Uniform-temperature liquid cooling plate heat dissipation device and liquid cooling circulation heat dissipation system

Abstract

The present invention discloses an isothermal liquid cooling plate heat dissipation device and a liquid cooling circulation heat dissipation system, comprising: a substrate, on the upper surface of which two groups of microchannels are provided, and there is a heat conduction channel between the microchannels; an isothermal plate, which is arranged on the substrate, a cavity with a certain vacuum degree is arranged inside the isothermal plate, a working medium is arranged inside the cavity, a part of the cavity bulges outwards and forms a boss on the lower surface of the isothermal plate, the boss is inserted into the heat conduction channel, the part where the cavity bulges outwards serves as an evaporation area, and other parts serve as a condensation area; a liquid inflow channel penetrating up and down is arranged on the isothermal plate, the lower end of the liquid inflow channel is communicated with the microchannel, and at least a liquid return channel is arranged between the isothermal plate and the substrate; a cover plate, which is fixedly arranged on the substrate and is located above the isothermal plate, and a liquid inlet and a liquid outlet are arranged on the cover plate. The present invention realizes the technical effect of quickly dissipating the heat generated in the hot spot area of the heating element, making the heat distribution more uniform and improving the heat dissipation efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of liquid cooling heat dissipation, and in particular, to an isothermal liquid cooling plate heat dissipation device and a liquid cooling circulation heat dissipation system. Background Art

[0002] In the fields of modern electronic devices and high-performance computing, with the continuous progress of technology and the significant improvement of device performance, the heat dissipation requirements for high power, high heat flux density, and high isothermal performance have become particularly urgent. Whether it is the servers in data centers, high-performance graphics processors, or advanced aerospace electronic devices, these devices will generate extremely high heat during operation. If the heat cannot be effectively managed and dissipated, it will not only cause the device to overheat and reduce performance, but may also shorten the service life of the device and even cause serious safety problems.

[0003] In the related art, for the heat dissipation of high-heat chips, liquid cooling is generally adopted. Specifically, heat dissipation structures such as liquid cooling plates are arranged on the chips, and the chips achieve heat exchange through heat exchange with the circulating cooling liquid in the liquid cooling plates. However, since there are heat generation areas on the chips, and the heat in the heat generation areas is significantly greater than that in other areas, the heat is too concentrated in the liquid cooling plates and cannot be dissipated quickly. Summary of the Invention

[0004] The main object of the present invention is to provide an isothermal liquid cooling plate heat dissipation device and a liquid cooling circulation heat dissipation system to solve the problem that the liquid cooling heat dissipation device in the related art has heat concentration and cannot dissipate heat quickly.

[0005] To achieve the above object, the present invention provides an isothermal liquid cooling plate heat dissipation device, including:

[0006] A substrate, at least two groups of micro-channels are arranged on the upper surface of the substrate, and there is a heat conduction channel between adjacent two groups of the micro-channels, and the heat conduction channel corresponds to the hot spot area of the heating element;

[0007] An isothermal plate, the isothermal plate is arranged on the substrate, a cavity with a certain vacuum degree is arranged in the isothermal plate, a working medium is arranged in the cavity, a part of the cavity protrudes outwards and forms a convex platform on the lower surface of the isothermal plate, the convex platform is inserted into the heat conduction channel, the lower surface of the convex platform is attached to the surface of the substrate, and the part where the cavity protrudes outwards serves as an evaporation area, and other parts serve as a condensation area;

[0008] A liquid inflow channel that penetrates up and down is arranged on the isothermal plate, the lower end of the liquid inflow channel is communicated with the micro-channel, and at least one side of the isothermal plate and the substrate are at least provided with a liquid return channel;

[0009] A cover plate, which is fixedly arranged on the substrate and located above the heat pipe, is provided with a liquid inlet and a liquid outlet. The liquid inlet corresponds to the liquid inflow channel, and the liquid outlet corresponds to the liquid return channel.

[0010] Further, the lower surface of the heat pipe corresponding to the condensation area is attached to the upper end of the microchannel.

[0011] Further, the lower surface of the boss is fixedly connected to the surface of the substrate.

