Intelligent silver wire bonding system for efficient power supply power management
By designing an intelligent silver wire bonding system with efficient power management, the problems of insufficient power management and poor equipment temperature processing in the existing technology are solved, and efficient management of high-power consumption equipment and system stability are improved.
Patent Information
- Application Number
- CN202510162749.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-14
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2045-02-14
AI Technical Summary
The existing silver wire bonding systems are not efficient enough in power management, especially when dealing with high-power consumption equipment, and the processing of equipment temperature needs to be improved.
An intelligent silver wire bonding system with efficient power management is designed, including load, load detection module, power module, power catalytic module and power management module. The system detects the total power and sub-power of the load through the load detection module. The power management module adaptively adjusts the hierarchical voltage with the sub-power, and optimizes the power output through the power catalytic module to accurately control the voltage output of each unit.
It realizes efficient power management of high-power consumption equipment, improves the stability and efficiency of the system, maximizes the use of limited power resources, and improves the service life of the equipment by optimizing the heat generation of the high-frequency vibration unit.
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Figure CN119673830A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of silver wire bonding, and in particular to an intelligent silver wire bonding system with efficient power management. Background Art
[0002] Silver wire bonding is a microelectronic packaging technology that is mainly used to connect chips to external circuits during the manufacturing process of semiconductor devices. This technology involves connecting tiny silver wires (usually with a diameter of several microns to tens of microns) to the pads of the chip through thermal compression or ultrasonic bonding, and then connecting them to the external circuit board.
[0003] The key steps of silver wire bonding technology include selecting a suitable silver wire, whose diameter and material must meet specific electrical and mechanical performance requirements; coating a layer of solder or adhesive on the chip's pad to enhance the connection strength between the silver wire and the chip; using a precision mechanical device to place the silver wire between the chip pad and the external circuit board; and forming a strong connection between the silver wire and the pad through heat pressing or ultrasonic bonding. Thermocompression bonding uses heat and pressure to fuse the silver wire to the pad, while ultrasonic bonding uses the energy generated by ultrasonic vibrations to achieve connection. After bonding is completed, the connection needs to be inspected and tested to ensure that its electrical performance and mechanical strength meet the requirements.
[0004] The intelligent silver wire bonding system uses an intelligent control algorithm to monitor the power supply in real time and adjust the power output according to the actual needs of the equipment. The system also integrates high-precision sensors for real-time monitoring of key parameters such as power supply power, current, and voltage, providing accurate data support for the intelligent control algorithm. In addition, the system can also intelligently adjust the bonding parameters of the silver wire, such as bonding pressure, temperature, etc., according to the real-time monitored power supply and current requirements to optimize the connection performance. At the same time, the system has fault detection and diagnosis functions, which can monitor abnormal conditions during the bonding process in real time and troubleshoot in a timely manner to ensure the stable operation of the system.
[0005] Although the existing silver wire bonding system can perform silver wire bonding operations normally, the power management is not efficient enough, especially when dealing with high-power consumption devices, and the handling of device temperature needs to be improved. Summary of the invention
[0006] The present invention provides an intelligent silver wire bonding system with efficient power management, which is used to solve the defects in the prior art that power management is not efficient enough, especially when processing high power consumption equipment, and the processing of equipment temperature needs to be improved.
[0007] In one aspect, the present invention provides an intelligent silver wire bonding system for efficient power management of power supply, comprising: a load, a load detection module, a power supply module, a power catalysis module and a power management module; The load is used to solder the silver bonding wire; The load detection module is used to detect the total power of the load and the power distribution of each unit in the load; The power module is used to provide initial voltage to the power catalytic module; The power catalytic module is used to grade the initial voltage and output the graded voltage;
[0008] The power management module is used to combine the divided power, adaptively adjust the graded voltage, and calculate the divided voltage set required by the load.
[0009] According to an intelligent silver wire bonding system with high-efficiency power management provided by the present invention, the load includes: a wire supply unit, a welding unit, a high-frequency vibration unit, a pressure control unit, and a temperature control unit; The wire supply unit is used to supply the bonding silver wire to the welding unit; The welding unit is used to weld the bonding silver wire; The high-frequency vibration unit is used to provide welding heat energy for silver wire bonding; The pressure control unit is used to provide contact pressure for the bonding silver wire; The temperature control unit is used to adjust the welding heat energy of the high-frequency vibration unit.
