Carrying device for wafer detection by immersion ultrasonic scanning microscope

Abstract

This application relates to the technical field of semiconductor detection, and in particular to a loading device for water immersion ultrasonic scanning microscope wafer detection, which includes a loading table. An adsorption flow channel is opened on the loading table, a negative pressure flow channel is provided in the loading table, a negative pressure hole communicating with the adsorption flow channel is opened on the loading table, a receiving groove is opened on the loading table, and a plurality of support platforms for supporting the wafer are vertically fixed at the bottom of the receiving groove. An adsorption flow channel is formed between the side wall of the support platform and the receiving groove. A soft annular sealing ring is provided in the outer ring channel, and the thickness of the sealing ring is not less than the height of the support platform. A plurality of variable-diameter claws located in the outer ring channel are evenly arranged circumferentially on the loading table. The variable-diameter claws are slidably connected to the outer ring channel along the radial direction of the receiving groove, and the variable-diameter claws are connected to the sealing ring. Due to the sealing of the sealing ring, the residual detection liquid between the upper surface of the support platform and the wafer is small, and the adsorption force between the two is small. When the wafer is removed, it is not easy to break, thereby reducing the breakage rate of the wafer.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor detection, and particularly to a loading device for wafer detection by an immersion ultrasonic scanning microscope. Background Art

[0002] An ultrasonic scanning microscope is a non-destructive testing device that uses a propagation medium. During operation, it uses scanning methods such as reflection or transmission to inspect defects such as delamination, voids, and cracks inside components, materials, wafers, etc. When in use, the wafer is placed in a detection liquid, and the wafer is detected by an ultrasonic probe.

[0003] The wafer itself is generally thin. To ensure stability during detection, the wafer is usually adsorbed and fixed by a negative pressure adsorption method. For related technologies, reference can be made to the Chinese patent with the publication number CN116399957A, which discloses an immersion ultrasonic scanning microscope sample transfer device and control method, including: a wafer stage, a trolley, a guide rail, a guide rail bracket, a push-pull drive mechanism, a liquid tank, and a bottom plate. Among them, a vacuum chuck and a vacuum air path system are provided on the wafer stage, and the vacuum chuck is used to suck the wafer.

[0004] Normally, in a gas environment, the wafer can be picked up and placed by the chuck through vacuum pumping and vacuum release. However, in the operating environment of an ultrasonic scanning microscope, the wafer is immersed in a liquid. There will be a gap between the wafer and the carrier stage, and the detection liquid will seep between the wafer and the carrier stage. When the wafer is negatively pressure adsorbed on the carrier stage, the detection liquid between the two is also clamped between the two.

[0005] When the detection is completed and the vacuum is released, the air path on the carrier stage will be pressurized to balance with the external air pressure. However, the detection liquid itself between the carrier stage and the wafer will have a certain surface tension and still adsorb the two together. At this time, if the wafer is forcibly removed, the surface tension of the detection liquid is likely to damage the wafer, resulting in wafer breakage. Summary of the Invention

[0006] In order to reduce the risk of wafer breakage, this application provides a loading device for wafer detection by an immersion ultrasonic scanning microscope.

[0007] The loading device for wafer detection by an immersion ultrasonic scanning microscope provided by this application adopts the following technical solutions:

[0008] A water immersion ultrasonic scanning microscope wafer detection carrier device, including a liftable carrier table, an adsorption channel is opened on the carrier table, a negative pressure channel is arranged in the carrier table, a negative pressure hole communicating with the adsorption channel is opened on the carrier table, the negative pressure hole is communicated with the negative pressure channel, a receiving groove for accommodating the wafer is opened on the carrier table, a plurality of support platforms for supporting the wafer are vertically fixed at the bottom of the receiving groove, an adsorption channel is formed between the side wall of the support platform and the receiving groove, the adsorption channel includes an outer ring channel with a diameter larger than the diameter of the wafer, a soft annular sealing ring is arranged in the outer ring channel, the thickness of the sealing ring is not less than the height of the support platform, a plurality of variable diameter claws located in the outer ring channel are evenly arranged circumferentially on the carrier table, the variable diameter claws are slidably connected to the outer ring channel along the radial direction of the receiving groove, and the variable diameter claws are connected to the sealing ring.