[0012] Further, the substrate includes a bottom plate and a first enclosure fixedly arranged around the bottom plate. The microchannel is arranged on the bottom plate, and the lower surface of the boss is fixedly connected to the bottom plate by welding.

[0013] At least one pair of sides of the first enclosure is provided with installation grooves, and two sides of the heat pipe are embedded in the corresponding installation grooves.

[0014] A spacing is formed between the other pair of sides of the first enclosure and the heat pipe to form the liquid return channel.

[0015] The lower end surface of the cover plate abuts against and is fixedly connected to the upper end surface of the first enclosure.

[0016] Further, at least two liquid inflow channels are arranged on the heat pipe, and the two liquid inflow channels are respectively vertically corresponding to two groups of the microchannels.

[0017] Further, the length direction of the liquid inflow channel is perpendicular to the length direction of the microchannel and parallel to the length direction of the liquid return channel.

[0018] Further, it further includes a second enclosure, which is located between the upper surfaces of the cover plate and the heat pipe. The second enclosure surrounds the liquid inflow channel, and a liquid distribution area is formed among the cover plate, the second enclosure and the heat pipe.

[0019] Further, a flow disturbance structure is arranged on the surface of the heat pipe located in the liquid distribution area.

[0020] Further, both the liquid inlet and the liquid outlet are connected with connectors.

[0021] According to another aspect of the present invention, a liquid cooling circulation heat dissipation system is provided, which includes the above-mentioned heat pipe type liquid cooling plate heat dissipation device.

[0022] In an embodiment of the present invention, a substrate is provided. At least two groups of microchannels are provided on the upper surface of the substrate. There is a heat conduction channel between adjacent two groups of microchannels, and the heat conduction channel corresponds to the hot spot area of the heating element; a heat pipe, the heat pipe is disposed on the substrate, a cavity with a certain vacuum degree is provided inside the heat pipe, a working fluid is provided inside the cavity, a part of the cavity bulges outwards and forms a boss on the lower surface of the heat pipe, the boss is inserted into the heat conduction channel, and the lower surface of the boss is attached to the surface of the substrate. The part where the cavity bulges outwards serves as the evaporation area, and other parts serve as the condensation area; a liquid inflow channel that penetrates up and down is provided on the heat pipe, the lower end of the liquid inflow channel is communicated with the microchannel, and at least one side of the heat pipe and the substrate are provided with at least a liquid return channel; a cover plate, the cover plate is fixedly disposed on the substrate and is located above the heat pipe, and a liquid inlet and a liquid outlet are provided on the cover plate, the liquid inlet corresponds to the liquid inflow channel, and the liquid outlet corresponds to the liquid return channel.

[0023] Taking the heating element as a chip as an example, during the heat dissipation process, the heat generated in the hot spot area of the heating element is directly transferred to the boss of the heat pipe through the substrate. Since the boss is a structure formed by the outward bulge of the lower part of the cavity, there is a large amount of working fluid in the boss. After the heat is transferred to the boss, the working fluid quickly absorbs the heat and vaporizes into steam and flows into the condensation area of the cavity. After entering the condensation area, it contacts the inner wall of the cavity, releases the heat and condenses into a liquid, and the heat is dissipated to the surroundings through this process. At the same time, the heat generated by the heating element is also transferred to the microchannel through the substrate. The circulating coolant enters the microchannel through the liquid inflow channel and flows out from the liquid return channel after heat exchange with the microchannel. The present invention realizes the technical effect of quickly dissipating the heat generated in the hot spot area of the heating element, making the heat distribution more uniform, and improving the heat dissipation efficiency, thereby solving the problem that the liquid cooling heat dissipation device in the related art has heat concentration and cannot dissipate heat quickly. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The drawings constituting a part of the present invention are used to provide a further understanding of the present invention, making other features, objects, and advantages of the present invention more obvious. The schematic embodiments and descriptions thereof of the present invention are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0025] Figure 1 is a perspective structural schematic diagram of a heat pipe type liquid cooling plate heat dissipation device according to an embodiment of the present invention;

