Compressor assembly, air conditioner and control method

Abstract

The invention provides a compressor assembly, an air conditioner and a control method.The compressor assembly comprises a power device box body, a frequency converter box body and a semiconductor refrigeration part, and the semiconductor refrigeration part is arranged in the frequency converter box body so as to cool and dehumidify air in the frequency converter box body; a condensation flow channel is further arranged in the frequency converter box body, the condensation flow channel can receive condensate water generated by refrigeration on the semiconductor refrigeration component, and the condensation flow channel can further enter the power device box body to dissipate heat of components in the power device box body. According to the frequency converter, condensation in the frequency converter can be solved, meanwhile, auxiliary heat dissipation can be conducted on the power module, and the energy efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of compressors, and in particular to a compressor assembly, an air conditioner and a control method. Background Art

[0002] Commercial central air conditioners combine the whole system, compressor and frequency conversion controller to realize the refrigeration function of commercial central air conditioners. The development direction of commercial central air conditioners is moving towards miniaturization and intelligence. The integrated design of compressor and frequency converter has become a development direction. The frequency converter is integrated into the compressor body to reduce the space volume, reduce costs and improve assembly efficiency.

[0003] However, the integrated design inevitably leads to the inverter being sealed, with a relatively narrow internal space and severe heat generation of the power devices, causing the air temperature inside the inverter to be higher than that outside. Affected by the rainy season and weather changes, the humid and high-temperature air cannot be discharged in time, and condensation is prone to occur on the cold shell.

[0004] Condensation attached to components or electrical connection points will affect the insulation performance of the equipment and easily cause short circuits or grounding faults. Condensation will also accelerate the corrosion of metal structural parts of equipment in the cabinet, reduce equipment operation reliability and mechanical strength, and greatly reduce the insulation performance and life of electrical parts, causing electrical equipment creepage, flashover and tripping and other accidents.

[0005] At present, conventional inverters use a combination of a small evaporator and a water tray. The small evaporator needs to be filled with refrigerant. The refrigerant in the small evaporator needs to be taken from the compressor output refrigerant. The refrigerant flow path is complicated, and the water tray needs to be connected to the guide pipe for drainage. Therefore, it is difficult to control the layout of the pipeline space, which is not conducive to integrated design. It has the following problems: 1. It occupies a large space; 2. It requires an additional refrigerant flow path.

[0006] Moreover, when the whole machine is not powered on, the refrigerant in the small evaporator does not circulate. If condensation occurs on the inverter components at this time, it may easily lead to dangerous situations such as explosion of power components at the moment of power-on.

[0007] Since there are technical problems such as condensation inside the compressor inverter in the prior art, the present invention studies and designs a compressor assembly, an air conditioner and a control method. Summary of the invention

[0008] Therefore, the technical problem to be solved by the present invention is to overcome the defect of condensation inside the compressor inverter in the prior art, thereby providing a compressor assembly, an air conditioner and a control method.

[0009] In order to solve the above problems, the present invention provides a compressor assembly, which includes:

[0010] A power device case, an inverter case and a semiconductor refrigeration component, wherein the semiconductor refrigeration component is arranged inside the inverter case to cool and dehumidify the air inside the inverter case, and a condensation flow channel is also arranged inside the inverter case, and the condensation flow channel can receive condensed water generated by refrigeration on the semiconductor refrigeration component, and the condensation flow channel can also enter the power device case to dissipate heat from the components inside the power device case.

[0011] In some embodiments,

[0012] The semiconductor refrigeration component comprises a cold end and a hot end, wherein the cold end faces the inner space of the inverter housing, and the hot end is arranged on the inner wall of the inverter housing.

[0013] In some embodiments,

[0014] There are multiple semiconductor refrigeration components, and the multiple semiconductor refrigeration components are evenly spaced and arranged on the inner wall of the inverter case; and / or the semiconductor refrigeration components are integrally attached to the inner wall of the inverter case.

[0015] In some embodiments,

[0016] One end and at least a portion of the condensation flow channel are located inside the inverter case, and at least a portion of the condensation flow channel is opposite to or connected to the cold end of the semiconductor refrigeration component, so that condensed water generated by the cold end of the semiconductor refrigeration component can flow into the condensation flow channel. The other end of the condensation flow channel extends out of the inverter case and enters the power device case, so that the condensed water can be introduced into the interior of the power device case to dissipate heat and cool the power device.

