Flexible VC, folding screen mobile phone and electronic equipment

By designing a stacked structure and buffer structure in the flexible temperature uniform plate, the problem of traditional temperature uniform plates being easily broken when folded by folding screen mobile phones is solved, and a higher structural strength and thermal conductivity and heat dissipation effect are achieved, reducing the risk of damage to the internal circuits by leakage of thermal fluids.

CN119677069APending Publication Date: 2025-03-21SUZHOU TIANMAI THERMAL TECH
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Patent Information

Application Number
CN202510128443.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-02-05
Publication Date
2025-03-21

AI Technical Summary

Technical Problem

When the folding screen of the traditional flexible temperature uniform plate is folded, the stress generated by bending is concentrated and it is easy to break, causing leakage of thermal fluid, affecting the heat dissipation effect and damaging the internal circuit.

Method used

A laminated structure including a first flexible cover plate, a flexible capillary structure and a second flexible cover plate is designed, by providing a buffer structure in each part and abutting in sequence along the thickness direction to achieve bending of the flexible VC in a specific area and increasing the steam diffusion area through the through groove.

Benefits of technology

It effectively reduces stress and deformation caused by regional bending and tensile strength, prevents rupture, improves structural strength, avoids leakage of thermal fluid, ensures good thermal conductivity and heat dissipation effect, and reduces the risk of damage to the internal circuit.

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Abstract

The invention discloses a flexible VC, a folding screen mobile phone and electronic equipment, the flexible VC comprises a first flexible cover plate and a second flexible cover plate, the first flexible cover plate and the second flexible cover plate are connected to form a cavity capable of accommodating a heat conduction working medium, a flexible capillary structure is arranged in the cavity, the first flexible cover plate is provided with a first buffer structure, and the second flexible cover plate is provided with a second buffer structure. The first buffer structure is used for buffering the bending of the first flexible cover plate on the first buffer structure; the second flexible cover plate comprises a second buffer structure, and the second buffer structure is used for buffering bending of the second flexible cover plate on the second buffer structure; the flexible capillary structure comprises a third buffer structure, and the third buffer structure is used for buffering bending of the flexible capillary structure on the third buffer structure; the first buffer structure, the second buffer structure and the third buffer structure are sequentially and correspondingly connected in an abutting mode in the thickness direction of the flexible VC so that the flexible VC can be bent in the bending direction.
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Description

Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and in particular to a novel capillary support structure and a processing method thereof, and a temperature equalizing plate using the novel capillary support structure. Background Art

[0002] With the rise of smart terminal consumer electronic products, especially foldable screen mobile phones, higher design and performance requirements are placed on VC (Vapor Chamber) used to conduct heat and dissipate heat for mobile phones.

[0003] When a foldable phone is folded, the stress generated by the bending will be concentrated at the bend, making the VC very easy to crack. This will not only affect the structural strength of the VC and the foldable phone, but also cause VC leakage in severe cases, which will not only affect the heat conduction and heat dissipation effect of the VC on the foldable phone, but also cause liquid immersion damage to the internal circuits of the foldable phone.

[0004] The present application solves at least one of the above technical problems. Summary of the invention

[0005] The purpose of the present invention is to provide a flexible VC, a folding screen mobile phone and an electronic device to solve the problem that when the traditional flexible VC is folded, the stress generated by the bending will be concentrated at the bending point, making the VC very easy to break, which not only affects the structural strength of the VC and the folding screen mobile phone, but also causes VC leakage in severe cases, affecting the thermal conductivity and heat dissipation effect of the VC on the folding screen mobile phone, and causing liquid immersion damage to the internal circuit of the folding screen mobile phone. The flexible VC of the present application can reduce the stress and deformation caused by regional bending and stretching, prevent the flexible VC from breaking due to bending, improve the structural strength of the flexible VC, avoid the leakage of heat-conducting fluid caused by the rupture of the flexible VC, ensure that the flexible VC has a good thermal conductivity and heat dissipation effect on the folding screen mobile phone, and reduce the risk of liquid immersion damage to the internal circuit of the folding screen mobile phone due to leakage of heat-conducting fluid.

