Horizontal type wafer batch cleaning apparatus

Abstract

The application discloses a horizontal wafer centralized cleaning equipment and relates to the technical field of wafer cleaning. The application can sequentially clean the wafer body in multiple cleaning liquids, is more efficient in cleaning efficiency, drives the nozzle to reciprocate through the spray pipe, thereby avoiding impurity adhesion in the cleaning process, drives the wafer body to rotate while cleaning the wafer body, can realize sufficient cleaning of the wafer body, effectively cleans the wafer body, and improves the cleaning effect.

Description

Technical Field

[0001] This invention relates to the field of wafer cleaning technology, and more particularly to a horizontal centralized wafer cleaning device. Background Technology

[0002] A wafer is a circular piece of high-purity silicon material used to manufacture silicon semiconductor circuits. The manufacturing process begins with polycrystalline silicon raw material, which is purified, dissolved, and doped with silicon seed crystals. This is then slowly stretched into a cylindrical single-crystal silicon rod. Next, this silicon rod undergoes meticulous grinding, polishing, and slicing processes to finally obtain the wafer we know today. Currently, the mainstream wafer sizes in China are 8 inches and 12 inches. In the later stages of wafer fabrication, removing the adhesive and impurities from the wafer surface is a crucial step, preparing it for subsequent dicing and processing.

[0003] Existing wafer cleaning methods typically require robotic arms to repeatedly grip the wafer and place it into different cleaning tanks for cleaning. This reduces work efficiency, is time-consuming and labor-intensive, and repeated gripping can easily cause irreversible damage to the wafer. It also significantly delays cleaning time and reduces cleaning efficiency. Furthermore, existing wafer cleaning methods leave cleaning solution residues, resulting in insufficient cleaning effectiveness. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a horizontal wafer centralized cleaning device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A horizontal wafer centralized cleaning device includes a base, a vertical frame fixedly connected to the upper end of the base, a movable groove provided on the side wall of the vertical frame, a movable plate provided inside the movable groove, an electric telescopic rod installed on the top of the vertical frame, the telescopic end of the electric telescopic rod penetrating downward through the vertical frame and fixedly connected to the upper end of the movable plate, two sliding rods vertically provided inside the movable groove, the sliding rods penetrating through the movable plate and slidably connected to the movable plate, the two ends of the sliding rods being fixedly connected to the inner top wall and inner bottom wall of the movable groove respectively, a cleaning assembly provided at the lower end of the movable plate, a first device cavity provided inside the base, a rotating column rotatably connected to the inner bottom wall of the first device cavity, the upper end of the rotating column penetrating through the inner top wall of the first device cavity and fixedly connected to a turntable, four cleaning boxes fixedly located at the upper end of the turntable, the four cleaning boxes being evenly distributed circumferentially along the upper end of the turntable, and a reversing assembly connected to the rotating column and the movable plate being provided inside the first device cavity.

[0007] As a further improvement of the present invention, the cleaning assembly includes a mounting plate fixedly connected to the lower end of the movable plate. The lower end of the mounting plate is provided with a swing cavity and a device slot. Two side plates are fixed to the lower end of the mounting plate. The two side plates are respectively located on both sides of the swing cavity. A loading mechanism is provided between the two side plates. A rinsing mechanism is provided inside the swing cavity. A driving mechanism connected to the rinsing mechanism is provided inside the device slot. A second device cavity is provided inside the side plate located below the device slot. A linkage mechanism connected to the driving mechanism and the loading mechanism is provided inside the second device cavity.

[0008] As a further improvement of the present invention, the reversing assembly includes a first rack disposed inside the first device cavity, a first gear mounted on the side wall of the rotating column via a one-way bearing, the first gear meshing with the first rack, a traction rope fixedly connected to one end of the first rack, the end of the traction rope away from the first rack passing through the base and fixedly connected to the lower end of the moving plate, a first spring disposed inside the first device cavity, one end of the first spring fixedly connected to the inner wall of the first device cavity, and the other end of the first spring fixedly connected to the end of the first rack.