[0017] In some embodiments,

[0018] The condensation flow channel includes a branch section and a gathering section. When there are multiple semiconductor refrigeration components, there are also multiple branch sections, and the branch sections are arranged one by one corresponding to the cold ends of the semiconductor refrigeration components, so that the condensed water generated by the cold ends of the semiconductor refrigeration components can flow into the branch sections. The lower ends of the multiple branch sections are connected and gathered to the gathering section, and the other end of the gathering section extends out of the inverter case and enters the power device case.

[0019] In some embodiments,

[0020] It also includes a compressor housing, the frequency converter housing is arranged on the outer wall and / or inner wall of the compressor housing, and the power device housing is arranged on the outer wall and / or inner wall of the compressor housing.

[0021] In some embodiments,

[0022] An IGBT power module, a heat sink and a condensation water flow channel are arranged inside the power device box. The IGBT power module is arranged on the heat sink. The condensation water flow channel is arranged on the heat sink and connected to the IGBT power module. The IGBT power module can be cooled by the condensed water in the condensation water flow channel and / or the air flowing through the heat sink. The condensation water flow channel is connected to the condensation flow channel.

[0023] In some embodiments,

[0024] It also includes a humidity sensor, a controller and a semiconductor drive circuit. The humidity sensor is arranged inside the inverter case and can detect the humidity inside the inverter case. When the humidity sensor detects that the humidity inside the inverter case is lower than a first threshold, the controller controls the semiconductor refrigeration component to not work through the semiconductor drive circuit. When the humidity sensor detects that the humidity inside the inverter case is higher than the first threshold, the controller controls the semiconductor refrigeration component to work through the semiconductor drive circuit to cool and dehumidify the inside of the inverter case.

[0025] In some embodiments,

[0026] It also includes a semiconductor heating system and a withstand voltage testing device. When the humidity sensor detects that the humidity inside the inverter case is higher than a first threshold and lower than a second threshold, the second threshold is greater than the first threshold, and the controller controls the semiconductor refrigeration component to work through the semiconductor drive circuit to cool and dehumidify the inside of the inverter case; when the humidity sensor detects that the humidity inside the inverter case is higher than the second threshold, the controller controls the semiconductor refrigeration component not to work through the semiconductor drive circuit, controls the compressor to stop, and starts the semiconductor heating system to heat the inside of the inverter case, and starts the withstand voltage testing device until the humidity sensor detects that the humidity inside the inverter case is lower than the first threshold.

[0027] The present invention also provides an air conditioner, which comprises the aforementioned compressor assembly.

[0028] The present invention also provides a control method for the compressor assembly as described above, comprising:

[0029] A detection step of detecting the humidity inside the inverter housing;

[0030] The control step includes controlling the semiconductor refrigeration component not to work when it is detected that the humidity inside the inverter case is lower than a first threshold value, and controlling the semiconductor refrigeration component to work when it is detected that the humidity inside the inverter case is higher than the first threshold value, so as to cool and dehumidify the inside of the inverter case.

[0031] In some embodiments,

[0032] When semiconductor heating system and pressure test device are also included:

[0033] The control step controls the semiconductor refrigeration component to operate to cool and dehumidify the interior of the inverter case when it is detected that the humidity inside the inverter case is higher than a first threshold and lower than a second threshold; controls the semiconductor refrigeration component not to operate, controls the compressor to stop, starts the semiconductor heating system to heat the interior of the inverter case, and starts the withstand voltage testing device until the humidity sensor detects that the humidity inside the inverter case is lower than the first threshold.

[0034] A compressor assembly, an air conditioner and a control method provided by the present invention have the following beneficial effects:

[0035] 1. The present invention uses the semiconductor refrigeration component arranged inside the inverter case to utilize the principle of semiconductor refrigeration to cool and dehumidify the inside of the inverter case, thereby effectively solving the problem of condensation on the internal components of the inverter causing potential safety hazards. Furthermore, through the arrangement of the condensation flow channel, the condensation water produced by dehumidification on the semiconductor refrigeration component can be discharged to further improve the efficiency of dehumidification inside the inverter case. Moreover, the condensation flow channel also enters the inside of the power device case, and can also dissipate heat and cool the power device, thereby improving the heat dissipation effect on the power module, etc. Therefore, the present invention can solve the problem of condensation inside the inverter while also assisting in the heat dissipation of the power module, thereby improving energy efficiency.

