Unit sheet rubberizing mechanism and thermal composite laminating machine

Abstract

The invention provides a unit sheet rubberizing mechanism and a thermal composite laminating machine. The unit sheet rubberizing mechanism comprises a bracket, a material belt roller, a rubber belt and a rubberizing assembly, the material belt roller is used for conveying the unit sheets; the adhesive tape comprises a first surface and a second surface which are oppositely arranged, the first surface is a bonding surface, and the second surface is a smooth surface; the adhesive tape sticking assembly is used for sticking a first surface of an adhesive tape to the surface of a unit sheet of a material belt; a unit piece rubberizing mechanism is additionally arranged before a thermal compounding Z-stack step, a driving part drives a vacuum roller to rotate, so that a rubber belt is attached to the surface of a corresponding unit piece, NG unit pieces cannot be bonded with other unit pieces, the problems of pole piece damage and powder falling caused in the separation process are avoided, secondary damage in the reworking process is reduced, and the working efficiency is improved. The technical problem of low efficiency of manually counting the tabs can be solved; in addition, the unit sheets are conveyed through the material belt roller, so that the machine is not stopped in the rubberizing process, other working procedures are prevented from being influenced, and the production efficiency is ensured.

Description

Technical Field

[0001] The invention relates to the technical field of lithium battery production, and in particular to a unit cell gluing mechanism and a thermal composite laminating machine. Background Art

[0002] With the advancement of modern science and technology, lithium-ion batteries are becoming more and more widely used in life, and are widely used in various digital products and new energy vehicles. Lithium-ion batteries are mainly composed of shells and battery cells. At present, in the manufacturing process of large lithium-ion batteries, a hot composite lamination machine is usually used to assemble the positive and negative electrodes of the lithium-ion battery cell with the isolation film in a Z-shaped stack to make a battery cell, and then glue is applied to the tail of the battery cell to play the final fixing role; in the related technology, when NG cells (i.e., unqualified cells) appear in the core package of the battery cell, they need to be reworked. When the core package is subjected to the Z-stack hot pressing process of the hot composite stacking machine, the NG unit sheet will be adhered to the other qualified unit sheets. Therefore, in the process of separating the NG unit sheet from the other qualified unit sheets, the pole sheet is prone to damage and powder falling, resulting in secondary damage during the rework process. At the same time, it is also easy to cause the hot composite Z-stack core package to be scrapped after the unit sheet is NG, which increases the production cost. Summary of the invention

[0003] The embodiments of the present invention provide a unit chip gluing mechanism and a thermal composite stacking machine, which can improve the technical problems of low rework efficiency of NG unit chips and easy occurrence of pole chip damage and powder loss.

[0004] In a first aspect, an embodiment of the present invention provides a unit chip gluing mechanism, comprising:

[0005] Bracket;

[0006] A material belt roller, the material belt roller is rotatably connected to the bracket for conveying the material belt;

[0007] An adhesive tape, the adhesive tape comprising a first surface and a second surface arranged opposite to each other, the first surface being an adhesive surface, and the second surface being a smooth surface;

[0008] The adhesive sticking assembly is used to stick the first side of the adhesive tape to the surface of the unit piece of the material tape.

[0009] In one embodiment, the adhesive tape assembly includes a vacuum roller and a driving member, wherein the driving member is drivingly connected to the vacuum roller to drive the vacuum roller to rotate and can attach the first side of the adhesive tape to the surface of the unit sheet of the material tape.

[0010] In one embodiment, a cavity is provided in the vacuum roller, and the cavity is used to connect to an exhaust device to exhaust the air in the cavity. A plurality of adsorption holes communicating with the cavity are provided on the surface of the vacuum roller.

[0011] In one embodiment, the plurality of adsorption holes are arranged in a matrix, and the area of ​​the plurality of adsorption holes occupies between 2 / 3 and 3 / 4 of the circumferential surface area of ​​the vacuum roller.

[0012] In one embodiment, a unit chip gluing mechanism also includes a preparation glue component for providing the tape, the preparation glue component includes a preparation tape roll, a guide roller, a first drive roller, a second drive roller and the tape, the first drive roller and the second drive roller are arranged opposite to each other, the tape is installed on the preparation tape roll, one end of the tape is wound around the top of the guide roller and is conveyed from between the first drive roller and the second drive roller to the vacuum roller.