[0009] By adopting the above technical solutions, the wafer is placed in the receiving groove of the carrier table, the wafer contacts the upper surface of the support platform, the support platform supports the wafer, and the adsorption channel is located below the wafer. Moreover, the sealing ring serves as the outer wall of the outer ring channel, the edge of the wafer presses on the upper surface of the sealing ring, and the sealing ring seals and isolates the adsorption channel to prevent external detection liquid from flowing into the channel, thereby ensuring the dryness in the adsorption channel. Negative pressure suction is generated in the negative pressure channel, the adsorption channel is communicated with the negative pressure channel through the negative pressure hole, and the wafer is adsorbed to fix the wafer. After the detection is completed, the carrier table rises out of the detection liquid, the variable diameter claws contract to pull the sealing ring, increasing the diameter of the sealing ring until the sealing ring is separated from the wafer. At this time, the outer ring channel is opened, and the outer ring channel contacts the external air, thereby balancing the air pressure on both sides of the wafer and facilitating the removal of the wafer. And due to the sealing of the sealing ring, the residual detection liquid between the upper surface of the support platform and the wafer is small, and the adsorption force between the two is small, so the wafer is not easily broken when removed, thereby reducing the breakage rate of the wafer. Even if the detection liquid accumulates, most of it accumulates between the sealing ring and the wafer. When the variable diameter claws pull the sealing ring, the sealing ring and the wafer slide radially, and no vertical destructive force is generated on the wafer, thereby further protecting the wafer and reducing the breakage rate.

[0010] Preferably, the variable diameter claw includes a variable diameter rod penetrating through the side wall of the receiving groove and slidably connected to the side wall of the receiving groove, and a connecting claw piece fixed at the end of the variable diameter rod and perpendicularly connected to the end of the variable diameter rod, and the connecting claw piece is fixed in the sealing ring.

[0011] By adopting the above technical solutions, the connecting claw piece is buried in the sealing ring to enhance the structural strength of the sealing ring, and also ensures the deformation effect of the sealing ring when the connecting claw piece pulls the sealing ring.

[0012] Preferably, at least two annular waterproof convex platforms are arranged on the upper surface of the sealing ring, and a water return groove is formed between the waterproof convex platforms.

[0013] By adopting the above technical solution, the multi-channel waterproof convex platform enhances the waterproof effect on the detection liquid. When the detection liquid penetrates through one waterproof convex platform, the water return groove will also temporarily store the detection liquid, reducing its subsequent leakage volume.

[0014] Preferably, the connecting claw pieces correspond to the water return grooves one by one. A plurality of water return holes corresponding to the connecting claw pieces one by one are opened at the bottom of the water return groove. A water return channel facing the water return hole is opened in the connecting claw piece. The reducing rod is hollow and communicated with the water return channel.

[0015] By adopting the above technical solution, negative pressure suction is generated in the reducing rod and communicated with the water return groove through the connecting claw piece, so as to suck out the detection liquid in the water return groove, further reducing the leakage of the detection liquid. Moreover, the negative pressure suction generated in the water return groove can also enhance the adsorption stability of the wafer and ensure the detection effect.

[0016] Preferably, a connecting head is rotatably connected to one end of the reducing rod facing the connecting claw piece, and the connecting head is connected to the connecting claw piece by a thread.

[0017] By adopting the above technical solution, the reducing rod is detachably connected to the sealing ring in a threaded form, which is convenient for the replacement and maintenance of the sealing ring.

[0018] Preferably, the end of the reducing rod away from the connecting claw piece is communicated with the negative pressure flow channel through a soft air pipe.

[0019] By adopting the above technical solution, while negative pressure suction is generated in the negative pressure flow channel to adsorb the wafer, negative pressure suction is generated in the reducing rod to suck out the detection liquid in the water return groove. After the detection is completed, negative pressure suction is no longer generated in the negative pressure flow channel, and the reducing rod no longer needs to continue sucking out the detection liquid. The two operate synchronously without the need to additionally increase an air channel for control, which is convenient to use.

[0020] Preferably, a control disk is rotatably connected in the bearing platform. A spiral groove is provided on the upper surface of the control disk. A block fixed to the reducing rod is threadedly connected to the spiral card slot. A control motor for driving the control disk to rotate is provided in the bearing platform.

[0021] By adopting the above technical solution, when the control motor is started, the control disk rotates and drives the reducing rod to linearly slide through the block. One control motor can simultaneously control all the reducing rods to linearly move synchronously, which is convenient to use.

[0022] Preferably, a plurality of concave drainage grooves are provided on the upper surface of the support platform, and the bottom of the drainage groove is inclined.

[0023] By adopting the above technical solution, when the detection liquid leaks into the adsorption flow channel and is located between the support platform and the wafer, the detection liquid remains in the drainage groove and will flow out from the drainage groove. The contact area between the support platform and the wafer is small, thereby reducing the adsorption force between the detection liquid and the wafer and facilitating the picking of the wafer.

