Intelligent immersion precision liquid cooling device and control method for waste heat cascade recovery

Abstract

The present invention discloses an intelligent computing immersion type precise liquid cooling device and control method for step-by-step recovery of waste heat, which belongs to the field of precise cooling technology; it includes: a cabinet, the interior of the cabinet includes a cooling package, a computing chip and a server motherboard, and the computing chip is fixedly connected to the surface of the server motherboard; a first circulation system is used to derive the waste heat of components other than the computing chip on the server in the liquid pool; a second circulation system is used to derive the waste heat of the computing chip; the first waste heat recovery system is used to recover the waste heat of components other than the computing chip in the liquid pool; the second waste heat recovery system is used to recover the waste heat of the computing chip. The present invention monitors the temperature of each server motherboard and the temperature of each computing chip in the cabinet, adjusts the opening of the main pipe valve and each branch pipe valve, combines two sets of cooling liquid circulation systems, and provides cooling liquid for each server motherboard and each computing chip respectively, so as to realize precise cooling of the liquid cooling cabinet.

Description

Technical Field

[0001] The present invention relates to the technical field of precision cooling, and in particular to an intelligent immersion precision liquid cooling device with step-by-step waste heat recovery and a control method. Background Art

[0002] With the continuous development of the Internet, the heat flux density per unit area of ​​heat-generating components in data centers continues to increase, and the requirements for cooling systems in data centers are getting higher and higher. Immersion liquid cooling has been promoted and applied in data centers due to its advantages of low energy consumption, high efficiency and low noise.

[0003] However, existing liquid cooling cabinets usually use diffused liquid supply to cool server motherboards and computing chips. The cooling liquid flow rate on the computing chip surface is attenuated compared to the liquid supply branch pipe, and the cooling effect of the cooling liquid on the computing chip is not ideal. In addition, existing liquid cooling cabinets also have problems such as the difficulty in matching the cooling liquid supply volume of each server with the corresponding heat dissipation requirements, resulting in energy waste in the cooling system, the risk of overheating and downtime of some servers due to sudden high loads that cannot be cooled in time, and the high-quality waste heat of liquid cooling cannot be effectively recovered.

[0004] Therefore, it is necessary to provide an intelligent immersion precision liquid cooling device and control method for step-by-step recovery of waste heat. Summary of the invention

[0005] The purpose of the present invention is to provide an intelligent immersion precision liquid cooling device and control method with cascaded waste heat recovery, so as to solve the problems in the prior art that the coolant supply of each server to the liquid cooling cabinet is difficult to match with the corresponding heat dissipation demand, resulting in energy waste of the cooling system, some servers cannot be cooled in time due to sudden high load, resulting in the risk of overheating and shutdown, and high-grade waste heat from liquid cooling cannot be effectively recovered.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] A cabinet, wherein the cabinet includes a plurality of arranged servers; the server includes a cooling package, a computing chip and a server motherboard, the computing chip is fixedly connected to the surface of the server motherboard, the cooling package cover is arranged outside the computing chip and connected to the server motherboard; the computing chip includes: CPU, GPU and APU; the server motherboard is also equipped with a memory, a hard disk and a power module.

[0008] A first circulation system is provided inside and outside the cabinet and is used to conduct waste heat of components other than the computing chip on the server in the liquid pool;

[0009] A second circulation system is provided inside and outside the cabinet and is used to conduct waste heat of the computing chip;

[0010] The first waste heat recovery system is arranged outside the cabinet and is used to recover the waste heat of components other than the computing chip in the liquid pool; the first waste heat recovery system includes a plate heat exchanger B 1 ;

[0011] A second waste heat recovery system is arranged at a distance from the first waste heat recovery system, and is used to recover the waste heat of the computing power chip; the second waste heat recovery system includes a plate heat exchanger B 2 .

[0012] Furthermore, the cabinet is close to the plate heat exchanger B 1 A first inlet, a second inlet and an outlet are sequentially arranged at intervals on one side.