[0013] In one embodiment, a unit chip gluing mechanism also includes a first guide plate and a second guide plate, wherein the first guide plate and the second guide plate are both arranged on the side of the first driving roller and the second driving roller facing the vacuum roller, and the first guide plate and the second guide plate are arranged at an angle and the spacing between them gradually decreases to guide the tape to run from between the first guide plate and the second guide plate to the vacuum roller.

[0014] In one embodiment, a unit chip gluing mechanism further includes a cutter, wherein the cutter is disposed between the first glue preparation component and the glue gluing component to cut the adhesive tape.

[0015] In one embodiment, a unit chip gluing mechanism further includes a transverse movement component, wherein the transverse movement component is connected to the vacuum roller and is used to adjust the distance between the vacuum roller and the material belt roller.

[0016] In one embodiment, a unit sheet gluing mechanism also includes a pulley assembly, which includes a first synchronous wheel, a second synchronous wheel and a synchronous belt, wherein the first synchronous wheel is fixedly connected to the driving member, and the first synchronous wheel is connected to the second synchronous wheel through the synchronous belt to drive the second synchronous wheel to rotate synchronously, and the second synchronous wheel is fixedly connected to the vacuum roller.

[0017] In one embodiment, the second surface is disposed toward the vacuum roller, and the vacuum roller is capable of adsorbing the second surface to the surface of the vacuum roller.

[0018] In a second aspect, an embodiment of the present invention provides a thermal composite lamination machine, including a unit chip gluing mechanism.

[0019] In one embodiment, the number of the unit chip gluing mechanisms is two, and the two unit chip gluing mechanisms are used to attach both sides of the same unit chip of the material sheet to the first side of the tape.

[0020] Beneficial effects of the embodiments of the present invention:

[0021] In an embodiment of the present invention, by adding a unit chip gluing mechanism before the thermal composite Z stacking step, when the unit chip is detected to be an NG unit chip, the adhesive surface of the tape is attached to the surface of the corresponding unit chip on the material tape through the gluing component, and the smooth surface of the tape is away from the unit chip. In the subsequent thermal composite Z stacking step, the smooth surface of the tape will not adhere to the remaining unit chips on the material tape, that is, the NG unit chip of the material tape will not adhere to the remaining unit chips on the material tape, which can ensure that in the subsequent patching process, the NG unit chip on the material tape can be easily separated from the remaining unit chips on the material tape, avoiding the problem of pole chip damage and powder loss caused by the adhesion of the NG unit chip on the material tape with the remaining unit chips on the material tape during the separation process. Therefore, it is possible to reduce the secondary damage to the NG unit chip on the material tape during the rework process, and at the same time avoid the problem that the unit chip wrapped on the material tape of the thermal composite Z stacking core needs to be scrapped after it is NG. Furthermore, by attaching tape on the NG unit pieces on the material tape, production personnel can quickly identify the layer where the NG unit pieces on the material tape are located, that is, there is no need to identify the layer where the NG unit pieces are located by manually counting the pole ears, thereby improving the technical problem of low efficiency of manually counting the pole ears.

[0022] In addition, in an embodiment of the present invention, the unit sheet is conveyed by a material roller, so that the continuity between the gluing process and the subsequent thermal composite Z stacking process can be achieved, that is, the entire gluing process can be carried out without stopping, thereby avoiding affecting the progress of other processes and ensuring production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 It is a three-dimensional schematic diagram of a unit chip gluing mechanism provided in the first embodiment of the present invention;

[0025] Figure 2 is a three-dimensional schematic diagram of a vacuum roller provided in Embodiment 1 of the present invention;

[0026] Figure 3 It is a three-dimensional schematic diagram of a unit chip gluing mechanism provided in the second embodiment of the present invention.

[0027] Figure 4 It is a three-dimensional schematic diagram of a unit chip gluing mechanism provided in the third embodiment of the present invention.

[0028] Figure 5 It is a three-dimensional schematic diagram of a unit chip gluing mechanism provided in the fourth embodiment of the present invention.

