Packaging circuit board, heat dissipation system and electronic equipment

Abstract

The present invention discloses a packaged circuit board, a heat dissipation system and an electronic device, which are applied to the field of heat dissipation of electronic devices. The packaged circuit board comprises: a substrate, on which electronic components are installed; a package component, which is arranged on the substrate, and the electronic components are located inside the package component; a plurality of liquid cooling micro tubes, which are used to carry heat dissipation media, and the liquid cooling micro tubes are located inside the package component, and the liquid cooling micro tubes extend from the inlet of the package component to the outlet of the package component. The packaged circuit board provided by the present invention has high heat dissipation efficiency, is easy to process, occupies a small volume, does not need to deploy a cold plate or a radiator, and is conducive to the lightweight design of the chassis.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation of electronic equipment, and in particular to a packaged circuit board, a heat dissipation system and electronic equipment. Background Art

[0002] In the process of heat dissipation of electronic equipment, two methods are generally used: immersion liquid cooling and cold plate liquid cooling. Immersion liquid cooling technology directly immerses heat-generating electronic components, such as CPU (Central Processing Unit), GPU (Graphics Processing Unit), memory and hard disk, in a non-conductive inert fluid medium, namely coolant, to achieve heat transfer and dissipation; cold plate liquid cooling technology refers to the use of a cold plate (usually a closed cavity made of high thermal conductivity metals such as copper and aluminum) to indirectly transfer the heat generated by electronic components to the cooling liquid enclosed in the circulation pipe, and then use the cooling liquid to take away the heat.

[0003] However, in the related technologies, when immersion liquid cooling technology is used, corrosion may occur due to the server being immersed in the coolant for a long time, which in turn affects the function and performance. In addition, immersion liquid cooling technology generally adopts a box-type deployment structure, and the deployment density is lower than that of cold plate liquid cooling. Since it needs to be changed to a box-type deployment, the difficulty and cost of modifying the equipment room and servers are also relatively high. When cold plate liquid cooling technology is used, due to the multi-layer thermal interface material and complex thermal interface contact, the overall thermal resistance of the circuit board is very high, and the heat dissipation effect cannot meet the heat dissipation requirements of future high-power density data centers. In addition, the weight of the cold plate itself is relatively large, which can easily cause the sinking and deformation of the rack-mounted server.

[0004] Therefore, how to improve the heat dissipation efficiency of electronic components is a technical problem that technical personnel in this field currently need to solve. Summary of the invention

[0005] The purpose of the present invention is to provide a packaged circuit board, a heat dissipation system and an electronic device, which can significantly improve the heat dissipation efficiency of the packaged circuit board and reduce the volume.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A packaging circuit board, comprising:

[0008] a substrate, on which electronic components are mounted;

[0009] A packaging component is arranged on the substrate, and the electronic components are located inside the packaging component;

[0010] A plurality of liquid cooling micro tubes are used for carrying heat dissipation medium. The liquid cooling micro tubes are located in the packaging component and extend from the inlet of the packaging component to the outlet of the packaging component.

[0011] On the other hand, the liquid cooling micro tube is arranged in contact with the surface of the electronic component, and the liquid cooling micro tube extends from one side of the electronic component to the other side.

[0012] On the other hand, the inlet of the packaging component is located on a side of the packaging component close to the substrate, and a substrate avoidance hole is provided on the substrate. After the liquid cooling micro-tube passes through the substrate avoidance hole, it enters the inlet of the packaging component.

[0013] On the other hand, the outlet of the package component is located at a side of the package component facing away from the substrate, and the liquid cooling micro-tube extends out of the outlet of the package component and extends to a target height.

[0014] On the other hand, the outer diameter of the liquid-cooled microtube is 1-2 mm and the wall thickness is 0.4-0.6 mm.

[0015] On the other hand, the liquid-cooled microtube is provided with an inlet section, a cooling section and an outlet section in sequence from the first end to the second end. The extension directions of the inlet section and the outlet section are perpendicular to the extension direction of the cooling section, and the cooling section is arranged parallel to the surface of the electronic component.

[0016] On the other hand, high-speed signal pins and power signal pins are connected between the substrate and the mainboard. The high-speed signal pins and the power signal pins are arranged along a first direction on the surface of the substrate, and the liquid cooling microtubes are arranged along a second direction on the surface of the electronic components. The first direction is perpendicular to the second direction.

[0017] The present invention also provides a heat dissipation system, comprising any one of the above-mentioned packaged circuit boards.

[0018] On the other hand, it also includes a chassis shell, which is provided with a liquid storage chamber for storing a cooling medium and a circuit board installation chamber for installing a circuit board. A mainboard is provided in the chassis shell, and the mainboard is located between the liquid storage chamber and the circuit board installation chamber, and the packaged circuit board is installed on the mainboard; a mainboard avoidance hole is provided on the mainboard, and the liquid cooling microtube passes through the mainboard avoidance hole and is connected to the liquid storage chamber.

[0019] On the other hand, the chassis shell includes a chassis shell, a cover plate and a partition plate, the partition plate is installed inside the chassis shell, and a liquid storage chamber is formed between the partition plate and the side wall of the chassis shell and between the mainboard and the bottom plate of the chassis shell.

[0020] On the other hand, the liquid storage chamber includes a liquid storage part and a liquid supply part which are interconnected. The liquid storage part is located beside the main board, the liquid supply part is located at the bottom of the main board, and the liquid level height of the liquid storage part is higher than the liquid level height of the liquid supply part.

[0021] On the other hand, a guide component is also provided on the top of the circuit board installation chamber. The cooling medium is a two-phase cooling medium. The outlet of the liquid cooling microtube faces the guide component, and the guide component is used to supply the liquefied cooling medium to flow into the liquid storage chamber.

[0022] On the other hand, the cover plate is detachably connected to the chassis shell; and / or the flow guide component is detachably connected to the chassis shell.

[0023] On the other hand, the upper part of the flow guide component forms an air storage area, and the flow guide component is a waterproof and breathable film component; the flow guide component is inclined downward from the side away from the liquid storage part to the side close to the liquid storage part.

[0024] On the other hand, the waterproof breathable film member is a polymer material film member.

[0025] On the other hand, the inclination angle of the guide component relative to the horizontal direction is 10°~60°.

[0026] On the other hand, a condensation zone is provided on the upper part of the liquid storage part, and a cooling fan, a heat conducting fin and / or a heat dissipation cold plate are provided on the outer side of the chassis shell at a position corresponding to the condensation zone.

[0027] On the other hand, heat dissipation fins and / or capillary heat dissipation components are arranged inside the condensation area to allow the vaporized cooling medium to liquefy and flow into the liquid storage part.

