Semiconductor manufacturing apparatus

Abstract

The purpose of the present invention is to provide a technique capable of improving the bending accuracy of a terminal when products of different sizes are manufactured in a semiconductor manufacturing apparatus. A semiconductor manufacturing apparatus (100) is provided with: a plurality of pairs of die heads (5, 6) capable of switching between a first fixed position and a first avoidance position; a plurality of pairs of punches (7, 8) capable of switching between a second fixed position and a second avoidance position; a pair of terminal bending parts for bending the terminal (2b) by contacting with a portion of the terminal (2b) that is not fixed by the plurality of pairs of dies (5, 6) and the plurality of pairs of dies (7, 8); and a control unit (30) that controls switching between the plurality of pairs of dies (5, 6) and the plurality of pairs of dies (7, 8). When the terminal (2b) is fixed, one of the plurality of pairs of dies (5, 6) is switched to a first fixed position, and one of the plurality of pairs of dies (7, 8) is switched to a second fixed position, so that the pair of terminal bent parts can move in the horizontal direction.

Description

Technical Field

[0001] The present invention relates to a semiconductor manufacturing apparatus. Background Art

[0002] Semiconductor devices of the type that are mounted by inserting terminals into a control substrate are distributed in product groups of various sizes depending on the application. For example, Patent Document 1 discloses a device that provides a die having a punch and a die, and forms a gull-wing shape of a terminal between the punch and the die. The technology described in Patent Document 1 can cope with products of different sizes by moving the positions of the punch and the die in accordance with the product size.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2004-214497

[0004] However, in the technology described in Patent Document 1, when manufacturing products of different sizes, in order to move the positions of the punch and the die, the entire die must be moved to an accurate position, so there is a problem that it is difficult to bend the terminal with high accuracy. Summary of the invention

[0005] Therefore, an object of the present invention is to provide a technology capable of improving the bending accuracy of a terminal when manufacturing products having different sizes in a semiconductor manufacturing apparatus.

[0006] The semiconductor manufacturing device of the present invention comprises: a plurality of pairs of dies, which can be switched between a first fixing position for fixing the semiconductor device in a state of contacting terminals protruding from a pair of opposite side portions of the semiconductor device from the bottom side and a first avoiding position avoiding the terminals; a plurality of pairs of punches, which can be switched between a second fixing position for fixing the semiconductor device in a state of contacting the terminals from the top side and a second avoiding position avoiding the terminals; a pair of terminal bending portions, which bend the terminals by contacting portions of the terminals that are not fixed by the plurality of pairs of dies and the plurality of pairs of punches; and

[0007] A control unit controls the switching of the multiple pairs of dies and the multiple pairs of punches. When fixing the terminal, one pair of the dies among the multiple pairs of dies is switched to the first fixed position, and one pair of the punches among the multiple pairs of punches is switched to the second fixed position, so that a pair of the terminal bending portions can move in the horizontal direction.

[0008] Effects of the Invention

[0009] According to the present invention, when manufacturing products of different sizes, a pair of die heads are switched to the first fixed position and a pair of punches are switched to the second fixed position in accordance with the product size, and a pair of terminal bending portions are moved in the horizontal direction, so that a pair of terminal bending portions can be arranged in a bending position. In this way, a pair of terminal bending portions can be arranged in a bending position by moving a pair of terminal bending portions individually in the horizontal direction without moving the entire die, so that the bending accuracy of the terminal can be improved when manufacturing products of different sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 This is a side view showing a state after switching to one die head and one punch in the semiconductor manufacturing apparatus according to the first embodiment.

[0011] Figure 2 This is a side view showing a state after switching to another die head and punch in the semiconductor manufacturing apparatus according to the first embodiment.

[0012] Figure 3 This is a side view showing a terminal bending step of the semiconductor manufacturing apparatus according to the first embodiment.

[0013] Figure 4 It is a side view showing the types of sizes of semiconductor devices.

[0014] Figure 5 It is a side view of the semiconductor manufacturing apparatus involved in Embodiment 2.