[0029] Reference numerals

[0030] 1. Belt roller;

[0031] 2. Tape;

[0032] 3. Glue sticking assembly; 31. Vacuum roller; 311. Cavity; 312. Adsorption hole; 313. Exhaust device; 32. Driving member; 33. Pulley assembly; 331. First synchronous wheel; 332. Second synchronous wheel; 333. Synchronous belt;

[0033] 4. Glue preparation assembly; 41. Glue preparation roll; 42. Guide roller; 43. First drive roller; 44. Second drive roller;

[0034] 5. A first guide plate;

[0035] 6. A second guide plate;

[0036] 7. Cutter;

[0037] 8. Transverse movement assembly;

[0038] 9. Material strip. DETAILED DESCRIPTION

[0039] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention. In the present invention, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the drawings; while "inside" and "outside" refer to the outline of the device.

[0040] Reference Figure 1 The present application provides a unit chip gluing mechanism, which includes a bracket (not shown in the figure), a material tape roller 1, a tape 2 and a gluing assembly 3.

[0041] The material belt roller 1 is rotatably connected to the bracket to be used for the tape feeding of the unit wafer;

[0042] The adhesive tape 2 comprises a first surface and a second surface which are arranged opposite to each other, the first surface is a bonding surface, and the second surface is a smooth surface;

[0043] The adhesive sticking assembly 3 is used to stick the first surface of the adhesive tape 2 to the surface of the unit piece of the material tape 9 .

[0044] In the embodiment of the present invention, by adding a unit chip gluing mechanism before the thermal composite Z stacking step, when the unit chip is detected to be an NG unit chip, the adhesive surface of the tape 2 is attached to the surface of the corresponding unit chip on the material tape 9 through the gluing component 3, and the smooth surface of the tape 2 is away from the unit chip. In the subsequent thermal composite Z stacking step, the smooth surface of the tape 2 will not be bonded to the remaining unit chips on the material tape 9, that is, the NG unit chip of the material tape will not be bonded to the remaining unit chips on the material tape, and it can be ensured that in the subsequent patching process, the NG unit chip on the material tape 9 can be easily separated from the remaining unit chips on the material tape 9, avoiding the problem of pole chip damage and powder loss caused by the bonding of the NG unit chip on the material tape 9 with the remaining unit chips on the material tape 9 during the separation process. Therefore, it can reduce the secondary damage phenomenon of the NG unit chip on the material tape 9 during the rework process, and at the same time avoid the problem that the unit chip wrapped on the material tape 9 of the thermal composite Z stacking core needs to be scrapped after it is NG. Furthermore, by attaching tape 2 on the NG unit pieces on the material tape 9, production personnel can quickly identify the layer where the NG unit pieces on the material tape 9 are located, that is, there is no need to identify the layer where the NG unit pieces are located by manually counting the pole ears, thereby improving the technical problem of low efficiency of manually counting the pole ears.

[0045] In addition, in an embodiment of the present invention, by conveying the unit sheet through the material roller 1, the continuity between the gluing process and the subsequent thermal composite Z stacking process can be achieved, that is, the entire gluing process can be carried out without stopping, thereby avoiding affecting the progress of other processes and ensuring production efficiency.

[0046] In some embodiments, reference Figure 1The glue sticking assembly 3 includes a vacuum roller 31 and a driving member 32. The driving member 32 is connected to the vacuum roller 31 to drive the vacuum roller 31 to rotate and can stick the first surface of the tape 2 to the surface of the unit sheet of the material belt 9. Therefore, compared with the traditional glue pulling method, the setting of the vacuum roller 31 can ensure that when the tape 2 is adsorbed on the vacuum roller 31, the vacuum roller 31 and the tape 2 are adhered to each other without generating bubbles, so as to avoid generating bubbles between the tape 2 and the unit sheet of the material belt 9 during the glue sticking process, and ensure complete adhesion between the tape 2 and the unit sheet of the material belt 9, that is, it can prevent the remaining qualified unit sheets on the material belt 9 from having abnormal phenomena such as marks and wrinkles due to the presence of bubbles, thereby preventing the core package from being damaged.

[0047] It can be understood that, in this embodiment, the driving member 32 can be a driving motor, the driving member 32 can also be a rotary cylinder, and the driving member 32 can also be arranged in different forms according to actual practical needs; in the embodiment of the present invention, the driving member 32 is preferably a driving motor, and the driving member 32 adopts a driving motor. Compared with a rotary cylinder, the driving motor can produce faster and stronger rotation, high efficiency, good precision, and less noise during use; at the same time, it can also maintain long-term operation, which is convenient for daily maintenance.

[0048] In addition, the drive motor can also achieve different speeds by simply adjusting the voltage and current, which is easy to adjust.

