A device for preventing tin balls from being generated during PCB soldering process

Abstract

The present invention relates to the field of welding technology, and specifically to a device for preventing tin balls from being generated in a PCB board welding process, comprising a base, an upper surface of the base being provided with an electric board support, two sides of the base being slidably connected to the same slide, a surface of the slide being sleeved with a movable frame, the left side of the movable frame being rotatably connected to a tin bar roll, a lower surface of the movable frame being slidably connected to a telescopic frame, a welding gun being inserted into the interior of the telescopic frame, and a wire feeding device being inserted into the inner wall of the telescopic frame, by arranging an air suction hole, a tin bar, a needle, and a wire opener, during the movement of the tin bar, the sharp part of the wire opener will penetrate into the interior of the tin bar to form a continuous crack, and the provision of two wire openers increases the surface area of ​​the tin bar, thereby increasing the welding contact area with the welding gun. This method is efficient, energy-saving, and minimizes the generation of tin balls.

Description

Technical Field

[0001] The present invention relates to the field of welding technology, in particular to a device for preventing tin balls from being generated in a PCB board welding process. Background Art

[0002] PCB is a circuit board known as the "mother of electronic products". During the production process, soldering technology is used to solder components. During the soldering process, tin balls usually appear. The appearance of tin balls not only affects the appearance of the product, but also causes short circuits and other phenomena, seriously affecting the use of the product. However, the cleaning work of tin balls not only wastes a lot of manpower and reduces product quality, but can even directly lead to scrapping.

[0003] In the prior art, tin balls need to be removed through secondary detinning. Therefore, we propose a device to prevent the generation of tin balls in the PCB board soldering process. Summary of the Invention

[0004] The object of the present invention is to provide a device for preventing the generation of tin balls in a PCB board soldering process, so as to solve the problems raised in the above background technology.

[0005] The technical solution of the present invention is: a device for preventing tin beads from being generated in a PCB board soldering process, comprising a base, an electric board support being provided on the upper surface of the base, a slide being slidably connected to both sides of the base, a movable frame being sleeved on the surface of the slide, a tin bar roll being rotatably connected to the left side of the movable frame, a telescopic frame being slidably connected to the lower surface of the movable frame, a welding gun being inserted into the interior of the telescopic frame, a switch device being fixedly installed on the lower surface of the telescopic frame, a trapezoidal block being provided in the inner cavity of the switch device, a slide rod being fixedly installed on the upper surface of the trapezoidal block, and the upper end of the slide rod being fixedly connected to a support The sliding rod passes through the interior of the switch device and extends upward, the surface of the sliding rod is sleeved with a first spring, one end of the first spring is fixedly connected to the upper surface of the trapezoidal block, and the other end of the first spring is fixedly connected to the inner top surface of the switch device, the lower surface of the trapezoidal block is fixedly connected to a sensing rod, the sensing rod passes through the interior of the switch device and extends downward, the left side wall of the trapezoidal block is provided with a telescopic block, the telescopic block passes through the inner wall of the switch device and extends to the left, and the right side of the telescopic block is fixedly connected to two symmetrically arranged second springs, which are respectively located on both sides of the trapezoidal block;

[0006] A wire feeding device is inserted into the inner wall of the telescopic frame, and an air suction hole is penetrated through the upper surface of the wire feeding device, and a tin bar is inserted into the interior of the wire feeding device, and a cover body is provided on the upper end of the wire feeding device, and one end of the tin bar away from the wire feeding device penetrates the interior of the cover body and is wound around the surface of the tin bar roll, and a strip groove is provided on the inner wall of the air suction hole, and the end of the strip groove away from the air suction hole is tangent to the groove of the tin bar, and a rotating rod is rotatably connected to the interior of the strip groove, and a needle is provided at the right end of the rotating rod, and a fan blade is provided at the left end of the rotating rod, and a groove is provided at the upper end of the wire feeding device, and a wire opener is provided inside the groove, and an air suction pipe is provided at the upper end of the wire feeding device, one end of the air suction pipe penetrates the interior of the cover body and is connected to the air suction hole, and the other end of the air suction pipe is fixedly connected to the air suction device.

