Temperature regulation module, electronic device and error compensation method

Abstract

The application discloses a temperature adjusting module, an electronic device and an error compensation method, and belongs to the technical field of sensors, wherein the temperature adjusting module comprises a first sensor, a first temperature detecting device, a temperature compensation device and a heat source; the heat source and the first sensor have a heat propagation path therebetween; the first temperature detecting device is arranged correspondingly to the first sensor and is used for detecting the temperature of the first sensor; the temperature compensation device is electrically connected to the first temperature detecting device and is used for performing temperature compensation on the first sensor according to the temperature detected by the first temperature detecting device, so as to adjust the temperature change rate of the first sensor to be consistent with a target temperature curve; wherein the target temperature curve is used for determining a temperature hysteresis curve of the first sensor, and the temperature hysteresis curve is used for compensating for an offset error caused by the temperature change of the first sensor.

Description

Technical Field

[0001] This application belongs to the field of sensor technology, specifically relating to a temperature regulation module, electronic device, and temperature regulation method. Background Technology

[0002] In related technologies, there are a large number of sensors that are affected by temperature changes. The performance of these sensors is affected by temperature changes, which can cause detection errors.

[0003] Taking Micro-Electro-Mechanical System (MEMS) gyroscopes as an example, MEMS gyroscopes are widely used in camera image stabilization, navigation, and other fields. However, MEMS gyroscopes suffer from zero-point offset error and angle random walk error.

[0004] Among these, random walk error is an irregular error that can usually be filtered out by software filtering, and this type of error is easily canceled out during angle integration. Zero-point offset, however, deteriorates due to temperature changes and is one of the main factors causing angle integration error.

[0005] Because MEMS gyroscopes exhibit different temperature shift characteristics during heating and cooling, they possess hysteresis characteristics. Moreover, the hysteresis characteristics of MEMS gyroscopes are not only related to the real-time external temperature but also affected by the rate of temperature change. The rate of temperature change around a MEMS gyroscope is related to the ambient temperature and the heating efficiency of the heat source within the same electronic device, making the temperature changes around the MEMS gyroscope unpredictable. Therefore, the hysteresis characteristics of a MEMS gyroscope consist of multiple complex hysteresis paths, requiring extensive and complex neural network calculations to achieve software compensation for the offset characteristics of the MEMS gyroscope at various temperature points. Summary of the Invention

[0006] The purpose of this application is to provide a temperature regulation module, electronic device, and temperature regulation method. By using a heat compensation device to perform heat compensation on the sensor, the temperature change around the sensor is made close to a preset temperature change curve. In this way, the offset characteristics of the sensor at various temperature points can be compensated by software based on a hysteresis path corresponding to the temperature change curve, which simplifies the calculation process of software compensation for the offset characteristics of the sensor.

[0007] In a first aspect, embodiments of this application provide a temperature regulation module, which includes: a first sensor, a first temperature detection device, a temperature compensation device, and a heat source;

[0008] There is a heat transfer path between the heat source and the first sensor;

[0009] The first temperature detection device is configured correspondingly to the first sensor and is used to detect the temperature of the first sensor;

[0010] The temperature compensation device is electrically connected to the first temperature detection device and is used to perform temperature compensation on the first sensor based on the temperature detected by the first temperature detection device, so as to adjust the temperature change rate of the first sensor to be consistent with the target temperature curve.

[0011] The target temperature curve is used to determine the temperature hysteresis curve of the first sensor, and the temperature hysteresis curve is used to compensate for the offset error caused by the temperature change of the first sensor.

[0012] Secondly, embodiments of this application provide an electronic device that includes the temperature regulation module as described in the first aspect.

[0013] Thirdly, embodiments of this application provide an error compensation method, which is applied to the temperature regulation module as described in the first aspect, or to the electronic device as described in the second aspect;

[0014] The method includes:

[0015] Obtain the target temperature profile;

[0016] Based on the temperature of the first sensor detected by the first temperature detection device, the temperature compensation device is controlled to perform temperature compensation on the first sensor so as to adjust the temperature change rate of the first sensor to be consistent with the target temperature curve.

[0017] The temperature offset error of the first sensor at each temperature point on the target temperature curve is obtained;

[0018] The temperature hysteresis curve is determined based on the temperature offset error of the first sensor at each temperature point on the target temperature curve.

[0019] Based on the temperature hysteresis curve, error fitting compensation is performed on the detection results of the first sensor.

[0020] In this embodiment, the temperature regulation module includes: a first sensor, a first temperature detection device, a temperature compensation device, and a heat source; the heat source and the first sensor have a heat transfer path; the first temperature detection device is correspondingly arranged with the first sensor and is used to detect the temperature of the first sensor; the temperature compensation device is electrically connected to the first temperature detection device and is used to perform temperature compensation on the first sensor according to the temperature detected by the first temperature detection device, so as to adjust the temperature change rate of the first sensor to be consistent with the target temperature curve; wherein, the target temperature curve is used to determine the temperature hysteresis curve of the first sensor, and the temperature hysteresis curve is used to compensate for the offset error caused by the temperature change of the first sensor. By controlling the temperature compensation device to fine-tune the temperature of the first sensor so that the temperature change rate of the first sensor conforms to the preset target temperature curve, the first sensor can be adjusted to conform to a fixed temperature change law regardless of the heat generated by the heat source or the ambient temperature of the temperature regulation module, thereby giving the first sensor a fixed temperature hysteresis curve, which simplifies the computational complexity of software compensation for the offset characteristics of the MEMS gyroscope at various temperature points based on the fixed temperature hysteresis curve. Attached Figure Description

[0021] Figure 1 This is a temperature curve of a MEMS gyroscope;

[0022] Figure 2 yes Figure 1 The temperature hysteresis curve of the MEMS gyroscope is shown below.

[0023] Figure 3 This is a schematic diagram of a MEMS gyroscope heat insulation device in related technologies;

[0024] Figure 4 This is one of the structural schematic diagrams of the temperature regulation module provided in the embodiments of this application;

[0025] Figure 5 This is a schematic diagram of the possible temperature curve of the first sensor when the temperature compensation device is not activated.

[0026] Figure 6 When the temperature compensation device is activated, Figure 5 The temperature curve shown is a schematic diagram of adjusting it to the target temperature curve;

[0027] Figure 7 It is the first sensor and Figure 6 A schematic diagram of the temperature hysteresis curve corresponding to the target temperature curve shown.

