Display device

Abstract

A display device is provided. The display device includes a substrate, a display layer positioned on a first surface of the substrate and including a display element, and a protective film on a second surface of the substrate, the second surface of the substrate being opposite the first surface of the substrate. The protective film includes a transparent base layer, a first conductive layer positioned on a first surface of the base layer, and a second conductive layer positioned on a second surface of the base layer, the second surface of the base layer being opposite the first surface of the base layer. The protective film includes an adhesive layer between the first conductive layer and the substrate. The adhesive layer includes at least one of conductive molecules, polar molecules, and zwitterions.

Description

[0001] This application claims priority to and all benefits derived from Korean Patent Application No. 10-2023-0126402, filed on September 21, 2023, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0002] One or more embodiments relate to a display device. Background Art

[0003] The display device can display data visually. The display device may include a substrate divided into a display area and a non-display area. A plurality of pixel areas may be defined in the display area. In some cases, a thin film transistor corresponding to each of the pixel areas and a pixel electrode electrically connected to the thin film transistor may be provided in the display area. Various conductive layers such as a line for sending an electrical signal to a wiring in the display area may be provided in the non-display area.

[0004] By bending at least a portion of the display device, visibility from various angles may be improved or the area of ​​a non-display region may be reduced. Summary of the invention

[0005] One or more embodiments include a protective film disposed below the display panel.The embodiments set forth herein are examples, and the scope of the present disclosure is not limited thereto.

[0006] Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the presented embodiments of the disclosure.

[0007] According to one or more embodiments, a display device includes a substrate, a display layer positioned on a first surface of the substrate and including a display element, and a protective film positioned on a second surface of the substrate, wherein the second surface of the substrate is opposite to the first surface of the substrate. The protective film includes a transparent base layer, a first conductive layer positioned on the first surface of the base layer, a second conductive layer positioned on the second surface of the base layer, and an adhesive layer between the first conductive layer and the substrate, wherein the second surface of the base layer is opposite to the first surface of the base layer, wherein the adhesive layer includes at least one of conductive molecules, polar molecules, and zwitterions.

[0008] The base layer may include polyethylene terephthalate or polyimide.

[0009] The base layer may be free of organic nanoparticles and inorganic nanoparticles.

[0010] The surface resistance of the first conductive layer may be about 30 Ω / sq to about 10 6 Ω / sq.

[0011] The first conductive layer and the second conductive layer may each include a conductive polymer or a transparent conductive oxide.

[0012] The thickness of each of the first conductive layer and the second conductive layer may be about 0.01 μm to about 0.5 μm.

[0013] The thickness of the adhesive layer may be about 3 μm to about 30 μm.

[0014] The surface resistance of the adhesive layer can be about 10 3 Ω / sq to about 10 10 Ω / sq.

[0015] The fluorine (F) content of the protective film may be less than 0.25 ppb.

[0016] According to one or more embodiments, a display device includes a substrate, a display element arranged on a front surface of the substrate, an encapsulation member covering the display element, and a protective film arranged on a rear surface of the substrate, wherein the protective film includes a transparent base layer, a first conductive layer arranged on the front surface of the base layer, a second conductive layer arranged on the rear surface of the base layer, and an adhesive layer between the first conductive layer and the substrate, wherein the adhesive layer includes at least one of conductive molecules, polar molecules, and zwitterions, and the surface resistance of the adhesive layer is about 10 10 Ω / sq or less.

[0017] The substrate may include a first region facing a first direction, a second region extending from the first region and facing a second direction different from the first direction, and a third region positioned between the first region and the second region, the display element may be arranged on the first region, and the protective film may include a portion positioned in the first region and another portion spaced apart from the portion and positioned in the second region.

[0018] The display device may further include an optical member on the encapsulation member and a window on the optical member.

[0019] The base layer may include polyethylene terephthalate or polyimide.

[0020] The base layer may be free of organic nanoparticles and inorganic nanoparticles.

[0021] The surface resistance of the first conductive layer may be about 30 Ω / sq to about 10 6 Ω / sq.

[0022] The first conductive layer and the second conductive layer may each include a conductive polymer or a transparent conductive oxide.

[0023] The first conductive layer and the second conductive layer may each have a thickness of about 0.01 μm to about 0.5 μm.

[0024] The adhesive layer may have a thickness of about 3 μm to about 30 μm.

[0025] The surface resistance of the adhesive layer can be about 10 3 Ω / sq to about 10 10 Ω / sq.

[0026] The fluorine (F) content of the protective film may be less than 0.25 ppb. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The above and other aspects, features and advantages of certain embodiments of the present disclosure will be more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0028] Figure 1 is a schematic plan view of a display device according to an embodiment;

[0029] Figure 2 is a schematic perspective view of a portion of a display device according to an embodiment;

[0030] Figure 3 is an equivalent circuit diagram of a pixel that may be included in a display device according to an embodiment;

[0031] Figure 4 is along Figure 1 A portion of a cross-sectional view of the display device taken along line II';

[0032] Figure 5 is a schematic cross-sectional view of a portion of a display device according to an embodiment;

[0033] Figure 6 is a cross-sectional view of a protective film included in a display device according to an embodiment;

[0034] Figure 7 is a cross-sectional view of a protective film included in a display device according to an embodiment;

[0035] Figure 8 is a cross-sectional view of a protective film included in a display device according to an embodiment; and

[0036] Fig. 9 is a cross-sectional view of a protective film included in the display device according to the embodiment. DETAILED DESCRIPTION

[0037] The embodiments illustrated in the accompanying drawings will now be described in detail with reference to the examples, in which similar reference numerals always refer to similar elements. In this regard, the present embodiment may have different forms and should not be construed as being limited to the description set forth herein. Accordingly, the embodiments are described below only by reference to the figures to illustrate the various aspects of this description. As used herein, the term "and / or" includes any and all combinations of one or more of the items listed in association. Throughout the disclosure, the expression "at least one of a, b, and c" indicates only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or their variants.

[0038] Various modifications may be applied to the present embodiment, and specific embodiments will be illustrated in the accompanying drawings and described in the detailed description section. With reference to the following detailed description and the accompanying drawings, the effects and features of the present embodiment and the methods for achieving them will be more clear. However, by not being limited to the embodiments presented below, the present embodiment can be implemented in various forms.

[0039] In the example embodiments described herein, it will be understood that although the terms "first", "second" and the like may be used herein to describe various components, these components should not be limited by these terms. These terms are only used to distinguish one component from another.

[0040] In example embodiments described herein, as used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise.

[0041] In the example embodiments described herein, it will be further understood that the terms “include,” “comprise,” and / or “have” used herein indicate the presence of stated features or components, but do not preclude the presence or addition of one or more other features or components.

[0042] In the example embodiments described herein, it will be understood that when a layer, region, or component is referred to as being "formed" "on" another layer, region, or component, the layer, region, or component can be formed directly or indirectly on the other layer, region, or component. That is, for example, there may be intervening layers, regions, or components.

[0043] In the specification, the expression "A and / or B" may include A, B, or A and B. In addition, the expression "at least one of A and B" may include A, B, or A and B.

[0044] As used herein, description of a wiring referred to as “extending in the first direction or the second direction” may mean that the wiring extends not only in a straight line shape but also in a zigzag shape or a curved line in the first direction or the second direction.

[0045] As used herein, “in a plan view” means viewing a target portion from above, and “in a cross-sectional view” means viewing a cross section of a target portion vertically cut from a lateral side.

[0046] The terms "about" or "approximately" as used herein include the stated value and include a suitable range of deviations for the particular value as determined by one of ordinary skill in the art, taking into account the measurement in question and the errors associated with the measurement of a particular quantity. For example, the term "about" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the stated value.

[0047] As used herein, the term "substantially equal" means approximately or substantially equal (eg, within a threshold percentage of equality, within a threshold difference).

[0048] Hereinafter, embodiments of the present disclosure are described in detail with reference to the accompanying drawings. When describing with reference to the accompanying drawings, like reference numerals are used for like or corresponding elements.