[0024] In summary, the present application includes the following beneficial technical effects:

[0025] Through the setting of the sealing ring, the adsorption flow channel is in a relatively sealed state. The residual detection liquid between the upper surface of the support platform and the wafer is small, and the adsorption force between the two is small. When the wafer is removed, it is not easy to break, thereby reducing the breakage rate of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a schematic diagram of the overall structure of the embodiment;

[0027] Figure 2 is a schematic diagram of the structure of the carrier table in the embodiment;

[0028] Figure 3 is a schematic diagram of the internal structure of the carrier table in the embodiment.

[0029] DESCRIPTION OF THE REFERENCE NUMERALS:

[0030] 1. Carrier table; 11. Negative pressure flow channel; 12. Negative pressure hole; 2. Adsorption flow channel; 21. Outer ring channel; 22. Inner channel; 3. Accommodation groove; 4. Support platform; 41. Drainage groove; 5. Sealing ring; 51. Waterproof boss; 52. Water return groove; 53. Water return hole; 6. Reducing claw; 61. Reducing rod; 62. Connecting claw piece; 621. Water return channel; 63. Air pipe; 71. Control panel; 72. Clamping block; 73. Control motor; 74. Control gear; 8. Detection groove; 9. Lifting platform. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0031] The following further describes the present application in detail with reference to all the drawings. Embodiment

[0032] The embodiment of the present application discloses a carrier device for wafer detection of an immersion ultrasonic scanning microscope. Referring to Figures 1 to 2 , it includes a detection groove 8. An lifting platform 9 is arranged in the detection groove 8, and a carrier table 1 for loading a wafer is fixed on the lifting platform 9. Detection liquid is filled in the detection groove 8. After the wafer is placed on the carrier table 1, the lifting platform 9 drives the carrier table 1 to descend until the wafer is submerged in the detection liquid for detection. After the detection is completed, the lifting platform 9 drives the carrier table 1 to rise until it jumps out of the liquid surface of the detection liquid, and the detected wafer is removed or replaced.

[0033] Referring to Figures 2 to 3, a circular receiving groove 3 is formed on the upper surface of the carrier 1, and the diameter of the receiving groove 3 is larger than the diameter of the wafer. The wafer is placed in the receiving groove 3 for detection.

[0034] Referring to Figures 2 to 3 , a plurality of support platforms 4 are vertically fixed at the bottom of the receiving groove 3, and the height of the support platform 4 is less than the depth of the receiving groove 3. The wafer is placed in the receiving groove 3, and the upper surface of the support platform 4 contacts the bottom of the wafer to support the wafer, so that a gap is formed between the bottom of the wafer and the bottom of the receiving groove 3. A plurality of concave drainage grooves 41 are provided on the upper surface of the support platform 4, and the bottom of the drainage groove 41 is inclined. If the detection liquid leaks into the adsorption channel 2 and is located between the support platform 4 and the wafer, the detection liquid remains in the drainage groove 41 and will flow out of the drainage groove 41. The contact area between the support platform 4 and the wafer is small, thereby reducing the adsorption force between the detection liquid and the wafer, facilitating the picking of the wafer, and reducing the chip breakage rate.

[0035] Referring to Figures 2 to 3 , an adsorption channel 2 is formed between the side wall of the support platform 4 and the receiving groove 3, and a negative pressure suction force is generated in the adsorption channel 2 to adsorb and fix the wafer. A negative pressure channel 11 is formed in the carrier 1, and a negative pressure hole 12 is provided at the center of the bottom of the receiving groove 3. One end of the negative pressure hole 12 is communicated with the adsorption channel 2, and the other end is communicated with the negative pressure channel 11. The negative pressure channel 11 is connected to an external vacuum machine for generating a negative pressure suction force.

[0036] Referring to Figures 2 to 3 , the adsorption channel 2 includes an outer ring channel 21 located at the edge part of the receiving groove 3 in a ring shape, and the outer ring channel 21 is communicated with the negative pressure hole 12 through an inner channel 22. The inner channel 22 can be in a ring shape or in a radial shape on the bottom of the receiving groove 3, ensuring uniform distribution in the receiving groove 3, so that the adsorption force generated by the adsorption channel 2 on the wafer is relatively uniform.

[0037] Referring to Figures 2 to 3 , the diameter of the outer ring channel 21 is larger than the diameter of the wafer, and a soft ring-shaped sealing ring 5 is provided in the outer ring channel 21. The thickness of the sealing ring 5 is not less than the height of the support platform 4. When the wafer is pressed on the support platform 4, the edge part of the wafer is pressed on the sealing ring 5. The sealing ring 5 seals the adsorption channel 2 to prevent the detection liquid from infiltrating and adsorbing between the carrier 1 and the wafer, affecting the picking of the wafer.