[0036] 2. The present invention can also control whether the semiconductor refrigeration component is cooling and whether to reduce the humidity inside the inverter case according to the humidity inside the inverter case through the setting of humidity sensors, controllers and semiconductor drive circuits, thereby improving the accuracy of humidity control; the present invention can further control the compressor to stop when the humidity is very high through the setting of semiconductor heating system and voltage resistance testing device, so as to avoid safety hazards caused by the operation of the compressor at this time, and control the semiconductor refrigeration component to be closed (its dehumidification capacity can no longer meet the requirements), turn on the semiconductor heating system, so as to heat the water and evaporate it, thereby improving the dehumidification effect, and realize the insulation and voltage resistance self-test function of the compressor inverter through the voltage resistance testing device, and can perform comprehensive and reliable tests on weak links to ensure that breakdown, flashover and other faults caused by condensation problems will not occur during power-on and operation, thereby improving the dehumidification effect and ensuring the safe and reliable operation of the compressor inverter. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a structural diagram of the integrated inverter compressor of the present invention (front view of the interior);

[0038] Figure 2 yes Figure 1 The internal structure diagram of the power device box;

[0039] Figure 3 It is an electrical connection structure diagram of the semiconductor refrigeration structure of the present invention;

[0040] Figure 4 It is a control logic flow chart of the semiconductor refrigeration system of the present invention.

[0041] The reference numerals are as follows:

[0042] 1. Power device housing; 2. Power junction box; 3. Compressor housing; 4. Inverter housing; 5. Condensation flow channel; 51. Branch section; 52. Collection section; 6. Semiconductor refrigeration component; 7. Humidity sensor; 8. IGBT power module; 9. Condensate flow channel; 10. Radiator; 11. Controller; 12. Semiconductor drive circuit. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0044] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0045] Unless otherwise specifically stated, the relative arrangement of the parts and steps described in these embodiments, numerical expressions and numerical values ​​do not limit the scope of the present invention. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, method and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, method and equipment should be regarded as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0046] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the devices or elements referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention. The directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0047] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0048] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention.

[0049] like Figure 1-4 As shown, the present invention provides a compressor assembly, which includes:

[0050] A power device case 1, an inverter case 4 and a semiconductor refrigeration component 6. The semiconductor refrigeration component 6 is arranged inside the inverter case 4 to cool and dehumidify the air inside the inverter case 4. A condensation flow channel 5 is also arranged inside the inverter case 4. The condensation flow channel 5 can receive condensed water generated by refrigeration on the semiconductor refrigeration component 6. The condensation flow channel 5 can also enter the power device case 1 to dissipate heat for the components inside the power device case 1.

[0051] The present invention uses the semiconductor refrigeration component set inside the inverter case to utilize the principle of semiconductor refrigeration to cool and dehumidify the interior of the inverter case, thereby effectively solving the problem of safety hazards caused by condensation on the internal components of the inverter. In addition, through the setting of the condensation flow channel, the condensation water produced by dehumidification on the semiconductor refrigeration component can be discharged to further improve the efficiency of dehumidification inside the inverter case. The condensation flow channel also enters the interior of the power device case, and can also dissipate heat and cool the power device, thereby improving the heat dissipation effect on the power module, etc. Therefore, the present invention can solve the problem of condensation inside the inverter while also assisting in the heat dissipation of the power module, thereby improving energy efficiency.

[0052] In some embodiments,

[0053] The semiconductor refrigeration component 6 includes a cold end and a hot end. The cold end faces the inner space of the inverter case 4 , and the hot end is attached to the inner wall of the inverter case 4 .

[0054] This is the preferred structural form and setting form of the semiconductor refrigeration component of the present invention, that is, the cold end faces the internal space of the inverter case, which can effectively cool and dehumidify the internal space of the inverter case, and the hot end is attached to the inner wall of the inverter case, which can dissipate the absorbed heat through the inverter case to the outside, thereby improving the dehumidification effect inside the inverter case.

[0055] In some embodiments,

[0056] There are multiple semiconductor refrigeration components 6, and the multiple semiconductor refrigeration components 6 are evenly spaced and arranged on the inner wall of the inverter case 4; and / or the semiconductor refrigeration components 6 are integrally attached to the inner wall of the inverter case 4.

[0057] The present invention uses multiple semiconductor refrigeration components that are spaced apart on the inner wall of the inverter case, which can further increase the heat exchange area inside the inverter case and improve the refrigeration and dehumidification effects; the semiconductor refrigeration components of the present invention can also be preferably attached to the inner wall of the inverter case as a whole, which can increase the heat exchange area and improve the refrigeration and dehumidification effects.