[0006] The purpose of the present invention is achieved by the following technical solutions:

[0007] In a first aspect of the present invention, a flexible VC is provided, comprising a first flexible cover plate and a second flexible cover plate, wherein the first flexible cover plate and the second flexible cover plate are connected to form a cavity capable of accommodating a heat-conducting medium, wherein a flexible capillary structure is provided in the cavity;

[0008] The first flexible cover plate is provided with a first buffer structure, and the first buffer structure is used to buffer the bending of the first flexible cover plate in the first buffer structure; the second flexible cover plate includes a second buffer structure, and the second buffer structure is used to buffer the bending of the second flexible cover plate in the second buffer structure; the flexible capillary structure includes a third buffer structure, and the third buffer structure is used to buffer the bending of the flexible capillary structure in the third buffer structure;

[0009] The first buffer structure, the second buffer structure and the third buffer structure are sequentially and correspondingly abutted along the thickness direction of the flexible VC, so that the flexible VC can be bent along the bending direction.

[0010] Compared with the prior art, the beneficial effects of the present invention are that the first flexible cover plate, the flexible capillary structure and the second flexible cover plate are stacked structures, which are stacked along the thickness direction of the flexible VC. Since the first buffer structure, the third buffer structure and the second buffer structure are sequentially correspondingly abutted along the thickness direction of the flexible VC, when the flexible VC is bent along a preset bending direction, at the same time, the first flexible cover plate is bent along the bending direction at the first buffer structure, the flexible capillary structure is bent along the bending direction at the third buffer structure, and the second flexible cover plate is bent along the bending direction at the second buffer structure, so the flexible VC can be bent in a specific area.

[0011] Furthermore, when the flexible VC is bent in a specific area along the bending direction, the presence of the first buffer structure, the third buffer structure and the second buffer structure adaptively buffer the bending generated in the specific area along the bending direction, so that the flexible VC with the stacked structure can better adapt to deformation when bending, reduce the stress and deformation caused by regional bending and stretching, prevent the flexible VC from breaking due to bending, improve the structural strength of the flexible VC, avoid the leakage of heat conductive fluid caused by the rupture of the flexible VC, ensure that the flexible VC has a good thermal conductivity and heat dissipation effect on the folding screen mobile phone, and reduce the risk of immersion damage to the internal circuits of the folding screen mobile phone due to leakage of heat conductive fluid.

[0012] In some possible implementations of the first aspect, the third buffer structure is provided with a through groove penetrating the third buffer structure along the thickness direction; and / or

[0013] The length of the through slot is not less than the length of the third buffer structure.

[0014] In some possible implementations of the first aspect, the first flexible cover plate and / or the second flexible cover plate is located at one side of the cavity and is provided with a plurality of first protrusions for abutting against the flexible capillary structure.

[0015] In some possible implementations of the first aspect, at least one side of the flexible capillary structure is provided with a plurality of second protrusions for abutting against the first flexible cover plate and / or the second flexible cover plate.

[0016] In some possible implementations of the first aspect, the first buffer structure, the second buffer structure and the third buffer structure are respectively formed by at least one group of protrusions and depressions adjacent to each other along a first direction, and the first direction is perpendicular to the bending direction.

[0017] In some possible implementations of the first aspect, along the first direction, the adjacent protrusions and depressions form a wavy structure.

[0018] In some possible implementations of the first aspect, the first flexible cover plate and / or the second flexible cover plate comprises a high molecular polymer layer.

[0019] In some possible implementations of the first aspect, the first flexible cover plate and / or the second flexible cover plate further includes a metal layer disposed on an inner surface of the high molecular polymer layer, and the metal layer is located in the cavity.

[0020] In some possible implementations of the first aspect, the flexible capillary support structure is a single hydrophilic organic compound material layer or a structural layer in which multiple hydrophilic organic compound material layers are stacked on each other.

[0021] In some possible implementations of the first aspect, the organic compound material layer is a mesh fabric, and the second protrusion is formed by the mesh fabric using a jacquard fabric process.

[0022] A second aspect of the present invention provides a foldable screen mobile phone, which includes the flexible VC described in the first aspect.