[0026] Figure 2 is a sectional structural schematic diagram of a heat pipe type liquid cooling plate heat dissipation device according to an embodiment of the present invention;

[0027] Figure 3 is another sectional structural schematic diagram of a heat pipe type liquid cooling plate heat dissipation device according to an embodiment of the present invention;

[0028] Figure 4 is another cross-sectional structural schematic diagram of the isothermal liquid cooling plate heat dissipation device according to an embodiment of the present invention;

[0029] Figure 5 is a structural schematic diagram of the isothermal plate according to an embodiment of the present invention;

[0030] Figure 6 is a structural schematic diagram of the substrate and the microchannel according to an embodiment of the present invention;

[0031] Figure 7 is a schematic diagram of the liquid cooling circulation heat dissipation system according to an embodiment of the present invention;

[0032] Among them, 1 is the substrate, 100 is the heat conduction channel, 101 is the bottom plate, 102 is the first enclosure, 2 is the cover plate, 3 is the isothermal plate, 30 is the convex platform, 31 is the condensation area, 32 is the liquid inflow channel, 33 is the evaporation area, 34 is the cavity, 4 is the liquid inlet, 5 is the liquid outlet, 6 is the joint, 7 is the second enclosure, 70 is the liquid distribution area, 8 is the microchannel, 9 is the liquid return channel, 10 is the liquid storage tank, 11 is the first ball valve, 12 is the filter, 13 is the pump, 14 is the flowmeter, 15 is the second ball valve, 16 is the isothermal liquid cooling plate heat dissipation device, and 17 is the radiator. Detailed implementation manners

[0033] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0034] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and do not have to be used to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so as to implement the embodiments of the present invention described here.

[0035] In the present invention, the orientation or positional relationship indicated by terms such as "upper", "lower", "inner", etc. is based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit that the indicated device, element or component must have a specific orientation, or be constructed and operated in a specific orientation.

[0036] Moreover, in addition to being used to represent orientation or positional relationships, some of the above terms may also be used to represent other meanings. For example, the term "upper" may also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in the present invention can be understood according to specific circumstances.

[0037] In addition, terms such as "arranged", "provided with", "connected", "fixed", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there can be internal communication between two devices, components or parts. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In addition, the meaning of the term "plurality" should be two or more.

[0039] It should be noted that, without conflict, the embodiments in the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.

[0040] To solve the related technical problems, as Figures 1 to 5 shown, an embodiment of the present invention provides an isothermal liquid-cooled plate heat dissipation device, including:

[0041] A substrate 1, on the upper surface of the substrate 1, at least two groups of microchannels 8 are provided, and there is a heat conduction channel 100 between adjacent two groups of microchannels 8, and the heat conduction channel 100 corresponds to the hot spot area of the heating element;

[0042] An isothermal plate 3, the isothermal plate 3 is arranged on the substrate 1, a cavity 34 with a certain vacuum degree is arranged in the isothermal plate 3, a working medium is arranged in the cavity 34, a part of the cavity 34 protrudes outwards and forms a convex platform 30 on the lower surface of the isothermal plate 3, the convex platform 30 is inserted into the heat conduction channel 100, the lower surface of the convex platform 30 is attached to the surface of the substrate 1, and the protruding part of the cavity 34 outwards serves as an evaporation area 33, and other parts serve as a condensation area 31;

[0043] A liquid inflow channel 32 that penetrates up and down is arranged on the isothermal plate 3, the lower end of the liquid inflow channel 32 is communicated with the microchannel 8, and at least one side of the isothermal plate 3 and the substrate 1 are at least provided with a liquid return channel 9;

[0044] A cover plate 2, the cover plate 2 is fixedly arranged on the substrate 1 and is located above the isothermal plate 3, a liquid inlet 4 and a liquid outlet 5 are arranged on the cover plate 2, the liquid inlet 4 corresponds to the liquid inflow channel 32, and the liquid outlet 5 corresponds to the liquid return channel 9.