[0015] Figure 6 It is a top view of the semiconductor manufacturing apparatus involved in Embodiment 2. DETAILED DESCRIPTION

[0016] <Implementation Method 1>

[0017] <Overall Structure>

[0018] Next, Embodiment 1 will be described with reference to the drawings. Figure 1 This is a side view showing a state in which the die head 5 and the punch 7 are switched to one in the semiconductor manufacturing apparatus 100 according to the first embodiment. Figure 2 This is a side view showing a state after switching to another die head 6 and punch 8 in the semiconductor manufacturing apparatus 100 according to the first embodiment.

[0019] like Figure 1 and Figure 2 As shown, the semiconductor manufacturing apparatus 100 is an apparatus that performs a terminal bending step of bending the terminal 2 b of the semiconductor device 1 upward.

[0020] First, use Figure 3(a), (b) and Figure 4 (a) and (b) briefly describe the semiconductor device 1. Figure 3 (a) is a side view showing the semiconductor device 1 before the terminal bending step. Figure 3 (b) is a side view showing the semiconductor device 1 after the terminal bending step. Figure 4 (a) is a side view of the semiconductor device 1 showing that the sealing resin 2a has a width W1, Figure 4 (b) is a side view of the semiconductor device 1 showing that the sealing resin 2a has a width w2. <w2。

[0021] like Figure 3 (a), (b) and Figure 4 As shown in (a) and (b), the semiconductor device 1 has a sealing resin 2a and a terminal 2b. Although not shown, a semiconductor element mounted on an insulating substrate is sealed in the sealing resin 2a. A plurality of terminals 2b protrude from a pair of opposite sides of the sealing resin 2a and are electrically connected to the semiconductor element in the sealing resin 2a.

[0022] like Figure 3 As shown in (a), before the terminal bending process, the terminal 2b is in the horizontal direction ( Figure 3 (a) extends linearly in the left-right direction. Figure 3 As shown in (b), the terminal 2b is bent upward in the terminal bending step. Figure 4 As shown in (a) and (b), the case where the terminal bending step is performed on two types of semiconductor devices 1 having a sealing resin 2a having a width w1 and a width w2 is described.

[0023] Return to the description of the semiconductor manufacturing apparatus 100. Figure 1 and Figure 2 As shown, the semiconductor manufacturing apparatus 100 includes a plurality of pairs (eg, two pairs) of dies 5 , 6 , a plurality of pairs (eg, two pairs) of punches 7 , 8 , a pair of rollers 3 as a pair of terminal bending portions, and a control unit 30 .

[0024] The two pairs of dies 5 and 6 are arranged on the lower side of the semiconductor device 1, and can be switched between a first fixed position in which the semiconductor device 1 is fixed in a state of contacting the terminal 2b from the lower side and a first avoidance position in which the terminal 2b is avoided. The pair of dies 6 is arranged on the outer side of the pair of dies 5 when viewed from the side. The pair of dies 5 is used for the semiconductor device 1 with a width w1, and the pair of dies 6 is used for the semiconductor device 1 with a width w2. The first fixed position is located directly below the root of the terminal 2 protruding from the side of the encapsulation resin 2a, and is a position in contact with the root of the terminal 2 from the lower side. The first avoidance position is located on the lower side compared to the first fixed position, and is a position that does not contact the terminal 2b.

[0025] Two pairs of punches 7 and 8 are arranged on the upper side of the semiconductor device 1, and can be switched between a second fixed position for fixing the semiconductor device 1 in a state of contacting the terminal 2b from the upper side and a second avoidance position avoiding the terminal 2b. The pair of punches 7 are arranged at a position opposite to the pair of dies 5 in a manner that can fix the terminal 2b with the pair of dies 5. The pair of punches 8 are arranged at a position opposite to the pair of dies 6 in a manner that can fix the terminal 2b with the pair of dies 6. That is, the pair of punches 8 are arranged outside the pair of punches 7 when viewed from the side. The pair of punches 7 are used for semiconductor devices 1 with a width of w1, and the pair of punches 8 are used for semiconductor devices 1 with a width of w2. The second fixed position is located directly above the root of the terminal 2b, and is a position that contacts the root of the terminal 2b from the upper side. The second avoidance position is located on the upper side compared to the second fixed position, and is a position that does not contact the terminal 2b.