[0023] A third aspect of the present invention provides an electronic device, wherein the electronic device comprises the flexible VC described in the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of the exploded structure of the flexible VC according to an embodiment of the present invention;

[0025] Figure 2 Schematic diagram of the bending of the flexible VC according to an embodiment of the present invention;

[0026] Figure 3 It is a schematic diagram of the cross-sectional structure of a flexible VC according to an embodiment of the present invention;

[0027] Figure 4 For the embodiment of the present invention Figure 1 A schematic diagram of the enlarged structure at A in the middle;

[0028] Figure 5For the embodiment of the present invention Figure 1 Schematic diagram of the enlarged structure at point B in the middle.

[0029] In the figure, 1, first flexible cover plate; 2, second flexible cover plate; 3, flexible capillary structure; 11, first buffer structure; 12, first protrusion; 21, second buffer structure; 31, third buffer structure; 311, through groove; 100, cavity. DETAILED DESCRIPTION

[0030] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to make the present invention more comprehensive and complete and to fully convey the concepts of example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted.

[0031] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, or it can be an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0032] In the description of the present application, it should be understood that the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are orientations or positional relationships based on the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0033] In addition, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, for example, a process, method, system, product, or display comprising a series of steps or elements is not necessarily limited to those steps or elements explicitly listed, but may include other steps or elements not explicitly listed or inherent to such process, method, product, or display.

[0034] Combined with Figure 1-3As shown, the present application provides an embodiment, and the present embodiment provides a flexible VC, including a first flexible cover plate 1 and a second flexible cover plate 2, the first flexible cover plate 1 and the second flexible cover plate 2 are connected to form a cavity 100 capable of accommodating a heat-conducting medium, and a flexible capillary structure 3 is provided in the cavity 100. In this embodiment, the first flexible cover plate 1 can be an upper cover plate, and the second flexible cover plate 2 can be a lower cover plate.

[0035] Furthermore, the temperature homogenizing plate also has a hot end in contact with the heat source and a cold end away from the heat source, and the direction from the hot end to the cold end is a first direction F3.

[0036] It should be noted that the heat conducting medium is a liquid phase change material, such as liquid water, ethanol, and acetone. Through the transformation process of the heat conducting medium from liquid to gas and then to liquid, the heat is quickly dissipated, thereby exerting the heat conduction and heat dissipation effect of the flexible VC. In order to ensure that the transformation process of the heat conducting medium from liquid to gas and then to liquid is not affected by impurities, the cavity 100 is generally in a closed vacuum state, thereby improving the heat conduction and heat dissipation effect of the flexible VC.

[0037] The first flexible cover plate 1 is provided with a first buffer structure 11, and the first buffer structure 11 is used to buffer the bending of the first flexible cover plate 1 in the first buffer structure 11. The second flexible cover plate 2 includes a second buffer structure 21, and the second buffer structure 21 is used to buffer the bending of the second flexible cover plate 2 in the second buffer structure 21. The flexible capillary structure 3 is provided with a third buffer structure 31, and the third buffer structure 31 is used to buffer the bending of the flexible capillary structure 3 in the third buffer structure 31.

[0038] It should be noted that the flexible capillary structure 3 can be abutted against the first flexible cover plate 1 and the second flexible cover plate 2 at the same time (i.e., along the thickness direction F1 of the flexible VC, one side of the flexible capillary structure 3 abuts against the first flexible cover plate 1, and the other side abuts against the second flexible cover plate 2), or can be separated from each other and placed in the cavity 100 between the first flexible cover plate 1 and the second flexible cover plate 2. Both methods can meet the working requirements of the flexible VC.

[0039] The first buffer structure 11 , the third buffer structure 31 and the second buffer structure 21 are sequentially and correspondingly abutted along the thickness direction of the flexible VC, so that the flexible VC can be bent along the bending direction F2 .

[0040] Specifically, along the thickness direction of the flexible VC, one side of the third buffer structure 31 is embedded in the first buffer structure 11 , and the second buffer structure 21 is embedded in the other side of the third buffer structure 31 to form a stacked structure.