[0028] Figure 8 It is the first sensor and Figure 5A schematic diagram of the temperature hysteresis curve corresponding to the temperature curve shown.

[0029] Figure 9 This is a second schematic diagram of the structure of the temperature regulation module provided in the embodiments of this application;

[0030] Figure 10 This is the third schematic diagram of the structure of the temperature regulation module provided in the embodiments of this application;

[0031] Figure 11 This is a side view of the temperature regulation module provided in the embodiment of this application;

[0032] Figure 12 This is one of the flowcharts of the error compensation method provided in the embodiments of this application;

[0033] Figure 13 This is the second flowchart of the error compensation method provided in the embodiments of this application. Detailed Implementation

[0034] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0035] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0036] In related technologies, there are generally two methods to reduce the temperature offset error of MEMS gyroscopes:

[0037] 1. Software compensation is used to compensate for the offset characteristics of the MEMS gyroscope at various temperature points.

[0038] 2. A hardware design approach is used to perform temperature isolation and constant temperature control on the MEMS gyroscope.

[0039] Among them, the software compensation method requires software compensation for the offset characteristics of MEMS gyroscopes under various temperatures or application environments.

[0040] However, because the temperature of a MEMS gyroscope is affected by factors such as ambient temperature and the heating efficiency of the heat source, the temperature variation around the MEMS gyroscope is unpredictable. Based on different temperature variation patterns, different temperature hysteresis curves are required for error compensation. Therefore, for example... Figure 1 The temperature profile of the MEMS gyroscope shown requires the use of, for example... Figure 2 The numerous temperature hysteresis curves shown are used for error compensation. However, using simple table lookup methods or polynomial fitting of the temperature hysteresis curves will result in poor error compensation.

[0041] Therefore, extensive data acquisition and computation are required to handle errors caused by complex temperature variations. For example, related technologies use neural network algorithms to calculate temperature hysteresis curves based on the temperature characteristics of MEMS gyroscopes, thereby achieving better error compensation. However, these neural network algorithms have high requirements for computing power and storage, making them difficult to implement in conventional electronic devices such as mobile phones and watches.

[0042] The main method for temperature isolation and constant temperature control of MEMS gyroscopes is to isolate the MEMS gyroscope from the external environment and heat sources through a high thermal resistance structural design, so as to minimize the temperature change of the MEMS gyroscope.

[0043] However, high thermal resistance isolation designs are difficult, especially given the trend towards smaller sizes in electronic devices. It's challenging to achieve sufficient distance from heat sources while also having enough space for thermal insulation. Alternatively, as... Figure 3 As shown, the method of temperature isolation and constant temperature control for MEMS gyroscope 103 can also be to place MEMS gyroscope 103 in thermal isolation cavity 101 on the basis of temperature isolation scheme, and then use heating device 102 to stably control MEMS gyroscope 103 at a fixed temperature.

[0044] Figure 3 The proposed solution addresses the angular offset error caused by temperature variations in the MEMS gyroscope by simply maintaining a constant ambient temperature around it through hardware. However, this method requires continuous temperature adjustment to achieve constant temperature control, consuming significant power, especially in scenarios with large temperature differences from the external environment or drastic temperature changes. Figure 3 The proposed solution also requires thermal insulation for the MEMS gyroscope to keep it away from heat sources and reduce the temperature impact of the external environment. Consequently, this solution consumes a lot of power, and the thermal insulation design requires a large amount of space, which increases the size of the electronic device or makes it difficult to implement in smaller electronic devices.

[0045] In this embodiment, there is no need to design a heat insulation for the first sensor, allowing the heat from the heat source to be transferred to the first sensor. By pre-setting a target temperature curve, the temperature curve of the first sensor can be compensated by a temperature compensation device based on the influence of the heat transferred from the heat source, so that the temperature change rate of the first sensor is consistent with the pre-set target temperature curve. In this way, when the heating efficiency of the heat source, the ambient temperature, etc. change, the temperature compensation device can be used to compensate for the temperature effect of the change on the first sensor, so that the first sensor conforms to a fixed temperature change law. Based on this fixed temperature change law, a fixed temperature hysteresis curve can be obtained, and a simplified temperature offset error compensation for the first sensor can be performed based on this fixed temperature hysteresis curve.

[0046] The temperature regulation module, electronic device, and error compensation method provided in this application will be described in detail below with reference to the accompanying drawings and through specific embodiments and application scenarios.

[0047] See Figure 4 The temperature regulation module provided in this application embodiment includes: a first sensor 1, a first temperature detection device 2, a temperature compensation device 3, and a heat source 4.

[0048] There is a heat transfer path between heat source 4 and first sensor 1;

[0049] The first temperature detection device 2 is set up corresponding to the first sensor 1 and is used to detect the temperature of the first sensor 1;

[0050] The temperature compensation device 3 is electrically connected to the first temperature detection device 2 and is used to perform temperature compensation on the first sensor 1 according to the temperature detected by the first temperature detection device 2, so as to adjust the temperature change rate of the first sensor 1 to be consistent with the target temperature curve.

[0051] The target temperature curve is used to determine the temperature hysteresis curve of the first sensor 1, and the temperature hysteresis curve is used to compensate for the offset error caused by the temperature change of the first sensor 1.

[0052] It should be noted that the first sensor 1 in the embodiments of this application can be any sensor whose detection error is related to temperature change. For ease of explanation, the first sensor 1 in the embodiments of this application is usually exemplified as a MEMS gyroscope, which does not constitute a specific limitation.

[0053] In some implementations, the target temperature curve may be a fixed temperature curve, in which case the fixed temperature curve corresponds to a fixed temperature hysteresis curve.

[0054] In some implementations, the target temperature profile can be a temperature profile set according to the heating law of the heat source.

[0055] In some implementations, the target temperature profile may be a temperature profile determined based on the temperature change pattern of the first sensor detected by the first temperature detection device.

[0056] For example, the temperature curve of the first sensor detected by the first temperature detection device within a historical time period is used as the target temperature curve.

[0057] For example, the temperature of the first sensor is detected by the first temperature detection device within a historical time period to obtain a historical temperature curve. The historical temperature curve is then processed in a certain way, such as smoothing, peak shaving and valley filling, and replacing the temperature on the curve segment where the temperature change rate is less than a certain threshold with the same temperature, to obtain the processed target temperature curve.