[0009] As a further improvement of the present invention, the rinsing mechanism includes multiple nozzles arranged horizontally inside the swing cavity. Multiple nozzles are arranged on the lower sidewall of each nozzle. One end of each nozzle is rotatably connected to the inner wall of the swing cavity, and the other end of each nozzle penetrates the inner wall of the swing cavity and extends to the outside of the mounting plate. An air tank is provided at the upper end of the base, and an air valve is connected to the air tank. An air supply pipe is connected to the output end of the air valve. The end of the air supply pipe away from the air valve is connected to the nozzle. A second gear is fixedly sleeved on the sidewall of the nozzle. A second rack is horizontally arranged inside the swing cavity, meshing with the second gear. A movable groove is provided on the inner wall of the swing cavity. One end of the second rack is slidably inserted into the movable groove, and the other end of the second rack penetrates the inner wall of the swing cavity and extends into the device groove. The second rack is slidably connected to the inner wall of the swing cavity. A second spring is provided inside the movable groove, with one end of the second spring fixedly connected to the end of the second rack, and the other end of the second spring fixedly connected to the inner wall of the movable groove.

[0010] As a further improvement of the present invention, the driving mechanism includes a motor mounted on the inner wall of the device slot, the output shaft of the motor is fixedly connected to a first rotating shaft, the end of the first rotating shaft away from the motor is rotatably connected to the inner wall of the device slot, a turntable is fixedly sleeved on the first rotating shaft, and a plurality of extrusion protrusions are fixed on the side wall of the turntable near the second rack, and the plurality of extrusion protrusions are evenly distributed along the circumferential direction of the side wall of the turntable.

[0011] As a further improvement of the present invention, the linkage mechanism includes a second rotating shaft rotatably connected to the inner wall of the second device cavity, the second rotating shaft passing through the inner wall of the second device cavity and extending to the outside of the side plate, a third gear being fixedly connected to one end of the second rotating shaft located outside the side plate, a second sprocket being fixedly sleeved on the side wall of the second rotating shaft located inside the second device cavity, a first sprocket being fixedly sleeved on the first rotating shaft, and the first sprocket and the second sprocket being connected by a transmission chain.

[0012] As a further improvement of the present invention, the loading mechanism includes a placement frame, the upper end of which is provided with a plurality of placement slots, each placement slot containing a wafer body. Connecting blocks are fixedly connected to the left and right side walls of the placement frame, and connecting seats are fixedly connected to the side walls of the two side plates. The two connecting blocks are respectively located inside the two connecting seats. A third rotating shaft is provided through the interior of the placement frame. One end of the third rotating shaft is rotatably connected to the interior of the placement frame, and the other end of the third rotating shaft extends out of the placement frame and is fixedly connected to a third gear and a fourth gear. The fourth gear meshes with the third gear. A plurality of friction rollers are fixedly sleeved on the side wall of the third rotating shaft. The plurality of friction rollers extend into the interior of the plurality of placement slots and are in contact with the bottom of the wafer body.

[0013] As a further improvement of the present invention, a limiting groove is provided on the inner wall of the first device cavity, and the end of the first rack away from the traction rope is slidably inserted into the interior of the limiting groove. A reversing wheel is installed inside the base, and the traction rope is wound around the reversing wheel.

[0014] As a further improvement of the present invention, the base is provided with a mounting hole near the rotating column, the mounting hole is provided with a positioning block, the side wall of the rotating column is provided with four positioning grooves that cooperate with the positioning block, the four positioning grooves are equally spaced along the circumference of the rotating column, the mounting hole is provided with a third spring, one end of the third spring is fixedly connected to the positioning block, and the other end of the third spring is fixedly connected to the inner wall of the mounting hole.

[0015] The beneficial effects of this invention are:

[0016] 1. By setting up multiple cleaning boxes and adding different cleaning solutions to them, the wafer body can be cleaned sequentially in multiple cleaning solutions by rotating the turntable, resulting in higher cleaning efficiency.

[0017] 2. By moving the moving plate upward, the wafer body is moved out of the cleaning box. The reversing mechanism drives the rotating column to rotate, which in turn drives the turntable to rotate. This allows the cleaning box position to be automatically changed after each wafer body cleaning.

[0018] 3. By setting up a drive mechanism and a rinsing mechanism, the drive mechanism can drive the second rack to move back and forth, and the reciprocating movement of the second rack can drive the nozzle to swing back and forth, which in turn drives the nozzle to swing back and forth, thereby preventing impurities from sticking together during the cleaning process, while effectively cleaning the wafer body and improving the cleaning effect.