[0041] The first flexible cover plate 1, the flexible capillary structure 3, and the second flexible cover plate 2 are stacked structures, which are stacked along the thickness direction of the flexible VC. Since the first buffer structure 11, the third buffer structure 31 and the second buffer structure 21 are sequentially correspondingly abutted along the thickness direction of the flexible VC, when the flexible VC is bent along a preset bending direction, at the same time, the first flexible cover plate 1 is bent along the bending direction at the first buffer structure 11, the flexible capillary structure 3 is bent along the bending direction at the third buffer structure 31, and the second flexible cover plate 2 is bent along the bending direction at the second buffer structure 21, so the flexible VC can be bent in a specific area.

[0042] Furthermore, when the flexible VC is bent in a specific area along the bending direction, the presence of the first buffer structure 11, the third buffer structure 31 and the second buffer structure 21 adaptively buffers the bending generated in the specific area along the bending direction, so that the flexible VC with the stacked structure can better adapt to deformation when bending, reduce the stress and deformation caused by regional bending and stretching, prevent the flexible VC from breaking due to bending, improve the structural strength of the flexible VC, avoid the leakage of heat conductive fluid caused by the rupture of the flexible VC, ensure that the flexible VC has a good thermal conductivity and heat dissipation effect on the folding screen mobile phone, and reduce the risk of immersion damage to the internal circuits of the folding screen mobile phone due to leakage of heat conductive fluid.

[0043] Since foldable phones need to be folded frequently both during factory inspection and daily use, the flexible VC not only has a good thermal conductivity and heat dissipation effect on foldable screen phones, but can also well meet the high-frequency bending requirements of foldable screen phones.

[0044] Combined with Figure 3 As shown, in some specific embodiments, the first buffer structure 11, the second buffer structure 21 and the third buffer structure 31 are respectively formed by at least one group of a row of protrusions and a row of depressions adjacent to each other along a first direction, and the first direction is perpendicular to the bending direction.

[0045] The bending direction may be the length direction of the flexible VC, in which case the first direction is the width direction of the flexible VC; the bending direction may also be the width direction of the flexible VC, in which case the first direction is the length direction of the flexible VC.

[0046] Furthermore, adjacent protrusions and depressions may be formed by a stamping process.

[0047] The height difference between adjacent protrusions and depressions can achieve adaptive buffering of stress caused by bending, so that the stress concentration of the flexible VC can be reduced when bending. When bending, the stress of the traditional linear structure will be concentrated at the bend, which is easy to cause rupture. The structural design of adjacent protrusions and depressions can disperse the stress and avoid stress concentration at one point, thereby reducing the risk of rupture of the flexible VC.

[0048] Combined with Figure 3 As shown, as a more specific implementation of this embodiment, along the first direction F3, adjacent protrusions and depressions form a wave-shaped structure.

[0049] Furthermore, the wavy structure can be formed by a stamping process, that is, the first buffer structure 11, the second buffer structure 21 and the third buffer structure 31 form a stacked wavy structure, and the design of the wavy structure helps to disperse stress. When subjected to external force, the wavy structure can disperse it to a wider area to avoid excessive concentration of stress in a certain part, which helps to prevent the flexible VC from breaking due to stress concentration. Compared with traditional straight or planar structures, the wavy structure has better stress distribution characteristics.

[0050] Secondly, the wavy structure increases the elasticity of the structure. Since the wavy structure has a certain curvature in its shape, when subjected to external force, it can better adapt to changes in external force and absorb and release energy through its own elastic deformation. This elastic deformation helps to reduce stress concentration when the structure is impacted or vibrated, thereby improving the impact and vibration resistance of the flexible VC.

[0051] Furthermore, the R angle circumference of the wave-shaped structure can be designed according to actual needs.

[0052] In some specific embodiments, the first flexible cover plate 1 and / or the second flexible cover plate 2 include a polymer layer. The polymer may be one or more of PI (Polyimide) material, PP (Polypropylene), and PET (Polyethylene terephthalate) material.