[0058] In some embodiments,

[0059] One end and at least a part of the condensation flow channel 5 are located inside the inverter case 4, and at least a part of the condensation flow channel 5 is opposite to or connected to the cold end of the semiconductor refrigeration component 6, so that the condensed water generated by the cold end of the semiconductor refrigeration component 6 can flow into the condensation flow channel 5, and the other end of the condensation flow channel 5 extends out of the inverter case 4 and enters the power device case 1, so that the condensed water can be introduced into the power device case 1 to dissipate heat and cool the power device.

[0060] This is the preferred structural form of the condensation flow channel of the present invention, that is, one end introduces condensed water from a position opposite to or connected to the cold end of the semiconductor refrigeration component and guides it into the power device housing, so as to utilize the condensed water generated by dehumidification inside the inverter housing to dissipate heat and cool the power device, thereby achieving the effect of assisting the heat dissipation of the power module while solving the condensation inside the inverter, thereby improving energy efficiency.

[0061] In some embodiments,

[0062] The condensation flow channel 5 includes a branch section 51 and a collection section 52. When there are multiple semiconductor refrigeration components 6, there are also multiple branch sections 51, and the branch sections 51 are arranged one by one corresponding to the cold ends of the semiconductor refrigeration components 6, so that the condensed water generated by the cold ends of the semiconductor refrigeration components 6 can flow into the branch sections 51. The lower ends of the multiple branch sections 51 are connected and collected to the collection section 52, and the other end of the collection section 52 extends out of the inverter case 4 and enters the power device case 1.

[0063] This is the preferred structural form of the condensation flow channel of the present invention, that is, it includes branch sections and aggregation sections. Multiple branch sections can be set one-to-one corresponding to multiple semiconductor refrigeration components, so as to cool and dehumidify the inverter box positions at multiple locations to improve the dehumidification effect, and the lower ends of the multiple branch sections are aggregated through the aggregation section, which can aggregate the condensed water collected by the multiple branch sections into one path and conduct it to the power device box, thereby improving the heat dissipation effect on the power device.

[0064] In some embodiments,

[0065] It also includes a compressor housing 3 , the frequency converter housing 4 is arranged on the outer wall and / or inner wall of the compressor housing 3 , and the power device housing 1 is arranged on the outer wall and / or inner wall of the compressor housing 3 .

[0066] The present invention uses a compressor casing, a compressor is arranged inside the compressor casing, an inverter casing is arranged preferably on the periphery of the compressor casing, and a power device casing is preferably arranged on the periphery of the compressor casing. The compressor casing, the inverter casing and the power device are effectively integrated into one, fully utilizing the space and making the structure more compact.

[0067] In some embodiments,

[0068] An IGBT power module 8, a radiator 10 and a condensation water flow channel 9 are arranged inside the power device box 1. The IGBT power module 8 is arranged on the radiator 10. The condensation water flow channel 9 is arranged on the radiator 10 and connected to the IGBT power module 8. The IGBT power module 8 can dissipate heat through the condensed water in the condensation water flow channel 9 and / or the air flowing through the radiator 10. The condensation water flow channel 9 is connected to the condensation flow channel 5.

[0069] The present invention preferably arranges an IGBT power module, which is a heat-generating component, inside the power device housing. By setting a radiator and a condensed water flow channel, the condensed water flow channel is connected with the condensation flow channel, and the condensed water generated by the dehumidification of the inverter housing can be effectively guided into the condensed water flow channel, thereby utilizing water cooling and air cooling to improve the heat dissipation effect of the IGBT power module, effectively utilizing the cooling capacity, and improving energy efficiency.

[0070] In some embodiments,

[0071] It also includes a humidity sensor 7, a controller 11 and a semiconductor drive circuit 12. The humidity sensor 7 is arranged inside the inverter case 4 and can detect the humidity inside the inverter case 4. When the humidity sensor 7 detects that the humidity inside the inverter case 4 is lower than a first threshold value, the controller 11 controls the semiconductor refrigeration component 6 not to work through the semiconductor drive circuit 12. When the humidity sensor 7 detects that the humidity inside the inverter case 4 is higher than the first threshold value, the controller 11 controls the semiconductor refrigeration component 6 to work through the semiconductor drive circuit 12 to cool and dehumidify the inside of the inverter case 4.

[0072] The present invention can also control whether the semiconductor refrigeration component is cooling and whether to reduce the humidity inside the inverter case according to the humidity inside the inverter case through the arrangement of a humidity sensor, a controller and a semiconductor drive circuit, thereby improving the accuracy of humidity control.

