A launching component structure

Abstract

The present invention discloses a transmitting assembly structure, comprising a control board, an attenuation unit, a delay unit, a correction detection unit, and a radio frequency unit; the control board is connected to the attenuation unit, the delay unit, and the correction detection unit; the attenuation unit and the delay unit are respectively connected to the radio frequency unit to receive radio frequency signal input; the attenuation unit is connected to the delay unit, which is connected to the radio frequency output terminal and outputs the processed radio frequency signal in a combined manner; the correction detection unit is connected to the correction signal input terminal, the detection signal input terminal of the correction detection unit is connected to the control board, and the correction detection unit is provided with a correction signal output terminal. The present invention simplifies the external cascade interface and the number of cores, reduces hardware costs, and improves product production efficiency and maintainability.

Description

Technical Field

[0001] The present invention relates to the field of communication technology, and in particular to a transmitting component structure. Background Art

[0002] With the advancement of wireless communication technology, the demand for high-performance, low-cost wireless communication equipment continues to increase. RF / microwave components operating at higher frequencies provide wider bandwidth, enabling high-capacity communications while meeting the requirements for high-quality communication and interference resistance. As a crucial component of active transmit phased arrays, the performance, cost, and maintainability of the transmitter assembly significantly impact the performance and cost of the phased array.

[0003] At present, conventional RF / microwave components are often designed using the traditional hybrid two-dimensional integration method, that is, the two-dimensional integration method of digital PCB board + single-layer microwave circuit chip, or LTCC substrate + microwave device. In the Journal of Electronic Industry Technology (Volume 41, Issue 4, July 2020), a multi-layer circuit substrate manufacturing technology for radar high-frequency T / R components was disclosed. The TSV multi-layer circuit achieved an ultra-high integration three-dimensional chip component. Its product has high integration, but high cost and poor maintainability. In the Journal of Electronic Mechanical Engineering (Volume 38, Issue 3, June 2022), a study on the micro-assembly technology of satellite-borne microwave components was introduced. It also followed the traditional design ideas and adopted the two-dimensional integration method of LTCC substrate + microwave devices. Its product reliability is high, but the cost, integration and maintainability also do not meet current needs. Summary of the Invention

[0004] To solve the above problems, the present invention provides a transmitting component structure, which combines the input 4-channel RF signals after amplification, 8-way digital controlled delay, 6-way digital controlled attenuation and other shaping processes, and outputs them. The control board is connected to the ports of each functional chip through a control bus. Based on the control signal, the component is enabled to simultaneously have the functions of amplifying, detecting or attenuating, detecting and outputting the 4-channel correction signals through switch control, thereby realizing a compatible design of the component's working modes.

[0005] The present invention provides a launch assembly structure, and the specific technical solution is as follows:

[0006] It includes a control board, an attenuation unit, a delay unit, a correction and detection unit, and a radio frequency unit;

[0007] The control board is connected to the attenuation unit, the delay unit, and the correction and detection unit respectively;

[0008] The attenuation unit and the delay unit are respectively connected to the radio frequency unit to receive radio frequency signal input, the attenuation unit is connected to the delay unit, and the delay unit is connected to the radio frequency output end to combine and output the processed radio frequency signal;

[0009] The correction detection unit is connected to the correction signal input end, the detection signal input end of the correction detection unit is connected to the control board, and the correction detection unit is provided with a correction signal output end.

[0010] Furthermore, the radio frequency unit includes four radio frequency signal inputs, which are respectively connected to the attenuation unit and the delay unit through radio frequency connectors.

[0011] Furthermore, the attenuation unit includes a first attenuation module and a second attenuation module. The first attenuation module and the second attenuation module respectively receive one RF signal through the RF connector and output the signal as two RF signals.

[0012] Furthermore, the delay unit includes a first delay module and a second delay module, and the first delay module and the second delay module respectively receive one RF signal input through the RF connector, and respectively receive one RF signal output from the first attenuation module and the second attenuation module.

[0013] Furthermore, the attenuation unit, the delay unit and the correction detection unit all use a multifunctional chip as a processor, and the multifunctional chip uses SIPFC-CB-0116.

[0014] Furthermore, the correction detection unit is connected to the correction signal input end through four radio frequency connectors to receive four correction signal inputs respectively.

[0015] Furthermore, the control board includes four wave control chips connected in parallel, and the wave control chips are connected to the attenuation unit, the delay unit, and the correction detection unit through a power bus and a control bus respectively.

[0016] Furthermore, the wave control chip adopts GND2004CQ.

[0017] Furthermore, the control board is also connected to a low-frequency connector, which receives and outputs the detection signal transmitted by the control board, and transmits the power signal and control signal of the host computer to the control board.

[0018] Furthermore, the low-frequency connector adopts J63A-2F2-21-431-TH.

[0019] The beneficial effects of the present invention are as follows:

[0020] Compared with the traditional structure, the transmitting component structure of the present invention greatly reduces the number of external low-frequency connector cores. Based on this structure, the number of control signal lines of the wave control chip is reduced, the cascade interface and the number of cores are simplified, the product's utilization efficiency is improved, and at the same time, the hardware cost is reduced, and the product production efficiency and maintainability are improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the radio frequency link structure of the present invention.

[0022] Figure 2 It is a schematic diagram of the control panel structure of the present invention. DETAILED DESCRIPTION

[0023] The following description clearly and completely describes the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts are within the scope of protection of the present invention.

[0024] In the description of the embodiments of the present invention, it should be noted that the indicated orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, or the orientations or positional relationships in which the inventive product is typically placed when in use, or the orientations or positional relationships commonly understood by those skilled in the art, or the orientations or positional relationships in which the inventive product is typically placed when in use. These are merely for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the present invention. In addition, the terms "first" and "second" are used only to distinguish descriptions and should not be understood as indicating or implying relative importance.