[0049] Figure 1 is a schematic plan view of a display device DD according to the embodiment.

[0050] refer to Figure 1 , the display device DD may include a display panel DP for displaying an image, a window WD, and a case CS for protecting the display panel DP.

[0051] The display panel DP can display any visual information (such as text, video, photo, and two-dimensional or three-dimensional image as examples). In the following, general visual information is referred to as "image". According to one or more embodiments of the present disclosure, the type, structure and / or shape of the display panel DP are not particularly limited. For example, the display panel DP may be a self-emissive display panel (such as an organic light-emitting display panel (OLED panel) as an example), or may be a non-emissive display panel (such as a liquid crystal display panel (LCD panel), an electrophoretic display panel (EPD panel), and an electrowetting display panel (EWD panel) as examples). In the example where a non-emissive display panel is used as a display panel DP of a display device DD, the display device DD may be provided with a light source unit (e.g., a backlight unit) for supplying light to the display panel DP.

[0052] As an example, the display panel DP may include a display area DA and a non-display area NDA positioned around the display area DA. The display area DA may include a plurality of pixels for displaying an image. In an embodiment, a light-transmitting hole area H (e.g., a non-pixel area where pixels are not arranged or a low-resolution area where pixels are arranged at a low resolution) corresponding to a camera, an infrared (IR) sensor, etc. may be formed in the display area DA. The non-display area NDA may be arranged on at least one side of the display area DA so that the non-display area NDA partially or completely surrounds the display area DA. In the non-display area NDA, wiring, pads, and / or at least one driving circuit for driving the pixels of the display area DA may be arranged.

[0053] The window WD and the housing CS are connected to the display panel DP to protect the display panel DP from external impacts. As an example, the window WD can be positioned in front of the display device DD and placed on top of the display panel DP, and the housing CS can be positioned on the side and / or back of the display device DD so that the housing CS surrounds the side and / or back of the display panel DP.

[0054] The display device DD may include at least one type of sensor that supports providing various functions. As an example, the display device DD may include an IR sensor (not shown) or a fingerprint sensor (not shown) that supports providing a biometric information authentication function. In some aspects, the display device DD may further include a sensor that supports providing a touch input function.

[0055] For example, the display device DD may include an IR sensor provided on the back side of the display panel DP, and the IR sensor may overlap with the area of ​​the display area DA. However, the position of the IR sensor may vary based on the embodiment. As an example, the IR sensor may be provided so that the IR sensor overlaps with the non-display area NDA (e.g., the light-transmitting hole area H).

[0056] In a plan view, the display device DD may have various shapes. For example, the display device DD may have a rectangular shape in which the horizontal length (or width) in the x direction is less than the vertical length in the y direction, but is not limited thereto. For example, in another embodiment, the display device DD may have a rectangular shape in which the horizontal length is greater than the vertical length, a square shape in which the horizontal length is substantially equal to the vertical length, or various other shapes. For example, the display device DD may have various polygonal shapes, circular shapes, elliptical shapes, and / or combinations of shapes. In some aspects, the display device DD may have right-angled corners or rounded corners. In this article, the x direction may refer to the +x direction and / or the -x direction, the y direction may refer to the +y direction and / or the -y direction, and the z direction may refer to the +z direction and / or the -z direction.

[0057] Figure 2 is a schematic perspective view of a portion of a display device according to an embodiment.

[0058] According to one or more embodiments of the present disclosure, a portion of the substrate 100 may be bendable. Figure 2 , a portion of the substrate 100 which is a portion of the display device is illustrated as being in a bent state, and thus, the portion of the display device may have a curved shape similar to the substrate 100. Figure 2 The bending state of the portion relative to the substrate 100 is described.

[0059] The substrate 100 may have a first region 1A facing a first direction, a second region 2A extending from the first region 1A and facing a second direction different from the first direction (eg, in a bent state), and a third region 3A positioned between the first region 1A and the second region 2A. Figure 2 As shown in , when the first direction facing the first region 1A is the +z direction, the second direction facing the second region 2A may be the -z direction. The first region 1A and the second region 2A may face opposite directions. That is, one side of the first region 1A and one side of the second region 2A may be positioned parallel to each other and may be provided in a folded state to face each other. However, the present disclosure is not limited thereto, and may include a case where the first region 1A and the second region 2A do not face the same direction.

[0060] The third region 3A may be positioned between the first region 1A and the second region 2A. Figure 2 As shown in , as an example, the third region 3A can be bent around a bending axis BAX extending in the y direction perpendicular to the first direction (+z direction). Figure 2 , the substrate 100 is shown as being bent with the same radius of curvature based on the bending axis BAX. However, the present disclosure is not limited thereto. The substrate 100 may be bent with an irregular radius of curvature around the bending axis BAX.

[0061] The third region 3A may be arranged so that the third region 3A is continuous with the first region 1A, and the second region 2A may be arranged so that the second region 2A is continuous with the third region 3A. The third region 3A may be formed integrally with the first region 1A so that the third region 3A is continuous with the first region 1A, but is not limited thereto.

[0062] In an embodiment, the first area 1A may be provided in at least a portion of the display area DA and / or the non-display area NDA. The third area 3A may be provided in the non-display area NDA. Figure 2As shown in , the non-display area NDA may include a protruding area protruding from a portion of the non-display area NDA in at least one direction (e.g., -x direction), and may be folded or bent in the protruding area. As an example, the first area 1A may be provided in the display area DA and / or in the non-display area NDA around the display area DA, and the third area 3A and the second area 2A may be provided in the protruding area of ​​the non-display area NDA.

[0063] The protruding area of ​​the non-display area NDA may be folded (or bent or curled) along the folding line, and the width of the bezel may be reduced by folding (or bending) the protruding area of ​​the non-display area NDA.

[0064] The substrate 100 may include various flexible or bendable materials. For example, the substrate 100 may include a polymer resin (such as polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyphenylene sulfide, polyarylate, polyimide, or cellulose acetate propionate). The substrate 100 may have a single-layer or multi-layer structure including the above materials, and the multi-layer structure may further include an inorganic layer.

[0065] Figure 3 is an equivalent circuit diagram of a pixel that may be included in the display device according to the embodiment.

[0066] refer to Figure 3 , each pixel P may include a pixel circuit PC connected to the scan line SL and the data line DL, and each pixel P may include an organic light emitting device OLED connected to the pixel circuit PC.

[0067] The pixel circuit PC may include a driving thin film transistor Td, a switching thin film transistor Ts, and a storage capacitor Cst. The switching thin film transistor Ts may be connected to a scan line SL and a data line DL. The switching thin film transistor Ts may be configured to transmit a data signal Dm input through the data line DL to the driving thin film transistor Td according to a scan signal Sn input through the scan line SL.

[0068] The storage capacitor Cst may be connected to the switching thin film transistor Ts and the driving voltage line PL. The storage capacitor Cst may store a voltage corresponding to a difference between a voltage received from the switching thin film transistor Ts and a first power supply voltage ELVDD (or driving voltage) supplied to the driving voltage line PL. A pixel electrode of the organic light emitting device OLED is electrically connected to the pixel circuit PC, and an opposite electrode of the organic light emitting device OLED may be supplied with a second power supply voltage ELVSS (or common voltage).

[0069] The driving thin film transistor Td may be connected to the driving voltage line PL and the storage capacitor Cst. The driving thin film transistor Td may be configured to control a driving current flowing from the driving voltage line PL through the organic light emitting device OLED in response to the value of the voltage stored in the storage capacitor Cst. The organic light emitting device OLED may emit light having a certain brightness based on the driving current.

[0070] Despite Figure 3 , the pixel circuit PC includes two thin film transistors and one storage capacitor, but the embodiments supported by the present disclosure are not limited thereto. In another embodiment, the pixel circuit PC may include, for example, seven thin film transistors and one storage capacitor. In another embodiment, the pixel circuit PC may include two or more storage capacitors.

[0071] Figure 4 is along Figure 1 A portion of a cross-sectional view of the display device DD taken along line II'.