[0045] In this embodiment, the lower surface of the substrate 1 is a flat surface, which can be attached to the surface of a heat-generating component such as a chip. At least two groups of microchannels 8 are provided on the upper surface of the substrate 1. The microchannels 8 are composed of a number of sheet materials with relatively high thermal conductivity. For example, a number of copper sheets are arranged side by side at intervals, and channels for the coolant to flow are formed between adjacent copper sheets. Each group of microchannels 8 includes a plurality of slender channels, so as to increase the heat exchange area between the microchannels 8 and the coolant. In this embodiment, the microchannels 8 are provided with at least two groups, and a certain distance is provided between the two groups of microchannels 8 to form a heat conduction channel 100.

[0046] In one implementation, as Figure 1 and Figure 6 shown, two groups of microchannels 8 are provided on the upper surface of the substrate 1, and the two groups of microchannels 8 are symmetrically arranged, and a heat conduction channel 100 is formed in the middle of the two groups of microchannels 8. It can be understood that the heat conduction channel 100 can also be arranged at other positions as long as it corresponds to the hot spot area of the heat-generating component. In addition, the number of the heat conduction channels 100 is not limited either, and it can be correspondingly set according to the number of hot spot areas of the heat-generating component.

[0047] In this embodiment, the size of the microchannels 8 is small, and the flow velocity of the fluid in the flow channels is high, which helps to enhance the convective heat transfer ability of the fluid. In addition, the microchannel 8 structure can increase the contact area of the fluid, thereby improving the heat dissipation efficiency. In this embodiment, the form of the microchannels 8 includes but is not limited to straight channels, folded fins, copper foam, etc.

[0048] The heat pipe 3 is used to evenly dissipate heat. As Figure 5 shown, a cavity 34 with a certain vacuum degree is provided in the heat pipe 3, and a certain amount of working medium is stored in the cavity 34. The working medium can be degassed pure water. The working medium in the cavity 34 can be vaporized into steam after being heated. Under the action of the pressure difference, the vaporized steam quickly diffuses from the high-pressure area (high-temperature area) to the low-pressure area (low-temperature area). During the diffusion process, the steam carries a large amount of thermal energy, so as to achieve rapid heat transfer.

[0049] The steam can release heat and condense into a liquid after being cooled, and the heat can be quickly dissipated during this process. As Figures 1 to 3As shown, in this embodiment, the heat of the heating element is first transferred to the substrate 1. Therefore, in order to quickly dissipate the heat generated by the heating element, a part of the heat pipe 3 needs to be in direct contact with the surface of the substrate 1. For this purpose, a part of the cavity 34 bulges outwards in this embodiment and forms a boss 30 on the lower surface of the heat pipe 3. Specifically, in this embodiment, the lower wall of the cavity 34 bulges outwards to form the boss 30, and the boss 30 can be in the shape of a square or a trapezoid, etc. The lower surface of the boss 30 should be a flat surface so as to better contact the upper surface of the substrate 1. The inner space of the boss 30 is lower than other parts of the cavity 34 in the horizontal position as a part of the cavity 34, and the condensed working fluid in the cavity 34 can naturally gather in the inner space of the boss 30.

[0050] After installation, the boss 30 of the heat pipe 3 is inserted into the heat conduction channel 100 between the two groups of microchannels 8, and the lower surface of the boss 30 is attached to the upper surface of the substrate 1. Since the position of the heat conduction channel 100 is set according to the hot spot area on the heating element, the heat generated in the hot spot area is directly transferred to the boss 30 after passing through the substrate 1. The area corresponding to the boss 30 in the cavity 34 serves as the evaporation zone 33, and other areas serve as the condensation zone 31. There is liquid working fluid gathered in the evaporation zone 33, so the heat of the boss 30 can be directly transferred to the working fluid. After absorbing heat in the evaporation zone 33 (high-pressure zone), the working fluid quickly vaporizes into steam and diffuses towards the condensation zone 31 (low-pressure zone) in the cavity 34. After contacting the inner walls on both sides of the cavity 34, it releases heat and condenses into a liquid. This condensation process releases the heat accumulated during evaporation before, thus realizing the effective dissipation of heat. The condensed liquid working fluid flows back to the evaporation zone 33 along the microstructures under the capillary action of the capillary wick, absorbs heat again and vaporizes into steam again. This process is carried out cyclically, forming a continuous heat conduction cycle. During this process, the heat generated in the hot spot area of the heating element is quickly dissipated, and heat concentration in a certain area can be avoided.