[0028] On the other hand, the liquid level height of the liquid storage part is higher than the height of the electronic components and lower than the height of the outlet port of the liquid cooling micro tube.

[0029] The present invention also provides an electronic device, comprising any one of the above-mentioned heat dissipation systems.

[0030] The packaged circuit board provided by the present invention has the following beneficial effects: by arranging liquid-cooling microtubes in the packaging components, the heat of electronic components is taken away by the cooling medium in the liquid-cooling microtubes, thereby achieving effective cooling of the electronic components; the cooling medium in the liquid-cooling microtubes may be a flowing cooling medium, for example, a circulation system may be provided to supply cooling medium to the liquid-cooling microtubes, and a cooling medium with a lower temperature flows into the liquid-cooling microtubes. When the cooling medium flows through the packaging components, the heat of the electronic components is transferred to the cooling medium by heat exchange, and the heated cooling medium flows out of the packaging components along the liquid-cooling microtubes, and the heat of the electronic components located inside the packaging components is taken away by the circulating flow of the cooling medium; or, the cooling medium in the liquid-cooling microtubes may be a two-phase cooling medium, which refers to a cooling medium that undergoes a phase change during the cooling process, that is, changes from a liquid state to a gaseous state. When the cooling medium is cooled, the cooling medium changes phase from a liquid state to a gaseous state. When the medium flows into the interior of the packaged component through the liquid cooling micro-tube, due to the high heat of the electronic components, the cooling medium will undergo a phase change, from liquid to gas, thereby taking away the heat of the electronic components. The vaporized cooling medium can be condensed in the chassis and then passed into the liquid cooling micro-tube again, or the vaporized cooling medium can be introduced to the outside of the chassis for condensation. This method directly exchanges energy inside the packaged component without the need for a cold plate, which can effectively avoid the cold plate occupying the internal volume of the chassis, and eliminates the need for multiple layers of thermal interface materials and complex thermal interface contacts, which can effectively reduce thermal resistance, and is beneficial for compressing the thickness space between the packaged circuit board and the motherboard to the extreme, which is beneficial for the deployment of high-density systems. At the same time, it can avoid the corrosion that may occur when electronic equipment is immersed in coolant for a long time in the immersion liquid cooling solution, and avoid the impact on the function and performance of electronic components.

[0031] The packaged circuit board provided by the present invention has high heat dissipation efficiency, is easy to process, occupies a small volume, does not require the deployment of a cold plate or a radiator, and is conducive to achieving a lightweight design of the chassis.

[0032] In one embodiment, a high-speed signal pin and a power signal pin are connected between the substrate and the mainboard. The high-speed signal pin realizes signal transmission between the substrate and the mainboard, and the power signal pin realizes power transmission between the mainboard and the substrate. The high-speed signal pin and the power signal pin are arranged along a first direction on the surface of the substrate. Specifically, the number of the high-speed signal pin and the power signal pin can be multiple. Generally, the high-speed signal pins are arranged in parallel, and the power signal pins are arranged in parallel. The high-speed signal pin and the power signal pin extend from the surface of the substrate to the side of the substrate, and are connected to the mainboard after being bent. Furthermore, the liquid cooling microtubes are arranged along a second direction on the surface of the electronic components. The number of the liquid cooling microtubes can also be multiple, and the multiple liquid cooling microtubes can also be arranged in parallel. In order to improve the heat dissipation efficiency, a part of the structure of the liquid cooling microtube is located On the surface of the substrate, the inlet and outlet of the liquid-cooling microtube can extend in the vertical direction to facilitate the cooling medium to enter the liquid-cooling microtube, that is, the inlet of the liquid-cooling microtube is located on the side of the packaging component close to the substrate, and the outlet of the liquid-cooling microtube is located on the side of the packaging component away from the substrate; wherein, the surface of the electronic component can be parallel to the surface of the substrate. In order to avoid interference between the liquid-cooling microtube and the setting position of the high-speed signal pin and the power signal pin, the first direction is set to be perpendicular to the second direction, that is, the arrangement direction of the high-speed signal pin and the power signal pin on the surface of the substrate is perpendicular to the arrangement direction of the liquid-cooling microtube on the surface of the electronic component, that is, the high-speed signal pin and the power signal pin in the packaging component are orthogonally distributed with the liquid-cooling microtube, which can effectively ensure the integration and signal transmission efficiency of the packaging component, reduce interference, facilitate layout, and ensure the use effect.

[0033] The heat dissipation system provided by the present invention is provided with the above-mentioned packaged circuit board. Since the packaged circuit board has the above-mentioned technical effects, the heat dissipation system provided with the packaged circuit board should also have corresponding technical effects.

[0034] The electronic device provided by the present invention is provided with the above-mentioned heat dissipation system. Since the heat dissipation system has the above-mentioned technical effects, the electronic device provided with the heat dissipation system should also have corresponding technical effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0036] Figure 1 A schematic structural diagram of a specific implementation of the packaged circuit board provided by the present invention;

[0037] Figure 2for Figure 1 A left side view of the package circuit board shown;

[0038] Figure 3 for Figure 1 A top view of the packaged circuit board shown;

[0039] Figure 4 A schematic diagram of the structure of the packaged circuit board provided by the present invention and the main board after removing the packaging components;

[0040] Figure 5 for Figure 4 A side view of the main board and the package circuit board shown;

[0041] Figure 6 for Figure 4 A top view of the main board and the package circuit board shown;

[0042] Figure 7 A cross-sectional view of a specific implementation of the heat dissipation system provided by the present invention;

[0043] Figure 8 A schematic diagram of the structure of a chassis in the heat dissipation system provided by the present invention;

[0044] Fig. 9 for Figure 8 The internal structure diagram of the chassis shown;

[0045] Fig.10 It is a schematic diagram of the structure of the main board and the packaged circuit board in the heat dissipation system provided by the present invention.

[0046] Reference numerals:

[0047] Packaged circuit board 1; substrate 11; electronic components 12; packaged component 13; liquid-cooled microtube 14; inlet section 141; cooling section 142; outlet section 143; high-speed signal pin 15; chassis shell 2; chassis shell 201; cover plate 202; partition plate 203; liquid storage chamber 21; liquid storage part 211; liquid supply part 212; condensation area 213; cooling fan 214; circuit board installation chamber 22; mainboard 23; flow guide component 24; gas storage area 241. DETAILED DESCRIPTION

[0048] The core of the present invention is to provide a packaged circuit board, a heat dissipation system and an electronic device, which can significantly reduce thermal resistance, improve heat dissipation efficiency and facilitate structural deployment.