[0019] 4. By setting up a loading mechanism and a linkage mechanism, the linkage mechanism can drive the wafer body inside the placement rack to rotate. Thus, while cleaning the wafer body, the wafer body is driven to rotate, which can achieve thorough cleaning of the wafer body and further improve the cleaning effect. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of a horizontal wafer centralized cleaning device proposed in this invention;

[0021] Figure 2 This is a schematic diagram of the cleaning component of a horizontal wafer centralized cleaning device proposed in this invention;

[0022] Figure 3 This is a three-dimensional structural diagram of the base, turntable, cleaning box, vertical frame, moving trough, moving plate, slide bar, and electric telescopic rod of a horizontal wafer centralized cleaning equipment proposed in this invention.

[0023] Figure 4 This is a three-dimensional structural diagram of the mounting plate, side plate, and connecting seat of a horizontal wafer centralized cleaning equipment proposed in this invention;

[0024] Figure 5 This is a schematic diagram of the structure of the turntable and extrusion bumps in a horizontal wafer centralized cleaning device proposed in this invention;

[0025] Figure 6 for Figure 1 Enlarged view of point A in the middle.

[0026] In the diagram: 1. Base, 2. Vertical frame, 3. Moving groove, 4. Slide rod, 5. Traction rope, 6. Moving plate, 7. Electric telescopic rod, 8. Mounting plate, 9. Air supply pipe, 10. Air tank, 11. Air valve, 12. Cleaning box, 13. Turntable, 14. Rotating column, 15. Limiting groove, 16. First gear, 17. First rack, 18. First device cavity, 19. First spring, 20. Directional wheel, 21. Swinging cavity, 22. Moving groove, 23. Second spring, 24. Second rack, 25. Second gear, 26. Nozzle, 27. Nozzle 28 Device slot, 29 Turntable, 30 First rotating shaft, 31 Motor, 32 First sprocket, 33 Transmission chain, 34 Side plate, 35 Second device cavity, 36 Second sprocket, 37 Second rotating shaft, 38 Third gear, 39 Fourth gear, 40 Third rotating shaft, 41 Friction roller, 42 Placement rack, 43 Placement slot, 44 Connecting block, 45 Connecting seat, 46 Wafer body, 47 Extrusion bump, 48 Mounting hole, 49 Third spring, 50 Positioning block, 51 Positioning slot. Detailed Implementation

[0027] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0028] Reference Figures 1-6A horizontal wafer centralized cleaning device includes a base 1, a vertical frame 2 fixedly connected to the upper end of the base 1, a movable groove 3 provided on the side wall of the vertical frame 2, a movable plate 6 provided inside the movable groove 3, an electric telescopic rod 7 installed on the top of the vertical frame 2, the telescopic end of the electric telescopic rod 7 passing downward through the vertical frame 2 and fixedly connected to the upper end of the movable plate 6, two sliding rods 4 vertically provided inside the movable groove 3, the sliding rods 4 passing through the movable plate 6 and slidably connected to the movable plate 6, the two ends of the sliding rods 4 being fixedly connected to the inner top wall and inner bottom wall of the movable groove 3 respectively, a cleaning assembly provided at the lower end of the movable plate 6, a first device cavity 18 provided inside the base 1, a rotating column 14 rotatably connected to the inner bottom wall of the first device cavity 18, the upper end of the rotating column 14 passing through the inner top wall of the first device cavity 18 and fixedly connected to a turntable 13, and mounting holes near the rotating column 14 provided inside the base 1. 48. The mounting hole 48 is provided with a positioning block 50. The side wall of the rotating column 14 is provided with four positioning grooves 51 that cooperate with the positioning block 50. The four positioning grooves 51 are evenly spaced along the circumference of the rotating column 14. The mounting hole 48 is provided with a third spring 49. One end of the third spring 49 is fixedly connected to the positioning block 50, and the other end of the third spring 49 is fixedly connected to the inner wall of the mounting hole 48. The rotating column 14 can be positioned and fixed by the positioning block 50 engaging in the positioning groove 51, thereby ensuring the stability of the turntable 13 and the stability of the cleaning box 12 above the turntable 13. Four cleaning boxes 12 are fixed at the upper end of the turntable 13. The four cleaning boxes 12 are evenly distributed along the circumference of the upper end of the turntable 13. Different cleaning liquids are stored in the cleaning boxes 12. The first device cavity 18 is provided with a reversing assembly connected to the rotating column 14 and the moving plate 6.