[0038] Referring to Figures 2 to 3 , at least two ring-shaped waterproof convex platforms 51 are provided on the upper surface of the sealing ring 5, and a water return groove 52 is formed between the waterproof convex platforms 51 and the waterproof convex platforms 51. The multi-channel waterproof convex platforms 51 enhance the waterproof effect on the detection liquid. When the detection liquid penetrates through one waterproof convex platform 51, the water return groove 52 will also temporarily store the detection liquid, reducing its subsequent leakage amount.

[0039] Referring to Figures 2 to 3, during detection, the sealing ring 5 is located below the wafer. The inner diameter of the sealing ring 5 is smaller than the diameter of the wafer. The sealing ring 5 seals the adsorption flow channel 2. After the detection is completed, since the material of the sealing ring 5 is soft and can be deformed, a plurality of diameter-changing claws 6 located in the outer ring channel 21 are evenly arranged in the circumferential direction of the receiving groove 3. The diameter-changing claws 6 are slidably connected to the outer ring channel 21 along the radial direction of the receiving groove 3. The diameter-changing claws 6 are connected to the sealing ring 5 and can pull the sealing ring 5, so as to change the diameter of the sealing ring 5 until the inner diameter of the sealing ring 5 is larger than the diameter of the wafer, and the sealing ring 5 is separated from the wafer, so that the adsorption flow channel 2 is connected to the external environment, the air pressure on both sides of the wafer is balanced, and it is convenient to pick up the wafer.

[0040] Moreover, when the diameter-changing claws 6 pull the sealing ring 5, the sealing ring 5 and the wafer have a radial sliding, which will not generate a destructive force in the vertical direction on the wafer, thereby further protecting the wafer and reducing the chip breakage rate. The diameter-changing claws 6 are composed of a diameter-changing rod 61 and a connecting claw piece 62.

[0041] Refer to Figures 2 to 3 , a control mechanism for controlling the sliding of the diameter-changing claws 6 is provided in the carrier 1. The control mechanism includes a control disk 71 rotatably connected to the inside of the carrier 1 and coaxial with the receiving groove 3. A spiral groove is provided on the upper surface of the control disk 71. A plurality of blocks 72 are threadedly connected to the spiral groove in the circumferential direction. When the control disk 71 rotates, all the blocks 72 linearly slide along the radial direction of the control disk 71. A toothed groove is provided on the lower surface of the control disk 71. A control motor 73 is installed in the carrier 1. The control motor 73 is a stepping motor. A control gear 74 meshing with the lower surface of the control disk 71 is connected to the output shaft of the control motor 73. When the control motor 73 is started, the control disk 71 is driven to rotate, thereby controlling the sliding of all the blocks 72.

[0042] Refer to Figures 2 to 3 , the blocks 72 correspond to the diameter-changing rods 61 one by one and are fixedly connected. The diameter-changing rods 61 are horizontally arranged and extend out from the side of the receiving groove 3 and are located in the outer ring channel 21. A connecting head is rotatably connected to the end of the diameter-changing rod 61. The connecting head is connected to the connecting claw piece 62 by a thread. The connecting claw piece 62 is fixed inside the sealing ring 5. The diameter-changing rod 61 is detachably connected to the sealing ring 5, which is convenient for the replacement and maintenance of the sealing ring 5. When the control motor 73 is started, the blocks 72 drive the diameter-changing rods 61 to slide, thereby pulling the sealing ring 5 and changing the diameter of the sealing ring 5.

[0043] Refer to Figures 2 to 3, the number of connecting claw pieces 62 connected to each variable-diameter rod 61 is the same as the number of water return grooves 52, and the positions of the connecting claw pieces 62 on each variable-diameter rod 61 correspond one-to-one with the water return grooves 52. A number of water return holes 53 corresponding one-to-one with the connecting claw pieces 62 are formed at the bottom of the water return groove 52. A water return channel 621 facing the water return holes 53 is formed in the connecting claw piece 62. The variable-diameter rod 61 is hollow and communicated with the water return channel 621. The end of the variable-diameter rod 61 away from the connecting claw piece 62 is communicated with the negative pressure flow channel 11 through a soft air pipe 63. A negative pressure suction force is generated in the negative pressure flow channel 11 to suck out the detection liquid infiltrated into the water return groove 52 through the connecting claw piece 62, so as to ensure the dryness of the adsorption flow channel 2.