[0026] When fixing the terminal 2b, one of the two pairs of dies 5 and 6 (or one pair of dies 6) is switched to the first fixed position, and the remaining pair of dies 6 (or one pair of dies 5) is switched to the first escape position, in accordance with the size of the semiconductor device 1. In addition, one of the two pairs of punches 7 and 8 (or one pair of punches 8) is switched to the second fixed position, and the remaining pair of punches 8 (or one pair of punches 7) is switched to the second escape position.

[0027] Here, the die and punch are not limited to two pairs, and may be greater than or equal to three pairs. In this case, the die and punch need to be arranged at positions facing each other across the terminal 2b. In addition, the size of the semiconductor device 1 is the width of the encapsulating resin 2a.

[0028] The pair of rollers 3 are each supported by a pair of roller support portions 3a, and the pair of roller support portions 3a are held by a sliding mechanism (not shown) so as to be movable in the horizontal direction ( Figure 1 The pair of rollers 3 are respectively arranged outside the two pairs of die heads 5 and 6 when viewed from the side. The pair of rollers 3 bend the terminal 2b by contacting the portion of the terminal 2b that is not fixed by the two pairs of die heads 5 and 6 and the two pairs of punches 7 and 8, specifically, the portion of the terminal 2b that is closer to the front end than the portion fixed by the pair of die heads 5 (or the pair of die heads 6) and the pair of punches 7 (or the pair of punches 8). Here, the front end side of the terminal 2b is the side of the terminal 2b opposite to the encapsulating resin 2a side.

[0029] The two pairs of dies 5, 6 and the two pairs of punches 7, 8 are held so as to be movable up and down, for example, by a sliding mechanism (not shown). In the terminal bending process, after the terminal 2b is fixed by the pair of dies and the pair of punches, the pair of dies and the pair of punches are lowered to make the pair of rollers 3 contact the terminal 2b from the bottom, thereby bending the front end side of the terminal 2b upward. Specifically, in a state where the pair of rollers 3 are in contact with the terminal 2b from the bottom, the pair of dies and the pair of punches are further lowered, thereby bending the front end side of the terminal 2b upward.

[0030] The control unit 30 controls each part of the semiconductor manufacturing device 100 based on a control program related to the terminal bending process stored in the memory of the control unit 30. The control unit 30 is, for example, a processor. Specifically, the control unit 30 controls the switching of the two pairs of dies 5 and 6 and the two pairs of punches 7 and 8 and the driving of the sliding mechanism. The control unit 30 determines which pair of the two pairs of dies 5 and 6 and the two pairs of punches 7 and 8 is used based on information related to the size of the semiconductor device 1. The information related to the size of the semiconductor device 1 can be input by the manufacturer from an external input device, or can be read from the memory of the control unit 30.

[0031] <Action>

[0032] Next, the operation of the semiconductor manufacturing apparatus 100 will be described. Figure 1 As shown, firstly, a pair of die heads 5 and a pair of punches 7 are used to fix the root of the terminal 2b. Figure 2 As shown, the base of the terminal 2b is fixed by a pair of dies 6 and a pair of punches 8. At this time, the control unit 30 determines which pair of the two pairs of dies 5 and 6 and the two pairs of punches 7 and 8 to use based on information related to the size of the semiconductor device 1.

[0033] The lower parts of the two pairs of dies 5 and 6 are supported by springs (not shown), and after the terminal 2b is fixed, the punch 7 (or punch 8) and the die 5 (or die 6) are lowered to make the terminal 2b contact the pair of rollers 3. In a state where the pair of rollers 3 are in contact with the terminal 2b from the lower side, the pair of dies and the pair of punches are further lowered, so that the front end side of the terminal 2b is bent upward.

[0034] The two pairs of die heads 5 and 6 and the two pairs of punches 7 and 8 are fixed so as not to move in the horizontal direction, but the pair of rollers 3 can move in the horizontal direction, thereby enabling terminals of various sizes to be bent in the semiconductor manufacturing apparatus 100 .