[0029] In this invention, the cleaning assembly includes a mounting plate 8 fixedly connected to the lower end of a movable plate 6. The lower end of the mounting plate 8 is provided with a swing cavity 21 and a device groove 28. Two side plates 34 are fixed to the lower end of the mounting plate 8. The two side plates 34 are respectively located on both sides of the swing cavity 21. A loading mechanism is provided between the two side plates 34. A rinsing mechanism is provided inside the swing cavity 21. A driving mechanism connected to the rinsing mechanism is provided inside the device groove 28. A second device cavity 35 is provided inside the side plate 34 located below the device groove 28. A linkage mechanism connected to the driving mechanism and the loading mechanism is provided inside the second device cavity 35.

[0030] Reference Figure 1The reversing assembly includes a first rack 17 disposed inside the first device cavity 18. A first gear 16 is mounted on the side wall of the rotating column 14 via a one-way bearing. The first gear 16 meshes with the first rack 17. When the first rack 17 moves to the left, the first gear 16 rotates. At this time, the one-way bearing will not drive the rotating column 14 to rotate. When the first rack 17 moves to the right, the first gear 16 rotates. At this time, the one-way bearing will drive the rotating column 14 to rotate, which in turn drives the turntable 13 to rotate. One end of the first rack 17 is fixedly connected to a traction rope 5. The end of the traction rope 5 away from the first rack 17 passes through the base 1 and is fixedly connected to the lower end of the moving plate 6. A first spring 19 is disposed inside the first device cavity 18. One end of the first spring 19 is fixedly connected to the inner wall of the first device cavity 18, and the other end of the first spring 19 is fixedly connected to the end of the first rack 17.

[0031] The rinsing mechanism includes multiple nozzles 26 arranged horizontally inside the swing chamber 21. Multiple nozzles 27 are arranged on the lower sidewall of each nozzle 26. One end of each nozzle 26 is rotatably connected to the inner wall of the swing chamber 21, and the other end of each nozzle 26 penetrates the inner wall of the swing chamber 21 and extends to the outside of the mounting plate 8. An air tank 10 is located at the upper end of the base 1, and an air valve 11 is connected to the air tank 10. An air supply pipe 9 is connected to the output end of the air valve 11. The end of the air supply pipe 9 away from the air valve 11 is connected to the nozzle 26. A second gear 25 is fixedly sleeved on the sidewall of the nozzle 26. The interior of the 1 is horizontally provided with a second rack 24 that meshes with the second gear 25. The inner wall of the swing cavity 21 is provided with a movable groove 22. One end of the second rack 24 is slidably inserted into the interior of the movable groove 22, and the other end of the second rack 24 passes through the inner wall of the swing cavity 21 and extends into the interior of the device groove 28. The second rack 24 is slidably connected to the inner wall of the swing cavity 21. The interior of the movable groove 22 is provided with a second spring 23. One end of the second spring 23 is fixedly connected to the end of the second rack 24, and the other end of the second spring 23 is fixedly connected to the inner wall of the movable groove 22.

[0032] The drive mechanism includes a motor 31 mounted on the inner wall of the device slot 28. The output shaft of the motor 31 is fixedly connected to a first rotating shaft 30. The end of the first rotating shaft 30 away from the motor 31 is rotatably connected to the inner wall of the device slot 28. A turntable 29 is fixedly sleeved on the first rotating shaft 30. Multiple pressing protrusions 47 are fixed on the side wall of the turntable 29 near the second rack 24. The multiple pressing protrusions 47 are evenly distributed along the circumference of the side wall of the turntable 29. When the pressing protrusions 47 press against the second rack 24, the second rack 24 can move. When the pressing protrusions 47 separate from the second rack 24, the elastic force of the second spring 23 can act on the second rack 24, causing the second rack 24 to reset and move.