[0051] In this embodiment, the substrate 1 and the microchannels 8 are used as the liquid-cooling heat dissipation structure, and heat dissipation needs to be achieved through liquid circulation. For this purpose, a liquid inflow channel 32 is provided on the heat pipe 3 in this embodiment, and the liquid inflow channel 32 corresponds to the microchannels 8 up and down. To form a return channel, there is a gap between at least one side of the heat pipe 3 and the substrate 1 to form a liquid return channel 9. In other words, in this embodiment, the external liquid enters the microchannels 8 through the liquid inflow channel 32 on the heat pipe 3, flows through the microchannels 8 and exchanges heat with the microchannels 8, and then flows out through the liquid return channel 9.

[0052] To achieve the circulation of the entire liquid, as Figure 1 and Figure 2As shown in the figure, in this embodiment, a cover plate 2 is further provided. The cover plate 2 is disposed on the heat pipe 3 and fixedly connected to the substrate 1. A closed chamber is formed by the cover plate 2. One chamber is for liquid inflow, and the other chamber is for liquid reflux. The chamber for liquid inflow corresponds to the liquid inflow channel 32, and the chamber for liquid reflux corresponds to the liquid reflux channel 9. A liquid inlet 4 and a liquid outlet 5 are provided on the cover plate 2. The liquid inlet 4 corresponds to the liquid inflow channel 32, and the liquid outlet 5 corresponds to the liquid reflux channel 9. The liquid inlet 4 and the liquid outlet 5 can be respectively connected to pipes to realize liquid circulation.

[0053] Thus, during the heat dissipation process, the heat generated in the hot spot area of the heating element is directly transferred from the substrate 1 to the boss 30 of the heat pipe 3. Since the boss 30 is a structure protruding outward from the lower part of the cavity 34, there is a large amount of liquid working medium in the boss 30. After the heat is transferred to the boss 30, the working medium quickly absorbs the heat and vaporizes into steam, which flows into the condensation area 31 of the cavity 34. After entering the condensation area 31, it contacts the inner wall of the cavity 34, releases heat and condenses into liquid, and dissipates the heat to the surroundings through this process. At the same time, the heat generated by the heating element is also transferred from the substrate 1 to the microchannel 8. The circulating coolant enters the microchannel 8 through the liquid inflow channel 32 and flows out from the liquid reflux channel 9 after heat exchange with the microchannel 8. The present invention realizes the technical effect of quickly dissipating the heat generated in the hot spot area of the heating element, making the heat distribution more uniform and improving the heat dissipation efficiency, thereby solving the problem that the liquid cooling heat dissipation device in the related art has heat concentration and cannot quickly dissipate heat.

[0054] In the present invention, the substrate 1 and the microchannel 8 form a liquid cooling plate. The heat pipe 3 is embedded in the liquid cooling plate, and the liquid cooling is also covered in the heat pipe 3, which significantly improves the heat conduction efficiency of the entire system, reduces the system energy consumption, and ensures the stability and reliability of the equipment operation. Moreover, the liquid cooling plate in the present invention makes full use of the microchannel 8 for efficient heat exchange, which can not only effectively dissipate the heat of the hot spot with high heat flux density, improve the overall temperature uniformity of the surface of the heating component, but also provide necessary support and reinforcement for the microchannel 8. At the same time, during the heat dissipation process, the cooling working medium does not directly contact the heating element, so it has high safety, low requirement for material compatibility, and strong customization, and can be relatively easily compatible with computing devices of different manufacturers and models to adapt to different application scenarios.

[0055] Since the circulation process of the working medium in the heat pipe 3 is that the liquid working medium absorbs heat and vaporizes into gaseous working medium in the evaporation area 33, and the gaseous working medium condenses into liquid working medium in the condensation area 31 and refluxes to the evaporation area 33. Therefore, to improve the heat equalization effect, it is necessary to increase the temperature difference between the evaporation area 33 and the condensation area 31 so that the steam can quickly condense and release heat in the condensation area 31 with a lower temperature.