[0073] In some embodiments,

[0074] It also includes a semiconductor heating system and a withstand voltage test device. When the humidity sensor 7 detects that the humidity inside the inverter case 4 is higher than a first threshold and lower than a second threshold, the second threshold is greater than the first threshold, and the controller 11 controls the semiconductor refrigeration component 6 to work through the semiconductor drive circuit 12 to cool and dehumidify the inside of the inverter case 4; when the humidity sensor 7 detects that the humidity inside the inverter case 4 is higher than the second threshold, the controller 11 controls the semiconductor refrigeration component 6 not to work through the semiconductor drive circuit 12, controls the compressor to stop, and starts the semiconductor heating system to heat the inside of the inverter case 4, and starts the withstand voltage test device until the humidity sensor 7 detects that the humidity inside the inverter case 4 is lower than the first threshold.

[0075] The present invention further controls the compressor to stop when the humidity is very high through the arrangement of a semiconductor heating system and a withstand voltage test device, thereby avoiding safety hazards caused by the operation of the compressor at this time, and controls the semiconductor refrigeration component to be closed (its dehumidification capacity can no longer meet the requirements), and turns on the semiconductor heating system to heat the water to evaporate it, thereby improving the dehumidification effect. The withstand voltage test device can realize the insulation withstand voltage self-test function of the compressor inverter, and can perform comprehensive and reliable tests on weak links to ensure that breakdown, flashover and other faults due to condensation problems will not occur during the power-on and operation process, thereby improving the dehumidification effect while ensuring the safe and reliable operation of the compressor inverter.

[0076] 1. The anti-condensation device of the present invention does not occupy additional space inside the integrated compressor inverter, which is convenient for modification and maintenance. The present invention makes changes based on the original structure and designs the dehumidification equipment according to the shell characteristics: ① The semiconductor dehumidification device controller can be designed to be compatible with the compressor controller; ② The inner side of the shell is designed as follows Figure 1 The milling channel in the heat sink is connected to the radiator as a condensation channel to collect and discharge condensed water; ③ The heating side of the semiconductor refrigeration sheet is directly attached to the metal shell. Compared with the traditional semiconductor refrigeration device, the radiator is omitted and the box shell is directly used to dissipate the heat of the semiconductor to achieve a compatible design. The three-dimensional space is fully utilized, so there is no need to design a separate space for the dehumidification device.

[0077] 2. The present invention designs a condensed water recovery channel in the compressor housing, and the condensed water flows through the power module radiator, which can help complete the compensatory heat dissipation function.

[0078] 3. The dehumidification device is designed to be installed in the capacitor box at the top of the inverter. The semiconductor dehumidification device can be repaired and replaced by simply removing the upper box cover.

[0079] 4. In the initial stage of power-on, the insulation withstand voltage self-test function (not integrated on the compressor inverter) is started first, which can conduct comprehensive and reliable tests on weak links to ensure that breakdown, flashover and other faults caused by condensation problems will not occur during power-on and operation.

[0080] 1. The present invention can also change the flow path arrangement in the radiator to a multi-layer capillary structure, a coil structure, or a milling groove structure, etc.;

[0081] 2. The semiconductor refrigeration sheet of the present invention can be designed to be arranged in a single-stage or multi-stage series-parallel structure in the housing according to the selected specifications;

[0082] 3. The control circuit of the present invention can adopt a buck-boost drive circuit to change the direction and size of the circuit power supply;

[0083] 4. The anti-condensation solution of the present invention is mainly used in integrated compressors, and can also be simultaneously applied to other related fields such as variable frequency starting cabinets that require radiators.

[0084] The present invention also provides an air conditioner, which comprises the aforementioned compressor assembly.

[0085] The present invention also provides a control method for the compressor assembly as described above, comprising:

[0086] A detection step of detecting the humidity inside the inverter housing 4;

[0087] The control step is as follows: when it is detected that the humidity inside the inverter case 4 is lower than a first threshold value, the semiconductor refrigeration component 6 is controlled not to work; when it is detected that the humidity inside the inverter case 4 is higher than the first threshold value, the semiconductor refrigeration component 6 is controlled to work, so as to cool and dehumidify the inside of the inverter case 4.

[0088] The present invention can also control whether the semiconductor refrigeration component is cooling and whether to reduce the humidity inside the inverter case according to the humidity inside the inverter case through the above control means, thereby effectively improving the accuracy of humidity control.