[0058] In some implementations, application scenarios can be defined, such as categorizing them according to the season or determining them based on the operating scenarios of the electronic devices equipped with the temperature control module, such as assigning corresponding application scenarios to games, telephone calls, etc. In this way, since the heating efficiency of the heat source and the variation patterns of ambient temperature differ under different application scenarios, each application scenario can be associated with its own standard temperature curve, ensuring that the temperature variation pattern of the standard temperature curve is approximately the same as that of the first sensor 1 under its associated application scenario. Thus, when the temperature control module is operating, it can detect the actual application scenario and determine the standard temperature curve associated with that actual application scenario as the target temperature curve.

[0059] In some implementations, the heat source 4 may be a heat-generating device located in the same electronic device or apparatus as the first sensor, such as a central processing unit (CPU), a chip, etc.

[0060] In some embodiments, there is a heat transfer path between the heat source 4 and the first sensor 1. This can be achieved by having a heat-conducting structure between the heat source 4 and the first sensor 1, through which the heat from the heat source 4 can be transferred to the first sensor 1.

[0061] In some embodiments, there is a heat transfer path between the heat source 4 and the first sensor 1. This can be because no heat insulation structure is provided between the heat source 4 and the first sensor 1, so that the heat from the heat source 4 can be transferred to the first sensor 1 through air or other media.

[0062] In some embodiments, the temperature compensation device 3 performs temperature compensation on the first sensor 1 to adjust the temperature change rate of the first sensor 1 to be consistent with the target temperature curve. This can be achieved by the temperature compensation device 3 heating or cooling to raise or lower the temperature of the first sensor 1, so that the temperature curve of the first sensor 1 over a period of time is consistent with or approximately the same as the shape of the target temperature curve.

[0063] In some embodiments, the temperature compensation device 3 can be a heating device. In this case, the temperature compensation device 3 can adjust the temperature curve of the first sensor 1 over a period of time to be consistent with or approximately the same as the shape of the target temperature curve by transferring heat of different amounts to the first sensor 1.

[0064] In some embodiments, the temperature compensation device 3 can be a refrigeration device. In this case, the temperature compensation device 3 can adjust the temperature curve of the first sensor 1 over a period of time to be consistent with or approximately the same as the shape of the target temperature curve by absorbing heat of different magnitudes transmitted by the first sensor 1.

[0065] In some embodiments, the temperature compensation device 3 can be a device that is adjustable for both cooling and heating. In this case, when the end point of the temperature curve of the first sensor 1 over a period of time is about to exceed the target temperature curve, the temperature compensation device 3 can absorb the heat of the first sensor 1. And when the end point of the temperature curve of the first sensor 1 over a period of time is about to be lower than the target temperature curve, the temperature compensation device 3 can transfer heat to the first sensor 1, so as to adjust the temperature curve of the first sensor 1 over a period of time to be consistent with or approximately the same as the shape of the target temperature curve.

[0066] In some embodiments, the temperature compensation device 3 may include thermoelectric cooler (TEC) material, thereby enabling heating and cooling functions using TEC.

[0067] Of course, in addition to TEC materials, the temperature compensation device 3 can also use other structures or materials to achieve at least one of the heating and cooling functions, without specific limitations here.

[0068] In some embodiments, the first temperature detection device 2 can be any device or apparatus capable of performing temperature detection, such as a thermistor, a negative temperature coefficient (NTC) temperature sensor, etc. For ease of explanation, the embodiments of this application usually use an NTC temperature sensor as an example for illustration, which does not constitute a specific limitation.

[0069] In this embodiment, the temperature of the first sensor 1 is compensated by the temperature compensation device 3 so that the temperature of the first sensor 1 changes according to a preset target temperature curve. In this way, the temperature curve of the first sensor 1 can be compensated to a fixed target temperature curve. Based on this target temperature curve, the offset error caused by the temperature change of the first sensor 1 is compensated. Therefore, it is only necessary to first determine a temperature hysteresis curve corresponding to the target.

[0070] For example: assuming... Figure 5 The figure shows a possible temperature curve of the first sensor 1 when the temperature compensation device 3 is not working. By compensating for the temperature of the first sensor 1 using the temperature compensation device 3, the temperature can be... Figure 5 The possible temperature curves of the first sensor 1 shown are respectively adjusted to... Figure 6 The target temperature curve is shown. At this point, for Figure 6 The target temperature curve and the temperature hysteresis curve of the first sensor 1 are shown in the figure. Figure 7 As shown in the image.

[0071] Therefore, in this embodiment of the application, the temperature of the first sensor is finely adjusted by controlling the temperature compensation device so that the temperature change rate of the first sensor conforms to the preset target temperature curve. In this way, regardless of the heat generated by the heat source or the ambient temperature of the temperature regulation module, the first sensor can be adjusted to conform to a fixed temperature change law, thereby giving the first sensor a fixed temperature hysteresis curve. This simplifies the computational complexity of software compensation for the offset characteristics of the MEMS gyroscope at various temperature points based on the fixed temperature hysteresis curve, and reduces the amount of storage space occupied during the calculation process.

[0072] It is worth mentioning that in the relevant technology, if the first sensor 1 is not heat-insulated, the temperature curve of the first sensor 1 will be diverse under different times or different application scenarios. In this case, the offset error caused by the temperature change of the first sensor 1 is compensated based on the diverse temperature curves. Therefore, different temperature hysteresis curves correspond to different temperature changes. Thus, it is necessary to first determine multiple temperature hysteresis curves corresponding to the diverse temperature curves.

[0073] For example: Figure 8 As shown, for Figure 5 The three temperature curves of the first sensor 1 can correspond to Figure 8 The three temperature hysteresis curves shown are illustrated.

[0074] Determining multiple temperature hysteresis curves based on multiple temperature curves, and compensating for the offset error caused by temperature changes in the first sensor 1 based on multiple temperature hysteresis curves, requires a large amount of computation and storage space.

[0075] Therefore, in this embodiment, a heat transfer path can be established between the heat source 4 and the first sensor 1, reducing the drawback of increased volume in the temperature regulation module caused by heat insulation design of the first sensor 1. Furthermore, the temperature compensation device 3 compensates for the temperature of the first sensor 1, ensuring that its temperature changes according to a pre-set target temperature curve. This allows the temperature curve of the first sensor 1 to be compensated to a fixed target temperature curve. Based on this target temperature curve, compensation for the offset error caused by temperature changes in the first sensor 1 is performed. Only one temperature hysteresis curve corresponding to this target needs to be determined first, significantly reducing the computational load and storage space required for software compensation of the offset characteristics of the first sensor 1 at various temperature points.