[0013] The first circulation system comprises:

[0014] A first liquid return main pipe, a common pipeline and a first liquid supply main pipe connected in sequence;

[0015] A liquid supply hole plate is arranged on one side of the server, and the liquid supply hole plate is provided with a plurality of liquid supply holes arranged at intervals along the arrangement direction of the plurality of servers;

[0016] Wherein, the first liquid return main pipe is partially arranged through the plate heat exchanger B 1 Inside, the liquid inlet end of the first liquid return main pipe passes through the outlet and extends into the cabinet;

[0017] The common pipeline is connected to a coolant pump S;

[0018] The first liquid supply main pipe is provided with a main pipe valve V 01 One end of the first liquid supply main pipe away from the common pipeline passes through the first inlet and extends into the cabinet; the part of the first liquid supply main pipe arranged in the cabinet is connected with a plurality of first circulating liquid supply branches at intervals, and the first circulating liquid supply branches pass through the liquid supply holes, and the plurality of first circulating liquid supply branches are arranged one by one corresponding to the plurality of liquid supply holes.

[0019] Furthermore, the second circulation system comprises:

[0020] A second liquid return main pipe, the common pipeline and a second liquid supply main pipe connected in sequence;

[0021] The liquid outlet end of the cooling package is connected to a second circulating liquid return branch pipe;

[0022] Wherein, the liquid inlet end of the second liquid return main pipe extends into the cabinet through the outlet and is connected to the liquid outlet end of the second circulating liquid return branch pipe;

[0023] The second liquid supply main pipe is equipped with a main pipe valve V02 , an end of the second liquid supply main pipe away from the common pipeline extends into the cabinet through the second inlet;

[0024] The second liquid supply main pipe is provided in the cabinet and is connected with a plurality of second circulating liquid supply branch pipes at intervals, one end of the second circulating liquid supply branch pipe away from the second liquid supply main pipe is connected to the liquid inlet end of the cooling package, and each of the second circulating liquid supply branch pipes is connected with a branch pipe valve. The diameter of the second circulating liquid supply branch pipe is smaller than the diameter of the first circulating liquid supply branch pipe.

[0025] Furthermore, the first waste heat recovery system also includes: a first cooling water loop, a first hot water loop, an electric valve F 1 , Electric valve F 4 , Water pump S 1 , Cooling Tower L 1 , first bypass line, electric valve F 2 , Electric valve F 3 、Heat storage tank G 1 , first temperature sensor, expansion tank P 1 , Water pump S 2 , hot user end Y 1 , Water pump S 3 and heat pump system R 1 ;

[0026] The heat pump system R 1 Includes: Evaporator E 1 , the first refrigerant loop and condenser C 1 ;

[0027] Among them, the first cooling water loop is sequentially arranged through the plate heat exchanger B 1 , the evaporator E 1 , the cooling tower L 1 and the water pump S 1 The electric valve F 1 and the electric valve F 4 are respectively arranged in the evaporator E 1 Inlet and outlet ends on the water side;

[0028] The inlet and outlet of the first bypass pipeline are both connected to the first cooling water loop and to the electric valve F 1 , the evaporator E 1 , the electric valve F 4 In parallel; the electric valve F 2 and the electric valve F 3 are respectively arranged at the inlet end and the outlet end of the first bypass pipeline;

[0029] The first hot water loop is sequentially arranged through the condenser C 1 , the heat storage tank G 1 , the water pump S 2 , the thermal user terminal Y 1 , the heat storage tank G 1 and the water pump S 3 ; The heat storage tank G 1 The expansion tank P is connected to 1 and a first temperature sensor.