[0049] In some embodiments, reference Figure 2 The vacuum roller 31 is provided with a cavity 311, and the cavity 311 is used to connect the exhaust device 313 to exhaust the air in the cavity 311. The surface of the vacuum roller 31 is provided with a plurality of adsorption holes 312 connected with the cavity 311. When it is necessary to glue the surface of the unit chip of the material strip 9, the air in the cavity 311 is firstly completely exhausted through the exhaust device 313, so that the cavity 311 is in a vacuum state. At this time, the vacuum roller 31 can adsorb the second side of the tape 2 on the surface of the vacuum roller 31, so that the first side of the tape 2 can be flatly attached to the surface of the unit chip, ensuring that the entire core package will not have abnormal phenomena such as marks and wrinkles caused by gluing, thereby preventing the core package from being damaged.

[0050] In the specific use process, the exhaust device 313 can be an exhaust machine or a vacuum pump, and other different forms of exhaust devices 313 can be used according to actual needs. In the embodiment of the present application, the exhaust device 313 is preferably a vacuum pump, which can more efficiently extract gas from the container to achieve a higher vacuum degree, with high exhaust efficiency, and can also meet the needs of various complex working environments, with a wide range of applications and strong practicality.

[0051] In some embodiments, reference Figure 2 , the plurality of adsorption holes 312 are arranged in a matrix, and the area of ​​the plurality of adsorption holes 312 is between 2 / 3 and 3 / 4 of the circumferential surface area of ​​the vacuum roller 31. Through the above arrangement, most of the circumferential surface of the vacuum roller 31 is provided with adsorption holes 312, but not all of the circumferential surface of the vacuum roller 31 is provided with adsorption holes 312, that is, it can ensure that the vacuum roller 31 has sufficient adsorption degree to the adhesive tape 2, and avoid the adhesive tape 2 from falling off during the rotation of the vacuum roller 31; at the same time, it can also avoid the phenomenon that the adhesive tape 2 cannot be attached to the surface of the unit chip of the material belt 9 due to the excessive adsorption degree of the vacuum roller 31, and it can also avoid the phenomenon that the adhesive tape 2 is attached to the unit chip of the material belt 9 and then is adsorbed and taken away by the vacuum roller 31 again. Therefore, through the above arrangement, it is ensured that the adhesive tape 2 can be smoothly attached to the surface of the unit chip of the material belt 9.

[0052] In this embodiment, the area of ​​the plurality of adsorption holes 312 preferably accounts for 2 / 3 of the circumferential surface area of ​​the vacuum roller 31 .

[0053] In some embodiments, reference Figure 1 A unit chip gluing mechanism also includes a preparation glue component 4 for providing the adhesive tape 2, the preparation glue component 4 includes a preparation glue roll 41, a guide roller 42, a first drive roller 43, a second drive roller 44 and the adhesive tape 2, the first drive roller 43 and the second drive roller 44 are arranged opposite to each other, the adhesive tape 2 is installed on the preparation glue roll 41, one end of the adhesive tape 2 is wound around the top of the guide roller 42 and is conveyed from between the first drive roller 43 and the second drive roller 44 to the vacuum roller 31. Therefore, one end of the tape 2 is installed on the spare film roll 41 and can extend from the spare film roll 41, and the tape 2 is wound on the guide roller 42, so that the tape 2 can be reversed after passing through the guide roller 42, and the tape 2 is kept in a straight state to avoid wrinkles in the tape 2 during the transmission process. Then the tape 2 can be conveyed from between the first drive roller 43 and the second drive roller 44 to the vacuum roller 31, and the first drive roller 43 and the second drive roller 44 are arranged opposite to each other, so as to play a clamping and limiting effect on the tape 2, which can further ensure the straight state of the tape 2, so that the tape 2 remains straight during the entire glue preparation process until it is adsorbed by the vacuum roller 31, which is convenient for the subsequent glue application process.