[0053] Compared with traditional metal VC, flexible VC made of high molecular polymer has better mechanical properties, improves the flexibility of VC, and makes it lighter and lighter. This flexible VC can achieve bending in specific areas and is well used in folding screen mobile phones. While it has a good thermal conductivity and heat dissipation effect on folding screen mobile phones, it can also better meet its lightness, thinness, and high-frequency bending design and use requirements.

[0054] In some specific embodiments, the first flexible cover plate 1 and / or the second flexible cover plate 2 further includes a metal layer disposed on the inner surface of the high molecular polymer layer, and the metal layer is located in the cavity 100 .

[0055] The metal layer is used to enhance the air tightness of the polymer and prevent evaporation. The metal layer can also be used as a heat-conducting layer. Due to the good thermal conductivity of the metal layer, it can quickly conduct heat and cooperate with the thermal conductive medium to increase the thermal conductivity of the flexible VC temperature-averaging board. The metal layer is any one of a coated metal layer, a hot-pressed metal layer, a bonded metal layer or a welded metal layer.

[0056] As a more specific implementation of this embodiment, the metal layer is made of one of aluminum material, titanium material or copper material. Among them, aluminum material is easy to process and has good ductility and plasticity. Aluminum material also has good electrical conductivity and thermal conductivity, and is very suitable for manufacturing electronic components or radiators. And aluminum material can easily form a dense oxide film in the air and has good corrosion resistance. In addition, aluminum material is lighter and cheaper than copper material. Among them, titanium material is a high-strength and corrosion-resistant metal material, and copper material has good thermal conductivity and can be well used in flexible VC for heat conduction and heat dissipation.

[0057] In some specific implementations, the flexible capillary structure 3 is a single layer of hydrophilic organic compound material or a structural layer in which multiple layers of hydrophilic organic compound material are stacked on each other.

[0058] As a more specific implementation of this embodiment, the organic compound material layer is a mesh fabric, such as non-woven fabric, cloth and other fabric materials can be used as the material of the flexible capillary structure 3.

[0059] In some specific embodiments, the first flexible cover plate 1 and / or the second flexible cover plate 2 is located at one side of the cavity 100, and is provided with a plurality of first protrusions 12 for abutting against the flexible capillary structure 3. Figure 1 , 3 As shown in FIG. 5 , the first flexible cover plate 1 is located at one side of the cavity 100 and is provided with a plurality of first protrusions 12 for abutting against the flexible capillary structure 3 .

[0060] The first protrusion 12 can be formed by a stamping process. The first protrusion 12 can not only support and fix the flexible capillary structure 3 in the cavity, but also improve the overall structural strength of the flexible VC, optimize the liquid return path after the water vapor in the cavity is condensed, improve the thermal conductivity and improve the thermal heat dissipation effect.

[0061] In some specific embodiments, at least one side of the flexible capillary structure 3 is provided with a plurality of second protrusions for abutting against the first flexible cover plate 1 and / or the second flexible cover plate 2 .

[0062] The second protrusion can not only support and fix the flexible capillary structure 3 in the cavity, but also improve the overall structural strength of the flexible VC, optimize the liquid return path after the water vapor in the cavity is condensed, improve the thermal conductivity and improve the thermal conductivity and heat dissipation effect.

[0063] Furthermore, the second protrusion can be formed by weaving techniques such as jacquard or embroidery, so that the flexible capillary structure 3 has 2D / 3D arrangement and support, making the surface of the flexible capillary structure 3 more attractive to the liquid and having the ability to bend without destroying the structure of the flexible capillary structure 3.

[0064] During the weaving process, the flexible capillary support structure can be woven into different structures by changing the warp and weft. Theoretically, it can be varied and provide selection and design for different products.

[0065] Combined with Figure 4 As shown, in some specific embodiments, the third buffer structure 31 is provided with a through groove 311 penetrating the third buffer structure 31 along the thickness direction.

[0066] The through groove 311 serves as a steam channel to increase the diffusion area of ​​water vapor in the cavity, increase the diffusion speed of water vapor, and make water vapor flow from the hot end of the temperature equalizer to the cold end more quickly, thereby accelerating the heat conduction cycle and improving the heat dissipation efficiency.

[0067] Furthermore, the length of the through slot 311 in the first direction is not less than the length of the third buffer structure 31 in the first direction.