[0030] Furthermore, the second waste heat recovery system further includes: a second cooling water loop, a heat pump system R 2 , second temperature sensor, heat storage tank G 2 , Water pump S 5 , Water pump S 6 , Expansion tank P 2 , Cooling Tower L 2 , Water pump S 4 , Second bypass line, electric valve F 5 , Electric valve F 6 , Electric valve F 7 , hot user end Y 2 , Electric valve F 8 and a second hot water loop;

[0031] The heat pump system R 2 Includes: Evaporator E 2 , the second refrigerant loop and condenser C 2 ;

[0032] The second cooling water loop is sequentially arranged through the plate heat exchanger B 2 , the evaporator E 2 , the cooling tower L 2 and the water pump S 4 The electric valve F 5 and the electric valve F 8 are respectively arranged in the evaporator E 2 Inlet and outlet ends on the water side;

[0033] The inlet and outlet of the second bypass pipeline are both connected to the second cooling water loop and to the electric valve F 5 , the evaporator E 2 , the electric valve F 8 In parallel; the electric valve F 6 and the electric valve F 7 are respectively arranged at the inlet end and the outlet end of the second bypass pipeline;

[0034] The second hot water loop is sequentially arranged through the condenser C2 , the heat storage tank G 2 , the water pump S 5 , the thermal user terminal Y 2 , the heat storage tank G 2 and the water pump S 6 ; The heat storage tank G 2 The expansion tank P is connected to 2 and a second temperature sensor.

[0035] A control method for the intelligent immersion precision liquid cooling device with step-by-step waste heat recovery as described above includes the following four controls:

[0036] Control 1: Main pipe valve V 01 The control is used to adjust the coolant flow of the first circulation system according to the operating temperature of the server mainboard at the same time;

[0037] Control 2: Control of the branch pipe valve, which is used to adjust the coolant flow of the second circulation liquid supply branch pipe according to the operating temperature of each computing power chip to ensure that the coolant of the second circulation system is distributed on demand;

[0038] Control three: Electric valve F 1 , Electric valve F 2 , Electric valve F 3 And electric valve F 4 The control is used to control the heat storage tank G 1 The water temperature monitoring value in the heat pump system R 1 The working state controls whether the cooling water in the first cooling water loop passes through the heat pump system R 1 Evaporator E 1 ;

[0039] Control 4: Electric valve F 5 , Electric valve F 6 , Electric valve F 7 And electric valve F 8 The control is used to control the heat storage tank G 2 The water temperature monitoring value in the heat pump system R 2 The working state controls whether the cooling water in the second cooling water loop passes through the heat pump system R 2 Evaporator E 2 .

[0040] Furthermore, the control logic of the control one is as follows:

[0041] Step S1: Real-time monitoring of temperature T n , if T n ≥T n,set2 , then execute step S2, otherwise execute step S5;

[0042] Step S2: If α 01 =α 01,max , then execute step S3, otherwise execute step S4;

[0043] Step S3: Let α 01 Remain unchanged and continue to execute step S1;

[0044] Step S4: Set α 01 Adjust to α 01,max , continue to execute step S1;

[0045] Step S5: α 01 As (T n -T n,set1 ) decreases, and continues to execute step S6;

[0046] Step S6: If T n ≤T n,set1 , then execute step S7, otherwise execute step S8;

[0047] Step S7: If α 01 =α 01,min , then execute step S3, otherwise execute step S9;

[0048] Step S8: α 01 As (T n -T n,set1 ) increases, and step S1 is continued;

[0049] Step S9: Set α 01 Adjust to α 01,min , continue to execute step S1;

[0050] Among them, step S1 is the first step executed in control one;

[0051] Temperature T n It is the maximum operating temperature of all server motherboards in the cabinet at the same time;

[0052] T n,set2 and T n,set1 The temperature T n Maximum and minimum setting values;

[0053] α 01 Main pipe valve V 01 The valve opening monitoring value;

[0054] α 01,max With α 01,min They are main pipe valve V 01 Valve opening α 01 The maximum and minimum setting values.

[0055] Furthermore, the control logic of the second control is as follows:

[0056] Step S1: Real-time monitoring of the computing chip temperature T n0 , if T n0 ≥T n0,set2 , then execute step S2, otherwise execute step S5;

[0057] Step S2: If α Vn =α Vn,max , then execute step S3, otherwise execute step S4;

[0058] Step S3: Let α Vn Remain unchanged and continue to execute step S1;

[0059] Step S4: Set α Vn Adjust to α Vn,max , continue to execute step S1;

[0060] Step S5: α Vn As (T n0 -T n0,set1 ) decreases, and continues to execute step S6;