[0010] According to an intelligent silver wire bonding system with efficient power management provided by the present invention, the load detection module includes a load sniffing unit and a power calculation unit; The load sniffing unit is used to sniff the number of sub-units and node information of the load; The power calculation unit is used to calculate the working power and standby power of the subunit in combination with the node information.
[0011] According to an intelligent silver wire bonding system for efficient power management provided by the present invention, the power catalytic module includes a primary conversion unit, an intermediate conversion unit, a final conversion unit and a feedback control unit; The primary conversion unit is used to eliminate the noise voltage in the initial voltage and output the intermediate voltage required by the intermediate conversion unit; The intermediate conversion unit is used to adjust the intermediate voltage according to the rated voltage of the load and output the callback voltage; The final conversion unit is used to output the compensation voltage, fine-tune the callback voltage, and output the graded voltage to the load; The feedback control unit is used to monitor the real-time change of the initial voltage, and adjust the voltage conversion ratio and the compensation voltage of the intermediate conversion unit to keep the callback voltage constant.
[0012] According to an intelligent silver wire bonding system with high-efficiency power management provided by the present invention, the calculation formula of the noise voltage is expressed as: ; Where V md is the intermediate voltage, V in is the initial voltage, V n is the noise voltage.
[0013] According to an intelligent silver wire bonding system for efficient power management provided by the present invention, the power catalytic module also includes a current control unit, and the current control unit is used to adjust the graded current received by the load in combination with the graded voltage.
[0014] According to an intelligent silver wire bonding system with efficient power management provided by the present invention, the power management module includes a power integration unit, a control strategy unit and an automatic adjustment unit; The power integration unit is used to combine the working power and the standby power to output a hierarchical collection of power; The control strategy unit is used to combine the power classification set to prioritize and limit the load; The automatic adjustment unit is used to send priority allocation and power limit information to the current control unit to adjust the graded current.
[0015] According to an intelligent silver wire bonding system with efficient power management provided by the present invention, the specific steps of the control strategy unit performing priority allocation and power limitation include: Priority scoring is performed on each unit in the load based on the power distribution of each unit in the load and the working status of each unit in the load, and the scoring value is output; Different power transmission is performed according to the priority of each unit; the higher the priority, the closer the transmitted power is to the maximum rated power of each unit; when the priority is low, the closer the transmitted power is to the minimum rated power value of each unit, and the lowest is the minimum rated power value.
[0016] According to an intelligent silver wire bonding system with high-efficiency power management provided by the present invention, the specific steps of adjusting the welding heat energy by the temperature control unit include: Set the rated temperature required for silver wire bonding; Use thermocouples to measure the real-time temperature of the solder joint; Combining the real-time temperature with the rated temperature, a PID control method is used to adjust the output power of the high-frequency vibration unit to adjust the heat generation of the high-frequency vibration unit.
[0017] An intelligent silver wire bonding system with high-efficiency power management provided by the present invention also includes a gas protection module for filling an inert gas into a load to prevent oxidation of the bonding silver wire at high temperature.
[0018] The present invention provides an intelligent silver wire bonding system for efficient power management, which outputs a compensation voltage through a final conversion unit, fine-tunes the callback voltage, and outputs a graded voltage to the load, so as to achieve precise control of the voltage output of each unit, thereby saving energy consumption and improving system stability; by scoring the priority of each unit in the load and delivering different powers according to the priority of each unit, it can ensure that the most important load unit obtains sufficient power when needed, maximize the use of limited power resources, and improve the overall system efficiency and performance.
[0019] The present invention provides an intelligent silver wire bonding system with high-efficiency power management. By combining the real-time temperature and the rated temperature, a PID control method is used to adjust the output power of the high-frequency vibration unit to adjust the heat generation of the high-frequency vibration unit, which helps to improve the working efficiency of the high-frequency vibration unit, reduce energy loss and increase the service life of the high-frequency vibration unit. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0021] Figure 1 It is a structural schematic diagram of an intelligent silver wire bonding system with efficient power management provided in the first embodiment of the present invention. DETAILED DESCRIPTION
[0022] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0023] Embodiment 1: Combine the following Figure 1 An intelligent silver wire bonding system with efficient power management of the present invention is described.