[0035] <Effect>

[0036] As described above, the semiconductor manufacturing apparatus 100 according to the first embodiment includes: a plurality of pairs of dies 5 and 6, which can be switched between a first fixing position for fixing the semiconductor device 1 in a state of contacting the terminals 2b protruding from a pair of opposite side portions of the semiconductor device 1 from the bottom and a first avoiding position avoiding the terminals 2b; a plurality of pairs of punches 7 and 8, which can be switched between a second fixing position for fixing the semiconductor device 1 in a state of contacting the terminals 2b from the top and a second avoiding position avoiding the terminals 2b; a pair of terminal bending portions for bending the terminals 2b by contacting the portions of the terminals 2b not fixed by the plurality of pairs of dies 5 and 6 and the plurality of pairs of punches 7 and 8; and a control unit 30 for controlling the switching of the plurality of pairs of dies 5 and 6 and the plurality of pairs of punches 7 and 8. When fixing the terminals 2b, one pair of dies among the plurality of pairs of dies 5 and 6 is switched to the first fixing position, and one pair of punches among the plurality of pairs of punches 7 and 8 is switched to the second fixing position, and the pair of terminal bending portions can be moved in the horizontal direction.

[0037] Therefore, when manufacturing products of different sizes, the pair of terminal bent portions can be arranged at the bent position by switching the pair of die heads to the first fixed position and the pair of punches to the second fixed position in accordance with the product size, and by moving the pair of terminal bent portions in the horizontal direction. In this way, the pair of terminal bent portions can be arranged at the bent position by moving the pair of terminal bent portions individually in the horizontal direction without moving the entire die, so that the bending accuracy of the terminal 2b can be improved when manufacturing products of different sizes.

[0038] Furthermore, since the pair of terminal bent portions are rollers 3 , it is possible to suppress the terminal 2 b from being damaged when the terminal 2 b comes into contact with the rollers 3 .

[0039] <Variation of Implementation Example 1>

[0040] Next, a modified example of the first embodiment is described. The control unit 30 does not necessarily have to perform control based on information input by the manufacturer, and may also recognize the size of the semiconductor device 1 and automatically perform control. For example, the semiconductor manufacturing device 100 may also have a sensor (not shown) that detects the size of the semiconductor device 1 and transmits the detection result to the control unit 30. The control unit 30 performs control based on the detection result. As the sensor, a light sensor or a load sensor that detects weight is used. In this way, the size of the semiconductor device 1 can be automatically set in the control unit 30.

[0041] In addition, the pair of terminal bending parts are not limited to the rollers 3, and may be a punch.

[0042] <Implementation Method 2>

[0043] Next, a semiconductor manufacturing apparatus 100A according to the second embodiment will be described. Figure 5 It is a side view of the semiconductor manufacturing apparatus 100A according to the second embodiment. Figure 6 It is a top view of a semiconductor manufacturing apparatus 100A according to Embodiment 2. In Embodiment 2, the same components as those described in Embodiment 1 are denoted by the same reference numerals, and description thereof is omitted.

[0044] <Overall Structure>

[0045] like Figure 5 and Figure 6 As shown, in Embodiment 2, a semiconductor manufacturing apparatus 100A includes a pair of conveyance rails 11 , a pair of support tables 10 , a pair of rollers 3 as a pair of terminal bending portions, a pair of slide bases 12 , a servo motor 13 , a connecting portion 14 , two shafts 15 , and a base 16 .

[0046] A pair of sliding bases 12 are arranged on the base 16. The pair of sliding bases 12 are connected to both ends of the connecting portion 14. In addition, both ends of the two shafts 15 are inserted into the pair of sliding bases 12. The pair of sliding bases 12 are configured to be able to move in the horizontal direction ( Figure 5 The connecting portion 14 is connected to the rotating shaft (not shown) of the servo motor 13, and the servo motor 13 drives the pair of slide bases 12 to move in the horizontal direction ( Figure 6 By moving a pair of slide bases 12 in the horizontal direction, the interval between the pair of slide bases 12 can be changed.

[0047] The pair of conveyance guides 11 are disposed on the pair of slide bases 12 at intervals from each other at the lower side of the terminal 2b of the semiconductor device 1, and fix the semiconductor device 1 in a state of contacting the lower side of the terminal 2b. As described above, the connection portion 14 is operated by the drive of the servo motor 13, thereby changing the interval between the pair of slide bases 12 and the interval between the pair of conveyance guides 11 disposed on the pair of slide bases 12.