[0061] Step S6: If T n0 ≤T n0,set1 , then execute step S7, otherwise execute step S8;

[0062] Step S7: If α Vn =α Vn,min , then execute step S3, otherwise execute step S9;

[0063] Step S8: α Vn As (T n0 -T n0,set1 ) increases, and step S1 is continued;

[0064] Step S9: Set α Vn Adjust to α Vn,min , continue to execute step S1;

[0065] Among them, step S1 is the first step executed in control 2;

[0066] T n0,set2 and T n0,set1 They are respectively the computing chip temperature T n0 Maximum and minimum setting values;

[0067] α Vn It is the valve opening monitoring value of the branch valve;

[0068] αVn,max With α Vn,min They are the maximum setting value and the minimum setting value of the valve opening of the branch valve respectively.

[0069] Furthermore, the control logic of the control three is as follows:

[0070] Step S1: If the user has started the heat pump system R 1 , then execute step S2, otherwise execute step S3;

[0071] Step S2: If T 1 ≥T 1,set , then execute step S3, otherwise execute step S4;

[0072] Step S3: Electric valve F 1 , Electric valve F 4 At the same time, the electric valve F 2 , Electric valve F 3 At the same time, turn on and continue to execute step S1;

[0073] Step S4: Electric valve F 1 , Electric valve F 4 At the same time, the electric valve F 2 , Electric valve F 3 At the same time, close and continue to execute step S1;

[0074] Among them, step S1 is the first step executed in control three;

[0075] T 1 It is the heat storage tank G 1 The water temperature monitoring value inside, T 1,set It is the heat storage tank G 1 The water temperature setting value within the range; every 10 seconds, the first temperature sensor and the second temperature sensor simultaneously measure T 1 and heat storage tank G 2 Water temperature T 2 Conduct a data collection;

[0076] T 1,set Lower than the heat storage tank G 2 The water temperature setting value T 2,set .

[0077] Furthermore, the control logic of the control four is as follows:

[0078] Step S1: If the user has started the heat pump system R 2 , then execute step S2, otherwise execute step S3;

[0079] Step S2: If T 2 ≥T 2,set, then execute step S3, otherwise execute step S4;

[0080] Step S3: Electric valve F 5 , Electric valve F 8 At the same time, the electric valve F 6 , Electric valve F 7 At the same time, turn on and continue to execute step S1;

[0081] Step S4: Electric valve F 5 , Electric valve F 8 At the same time, the electric valve F 6 , Electric valve F 7 At the same time, close and continue to execute step S1;

[0082] Among them, step S1 is the first step executed in control 4;

[0083] T 2 It is the heat storage tank G 2 The water temperature monitoring value inside, T 2,set It is the heat storage tank G 2 Every 10 seconds, the second temperature sensor and the first temperature sensor simultaneously measure the water temperature set value within the range of T 2 and heat storage tank G 1 Water temperature T 1 Conduct a data collection;

[0084] T 2,set Higher than the heat storage tank G 1 The water temperature setting value T 1,set .

[0085] The present invention has the following beneficial effects:

[0086] 1. The second waste heat recovery system in the present invention can efficiently recover the waste heat of all computing chips and provide high-temperature hot water for heat users, which can be used for domestic water, bathing water, etc.; the first waste heat recovery system can efficiently recover the waste heat of other components on all servers in the liquid pool and provide medium-temperature hot water for heat users, which can be used for floor heating, radiators, etc. At the same time, the cold energy delivered to the cooling water loop by the evaporator of the heat pump system can provide cooling for the immersion liquid cooling device.

[0087] 2. The present invention monitors the temperature of each server mainboard and each computing chip in the cabinet, adjusts the opening of the main valve and each branch valve, and combines two sets of coolant circulation systems to provide coolant for each server mainboard and each computing chip, respectively, to achieve precise cooling of the liquid-cooled cabinet, while ensuring that the temperature of each server mainboard and each computing chip is within a safe range. At the same time, the energy consumption of the cooling system is reduced, and two sets of waste heat recovery systems corresponding to the two sets of coolant circulation systems are used to achieve cascade recovery of waste heat, thereby promoting energy conservation and carbon reduction in the intelligent computing center and surrounding buildings. BRIEF DESCRIPTION OF THE DRAWINGS

[0088] Figure 1 It is a structural schematic diagram of the device of the present invention;

[0089] Figure 2 is a control logic flow chart of control 1 in the device of the present invention;

[0090] Figure 3 is a control logic flow chart of control 2 in the device of the present invention;

[0091] Figure 4 is a control logic flow chart of control three in the device of the present invention;

[0092] Figure 5 This is a control logic flow chart of control four in the device of the present invention.