[0049] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0050] As the iteration of AI (Artificial Intelligence) integrated circuits accelerates, the power consumption of integrated circuits increases generation by generation, and liquid cooling technology becomes the key to improving heat dissipation efficiency. Liquid cooling microchannel technology optimizes the spatial layout and improves the compactness of the overall design by penetrating the motherboard 23 and extending to the liquid storage tank. Compared with the existing cold plate solution, it saves the thickness space occupied by the cold plate and its mounting structure. Compared with traditional immersion liquid cooling, liquid cooling microchannel technology using a two-phase cooling medium can keep the motherboard 23 dry, avoiding the process of first handling the liquid and then maintaining the motherboard 23, reducing maintenance requirements and potential failure risks.

[0051] Please refer to Figures 1 to 6 In this embodiment, the packaged circuit board 1 includes:

[0052] A substrate 11, on which electronic components 12 are mounted;

[0053] The packaging component 13 is disposed on the substrate 11, and the electronic components 12 are located inside the packaging component 13;

[0054] A plurality of liquid cooling micro tubes 14 are used to carry heat dissipation medium. The liquid cooling micro tubes 14 are located in the packaging component 13 . The liquid cooling micro tubes 14 extend from the inlet of the packaging component 13 to the outlet of the packaging component 13 .

[0055] Specifically, the substrate 11 is used to install the electronic components 12, and the packaging component 13 can be made of plastic or other materials. The integrated circuit is connected to the substrate 11 or the lead frame through specific processes and technologies, so as to protect the integrated circuit from the influence of the external environment; the liquid cooling micro tube 14 has a heat dissipation micro channel inside. With the help of the heat dissipation micro channel technology, it is suitable for the heat dissipation needs of a large amount of heat generated by the high-performance GPU when running under high load. By setting the heat dissipation micro channel in the packaging component 13, the cooling medium flows in these channels to absorb and take away the heat. The cooling medium is directly cooled near the heat source, which can significantly improve the heat dissipation efficiency; for the flow power of the cooling medium, a liquid cooling pump can be set to drive the cooling medium to circulate in the liquid cooling micro tube 14; then a radiator is set to dissipate the heat absorbed by the cooling medium to the external environment; the liquid cooling micro tube 14 and the radiator are connected through a liquid supply / return line to form a complete cooling cycle; the structure of the liquid cooling micro tube 14 can distribute heat more evenly and avoid local overheating.

[0056] Furthermore, there can be multiple liquid-cooling microtubes 14, which are installed inside the packaging component 13 in a parallel arrangement, or there can be only one liquid-cooling microtube 14, which is installed inside the packaging component 13 in a surrounding manner. In order to ensure the heat dissipation effect of the liquid-cooling microtube 14 and avoid the blockage of a single liquid-cooling microtube 14 and the impact of the heat dissipation, it is better to set up multiple liquid-cooling microtubes 14.

[0057] The packaged circuit board 1 is provided with a liquid cooling microtube 14 in the packaging component 13, and utilizes the cooling medium in the liquid cooling microtube 14 to take away the heat of the electronic components 12, thereby realizing effective cooling of the electronic components 12. The cooling medium in the liquid cooling microtube 14 can be a flowing cooling medium. For example, a circulation system can be provided to supply cooling medium to the liquid cooling microtube 14, and a cooling medium with a lower temperature flows into the liquid cooling microtube 14. When the cooling medium flows through the packaging component 13, the heat of the electronic components 12 is transferred to the cooling medium by heat exchange. The heated cooling medium flows out of the packaging component 13 along the liquid cooling microtube 14, and the heat of the electronic components 12 located inside the packaging component 13 is taken away by the circulating flow of the cooling medium. Alternatively, the cooling medium in the liquid cooling microtube 14 can also be a two-phase cooling medium. A two-phase cooling medium refers to a cooling medium that undergoes a phase change during the cooling process, that is, changes from a liquid state to a gaseous state. When the cooling medium is cooled, the phase change occurs. When the medium flows into the interior of the packaging component 13 through the liquid cooling micro-tube 14, due to the high heat of the electronic components 12, the cooling medium will undergo a phase change, from liquid to gas, thereby taking away the heat of the electronic components 12. For the vaporized cooling medium, it can be condensed in the chassis and then passed into the liquid cooling micro-tube 14 again, or the vaporized cooling medium can be introduced into the outside of the chassis for condensation; this method directly exchanges energy inside the packaging component 13, without the need to set up a cold plate, which can effectively avoid the cold plate occupying the internal volume of the chassis, and eliminates the need for multi-layer thermal interface materials and complex thermal interface contacts, which can effectively reduce thermal resistance, and is conducive to compressing the thickness space of the packaging circuit board 1 and the mainboard 23 to the extreme, which is conducive to the deployment of high-density systems; at the same time, it can avoid the corrosion that may occur when the electronic equipment is immersed in the coolant for a long time in the immersion liquid cooling solution, and avoid the impact on the function and performance of the electronic components 12. The packaging circuit board 1 has high heat dissipation efficiency, convenient processing, small occupied volume, no need to deploy a cold plate or radiator, and is conducive to the lightweight design of the chassis.

[0058] In some embodiments, the liquid cooling micro tube 14 is arranged to be attached to the surface of the electronic component 12, and the liquid cooling micro tube 14 extends from one side of the electronic component 12 to the other side; specifically, the liquid cooling micro tube 14 is attached to the surface of the electronic component 12, so that the heat of the electronic component 12 can be transferred to the liquid cooling micro tube 14 as quickly as possible. In order to ensure that the liquid cooling micro tube 14 fully dissipates heat for the electronic component 12, the liquid cooling micro tube 14 can extend from one side of the electronic component 12 to the other side, that is, the liquid cooling micro tube 14 can cover the entire electronic component 12; of course, In order to further improve the heat dissipation effect of the liquid-cooling microtubes 14 on the electronic components 12, there are multiple liquid-cooling microtubes 14, which are arranged in sequence. The total width of each liquid-cooling microtube 14 is consistent with the width of the electronic component 12, and the liquid-cooling microtube 14 extends along the length direction of the electronic component 12; of course, it can also be set as: the total width of each liquid-cooling microtube 14 is consistent with the length of the electronic component 12, and the liquid-cooling microtube 14 extends along the width direction of the electronic component 12, that is, after the liquid-cooling microtubes 14 are arranged, they can cover the entire electronic component 12, and the heat dissipation effect is better.