[0007] Preferably, the trapezoidal block is arranged to be smaller at the top and larger at the bottom, and the thickness of the trapezoidal block is smaller than the width of the telescopic block.

[0008] Preferably, the wire opener is a combination of a cone and a boss, the conical portion of the wire opener extends toward the axis of the tin bar, and there are two wire openers.

[0009] Preferably, the air suction hole is semicircular, and the lower end of the air suction hole is flush with the electric board support.

[0010] Preferably, the diameter of the air suction hole is smaller than the length of the sliding rod, and the size of the air suction hole is adapted to the size of the left end portion of the telescopic block.

[0011] Preferably, the needle is arranged in a continuous cone shape, and the sharp end of the needle is against the surface of the tin bar.

[0012] Preferably, the fan blades rotate counterclockwise and are located in the middle of the air suction hole.

[0013] Preferably, one side of the tin bar close to the bottom of the air suction hole is recessed inward to form an empty groove, and the side surface of the tin bar is located inside the empty groove.

[0014] The present invention provides a device for preventing the generation of tin balls in the PCB board soldering process through improvement. Compared with the prior art, it has the following improvements and advantages:

[0015] First, the present invention provides a device for preventing the generation of tin balls in a PCB board welding process. The device comprises a trapezoidal block, a first spring, a sensing rod, a telescopic block, and an air suction hole. When the sensing rod contacts the PCB board, the first spring is deformed, and at the same time, the trapezoidal block moves upward. Since the trapezoidal block is arranged in a trapezoidal shape, the telescopic block moves leftward, thereby separating the left end portion of the telescopic block from the air suction hole, allowing the air suction hole to begin normal air suction operation. This method is simple to operate, timely and effective, and can promptly remove tin balls during welding work, and can also avoid directly removing components before absorbing the tin balls.

[0016] Second, the present invention provides a device for preventing the generation of tin beads in the PCB board welding process. By providing an air suction hole, a tin bar, a needle, and a fan blade, during the welding process, the wind will drive the fan blade to rotate. Since the needle and the fan blade are coaxial, the needle will rotate. Since the needle and the surface of the tin bar are in contact, the tin bar will move downward, so that the tin bar can be delivered in time during the welding process, the supply of tin bar during welding is guaranteed, and the phenomenon of cold solder joints during the welding process is avoided, so that welding materials can be provided in time during the PCB welding process. Third, the present invention provides a device for preventing the generation of tin beads in the PCB board welding process. By providing an air suction hole, a tin bar, a needle, and a wire opener, during the movement of the tin bar, the sharp part of the wire opener will penetrate into the interior of the tin bar, forming a continuous crack. The provision of two wire openers increases the surface area of ​​the tin bar, thereby increasing the welding contact area with the welding gun, preventing the tin bar from splashing during welding. This method is efficient, energy-saving, and minimizes the generation of tin beads. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention will be further explained below in conjunction with the accompanying drawings and examples:

[0018] Figure 1 It is a schematic diagram of the front three-dimensional structure of the present invention;

[0019] Figure 2 is a schematic structural diagram of the switch device of the present invention;

[0020] Figure 3 It is a structural schematic diagram of the strip groove and the rotating rod of the present invention;

[0021] Figure 4 It is a structural schematic diagram of the wire opener of the present invention;

[0022] Figure 5 It is a structural schematic diagram of the bottom of the wire feeding device of the present invention;

[0023] Figure 6 It is a structural schematic diagram of the telescopic block of the present invention.