[0072] refer to Figure 4 The display device DD may include a display panel DP and a window WD on the display panel DP. The thin film transistor TFT and the display element 200 may be arranged on a substrate 100 of the display device DD. The thin film transistor TFT may correspond to Figure 3 The driving thin film transistor Td in the display element 200 may correspond to Figure 3 Organic light-emitting device OLED.

[0073] The substrate 100 may include various flexible, bendable or rollable materials. For example, the substrate 100 may include a polymer resin (such as polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate or cellulose acetate propionate).

[0074] The substrate 100 includes a first base layer 101, a second base layer 102 disposed on the first base layer 101, a first barrier layer 103 between the first base layer 101 and the second base layer 102, and a second barrier layer 104 on the second base layer 102. Each of the first barrier layer 103 and the second barrier layer 104 may include at least one inorganic insulating material selected from the group including silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, and zinc oxide. The second barrier layer 104 may include a single layer or multiple layers including the aforementioned inorganic insulating material. In some embodiments, the second barrier layer 104 may be omitted.

[0075] The buffer layer 105 may be disposed on the second barrier layer 104. The buffer layer 105 may be positioned on the substrate 100, and reduce or prevent foreign matter, moisture, or external air from penetrating from the bottom of the substrate 100, and may provide a flat surface on the substrate 100. The buffer layer 105 may include an inorganic material (such as an oxide or a nitride, for example), an organic material, or an organic-inorganic composite material, and may have a single-layer or multi-layer structure including an inorganic material, an organic material, or a combination of one or more inorganic materials and one or more organic materials.

[0076] The lower metal layer BML may be disposed between the second barrier layer 104 and the buffer layer 105. The lower metal layer BML may overlap the thin film transistor TFT disposed over the lower metal layer BML.

[0077] The thin film transistor TFT may be disposed on the buffer layer 105. The thin film transistor TFT may include a semiconductor layer Act, a gate electrode GE overlapping the semiconductor layer Act, and a source electrode SE and a drain electrode DE electrically connected to the semiconductor layer Act. The thin film transistor TFT may be connected to the display element 200 and may drive the display element 200.

[0078] The semiconductor layer Act may be arranged on the buffer layer 105 and may include a channel region overlapping the gate electrode GE. The semiconductor layer Act may include a source region and a drain region arranged on both sides of the channel region and including impurities having a higher concentration than the channel region. In this example case, the impurities may include N-type impurities or P-type impurities. The source region and the drain region may be electrically connected to the source electrode SE and the drain electrode DE, respectively.

[0079] The semiconductor layer Act may include an oxide semiconductor and / or a silicon semiconductor. In an example where the semiconductor layer Act includes an oxide semiconductor, the oxide semiconductor may include, for example, an oxide of at least one material selected from the group consisting of indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). For example, the semiconductor layer Act may include InSnZnO (ITZO), InGaZnO (IGZO), etc. In an example where the semiconductor layer Act includes a silicon semiconductor, the silicon semiconductor may include, for example, amorphous silicon or low temperature polycrystalline silicon (LTPS) obtained by crystallizing amorphous silicon.

[0080] The first insulating layer 107 may be disposed on the semiconductor layer Act. The first insulating layer 107 may include at least one inorganic insulating material selected from the group consisting of silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, and zinc oxide. The first insulating layer 107 may include a single layer or multiple layers including the aforementioned inorganic insulating materials.

[0081] The gate electrode GE may be disposed on the first insulating layer 107. The gate electrode GE may include one or more metals selected from aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and copper (Cu), and may be formed as a single layer or a multilayer. The gate electrode GE may be connected to a gate line that applies an electrical signal to the gate electrode GE.

[0082] The second insulating layer 109 may be disposed on the gate electrode GE. The second insulating layer 109 may include at least one inorganic insulating material selected from the group consisting of silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, and zinc oxide. The second insulating layer 109 may include a single layer or multiple layers including the aforementioned inorganic insulating materials.

[0083] The storage capacitor Cst may be disposed on the first insulating layer 107. The storage capacitor Cst may include a lower electrode 144 and an upper electrode 146 overlapping the lower electrode 144. The lower electrode 144 of the storage capacitor Cst and the upper electrode 146 of the storage capacitor Cst may overlap each other with the second insulating layer 109 therebetween.

[0084] The lower electrode 144 of the storage capacitor Cst may overlap with the gate electrode GE of the thin film transistor TFT (for example, the lower electrode 144 of the storage capacitor Cst may be in the same layer as the gate electrode GE of the thin film transistor TFT), and may be arranged integrally with the gate electrode GE of the thin film transistor TFT. In another embodiment, the storage capacitor Cst may not overlap with the thin film transistor TFT, and the lower electrode 144 of the storage capacitor Cst may be an independent component separated from the gate electrode GE of the thin film transistor TFT.

[0085] The upper electrode 146 of the storage capacitor Cst may include Al, Pt, Pd, Ag, Mg, Au, Ni, Nd, Ir, Cr, Li, Ca, Mo, Ti, W and / or Cu, and may include a single layer or multiple layers containing the foregoing materials (e.g., one or more of Al, Pt, Pd, Ag, Mg, Au, Ni, Nd, Ir, Cr, Li, Ca, Mo, Ti, W and Cu).

[0086] The third insulating layer 111 may be disposed on the upper electrode 146 of the storage capacitor Cst. The third insulating layer 111 may include at least one inorganic insulating material selected from the group consisting of silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, and zinc oxide. The third insulating layer 111 may include a single layer or multiple layers including the aforementioned inorganic insulating materials.

[0087] The source electrode SE and the drain electrode DE may be disposed on the third insulating layer 111. The source electrode SE and the drain electrode DE may each include a conductive material including Mo, Al, Cu, Ti, etc., and may include a multilayer or a single layer including the foregoing conductive material. Each of the source electrode SE and the drain electrode DE may have a multilayer structure including a Ti layer / Al / Ti layer.

[0088] The first planarization layer 113 may be arranged on the source electrode SE and the drain electrode DE. The first planarization layer 113 may be formed as a single layer or multilayer film including an organic material or an inorganic material. In an embodiment, the first planarization layer 113 may include a general polymer (such as benzocyclobutene (BCB), polyimide (PI), hexamethyldisiloxane (HMDSO), polymethylmethacrylate (PMMA) or polystyrene (PS) as an example), a polymer derivative with a phenolic group, an acryl polymer, an imide polymer, an aromatic ether polymer, an amide polymer, a fluorine polymer, a paraxylene polymer, a vinyl alcohol polymer or a mixture of any combination of a general polymer and / or a polymer derivative. The first planarization layer 113 may include silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide or zinc oxide. After forming the first planarization layer 113, a chemical mechanical polishing that supports providing a flat top surface may be performed.

[0089] The connection electrode 139 may be disposed on the first planarization layer 113. The connection electrode 139 may include Al, Cu, Ti, etc., and may be formed as a multilayer or a single layer. The connection electrode 139 may have a multilayer structure including a Ti layer / Al layer / Ti layer.

[0090] The second planarization layer 115 may be disposed on the connection electrode 139. The second planarization layer 115 may be formed as a single layer or multilayer film including an organic material or an inorganic material. The second planarization layer 115 may include the same material as the first planarization layer 113. The second planarization layer 115 may include a material different from the first planarization layer 113.

[0091] The display element 200 including the pixel electrode 210, the intermediate layer 220, and the opposite electrode 230 may be disposed on the second planarization layer 115. In an example, the display element 200 including the pixel electrode 210, the intermediate layer 220, and the opposite electrode 230 may be an organic light emitting device.

[0092] The pixel electrode 210 can be electrically connected to the connection electrode 139 through a contact hole passing through the second planarization layer 115, and the connection electrode 139 can be electrically connected to the source electrode SE or the drain electrode DE of the thin film transistor TFT through a contact hole passing through the first planarization layer 113, and therefore, the display element 200 can be electrically connected to the thin film transistor TFT.