[0024] Figure 1 It is a structural schematic diagram of an intelligent silver wire bonding system with efficient power management provided by an embodiment of the present invention.
[0025] like Figure 1As shown, an embodiment of the present invention provides an intelligent silver wire bonding system with high-efficiency power management, including: a load, a load detection module, a power module, a power catalysis module and a power management module.
[0026] Silver wire bonding for bonding silver wire. Bonding silver wire is a product used to replace traditional gold wire in the LED and IC industries. Its main component is single crystal silver, which generally contains 90%-99%, and the rest are various trace elements. The advantage of bonding silver wire is that it is cheap, about one-fifth of the gold wire of the same wire diameter; at the same time, it has good conductivity, solderability, reflectivity and heat dissipation. The main components of silver wire include pure silver and alloys containing palladium (Pd) or gold (Au). The use of these alloys helps to improve the performance of silver wire, such as increasing the breaking load of bonding silver wire through solid solution strengthening and grain refinement. Silver wire bonding is an important part of the semiconductor packaging process. It forms the connection between the lead and the chip through ultrasonic welding, hot pressing welding and other methods.
[0027] The load includes: wire feeding unit, welding unit, high-frequency vibration unit, pressure control unit, and temperature control unit. The wire feeding unit is used to feed the bonding silver wire to the welding unit. The wire feeding unit is usually located above or on the side of the welding head and is responsible for feeding the silver wire to the welding point. The wire feeding unit is directly connected to the welding unit, and a conveying system is usually used to transport the silver wire to the welding point. The welding unit is used to perform silver wire bonding on the bonding silver wire. The high-frequency vibration unit is used to provide welding heat energy for silver wire bonding. The pressure control unit is used to provide contact pressure for the bonding silver wire. The temperature control unit is used to adjust the welding heat energy of the high-frequency vibration unit. The welding unit ensures that the electrical connection between electronic components is stable and reliable. In this process, the high-frequency vibration unit is responsible for providing the required welding heat energy for silver wire bonding, and uses the heat generated by high-frequency vibration to accelerate the melting and bonding of the welding material, thereby forming a solid solder joint. At the same time, the pressure control unit is responsible for providing precise contact pressure for the bonding silver wire to ensure good contact between the silver wire and the substrate, promote welding quality and avoid possible welding defects. Through appropriate contact pressure, the welding effect can be enhanced and the mechanical strength and electrical conductivity of the solder joint can be improved. In addition, the temperature control unit is used to adjust the welding heat energy of the high-frequency vibration unit to ensure that the temperature is maintained within the optimal range during the welding process to prevent material damage or degradation of solder joint quality due to excessive temperature.
[0028] The specific steps of the temperature control unit to adjust the welding heat energy include: Set the rated temperature required for silver wire bonding. Set the rated temperature for silver wire bonding based on the melting point of the silver wire.
[0029] Use a thermocouple to measure the real-time temperature of a solder joint. A temperature measurement device that consists of two wires of dissimilar metals welded together to form two junctions. When the two junctions are at different temperatures, a small voltage (thermoelectromotive force) is generated in the circuit, and its magnitude is proportional to the temperature difference. This allows the thermocouple to measure temperature changes. Firmly touch the sensing end of the thermocouple (the solder joint side) to the surface of the solder joint. You can use some thermally conductive glue or a mechanical clamp to ensure good contact. Connect the leads of the thermocouple to a temperature recorder or multimeter, making sure the connection is good to avoid inaccurate readings. Before soldering, you can calibrate the thermocouple to ensure its accuracy. You can compare it to a known temperature source. Before you start soldering, start the temperature recorder to monitor the temperature of the solder joint in real time. During the soldering process, observe and record the temperature changes.
[0030] Combine the real-time temperature with the rated temperature, and use the PID control method to adjust the output power of the high-frequency vibration unit to adjust the heat generation of the high-frequency vibration unit. The real-time temperature data is transmitted to the control system (such as a microcontroller, PLC or computer) and compared with the rated operating temperature. The PID control algorithm has the advantages of being simple to understand, easy to implement, highly adaptable, and can optimize performance by adjusting the gain coefficient.