[0076] As an optional implementation method, such as Figure 9 As shown, the temperature regulation module also includes a substrate 5;

[0077] Heat source 4 and first sensor 1 are disposed at an interval on substrate 5;

[0078] The heat transfer path between the heat source 4 and the first sensor 1 includes a connecting part 52, which is located on the substrate 5 and between the heat source 4 and the first sensor 1.

[0079] In some embodiments, the substrate 5 can be any structure capable of heat conduction, such as a printed circuit board (PCB), a flexible printed circuit (FPC), a plastic or metal structure, etc. For ease of explanation, this application typically uses a PCB as an example for illustration.

[0080] In this method, by spaced apart between the heat source 4 and the first sensor 1 on the substrate 5, the substrate 5 can be used to promote heat conduction between the heat source 4 and the first sensor 1.

[0081] In some embodiments, the heat transfer efficiency between the heat source 4 and the first sensor 1 can be adjusted by designing the structure, materials, etc. of the portion of the substrate 5 used for heat conduction between the heat source 4 and the first sensor 1.

[0082] For example, substrate 5 also includes a cutout portion 51;

[0083] The portion of the cutout 51 is located between the heat source 4 and the first sensor 1. The heat source 4 and the first sensor 1 are connected by the connecting portion 52. The heat transfer efficiency between the heat source 4 and the first sensor 1 is related to the width of the connecting portion 52 along the first direction X, and / or the heat transfer efficiency between the heat source 4 and the first sensor 1 is related to the material of the connecting portion 52. The first direction X is the direction in the plane of the substrate 5 that is perpendicular to the line connecting the heat source 4 and the first sensor 1.

[0084] In some embodiments, the wider the width of the connection portion 52 along the first direction X, the higher the heat transfer efficiency between the heat source 4 and the first sensor 1.

[0085] In some embodiments, the higher the proportion of materials with high thermal conductivity used in the connecting part 52, the higher the heat transfer efficiency between the heat source 4 and the first sensor 1.

[0086] For example, taking a PCB as an example, the PCB includes copper foil and plastic material. The heat conduction efficiency of copper foil is higher than that of plastic. Thus, the wider the width of the copper foil used in the connection part 52 along the first direction X, the higher the heat transfer efficiency between the heat source 4 and the first sensor 1.

[0087] It should be noted that the cutout portion 51 refers to the part of the substrate 5 that is cut out. The substrate in this part is cut out, thereby forming a structure that is not heat-conducting or has low heat conduction efficiency, so that the heat transfer between the heat source 4 and the first sensor 1 is mainly conducted through the connection portion 52.

[0088] In some embodiments, the cavity formed by the hollow portion 51 can be filled with heat-insulating material.

[0089] In some implementations, such as Figure 9 As shown, there are two hollowed-out portions 51. The two hollowed-out portions 51 are grooves formed by the first side 53 and the second side 54 of the substrate 5 recessed towards the center of the substrate 5. At this time, the connecting portion 52 is located between the bottom of the two grooves.

[0090] In some implementations, such as Figure 10 As shown, there are two cutouts 51. The two cutouts 51 are through holes opened on the substrate 5. The through holes are located near the first sensor 1 so that heat can only be conducted between the heat source 4 and the first sensor 1 through the connection part 52.

[0091] In this embodiment, the substrate 5 is divided into a hollow part 51 and a connecting part 52. By designing the structure and material of the connecting part 52, the heat conduction efficiency between the heat source 4 and the first sensor 1 can be adjusted.

[0092] In some embodiments, the heat transfer efficiency between the heat source 4 and the first sensor 1 can be determined based on the power and compensation method of the temperature compensation device 3, and the width of the connection part 52 along the first direction X and / or the material of the connection part 52 can be designed according to the heat transfer efficiency.

[0093] For example, the width of the connecting part 52 along the first direction X satisfies the following formula:

[0094] (AB) / 2≤C;

[0095] Wherein, C represents the maximum amount of heat compensation that the temperature compensation device 3 can provide to the first sensor 1, A represents the maximum amount of heat transferred from the heat source 4 to the first sensor 1 through the connection part 52 per unit time, and B represents the minimum amount of heat transferred from the heat source 4 to the first sensor 1 through the connection part 52 per unit time.

[0096] In some implementations, the temperature control module can be thermally simulated with (AB) / 2≤C as the target, and the structure and material of the connection part 52 can be adjusted according to the simulation results until (AB) / 2≤C is satisfied.

[0097] It is worth mentioning that by making the maximum compensation amount C of the temperature compensation device 3 for the heat compensation of the first sensor 1 greater than or equal to 1 / 2 of the difference between the maximum and minimum values ​​of the heat transferred from the heat source 4 to the first sensor 1 through the connection part 52 per unit time, the temperature compensation device 3 can at least compensate the temperature change rate of the first sensor 1 to an intermediate value of temperature rise or fall during the process of the heat transferred from the heat source 4 to the first sensor 1 through the connection part 52, so that the compensation of peak shaving and valley filling of the temperature curve of the first sensor 1 can be achieved.

[0098] Compared to related technologies that use temperature control systems and thermal insulation designs to make the ambient temperature of the sensor a constant value to solve the offset error caused by temperature changes, in this embodiment, a thermal control system is formed by heat source 4 and temperature compensation device 3. The temperature compensation device 3 compensates for the heat transferred from heat source 4 to first sensor 1, so that the temperature change hysteresis curve of first sensor 1 always closely follows the same linear characteristic. Then, offset error compensation can be achieved through a simple fitting algorithm.

[0099] Furthermore, compared to related technologies, this embodiment does not require heat insulation design for the first sensor 1, and can reduce the volume of the temperature regulation module. Moreover, the temperature compensation device 3 only needs to compensate for the heat transferred from the heat source 4 to the first sensor 1, so that the temperature change rate of the first sensor 1 is consistent with the target temperature curve. There is no need to set the temperature compensation value of the first sensor 1 to a fixed value. Therefore, compared to the method in related technologies that makes the ambient temperature of the sensor a fixed value, the temperature compensation device 3 consumes less power.