[0093] The pixel electrode 210 may be arranged on the second planarization layer 115. The pixel electrode 210 may be a (semi) transmissive electrode or a reflective electrode. The pixel electrode 210 may include a reflective layer comprising a compound of any of Al, Pt, Pd, Ag, Mg, Au, Ni, Nd, Ir, Cr, Li, Ca, Mo, Ti, W, Cu, or Al, Pt, Pd, Ag, Mg, Au, Ni, Nd, Ir, Cr, Li, Ca, Mo, Ti, W, or Cu. The pixel electrode 210 may include a transparent or semi-transparent electrode layer formed on the reflective layer. The transparent or semi-transparent electrode layer may include at least one selected from the group comprising indium tin oxide, indium zinc oxide, zinc oxide, indium oxide, indium gallium oxide, and aluminum zinc oxide. For example, the pixel electrode 210 may have a stacked structure comprising an ITO layer / Ag layer / ITO layer.

[0094] The bank layer 180 may be arranged on the second planarization layer 115, and the bank layer 180 may have an opening exposing at least a portion of the pixel electrode 210. The area exposed by the opening of the bank layer 180 may be defined as an emission area. The surrounding area of ​​the emission area may be a non-emission area, and the non-emission area may surround the emission area. That is, the display area DA may include a plurality of emission areas and a non-emission area surrounding the emission area. The bank layer 180 may increase the distance between the edge of the pixel electrode 210 and the relative electrode 230 above the pixel electrode 210, thereby preventing arcing or other effects from occurring at the edge of the pixel electrode 210. The bank layer 180 may include an organic insulating material (such as polyimide, polyamide, acrylic resin, benzocyclobutene, HMDSO or phenol resin as examples), and may be formed by a method such as spin coating as an example.

[0095] The intermediate layer 220 may be disposed on the pixel electrode 210 at least partially exposed by the bank layer 180. For example, the intermediate layer 220 may be disposed on a portion of the pixel electrode 210 exposed by the bank layer 180. The intermediate layer 220 may include an emission layer. The intermediate layer 220 may include a first functional layer and / or a second functional layer selectively disposed below and / or above the emission layer.

[0096] The intermediate layer 220 may be disposed on the pixel electrode 210 at least partially exposed by the bank layer 180. More specifically, the emission layer of the intermediate layer 220 may be disposed on the pixel electrode 210 at least partially exposed by the bank layer 180. For example, the emission layer may be disposed on a portion of the pixel electrode 210 exposed by the bank layer 180.

[0097] The first functional layer may include a hole injection layer and / or a hole transport layer, and the second functional layer may include an electron transport layer and / or an electron injection layer.

[0098] The emission layer may include an organic material including a fluorescent or phosphorescent material that emits red, green, blue, or white light. The emission layer may include a low-molecular organic material or a high-molecular organic material.

[0099] In an example where the emission layer includes a low-molecular organic material, the intermediate layer 220 may have a structure in which a hole injection layer, a hole transport layer, an emission layer, an electron transport layer, an electron injection layer, etc. (e.g., other layers of the intermediate layer 220) are stacked in a single or composite structure, and the low-molecular organic material may include various organic materials (such as copper phthalocyanine (CuPc), N,N'-di(naphthalene-1-yl)-N,N'-diphenyl-benzidine (NPB) and tri-8-hydroxyquinoline aluminum (Alq 3 )) as an example). In some embodiments, the layers described with reference to the intermediate layer 220 may be formed by vacuum deposition.

[0100] In the example where the emission layer includes a high molecular organic material, the intermediate layer 220 may generally have a structure including a hole transport layer and an emission layer. In some aspects, the hole transport layer may include PEDOT, and the emission layer may include a high molecular weight material (such as poly(p-phenylene vinylene) (PPV) or polyfluorene). Such an emission layer may be formed by screen printing, inkjet printing, laser induced thermal imaging (LITI), etc.

[0101] The opposing electrode 230 may be disposed on the intermediate layer 220. The opposing electrode 230 may be disposed on the intermediate layer 220 to completely cover the intermediate layer 220. The opposing electrode 230 may be disposed throughout the display area DA, and may be disposed to completely cover the display area DA. That is, the opposing electrode 230 may be integrally formed as a single body by the display panel DP, so that the opposing electrode 230 covers a plurality of pixels arranged in the display area DA by using an open mask.

[0102] The opposing electrode 230 may include a conductive material having a low work function. For example, the opposing electrode 230 may include a (semi) transparent layer including Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, or an alloy of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, or Ca. Alternatively or additionally, the opposing electrode 230 may further include a layer (such as an ITO layer, an IZO layer, a ZnO layer, or an Indium oxide layer) on the (semi) transparent layer including the aforementioned materials. 2 O 3 layer as an example).

[0103] The thin film encapsulation layer 300, which is an encapsulation member, may be arranged on the display element 200, for example, on the opposite electrode 230. The thin film encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. The thin film encapsulation layer 300 may prevent oxygen or moisture from penetrating into the intermediate layer 220 including the emission layer and the opposite electrode 230. In an example, the thin film encapsulation layer 300 may include a first inorganic encapsulation layer 310 arranged on the opposite electrode 230, an organic encapsulation layer 320 arranged on the first inorganic encapsulation layer 310, and a second inorganic encapsulation layer 330 arranged on the organic encapsulation layer 320. The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may each include silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, or aluminum oxide. The organic encapsulation layer 320 may include acrylic resin, epoxy resin, phenol resin, polyamide resin, polyimide resin, etc.

[0104] Such a thin film encapsulation layer 300 may extend outside the display area DA. In some embodiments, outside the display area DA, the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may contact each other.

[0105] The sensor layer 400 may be disposed on the thin film encapsulation layer 300. The sensor layer 400 may include a first sensor insulating layer 410, a second sensor insulating layer 430, and a third sensor insulating layer 450. In some aspects, the sensor layer 400 may include a first sensor electrode 420 disposed between the first sensor insulating layer 410 and the second sensor insulating layer 430 and a second sensor electrode 440 disposed between the second sensor insulating layer 430 and the third sensor insulating layer 450. The first sensor electrode 420 and the second sensor electrode 440 may include a driving electrode and a sensing electrode. Although not shown in the drawings, the first sensor electrode 420 and the second sensor electrode 440 may be electrically connected to each other through a contact hole defined in the second sensor insulating layer 430.

[0106] The first sensor insulating layer 410 may include at least one inorganic insulating material selected from the group consisting of silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, and zinc oxide. The first sensor insulating layer 410 may have a single layer or a multilayer structure. In another embodiment, the first sensor insulating layer 410 may include at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and perylene resin. In some embodiments, the first sensor insulating layer 410 may be omitted.

[0107] The second sensor insulating layer 430 may include at least one inorganic insulating material selected from the group consisting of silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, and zinc oxide. The second sensor insulating layer 430 may have a single layer or multilayer structure. In another embodiment, the second sensor insulating layer 430 may include at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and perylene resin.

[0108] The polarizing film 500, which is an optical member, can be positioned on the sensor layer 400. The polarizing film 500 can be attached to the sensor layer 400 by a light-transmitting adhesive layer 510. The polarizing film 500 can reduce external light reflection. For example, when external light passes through the polarizing film 500, is reflected from the upper surface of the relative electrode 230, and passes through the polarizing film 500 again, the phase of the external light can be changed due to the external light passing through the polarizing film 500 twice. As a result, destructive interference in which the phase of the reflected light is different from the phase of the external light entering the polarizing film 500 can occur. As described herein, various aspects of the display device DD and the display panel DP support features that can improve visibility by reducing external light reflection. The light-transmitting adhesive layer 510 and the polarizing film 500 can be provided so that in addition to the display area DA, the light-transmitting adhesive layer 510 and the polarizing film 500 also overlap with a portion of the non-display area NDA.

[0109] In some embodiments, the display device DD may omit or not have the polarizing film 500. For example, in some embodiments, the polarizing film 500 may be omitted or replaced with other components. For example, the polarizing film 500 may be omitted, and external light reflection may be reduced by using a black matrix and a color filter.