[0048] The pair of support tables 10 are arranged on the upper side of the semiconductor device 1, and the semiconductor device 1 is fixed in a state of contacting the terminal 2b from the upper side. The pair of support tables 10 are arranged at a position opposite to the pair of conveying rails 11 so that the terminal 2b can be fixed with the pair of conveying rails 11. For example, the distance between the pair of support tables 10 is changed by a sliding mechanism (not shown) to match the distance between the pair of conveying rails 11. Specifically, the distance between the pair of support tables 10 is changed based on information related to the size of the semiconductor device 1.

[0049] The pair of rollers 3 are each supported by a pair of roller support portions 3a, and the pair of roller support portions 3a are held by a pair of slide bases 12 so as to be able to move in the horizontal direction ( Figure 5 The pair of rollers 3 are each arranged outside the pair of conveying guide rails 11 when viewed from the side. The pair of rollers 3 bend the terminal 2b by contacting a portion of the terminal 2b that is not fixed by the pair of conveying guide rails 11 and the pair of support tables 10, specifically, a portion of the terminal 2b that is closer to the front end than a portion fixed by the pair of conveying guide rails 11 and the pair of support tables 10.

[0050] The pair of rollers 3 is held by a sliding mechanism (not shown) so as to be movable up and down. In the terminal bending process, after the terminal 2b is fixed by the pair of conveying guides 11 and the pair of support tables 10, the pair of rollers 3 are raised so as to contact the terminal 2b from the bottom, thereby bending the front end side of the terminal 2b upward. Specifically, in a state where the pair of rollers 3 are in contact with the terminal 2b from the bottom, the pair of rollers 3 are further raised, thereby bending the front end side of the terminal 2b upward.

[0051] Alternatively, the pair of rollers 3 may be replaced by a pair of conveying guides 11 and a pair of support platforms 10, for example, being held by a sliding mechanism (not shown) so as to be movable up and down. In this case, in the terminal bending process, after the terminal 2b is fixed by the pair of conveying guides 11 and the pair of support platforms 10, the pair of conveying guides 11 and the pair of support platforms 10 are lowered to make the pair of rollers 3 contact the terminal 2b from the bottom, thereby bending the front end side of the terminal 2b upward. Specifically, in a state where the pair of rollers 3 are in contact with the terminal 2b from the bottom, the pair of conveying guides 11 and the pair of support platforms 10 are further lowered, thereby bending the front end side of the terminal 2b upward.

[0052] Although not shown in the figure, a control unit is provided to control each unit of the semiconductor manufacturing apparatus 100A based on a control program related to the terminal bending process stored in a memory provided therein.

[0053] <Action>

[0054] Next, the operation of the semiconductor manufacturing apparatus 100A will be described. Figure 5 As shown, first, the pair of conveying guides 11 are moved in the horizontal direction by driving the servo motor 13 to change the interval between the pair of conveying guides 11 in accordance with the size of the semiconductor device 1. At this time, the control unit (not shown) changes the interval between the pair of conveying guides 11 based on the information related to the size of the semiconductor device 1. Here, the information related to the size of the semiconductor device 1 is input in the same method as in the case of the first embodiment or the modified example of the first embodiment.

[0055] Next, the distance between the pair of support tables 10 is changed by a sliding mechanism (not shown) in accordance with the distance between the pair of conveying rails 11. By the above change, the base of the terminal 2b is fixed by the pair of conveying rails 11 and the pair of support tables 10. In addition, the pair of support tables 10 and the servo motor 13 may be connected in such a manner that the distance between the pair of support tables 10 is changed in conjunction with the driving of the servo motor 13.

[0056] After fixing the terminal 2b, the pair of rollers 3 are raised to bring the terminal 2b into contact with the pair of rollers 3. In a state where the pair of rollers 3 are in contact with the terminal 2b from below, the pair of rollers 3 are further raised to bend the front end side of the terminal 2b upward.