[0100] As an optional implementation, the temperature compensation device 3 is disposed on the substrate 5 and surrounds the first side surface 11 of the first sensor 1, wherein the first side surface 11 is the side surface of the first sensor 1 that avoids the heat propagation path.

[0101] For example: Figure 9 or Figure 10 As shown, the temperature compensation device 3 is close to the left side surface of the first sensor 1, and both ends of the temperature compensation device 3 are bent and extended to the side and lower surfaces close to the first sensor 1. In this way, the heat transfer efficiency between the temperature compensation device 3 and the first sensor 1 can be improved.

[0102] In this embodiment, since both the temperature compensation device 3 and the first sensor 1 are disposed on the substrate 5, and the temperature compensation device 3 is disposed close to the first side surface 11 of the first sensor 1, the heat transfer efficiency between the temperature compensation device 3 and the first sensor 1 can be relatively high based on the copper foil structure in the substrate 5. At least the heat transfer efficiency between the temperature compensation device 3 and the first sensor 1 is higher than the heat transfer efficiency between the first sensor 1 and the heat source 4, and / or the heat transfer speed between the temperature compensation device 3 and the first sensor 1 is faster than the heat transfer speed between the first sensor 1 and the heat source 4, thereby improving the sensitivity of the temperature compensation device 3 in temperature compensation of the first sensor 1.

[0103] As an optional implementation method, such as Figure 11 As shown, the height of the temperature compensation device 3 along the second direction Z is the same as the height of the first sensor 1 along the second direction Z, where the second direction Z is perpendicular to the plane of the substrate 5.

[0104] In this embodiment, since the temperature compensation device 3 and the first sensor 1 are respectively mounted on the substrate 5, and the height of the temperature compensation device 3 along the second direction Z is the same as the height of the first sensor 1 along the second direction Z, the surface of the temperature compensation device 3 facing away from the substrate 5 can be flush with the surface of the first sensor 1 facing away from the substrate 5. In this way, the space occupied by the temperature compensation device 3 in the second direction Z can be reduced, thereby reducing the size of the temperature regulation module along the second direction Z.

[0105] For example, when the temperature regulation module is applied to a mobile phone, the substrate 5 can be a circuit board inside the mobile phone, and the second direction Z is the thickness direction of the mobile phone. In this case, by making the surface of the temperature compensation device 3 facing away from the substrate 5 flush with the surface of the first sensor 1 facing away from the substrate 5, the space occupied by the temperature regulation module in the thickness direction of the mobile phone can be reduced.

[0106] As an optional implementation, when the temperature compensation device 3 is in the off state, the target temperature curve is related to the temperature change rate of the first sensor 1.

[0107] In this embodiment, the target temperature curve can be determined based on the temperature change pattern of the first sensor 1 when the temperature compensation device 3 is in the off state, so that the target temperature curve conforms to the temperature change pattern of the first sensor 1. In this way, when the temperature compensation device 3 is activated, the temperature compensation device 3 only needs to fine-tune the temperature of the first sensor 1 to make the temperature change rate of the first sensor 1 consistent with the target temperature curve, thereby reducing the power consumption of the temperature compensation device 3.

[0108] As an optional implementation method, such as Figure 9 or Figure 10 As shown, the temperature regulation module also includes: a second temperature detection device 6;

[0109] The second temperature detection device 6 is set up corresponding to the heat source 4 and is used to detect the temperature of the heat source 4;

[0110] The second temperature detection device 6 is electrically connected to the temperature compensation device 3;

[0111] The temperature compensation amount and compensation time of the temperature compensation device 3 for the first sensor 1 are related to the first temperature and the second temperature. The first temperature is the temperature detected by the first temperature detection device 2, and the second temperature is the temperature detected by the second temperature detection device 6.

[0112] In some embodiments, the temperature compensation amount of the temperature compensation device 3 for the first sensor 1 is related to at least one of a first temperature and a second temperature. For example, the temperature compensation amount is determined based on the first temperature, or based on the second temperature, or based on the intermediate value or weighted sum of the first and second temperatures, so that the temperature change rate of the first sensor 1 after compensation based on the temperature compensation amount conforms to the target temperature curve.

[0113] It should be noted that the target temperature curve includes temperatures at multiple time points, and the temperatures at two adjacent time points can be the same or different. Based on this pattern, the temperature change rate can be determined based on the temperatures at at least two consecutive time points. The temperature change rate of the first sensor 1 can be the proportion of temperature change of the first sensor 1 at at least two consecutive sampling time points. Based on this principle, in determining the temperature compensation amount for the first sensor 1, the temperature change rate of the next time point on the target temperature curve at the current time point can be obtained, as well as the current first temperature of the first sensor 1. The temperature change rate is then multiplied by the first temperature to obtain the temperature compensation amount that the temperature compensation device 3 needs to apply to the first sensor 1.

[0114] In some embodiments, the compensation time for the temperature compensation device 3 to perform temperature compensation on the first sensor 1 is related to the second temperature. For example, based on the time delay of heat conduction, the temperature compensation of the first sensor 1 can be performed in advance according to the second temperature when the heat source 4 is detected.

[0115] For example, when the second temperature of the heat source 4 is detected to be lower than the third temperature, the heat output of the temperature compensation device 3 can be increased in advance based on the difference between the second and third temperatures. The third temperature is determined according to the target temperature curve, which is the temperature required by the heat source 4 when the heat transferred from the heat source 4 to the first sensor 1 is sufficient to make the temperature change rate of the first sensor 1 consistent with the target temperature curve.

[0116] For example, when the second temperature of the heat source 4 is detected to be higher than the third temperature, the heat generation of the temperature compensation device 3 can be reduced in advance based on the difference between the second and third temperatures. The third temperature is determined according to the target temperature curve, which is the temperature required by the heat source 4 when the heat transferred from the heat source 4 to the first sensor 1 is sufficient to make the temperature change rate of the first sensor 1 consistent with the target temperature curve.

[0117] In this embodiment, the second temperature of the heat source 4 can be detected by the second temperature detection device 6, and the second temperature is used as the basis for determining the temperature compensation amount and temperature compensation time of the temperature compensation device 3. This can improve the accuracy of temperature compensation performed by the temperature compensation device 3 and reduce the time delay of temperature compensation performed by the temperature compensation device 3.