[0059] In some embodiments, the entrance of the packaging component 13 is located on a side of the packaging component 13 close to the substrate 11, that is, the liquid-cooling microtube 14 extends from the bottom of the packaging component 13 to the interior of the packaging component 13, and a substrate avoidance hole is provided on the substrate 11. After the liquid-cooling microtube 14 passes through the substrate avoidance hole, it enters the entrance of the packaging component 13. In this way, the liquid-cooling microtube 14 will not occupy the space on the side of the substrate 11. Due to the arrangement of the electronic components 12, the space of the packaging component 13 is saved; in order to ensure the sealing effect of the packaging component 13, sealing materials such as sealant need to be filled between the liquid-cooling microtube 14 and the substrate avoidance hole and the entrance of the packaging component 13.

[0060] In some embodiments, the outlet of the packaging component 13 is located on the side of the packaging component 13 facing away from the substrate 11, and the liquid-cooling microtube 14 extends out of the outlet of the packaging component 13 and extends to the target height, which can prevent the heat dissipation medium from entering the interior of the packaging component 13; specifically, the outlet of the packaging component 13 can extend in the vertical direction and extend the packaging component 13 from the top of the packaging component 13, which can make more full use of the space, and when the cooling medium is a two-phase cooling medium, it is also beneficial for the gaseous cooling medium to flow out of the liquid-cooling microtube 14; similarly, in order to ensure the sealing effect of the packaging component 13, a sealing material, such as a sealant, is also needed to be filled between the liquid-cooling microtube 14 and the outlet of the packaging component 13.

[0061] In some embodiments, the outer diameter of the liquid-cooling microtube 14 is 1-2 mm, and the wall thickness is 0.4-0.6 mm, for example, 0.5 mm; in this way, the liquid-cooling microtube 14 can use the siphon effect to absorb the cooling medium, so as to always maintain a liquid flow in the liquid-cooling microtube 14 without the risk of dry burning. In order to enhance the siphon effect, a capillary structure can also be set inside the liquid-cooling microtube 14; further, the material of the liquid-cooling microtube 14 can be copper, aluminum, diamond or other materials with good thermal conductivity.

[0062] In some embodiments, the liquid-cooling microtube 14 is provided with an inlet section 141, a cooling section 142 and an outlet section 143 in sequence from the first end to the second end, that is, the inlet section 141, the cooling section 142 and the outlet section 143 are connected in sequence, and the extension directions of the inlet section 141 and the outlet section 143 are perpendicular to the extension direction of the cooling section 142. Specifically, the extension directions of the inlet section 141 and the outlet section 143 are along the vertical direction, and the extension direction of the cooling section 142 is along the horizontal direction, and the cooling section 142 is arranged parallel to the surface of the electronic component 12. Such an arrangement is conducive to the cooling section 142 to more fully contact the surface of the electronic component 12. At the same time, the inlet section 141 and the outlet section 143 will not occupy the space of the packaged circuit board 1 in the horizontal direction, thereby avoiding the occupation of the space on the main board 23. The inlet section 141 and the outlet section 143 only occupy the space of the packaged circuit board 1 in the vertical direction, which is beneficial to the space deployment of the chassis.

[0063] In some embodiments, a high-speed signal pin 15 and a power signal pin are connected between the substrate 11 and the mainboard 23. The high-speed signal pin 15 and the power signal pin are arranged along a first direction on the surface of the substrate 11. The liquid cooling microtube 14 is arranged along a second direction on the surface of the electronic component 12. The first direction is perpendicular to the second direction. Specifically, a high-speed signal pin 15 and a power signal pin are connected between the substrate 11 and the main board 23. The high-speed signal pin 15 realizes signal transmission between the substrate 11 and the main board 23, and the power signal pin realizes power transmission between the main board 23 and the substrate 11. The high-speed signal pin 15 and the power signal pin are arranged along a first direction on the surface of the substrate 11. Specifically, the number of the high-speed signal pin 15 and the power signal pin can be multiple. Generally, the high-speed signal pins 15 are arranged in parallel, and the power signal pins are arranged in parallel. The high-speed signal pin 15 and the power signal pin extend from the surface of the substrate 11 to the side of the substrate 11, and are connected to the main board 23 after being bent. Further, the liquid cooling micro tube 14 is arranged along a second direction on the surface of the electronic component 12. The number of the liquid cooling micro tube 14 can also be multiple, and the multiple liquid cooling micro tubes 14 can also be arranged in parallel. In order to improve the heat dissipation efficiency, a part of the structure of the liquid cooling micro tube 14 is located on the substrate 1 1, the inlet and outlet of the liquid-cooling microtube 14 can extend in the vertical direction to facilitate the cooling medium to enter the liquid-cooling microtube 14, that is, the inlet of the liquid-cooling microtube 14 is located on the side of the packaging component 13 close to the substrate 11, and the outlet of the liquid-cooling microtube 14 is located on the side of the packaging component 13 away from the substrate 11; wherein, the surface of the electronic component 12 can be parallel to the surface of the substrate 11, and in order to avoid interference between the liquid-cooling microtube 14 and the setting positions of the high-speed signal pin 15 and the power signal pin, the first direction is set to be perpendicular to the second direction, that is, the arrangement direction of the high-speed signal pin 15 and the power signal pin on the surface of the substrate 11 is perpendicular to the arrangement direction of the liquid-cooling microtube 14 on the surface of the electronic component 12, that is, the high-speed signal pin 15 and the power signal pin in the packaging component 13 are orthogonally distributed with the liquid-cooling microtube 14, which can effectively ensure the integration and signal transmission efficiency of the packaging component 13, reduce interference, facilitate layout, and ensure the use effect.

[0064] In a specific embodiment, the packaged circuit board 1 includes a substrate 11, a packaging component 13 and a plurality of liquid-cooling microtubes 14, the substrate 11 is mounted with electronic components 12, the packaging component 13 is arranged on the substrate 11, and the electronic components 12 are located inside the packaging component 13; the liquid-cooling microtubes 14 contain a cooling medium, the liquid-cooling microtubes 14 are located inside the packaging component 13, and the liquid-cooling microtubes 14 extend from the inlet of the packaging component 13 to the outlet of the packaging component 13; the number of the liquid-cooling microtubes 14 can be multiple, and they are installed inside the packaging component 13 in a parallel arrangement; the liquid-cooling microtubes 14 are arranged in contact with the surface of the electronic components 12, and the liquid-cooling microtubes 14 extend from one side of the electronic components 12 to the other side; the inlet of the packaging component 13 is located on the side of the packaging component 13 close to the substrate 11, and the base A substrate avoidance hole is provided on the plate 11. After the liquid-cooling micro-tube 14 passes through the substrate avoidance hole, it enters the entrance of the packaging component 13. The exit of the packaging component 13 is located on the side of the packaging component 13 away from the substrate 11; the liquid-cooling micro-tube 14 is provided with an entrance section 141, a cooling section 142 and an exit section 143 from the first end to the second end in sequence, and the extension directions of the entrance section 141 and the exit section 143 are both perpendicular to the extension direction of the cooling section 142, and the cooling section 142 is arranged parallel to the surface of the electronic component 12; a high-speed signal pin 15 and a power signal pin are connected between the substrate 11 and the main board 23, and the high-speed signal pin 15 and the power signal pin are arranged along a first direction on the surface of the substrate 11, and the liquid-cooling micro-tube 14 is arranged along a second direction on the surface of the electronic component 12, and the first direction is perpendicular to the second direction.