[0068] A traditional capillary structure will have multiple tiny through holes as steam channels. However, if a through hole is opened on the third buffer structure 31, when the flexible VC is bent, the through hole will be piled up and clogged as the third buffer structure 31 is bent, making it impossible for water vapor to pass through. In this embodiment, since the length of the through groove 311 in the first direction is not less than the length of the third buffer structure 31 in the first direction, when the third buffer structure 31 is bent, the through groove 311 will not be piled up and clogged, thereby ensuring a good passage for the steam channel.

[0069] It should be further explained that the through groove 311 can further disperse the stress generated by bending along the bending direction, improve the structural strength of the flexible VC, and prevent the flexible VC from being broken due to stress concentration.

[0070] The present application provides another embodiment, which provides a folding screen mobile phone, and the folding screen mobile phone includes the flexible VC of the first aspect.

[0071] The present application provides another embodiment, providing an electronic device, wherein the electronic device includes the flexible VC of the first aspect.

[0072] The electronic device can be a foldable screen mobile phone, or a smart terminal such as a foldable screen tablet.

[0073] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, substitute and modify the above embodiments within the scope of the invention without departing from the principles and purpose of the present invention. All such changes should fall within the scope of protection of the claims of the present invention.

Claims

1. A flexible VC, comprising a first flexible cover plate and a second flexible cover plate, wherein the first flexible cover plate and the second flexible cover plate are connected to form a cavity capable of accommodating a heat-conducting medium, wherein a flexible capillary structure is provided in the cavity, wherein: The first flexible cover plate is provided with a first buffer structure, and the first buffer structure is used to buffer the bending of the first flexible cover plate in the first buffer structure; the second flexible cover plate includes a second buffer structure, and the second buffer structure is used to buffer the bending of the second flexible cover plate in the second buffer structure; The flexible capillary structure comprises a third buffer structure, and the third buffer structure is used to buffer the bending of the flexible capillary structure at the third buffer structure; The first buffer structure, the second buffer structure and the third buffer structure are sequentially and correspondingly abutted along the thickness direction of the flexible VC, so that the flexible VC can be bent along the bending direction.

2. The flexible VC according to claim 1, characterized in that: The third buffer structure is provided with a through groove penetrating the third buffer structure along the thickness direction; and / or The length of the through slot is not less than the length of the third buffer structure.

3. The flexible VC according to claim 1, characterized in that: The first flexible cover plate and / or the second flexible cover plate is located at one side of the cavity and is provided with a plurality of first protrusions for abutting against the flexible capillary structure.

4. The flexible VC according to claim 1, characterized in that: At least one side of the flexible capillary structure is provided with a plurality of second protrusions for abutting against the first flexible cover plate and / or the second flexible cover plate.

5. The flexible VC according to claim 1, characterized in that: The first buffer structure, the second buffer structure and the third buffer structure are respectively formed by at least one group of protrusions and depressions adjacent to each other along a first direction, and the first direction is perpendicular to the bending direction.

6. The flexible VC according to claim 5, characterized in that: Along the first direction, the adjacent protrusions and depressions form a wave-shaped structure.

7. The flexible VC according to claims 1-6, characterized in that: The first flexible cover plate and / or the second flexible cover plate comprises a high molecular polymer layer.

8. The flexible VC according to claim 7, characterized in that: The first flexible cover plate and / or the second flexible cover plate further comprises a metal layer arranged on the inner surface of the high molecular polymer layer, and the metal layer is located in the cavity.

9. The flexible VC according to claim 4, characterized in that: The flexible capillary support structure is a single hydrophilic organic compound material layer or a structural layer in which multiple hydrophilic organic compound material layers are stacked on each other.

10. The flexible VC according to claim 9, characterized in that: The organic compound material layer is a mesh fabric, and the second protrusion is formed by the mesh fabric using a jacquard fabric process.

11. A foldable screen mobile phone, characterized in that: The folding screen mobile phone includes the flexible VC described in any one of claims 1-10.

12. An electronic device, characterized in that: The electronic device comprises the flexible VC described in any one of claims 1-10.