A dehumidification device for switch cabinets

Abstract

This utility model discloses a dehumidification device for a switch cabinet, comprising a housing and a semiconductor dehumidification component disposed within the housing. The housing has at least one air inlet area and at least one air outlet area. The semiconductor dehumidification component includes a semiconductor cooling chip, a cooling element, a heat sink, an air duct cover, and a fan. The cooling element and the heat sink are respectively installed at the cold end and hot end of the semiconductor cooling chip. The air duct cover is connected to the semiconductor cooling chip and separates the cooling element and the heat sink. An air outlet chamber covering the heat sink is formed inside the air duct cover. The air outlet chamber has an air inlet and at least one air outlet. Each air outlet of the air outlet chamber is respectively connected to each air outlet area of ​​the housing. An air inlet chamber communicating with the air inlet area of ​​the housing is formed between the air duct cover and the housing. The air inlet of the air outlet chamber is connected to the air inlet chamber. The cooling element is located in the air inlet chamber. The fan is connected to the air duct cover and is used to drive the air in the air inlet chamber into the air outlet chamber through the air inlet of the air outlet chamber. This utility model has the advantage of high dehumidification efficiency.

Description

Technical Field

[0001] This utility model relates to the field of switch cabinets, and in particular to a dehumidification device for switch cabinets. Background Technology

[0002] As a crucial component of the power system, the insulation capacity of switchgear is a critical factor determining its safe operation. A major cause of insulation failures in switchgear is moisture inside the cabinet; therefore, dehumidification devices are typically installed inside switchgear to prevent moisture buildup.

[0003] Existing dehumidification devices for switchgear typically employ semiconductor dehumidifiers. In these devices, the cooling and heat dissipation components are mounted on the cold and hot ends of the semiconductor cooling chip, respectively. Air inside the switchgear is blown from the outside towards the cooling components by a fan. Due to the low surface temperature of the cooling components, moisture in the air condenses into small water droplets that fall into a water tank below. The dry, cool air then passes through the heat dissipation components and is exhausted. This process repeats, completing the dehumidification of the air inside the switchgear. However, this semiconductor dehumidifier has the following problems:

[0004] The air passing through the cooling component (hereinafter referred to as cold end air) and the air passing through the heat dissipation component (hereinafter referred to as hot end air, the temperature of the hot end air is higher than the temperature of the cold end air) will swirl inside the semiconductor dehumidifier, causing the cold end air and the hot end air to interfere with each other, resulting in the temperature of the cold end air rising, affecting the condensation effect of the moisture in the cold end air, and causing the dehumidification efficiency to be relatively low.

[0005] In view of the above problems, it is necessary to study a dehumidification device for switch cabinets, which has the advantage of high dehumidification efficiency. Utility Model Content

[0006] The purpose of this utility model is to provide a dehumidification device for switch cabinets, which has the advantage of high dehumidification efficiency.

[0007] To achieve the above objectives, the solution of this utility model is:

[0008] A dehumidification device for a switch cabinet includes a housing and a semiconductor dehumidification component disposed within the housing. The housing has at least one air inlet area and at least one air outlet area. The semiconductor dehumidification component includes a semiconductor cooling chip, a cooling element, a heat sink, an air duct cover, and a fan. The cooling element and the heat sink are respectively installed at the cold end and hot end of the semiconductor cooling chip. The air duct cover is connected to the semiconductor cooling chip and separates the cooling element and the heat sink. An air outlet chamber covering the heat sink is formed inside the air duct cover. The air outlet chamber has an air inlet and at least one air outlet. Each air outlet of the air outlet chamber is respectively connected to each air outlet area of ​​the housing. An air inlet chamber communicating with the air inlet area of ​​the housing is formed between the air duct cover and the housing. The air inlet of the air outlet chamber is connected to the air inlet chamber. The cooling element is located in the air inlet chamber. The fan is connected to the air duct cover and is used to drive the air in the air inlet chamber into the air outlet chamber from the air inlet of the air outlet chamber.

[0009] The cooling and heat dissipation components are in surface contact with the cold and hot ends of the semiconductor cooling chip, respectively.

[0010] The cooling component has multiple cooling fins, and the heat dissipation component has multiple heat dissipation fins.

[0011] The cooling component is positioned opposite an air inlet area of ​​the outer casing.