[0056] For this reason, as Figure 2and Figure 3 As shown, in this embodiment, the lower surface of the heat pipe 3 corresponding to the condensation area 31 is attached to the upper end of the microchannel 8. In other words, in this embodiment, the parts of the lower surface of the heat pipe 3 on both sides of the boss 30 are attached to the upper end of the microchannel 8. This part, as the area corresponding to the condensation area 31, cooling it can reduce the temperature of the condensation area 31. For this purpose, during the liquid cooling process, the liquid in the microchannel 8 circulates, so while the microchannel 8 is used to dissipate heat from the heating element, it also dissipates heat from the condensation area 31 of the heat pipe 3, thereby increasing the temperature difference between the condensation area 31 and the evaporation area 33 and improving the condensation effect.

[0057] Since the external liquid circulates in the microchannel 8, it is easy for the lower surface of the substrate 1 to bulge during the circulation process, especially the heat conduction channel 100 part of the substrate 1. For this reason, in this embodiment, the lower surface of the boss 30 is fixedly connected to the surface of the substrate 1. In a specific implementation manner, the lower surface of the boss 30 can be fixedly connected to the surface of the substrate 1 by welding. After connecting the substrate 1 through the boss 30, the structural strength of the substrate 1 can be increased, effectively preventing the substrate 1 from generating local deformation.

[0058] In one implementation manner of the substrate 1, as Figures 2 to 4 shown, the substrate 1 includes a bottom plate 101 and a first enclosure 102 fixed around the bottom plate 101. The microchannel 8 is arranged on the bottom plate 101, and the lower surface of the boss 30 is fixedly connected to the bottom plate 101 by welding;

[0059] At least one pair of sides of the first enclosure 102 is provided with installation grooves, and two sides of the heat pipe 3 are embedded in the corresponding installation grooves;

[0060] There is a gap between the other pair of sides of the first enclosure 102 and the heat pipe 3 to form a liquid return channel 9;

[0061] The lower end surface of the cover plate 2 abuts against and is fixedly connected to the upper end surface of the first enclosure 102.

[0062] Specifically, in this embodiment, the setting of the first enclosure 102 enables a certain liquid flow space to be formed in the substrate 1, so that when the external liquid enters, it can fully contact and exchange heat with the microchannel 8. At the same time, the first enclosure 102 also facilitates the installation of the heat pipe 3. In this embodiment, the first enclosure 102 is provided with two stepped surfaces. One stepped surface is formed by opening an installation groove, and the other stepped surface is the upper end surface of the first enclosure 102, which is used to abut against and connect the cover plate 2 with the lower end surface of the cover plate 2. The cover plate 2 and the upper end surface of the first enclosure 102 can be fixedly connected by welding or fixed by screws.

[0063] In this embodiment, the installation groove is only opened on one of the opposite sides of the first enclosure 102, and the distance between the other opposite sides is greater than the length of the heat pipe 3 in this direction, so that after the heat pipe 3 is installed, there is a gap between the first enclosure 102 and the heat pipe 3 to form a liquid return channel 9. In other words, in this embodiment, two liquid return channels 9 are provided and located on both sides of the heat pipe 3.

[0064] Since two groups of micro-channels 8 are provided in the present invention, in order to facilitate the external liquid to enter the micro-channels 8 through the liquid inlet channels 32 on the heat pipe 3, in this embodiment, at least two liquid inlet channels 32 are provided on the heat pipe 3, and the two liquid inlet channels 32 respectively correspond to the two groups of micro-channels 8 up and down.

[0065] Specifically, in this embodiment, the external liquid flows into the micro-channels 8 in a manner of flowing from top to bottom. Compared with the way of directly flowing the external liquid into and out of the ends of the micro-channels 8, the temperature difference of the liquid flowing into each micro-channel 8 is smaller, so that the heat dissipation effect is significantly increased. And, due to the resistance of the micro-channels 8, when the liquid flows into and out of the ends of the micro-channels 8, the resistance is large, and a greater power needs to be applied to the liquid by the pump 13. In this embodiment, the liquid flows into each micro-channel 8 from the upper part at the same time, and the power requirement for the liquid is lower.