[0093] Among them: 1. Cooling package; 2. Computing chip; 3. Server motherboard; 4. First liquid supply main pipe; 5. Second liquid supply main pipe; 6. Branch pipe valve; 7. Second circulation liquid supply branch pipe; 8. Liquid supply hole; 9. Liquid supply orifice plate; 10. Main pipe valve V 01 ; 11. Main pipe valve V 02 ; 12. Coolant pump S; 13. Cabinet; 14. Plate heat exchanger B 1 ; 15. Plate heat exchanger B 2 ; 16. Electric valve F 1 ; 17. Electric valve F 2 ; 18. Electric valve F 3 ; 19. Electric valve F 4 ; 20. Evaporator E 1 ; 21. Cooling tower L 1 ; 22. Water pump S 1 ; 23. Condenser C 1 ; 24, first temperature sensor; 25, expansion tank P 1 ; 26. Heat storage tank G 1 ; 27. Water pump S 2 ; 28. Hot user terminal Y 1 ; 29. ​​Water pump S 3 ; 30. Electric valve F5 ; 31. Electric valve F 6 ; 32. Electric valve F 7 ; 33. Electric valve F 8 ; 34. Evaporator E 2 ; 35. Cooling tower L 2 ; 36. Water pump S 4 ; 37. Condenser C 2 ; 38, second temperature sensor; 39, expansion tank P 2 ; 40. Heat storage tank G 2 ; 41. Water pump S 5 ; 42, hot user end Y 2 ; 43. Water pump S 6 ; 44. First circulation liquid supply branch; 45. Common pipeline; 46. Second circulation liquid return branch; 47. Second liquid return main pipe; 48. First liquid return main pipe; 49. First cooling water loop; 50. First bypass pipeline; 51. Second cooling water loop; 52. Second bypass pipeline; 53. First refrigerant loop; 54. Second refrigerant loop; 55. First hot water loop; 56. Second hot water loop. DETAILED DESCRIPTION

[0094] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0095] In order to further improve the safety of liquid-cooled cabinets and reduce cooling energy consumption, the present invention designs an intelligent computing immersion precision liquid cooling device with cascade recovery of waste heat. By monitoring the temperature of each server mainboard and the temperature of each computing power chip in the cabinet, the opening of the main valve and the branch valves are adjusted. Combined with two sets of coolant circulation systems, coolant is provided to each server mainboard and each computing power chip respectively, thereby realizing precise cooling of the liquid-cooled cabinet. While ensuring that the temperature of each server mainboard and each computing power chip is within a safe range, the energy consumption of the cooling system is reduced. Through two sets of waste heat recovery systems corresponding to the two sets of coolant circulation systems, cascade recovery of waste heat is realized, thereby promoting energy conservation and carbon reduction of the intelligent computing center and surrounding buildings. Example 1

[0096] Reference Figure 1 This embodiment provides an intelligent computing immersion precision liquid cooling device with waste heat cascade recovery, including:

[0097] The cabinet 13 includes a plurality of servers arranged in an arrangement; the server includes a cooling package 1, a computing chip 2 and a server motherboard 3, the computing chip 2 is fixedly connected to the surface of the server motherboard 3, and the computing chip 2 includes: CPU, GPU and APU; the server motherboard 3 is also equipped with a memory, a hard disk and a power module. The cooling package 1 is covered on the outside of the computing chip 2 and connected to the server motherboard 3; the cabinet 13 is close to the plate heat exchanger B 1 A first inlet, a second inlet and an outlet are sequentially arranged on one side of 14.