[0025] In describing the embodiments of the present invention, it should be noted that, unless otherwise specified or limited, the terms "disposed" and "connected" should be understood broadly. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to direct connections or indirect connections through an intermediary. Those skilled in the art will understand the specific meanings of these terms in the present invention based on the specific circumstances.

[0026] Example 1

[0027] Embodiment 1 of the present invention discloses a transmitting component structure, such as Figure 1 As shown, the details are as follows:

[0028] It includes a control board, an attenuation unit, a delay unit, a correction and detection unit, and a radio frequency unit;

[0029] In this embodiment, the radio frequency unit includes four radio frequency signal inputs, which are respectively connected to the attenuation unit and the delay unit through radio frequency connectors;

[0030] Specifically, there are four RF connectors for receiving RF signals, forming a RF input port.

[0031] The control board is connected to the attenuation unit, the delay unit, and the correction and detection unit respectively;

[0032] As a preferred embodiment, Figure 2 As shown, the control board includes four wave control chips connected in parallel, and the wave control chips are connected to the processor via a power bus and a control bus respectively;

[0033] Specifically, the wave control chip adopts GND2004CQ.

[0034] As a preferred embodiment, the control board is further connected to a low-frequency connector, which receives and outputs the detection signal transmitted by the control board, and transmits the power signal and control signal of the host computer to the control board;

[0035] Specifically, the low-frequency connector adopts J63A-2F2-21-431-TH.

[0036] The attenuation unit and the delay unit are respectively connected to the radio frequency unit to receive radio frequency signal input, the attenuation unit is connected to the delay unit, and the delay unit is connected to the radio frequency output end to combine and output the processed radio frequency signal;

[0037] As a preferred embodiment, the attenuation unit includes a first attenuation module and a second attenuation module. The first attenuation module and the second attenuation module respectively receive one RF signal through the RF connector and output the signal as two RF signals.

[0038] The delay unit includes a first delay module and a second delay module. The first delay module and the second delay module respectively receive one RF signal input through the RF connector, and respectively receive one RF signal output from the first attenuation module and the second attenuation module. The first delay module and the second delay module are respectively connected to two RF connectors to form four RF output ports. After the first delay module and the second delay module combine the received signals, they are divided into two RF outputs through the two connected RF connectors.

[0039] Specifically, the attenuation unit, delay unit and correction detection unit all use a multifunctional chip as a processor, and the multifunctional chip uses SIPFC-CB-0116;

[0040] The radio frequency connector adopts LRM / RFM12JEE-2.

[0041] The correction detection unit is connected to the correction signal input end, the detection signal input end of the correction detection unit is connected to the control board, and the correction detection unit is provided with a correction signal output end;

[0042] The correction detection unit is connected to the correction signal input terminal through four radio frequency connectors to receive four correction signal inputs respectively;

[0043] The correction detection unit performs amplification detection processing or attenuation detection processing on the received correction signal through the control signal, and outputs it to the control board; the correction detection unit is also connected to a radio frequency connector to form a correction signal output port, which outputs the received correction signal.

[0044] The present invention is not limited to the aforementioned specific embodiments, but extends to any new features or any new combination disclosed in this specification, as well as any new method or process steps or any new combination disclosed.

Claims

1. A transmitting assembly structure, characterized in that: It includes a control board, an attenuation unit, a delay unit, a correction and detection unit, and a radio frequency unit; The control board is connected to the attenuation unit, the delay unit, and the correction and detection unit respectively; The attenuation unit and the delay unit are respectively connected to the radio frequency unit to receive radio frequency signal input, the attenuation unit is connected to the delay unit, and the delay unit is connected to the radio frequency output end to combine and output the processed radio frequency signal; The radio frequency unit includes four radio frequency signal inputs, which are respectively connected to the attenuation unit and the delay unit through radio frequency connectors; The attenuation unit includes a first attenuation module and a second attenuation module, wherein the first attenuation module and the second attenuation module respectively receive one channel of radio frequency signal through the radio frequency connector and output the signal as two channels of radio frequency signal; The delay unit includes a first delay module and a second delay module, wherein the first delay module and the second delay module respectively receive one RF signal input through the RF connector, and respectively receive one RF signal output from the first attenuation module and the second attenuation module; The attenuation unit, delay unit and correction detection unit all use a multifunctional chip as a processor, and the multifunctional chip uses SIPFC-CB-0116; The correction detection unit is connected to the correction signal input end, the detection signal input end of the correction detection unit is connected to the control board, and the correction detection unit is provided with a correction signal output end; the correction detection unit performs amplification detection processing or attenuation detection processing on the received correction signal through the control signal, and outputs it to the control board.

2. The launch assembly structure according to claim 1, characterized in that: The correction detection unit is connected to the correction signal input end through four radio frequency connectors and receives four correction signal inputs respectively.

3. The launch assembly structure according to claim 1, characterized in that: The control board includes four wave control chips connected in parallel, and the wave control chips are connected to the attenuation unit, the delay unit, and the correction detection unit through a power bus and a control bus respectively.

4. The launch assembly structure according to claim 3, characterized in that: The wave control chip adopts GND2004CQ.

5. The launching assembly structure according to claim 3, characterized in that: The control board is also connected to a low-frequency connector, which receives and outputs the detection signal transmitted by the control board, and transmits the power signal and control signal of the host computer to the control board.

6. The launching assembly structure according to claim 5, characterized in that: The low-frequency connector is J63A-2F2-21-431-TH.

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