[0024] Description of reference numerals:

[0025] 1. Base; 2. Electric board support; 3. Slide; 4. Movable frame; 5. Tin bar roll; 6. Telescopic frame; 7. Welding gun; 8. Switch device; 81. Trapezoidal block; 82. Slide rod; 83. Support block; 84. First spring; 85. Sensing rod; 86. Telescopic block; 87. Second spring; 9. Wire feeding device; 91. Suction hole; 92. Tin bar; 93. Strip groove; 94. Rotating rod; 95. Needle; 96. Fan blade; 10. Groove; 11. Wire opener; 12. Suction pipe; 13. Suction device. DETAILED DESCRIPTION

[0026] The present invention is described in detail below, clearly and completely describing the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0027] The present invention provides a device for preventing the generation of tin balls in a PCB board welding process through improvement. The technical solution of the present invention is:

[0028] like Figure 1 - Figure 6 As shown, a device for preventing tin balls from being generated in a PCB board soldering process includes a base 1, an electric board support 2 is provided on the upper surface of the base 1, a same slide 3 is slidably connected to both sides of the base 1, a movable frame 4 is sleeved on the surface of the slide 3, a tin bar roll 5 is rotatably connected to the left side of the movable frame 4, a telescopic frame 6 is slidably connected to the lower surface of the movable frame 4, a welding gun 7 is inserted into the interior of the telescopic frame 6, a switch device 8 is fixedly installed on the lower surface of the telescopic frame 6, a trapezoidal block 81 is provided in the inner cavity of the switch device 8, a slide rod 82 is fixedly installed on the upper surface of the trapezoidal block 81, the upper end of the slide rod 82 is fixedly connected to the support block 83, and the slide rod 82 passes through The interior of the switch device 8 extends upward, and the surface of the slide rod 82 is sleeved with a first spring 84, one end of the first spring 84 is fixedly connected to the upper surface of the trapezoidal block 81, and the other end of the first spring 84 is fixedly connected to the internal top surface of the switch device 8, and the lower surface of the trapezoidal block 81 is fixedly connected to a sensing rod 85, which passes through the interior of the switch device 8 and extends downward. A telescopic block 86 is provided on the left side wall of the trapezoidal block 81, and the telescopic block 86 passes through the inner wall of the switch device 8 and extends to the left. Two symmetrically arranged second springs 87 are fixedly connected to the right side of the telescopic block 86, and the second springs 87 are respectively located on both sides of the trapezoidal block 8.

[0029] The inner wall of the telescopic frame 6 is provided with a wire feeding device 9, and the upper surface of the wire feeding device 9 is penetrated by an air suction hole 91, and a tin bar 92 is inserted into the interior of the wire feeding device 9. The upper end of the wire feeding device 9 is sleeved with a cover body, and the end of the tin bar 92 away from the wire feeding device 9 passes through the interior of the cover body and is wound around the surface of the tin bar roll 5. The inner wall of the air suction hole 91 is provided with a strip groove 93, and the end of the strip groove 93 away from the air suction hole 91 is tangent to the groove of the tin bar 92. The interior of the strip groove 93 is rotatably connected to a rotating rod 94, and a needle 95 is provided at the right end of the rotating rod 94, and a fan blade 96 is provided at the left end of the rotating rod 94. The upper end of the wire feeding device 9 is provided with a groove 10, and a wire opener 11 is provided inside the groove 10. The upper end of the wire feeding device 9 is provided with an air suction pipe 12, one end of the air suction pipe 12 passes through the interior of the cover body and is connected to the air suction hole 91, and the other end of the air suction pipe 12 is fixedly connected to the air suction device 13.

[0030] Furthermore, the trapezoidal block 81 is set to be small at the top and large at the bottom. The thickness of the trapezoidal block 81 is smaller than the width of the telescopic block 86. By setting the trapezoidal block 81, the telescopic block 86 moves due to the different widths of the trapezoidal block 81, and the telescopic block 86 is larger than the width of the trapezoidal block 81, so as to facilitate the stretching and resetting of the second springs 87 on both sides.