[0066] In one embodiment, to further facilitate the circulation of the liquid in the micro-channels 8, the liquid inlet channels 32 are long strip-shaped openings, and the length direction of the liquid inlet channels 32 is perpendicular to the length direction of the micro-channels 8 and parallel to the length direction of the liquid return channels 9.

[0067] Specifically, in this embodiment, taking two groups of micro-channels 8 as an example, the two liquid inlet channels 32 respectively correspond to the two groups of micro-channels 8. Since the liquid inlet channels 32 are perpendicular to the length direction of the micro-channels 8, the same liquid inlet channel 32 can cover multiple channels in this group of micro-channels 8 at the same time, and even can cover all the channels in this group of micro-channels 8, so that the liquid in the liquid inlet channels 32 can flow into all the channels at the same time, and can be divided into two paths and flow to both sides along the length direction of the micro-channels 8, and flow out from the liquid return channels 9 at both ends after heat exchange.

[0068] It can be seen that in this embodiment, the flow path of each path of liquid is short, and can be set to about half of the channel length. When the flow path of the liquid is short, the low-temperature liquid can quickly exchange heat with the channel, improving the heat dissipation efficiency. And, since each path of liquid will not flow through other channels again, the heat dissipation of each channel is more uniform.

[0069] In addition, in this embodiment, the liquid inlet channel 32 is located in the middle of the heat pipe 3, which can guide the liquid to flow into the flow channel smoothly, avoiding the generation of vortices and turbulence. The liquid return channels 9 on both sides of the heat pipe 3 can ensure that the liquid can flow out of the flow channel smoothly, while maintaining the pressure balance in the flow channel.

[0070] To form two closed chambers through the cover plate 2, one chamber is for liquid inflow and the other chamber is for liquid return. As Figures 1 to 3 shown, this embodiment further includes a second retaining wall 7, which is located between the upper surfaces of the cover plate 2 and the heat pipe 3. The second retaining wall 7 surrounds the liquid inlet channel 32, and a liquid distribution area 70 is formed among the cover plate 2, the second retaining wall 7, and the heat pipe 3.

[0071] Specifically, in this embodiment, the liquid distribution area 70 is one of the closed chambers, and this chamber is only for liquid inflow. The other chamber is the chamber located outside the liquid distribution area 70, and this chamber is for liquid return. The second retaining wall 7 is of a frame structure. The second retaining wall 7 can be part of the cover plate 2 or part of the heat pipe 3, or an independent component pressed and fixed on the heat pipe 3 by the cover plate 2. For the convenience of installation, in this embodiment, it is preferably that the second retaining wall 7 is part of the cover plate 2 or part of the heat pipe 3.

[0072] In addition, a turbulator structure is provided on the surface of the heat pipe 3 located in the liquid distribution area 70, so as to enhance the convective heat transfer effect with the liquid. The turbulator structure can be a cylinder, fins, copper foam, etc. For the convenience of connecting pipelines, both the liquid inlet 4 and the liquid outlet 5 are connected with connectors 6.

[0073] According to another aspect of the present invention, as Figure 7 shown, a liquid cooling circulation heat dissipation system is provided, including the above-mentioned heat pipe type liquid cooling plate heat dissipation device 16.

[0074] In this embodiment, the liquid cooling circulation heat dissipation system includes a liquid storage tank 10, a first ball valve 11, a filter 12, a pump 13, a flow meter 14, a second ball valve 15, a heat pipe type liquid cooling plate heat dissipation device 16, and a radiator 17, which are connected in sequence to form a loop. During the heat dissipation process, the pump 13 pushes the cooling liquid (usually water or a special non-conductive liquid) through a closed pipeline network, and the pipeline network is connected to a plurality of heat pipe type liquid cooling plate heat dissipation devices 16.

[0075] Heat exchange: The heat pipe type liquid cooling plate heat dissipation device 16 is installed on key heat generating components, such as the CPU, GPU, etc. When the liquid flows through the liquid cooling plate of the heat pipe type liquid cooling plate heat dissipation device 16, it absorbs the heat transferred from the heat generating element to the microchannel 8, causing the temperature of the liquid to rise. During this process, the working medium in the heat pipe 3 continuously and cyclically undergoes the process of evaporation - condensation - evaporation, spreading the heat of the heat generating element.