[0012] The outer casing has two opposing air intake areas. The cooling component is positioned opposite one of the air intake areas of the outer casing, and the air inlet of the air outlet chamber is positioned opposite the other air intake area of ​​the outer casing.

[0013] The air intake chamber is surrounded by an air duct cover.

[0014] The fan is located in the air inlet of the air outlet chamber.

[0015] The outer shell has two opposing air outlet areas, and the air outlet cavity has two opposing air outlets, with the two air outlets of the air outlet cavity respectively connected to the two air outlet areas of the outer shell.

[0016] The dehumidification device for the switch cabinet also includes a water collection tank, which is installed in the outer casing and positioned below the refrigeration unit.

[0017] The water collection tank has a drain outlet that extends out of the outer casing.

[0018] With the above solution, the dehumidification device for a switch cabinet of this utility model is installed inside the switch cabinet during use. When this utility model is working, the semiconductor refrigeration chip operates, causing the temperature of the cooling component to decrease and the temperature of the heat sink to increase. The fan operates, causing air in the switch cabinet to enter the air intake chamber from the air intake area of ​​the outer shell. The air entering the air intake chamber passes through the cooling component and the fan before entering the air outlet chamber. The air entering the air outlet chamber passes through the heat sink and is then directly output to the switch cabinet from the air outlet area of ​​the outer shell. When the air passes through the cooling component, the cooling component can condense the moisture in the air, thus dehumidifying the air. When the air passes through the heat sink, the air can carry away the heat from the heat sink (i.e., reduce the temperature difference between the cold and hot ends of the semiconductor refrigeration chip), making the cooling effect of the cold end of the semiconductor refrigeration chip better. Because the duct cover separates the cooling component and the heat dissipation component, and the interior of the duct cover forms an air outlet chamber that covers the heat dissipation component, and the duct cover and the outer shell form an air inlet chamber that communicates with the air inlet area of ​​the outer shell, the air inlet of the air outlet chamber communicates with the air inlet chamber, and each air outlet of the air outlet chamber is connected to each air outlet area of ​​the outer shell, with the cooling component located in the air inlet chamber; this arrangement ensures that when the present invention is working, the air flows unidirectionally through the air inlet area, air inlet chamber, air outlet chamber, and air outlet area. In this way, the air passing through the cooling component (hereinafter referred to as cold end air) and the air passing through the heat dissipation component (hereinafter referred to as hot end air, the temperature of the hot end air is higher than the temperature of the cold end air) will not interfere with each other, thus avoiding mutual interference between the cold end air and the hot end air and affecting the dehumidification efficiency, resulting in high dehumidification efficiency of the present invention. Attached Figure Description

[0019] Figure 1 This is an exploded view of the structure of this utility model.

[0020] Figure 2 This is a schematic diagram of the air circulation path of this utility model. Figure 1 .

[0021] Figure 3 This is a schematic diagram of the air circulation path of this utility model. Figure 2 .

[0022] Figure 4 This is a schematic diagram of the air circulation path of this utility model. Figure 3 .

[0023] Figure 5 This is a schematic diagram of the structure of the semiconductor dehumidification component of this utility model. Figure 1 .

[0024] Figure 6 This is a schematic diagram of the structure of the semiconductor dehumidification component of this utility model. Figure 2 .

[0025] Label Explanation:

[0026] Outer casing 1, front cover 11, rear cover 12, electrical cavity 100, air intake area 101, air exhaust area 102.

[0027] Semiconductor dehumidification component 2, air inlet chamber 20,

[0028] Semiconductor cooling chip 21, cooling component 22, cooling fins 221, heat sink 23, heat sink fins 231, air duct cover 24, air outlet 241, air inlet 2411, air outlet 2412, fan 25.

[0029] Control component 3,

[0030] Water collection tank 4, drain outlet 41. Detailed Implementation

[0031] To further explain the technical solution of this utility model, the following detailed description is provided through specific embodiments.