[0033] The linkage mechanism includes a second rotating shaft 37 rotatably connected to the inner wall of the second device cavity 35. The second rotating shaft 37 passes through the inner wall of the second device cavity 35 and extends to the outside of the side plate 34. A third gear 38 is fixedly connected to one end of the second rotating shaft 37 outside the side plate 34. A second sprocket 36 is fixedly sleeved on the side wall of the second rotating shaft 37 inside the second device cavity 35. A first sprocket 32 ​​is fixedly sleeved on the first rotating shaft 30. The first sprocket 32 ​​and the second sprocket 36 are connected by a transmission chain 33.

[0034] The loading mechanism includes a placement rack 42, with multiple placement slots 43 arranged at the upper end of the placement rack 42. Ball bearings are embedded in the inner walls of the placement slots 43 for positioning the wafer body 46. Each placement slot 43 contains a wafer body 46. Connecting blocks 44 are fixedly connected to the left and right side walls of the placement rack 42. Connecting seats 45 are fixedly connected to the side walls of the two side plates 34. The connecting blocks 44 are rectangular blocks, and the connecting seats 45 have rectangular slots that mate with the connecting blocks 44. The two connecting blocks 44 are located on two connecting... Inside the receiving base 45, a third rotating shaft 40 is provided through the interior of the placement rack 42. One end of the third rotating shaft 40 is rotatably connected to the interior of the placement rack 42, and the other end of the third rotating shaft 40 extends out of the placement rack 42 and is fixedly connected to a third gear 38 and a fourth gear 39. The fourth gear 39 meshes with the third gear 38. Multiple friction rollers 41 are fixedly sleeved on the side wall of the third rotating shaft 40. The multiple friction rollers 41 extend into the interior of multiple placement slots 43, and the friction rollers 41 are in contact with the bottom of the wafer body 46.

[0035] The inner wall of the first device cavity 18 is provided with a limiting groove 15. The end of the first rack 17 away from the traction rope 5 is slidably inserted into the interior of the limiting groove 15. The base 1 is equipped with a reversing wheel 20, and the traction rope 5 is wound around the reversing wheel 20.

[0036] When using this invention, the wafer body 46 is placed inside the placement slot 43, then the placement rack 42 is placed between the two side plates 34, and then the connecting block 44 is inserted into the connecting seat 45 to complete the loading of the wafer body 46. At this time, the third gear 38 and the fourth gear 39 mesh.

[0037] Then, the electric telescopic rod 7 is activated to extend, causing the moving plate 6 to move downwards, which in turn causes the mounting plate 8 to move downwards. This allows the placement rack 42 and the wafer body 46 to move into the cleaning box 12. Simultaneously, the nozzle 27 is inserted into the cleaning fluid in the cleaning box 12. The air valve 11 is activated to discharge the high-pressure gas from the air tank 10 and spray it into the cleaning fluid through the nozzle 27. This allows the airflow to carry the cleaning fluid and rinse the wafer body 46. The motor 31 is activated to drive the first rotating shaft 30 to rotate. The first rotating shaft 30 drives the turntable 29 to rotate, which in turn causes the extrusion protrusion 47 to intermittently extrude the second rack 24, causing the second rack 24 to reciprocate. Since the second rack 24 meshes with the second gear 25, it drives the second gear 25 to reciprocate, which in turn drives the nozzle 26 to oscillate back and forth. This, in turn, drives the nozzle 27 to oscillate back and forth, thus preventing impurities from adhering during the cleaning process and effectively cleaning the wafer body 46, improving the cleaning effect.

[0038] When the first rotating shaft 30 rotates, it can drive the first sprocket 32 ​​to rotate. Through the transmission action of the transmission chain 33, it can drive the second sprocket 36 to rotate, which in turn drives the second rotating shaft 37 to rotate. The second rotating shaft 37 drives the third gear 38 to rotate. Since the third gear 38 meshes with the fourth gear 39, it can drive the third rotating shaft 40 to rotate. The third rotating shaft 40 drives the friction roller 41 to rotate. Through the friction force of the friction roller 41 contacting the wafer body 46, it can drive the wafer body 46 inside the placement rack 42 to rotate. Thus, while cleaning the wafer body 46, it drives the wafer body 46 to rotate, which can achieve thorough cleaning of the wafer body 46 and further improve the cleaning effect.

