, characterized in that: Before the camera module is diverted to the defective product warehouse, the method further includes: Send the test results of the gold wire test to the marking agency; The identification mechanism marks a preset position of the camera module according to the detection result.

4. The dust removal detection method according to claim 1, characterized in that: The dust removal mechanism performs dust removal operation on the camera module, including: Send the dust position coordinates and dust size to the dust removal mechanism; The dust removal mechanism removes the dust on the camera module according to the dust coordinates.

5. The dust removal detection method according to claim 4, characterized in that: The detection and dust removal method also includes: The chip of the camera module is inspected for dust removal. If there is no dust exceeding the preset size, the inspection result is a good product and the dust removal operation is stopped; if there is dust exceeding the preset size, the inspection result is a defective product and the dust removal mechanism repeats the dust removal operation on the camera module.

6. The dust removal detection method according to claim 5, characterized in that: If the number of repeated dust removal operations is greater than or equal to 3 times, the dust removal operation is stopped and the camera module is diverted to a defective product warehouse.

7. A dust removal detection device, characterized in that: include: A control unit and a conveying platform, a grasping mechanism, a gold wire detection mechanism, a dust detection mechanism, and a dust removal mechanism electrically connected to the control unit respectively; the control unit executes the detection and dust removal method according to any one of claims 1 to 6; The transmission platform is used to transmit the camera module to be tested to the gold wire detection mechanism; the gold wire detection mechanism is used to scan the QR code of the camera module, determine the product information of the camera module, and send it to the work order management system; the gold wire detection mechanism is also used to perform gold wire detection on the camera module to determine whether the gold wire detection of the camera module is good; If the gold wire of the camera module is detected as a defective product, the grabbing mechanism grabs the camera module and diverts it to the defective product bin; If the gold wire detection of the camera module is good, the conveying platform conveys the camera module to the dust detection mechanism, and the dust detection mechanism is used to perform chip dust detection on the camera module. When the chip dust detection is defective, the dust removal mechanism performs dust removal on the camera module.

8. The dust removal detection device according to claim 7, characterized in that: The detection and dust removal device also includes a marking mechanism, which is used to mark a preset position of the camera module according to the detection result of the gold wire detection.

9. The dust removal detection device according to claim 7, characterized in that: The dust removal mechanism includes a cleaning turntable, a dust sticking rod arranged on the cleaning turntable, and a dust removal gripper for grabbing the dust sticking rod to perform dust removal operations on the camera module.

10. An electronic device, characterized in that: The electronic device comprises: a memory, a processor and a computer program stored in the memory and executable on the processor, and the processor implements the dust removal detection method described in any one of claims 1 to 6 when executing the computer program.

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