[0054] It is understood that in the embodiment of the present invention, in order to avoid the phenomenon that the first side of the adhesive tape 2, i.e., the adhesive surface of the adhesive tape 2, does not adhere when the adhesive tape 2 passes through the guide roller 42, the first drive roller 43, and the second drive roller 44 during the adhesive preparation process, special treatment can be performed on the surfaces of the guide roller 42, the first drive roller 43, and the second drive roller 44. For example, an anti-stick coating is sprayed on the surfaces of the guide roller 42, the first drive roller 43, and the second drive roller 44, or a process such as polishing or etching is performed on the surfaces of the guide roller 42, the first drive roller 43, and the second drive roller 44 to change the physical and chemical properties of the surfaces. Special treatment on the surfaces of the guide roller 42, the first drive roller 43, and the second drive roller 44 can form a smooth film on the surfaces of the guide roller 42, the first drive roller 43, and the second drive roller 44 that is not easy to interact strongly with the adhesive tape 2, thereby further reducing the adhesion between the adhesive tape 2 and the guide roller 42, the first drive roller 43, and the second drive roller 44, thereby avoiding the phenomenon of failure of the adhesive tape 2.

[0055] In some embodiments, reference Figure 3 A unit chip gluing mechanism further includes a first guide plate 5 and a second guide plate 6, both of which are arranged on the side of the first driving roller 43 and the second driving roller 44 facing the vacuum roller 31, and the first guide plate 5 and the second guide plate 6 are arranged at an angle and the spacing is gradually reduced, so as to guide the adhesive tape 2 to run from between the first guide plate 5 and the second guide plate 6 to the vacuum roller 31. Through the above arrangement, after the adhesive tape 2 extends from between the first driving roller 43 and the second driving roller 44, it can fall between the first guide plate 5 and the second guide plate 6. Since the first guide plate 5 and the second guide plate 6 are arranged at an angle and the spacing is gradually reduced, the adhesive tape 2 can run smoothly from between the first guide plate 5 and the second guide plate 6 until it is adsorbed by the vacuum roller 31; therefore, the first guide plate 5 and the second guide plate 6 can play a guiding role for the adhesive tape 2, thereby ensuring that the adhesive tape 2 can be smoothly adsorbed to the vacuum roller 31, ensuring the continuity of the gluing process, and high gluing efficiency.

[0056] In some embodiments, reference Figure 4 A unit chip gluing mechanism also includes a cutter 7, which is arranged between the glue preparation component 4 and the glue sticking component 3 to cut the tape 2.

[0057] It should also be noted that before the gluing mechanism glues, the cutter 7 can automatically cut the tape 2 according to the length of the NG unit piece in the material tape 9, so that the length of the tape 2 is only sufficient to adhere to the surface of the NG unit piece in the material tape 9 without affecting the remaining unit pieces, thereby avoiding increasing the workload of the patching process.

[0058] It can be understood that in the specific glue laminating process, the cutter 7 can cut the tape 2 according to the actual length of the NG unit piece in the material tape 9, or make the length of the cut tape 2 less than the actual length of the NG unit piece in the material tape 9, that is, choose to fully cover or half cover the NG unit piece in the material tape 9, so as to avoid the NG unit piece in the material tape 9 from adhering to the remaining unit pieces.

[0059] In some embodiments, reference Figure 5 , a unit chip gluing mechanism also includes a transverse shifting component 8, which is connected to the vacuum roller 31 and is used to adjust the distance between the vacuum roller 31 and the material tape roller 1. Therefore, when the unit chip of the material tape 9 passing through the material tape roller 1 is qualified, the distance between the vacuum roller 31 and the material tape roller 1 can be adjusted by the transverse shifting component 8, that is, the vacuum roller 31 is driven by the transverse shifting component 8 to move away from the material tape roller 1, so as to avoid affecting the normal overlapping process of the material tape 9; when the unit chip of the material tape 9 passing through the material tape roller 1 is unqualified and is an NG unit chip, the distance between the vacuum roller 31 and the material tape roller 1 can be adjusted by the transverse shifting component 8, that is, the vacuum roller 31 is driven by the transverse shifting component 8 to move toward the material tape roller 1, so that the gap between the vacuum roller 31 and the material tape roller 1 is only the sum of the thickness of the material tape 9 and the thickness of the adhesive tape 2, thereby ensuring the adhesion effect of the adhesive tape 2. In some embodiments, refer to Figures 1 to 5 A unit sheet gluing mechanism further includes a pulley assembly 33, the pulley assembly 33 includes a first synchronous wheel 331, a second synchronous wheel 332 and a synchronous belt 333, the first synchronous wheel 331 is fixedly connected to the driving member 32, the first synchronous wheel 331 is connected to the second synchronous wheel 332 through the synchronous belt 333, so as to drive the second synchronous wheel 332 to rotate synchronously, and the second synchronous wheel 332 is fixedly connected to the vacuum roller 31. Therefore, during gluing, the driving member 32 drives the first synchronous wheel 331 to rotate, and since the first synchronous wheel 331 is connected to the second synchronous wheel 332 through the synchronous belt 333, the vacuum roller 31 fixed on the second synchronous wheel 332 can rotate synchronously, and the entire gluing process is smoothly realized.