[0039] After cleaning is completed, the electric telescopic rod 7 is retracted, which moves the moving plate 6 upward and moves the wafer body 46 out of the cleaning box 12. During the upward movement of the moving plate 6, the first rack 17 is pulled by the traction rope 5. When the first rack 17 moves, it can drive the first gear 16 to rotate. At this time, the one-way bearing can drive the rotating column 14 to rotate. The rotating column 14 drives the turntable 13 to rotate. The rotation of the turntable 13 drives the cleaning box 12 to rotate. Thus, the position of the cleaning box 12 can be automatically changed after each cleaning of the wafer body 46.

[0040] Repeat the above process to perform the next cleaning of the wafer body 46.

[0041] The above are merely preferred embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A horizontal wafer centralized cleaning device, comprising a base (1), characterized in that, A vertical frame (2) is fixedly connected to the upper end of the base (1). A movable groove (3) is provided on the side wall of the vertical frame (2). A movable plate (6) is provided inside the movable groove (3). An electric telescopic rod (7) is installed on the top of the vertical frame (2). The telescopic end of the electric telescopic rod (7) passes downward through the vertical frame (2) and is fixedly connected to the upper end of the movable plate (6). Two sliding rods (4) are vertically provided inside the movable groove (3). The sliding rods (4) pass through the movable plate (6) and are slidably connected to the movable plate (6). The two ends of the sliding rods (4) are respectively fixedly connected to the inner top wall and the inner wall of the movable groove (3). On the bottom wall, the lower end of the movable plate (6) is provided with a cleaning assembly. The base (1) is provided with a first device cavity (18). A rotating column (14) is rotatably connected to the inner bottom wall of the first device cavity (18). The upper end of the rotating column (14) penetrates the inner top wall of the first device cavity (18) and is fixedly connected to a turntable (13). Four cleaning boxes (12) are fixed at the upper end of the turntable (13). The four cleaning boxes (12) are evenly distributed along the upper circumference of the turntable (13). The interior of the first device cavity (18) is provided with a reversing assembly connected to the rotating column (14) and the movable plate (6). The cleaning assembly includes a mounting plate (8) fixedly connected to the lower end of the movable plate (6). The lower end of the mounting plate (8) is provided with a swing cavity (21) and a device groove (28). The lower end of the mounting plate (8) is fixed with two side plates (34). The two side plates (34) are respectively located on both sides of the swing cavity (21). A loading mechanism is provided between the two side plates (34). A rinsing mechanism is provided inside the swing cavity (21). A drive mechanism connected to the rinsing mechanism is provided inside the device groove (28). A second device cavity (35) is provided inside the side plate (34) located below the device groove (28). A linkage mechanism connected to the drive mechanism and the loading mechanism is provided inside the second device cavity (35). The moving plate moves upward, causing the wafer body to be removed from the cleaning box. The reversing mechanism drives the rotating column to rotate, which in turn drives the turntable to rotate. The driving mechanism drives the nozzles of the rinsing mechanism to oscillate back and forth. The driving mechanism drives the linkage mechanism, which in turn drives the wafer body inside the placement rack to rotate.

2. The horizontal wafer centralized cleaning equipment according to claim 1, characterized in that, The reversing assembly includes a first rack (17) disposed inside the first device cavity (18). A first gear (16) is mounted on the side wall of the rotating column (14) via a one-way bearing. The first gear (16) meshes with the first rack (17). A traction rope (5) is fixedly connected to one end of the first rack (17). The end of the traction rope (5) away from the first rack (17) passes through the base (1) and is fixedly connected to the lower end of the moving plate (6). A first spring (19) is disposed inside the first device cavity (18). One end of the first spring (19) is fixedly connected to the inner wall of the first device cavity (18), and the other end of the first spring (19) is fixedly connected to the end of the first rack (17).