[0098] In this embodiment, the first circulation system is provided inside and outside the cabinet 13 to conduct waste heat of components other than the computing chip 2 on the server in the liquid pool.

[0099] Specifically, the first circulation system includes: a first liquid return main pipe 48, a common pipeline 45 and a first liquid supply main pipe 4 connected in sequence. A liquid supply orifice plate 9 is arranged on one side of the server, and the liquid supply orifice plate 9 has a plurality of liquid supply holes 8 arranged at equal intervals along the arrangement direction of the servers.

[0100] The first liquid return main pipe 48 is partially arranged through the plate heat exchanger B. 1 14, the liquid inlet end of the first liquid return main pipe 48 extends through the outlet to the cabinet 13; the common pipeline 45 is connected to the coolant pump S12. The first liquid supply main pipe 4 is equipped with a main pipe valve V 01 10. One end of the first liquid supply main pipe 4 away from the common pipeline 45 extends through the first inlet to the cabinet 13. The part of the first liquid supply main pipe 4 arranged in the cabinet 13 is evenly connected with a plurality of first circulating liquid supply branch pipes 44, and the first circulating liquid supply branch pipes 44 pass through the liquid supply hole 8. The plurality of first circulating liquid supply branch pipes 44 are arranged one by one corresponding to the plurality of liquid supply holes 8.

[0101] In this embodiment, the second circulation system is disposed inside and outside the cabinet 13 to discharge the waste heat of the computing chip 2 .

[0102] Specifically, the second circulation system includes: a second liquid return main pipe 47 , a common pipeline 45 and a second liquid supply main pipe 5 connected in sequence; the liquid outlet end of the cooling package 1 is connected to a second circulation liquid return branch pipe 46 .

[0103] The liquid inlet end of the second liquid return main pipe 47 extends through the outlet into the cabinet 13 and is connected to the liquid outlet end of the second circulating liquid return branch pipe 46. 0211, one end of the second liquid supply main pipe 5 away from the common pipeline 45 passes through the second inlet and extends into the cabinet 13. The part of the second liquid supply main pipe 5 arranged in the cabinet 13 is connected with a plurality of second circulating liquid supply branch pipes 7 at equal intervals, one end of the second circulating liquid supply branch pipe 7 away from the second liquid supply main pipe 5 is connected to the liquid inlet end of the cooling package 1, and each second circulating liquid supply branch pipe 7 is connected with a branch pipe valve 6.

[0104] In this embodiment, the first waste heat recovery system is arranged outside the cabinet 13, and can recover the waste heat of components other than the computing chip 2 in the liquid pool; the first waste heat recovery system includes a plate heat exchanger B 1 14.

[0105] Specifically, the first waste heat recovery system is a medium temperature side waste heat recovery system, which can efficiently recover the waste heat of other components on all servers in the liquid pool, and provide medium temperature hot water for the heat user end, which is used for floor heating, radiators, etc. The first waste heat recovery system also includes: a first cooling water loop 49, a first hot water loop 55, and an electric valve F 1 16. Electric valve F 4 19. Water Pump 1 22. Cooling tower L 1 21. First bypass line 50, electric valve F 2 17. Electric valve F 3 18. Heat storage tank G 1 26. First temperature sensor 24. Expansion water tank P 1 25. Water Pump 2 27. Hot client Y 1 28. Water Pump 3 29 and heat pump system R 1 . Heat Pump System R 1 Includes: Evaporator E 1 20. First refrigerant loop 53 and condenser C 1 twenty three.

[0106] The first cooling water loop 49 passes through the plate heat exchanger B in sequence. 1 14. Electric valve F 1 16. Evaporator E 1 20. Electric valve F 4 19. Cooling tower L 1 21. Water pump 1 22 Return to plate heat exchanger B 1 14; Electric valve F 1 16 and electric valve F 4 19 are respectively provided in evaporator E 1 20 The inlet end and the outlet end of the water side.

[0107] The inlet and outlet of the first bypass line 50 are both connected to the first cooling water loop 49 and to the electric valve F 1 16. Evaporator E 1 20. Electric valve F 4 19 parallel; electric valve F 2 17 and electric valve F 3 18 are respectively disposed at the inlet end and the outlet end of the first bypass pipeline 50 .