[0118] As an optional implementation, the temperature control module also includes an information processing device (not shown);

[0119] The information processing device is electrically connected to the first sensor 1;

[0120] The information processing device is used to acquire the detection result of the first sensor 1, determine the temperature hysteresis curve of the first sensor 1 according to the target temperature curve, and compensate for the offset error caused by the temperature change of the first sensor 1 according to the temperature hysteresis curve.

[0121] In some implementations, the information processing device can be any device or component capable of performing information processing and computation, such as a central processing unit (CPU).

[0122] In this embodiment, an information processing device can be set in the temperature regulation module to compensate for the offset error of the first sensor 1.

[0123] Of course, in other embodiments, an information processing device located outside the temperature regulation module can also be used to compensate for the offset error of the first sensor 1. For example, when a temperature regulation module is installed in an electronic device, the CPU in the electronic device can be electrically connected to the first sensor 1, and the CPU can perform an information processing process to acquire the detection result of the first sensor 1, determine the temperature hysteresis curve of the first sensor 1 according to the target temperature curve, and compensate for the offset error caused by the temperature change of the first sensor 1 according to the temperature hysteresis curve.

[0124] This application also provides an electronic device, which includes any of the temperature regulation modules provided in the foregoing embodiments of this application.

[0125] In some implementations, the electronic device can be a terminal or other devices besides a terminal. For example, the electronic device can be a mobile phone, tablet computer, laptop computer, PDA, in-vehicle electronic device, mobile internet device (MID), augmented reality (AR) / virtual reality (VR) device, robot, wearable device, ultra-mobile personal computer (UMPC), netbook, or personal digital assistant (PDA), etc. It can also be a server, network attached storage (NAS), personal computer (PC), television set (TV), ATM, or self-service machine, etc. This application does not specifically limit the scope of the implementation.

[0126] In this embodiment of the application, by assembling any of the temperature regulation modules provided in the foregoing embodiments of the application in the electronic device, the temperature change rate of the first sensor can be compensated to be consistent with the target temperature curve by means of the temperature regulation module. In this way, the calculation process of software compensation for the offset characteristics of the first sensor can be simplified. Compared with the method of heat insulation and constant temperature design of the sensor in related technologies, the temperature regulation module of this embodiment of the application has the advantages of low power consumption and small size.

[0127] This application also provides an error compensation method. The subject of the error compensation method can be the electronic device provided in the foregoing embodiments of this application, or the temperature regulation module provided in the foregoing embodiments of this application.

[0128] like Figure 12 As shown, an error compensation method provided in this application embodiment may include the following steps:

[0129] Step 1201: Obtain the target temperature curve.

[0130] Step 1202: Based on the temperature of the first sensor detected by the first temperature detection device, control the temperature compensation device to perform temperature compensation on the first sensor so as to adjust the temperature change rate of the first sensor to be consistent with the target temperature curve.

[0131] Step 1203: Obtain the temperature offset error of the first sensor at each temperature point on the target temperature curve.

[0132] Step 1204: Determine the temperature hysteresis curve based on the temperature offset error of each temperature point on the target temperature curve by the first sensor.

[0133] Step 1205: Based on the temperature hysteresis curve, perform error fitting compensation on the detection results of the first sensor.

[0134] It should be noted that the target temperature curve, first temperature detection device, temperature compensation device, first sensor, and temperature hysteresis curve in the embodiments of this application have the same meaning as the target temperature curve, first temperature detection device, temperature compensation device, first sensor, and temperature hysteresis curve in the aforementioned temperature regulation module embodiments of this application, and will not be repeated here.

[0135] In some implementations, the temperature offset error of the first sensor at each temperature point on the target temperature curve can be obtained by detecting the offset error of the first sensor at each temperature point on the target temperature curve at the corresponding time.

[0136] It should be noted that the process of error fitting compensation of the detection result of the first sensor based on the temperature hysteresis curve in step 1205 is the same as the process of software compensation of the offset characteristics of MEMS gyroscope at various temperature points based on the temperature hysteresis curve in related technologies. The difference is that in related technologies, since the temperature changes of MEMS gyroscopes are diverse, it is necessary to determine multiple temperature hysteresis curves and perform software compensation of the offset characteristics of each temperature point on the corresponding temperature curve based on each temperature hysteresis curve. In order to meet the computational requirements of this process, it is necessary to train a neural network model and perform a large amount of data acquisition and data storage. However, in this embodiment, the temperature change of the first sensor conforms to the same law, so it is only necessary to determine one temperature hysteresis curve and use the temperature hysteresis curve to perform software compensation of the offset characteristics of each temperature point on the temperature curve of the first sensor.

[0137] Therefore, the embodiments of this application can greatly reduce the amount of data acquisition, computation, and storage space required for software compensation of the offset characteristics of each temperature point on the temperature curve of the first sensor.

[0138] As an optional implementation, obtaining the target temperature curve includes:

[0139] When the temperature compensation device is not activated, the temperature curve of the first sensor is detected by the first temperature detection device.

[0140] The target temperature curve is determined based on the temperature curve of the first sensor.

[0141] In some implementations, the temperature curve of the first sensor detected by the first temperature detection device can be directly used as the target temperature curve.

[0142] In other embodiments, the temperature curve of the first sensor detected by the first temperature detection device can be processed to obtain the target temperature curve.

[0143] For example, at least one of the following processes can be performed on the temperature curve of the first sensor detected by the first temperature detection device: smoothing, peak shaving and valley filling, and replacing the temperature on the curve segment of the temperature curve of the first sensor detected by the first temperature detection device that satisfies the temperature change rate being less than a certain threshold with the same temperature, in order to obtain the target temperature curve.

[0144] In this embodiment, the target temperature curve is determined based on the temperature curve of the first sensor detected by the first temperature detection device. This allows the target temperature curve to more closely match the temperature change pattern of the first sensor before the temperature compensation device is activated. As a result, the temperature compensation device only needs to fine-tune the temperature of the first sensor to make the temperature change rate of the first sensor conform to the target temperature curve, thereby reducing the power consumption of the temperature compensation device.