[0110] The window WD may be provided on the polarizing film 500. The window WD may protect the display panel DP from external impact and provide an input surface and / or a display surface to a user. In an embodiment, the window WD may be coupled to the polarizing film 500 by an optically transparent adhesive member.

[0111] The window WD may be formed rigid or flexible using glass or plastic. In some aspects, the window WD may have a single-layer or multi-layer structure. In an example where the window WD has a multi-layer structure, the window WD may be formed by a continuous process or an adhesive process using an adhesive layer.

[0112] Figure 5 is a schematic cross-sectional view of a portion of the display device DD according to the embodiment.

[0113] refer to Figure 5 , the display device DD according to the embodiment may include a substrate 100, a display layer DISL, a thin film encapsulation layer 300, a sensor layer 400, a light-transmitting adhesive layer 510, a polarizing film 500, a window WD, a protective film 700, a cover plate 910, and a cover spacer 920. As shown in reference Figure 5 The described display device DD includes example aspects of the display device DD as described herein, and repeated descriptions of similar elements are omitted for the sake of brevity.

[0114] As described herein, the substrate 100 may include the first region 1A and the second region 2A facing different directions, and the substrate 100 may include the third region 3A positioned between the first region 1A and the second region 2A.

[0115] The first area 1A may include a display area DA (eg, referring to Figure 2 ). In addition to the display area DA, the first area 1A may further include a non-display area NDA outside the display area DA (eg, referring to Figure 2 ) part.

[0116] The display layer DISL, the thin film encapsulation layer 300 , the sensor layer 400 , the light-transmitting adhesive layer 510 , the polarizing film 500 , and the window WD may be stacked in the first region 1A.

[0117] The display layer DISL may include the above Figure 4 The thin film transistor TFT, the display element 200, and the insulating layer between the thin film transistor TFT and the display element 200 are shown in FIG. The thin film encapsulation layer 300 may be formed in the display area DA and the non-display area NDA in the first area 1A so that the thin film encapsulation layer 300 covers the display layer DISL.

[0118] The sensor layer 400 may be provided on the thin film encapsulation layer 300 in the first region 1A. The polarization film 500 may be provided on the sensor layer 400 .

[0119] The light-transmitting adhesive layer 510 may be between the polarizing film 500 and the sensor layer 400. The light-transmitting adhesive layer 510 may include an optically clear adhesive (OCA). However, the present disclosure is not limited thereto, and the light-transmitting adhesive layer 510 may include an optically clear resin (OCR). In some embodiments, the light-transmitting adhesive layer 510 may include a pressure-sensitive adhesive (PSA). PSA may include a polymer curing material. PSA may include an acrylic or rubber adhesive. In some embodiments, PSA may include an adhesive obtained by adding fine particles (such as zirconium oxide) to an acrylic or rubber adhesive.

[0120] In an embodiment, the display device DD may omit or not exist (may not include) the polarizing film 500. For example, the display device DD may include a filter plate including a black matrix and a color filter instead of the polarizing film 500.

[0121] The window WD may be arranged on the polarizing film 500. The window WD may provide a display surface to a user and protect components under the window WD. As described above, a light-transmitting adhesive layer 510 may be arranged between the window WD and the polarizing film 500. The window WD may be arranged to correspond to the display area DA, the non-display area NDA, and the curved third area 3A of the first area 1A of the substrate 100.

[0122] The panel driver 800 may be arranged in the second region 2A. The panel driver 800 may be connected to the pad portion of the substrate 100, and may supply data signals and scan signals to the gate lines and the data lines. The panel driver 800 may be spaced apart from the curved protection layer 600. The panel driver 800 may be, for example, a driver integrated circuit (IC), and may be mounted on the pad portion of the substrate 100. In some aspects, the pad portion may be directly electrically connected to the driver IC.

[0123] In another embodiment, the flexible circuit board 810 may be mounted on the pad portion of the substrate 100, and the driver integrated circuit may be mounted on the flexible circuit board 810. The flexible circuit board 810 may use a chip on film (COF) or a flexible printed circuit (FPC). Figure 4 ) may be mounted on the flexible circuit board 810. Aspects of the present disclosure support various modifications to the flexible circuit board 810 (such as taking both the panel driver 800 and the flexible circuit board 810 arranged in the second area 2A as an example).

[0124] The third region 3A of the substrate 100 is positioned between the first region 1A and the second region 2A, and can be bent so that the third region 3A in a bent state has a certain inner radius. The connection line CWL can be arranged on the third region 3A (for example, the connection line CWL can be arranged on the substrate 100 in the third region 3A), and the bending protection layer 600 can be arranged on the connection line CWL. The connection line CWL can send a signal provided from the panel driver 800 and / or the flexible circuit board 810 to the display area DA of the first region 1A. The bending protection layer 600 can protect the connection line CWL and can be a stress neutralization layer. By placing the stress neutral surface near the connection line CWL by means of the bending protection layer 600, the tensile stress applied to the connection line CWL can be reduced. In some embodiments, the bending protection layer 600 can be omitted.

[0125] The substrate 100 may have a first surface 100a and a second surface 100b positioned on an opposite side of the first surface 100a (e.g., the second surface 100b positioned opposite to the first surface 100a). The first surface 100a of the substrate 100 may refer to a front surface of the substrate 100, and the second surface 100b may refer to a rear surface of the substrate 100. The display layer DISL including the display element 200 may be positioned on the first surface 100a of the substrate 100. The protective film 700 may be positioned on the second surface 100b of the substrate 100 opposite to the first surface 100a on which the display layer DISL is positioned, that is, on a surface on which an image is not displayed.

[0126] The protective film 700 may be applied to the second surface 100b of the substrate 100 in the form of a coating (for example, the second surface 100b may be coated with a material for forming the protective film 700) or may be attached to the second surface 100b in the form of a film. The protective film 700 may be attached to the second surface 100b of the substrate 100 to protect the display device DD. For example, the protective film 700 may absorb physical impacts from the outside or prevent impurities or moisture from penetrating into the display layer DISL. The protective film 700 may be patterned. The protective film 700 may be positioned in the first region 1A and the second region 2A of the substrate 100 (for example, in a plan view). The protective film 700 may be positioned outside the curved third region 3A (for example, in a plan view, it may not be positioned in the curved third region 3A). When the display panel DP is bent in the third region 3A, a portion of the protective film 700 and another portion of the protective film 700 may be arranged to face each other.

[0127] The cover plate 910 may be disposed on a back side of a portion of the protective film 700. In an embodiment, an adhesive layer (not shown) may be disposed between the protective film 700 and the cover plate 910. The cover plate 910 may protect the display panel DP from external impacts and other physical forces or damages.

[0128] The cover plate 910 can be used to mitigate external impacts, and can include a buffer layer containing an elastically deformable material. For example, the cover plate 910 may include a single or multilayer buffer layer containing at least one material selected from the group consisting of thermoplastic elastomers, polystyrene, polyolefins, polyurethane thermoplastic elastomers, polyamides, synthetic rubbers, polydimethylsiloxanes, polybutadienes, polyisobutylenes, poly(styrene-butadiene-styrene), polyurethanes, polychloroprene, polyethylene, silicones, and any combination of materials. In some aspects, the cover plate 910 may include a material having elasticity as long as the material does not affect the image display of the display panel DP. For example, the material may have a characteristic that does not negatively affect the display of the image of the display panel DP (e.g., within a threshold value of the display of the image of the display panel DP).

[0129] In some aspects, on the back side of the display panel DP, the cover plate 910 may further include a high strength plate (eg, a metal plate), graphite, a copper plate, and / or a heat dissipation plate that supports stably supporting the display panel DP.