[0065] In addition to the above-mentioned packaged circuit board 1 , the present invention further provides a heat dissipation system including the above-mentioned packaged circuit board 1 .

[0066] In some embodiments, please refer to Figures 7 to 10The heat dissipation system also includes a chassis shell 2, a mainboard 23 is installed in the chassis shell 2, and a plurality of packaged circuit boards 1 are installed on the mainboard 23. A liquid storage chamber 21 and a circuit board installation chamber 22 are provided in the chassis shell 2. The liquid storage chamber 21 should be sealed, and a cooling medium is filled in the liquid storage chamber 21. A mainboard 23 is provided in the chassis shell 2, and the mainboard 23 is located between the liquid storage chamber 21 and the circuit board installation chamber 22. The mainboard 23 can be used to separate the liquid storage chamber 21 and the circuit board installation chamber 22, thereby making full use of the structure of the mainboard 23. In order to reduce damage to the mainboard 23, a protective plate can also be added between the mainboard 23 and the liquid storage chamber 21. The protective plate is used to separate the liquid storage chamber 21 and the circuit board installation chamber 22. The mainboard 23 is located on the side of the protective plate away from the liquid storage chamber 21; further, the packaged circuit board 1 is installed on the mainboard 23, and multiple packaged circuit boards 1 can be set on a single mainboard 23. The liquid cooling micro-tubes 14 connected to each packaged circuit board 1 can pass The liquid can be supplied through a separate circulation system and connected to the liquid storage chamber 21, or the same circulation system can be shared for liquid supply, which saves costs; when the cooling medium in the liquid-cooling microtube 14 is a two-phase cooling medium, the liquid-cooling microtube 14 connected to each packaged circuit board 1 is connected to the liquid storage chamber 21, and then the gasified cooling medium is condensed through the same channel and flows back to the liquid storage chamber 21, which has high efficiency, does not require partitioning, and is convenient for layout; a mainboard avoidance hole is provided on the mainboard 23, and the liquid-cooling microtube 14 is connected to the liquid storage chamber 21 after passing through the mainboard avoidance hole; specifically, the inlet section 141 of the liquid-cooling microtube 14 is connected to the mainboard avoidance hole and connected to the liquid storage chamber 21, and the liquid-cooling microtube 14 passes through the mainboard avoidance hole on the mainboard 23, the substrate avoidance hole on the substrate 11 and the inlet of the package component 13 in turn, extends through the surface of the electronic component 12, and takes away the heat of the electronic component 12, and after the electronic component 12 is effectively cooled, it extends out through the outlet of the package component 13.

[0067] In some embodiments, the chassis housing 2 includes a chassis shell 201, a cover plate 202, and a partition plate 203, wherein the partition plate 203 is installed inside the chassis shell 201, and a liquid storage chamber 21 is formed between the partition plate 203 and the side wall of the chassis shell 201, and between the main board 23 and the bottom plate of the chassis shell 201. Specifically, the liquid storage part 211 of the liquid storage chamber 21 can be formed between the partition plate 203 and the side wall of the chassis shell 201, and the liquid supply part 212 of the liquid storage chamber 21 is formed between the main board 23 and the bottom plate of the chassis shell 201. It only needs to increase the structure of the partition plate 203 and set a sandwich between the main board 23 and the bottom plate of the chassis shell 201, which has low manufacturing cost and is easy to use.

[0068] In some embodiments, the cover plate 202 is detachably connected to the chassis shell 201; and / or, the air guide component 24 is detachably connected to the chassis shell 201. Specifically, the cover plate 202 and the air guide component 24 can both be detachably connected to the chassis shell 201. Specifically, a support step can be provided at the periphery of the chassis shell 201, and the periphery of the air guide component 24 is placed on the support step; the top cover of the chassis is also detachably connected to the chassis shell 201; when each packaged circuit board 1 on the mainboard 23 needs to be maintained, the top cover of the chassis can be separated from the chassis shell 201 first, and then the air guide component 24 can be removed, so that the packaged circuit board 1 can be easily maintained, and disassembly and maintenance can be facilitated while meeting the heat dissipation requirements.

[0069] In some embodiments, the liquid storage chamber 21 includes a liquid storage part 211 and a liquid supply part 212 that are interconnected. The liquid storage part 211 is located beside the main board 23, and the liquid supply part 212 is located at the bottom of the main board 23, and the liquid level height of the liquid storage part 211 is higher than the liquid level height of the liquid supply part 212; specifically, the liquid storage part 211 and the liquid supply part 212 form an L-shaped structure, the liquid storage part 211 provides cooling medium for the liquid supply part 212, and the liquid supply part 212 is connected to the liquid-cooling microtube 14. Such a configuration not only facilitates condensation, but also helps the liquid level in the liquid storage part 211 to press the cooling medium into the liquid-cooling microtube 14, which is beneficial to the circulation of the cooling medium.

[0070] In some embodiments, a guide component 24 is further provided on the top of the circuit board installation chamber 22, and the cooling medium is a two-phase cooling medium. The outlet of the liquid cooling microtube 14 faces the guide component 24, and the guide component 24 is used to supply the liquefied cooling medium to flow into the liquid storage chamber 21; through the setting of the guide component 24, the liquefied cooling medium can flow back into the liquid storage chamber 21 after condensation, so that the cooling medium can achieve self-circulation inside the chassis shell 2; as for how the liquid storage chamber 21 enters the liquid cooling microtube 14, the cooling medium in the liquid storage chamber 21 is automatically sucked into the liquid cooling microtube 14 through the siphon effect by setting the tube diameter size of the liquid cooling microtube 14, or setting a capillary structure, without setting a power component, which can effectively reduce costs.