[0089] In some embodiments,

[0090] When semiconductor heating system and pressure test device are also included:

[0091] The control step controls the semiconductor refrigeration component 6 to operate so as to cool and dehumidify the inside of the inverter case 4 when it is detected that the humidity inside the inverter case 4 is higher than the first threshold and lower than the second threshold; controls the semiconductor refrigeration component 6 not to operate, controls the compressor to stop, starts the semiconductor heating system to heat the inside of the inverter case 4, and starts the withstand voltage test device until the humidity sensor 7 detects that the humidity inside the inverter case 4 is lower than the first threshold.

[0092] The present invention further uses the above-mentioned control means to control the compressor to stop when the humidity is very high, thereby avoiding safety hazards caused by the operation of the compressor at this time, and controls the semiconductor refrigeration component to be closed (its dehumidification capacity can no longer meet the requirements), and turns on the semiconductor heating system, so as to use heating to evaporate water, thereby improving the dehumidification effect. The insulation and voltage resistance self-test function of the compressor inverter can be realized through the voltage resistance testing device, and comprehensive and reliable tests can be performed on weak links to ensure that breakdown, flashover and other faults due to condensation problems will not occur during the power-on and operation process. While improving the dehumidification effect, it also ensures the safe and reliable operation of the compressor inverter.

[0093] See also Figure 1 , 2 , 3, 4, the present invention provides a technical solution:

[0094] The present invention adopts at least one of waterproof slurry and SBS waterproof coiled material for the key power device box to isolate external moisture from entering the box. The high-voltage DC busbar and the copper busbar end of the inverter connected to the compressor are treated with epoxy resin paint to ensure that the key power device box is absolutely sealed.

[0095] The present invention involves the need to manually install power lines at the customer's address, so the diode rectifier and energy storage capacitor box cannot be completely isolated from the outside world. If the inverter is operated for a long time, the air temperature inside the inverter will be higher than the metal shell due to the heat generated by the power device, which will cause a large amount of condensation inside the energy storage capacitor box. In severe cases, condensation will accumulate and even soak the bottom of the capacitor.

[0096] With the development of semiconductor technology, the efficiency of semiconductor refrigeration chips has been continuously improved. At present, they are mainly used in semiconductor air conditioners and mobile phone radiators. Most of the heat dissipation methods use air cooling and water cooling. The present invention will give full play to the two unique functions of semiconductor refrigeration and heating. Based on the original integrated compressor inverter, an anti-condensation system and control method are designed. Semiconductor refrigeration chips are set on the side of the diode rectifier and energy storage capacitor box to realize the processing function for different situations and different condensation states. After the equipment starts to power on, the inverter controller starts, and the equipment starts the inverter withstand voltage test device to perform automatic insulation detection at power on to monitor whether each high-voltage copper bus is in a good insulation state to the ground. The detection process is as follows:

[0097] All components with filter elements must be disconnected, the line voltage sampling must be disconnected, the three-phase copper busbar at the rear end of the circuit breaker must be connected to the ground, and a power frequency voltage of 2.5kV / 50Hz must be applied for 1min. The withstand voltage test device must detect a leakage current of no more than 30mA;

[0098] All components with filtering elements must be disconnected, the line voltage sampling must be disconnected, the secondary circuit relay must be closed, the output three-phase terminals must be short-circuited, and the secondary circuit must be connected to apply an industrial frequency voltage of 2.5KV / 50Hz to the ground for 1 min. The withstand voltage test device must detect a leakage current no greater than 30mA.

[0099] If the test result is normal, the compressor control program cycle will be entered normally; if the test result is abnormal, the lock program will run and issue a warning to start the emergency stop device to disconnect the output circuit breaker and stop charging the inverter. The controller will then send a command to start the semiconductor heating system and the circulating fan, and perform a withstand voltage test every 5 minutes until the fault is eliminated.

[0100] A humidity sensor is provided inside the inverter housing (capacitor housing), and the sensor output signal is connected to the signal input end of the controller. The controller is configured with at least two humidity thresholds, including a first humidity threshold and a second humidity threshold. The first humidity threshold is less than the second humidity threshold. The controller starts and stops the operation of the semiconductor dehumidification device according to the first humidity threshold and controls the working power of the semiconductor dehumidification device according to the difference with the threshold. The controller starts and stops the operation state of the unit according to the second humidity threshold. The specific control strategy is as follows:

[0101] When the output signal of the humidity sensor is less than the first threshold, the semiconductor refrigeration and dehumidification device is controlled to stop running;

[0102] When the output signal of the humidity sensor is greater than the first threshold value and less than the second threshold value, the working power of the semiconductor dehumidification device is controlled according to the difference between the current humidity signal and the first threshold value, and the dehumidification speed of the semiconductor refrigeration and dehumidification device is dynamically adjusted by using a fuzzy control algorithm;