[0145] In other implementations, application scenarios can be defined, such as categorizing them according to the season or determining them based on the operating scenarios of the electronic devices equipped with the temperature control module, such as assigning corresponding application scenarios to operating scenarios like games and phone calls. Since the heating efficiency of the heat source and the variation patterns of ambient temperature differ under different application scenarios, each application scenario can be associated with its own standard temperature curve, ensuring that the temperature variation pattern of the standard temperature curve is approximately the same as that of the first sensor 1 under its associated application scenario. Thus, when the temperature control module is operating, it can detect the actual application scenario and determine the standard temperature curve associated with that actual application scenario as the target temperature curve.

[0146] As an optional implementation, the step of controlling the temperature compensation device to perform temperature compensation on the first sensor based on the temperature detected by the first temperature detection device, so as to adjust the temperature change rate of the first sensor to be consistent with the target temperature curve, includes:

[0147] Based on the first temperature of the first sensor detected by the first temperature detection device and the temperature change rate corresponding to the target temperature curve, a first temperature compensation amount is determined for temperature compensation of the first sensor.

[0148] Based on the second temperature of the heat source detected by the second temperature detection device, determine the second temperature compensation amount and compensation time for temperature compensation of the first sensor;

[0149] The target temperature compensation amount is determined based on the first temperature compensation amount and the second temperature compensation amount;

[0150] The temperature compensation device is activated at the compensation time and performs temperature compensation on the first sensor according to the target temperature compensation amount, so as to adjust the temperature change rate of the first sensor to be consistent with the target temperature curve.

[0151] In some embodiments, determining a first temperature compensation amount for temperature compensation of the first sensor based on the temperature change rate corresponding to the first temperature of the first sensor detected by the first temperature detection device and the target temperature curve may include:

[0152] The difference between the first temperature and the fourth temperature is used as the first temperature compensation amount that the temperature compensation device 3 needs to provide to the first sensor 1. The fourth temperature is determined based on the target temperature curve and is the temperature of the first sensor 1 that satisfies the condition that the temperature change rate of the first sensor 1 is consistent with the target temperature curve. For example, if the first temperature is lower than the fourth temperature, the first temperature compensation amount can be determined to be greater than 0; if the first temperature is higher than the fourth temperature, the first temperature compensation amount can be determined to be less than 0.

[0153] In some embodiments, determining a second temperature compensation amount and compensation time for temperature compensation of the first sensor based on a second temperature of the heat source detected by the second temperature detection device may include:

[0154] Based on the difference between the second and third temperatures, the second temperature compensation amount that the heat source 4 will transfer to the first sensor 1 is determined. The third temperature is determined according to the target temperature curve; it is the temperature required by the heat source 4 to ensure that the heat transferred from the heat source 4 to the first sensor 1 makes the temperature change rate of the first sensor 1 consistent with the target temperature curve. For example, if the second temperature is higher than the third temperature, it indicates that the heat source 4 will transfer too much heat to the first sensor 1, thus requiring a reduction in the heat transferred by the temperature compensation device 3 to the first sensor 1; if the second temperature is lower than the third temperature, it indicates that the heat source 4 will transfer too little heat to the first sensor 1, thus requiring an increase in the heat transferred by the temperature compensation device 3 to the first sensor 1.

[0155] In some implementations, the second temperature compensation amount can be negatively correlated with the value of DE, where D represents the second temperature and E represents the third temperature.

[0156] At this point, the target temperature compensation amount is determined based on the first temperature compensation amount and the second temperature compensation amount. This can be achieved by subtracting the second temperature compensation amount from the first temperature compensation amount, or by multiplying the first temperature compensation amount by a first coefficient to obtain a first value; multiplying the second temperature compensation amount by a second coefficient to obtain a second value; and subtracting the second value from the first value to obtain the target temperature compensation amount. The first and second coefficients can be constants greater than 0. These coefficients can be determined based on the proportional relationship between the heat transfer efficiency between the heat source 4 and the first sensor 1 and the heat transfer efficiency between the temperature compensation device 3 and the first sensor 1. For example, if the heat transfer efficiency between the heat source 4 and the first sensor 1 is lower than that between the temperature compensation device 3 and the first sensor 1, then the value of the second coefficient will be smaller.

[0157] Of course, the relationship between the second temperature compensation amount and the second and third temperatures can also be calculated in other ways. Similarly, the calculation process for determining the target temperature compensation amount based on the first and second temperature compensation amounts can also be adjusted accordingly. Here, the calculation process for the first, second, and target temperature compensation amounts is not specifically limited.

[0158] The error compensation method provided in this application embodiment can realize the temperature compensation and error compensation functions of the temperature regulation module for the first sensor provided in the foregoing embodiment of this application, and can reduce the amount of computation and data storage in this process.

[0159] As an optional implementation, the method further includes:

[0160] If the temperature compensation device fails to adjust the temperature change rate of the first sensor to be consistent with the target temperature curve, the target temperature curve is updated.

[0161] Based on the temperature of the first sensor detected by the first temperature detection device, the temperature compensation device is controlled to perform temperature compensation on the first sensor so that the temperature change rate of the first sensor is consistent with the updated target temperature curve.

[0162] For example: Figure 13 As shown, the temperature control module or electronic device implementing the error compensation method of this application embodiment can perform the following steps:

[0163] Step 1301: The first sensor starts working;

[0164] Step 1302: Collect temperature change data from the first sensor;

[0165] Step 1303: Determine the target temperature curve based on the temperature change data from the first sensor;

[0166] Step 1304: Control the temperature compensation device to adjust the temperature change rate of the first sensor to match the target temperature curve;

[0167] Step 1305: Detect the hysteresis error curve of the first sensor that satisfies the characteristic law;

[0168] Step 1306: The real-time temperature compensation device adjusts the temperature change rate of the first sensor to be consistent with the target temperature curve, while compensating for the offset error of the detection result of the first sensor.

[0169] Step 1307: Determine whether the temperature change characteristics of the first sensor deviate from the target temperature curve;

[0170] If the judgment result in step 1307 is "yes", step 1302 is repeated; otherwise, step 1306 is continued until the first sensor stops working.

[0171] In some implementations, the temperature change characteristics of the first sensor deviate from the target temperature curve. This may be due to a significant change in the ambient temperature or a significant change in the heating characteristics of the heat source, which prevents the temperature compensation device from adjusting the temperature change rate of the first sensor to match the target temperature curve.