[0130] As an example, the cover plate 910 may include an embossed layer (not shown), an absorption layer (not shown), and a supporting member (not shown) sequentially arranged on the rear surface of the display panel DP. However, the configuration of the cover plate 910 is not limited thereto, and the cover plate 910 may further include additional elements having various functions of supporting the features of the cover plate 910 and / or the display panel DP. In some aspects, the mutual positions (e.g., stacking order) of the elements constituting the cover plate 910 may vary based on the embodiment. For example, in an embodiment, the embossed layer, the absorption layer, and the supporting member are sequentially arranged on the back of the display panel DP, but in another embodiment, the supporting member may be first arranged on the back of the display panel DP, and the embossed layer and / or the absorption layer may be arranged on the back of the supporting member.

[0131] The embossed layer may include a plurality of embossed patterns that mitigate and disperse external impacts, etc. (e.g., other electrical events), and may include a single layer or multiple layers. The absorption layer may be filled with air or a dispersion material or a sound-absorbing material to absorb external impacts, etc., and may include a single layer or multiple layers. The embossed layer and the absorption layer may be formed separately and bonded to each other by an adhesive or glue. However, the present disclosure is not limited thereto, and the embossed layer and the absorption layer may be formed as a single layer.

[0132] The support member may include a high-strength and / or high-ductility material that supports ensuring or improving the mechanical strength of the display device DD. As an example, the support member may be a metal plate including at least one type of metal or alloy. The support member may have sufficient strength by having a thickness ranging from about 10 μm to about several hundred μm. Accordingly, the mechanical strength of the display device DD may be ensured or improved at least by the support member.

[0133] The cover spacer 920 can maintain a uniform gap between the cover plate 910 and the area of ​​the display panel DP corresponding to the second area 2A when the display panel DP is bent, thereby controlling the bending degree (or curvature) of the display panel DP. In some aspects, the cover spacer 920 can support the area of ​​the display panel DP corresponding to the second area 2A when the first area 1A and the second area 2A face each other when the display panel DP is bent. In an embodiment, the cover spacer 920 may include the same material as the cover plate 910, but is not limited thereto. For example, the cover spacer 920 may include an elastic material suitable for the design conditions of the display panel DP.

[0134] Figure 6 is a cross-sectional view of a protective film 700 included in the display device according to the embodiment.

[0135] refer to Figure 6 , the protective film 700 may include a base layer 710, a first conductive layer 720, a second conductive layer 730, and an adhesive layer 740. The base layer 710 may have a first surface 710a and a second surface 710b positioned on the opposite side of the first surface 710a (e.g., the second surface 710b positioned opposite to the first surface 710a). The first conductive layer 720 may be positioned on the first surface 710a of the base layer 710. The second conductive layer 730 may be positioned on the second surface 710b of the base layer 710. The adhesive layer 740 may be arranged on the first surface 720a of the first conductive layer 720. The adhesive layer 740 may be positioned between the first conductive layer 720 and the substrate 100 (see Figure 5 ). The adhesive layer 740 of the protective film 700 may be attached to the display panel DP (see Figure 5 ) of the substrate 100 (see Figure 5 ) of the second surface 100b (see Figure 5 ).

[0136] The base layer 710 may include a polymer resin. For example, the base layer 710 may include polyethylene terephthalate (PET) or polyimide (PI). In some aspects, the base layer 710 may include a light-transmitting hole area H (see FIG. 1 ) that supports increased overlap with a camera, an IR sensor, etc. Figure 1 ) of a transparent material.

[0137] In some embodiments, the base layer 710 may omit or not exist (may not include) organic nanoparticles or inorganic nanoparticles. For example, the base layer 710 may not include silicon particles. As a comparative example, in some other display devices, the display device may include a base layer containing organic nanoparticles or inorganic nanoparticles to increase the productivity in the manufacturing process. The organic nanoparticles or inorganic nanoparticles included in the base layer may cause light scattering, thereby reducing the light transmittance. However, in the present embodiment, the base layer 710 does not exist (does not include) organic nanoparticles and inorganic nanoparticles, and therefore, the transmittance of the protective film 700 can be improved.

[0138] In an embodiment, the haze of the protective film 700 may be greater than 0.05% and less than 0.45%. Since the transmittance of the protective film 700 is increased, the light-transmitting hole area H (see Figure 1 ) transmittance. The IR sensor performance of the display device can be improved.

[0139] In an embodiment, the surface resistance of the base layer 710 may be approximately 10 13 Ω / sq or more. Preferably, for example, the surface resistance of the base layer 710 may be about 10 13 Ω / sq to about 10 15 Ω / sq.

[0140] In an embodiment, the base layer 710 may have a thickness of about 25 μm to about 125 μm. In an example where the thickness of the base layer 710 is less than 25 μm, the thickness may result in decreased productivity and decreased panel protection effect of the protective film 700. In an example where the thickness of the base layer 710 exceeds 125 μm, the thickness may result in increased costs.

[0141] The first conductive layer 720 may be disposed on the first surface 710a of the base layer 710. In an embodiment, the first conductive layer 720 may be directly disposed on the first surface 710a of the base layer 710. The first conductive layer 720 may include a conductive polymer and / or a transparent conductive oxide. The first conductive layer 720 may include a conductive polymer such as poly(p-phenylene), polypyrrole, polythiophene, poly(p-phenylene), polyacetylene, polyaniline, poly(3,4-ethylenedioxythiophene), or poly(3,4-ethylenedioxythiophene): polystyrene sulfonate (PEDOT:PSS). Alternatively, the first conductive layer 720 may be, for example, a transparent electrode material, and may include at least one transparent conductive oxide selected from the group including indium tin oxide, indium zinc oxide, zinc oxide, indium oxide, indium gallium oxide, and aluminum zinc oxide. The first conductive layer 720 may include a transparent material that supports improving the transmittance of the protective film 700. In an embodiment, the first conductive layer 720 may include PEDOT:PSS.

[0142] In an embodiment, the surface resistance of the first conductive layer 720 may be about 30 Ω / sq to about 10 6 For example, the surface resistance of the first conductive layer 720 may refer to the surface resistance of the first surface 720 a of the first conductive layer 720 .

[0143] In an embodiment, the first conductive layer 720 may have a thickness of about 0.01 μm to about 0.5 μm. Preferably, the first conductive layer 720 may have a thickness of about 0.05 μm to about 0.2 μm. In some cases, if the thickness of the first conductive layer 720 is less than 0.01 μm, productivity may decrease, and if the thickness of the first conductive layer 720 is greater than 0.5 μm, cost may increase. Within the above thickness range of about 0.05 μm to about 0.2 μm, the first conductive layer 720 may have a thickness of about 30 Ω / sq to about 10 6 Surface resistance of Ω / sq.

[0144] The second conductive layer 730 may be disposed on the second surface 710b of the base layer 710. In an embodiment, the second conductive layer 730 may be disposed directly on the second surface 710b of the base layer 710. The second conductive layer 730 may include a conductive polymer and / or a transparent conductive oxide. In an embodiment, the second conductive layer 730 may include the same material as the first conductive layer 720. However, the present disclosure is not limited thereto, and the second conductive layer 730 may include a material different from that of the first conductive layer 720. In an embodiment, the second conductive layer 730 may include PEDOT:PSS.

[0145] In an embodiment, the surface resistance of the second conductive layer 730 may be about 30 Ω / sq to about 10 6Ω / sq. In some aspects, the surface resistance of the second conductive layer 730 may refer to the surface resistance of the second surface 730 b of the second conductive layer 730 .

[0146] In an embodiment, the second conductive layer 730 may have a thickness of about 0.01 μm to about 0.5 μm. Preferably, for example, the second conductive layer 730 may have a thickness of about 0.05 μm to about 0.2 μm. Within the thickness range of about 0.05 μm to about 0.2 μm, the second conductive layer 730 may have a resistance of about 30 Ω / sq to about 10 6 Surface resistance of Ω / sq.