[0103] When the humidity sensor output signal is greater than the second threshold, the controller sends a command to stop the compressor and start the semiconductor heating system, and starts the withstand voltage test device at the same time, until the monitoring result is in a good insulation state and the humidity sensor output signal is lower than the first threshold (withstand voltage refers to high voltage resistance. To prevent users from being in extreme environments such as the seaside, condensation has already occurred inside the inverter before power-on, resulting in insufficient insulation performance. At this time, there is a risk of pipe explosion at the moment of power-on. Therefore, when the detection is not satisfied, the semiconductor heating is turned on to heat the air inside the inverter to dry the condensation that has been produced, thereby restoring the insulation performance, and at the same time heating the water vapor to evaporate outside the shell.).

[0104] like Figure 1 As shown in the figure, the condensed water generated by dehumidification inside the capacitor box shell is collected in the bottom flow channel, and injected into the condensed water flow channel in the radiator through the collection flow channel to assist in completing the heat dissipation function, and discharged from the entire machine through the bottom flow channel of the radiator to achieve the dehumidification function inside the machine body.

[0105] The present invention provides an integrated compressor inverter dehumidification and anti-condensation structure and method, which has the following beneficial effects:

[0106] The present invention uses a semiconductor refrigeration component anti-condensation device, which can avoid occupying extra space inside the integrated compressor inverter and facilitate maintenance. The present invention makes changes based on the original structure, designs a dehumidification device according to the shell characteristics, and the condensation flow channel can be connected to the radiator through the internal flow channel of the shell, making full use of the three-dimensional space; it solves the problem that the existing anti-condensation device (small evaporator) occupies too much surface area of ​​the integrated compressor body, resulting in limited high integration.

[0107] The present invention does not require additional refrigerant, saving external refrigerant flow paths. If a problem occurs, it is only necessary to disassemble the upper capacitor box cover of the integrated compressor inverter and replace the semiconductor dehumidification device. This solves the problem that the existing small evaporator that passes refrigerant is difficult to disassemble and assemble, and requires an additional refrigerant flow path. If a problem occurs, the entire evaporator needs to be repaired, and the replacement is complicated.

[0108] 1. The semiconductor dehumidification device of the present invention is evenly distributed on the side of the shell, which can achieve overall uniform dehumidification; it solves the problem that the existing small evaporator is usually installed in a biased position, the dehumidification effect on the entire internal space of the inverter is uneven, and the dehumidification effect cannot be enhanced for humidity sensitive devices.

[0109] 2. The present invention starts the insulation withstand voltage self-test function at the initial stage of power-on, and can perform the dehumidification function according to the humidity detection signal after operation, and can perform comprehensive and reliable tests on weak links to ensure that breakdown, flashover and other faults due to condensation will not occur during power-on and operation; it solves the problem that condensation is easily generated inside the box and on the capacitors and laminated busbars when the existing inverter is not used for a long time, and short circuits are easily caused by the presence of water droplets when powered on.

[0110] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention. The above description is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and variations can be made without departing from the technical principles of the present invention. These improvements and variations should also be regarded as the protection scope of the present invention.

Claims

1. A compressor assembly, characterized in that: include: A power device case (1), a frequency converter case (4) and a semiconductor refrigeration component (6), wherein the semiconductor refrigeration component (6) is arranged inside the frequency converter case (4) to cool and dehumidify the air inside the frequency converter case (4), and a condensation flow channel (5) is also arranged inside the frequency converter case (4), and the condensation flow channel (5) can receive condensed water generated by refrigeration on the semiconductor refrigeration component (6), and the condensation flow channel (5) can also enter the power device case (1) to dissipate heat from components inside the power device case (1).

2. The compressor assembly according to claim 1, characterized in that: The semiconductor refrigeration component (6) comprises a cold end and a hot end, the cold end faces the internal space of the inverter case (4), and the hot end is arranged on the inner wall of the inverter case (4).

3. The compressor assembly according to claim 1, characterized in that: There are a plurality of semiconductor refrigeration components (6), and the plurality of semiconductor refrigeration components (6) are evenly spaced and arranged on the inner wall of the inverter housing (4); and / or the semiconductor refrigeration components (6) are integrally attached to the inner wall of the inverter housing (4).