[0076] Heat dissipation: The liquid that has absorbed heat is then sent to one or more radiators 17 to exchange heat with the ambient air or other cooling media, releasing the absorbed heat. This process is usually assisted by a fan to increase air circulation and improve the heat dissipation efficiency.

[0077] Coolant recirculation: The temperature of the liquid decreases after heat dissipation and then is pumped back to the liquid cooling plate by the pump 13 again to start a new cycle, continuously removing heat.

[0078] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, various modifications and changes can be made to the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A heat dissipation device of an isothermal liquid cooling plate, characterized in that, Comprising: A substrate, on the upper surface of which at least two groups of micro-channels are provided, and there is a heat conduction channel between adjacent two groups of the micro-channels, the heat conduction channel corresponding to the hot spot area of the heating element, and the direction of the heat conduction channel being the same as that of the micro-channels; A heat pipe, the heat pipe being arranged on the substrate, a cavity with a certain vacuum degree being arranged inside the heat pipe, a working fluid being arranged inside the cavity, a part of the cavity protruding outwards to form a boss on the lower surface of the heat pipe, the boss being inserted into the heat conduction channel, the lower surface of the boss being in contact with the surface of the substrate, and the protruding part of the cavity being used as an evaporation area and other parts being used as a condensation area; On the heat pipe, there is a liquid inlet channel that penetrates up and down, the lower end of the liquid inlet channel being communicated with the micro-channel, and there is a spacing between the two sides of the heat pipe and the substrate to form a liquid return channel, and the liquid return channel is located on both sides of the liquid inlet channel; A cover plate, the cover plate being fixedly arranged on the substrate and located above the heat pipe, a liquid inlet and a liquid outlet being arranged on the cover plate, the liquid inlet corresponding to the liquid inlet channel, and the liquid outlet corresponding to the liquid return channel; There are at least two of the liquid inlet channels arranged on the heat pipe, the two liquid inlet channels corresponding to two groups of the micro-channels up and down respectively, the length direction of the liquid inlet channel being perpendicular to the length direction of the micro-channel and parallel to the length direction of the liquid return channel.

2. The isothermal liquid cooling plate heat dissipation device according to claim 1, wherein The lower surface of the heat pipe corresponding to the condensation area is in contact with the upper end of the micro-channel.

3. The isothermal liquid cooling plate heat dissipation device according to claim 1, characterized in that, The lower surface of the boss is fixedly connected to the surface of the substrate.

4. The isothermal liquid cooling plate heat dissipation device according to claim 3, characterized in that, The substrate includes a bottom plate and a first enclosure fixedly arranged around the periphery of the bottom plate, the micro-channel being arranged on the bottom plate, and the lower surface of the boss being fixedly connected to the bottom plate by welding; At least one pair of sides of the first enclosure are provided with installation grooves, and two sides of the heat pipe are embedded in the corresponding installation grooves; There is a spacing between the other pair of sides of the first enclosure and the heat pipe to form the liquid return channel; The lower end surface of the cover plate abuts against and is fixedly connected to the upper end surface of the first enclosure.

5. The isothermal liquid cooling plate heat dissipation device according to claim 1, characterized in that, It further includes a second enclosure, the second enclosure being located between the cover plate and the upper surface of the heat pipe, the second enclosure surrounding the periphery of the liquid inlet channel, and a liquid distribution area being formed among the cover plate, the second enclosure and the heat pipe.

6. The isothermal liquid cooling plate heat dissipation device according to claim 5, characterized in that, A flow disturbing structure is arranged on the surface of the heat pipe located in the liquid distribution area.

7. The isothermal liquid cooling plate heat dissipation device according to claim 6, wherein, Both the liquid inlet and the liquid outlet are connected with connectors.

8. A liquid cooling circulation heat dissipation system, characterized in that, Comprising the heat pipe type liquid cooling plate heat dissipation device according to any one of claims 1 to 7.

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