3. The horizontal wafer centralized cleaning equipment according to claim 1, characterized in that, The flushing mechanism includes multiple nozzles (26) arranged horizontally inside the swing cavity (21). Multiple nozzles (27) are arranged on the lower sidewall of each nozzle (26). One end of each nozzle (26) is rotatably connected to the inner wall of the swing cavity (21), and the other end of each nozzle (26) penetrates the inner wall of the swing cavity (21) and extends to the outside of the mounting plate (8). An air tank (10) is provided at the upper end of the base (1). An air valve (11) is connected to the air tank (10). An air supply pipe (9) is connected to the output end of the air valve (11). The end of the air supply pipe (9) away from the air valve (11) is connected to the nozzle (26). A second gear (25) is fixedly sleeved on the sidewall of the nozzle (26). The swing cavity (21) is horizontally provided with a second rack (24) that meshes with the second gear (25). The inner wall of the swing cavity (21) is provided with a movable groove (22). One end of the second rack (24) is slidably inserted into the inside of the movable groove (22). The other end of the second rack (24) passes through the inner wall of the swing cavity (21) and extends into the inside of the device groove (28). The second rack (24) is slidably connected to the inner wall of the swing cavity (21). The movable groove (22) is provided with a second spring (23). One end of the second spring (23) is fixedly connected to the end of the second rack (24), and the other end of the second spring (23) is fixedly connected to the inner wall of the movable groove (22).

4. A horizontal wafer centralized cleaning device according to claim 3, characterized in that, The drive mechanism includes a motor (31) mounted on the inner wall of the device slot (28). The output shaft of the motor (31) is fixedly connected to a first rotating shaft (30). The end of the first rotating shaft (30) away from the motor (31) is rotatably connected to the inner wall of the device slot (28). A turntable (29) is fixedly sleeved on the first rotating shaft (30). A plurality of extrusion protrusions (47) are fixed on the side wall of the turntable (29) near the second rack (24). The plurality of extrusion protrusions (47) are evenly distributed along the circumferential direction of the side wall of the turntable (29).

5. A horizontal wafer centralized cleaning device according to claim 4, characterized in that, The linkage mechanism includes a second rotating shaft (37) rotatably connected to the inner wall of the second device cavity (35). The second rotating shaft (37) passes through the inner wall of the second device cavity (35) and extends to the outside of the side plate (34). A third gear (38) is fixedly connected to one end of the second rotating shaft (37) outside the side plate (34). A second sprocket (36) is fixedly sleeved on the side wall of the second rotating shaft (37) inside the second device cavity (35). A first sprocket (32) is fixedly sleeved on the first rotating shaft (30). The first sprocket (32) and the second sprocket (36) are connected by a transmission chain (33).

6. A horizontal wafer centralized cleaning device according to claim 5, characterized in that, The loading mechanism includes a placement rack (42), with multiple placement slots (43) arranged on the upper end of the placement rack (42). Each placement slot (43) contains a wafer body (46). Connecting blocks (44) are fixedly connected to the left and right side walls of the placement rack (42). Connecting seats (45) are fixedly connected to the side walls of the two side plates (34). The two connecting blocks (44) are located inside the two connecting seats (45). A third rotating shaft (40) passes through the interior of the placement rack (42). One end of the third rotating shaft (40) is rotatably connected to the inside of the placement rack (42), and the other end of the third rotating shaft (40) extends out of the placement rack (42) and is fixedly connected to a third gear (38). It also includes a fourth gear (39) meshing with the third gear (38). Multiple friction rollers (41) are fixedly sleeved on the side wall of the third rotating shaft (40). The multiple friction rollers (41) extend into the inside of multiple placement slots (43) respectively, and the friction rollers (41) are in contact with the bottom of the wafer body (46).

7. A horizontal wafer centralized cleaning device according to claim 2, characterized in that, The inner wall of the first device cavity (18) is provided with a limiting groove (15). The end of the first rack (17) away from the traction rope (5) is slidably inserted into the interior of the limiting groove (15). The base (1) is equipped with a reversing wheel (20), and the traction rope (5) is wound around the reversing wheel (20).

8. A horizontal wafer centralized cleaning device according to claim 1, characterized in that, The base (1) has an installation hole (48) near the rotating column (14) inside. The installation hole (48) has a positioning block (50) inside. The side wall of the rotating column (14) has four positioning grooves (51) that cooperate with the positioning block (50). The four positioning grooves (51) are evenly spaced along the circumference of the rotating column (14). The installation hole (48) has a third spring (49) inside. One end of the third spring (49) is fixedly connected to the positioning block (50), and the other end of the third spring (49) is fixedly connected to the inner wall of the installation hole (48).

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