[0060] It should also be noted that, in actual settings, the driving member 32, the first synchronous wheel 331, the second synchronous wheel 332, the synchronous belt 333 and the vacuum roller 31 can all be arranged in the same box; therefore, it is only necessary to connect the transverse shift assembly 8 to the box to drive the vacuum roller 31 to move laterally, so as to adjust the distance between the vacuum roller 31 and the material belt roller 1, thereby avoiding the connection between the vacuum roller 31 and the pulley assembly 33 from interfering with the movement of the vacuum roller 31.

[0061] In addition, in actual settings, the spare film roll 41, the guide roller 42, the first drive roller 43, the second drive roller 44, the adhesive tape 2, the drive member 32, the first synchronous wheel 331, the second synchronous wheel 332, the synchronous belt 333 and the vacuum roller 31 can be arranged in the same box, and the transverse shift assembly 8 is connected to the box, which can drive the vacuum roller 31 to move laterally to adjust the distance between the vacuum roller 31 and the material belt roller 1; thereby, the spare film roll 41, the guide roller 42, the first drive roller 43, the second drive roller 44, the adhesive tape 2, the drive member 32, the first synchronous wheel 331, the second synchronous wheel 332, the synchronous belt 333 and the vacuum roller 31 can be arranged in the same box, and the transverse shift assembly 8 is connected to the box, which can drive the vacuum roller 31 to move laterally to adjust the distance between the vacuum roller 31 and the material belt roller 1; The first synchronous wheel 331, the second synchronous wheel 332, the synchronous belt 333 and the vacuum roller 31 all move synchronously; therefore, the glue preparation component 4 and the glue application component 3 can move synchronously, thereby ensuring that the position between the glue preparation component 4 and the glue application component 3 remains relatively fixed, so as to ensure the movement consistency between the glue preparation component 4 and the glue application component 3, and avoid the need to calibrate the relative position of the glue preparation component 4 and the vacuum roller 31 after adjusting the distance between the vacuum roller 31 and the material roller 1 during glue application, so as to ensure the glue application effect of the NG unit sheet in the material tape 9 and the glue application efficiency.

[0062] In some embodiments, the second surface is disposed toward the vacuum roller 31, and the vacuum roller 31 can adsorb the second surface to the surface of the vacuum roller 31. Therefore, the smooth surface of the adhesive tape 2 is adsorbed on the vacuum roller 31, and the adhesive surface of the adhesive tape 2 faces the material tape roller 1, that is, it is ensured that the adhesive surface of the adhesive tape 2 can be smoothly attached to the surface of the NG unit sheet of the material tape 9.

[0063] In a second aspect, the present application also provides a thermal composite lamination machine, including a unit chip gluing mechanism.

[0064] In some embodiments, the number of the unit chip gluing mechanisms is two, and the two unit chip gluing mechanisms are used to attach both sides of the same unit chip of the material sheet to the first side of the tape 2 .

[0065] It can be understood that since the NG unit sheet on the material belt 9 has two sides, in order to ensure that both sides of the NG unit sheet on the material belt 9 can be attached with the tape 2, two unit sheet gluing mechanisms are provided on the thermal composite stacking machine, and the material belt rollers 1 of the two unit sheet gluing mechanisms rotate in opposite directions, that is, when the material belt 9 passes through the first material belt roller 1, the first side of the material belt 9 faces the vacuum roller 31, that is, when the unit sheet on the material belt 9 is detected to be an NG unit sheet, the corresponding vacuum roller 31 glues the first side of the NG unit sheet; when the material belt 9 passes through the first material belt roller 1, the second side of the material belt 9 faces the vacuum roller 31, that is, when the unit sheet on the material belt 9 is detected to be an NG unit sheet, the corresponding vacuum roller 31 glues the second side of the NG unit sheet.