[0071] In some embodiments, an air storage area 241 is formed at the upper portion of the guide component 24, and the guide component 24 is a waterproof and breathable film component; specifically, the guide component 24 is connected to the inner wall of the chassis shell 201 on all sides, and the vaporized cooling medium flows from the lower side of the guide component 24 to the upper side of the guide component 24, and after condensing in the air storage area 241, it flows back to the liquid storage part 211 through the guide component 24. Alternatively, the guide component 24 can also be set as a structure such as a plastic plate, and an air flow channel is set on the side of the guide component 24 away from the liquid storage part 211, that is, a gap is left between the side of the guide component 24 away from the liquid storage part 211 and the inner wall of the chassis shell 201, so that the gas storage area 241 is connected to the circuit board mounting chamber 22, so that the cooling medium in the liquid-cooled microtube 14 can enter the gas storage area 241 through the air flow channel after vaporization; that is to say, for the guide component 24, an air flow channel can be discharged on one side of the guide component 24, so that the vaporized cooling medium can flow from the lower side of the guide component 24 to the upper side of the guide component 24, and a waterproof and breathable film can also be selected to achieve the purpose of the gaseous cooling medium flowing from the lower side of the guide component 24 to the upper side. Furthermore, the two-phase cooling medium can be selected as needed, for example, it can be a fluorinated liquid, which is a high-performance cooling medium with good insulation and chemical stability, and can keep the liquid from freezing at extremely low temperatures. It also has a high latent heat of vaporization and can effectively absorb heat. It is chemically stable, non-flammable, has low corrosion to equipment, and has good dielectric properties, making it suitable for cooling electronic equipment. Furthermore, in order to ensure that the guide component 24 can smoothly guide the condensed liquid to the liquid storage portion 211, the guide component 24 is tilted downward from the side away from the liquid storage portion 211 to the side close to the liquid storage portion 211.

[0072] In some embodiments, the waterproof and breathable film component is a polymer film component, and specifically, a PE polymer film component or a PU polymer film component can be selected, as long as it can achieve the functions of being waterproof and breathable.

[0073] In some embodiments, the inclination angle of the guide component 24 relative to the horizontal direction is 10°~60° to ensure that the condensed liquid can flow smoothly back to the liquid storage part 211. The inclination angle should not be too large, resulting in a large occupied space, nor too small, resulting in low liquid return efficiency.

[0074] In some embodiments, a condensation area 213 is provided at the upper portion of the liquid storage portion 211. The vaporized cooling medium can be condensed in the gas storage area 241 or condensed again after entering the condensation area 213. A cooling fan 214, thermal fins and / or a heat dissipation cold plate are provided on the outer side of the chassis shell 2 at a position corresponding to the condensation area 213. The cooling fan 214, thermal fins and / or heat dissipation cold plate can accelerate the condensation efficiency of the condensation area 213, thereby improving the gas-liquid change efficiency of the cooling medium and ensuring that there is sufficient cooling medium in the liquid storage chamber 21.

[0075] In some embodiments, heat dissipation fins and / or capillary heat dissipation components are provided inside the condensation area 213 to liquefy the vaporized cooling medium and flow it into the liquid storage portion 211; specifically, the provision of heat dissipation fins and / or capillary heat dissipation components can accelerate the liquefaction efficiency of the vaporized cooling medium inside the condensation area 213, supplement the cooling fan 214, thermal fins and / or heat dissipation cold plate on the outside of the chassis shell 2, and enhance the condensation efficiency of the cooling medium.

[0076] In some embodiments, the liquid level of the liquid storage part 211 is higher than the height of the electronic components 12 and lower than the height of the outlet port of the liquid cooling micro tube 14; specifically, by setting the liquid level of the liquid storage part 211 to the height of the electronic components 12, the U-shaped tube principle can be used to make the liquid level of the cooling medium entering the liquid cooling micro tube 14 higher than the height of the electronic components 12, ensuring that the cooling medium can fully exchange heat with the electronic components 12; at the same time, the liquid level of the liquid storage part 211 is lower than the height of the outlet port of the liquid cooling micro tube 14, which can avoid the overflow of the cooling medium in the liquid cooling micro tube 14 under the U-shaped tube principle, and avoid damage to the mainboard 23. Further, in order to ensure that the cooling medium can smoothly flow into the liquid cooling micro tube 14, a sponge or other porous structure components can be set in the liquid cooling micro tube 14 to enhance the adsorption effect of the liquid cooling micro tube 14 on the cooling medium.

[0077] In some embodiments, the liquid storage part 211 is also provided with a liquid level sensor, which is used to obtain the liquid level height of the liquid storage part 211. When the liquid level height of the liquid storage part 211 is lower than the first preset height, the cooling fan 214 on the outside of the chassis shell 2 is controlled to increase the power, thereby improving the liquefaction efficiency of the gaseous cooling medium, replenishing the cooling medium of the liquid storage part 211 as soon as possible, ensuring that it has sufficient cooling medium, thereby having a sufficiently high pressure difference, and avoiding insufficient cooling medium in the liquid-cooling microtube 14; of course, when the liquid level height of the liquid storage part 211 is higher than the second preset height, the cooling fan 214 on the outside of the chassis shell 2 is controlled to reduce the power, thereby reducing energy consumption.

[0078] In a specific embodiment, the heat dissipation system includes a packaged circuit board 1 and a chassis shell 2, the packaged circuit board 1 includes a substrate 11, a packaging component 13 and a plurality of liquid-cooling microtubes 14, the substrate 11 is mounted with electronic components 12, the packaging component 13 is arranged on the substrate 11, and the electronic components 12 are located inside the packaging component 13; the liquid-cooling microtube 14 has a cooling medium, the liquid-cooling microtube 14 is located in the packaging component 13, and the liquid-cooling microtube 14 extends from the inlet of the packaging component 13 to the outlet of the packaging component 13; the chassis shell 2 is provided with a liquid storage chamber 21 for storing the cooling medium and a circuit board installation chamber 21 for installing the circuit board The housing 2 is provided with a mainboard 23, which is located between the liquid storage chamber 21 and the circuit board installation chamber 22, and the packaged circuit board 1 is installed on the mainboard 23; the mainboard 23 is provided with a mainboard avoidance hole, and the liquid cooling micro-tube 14 passes through the mainboard avoidance hole and is connected with the liquid storage chamber 21; the housing 2 includes a housing 201, a cover plate 202 and a partition plate 203, the partition plate 203 is installed inside the housing 201, and a liquid storage chamber 21 is formed between the partition plate 203 and the side wall of the housing 201 and between the mainboard 23 and the bottom plate of the housing 201; the cover plate 202 and the guide component 24 are connected with the housing 201; The chassis shell 201 is detachably connected; the liquid storage chamber 21 includes a liquid storage part 211 and a liquid supply part 212 which are interconnected, the liquid storage part 211 is located beside the mainboard 23, the liquid supply part 212 is located at the bottom of the mainboard 23, and the liquid level of the liquid storage part 211 is higher than the liquid level of the liquid supply part 212; a guide component 24 is also provided on the top of the circuit board installation chamber 22, the cooling medium is a two-phase cooling medium, the outlet of the liquid cooling micro tube 14 faces the guide component 24, the guide component 24 is used to supply the liquefied cooling medium to flow into the liquid storage chamber 21, and the upper part of the guide component 24 forms a gas storage area 241, the guide The flow component 24 is a waterproof and breathable film component, and the flow guide component 24 is inclined downward from the side away from the liquid storage part 211 to the side close to the liquid storage part 211; a condensation area 213 is provided on the upper part of the liquid storage part 211, and a cooling fan 214, heat-conducting fins and / or a heat-dissipating cold plate are provided on the outer side of the chassis shell 2 at a position corresponding to the condensation area 213; cooling fins and / or capillary heat-dissipating components are provided inside the condensation area 213 to liquefy the vaporized cooling medium and flow it into the liquid storage part 211; the liquid level height of the liquid storage part 211 is higher than the height of the electronic components 12 and lower than the outlet port height of the liquid-cooling microtube 14.