[0031] Furthermore, the wire opener 11 is a combination of a cone and a boss, and the conical part of the wire opener 11 extends toward the axis of the tin bar 92. There are two wire openers 11. By setting the wire opener 11, a continuous wire groove can be drawn on the surface of the tin bar 92, and the two wire openers 11 also increase the number of wire grooves, making the contact with the welding gun more complete, preventing the tin bar from splashing during welding, and greatly reducing the generation of tin beads.

[0032] Furthermore, the air suction hole 91 is semicircular in shape, and the lower end of the air suction hole 91 is level with the board support 2. By setting the air suction hole 91 semicircularly, the fan blades 96 can rotate more smoothly, and the air suction hole 91 is flush with the support 2, which can fully avoid the phenomenon of tin beads splashing. Therefore, the air suction hole 91 can also serve as a protective cover.

[0033] Furthermore, the diameter of the suction hole 91 is smaller than the length of the slide bar 82, and the size of the suction hole 91 is adapted to the size of the left end portion of the telescopic block 86. By setting the slide bar 82, it can adapt to various PCB boards of different thicknesses, and the slide bar 82 is long enough to keep the suction hole 91 of the telescopic block 86 separated and combined.

[0034] Furthermore, the needle 95 is set in a continuous cone shape, and the sharp end of the needle 95 is against the surface of the tin bar 92. By setting the needle 95 and the tin bar 92 to cooperate with each other, the tin bar 92 can be delivered in time during the welding process of the welding gun 7.

[0035] Furthermore, the fan blade 96 rotates counterclockwise and is located in the middle of the air suction hole. By setting the counterclockwise rotation direction of the fan blade 96, the tin bar 92 can be moved downward, and the middle position of the fan blade 96 can maximize the rotation speed, providing stable power for the smooth movement of the tin bar 92.

[0036] Furthermore, one side of the tin bar 92 near the bottom of the suction hole 91 is recessed inward to form an empty slot, and the side of the tin bar 92 is located inside the empty slot. Through the above arrangement, the tin beads are sucked away through the suction hole 91 to the greatest extent.

[0037] Working principle: When in use, first place the PCB board on the board support 2, then turn on the suction device 13, and then turn on the soldering machine. When the lower end of the sensing rod 85 contacts the PCB board, the first spring 14 is squeezed, and the trapezoidal block 81 moves upward. The change in the upper and lower width difference of the trapezoidal block 81 causes the telescopic block 86 to move to the left. As the telescopic block 86 moves to the left, the leftmost end of the telescopic block 86 is separated from the suction hole 91, thereby restoring the normal suction work of the suction hole 91. The fan blade 96 rotates under the influence of the wind, and at the same time, the needle 95 rotates. The tin bar 92 is driven to move downward. During the downward movement of the tin bar 92, the two wire openers 11 will scratch the surface of the tin bar 92. When the tin bar 92 at the lower end is melted into liquid by the high temperature of the welding gun 7, the PCB board and components are adhered together, and the excess molten liquid enters the suction pipe 13 along the inner wall of the suction hole 13. When the switch device 7 is separated from the PCB board, the sensing rod 85 is gradually reset under the influence of the first spring 84, and the telescopic block 86 at the far left will block the suction hole 91. The wind force at the lower end of the telescopic block 86 gradually disappears, and the tin bar 92 will stop being transported downward, and the welding work is completed.