[0066] In summary, by setting up two unit chip gluing mechanisms, it can be ensured that both sides of the NG unit chip on the material tape 9 can be attached with tape 2, so that the two sides of the NG unit chip will not be bonded to the other unit chips during the subsequent thermal composite Z stacking process, and further ensure that when the NG unit chip is manually separated during the patching stage, there will be no damage to the pole piece and powder falling during the separation process, thereby reducing secondary damage during the rework process.

[0067] It can be understood that in the embodiments of the present application, the unit chip gluing device and the offline NG unit chip patching equipment can also be used in combination to further improve the efficiency of manual rejection and patching of NG unit chips on the material strip 9, and further avoid the phenomenon that after the core package has undergone the hot composite Z stacking process, due to the presence of NG unit chips on the material strip 9, the NG unit chips are bonded to the remaining unit chips, and the pole pieces are damaged or dropped during the separation process, thereby causing the entire core package to be scrapped.

[0068] The embodiments of the present invention are described in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A unit chip gluing mechanism, characterized in that: include: Bracket; A material belt roller, the material belt roller is rotatably connected to the bracket for conveying the material belt; An adhesive tape, the adhesive tape comprising a first surface and a second surface arranged opposite to each other, the first surface being an adhesive surface, and the second surface being a smooth surface; The adhesive sticking assembly is used to stick the first side of the adhesive tape to the surface of the unit piece of the material tape.

2. The unit chip gluing mechanism according to claim 1, characterized in that: The adhesive tape assembly comprises a vacuum roller and a driving member, wherein the driving member is drivingly connected to the vacuum roller to drive the vacuum roller to rotate and can attach the first surface of the adhesive tape to the surface of the unit sheet of the material tape.

3. The unit chip gluing mechanism according to claim 2, characterized in that: A cavity is arranged inside the vacuum roller, and the cavity is used to connect to an exhaust device to discharge the air in the cavity. A plurality of adsorption holes communicating with the cavity are arranged on the surface of the vacuum roller.

4. The unit chip gluing mechanism according to claim 3, characterized in that: The plurality of adsorption holes are arranged in a matrix, and the area of ​​the plurality of adsorption holes occupies between 2 / 3 and 3 / 4 of the circumferential surface area of ​​the vacuum roller.

5. The unit chip gluing mechanism according to any one of claims 1 to 4, characterized in that: It also includes a rubber preparation component for providing the adhesive tape, the rubber preparation component includes a rubber preparation roll, a guide roller, a first drive roller, a second drive roller and the adhesive tape, the first drive roller and the second drive roller are arranged opposite to each other, the adhesive tape is installed on the rubber preparation roll, one end of the adhesive tape is wound above the guide roller and runs from between the first drive roller and the second drive roller to the vacuum roller.

6. The unit chip gluing mechanism according to claim 5, characterized in that: It also includes a first guide plate and a second guide plate, wherein the first guide plate and the second guide plate are both arranged on the side of the first driving roller and the second driving roller facing the vacuum roller, and the first guide plate and the second guide plate are arranged at an angle with a gradually decreasing spacing therebetween to guide the adhesive tape to run from between the first guide plate and the second guide plate to the vacuum roller.

7. A unit chip gluing mechanism according to any one of claim 5, characterized in that: It also includes a cutter, which is arranged between the glue preparation component and the glue application component to cut the adhesive tape.

8. The unit chip gluing mechanism according to claim 2, characterized in that: It also includes a traverse assembly, which is connected to the vacuum roller and is used to adjust the distance between the vacuum roller and the material belt roller.

9. The unit chip gluing mechanism according to claim 2, characterized in that: It also includes a pulley assembly, which includes a first synchronous wheel, a second synchronous wheel and a synchronous belt. The first synchronous wheel is fixedly connected to the driving member, and the first synchronous wheel is connected to the second synchronous wheel through the synchronous belt to drive the second synchronous wheel to rotate synchronously. The second synchronous wheel is fixedly connected to the vacuum roller.

10. The unit chip gluing mechanism according to claim 2, characterized in that: The second surface is disposed toward the vacuum roller, and the vacuum roller is capable of adsorbing the second surface to the surface of the vacuum roller.

11. A thermal composite lamination machine, characterized in that: It comprises the unit chip gluing mechanism as described in any one of claims 1-9.

12. The hot composite lamination machine according to claim 11, characterized in that: The number of the unit chip gluing mechanisms is two, and the two unit chip gluing mechanisms are used to attach both sides of the same unit chip of the material sheet to the first side of the tape.

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