[0032] like Figures 1 to 6 As shown, this utility model discloses a dehumidification device for a switch cabinet, which includes a housing 1 and a semiconductor dehumidification component 2 disposed in the housing 1; wherein, the housing 1 is provided with at least one air inlet area 101 and at least one air outlet area 102; the semiconductor dehumidification component 2 includes a semiconductor cooling chip 21, a cooling element 22, a heat sink 23, an air duct cover 24, and a fan 25, wherein the cooling element 22 and the heat sink 23 are respectively installed at the cold end and the hot end of the semiconductor cooling chip 21, the air duct cover 24 is connected to the semiconductor cooling chip 21 and separates the cooling element 22 and the heat sink 23, and a venting structure is formed inside the air duct cover 24. The heat-generating element 23 has an air outlet 241, which has an air inlet 2411 and at least one air outlet 2412. Each air outlet 2412 of the air outlet 241 is connected to each air outlet area 102 of the outer casing 1. The air duct cover 24 and the outer casing 1 form an air inlet 20 that communicates with the air inlet area 101 of the outer casing 1. The air inlet 2411 of the air outlet 241 communicates with the air inlet 20. The cooling element 22 is located in the air inlet 20. The fan 25 is connected to the air duct cover 24 and is used to drive the air in the air inlet 20 into the interior of the air outlet 241 from the air inlet 2411 of the air outlet 241.

[0033] The dehumidification device for a switch cabinet according to this invention is installed inside the switch cabinet during use. When the device is in operation, the semiconductor cooling chip 21 operates, causing the temperature of the cooling element 22 to decrease and the temperature of the heat sink 23 to increase. The fan 25 operates, causing air from the switch cabinet to enter the air intake chamber 20 from the air intake area 101 of the outer casing 1. The air entering the air intake chamber 20 passes through the cooling element 22 and the fan 25 before entering the air outlet chamber 241. The air entering the air outlet chamber 241 then passes through the heat sink 23 and is directly output to the switch cabinet from the air outlet area 102 of the outer casing 1. When the air passes through the cooling element 22, the cooling element 22 condenses the moisture in the air, thus dehumidifying it. When the air passes through the heat sink 23, the air carries away the heat from the heat sink 23 (i.e., reducing the temperature difference between the cold and hot ends of the semiconductor cooling chip 21), resulting in better cooling performance at the cold end of the semiconductor cooling chip 21. Because the air duct cover 24 separates the cooling component 22 and the heat dissipation component 23, and an air outlet chamber 241 covering the heat dissipation component 23 is formed inside the air duct cover 24, an air inlet chamber 20 communicating with the air inlet area 101 of the outer shell 1 is formed between the air duct cover 24 and the outer shell 1. The air inlet 2411 of the air outlet chamber 241 communicates with the air inlet chamber 20, and each air outlet 2412 of the air outlet chamber 241 is respectively connected to each air outlet area 102 of the outer shell 1. The cooling component 22 is located in the air inlet chamber 20; such as This design ensures that during operation, air flows unidirectionally through the air inlet zone 101, air inlet chamber 20, air outlet chamber 241, and air outlet zone 102. This prevents the air passing through the cooling component 22 (hereinafter referred to as cold-end air) and the air passing through the heat dissipation component 23 (hereinafter referred to as hot-end air, the temperature of which is higher than that of cold-end air) from interfering with each other. This avoids mutual interference between cold-end air and hot-end air, which would affect the dehumidification efficiency, resulting in high dehumidification efficiency of this invention.

[0034] In an embodiment of the present invention, the outer shell 1 has an air inlet area 101, and the cooling component 22 is disposed opposite to the air inlet area 101 of the outer shell 1 so that the cooling component 22 can quickly cool the air entering from the air inlet area 101, while the air inlet 2411 of the air outlet chamber 241 can be disposed opposite to the cooling component 22.

[0035] In an embodiment of this utility model, the outer shell 1 has two opposing air outlet areas 102, and the air outlet cavity 241 has two opposing air outlets 2412. The two air outlets 2412 of the air outlet cavity 241 are respectively connected to the two air outlet areas 102 of the outer shell 1. This arrangement can effectively improve the air flow rate of this utility model.

[0036] In an embodiment of this utility model, an electrical cavity 100 can be formed inside the outer shell 1, and a control component 3 is installed in the electrical cavity 100. The control component 3 is used to control the operation of the semiconductor cooling chip 21 and the fan 25. The control component 3 can periodically control the semiconductor cooling chip 21 to work in reverse (so that the cooling component 22 heats up) in order to defrost the cooling component 22.

[0037] In this embodiment of the invention, the air intake cavity 20 formed between the duct cover 24 and the outer shell 1 is arranged around the duct cover 24. This arrangement allows air passing through the cooling component 22 to quickly flow into the exhaust cavity 241 when the fan 25 is working. The fan 25 is located in the air inlet 2411 of the exhaust cavity 241, ensuring that the fan 25 can reliably drive the air in the air intake cavity 20 into the exhaust cavity 241 through the air inlet 2411. The duct cover 24 can be made of heat-insulating plastic material.