[0079] Specifically, by disposing liquid cooling micro-tubes 14 in the packaged circuit board 1, a phase change liquid cooling micro-channel is formed in the liquid cooling micro-tubes 14, and the cooling medium phase changes to take away the heat directly from the electronic components 12, and the phase change gas rises to the gas storage area 241, and then changes back to the liquid storage chamber 21 in the condensation area 213, and is then distributed to the liquid cooling micro-tubes 14 of the packaged circuit board 1, thereby forming a phase change heat dissipation circulation system in the sealed chassis; Specifically, the high-speed signal pins 15 and the power signal pins are soldered to the main board 23 in a conventional manner, and the liquid cooling micro-tubes 14 penetrate the main board 23 and extend into the liquid supply part 212 below the main board 23; the substrate 11 and the main board 23 of the packaged circuit board 1 should be properly grooved to facilitate the passage of the liquid cooling micro-tubes 14, and should be sealed during packaging; the material of the liquid cooling micro-tubes 14 is copper, aluminum, diamond and other materials with good thermal conductivity, and the structure is an outer diameter of 1~2m and a wall thickness of 0.The pipe is about 5mm in diameter; through the design of the overall system, the siphon effect can be used to ensure that the liquid flow rate is always maintained in the liquid cooling micro-tube 14 without the risk of dry burning; in order to enhance the siphon effect, a capillary structure can be set inside the pipe; in the packaged circuit board 1, the high-speed signal pin 15 and the liquid cooling micro-tube 14 are arranged orthogonally, that is, the high-speed signal pin 15 extends along the X-axis direction and leads the pin downward at the side of the package; the liquid cooling micro-tube 14 penetrates from the substrate 11, extends along the Y-axis direction, and fits the heating surface of the electronic component 12, from the package component 13; the inside of the chassis is divided into a gas storage area 241, a liquid storage chamber 21, a condensation area 213, and a circuit board installation chamber 22, wherein the condensation area 213 and the circuit board installation chamber 22 are separated by a partition 203, and the gas storage area 241 and the circuit board installation chamber 22 are separated by a guide component 24; the chassis as a whole needs to be sealed to prevent gas from overflowing; before the system works, the cooling medium should be fully filled, and the air in the chassis shell 2 should be emptied during the process of gasification of the cooling medium; the gas storage area 241 is made of a waterproof and breathable film part The film is at a certain angle to the horizontal plane; the phase-change gas, i.e., the gaseous cooling medium can enter the gas storage area 241 through the waterproof and breathable film component, and the condensed liquid cannot drip back onto the main board 23, so the main board 23 is kept dry; the gas storage area 241 is connected to the condensation area 213, and the gaseous cooling medium enters the condensation area 213 and is cooled and phase-changed into liquid, and flows into the liquid storage part 211; the liquid storage chamber 21 is below the main board 23, and is filled with cooling medium, and the liquid-cooling microtube 14 is immersed in the liquid storage chamber 21 to take liquid; The condensation area 213 connects the gas storage area 241 and the liquid storage chamber 21. The gas is cooled and phase-changed in this area by installing cooling means such as fans, heat-conducting fins, and cold plates on the outside of the condensation area 213. The heat exchange in the condensation area 213 can also be enhanced by fins, capillary structures, etc. The liquid filling amount ensures that the liquid level in the condensation area 213 is not lower than the upper edge of the electronic components 12 of the packaged circuit board 1 and not higher than the upper edge of the liquid cooling micro tube 14. Therefore, the siphon effect can be used to keep enough liquid in the phase change liquid cooling micro tube 14 without dry burning. .

[0080] The heat dissipation system has the following beneficial effects:

[0081] 1. Efficient heat dissipation: By deploying phase-change liquid cooling micro-tubes 14 in the packaged circuit board 1, heat is directly taken away from the electronic components 12, thereby improving heat dissipation efficiency; compared with the cold plate liquid cooling solution, it eliminates the need for multi-layer thermal interface materials and complex thermal interface contacts, greatly reducing thermal resistance;

[0082] 2. Circulation heat dissipation system: Through the interconnected design of the gas storage area 241, the condensation area 213, and the liquid storage chamber 21, a phase change heat dissipation circulation system is formed in a sealed chassis, ensuring continuous and effective heat dissipation; through precise control of the liquid filling amount and the capillary structure in the microchannel, an enhanced siphon effect is achieved, ensuring the continuous flow of liquid in the liquid cooling microtube 14, avoiding the risk of dry burning;

[0083] 3. Space utilization: The liquid cooling micro-tube 14 penetrates the mainboard 23 and extends to the liquid supply part 212, which optimizes the space layout and improves the compactness of the overall design. Compared with the existing cold plate solution, the thickness space occupied by the cold plate and its mounting structure is omitted, so that the thickness space of the assembly composed of the mainboard 23 and the packaged circuit board 1 is compressed to the extreme, which is conducive to the deployment of high-density systems.

