Method for transporting material, semiconductor process apparatus, and storage medium

By employing a dual-fork robot in semiconductor process equipment, the movement sequence is decomposed based on loading priority and working mode, achieving highly flexible material transfer and solving the problem of large space occupation of five-finger robots in multi-cavity equipment.

CN119673834BActive Publication Date: 2026-06-23BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Filing Date
2023-09-21
Publication Date
2026-06-23

AI Technical Summary

Technical Problem

In the existing technology, five-finger robotic arms lack flexibility in semiconductor process equipment, cannot independently perform wafer transfer operations, and are large in size, which does not meet the design requirements of multi-cavity equipment.

Method used

A dual-fork robot is used to generate a set of movement sequences and decompose the movement sequences based on loading priority and the robot's working mode. Material transfer is carried out using two independently controllable material handling components, including simultaneous handling of two components, single-component handling, and handling of components separately.

Benefits of technology

It improves the flexibility of material handling, reduces the space occupied by the robotic arm, and meets the design requirements of multi-cavity equipment.

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Abstract

Embodiments of the present application provide a method for transporting materials, a semiconductor process equipment and a storage medium, and belong to the technical field of semiconductors. The method comprises: for a to-be-executed task, generating a set of movement sequences based on the loading priority of the to-be-transported materials; and for any movement sequence in the set of movement sequences, decomposing the movement sequence based on the sequence type of the movement sequence and the working mode of a robot, and issuing the movement sequence obtained by decomposition to transport the materials, wherein the robot comprises two material taking and placing components that can be controlled individually, and the working mode indicates the taking and placing form of the robot for taking and placing materials in a first material placing container and a second material placing container. In this way, the robot comprising the two material taking and placing components that can be controlled individually is used to transport materials, and the limitation that only five-finger or single-finger robots can be used to transport wafers is broken.
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