[0031] The output formula of the PID controller is expressed as: ; In the formula, u(t) is the output of the controller, that is, the control signal. Kp is the proportional gain, Kb is the integral gain, Kd is the differential gain, and e(t) is the error at the current moment and the temperature difference between the real-time temperature and the rated temperature. is the integral of the error, is the derivative of the error. The calculation formula of e(t) is expressed as: ; Where r(t) is the rated temperature and y(t) is the real-time temperature.
[0032] The load detection module is used to detect the total power of the load and the power distribution of each unit within the load to ensure efficient operation and safe management of the system. The load detection module includes a load sniffing unit and a power calculation unit. The load sniffing unit is used to sniff the number of sub-units and node information of the load. This process not only provides a detailed view of the load structure, but also helps to detect potential faults or abnormalities in a timely manner. The power calculation unit is used to combine the node information to calculate the working power and standby power of the sub-unit. Accurate power analysis provides strong support for load management and optimization, and also lays the foundation for energy efficiency improvement and cost control. Through this comprehensive load detection solution, users can monitor the power usage of the system in real time, so as to carry out effective energy management and ensure the stability and economy of the equipment.
[0033] The power module is used to provide the initial voltage to the power catalytic module and is regulated by the power catalytic module to ensure that the load can start and run normally. It meets the requirements of different loads through stable and reliable voltage output and helps maintain the overall performance and function of the system. The power module usually has a variety of protection mechanisms, such as overvoltage, overcurrent and short circuit protection, to prevent equipment damage caused by abnormal current.
[0034] The power catalytic module is used to classify the initial voltage by combining the total power and the partial power, and output the graded voltage. It is used to improve the output efficiency of the power supply, reduce losses, improve the power factor, etc. By designing a multi-level power conversion topology, energy transfer is optimized at each level, and unnecessary energy loss is reduced, thereby improving the overall efficiency. The power catalytic module includes a primary conversion unit, an intermediate conversion unit, a final conversion unit, and a feedback control unit. The primary conversion unit is used to eliminate the noise in the initial voltage and output the intermediate voltage required by the intermediate conversion unit. The primary conversion unit monitors the initial voltage input by the power module, uses a filter to denoise the initial voltage, obtains a low-noise voltage signal, and then outputs the created voltage signal as an intermediate voltage to the intermediate conversion unit. The formula for denoising the initial voltage is expressed as: ; Where V md is the intermediate voltage, V in is the initial voltage, which is the voltage output by the power supply. n is the noise voltage. Noise voltage refers to the non-periodic or random interference signal superimposed on the signal power supply. These noises may come from thermal noise, electromagnetic interference, radio frequency interference or power supply fluctuations, thus affecting the normal operation of the equipment. The calculation formula of noise voltage is expressed as: ; ; ; Where V j is the integrated noise voltage, V s is the thermal noise voltage, V i is the voltage value of each sampling point, m is the total number of sampling points, i is an arbitrary sampling point, k is the Boltzmann constant (1.38 × 10^-23 J / K), T is the absolute temperature, R is the resistance value of the load, and Δf is the bandwidth. The range of bandwidth Δf is expressed as: 1kHz≤Δf≤100kHz. Bandwidth usually refers to the frequency range in which a signal can be effectively transmitted or processed. In noise analysis, bandwidth is defined as the frequency range of the signal or noise in the system, usually expressed in Hertz (Hz). The larger the bandwidth, the larger the value of the noise voltage is usually.
[0035] The intermediate conversion unit is used to adjust the intermediate voltage in combination with the rated voltage of the load and output a callback voltage. The process of outputting the callback voltage occurs at the load end. The callback voltage is the voltage value after the intermediate voltage is adjusted upward or downward according to the minimum rated voltage at the load end. When the value of the intermediate voltage is lower than the minimum rated voltage at the load end, the intermediate voltage needs to be adjusted upward. When the value of the intermediate voltage is higher than the minimum rated voltage at the load end, the intermediate voltage needs to be adjusted downward.