[0172] In this embodiment, a target temperature curve is first determined based on the temperature change pattern of the first sensor when the temperature compensation device is not working, so that the target temperature curve can represent the temperature change pattern of the first sensor. Subsequently, the temperature of the first sensor can be compensated in real time by controlling the temperature compensation device, so that the temperature change rate of the first sensor is always consistent with the target temperature curve. Moreover, when the ambient temperature changes significantly or the heating characteristics of the heat source change significantly, the target temperature curve can be adjusted in time so that the target temperature curve conforms to the actual temperature change characteristics of the first sensor, which can effectively reduce the power consumption of the temperature compensation device in various application scenarios.

[0173] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0174] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a computer software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods described in the various embodiments of this application.

[0175] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A temperature regulating module, characterized in that, The first sensor, the first temperature detection device, the temperature compensation device and the heat source are included. The heat source and the first sensor have a heat propagation path therebetween. The first temperature detection device is correspondingly arranged with the first sensor and is used for detecting the temperature of the first sensor. The temperature compensation device is electrically connected with the first temperature detection device and is used for compensating the temperature of the first sensor according to the temperature detected by the first temperature detection device, so as to adjust the temperature change rate of the first sensor to be consistent with a target temperature curve. The target temperature curve is used for determining a temperature hysteresis curve of the first sensor, and the temperature hysteresis curve is used for compensating the offset error caused by the temperature change of the first sensor. Further including a substrate; 2. Temperature regulating module according to claim 1, characterized in that The heat source and the first sensor are arranged on the substrate in a spaced manner; The heat propagation path between the heat source and the first sensor includes a connecting portion, which is located on the substrate and between the heat source and the first sensor. The substrate further includes a hollow portion; 3. Temperature regulating module according to claim 2, characterized in that Part of the hollow portion is located between the heat source and the first sensor, the heat source and the first sensor are connected through the connecting portion, the heat transfer efficiency between the heat source and the first sensor is related to the width of the connecting portion along a first direction, and / or the heat transfer efficiency between the heat source and the first sensor is related to the material of the connecting portion, wherein the first direction is a direction perpendicular to the connecting line from the heat source to the first sensor in the plane where the substrate is located. In the case that the heat transfer efficiency between the heat source and the first sensor is related to the width of the connecting portion along the first direction, the width of the connecting portion along the first direction satisfies the following formula:

4. Temperature regulating module according to claim 3, characterized in that (A-B) / 2≤C; Wherein, C represents the maximum compensation amount of the temperature compensation device for compensating the heat of the first sensor, A represents the maximum value of the heat transferred by the heat source to the first sensor through the connecting portion per unit time; B represents the minimum value of the heat transferred by the heat source to the first sensor through the connecting portion per unit time. The temperature compensation device is arranged on the substrate and surrounds the first side surface of the first sensor, wherein the first side surface is the side surface of the first sensor away from the heat propagation path.

5. Temperature regulating module according to any of claims 2 to 4, characterized in that, The height of the temperature compensation device along a second direction is consistent with the height of the first sensor along the second direction, and the second direction is a direction perpendicular to the plane where the substrate is located.

6. Temperature regulating module according to claim 5, characterized in that In the case that the temperature compensation device is in an off state, the target temperature curve is related to the temperature change rate of the first sensor.

7. Temperature regulating module according to any of claims 1 to 4, characterized in that Further including:

8. Temperature regulating module according to any one of claims 1 to 4, characterized in that A second temperature detection device; The second temperature detection device is correspondingly arranged with the heat source and is used for detecting the temperature of the heat source; The second temperature detection device is electrically connected with the temperature compensation device; ​ The temperature compensation device compensates the temperature of the first sensor, and the temperature compensation amount and compensation time of the temperature compensation device are related to a first temperature and a second temperature, the first temperature is a temperature detected by the first temperature detection device, and the second temperature is a temperature detected by the second temperature detection device.

9. Temperature regulating module according to any of claims 1 to 4, characterized in that Further comprising an information processing device; The information processing device is electrically connected with the first sensor; The information processing device is configured to acquire a detection result of the first sensor, determine a temperature hysteresis curve of the first sensor according to the target temperature curve, and compensate for an offset error caused by temperature change of the first sensor according to the temperature hysteresis curve.

10. An electronic device, comprising: The temperature adjustment module comprises the temperature adjustment module according to any one of claims 1 to 9.

11. A method of error compensation, characterized by, The temperature adjustment module according to any one of claims 1 to 9, or the electronic device according to claim 10. The method comprises: acquiring a target temperature curve; controlling the temperature compensation device to compensate for the temperature of the first sensor according to a temperature detected by the first temperature detection device, so as to adjust a temperature change rate of the first sensor to be consistent with the target temperature curve; acquiring a temperature offset error of each temperature point of the first sensor on the target temperature curve; determining a temperature hysteresis curve according to the temperature offset error of each temperature point of the first sensor on the target temperature curve; performing error fitting compensation on a detection result of the first sensor according to the temperature hysteresis curve.

12. The method of claim 11, wherein, The acquiring of the target temperature curve comprises: detecting a temperature curve of the first sensor by the first temperature detection device in a case where the temperature compensation device is in an unstarted state; determining the target temperature curve according to the temperature curve of the first sensor.

13. The method of claim 11, wherein, The controlling of the temperature compensation device to compensate for the temperature of the first sensor according to the temperature detected by the first temperature detection device, so as to adjust the temperature change rate of the first sensor to be consistent with the target temperature curve, comprises: determining a first temperature compensation amount for compensating for the temperature of the first sensor according to a first temperature of the first sensor detected by the first temperature detection device and a temperature change rate corresponding to the target temperature curve; determining a second temperature compensation amount and a compensation time for compensating for the temperature of the first sensor according to a second temperature of the heat source detected by the second temperature detection device; determining a target temperature compensation amount according to the first temperature compensation amount and the second temperature compensation amount; controlling the temperature compensation device to start at the compensation time and compensate for the temperature of the first sensor according to the target temperature compensation amount, so as to adjust the temperature change rate of the first sensor to be consistent with the target temperature curve.

14. The method according to any one of claims 11 to 13, characterized in that, The method further comprises: updating the target temperature curve in a case where the temperature compensation of the first sensor by the temperature compensation device does not satisfy the adjustment of the temperature change rate of the first sensor to be consistent with the target temperature curve. According to the temperature of the first sensor detected by the first temperature detecting device, the temperature compensation device is controlled to perform temperature compensation on the first sensor, so as to adjust the temperature change rate of the first sensor to be consistent with the updated target temperature curve.

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