[0038] In embodiments of this invention, the cooling element 22 and the heat sink 23 are in surface contact with the cold and hot ends of the semiconductor cooling chip 21, respectively. This results in good heat conduction between the cooling element 22 and the cold end of the semiconductor cooling chip, and good heat conduction between the heat sink 23 and the hot end of the semiconductor cooling chip. Furthermore, the cooling element 22 has multiple cooling fins 221, resulting in a large contact area between the cooling element 22 and the air; similarly, the heat sink 23 has multiple heat dissipation fins 231, resulting in a large contact area between the heat sink 23 and the air.

[0039] In an embodiment of this utility model, the dehumidification device for a switch cabinet may further include a water collection tank 4. The water collection tank 4 is installed in the outer casing 1 and located below the refrigeration component 22. The water collection tank 4 is used to collect condensate formed by the condensation of moisture in the air. The water collection tank 4 may have a drain outlet 41 extending out of the outer casing 1 to drain the condensate in the water collection tank 4. The drain outlet 41 may be located at the bottom of the water collection tank 4.

[0040] In an embodiment of this utility model, the outer casing 1 may include a front cover 11 and a rear cover 12 connected together, which facilitates the installation of the semiconductor dehumidification component 2, the control component 3 and the water collection tank 4; the air inlet area 101 of the outer casing 1 may have multiple holes, and the air outlet area 102 of the outer casing 1 may have multiple holes.

[0041] The above embodiments and figures are not intended to limit the product form and style of this utility model. Any appropriate changes or modifications made by those skilled in the art should be considered as not departing from the patent scope of this utility model.

Claims

1. A dehumidifying device of a switchgear, characterized by: Includes a housing and a semiconductor dehumidification component disposed within the housing; The casing is provided with at least one air inlet area and at least one air outlet area; The semiconductor dehumidification assembly includes a semiconductor cooling chip, a cooling element, a heat sink, an air duct cover, and a fan. The cooling element and the heat sink are respectively installed at the cold end and hot end of the semiconductor cooling chip. The air duct cover is connected to the semiconductor cooling chip and separates the cooling element and the heat sink. An air outlet chamber covering the heat sink is formed inside the air duct cover. The air outlet chamber has an air inlet and at least one air outlet. Each air outlet of the air outlet chamber is connected to each air outlet area of ​​the outer shell. An air inlet chamber communicating with the air inlet area of ​​the outer shell is formed between the air duct cover and the outer shell. The air inlet of the air outlet chamber is connected to the air inlet chamber. The cooling element is located in the air inlet chamber. The fan is connected to the air duct cover and is used to drive the air in the air inlet chamber into the air outlet chamber from the air inlet of the air outlet chamber.

2. The dehumidifying apparatus of a switchgear according to claim 1, characterized by: The cooling and heat dissipation components are in surface contact with the cold and hot ends of the semiconductor cooling chip, respectively.

3. The dehumidifying apparatus of a switchgear according to claim 1, characterized by: The cooling component has multiple cooling fins, and the heat dissipation component has multiple heat dissipation fins.

4. The dehumidification device for a switchgear as described in claim 1, characterized in that: The cooling component is positioned opposite an air inlet area of ​​the outer casing.

5. The dehumidification device for a switchgear as described in claim 4, characterized in that: The air inlet of the air outlet chamber is located opposite to the cooling component.

6. A dehumidification device for a switchgear as described in claim 1, 4, or 5, characterized in that: The air intake chamber is surrounded by an air duct cover.

7. The dehumidification device for a switchgear as described in claim 1, characterized in that: The fan is located in the air inlet of the air outlet chamber.

8. The dehumidification device for a switchgear as described in claim 1, characterized in that: The outer shell has two opposing air outlet areas, and the air outlet cavity has two opposing air outlets, with the two air outlets of the air outlet cavity respectively connected to the two air outlet areas of the outer shell.

9. The dehumidification device for a switchgear as described in claim 1, characterized in that: It also includes a water collection tank, which is installed in the housing and located below the refrigeration unit.

10. The dehumidification device for a switchgear as described in claim 9, characterized in that: The water collection tank has a drain outlet that extends out of the outer casing.

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