[0084] 4. Package design: The orthogonal layout of the high-speed signal and the liquid-cooling micro-tube 14 in the package circuit board 1 ensures the package integration and signal transmission efficiency;

[0085] 5. Smooth gas rising channel: The lower surface of the gas storage area 241 is inclined toward the condensation area 213, which speeds up the liquid discharge speed, prevents the liquid from dripping back to the main board 23, and keeps the gas rising channel smooth;

[0086] 6. Mainboard 23 is easy to maintain: The gas storage area 241 uses a waterproof and breathable film material to ensure that the condensed liquid will not drip back to the mainboard 23; compared with the immersion liquid cooling solution, the mainboard 23 does not directly contact the liquid, remains dry, and does not need to be handled before maintenance, reducing maintenance requirements and potential failure risks;

[0087] 7. High reliability: In this solution, the motherboard 23 does not need to contact the liquid, which improves the reliability of the application of liquid cooling technology. In contrast, in general immersion liquid cooling solutions, electronic equipment may be corroded when immersed in the cooling medium for a long time, thereby affecting the function and performance;

[0088] 8. Lightweight: No cold plate or radiator is required, making the chassis lightweight;

[0089] 9. The equipment room is easy to implement: there is no need to deploy CDU (Coolant Distribution Unit), cooling medium, pipelines, etc. in the equipment room to achieve the heat dissipation effect of liquid cooling.

[0090] In addition to the above heat dissipation system, the present invention also provides an electronic device including the above heat dissipation system. For the structures of other parts of the electronic device, please refer to the relevant technology and will not be described in detail herein.

[0091] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0092] The packaged circuit board and the heat dissipation system provided by the present invention are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the present invention.

Claims

1. A heat dissipation system, comprising a packaged circuit board (1), characterized in that: The packaged circuit board (1) comprises: A substrate (11) having electronic components (12) mounted thereon; A packaging component (13) is arranged on the substrate (11), and the electronic component (12) is located inside the packaging component (13); A plurality of liquid cooling micro tubes (14) for carrying a heat dissipation medium, the liquid cooling micro tubes (14) being located in the packaging component (13), and the liquid cooling micro tubes (14) extending from an inlet of the packaging component (13) to an outlet of the packaging component (13); The invention also comprises a chassis shell (2), wherein a liquid storage chamber (21) for storing a cooling medium and a circuit board installation chamber (22) for installing a circuit board are provided in the chassis shell (2), a mainboard (23) is provided in the chassis shell (2), the mainboard (23) is located between the liquid storage chamber (21) and the circuit board installation chamber (22), and the packaged circuit board (1) is installed on the mainboard (23); a mainboard avoidance hole is provided on the mainboard (23), and the liquid cooling micro-tube (14) passes through the mainboard avoidance hole and is communicated with the liquid storage chamber (21); The liquid storage chamber (21) comprises a liquid storage portion (211) and a liquid supply portion (212) which are interconnected, the liquid storage portion (211) being located beside the main board (23), the liquid supply portion (212) being located at the bottom of the main board (23), and the liquid level of the liquid storage portion (211) being higher than the liquid level of the liquid supply portion (212); and the liquid level of the liquid storage portion (211) being higher than the height of the electronic component (12) and lower than the height of the outlet port of the liquid cooling micro tube (14); A flow guide component (24) is also provided on the top of the circuit board installation chamber (22); the cooling medium is a two-phase cooling medium; the outlet of the liquid cooling micro-tube (14) faces the flow guide component (24); and the flow guide component (24) is used to allow the liquefied cooling medium to flow into the liquid storage chamber (21).

2. The heat dissipation system according to claim 1, characterized in that: The liquid cooling micro tube (14) is arranged in contact with the surface of the electronic component (12), and the liquid cooling micro tube (14) extends from one side of the electronic component (12) to the other side.

3. The heat dissipation system according to claim 2, characterized in that: The inlet of the packaging component (13) is located on a side of the packaging component (13) close to the substrate (11), and a substrate avoidance hole is provided on the substrate (11); the liquid cooling micro-tube (14) passes through the substrate avoidance hole and enters the inlet of the packaging component (13).

4. The heat dissipation system according to claim 1, characterized in that: The outlet of the packaging component (13) is located on a side of the packaging component (13) facing away from the substrate (11), and the liquid cooling micro-tube (14) extends out of the outlet of the packaging component (13) and to a target height.

5. The heat dissipation system according to claim 1, characterized in that: The liquid cooling micro tube (14) has an outer diameter of 1-2 mm and a wall thickness of 0.4-0.6 mm.

6. The heat dissipation system according to any one of claims 1 to 5, characterized in that: The liquid cooling micro-tube (14) is provided with an inlet section (141), a cooling section (142) and an outlet section (143) in sequence from the first end to the second end; the extension directions of the inlet section (141) and the outlet section (143) are both perpendicular to the extension direction of the cooling section (142); and the cooling section (142) is arranged parallel to the surface of the electronic component (12).

7. The heat dissipation system according to claim 6, characterized in that: A high-speed signal pin (15) and a power signal pin are connected between the substrate (11) and the mainboard (23); the high-speed signal pin (15) and the power signal pin are arranged along a first direction on the surface of the substrate (11); the liquid cooling micro-tube (14) is arranged along a second direction on the surface of the electronic component (12); the first direction is perpendicular to the second direction.

8. The heat dissipation system according to claim 1, characterized in that: The chassis housing (2) comprises a chassis shell (201), a cover plate (202) and a partition plate (203); the partition plate (203) is installed inside the chassis shell (201), and the liquid storage chamber (21) is formed between the partition plate (203) and the side wall of the chassis shell (201) and between the mainboard (23) and the bottom plate of the chassis shell (201).

9. The heat dissipation system according to claim 8, characterized in that: The cover plate (202) is detachably connected to the chassis shell (201); and / or the flow guide component (24) is detachably connected to the chassis shell (201).

10. The heat dissipation system according to claim 1, characterized in that: An air storage area (241) is formed at the upper portion of the flow guide component (24); the flow guide component (24) is a waterproof and breathable film component; the flow guide component (24) is inclined downward from a side away from the liquid storage portion (211) to a side close to the liquid storage portion (211).

11. The heat dissipation system according to claim 10, characterized in that: The waterproof and breathable film component is a polymer material film component.

12. The heat dissipation system according to claim 10, characterized in that: The inclination angle of the flow guide component (24) relative to the horizontal direction is 10° to 60°.

13. The heat dissipation system according to claim 1, characterized in that: A condensation area (213) is provided on the upper part of the liquid storage part (211), and a heat dissipation fan (214), heat conduction fins and / or a heat dissipation cold plate are provided on the outer side of the chassis shell (2) at a position corresponding to the condensation area (213).

14. The heat dissipation system according to claim 13, characterized in that: The condensation area (213) is provided with heat dissipation fins and / or capillary heat dissipation components to allow the vaporized cooling medium to be liquefied and flow into the liquid storage portion (211).

15. An electronic device, comprising a heat dissipation system, characterized in that: The heat dissipation system is the heat dissipation system according to any one of claims 1 to 14.

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