[0036] The final conversion unit is used to output the compensation voltage, fine-tune the callback voltage, and output the graded voltage to the load. The graded voltage is the voltage after the callback voltage is fine-tuned. The feedback control unit is used to monitor the real-time changes of the initial voltage and adjust the compensation voltage of the intermediate conversion unit to keep the callback voltage constant. This constancy is very important to ensure the normal operation of the equipment and avoid damage to the load.
[0037] The calculation formula of the compensation voltage is expressed as: ; Where V fb is the compensation voltage, V md is the intermediate voltage, V a It is the rated voltage of each unit in the load. The rated voltage of the load is usually within a range and can be adjusted according to the power management module.
[0038] The power catalytic module also includes a current control unit, which is used to adjust the graded current received by the load in combination with the graded voltage. The current control unit can accurately control the current flowing to the load to match the requirements of the load, thereby improving efficiency. Specifically, a current source can be used to control the current flowing to the load to ensure that the output current matches the graded current. The current source can provide a fixed current value regardless of the load changes. Its output voltage will be adjusted according to the load changes to keep the current constant. In reality, the current output of the current source may fluctuate when the load changes. Using a negative feedback control circuit, real-time monitoring of the output current and adjusting the input signal can greatly reduce fluctuations. You can also choose to use a linear regulator or a switching regulator to improve the stability of the power supply.
[0039] The power management module is used to combine the power division, adaptively adjust the graded voltage, and calculate the voltage division set required by the load. The power management module includes a power integration unit, a control strategy unit, and an automatic adjustment unit. The power integration unit is used to combine the working power and the standby power to output a power classification set. The power integration unit can monitor the working power and the standby power in real time to optimize the utilization of the power supply. The working power refers to the power consumption of the device in normal operation, while the standby power refers to the power consumption of the device in non-working state. In an application environment where the load changes frequently, the flexibility and adaptability of the power integration unit are particularly important. It can not only ensure the stable operation of the device under high load conditions, but also effectively reduce energy consumption in standby state, thereby extending the overall service life of the device. The control strategy unit is used to combine the power classification set to prioritize and limit the load. The control strategy unit can dynamically adjust the power distribution to ensure that important loads can still obtain sufficient power supply when the power is tight. After clarifying the load priority, the control strategy unit will calculate the power limit based on the power supply and current power demand. This includes evaluating the total power allocation capacity of the system and the current power usage to ensure that at any time, the total consumption of all loads does not exceed the power supply capacity of the system. The automatic adjustment unit is used to send priority allocation and power limit information to the current control unit to adjust the graded current.
[0040] The specific steps of the control strategy unit for priority allocation and power limitation include: The priority of each unit in the load is scored based on the power distribution of each unit in the load and the working status of each unit in the load, and the score value is output.
[0041] The priorities of each unit of the load can be divided from the perspective of functionality, power consumption, operating time, and working status. The standards for the priority of other conditions except the working status are: high priority (3 points), medium priority (2 points), and low priority (1 point). In terms of functionality, high priority usually indicates critical equipment, which is crucial to the normal operation of the system. Medium priority indicates important equipment, which affects work efficiency to a certain extent. Low priority indicates non-critical equipment, which has little impact on the overall function. In terms of power consumption, high priority usually indicates that the power demand is greater than 30% of the system's available power, medium priority indicates that the power demand is between 10% and 30% of the system's available power, and low priority indicates that the power demand is less than 10% of the system's available power. Operating time indicates the relative proportion of operating time between each unit. Under the condition of 24-hour uninterrupted operation of the production line, the operating time of each unit does not include the ratio of the time occupied by the standby time to the total time. The larger the proportion, the higher the priority. The working status of each unit is scored as 1 when it is working and 0 when it is standby.
[0042] Combined with the above priority division strategy, the specific division criteria of the score values of each unit in each load can be shown in Table 1: Table 1: Load Cell Functional Power consumption Run time Working status Rating value Wire feeding unit 3 1 3 1 8 Welding unit 3 3 3 1 10 High frequency vibration unit 3 3 3 1 10 Pressure control unit 2 1 3 1 7 Temperature Control Unit 3 2 2 1 8 Different power transmission is performed according to the priority of each unit. The higher the priority, the closer the transmitted power is to the maximum rated power of each unit. When the priority is low, the transmitted power is closer to the minimum rated power value of each unit, and the lowest is the minimum rated power value. The specific calculation formula for the required transmission power is expressed as: ; ; Where P0 is the maximum rated power of any unit in the load, P min is the minimum rated power of any unit in the load, P1 is the required transmission power, and α is the score value. The calculation method of the minimum rated power is P min =V min I min Where V min is the minimum rated voltage of the unit, I min is the minimum rated current of the unit. The power management module calculates the voltage distribution of each unit under the obtained priority according to the priority of each unit in the load. This voltage distribution is used to control the output of the compensation voltage of the final conversion unit. This can achieve accurate control of the voltage output of each unit, thereby saving energy consumption and improving system stability.