[0044] The implementation principle of the water immersion type ultrasonic scanning microscope wafer detection bearing device in the embodiment of the present application is as follows: The operator injects the detection liquid into the detection tank 8, and the lifting table 9 is started until the bearing table 1 extends out of the page of the detection liquid. The operator installs the wafer in the accommodation groove 3, and at least makes the inner ring of the sealing ring 5 contact with the lower surface of the wafer. A negative pressure suction force is generated in the negative pressure flow channel 11 to adsorb and fix the wafer. The lifting table 9 descends until the wafer is completely immersed in the detection liquid, and the detection starts. After the detection is completed, the lifting table 9 rises to lift the bearing table 1 out of the page of the detection liquid. No negative pressure suction force is generated in the negative pressure flow channel 11. The motor 73 is controlled to start, and the sealing ring 5 is pulled out from below the wafer to balance the air pressure on both sides of the wafer, and the wafer is taken off or replaced.

[0045] The above are all the preferred embodiments of the present application, and the protection scope of the present application is not limited accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of the present application should be covered within the protection scope of the present application.

Claims

1. A carrier device for wafer inspection using an immersion ultrasonic scanning microscope, comprising a liftable carrier platform (1), an adsorption flow channel (2) being provided on the carrier platform (1), a negative pressure flow channel (11) being provided inside the carrier platform (1), a negative pressure hole (12) being provided on the carrier platform (1) and being connected to the adsorption flow channel (2), the negative pressure hole (12) being connected to the negative pressure flow channel (11), characterized in that: The carrier platform (1) is provided with a receiving groove (3) for receiving wafers, and a plurality of support platforms (4) for supporting wafers are vertically fixed at the bottom of the receiving groove (3). An adsorption channel (2) is formed between the side wall of the support platform (4) and the receiving groove (3). The adsorption channel (2) includes an outer ring channel (21) with a diameter greater than the diameter of the wafer, and a soft annular sealing ring (5) is arranged in the outer ring channel (21). The thickness of the sealing ring (5) is not less than the height of the support platform (4). A plurality of diameter-changing claws (6) located in the outer ring channel (21) are evenly arranged circumferentially on the carrier platform (1). The diameter-changing claws (6) are connected to the outer ring channel (21) by radial sliding along the receiving groove (3), and the diameter-changing claws (6) are connected to the sealing ring (5).

2. The carrying device for wafer inspection using a water immersion ultrasonic scanning microscope according to claim 1, characterized in that: The diameter-changing claw (6) comprises a diameter-changing rod (61) penetrating the side wall of the accommodating groove (3) and slidably connected to the side wall of the accommodating groove (3), and a connecting claw piece (62) fixed to the end of the diameter-changing rod (61) and vertically connected to the end of the diameter-changing rod (61), and the connecting claw piece (62) is fixed in the sealing ring (5).

3. The carrying device for wafer inspection using a water immersion ultrasonic scanning microscope according to claim 2, characterized in that: At least two annular waterproof bosses (51) are provided on the upper surface of the sealing ring (5), and a water return groove (52) is formed between the waterproof bosses (51) and the waterproof bosses (51).

4. The carrying device for wafer inspection using a water immersion ultrasonic scanning microscope according to claim 3, characterized in that: The connecting claw pieces (62) correspond to the water return grooves (52) one by one. The bottom of the water return grooves (52) is provided with a plurality of water return holes (53) corresponding to the connecting claw pieces (62) one by one. A water return channel (621) facing the water return holes (53) is provided in the connecting claw pieces (62). The reducing rod (61) is hollow and communicates with the water return channel (621).

5. The carrying device for wafer inspection using a water immersion ultrasonic scanning microscope according to claim 4, characterized in that: One end of the diameter-changing rod (61) facing the connecting claw piece (62) is rotatably connected to a connecting head, and the connecting head is connected to the connecting claw piece (62) via a thread.

6. The carrying device for wafer inspection using a water immersion ultrasonic scanning microscope according to claim 4, characterized in that: The end of the reducing rod (61) away from the connecting claw piece (62) is connected to the negative pressure flow channel (11) through a soft air pipe (63).

7. The carrying device for wafer inspection using a water immersion ultrasonic scanning microscope according to claim 6, characterized in that: A control disk (71) is rotatably connected inside the bearing platform (1), a spiral groove is provided on the upper surface of the control disk (71), a clamping block (72) threadably connected to the spiral clamping groove is fixed on the diameter-changing rod (61), and a control motor (73) for driving the control disk (71) to rotate is provided inside the bearing platform (1).

8. The carrying device for wafer inspection using a water immersion ultrasonic scanning microscope according to claim 1, characterized in that: The upper surface of the support platform (4) is provided with a plurality of concave drainage grooves (41), and the bottom of the drainage grooves (41) is inclined.

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