[0038] The above description is intended to enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A device for preventing the generation of tin balls in a PCB board soldering process, comprising a base (1), characterized in that: The upper surface of the base (1) is provided with an electric board support (2), and the two sides of the base (1) are slidably connected to the same slide (3), the surface of the slide (3) is provided with a movable frame (4), the left side of the movable frame (4) is rotatably connected to a tin bar roll (5), the lower surface of the movable frame (4) is slidably connected to a telescopic frame (6), a welding gun (7) is inserted into the interior of the telescopic frame (6), a switch device (8) is fixedly installed on the lower surface of the telescopic frame (6), the inner cavity of the switch device (8) is provided with a trapezoidal block (81), a slide rod (82) is fixedly installed on the upper surface of the trapezoidal block (81), the upper end of the slide rod (82) is fixedly connected to a support block (83), and the slide rod (82) passes through the interior of the switch device (8) and The sliding rod (82) extends upward, and a first spring (84) is sleeved on the surface of the sliding rod (82), one end of the first spring (84) is fixedly connected to the upper surface of the trapezoidal block (81), and the other end of the first spring (84) is fixedly connected to the inner top surface of the switch device (8), and the lower surface of the trapezoidal block (81) is fixedly connected to a sensing rod (85), and the sensing rod (85) passes through the interior of the switch device (8) and extends downward, and a telescopic block (86) is provided on the left side wall of the trapezoidal block (81), and the telescopic block (86) passes through the inner wall of the switch device (8) and extends to the left, and two symmetrically arranged second springs (87) are fixedly connected to the right side of the telescopic block (86), and the second springs (87) are respectively located on both sides of the trapezoidal block (81); The inner wall of the telescopic frame (6) is provided with a wire feeding device (9), the upper surface of the wire feeding device (9) is provided with an air suction hole (91), the interior of the wire feeding device (9) is provided with a tin bar (92), the upper end of the wire feeding device (9) is provided with a cover body, the end of the tin bar (92) away from the wire feeding device (9) passes through the interior of the cover body and is wound on the surface of the tin bar roll (5), the inner wall of the air suction hole (91) is provided with a strip groove (93), the end of the strip groove (93) away from the air suction hole (91) is tangent to the groove of the tin bar (92), and the strip groove (93) is provided with a strip groove (93) The interior of the shaped groove (93) is rotatably connected to a rotating rod (94), the right end of the rotating rod (94) is provided with a needle (95), the left end of the rotating rod (94) is provided with a fan blade (96), the upper end of the wire feeding device (9) is provided with a groove (10), the interior of the groove (10) is provided with a wire opener (11), the upper end of the wire feeding device (9) is provided with an air suction pipe (12), one end of the air suction pipe (12) passes through the interior of the cover body and is connected to the air suction hole (91), and the other end of the air suction pipe (12) is fixedly connected to the air suction device (13).

2. The device for preventing tin balls from forming in a PCB soldering process according to claim 1, wherein: The trapezoidal block (81) is configured to be smaller at the top and larger at the bottom, and the thickness of the trapezoidal block (81) is smaller than the width of the telescopic block (86).

3. The device for preventing tin balls from forming in a PCB soldering process according to claim 1, wherein: The wire opener (11) is a combination of a cone and a boss, the conical portion of the wire opener (11) extends toward the axis of the tin bar (92), and there are two wire openers (11).

4. The device for preventing tin balls from being generated in a PCB soldering process according to claim 1, wherein: The air suction hole (91) is arranged in a semicircular shape, and the lower end of the air suction hole (91) is flush with the electric board support (2).

5. The device for preventing tin balls from being generated in a PCB soldering process according to claim 1, wherein: The diameter of the air suction hole (91) is smaller than the length of the slide bar (82), and the size of the air suction hole (91) is adapted to the size of the left end portion of the telescopic block (86).

6. The device for preventing tin balls from being generated in a PCB soldering process according to claim 1, wherein: The needle (95) is arranged in a continuous pointed cone shape, and the sharp end of the needle (95) is against the surface of the tin bar (92).

7. The device for preventing tin balls from being generated in a PCB soldering process according to claim 1, wherein: The fan blade (96) rotates in a counterclockwise direction, and the fan blade (96) is located in the middle of the air suction hole (91).

8. The device for preventing tin balls from being generated in a PCB soldering process according to claim 1, wherein: One side of the tin bar (92) close to the bottom of the air suction hole (91) is recessed inward to form an empty groove, and the side surface of the tin bar (92) is located inside the empty groove.

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