[0043] The gas protection module is used to fill the load with inert gas to prevent the silver bonding wire from oxidizing at high temperatures. Silver bonding wire is selected for its excellent electrical and thermal conductivity, but it is easily oxidized in high temperature environments, affecting its performance and life. The role of the gas protection module is to provide a protective gas, usually an inert gas such as nitrogen or argon, during the bonding process to prevent the silver wire from reacting with oxygen in the air at high temperatures. This protection measure significantly improves the stability and reliability of silver wire bonding, ensuring the efficient performance of the entire power management system in long-term operation.
[0044] In summary, the present invention provides an intelligent silver wire bonding system for efficient power management. By scoring the priorities of each unit in the load and delivering different powers according to the priorities of each unit, it can ensure that the most important load unit obtains sufficient power when needed, and can maximize the use of limited power resources to improve the overall system efficiency and performance. By outputting the compensation voltage through the final conversion unit, the callback voltage is fine-tuned, and the graded voltage is output to the load to achieve precise control of the voltage output of each unit, thereby saving energy consumption and improving the stability of the system. By combining the real-time temperature with the rated temperature, the PID control method is used to adjust the output power of the high-frequency vibration unit to adjust the heat generation of the high-frequency vibration unit, which helps to improve the working efficiency of the high-frequency vibration unit, reduce energy loss and increase the service life of the high-frequency vibration unit.
[0045] Embodiment 2: Different from the first embodiment, the output mode of the compensation voltage in the first embodiment can be realized by using an operational amplifier. The operational amplifier is usually configured with a differential amplifier or a follower. The differential amplifier is used to compare two different voltages and amplify the difference between them. This is very effective for implementing voltage compensation, especially when a reference voltage and a feedback voltage need to be compared. The follower is an operational amplifier configuration with a higher input impedance and a lower output impedance, which is used to provide voltage buffering while passing the input voltage. This is very useful for preventing voltage changes caused by the load. Among them, the configuration steps of the differential amplifier include: Determine the input voltage that needs to be compensated and the target output voltage.
[0046] Design the circuit to compare the input voltage with the target input voltage.
[0047] Select a suitable operational amplifier based on load capacity, bandwidth, distortion and other parameters. The output of the differential amplifier can be expressed using the following formula: ; Where V out The compensation voltage is V + is the positive input voltage, V - is the negative input voltage and A is the gain value. The gain of a standard differential amplifier can be set by resistors: ; In the formula, R f is the feedback resistor, R in is the input resistor, R1 and R3 are the upstream resistors, and R2 and R4 are the downstream resistors. R1 is the non-inverting input terminal (V + ) is connected to the inverting input terminal (V -) is connected to the inverting input (V - ) and the output terminal (V out ) helps set the feedback current. R4 is connected between the inverting input (V - ) to ground, affecting the input impedance and feedback configuration. If higher gain is required, a larger feedback resistor can be selected.
[0048] The device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Ordinary technicians in this field can understand and implement it without paying creative labor.
[0049] Through the description of the above implementation methods, those skilled in the art can clearly understand that each implementation method can be implemented by means of software plus a necessary general hardware platform, and of course, can also be implemented by hardware. Based on this understanding, the above technical solution is essentially or the part that contributes to the prior art can be embodied in the form of a software product, and the computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, a disk, an optical disk, etc., including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or some parts of the embodiments.
[0050] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims
1. An intelligent silver wire bonding system with efficient power management, characterized in that: include: Load, load detection module, power module, power catalysis module and power management module; The load is used to weld the bonding silver wire; The load detection module is used to detect the total power of the load and the partial power of each unit in the load; The power supply module is used to provide an initial voltage for the power catalytic module; The power catalytic module is used to classify the initial voltage and output a graded voltage; The power management module is used to combine the divided power, adaptively adjust the graded voltage, and calculate the divided voltage set required by the load.