[0057] <Effect>

[0058] As described above, the semiconductor manufacturing apparatus 100A according to the second embodiment includes: a pair of conveyance rails 11 which are arranged at intervals from each other on the lower side of the terminals 2b protruding from a pair of opposite side portions of the semiconductor device 1 and fix the semiconductor device 1 in a state of contacting the lower side of the terminals 2b; a pair of support tables 10 which fix the semiconductor device 1 in a state of contacting the terminals 2b from the upper side; and a pair of terminal bending portions which bend the terminals by contacting portions of the terminals 2b which are not fixed by the pair of conveyance rails 11 and the pair of support tables 10. The pair of terminal bending portions can move in the horizontal direction, and the interval between the pair of conveyance rails 11 can be changed.

[0059] Therefore, when manufacturing products of different sizes, the pair of terminal bending parts can be arranged at the bending position by changing the interval between the pair of conveying guide rails 11 and the interval between the pair of support platforms 10 in accordance with the product size and moving the pair of terminal bending parts in the horizontal direction. In this way, the pair of terminal bending parts can be arranged at the bending position by moving the pair of terminal bending parts individually in the horizontal direction without moving the entire mold, so that the bending accuracy of the terminal 2b can be improved when manufacturing products of different sizes.

[0060] Furthermore, by simply changing the interval between the pair of conveyance rails 11 and the pair of support tables 10 and moving the pair of terminal bending portions in the horizontal direction, it is possible to cope with products of various sizes, so that the manufacturing cost of the semiconductor device 1 can be reduced compared to the first embodiment.

[0061] Furthermore, since the pair of terminal bent portions are rollers 3 , it is possible to suppress the terminal 2 b from being damaged when the terminal 2 b comes into contact with the rollers 3 .

[0062] The semiconductor manufacturing apparatus 100A further includes a servo motor 13 for moving the pair of transport rails 11 and the pair of terminal bending parts in the horizontal direction. Therefore, the pair of transport rails 11 and the pair of terminal bending parts can be automatically controlled.

[0063] In addition, the pair of terminal bending parts or the pair of conveying rails 11 can move up and down, and after the terminal 2b is fixed by the pair of conveying rails 11 and the pair of support platforms 10, the terminal 2b is bent by raising the pair of terminal bending parts or lowering the pair of conveying rails 11. Therefore, expensive molds are not required, and the automation of production change operations can be realized.

[0064] Furthermore, the various embodiments may be freely combined, and the various embodiments may be appropriately modified or omitted.

[0065] The aspects of the present invention are summarized below as supplementary notes.

[0066] (Note 1)

[0067] A semiconductor manufacturing device comprising:

[0068] a plurality of pairs of die heads capable of switching between a first fixing position for fixing the semiconductor device in a state of contacting terminals protruding from a pair of opposite side portions of the semiconductor device from below and a first avoiding position for avoiding the terminals;

[0069] a plurality of pairs of punches capable of switching between a second fixing position for fixing the semiconductor device in a state of contacting the terminal from above and a second avoiding position avoiding the terminal;

[0070] a pair of terminal bending portions that bend the terminal by contacting portions of the terminal that are not fixed by the pairs of dies and the pairs of punches; and

[0071] A control unit controls the switching of the plurality of pairs of die heads and the plurality of pairs of punch heads,

[0072] When fixing the terminal, one of the plurality of pairs of dies is switched to the first fixed position, and one of the plurality of pairs of punches is switched to the second fixed position.

[0073] The pair of terminal bent portions is movable in a horizontal direction.

[0074] (Note 2)

[0075] The semiconductor manufacturing device according to Supplement 1, wherein:

[0076] The pair of terminal bent portions are rollers.

[0077] (Note 3)

[0078] The semiconductor manufacturing device according to Supplement 1 or 2, wherein:

[0079] A sensor is further provided, the sensor detects the size of the semiconductor device and transmits the detection result to the control unit,

[0080] The control unit controls switching of the plurality of pairs of the die heads and the plurality of pairs of the punches based on the detection result.

[0081] (Note 4)

[0082] The semiconductor manufacturing device according to Supplement 3, wherein:

[0083] The sensor is a light sensor or a load sensor.