[0147] The adhesive layer 740 may be arranged on the first conductive layer 720. In an embodiment, the adhesive layer 740 may be directly arranged on the first surface 720a of the first conductive layer 720. In an embodiment, the adhesive layer 740 may include a PSA. The PSA may include a polymer cured product. The PSA may include an acrylic or rubber adhesive, or an adhesive obtained by adding fine particles (such as zirconium oxide) to an acrylic or rubber adhesive. In another embodiment, the adhesive layer 740 may include an OCA. However, the present disclosure is not limited thereto, and in some embodiments, the adhesive layer 740 may include an OCR. In some aspects, the adhesive layer 740 may include a light-transmitting material. In some embodiments, the adhesive layer 740 may further include an ultraviolet (UV) sensitive material.

[0148] The adhesive layer 740 may not contain (may not include) perfluoro and polyfluoroalkyl substances (PFAS). For example, the adhesive layer 740 may not contain (may not include) perfluorohexanoic acid (PFHxA). PFAS is a substance that can be added to the adhesive layer 740 for the purpose of preventing static electricity. However, PFAS is a harmful substance that is not easily decomposed and accumulates in the human body and the environment, and the use of PFAS may be restricted in the future in countries such as the European Union (EU).

[0149] In an embodiment, the adhesive layer 740 may have a thickness of about 3 μm to about 30 μm. Preferably, for example, the adhesive layer 740 may have a thickness of about 3 μm to about 25 μm. In an example where the thickness of the adhesive layer 740 exceeds 30 μm, it may be difficult to ensure a process for bonding a flexible circuit board.

[0150] In an embodiment, the surface resistance of the adhesive layer 740 may be 10 10 Ω / sq or less. Preferably, for example, the surface resistance of the adhesive layer 740 may be about 10 3 Ω / sq to 10 10Ω / sq. For example, the surface resistance of the adhesive layer 740 may refer to the surface resistance of the first surface 740 a of the adhesive layer 740 .

[0151] In an embodiment, when the second conductive layer 730 is arranged on the second surface 710b of the base layer 710 and the first conductive layer 720 is arranged on the first surface 710a of the base layer 710, charge transfer from the adhesive layer 740 to the first conductive layer 720 or the second conductive layer 730 may be facilitated. Since the first conductive layer 720 positioned between the base layer 710 and the adhesive layer 740 includes a conductive material, the resistance of the first conductive layer 720 may be lower than the resistance of the adhesive layer 740. Accordingly, charges may move from the adhesive layer 740 toward the first conductive layer 720 in a vertical direction (e.g., z direction (specifically, -z direction)), and the surface resistance of the adhesive layer 740 may decrease. Accordingly, the adhesive layer 740 may have a low surface resistance without including PFAS. When the adhesive layer 740 of the protective film 700 is attached to the substrate 100 (see Figure 5 ) of the bottom display device DD (see Figure 5 ), electrostatic discharge defects can be reduced.

[0152] In an embodiment, the fluorine (F) content of the protective film 700 may be less than 0.25 ppb relative to the entire protective film 700. The F content of the protective film 700 may be greater than 0 and less than 0.25 ppb. In some embodiments, the protective film 700 may not include F.

[0153] Figure 7 2 is a cross-sectional view of a protective film 700 included in a display device according to an embodiment. Figure 7 The protective film 700 described herein includes Figure 6 Various aspects of the protective film 700 are described, and for the sake of brevity, repeated descriptions of similar elements are omitted. Figure 7 With reference Figure 6 The described embodiment is different in the configuration of the adhesive layer 740'. Hereinafter, the difference between the adhesive layer 740' and the adhesive layer 740 is mainly described, and the repeated description is omitted.

[0154] refer to Figure 7 , the protection film 700 may include a base layer 710 , a first conductive layer 720 , a second conductive layer 730 , and an adhesive layer 740 ′.

[0155] In an embodiment, the adhesive layer 740 ′ may include conductive molecules, polar molecules and / or zwitterions.

[0156] The adhesive layer 740' may include conductive molecules, such as poly(p-phenylene), polypyrrole, polythiophene, poly(p-phenylene), polyacetylene, polyaniline, poly(3,4-ethylenedioxythiophene), or PEDOT:PSS. Alternatively or additionally, the adhesive layer 740' may include polar molecules, such as polyoxyethylene alkylamine, polyoxyethylene alkylamine fatty acid ester, glycerol fatty acid ester, sorbitol fatty acid ester, polyoxyethylene sorbitol fatty acid ester, polyoxyethylene alkylphenyl ester, or polyoxyethylene glycol fatty acid ester. Alternatively or additionally, the adhesive layer 740' may include zwitterions, such as alkyl betaine.

[0157] In the example where the adhesive layer 740' includes such conductive molecules, polar molecules and / or zwitterions, the inclusion of such conductive molecules, polar molecules and / or zwitterions can promote the movement of charges in the direction from the adhesive layer 740' toward the first conductive layer 720 (e.g., the z direction (specifically, the -z direction)). Accordingly, in the example where the adhesive layer 740' includes conductive molecules, polar molecules and / or zwitterions, the surface resistance of the adhesive layer 740' can be reduced. The surface resistance of the adhesive layer 740' can refer to the surface resistance of the first surface 740'a of the adhesive layer 740'.

[0158] Figure 8 and Fig. 9 2 is a cross-sectional view of a protective film 700 included in a display device according to an embodiment. Figure 8 and Fig. 9 The protective film 700 described herein includes Figure 6 Various aspects of the protective film 700 are described, and for the sake of brevity, repeated descriptions of similar elements are omitted. Figure 8 and Fig. 9 yes Figure 6 , and hereinafter, the description will focus on the differences, and repeated descriptions will be omitted.

[0159] refer to Figure 8 , the protective film 700 may include a base layer 710 , a first conductive layer 720 , a second conductive layer 730 , and an adhesive layer 740 , and primer layers PR may be disposed on both sides of the first conductive layer 720 and both sides of the second conductive layer 730 , respectively.

[0160] Each of the primer layers PR may include a primer material such as, for example, acrylate resin, acrylic urethane, or epoxy urethane. The primer layers PR may increase interfacial adhesion between the first conductive layer 720 or the second conductive layer 730 and the base layer 710.

[0161] In an embodiment, Figure 8As shown in FIG. 1 , the primer layer PR is provided as a layer separated from the first conductive layer 720 and the second conductive layer 730, but the present disclosure is not limited thereto. Fig. 9 In another embodiment, the first conductive layer 720' may include a conductive polymer and / or a transparent conductive oxide. In some aspects, the first conductive layer 720' may further include a primer material. Similarly, for example, the second conductive layer 730' may include a conductive polymer and / or a transparent conductive oxide. The second conductive layer 730' may further include a primer material.

[0162] <Examples and Comparative Examples>

[0163] Hereinafter, various aspects supported by the present disclosure will be described in more detail by example embodiments and comparative examples. However, the following embodiments and comparative examples are intended to describe the present disclosure in more detail, and the scope of the present disclosure is not limited by the following embodiments and comparative examples. The following embodiments and comparative examples can be appropriately modified and changed by those skilled in the art within the scope of the present disclosure.

[0164] [Example 1]

[0165] The protective film 700 according to the embodiment may include a base layer 710, a first conductive layer 720, a second conductive layer 730, and an adhesive layer 740. The base layer 710 may include PET and may be formed to have a thickness of 75 μm. The first conductive layer 720 may include PEDOT:PSS and may include an acrylate resin as a primer material. The second conductive layer 730 may include PEDOT:PSS and may include an acrylate resin as a primer material. The first conductive layer 720 may be formed such that the thickness of the first conductive layer 720 is 0.06 μm, and the second conductive layer 730 may be formed such that the thickness of the second conductive layer 730 is 0.06 μm. The adhesive layer 740 may include an acrylic resin. The adhesive layer 740 may be formed such that the thickness of the adhesive layer 740 is 13 μm.