2. The intelligent silver wire bonding system with high efficiency power management according to claim 1, characterized in that: The load includes: a wire supply unit, a welding unit, a high-frequency vibration unit, a pressure control unit, and a temperature control unit; The wire supply unit is used to supply the bonding silver wire to the welding unit; The welding unit is used to weld the bonding silver wire; The high-frequency vibration unit is used to provide welding heat energy for the silver wire bonding; The pressure control unit is used to provide contact pressure for the bonding silver wire; The temperature control unit is used to adjust the welding heat energy of the high-frequency vibration unit.
3. The intelligent silver wire bonding system with high efficiency power management according to claim 1, characterized in that: The load detection module includes a load sniffing unit and a power calculation unit; The load sniffing unit is used to sniff the number of subunits and node information of the load; The power calculation unit is used to calculate the working power and standby power of the subunit in combination with the node information.
4. The intelligent silver wire bonding system with high efficiency power management according to claim 3, characterized in that: The power catalytic module includes a primary conversion unit, a mid-level conversion unit, a final conversion unit and a feedback control unit; The primary conversion unit is used to eliminate the noise voltage in the initial voltage and output the intermediate voltage required by the intermediate conversion unit; The intermediate conversion unit is used to adjust the intermediate voltage in combination with the rated voltage of the load and output a callback voltage; The final conversion unit is used to output a compensation voltage, fine-tune the callback voltage, and output the graded voltage to the load; The feedback control unit is used to monitor the real-time change of the initial voltage, and adjust the voltage conversion ratio of the intermediate conversion unit and the compensation voltage to keep the callback voltage constant.
5. The intelligent silver wire bonding system with high efficiency power management according to claim 4, characterized in that: The calculation formula of the noise voltage is expressed as: ; Where V md is the intermediate voltage, V in is the initial voltage, V n is the noise voltage.
6. The intelligent silver wire bonding system with high efficiency power management according to claim 4, characterized in that: The power catalytic module further includes a current control unit, and the current control unit is used to adjust the graded current received by the load in combination with the graded voltage.
7. The intelligent silver wire bonding system with high efficiency power management according to claim 6, characterized in that: The power management module includes a power integration unit, a control strategy unit and an automatic adjustment unit; The power integration unit is used to combine the working power and the standby power to output a power classification set; The control strategy unit is used to assign priorities and limit power to the loads in combination with the power classification set; The automatic adjustment unit is used to send the priority allocation and the power limitation information to the current control unit to adjust the graded current.
8. The intelligent silver wire bonding system with high efficiency power management according to claim 7, characterized in that: The specific steps of the control strategy unit performing the priority allocation and the power limitation include: Prioritize each unit in the load based on the power distribution of each unit in the load and the working status of each unit in the load, and output the score value; Different power transmission is performed according to the priority of each unit; the higher the priority, the closer the transmitted power is to the maximum rated power of each unit; when the priority is low, the closer the transmitted power is to the minimum rated power value of each unit, and the lowest is the minimum rated power value.
9. The intelligent silver wire bonding system with high efficiency power management according to claim 2, characterized in that: The specific steps of the temperature control unit regulating the welding heat energy include: Set the rated temperature required for silver wire bonding; Use thermocouples to measure the real-time temperature of the solder joint; Combining the real-time temperature with the rated temperature, a PID control method is used to adjust the output power of the high-frequency vibration unit to adjust the heat generation of the high-frequency vibration unit.
10. The intelligent silver wire bonding system with high efficiency power management according to claim 9, characterized in that: A gas protection module is also included, which is used to fill the load with an inert gas to prevent the bonding silver wire from being oxidized at high temperature.
Citation Information
Patent Citations
Realization method for lead bonding thick aluminum wire
CN102637613A
Gold wire bonding process method
CN115064455A
Over-voltage control system and method for anti-oxidation bonding silver wire production equipment of Internet of Things
CN116470477A
Energy-saving power distribution control system and method of multi-load power distribution cabinet
CN117410986A
Wide-range multi-module electronic load
CN118915877A