[0108] The first hot water loop 55 passes through the condenser C in turn. 1 23. Heat storage tank G 1 26. Water Pump 2 27. Hot client Y 1 28. Heat storage tank G 1 26. Water Pump 3 29 Return to condenser C 1 23; Heat storage tank G 1 26 is connected to an expansion tank P 1 25 and a first temperature sensor 24 .

[0109] In this embodiment, the second waste heat recovery system is arranged at intervals from the first waste heat recovery system, and can recover the waste heat of the computing power chip 2; the second waste heat recovery system includes a plate heat exchanger B 2 15.

[0110] Specifically, the second waste heat recovery system is a high-temperature side waste heat recovery system, which can efficiently recover the waste heat of all computing chips and provide high-temperature hot water for heat users for domestic water, bathing water, etc. The second waste heat recovery system also includes: a second cooling water loop 51, a heat pump system R 2 , second temperature sensor 38, heat storage tank G 2 40. Water pump S 5 41. Water Pump 6 43. Expansion tank P 2 39. Cooling tower L 2 35. Water Pump 4 36. Second bypass line 52. Electric valve F 5 30. Electric valve F 6 31. Electric valve F 7 32. Hot client Y 2 42. Electric valve F 8 33 and the second hot water loop 56. Heat pump system R 2 Includes: Evaporator E 2 34. Second refrigerant loop 54 and condenser C 2 37.

[0111] The second cooling water loop 51 passes through the plate heat exchanger B in sequence. 215. Electric valve F 5 30. Evaporator E 2 34. Electric valve F 8 33. Cooling tower L 2 35. Water Pump 4 36 Return to plate heat exchanger B 2 15; Electric valve F 5 30 and electric valve F 8 33 are respectively provided in evaporator E 2 34 The inlet and outlet ends of the water side.

[0112] The inlet and outlet of the second bypass pipeline 52 are both connected to the second cooling water loop 51 and to the electric valve F 5 30. Evaporator E 2 34. Electric valve F 8 33 parallel; electric valve F 6 31 and electric valve F 7 32 are respectively disposed at the inlet end and the outlet end of the second bypass pipeline 52 .

[0113] The second hot water loop 56 passes through the condenser C in turn. 2 37. Heat storage tank G 2 40. Water pump S 5 41. Hot client Y 2 42. Heat storage tank G 2 40. Water pump S 6 43 Return to condenser C 2 37; Heat storage tank G 2 40 is connected to an expansion tank P 2 39 and a second temperature sensor 38 .

[0114] In this embodiment, the diameter of the second circulating liquid supply branch pipe 7 is smaller than the diameter of the first circulating liquid supply branch pipe 44 to ensure that the coolant flow rate on the surface of the computing chip 2 inside the cooling package 1 is significantly higher than the coolant flow rate on the surface of the server motherboard 3.

[0115] In this embodiment, the high-temperature side waste heat recovery system can efficiently recover the waste heat of all computing chips and provide high-temperature hot water for the heat user end for domestic water, bathing water, etc.; the medium-temperature side waste heat recovery system can efficiently recover the waste heat of other components on all servers in the liquid pool and provide medium-temperature hot water for the heat user end for floor heating, radiators, etc. At the same time, the cold energy delivered to the cooling water loop by the evaporator of the heat pump system can provide cooling for the immersion liquid cooling device.