[0166] [Example 2]

[0167] The protective film 700 according to the embodiment may include a base layer 710, a first conductive layer 720, a second conductive layer 730, and an adhesive layer 740'. The base layer 710 may include PET, and may be formed such that the thickness of the base layer 710 is 75 μm. The first conductive layer 720 may include PEDOT:PSS, and may include an acrylate resin as a primer material. The second conductive layer 730 may include PEDOT:PSS, and may include an acrylate resin as a primer material. The first conductive layer 720 may be formed such that the thickness of the first conductive layer 720 is 0.06 μm, and the second conductive layer 730 may be formed such that the thickness of the second conductive layer 730 is 0.06 μm. The adhesive layer 740' may include an acrylic resin and an alkyl betaine that is a zwitter ion. The adhesive layer 740' may be formed such that the thickness of the adhesive layer 740' is 13 μm.

[0168] [Comparative Example]

[0169] The protective film according to the comparative example may include a base layer, a conductive layer and an adhesive layer. The adhesive layer may be arranged on a first surface of the base layer. The adhesive layer may be in direct contact with the first surface of the base layer. The conductive layer may be arranged on only one side of the base layer. The conductive layer may be arranged on a second surface positioned opposite to the first surface of the base layer. The base layer may include PET and may include silicon nanoparticles. The base layer may be formed so that the thickness of the base layer is 75 μm. The conductive layer may include PEDOT:PSS. The conductive layer may be formed so that the thickness of the conductive layer is 0.06 μm. The adhesive layer may include an acrylic resin and bis(trifluoromethanesulfonyl)imide having a content of 50 ppb of PFAS. The adhesive layer may be formed so that the thickness of the adhesive layer is 13 μm.

[0170] [Table 1]

[0171] Grouping Example 1 Example 2 Comparative Example Haze(%) 0.44 0.28 2.9

[0172] [Table 2]

[0173] Grouping Example 1 Example 2 Comparative Example Surface resistance (Ω / sq) <![CDATA[5.1×10 9 ]]> <![CDATA[2.1×10 7 ]]> <![CDATA[9.1×10 10 ]]>

[0174] Table 1 shows the results obtained by measuring the transparency of the protective films of Example 1, Example 2 and Comparative Example. The haze of the protective films of Example 1, Example 2 and Comparative Example was measured in a wavelength range of about 900 nm to about 1000 nm by using Lambda 1050+ (PerkinELmer) for haze measurement equipment.

[0175] By checking Table 1, it can be seen that the haze is reduced in Example 1 and Example 2 compared to the comparative example. According to the embodiment, since the base layer 710 of the protective film 700 does not exist (does not include) inorganic nanoparticles (such as silicon nanoparticles as an example) and organic nanoparticles, the transparency of the protective film 700 can be improved.

[0176] Table 2 shows the results obtained by measuring the surface resistance of the adhesive layer of the protective film of Example 1, Example 2 and Comparative Example. The surface resistance was measured at two randomly selected positions on the first surface of each of the adhesive layers, and the average value was obtained. The surface resistance was measured using TREK 152-1 and a test voltage of 100V.

[0177] Referring to Table 2, it can be seen that Example 1 and Example 2 have a surface resistance comparable to or less than that of the comparative example. According to the embodiment, since the first conductive layer 720 and the second conductive layer 730 are arranged on both sides of the base layer 710 of the protective film 700, and specifically, the first conductive layer 720 is arranged between the base layer 710 and the adhesive layer 740, the adhesive layer 740 can have a low surface resistance without including PFAS. Accordingly, the protective film 700 according to the embodiment can reduce the static electricity phenomenon. When the protective film 700 according to the embodiment is attached to the substrate 100 (see Figure 5 ) of the bottom display device DD (see Figure 5 ), electrostatic discharge defects can be reduced.

[0178] According to one or more embodiments of the present disclosure, since the protective film includes a base layer, a conductive layer arranged on both sides of the base layer, and an adhesive layer arranged on one side of the conductive layer, and the adhesive layer includes conductive molecules, polar molecules and / or zwitterions, a display device with reduced electrostatic discharge defects can be realized. However, the scope of the present disclosure is not limited by these effects.

[0179] Embodiments of the present disclosure support one or more processes (methods, flow charts) that support the features and embodiments described herein. According to the example aspects described herein, descriptions of elements "may be arranged," "may be formed," and the like include processes (methods, flow charts) and techniques for arranging, forming, placing, and modifying elements and the like.

[0180] It should be understood that the embodiments described herein should be considered in a descriptive sense and not for limiting purposes. The description of features or aspects within each embodiment should generally be considered as other similar features or aspects that can be used in other embodiments. Although one or more embodiments have been described with reference to the figures, it will be understood by those of ordinary skill in the art that various changes in form and detail may be made therein without departing from the spirit and scope as defined by the appended claims.

Claims

1. A display device, comprising: substrate; a display layer positioned on the first surface of the substrate and comprising a display element; as well as a protective film positioned on a second surface of the substrate, wherein the second surface of the substrate is opposite to the first surface of the substrate, and Wherein, the protective film comprises: transparent basal layer; a first conductive layer positioned on a first surface of the base layer; a second conductive layer positioned on a second surface of the base layer, wherein the second surface of the base layer is opposite to the first surface of the base layer; and An adhesive layer is between the first conductive layer and the substrate, wherein the adhesive layer comprises at least one of conductive molecules, polar molecules and zwitterions.

2. The display device according to claim 1, wherein: The base layer includes polyethylene terephthalate or polyimide.

3. The display device according to claim 1, wherein: The base layer is free of organic nanoparticles and inorganic nanoparticles.

4. The display device according to claim 1, wherein: The surface resistance of the first conductive layer is 30Ω / sq to 10 6 Ω / sq.

5. The display device according to claim 1, wherein: The first conductive layer and the second conductive layer each include a conductive polymer or a transparent conductive oxide.

6. The display device according to claim 1, wherein: The thickness of each of the first conductive layer and the second conductive layer is 0.01 μm to 0.5 μm.

7. The display device according to claim 1, wherein: The adhesive layer has a thickness of 3 μm to 30 μm.

8. The display device according to claim 1, wherein: The surface resistance of the adhesive layer is 10 3 Ω / sq to 10 10 Ω / sq.

9. The display device according to claim 1, wherein: The fluorine content of the protective film is less than 0.25 ppb.

10. A display device, comprising: substrate; a display element disposed on the front surface of the substrate; a packaging member, wherein the packaging member covers the display element; as well as a protective film disposed on a rear surface of the substrate, Wherein, the protective film comprises: transparent basal layer; a first conductive layer, the first conductive layer being arranged on a front surface of the base layer; a second conductive layer disposed on a rear surface of the base layer; and An adhesive layer is provided between the first conductive layer and the substrate, wherein the adhesive layer comprises at least one of conductive molecules, polar molecules and zwitterions, and the surface resistance of the adhesive layer is 10 10 Ω / sq or less.

11. The display device according to claim 10, wherein: The substrate includes a first region facing a first direction, a second region extending from the first region and facing a second direction different from the first direction, and a third region positioned between the first region and the second region; The display element is arranged on the first area; and The protection film includes a portion positioned in the first region and another portion spaced apart from the portion and positioned in the second region.

12. The display device according to claim 10, further comprising: an optical component, the optical component being on the packaging component; as well as A window is provided on the optical component.

13. The display device according to claim 10, wherein: The base layer includes polyethylene terephthalate or polyimide.

14. The display device according to claim 10, wherein: The base layer is free of organic nanoparticles and inorganic nanoparticles.

15. The display device according to claim 10, wherein: The surface resistance of the first conductive layer is 30Ω / sq to 10 6 Ω / sq.

16. The display device according to claim 10, wherein: The first conductive layer and the second conductive layer each include a conductive polymer or a transparent conductive oxide.

17. The display device according to claim 10, wherein: The first conductive layer and the second conductive layer each have a thickness of 0.01 μm to 0.5 μm.

18. The display device according to claim 10, wherein: The adhesive layer has a thickness of 3 μm to 30 μm.

19. The display device according to claim 10, wherein: The surface resistance of the adhesive layer is 10 3 Ω / sq to 10 10 Ω / sq.

20. The display device according to claim 10, wherein: The fluorine content of the protective film is less than 0.25 ppb.

Images