4. The compressor assembly according to any one of claims 1 to 3, characterized in that: One end and at least a portion of the condensation flow channel (5) are located inside the inverter housing (4); at least a portion of the condensation flow channel (5) is opposite to or connected to the cold end of the semiconductor refrigeration component (6), so that condensed water generated by the cold end of the semiconductor refrigeration component (6) can flow into the condensation flow channel (5); the other end of the condensation flow channel (5) extends out of the inverter housing (4) and enters the power device housing (1), so that the condensed water can be introduced into the interior of the power device housing (1) to dissipate heat and cool the power device.

5. The compressor assembly according to claim 4, characterized in that: The condensation flow channel (5) comprises a branch section (51) and a collection section (52). When there are multiple semiconductor refrigeration components (6), there are also multiple branch sections (51), and the branch sections (51) are arranged in a one-to-one correspondence with the cold ends of the semiconductor refrigeration components (6) so that condensed water generated by the cold ends of the semiconductor refrigeration components (6) can flow into the branch sections (51). The lower ends of the multiple branch sections (51) are connected and collected in the collection section (52), and the other end of the collection section (52) extends out of the inverter housing (4) and enters the power device housing (1).

6. The compressor assembly according to claim 1, characterized in that: It also comprises a compressor housing (3), the frequency converter housing (4) being arranged on the outer wall and / or the inner wall of the compressor housing (3), and the power device housing (1) being arranged on the outer wall and / or the inner wall of the compressor housing (3).

7. The compressor assembly according to claim 1, characterized in that: An IGBT power module (8), a heat sink (10) and a condensed water flow channel (9) are arranged inside the power device housing (1); the IGBT power module (8) is arranged on the heat sink (10); the condensed water flow channel (9) is arranged on the heat sink (10) and is connected to the IGBT power module (8); the IGBT power module (8) can be cooled by condensed water in the condensed water flow channel (9) and / or air flowing through the heat sink (10); and the condensed water flow channel (9) is connected to the condensation flow channel (5).

8. The compressor assembly according to any one of claims 1 to 7, characterized in that: It also includes a humidity sensor (7), a controller (11) and a semiconductor drive circuit (12). The humidity sensor (7) is arranged inside the inverter case (4) and can detect the humidity inside the inverter case (4). When the humidity sensor (7) detects that the humidity inside the inverter case (4) is lower than a first threshold value, the controller (11) controls the semiconductor refrigeration component (6) to not work through the semiconductor drive circuit (12). When the humidity sensor (7) detects that the humidity inside the inverter case (4) is higher than the first threshold value, the controller (11) controls the semiconductor refrigeration component (6) to work through the semiconductor drive circuit (12) to cool and dehumidify the inside of the inverter case (4).

9. The compressor assembly according to claim 8, characterized in that: It also includes a semiconductor heating system and a withstand voltage test device. When the humidity sensor (7) detects that the humidity inside the inverter case (4) is higher than a first threshold and lower than a second threshold, and the second threshold is greater than the first threshold, the controller (11) controls the semiconductor refrigeration component (6) to work through the semiconductor drive circuit (12) to cool and dehumidify the inside of the inverter case (4); when the humidity sensor (7) detects that the humidity inside the inverter case (4) is higher than the second threshold, the controller (11) controls the semiconductor refrigeration component (6) to stop working through the semiconductor drive circuit (12), controls the compressor to stop, starts the semiconductor heating system to heat the inside of the inverter case (4), and starts the withstand voltage test device until the humidity sensor (7) detects that the humidity inside the inverter case (4) is lower than the first threshold.

10. An air conditioner, characterized in that: A compressor assembly comprising the compressor assembly of any one of claims 1-9.

11. A method for controlling a compressor assembly according to any one of claims 8 to 9, characterized in that: include: A detection step, detecting the humidity inside the inverter housing (4); A control step, when it is detected that the humidity inside the inverter case (4) is lower than a first threshold value, the semiconductor refrigeration component (6) is controlled not to work; when it is detected that the humidity inside the inverter case (4) is higher than the first threshold value, the semiconductor refrigeration component (6) is controlled to work, so as to cool and dehumidify the inside of the inverter case (4).

12. The control method of the compressor assembly according to claim 11, characterized in that: When semiconductor heating system and pressure test device are also included: The control step controls the semiconductor refrigeration component (6) to operate so as to cool and dehumidify the interior of the inverter housing (4) when it is detected that the humidity inside the inverter housing (4) is higher than a first threshold value and lower than a second threshold value; and controls the semiconductor refrigeration component (6) not to operate, controls the compressor to stop, starts the semiconductor heating system to heat the interior of the inverter housing (4), and starts the withstand voltage test device until the humidity sensor (7) detects that the humidity inside the inverter housing (4) is lower than the first threshold value.

Images