[0084] (Note 5)

[0085] A semiconductor manufacturing device comprising:

[0086] a pair of conveying guides which are arranged at intervals from each other on the lower sides of terminals protruding from a pair of opposite side portions of the semiconductor device and fix the semiconductor device in a state of contacting the lower sides of the terminals;

[0087] a pair of support tables that fix the semiconductor device in a state of contacting the terminals from above; and

[0088] a pair of terminal bending portions that bend the terminal by contacting the portion of the terminal that is not fixed by the pair of conveying guides and the pair of support tables,

[0089] The pair of terminal bending parts can move in the horizontal direction,

[0090] The distance between the pair of conveying rails can be changed.

[0091] (Note 6)

[0092] The semiconductor manufacturing device according to Supplementary Note 5, wherein:

[0093] The pair of terminal bent portions are rollers.

[0094] (Note 7)

[0095] The semiconductor manufacturing device according to Supplement 5 or 6, wherein:

[0096] A servo motor is further provided, and the servo motor moves the pair of the conveyance guide rails and the pair of the terminal bending portions in a horizontal direction.

[0097] (Note 8)

[0098] A semiconductor manufacturing device according to any one of Supplementary Notes 5 to 7, wherein:

[0099] A pair of the terminal bending parts or a pair of the conveying guide rails can move up and down,

[0100] After the terminal is fixed by the pair of the conveyance rails and the pair of the support tables, the terminal is bent by raising the pair of terminal bending portions or lowering the pair of the conveyance rails.

[0101] Description of the label

[0102] 1 semiconductor device, 2b terminal, 3 roller, 5, 6 die head, 7, 8 punch, 10 support table, 11 conveying guide rail, 13 servo motor, 30 control unit, 100, 100A semiconductor manufacturing device.

Claims

1. A semiconductor manufacturing device comprising: a plurality of pairs of die heads capable of switching between a first fixing position for fixing the semiconductor device in a state of contacting terminals protruding from a pair of opposite side portions of the semiconductor device from below and a first avoiding position for avoiding the terminals; a plurality of pairs of punches capable of switching between a second fixing position for fixing the semiconductor device in a state of contacting the terminal from above and a second avoiding position avoiding the terminal; a pair of terminal bending parts that bend the terminal by contacting a portion of the terminal that is not fixed by the plurality of pairs of dies and the plurality of pairs of punches; as well as A control unit controls the switching of the plurality of pairs of die heads and the plurality of pairs of punch heads, When fixing the terminal, one of the plurality of pairs of dies is switched to the first fixed position, and one of the plurality of pairs of punches is switched to the second fixed position. The pair of terminal bent portions is movable in a horizontal direction.

2. The semiconductor manufacturing apparatus according to claim 1, wherein: The pair of terminal bent portions are rollers.

3. The semiconductor manufacturing apparatus according to claim 1 or 2, wherein: A sensor is further provided, the sensor detects the size of the semiconductor device and transmits the detection result to the control unit, The control unit controls switching of the plurality of pairs of the die heads and the plurality of pairs of the punches based on the detection result.

4. The semiconductor manufacturing apparatus according to claim 3, wherein: The sensor is a light sensor or a load sensor.

5. A semiconductor manufacturing device comprising: a pair of conveying guides which are arranged at intervals from each other on the lower sides of terminals protruding from a pair of opposite side portions of the semiconductor device and fix the semiconductor device in a state of contacting the lower sides of the terminals; a pair of support tables that fix the semiconductor device in a state of contacting the terminals from above; and a pair of terminal bending portions that bend the terminal by contacting the portion of the terminal that is not fixed by the pair of conveying guides and the pair of support tables, The pair of terminal bending parts can move in the horizontal direction, The distance between the pair of conveying rails can be changed.

6. The semiconductor manufacturing apparatus according to claim 5, wherein: The pair of terminal bent portions are rollers.

7. The semiconductor manufacturing apparatus according to claim 5 or 6, wherein: A servo motor is further provided, and the servo motor moves the pair of the conveyance guide rails and the pair of the terminal bending portions in a horizontal direction.

8. The semiconductor manufacturing apparatus according to any one of claims 5 to 7, wherein: A pair of the terminal bending parts or a pair of the conveying guide rails can move up and down, After the terminal is fixed by the pair of the conveyance rails and the pair of the support tables, the terminal is bent by raising the pair of terminal bending portions or lowering the pair of the conveyance rails.

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