[0116] In this embodiment, by monitoring the temperature of each server mainboard and the temperature of each computing chip in the cabinet, adjusting the opening of the main valve and each branch valve, and combining two sets of coolant circulation systems, coolant is provided to each server mainboard and each computing chip respectively, thereby realizing precise cooling of the liquid-cooled cabinet. While ensuring that the temperature of each server mainboard and each computing chip is within a safe range, the energy consumption of the cooling system is reduced, and two sets of waste heat recovery systems corresponding to the two sets of coolant circulation systems are used to realize cascade recovery of waste heat, thereby promoting energy conservation and carbon reduction in the intelligent computing center and surrounding buildings. Example 2

[0117] This embodiment provides a control method for an intelligent immersion precision liquid cooling device with step-by-step waste heat recovery, including the following four controls:

[0118] Control 1: Main pipe valve V 01 10 is used to adjust the cooling liquid flow of the first circulation system according to the operating temperature of the server motherboard 3 at the same time. Figure 2 , the control logic of control one is as follows:

[0119] Step S1: Real-time monitoring of temperature T n , if T n ≥T n,set2 , then execute step S2, otherwise execute step S5;

[0120] Step S2: If α 01 =α 01,max , then execute step S3, otherwise execute step S4;

[0121] Step S3: Let α 01 Remain unchanged and continue to execute step S1;

[0122] Step S4: Set α 01 Adjust to α 01,max , continue to execute step S1;

[0123] Step S5: α 01 With T n -T n,set1 The decrease of decreases, and the step S6 is continued;

[0124] Step S6: If T n ≤T n,set1 , then execute step S7, otherwise execute step S8;

[0125] Step S7: If α 01 =α 01,min , then execute step S3, otherwise execute step S9;

[0126] Step S8: α01 With T n -T n,set1 increases with the increase of , and continues to execute step S1;

[0127] Step S9: Set α 01 Adjust to α 01,min , continue to execute step S1;

[0128] Among them, step S1 is the first step executed in control one;

[0129] Temperature T n is the maximum value of the operating temperatures of all server motherboards 3 in the cabinet 13 at the same time;

[0130] T n,set2 and T n,set1 The temperature T n Maximum and minimum setting values;

[0131] α 01 Main pipe valve V 01 10 valve opening monitoring value;

[0132] α 01,max With α 01,min They are main pipe valve V 01 10 valve opening α 01 The maximum and minimum setting values.

[0133] Control 2: Control of the branch pipe valve 6 is used to adjust the coolant flow rate of the second circulation liquid supply branch pipe 7 according to the operating temperature of each computing chip 2 to ensure that the coolant of the second circulation system is distributed as needed. For details, refer to Figure 3 , the control logic of control 2 is as follows:

[0134] Step S1: Real-time monitoring of the temperature T of the computing chip 2 n0 , if T n0 ≥T n0,set2 , then execute step S2, otherwise execute step S5;

[0135] Step S2: If α Vn =α Vn,max , then execute step S3, otherwise execute step S4;

[0136] Step S3: Let α Vn Remain unchanged and continue to execute step S1;

[0137] Step S4: Set α Vn Adjust to α Vn,max , continue to execute step S1;

[0138] Step S5: α VnWith T n0 -T n0,set1 The decrease of decreases, and the step S6 is continued;

[0139] Step S6: If T n0 ≤T n0,set1 , then execute step S7, otherwise execute step S8;

[0140] Step S7: If α Vn =α Vn,min , then execute step S3, otherwise execute step S9;

[0141] Step S8: α Vn With T n0 -T n0,set1 increases with the increase of , and continues to execute step S1;

[0142] Step S9: Set α Vn Adjust to α Vn,min , continue to execute step S1;

[0143] Among them, step S1 is the first step executed in control 2;

[0144] T n0,set2 and T n0,set1 They are respectively the temperature of computing chip 2 T n0 Maximum and minimum setting values;

[0145] α Vn is the valve opening monitoring value of branch valve 6;

[0146] α Vn,max With α Vn,min They are respectively the maximum setting value and the minimum setting value of the valve opening of the branch valve 6.

[0147] In this embodiment, due to the sudden high load of the server, the operating temperature T n0 The temperature rises sharply. Under the action of the temperature monitoring system, T n0 >T n0,set2 At this time, the valve opening of branch valve 6 is α n0 Increase to α n0,max After a while, the server load began to decrease, and then we monitored T n0,set1 <T n0 <T n0,set2 And α n0 ≠α n0,min , at this time α n0 As (T n0 -T n0,set1 ) decreases. After a period of time, it is monitored that T n0 <T n0,set1 And αn0 =α n0,min , then the valve opening α of branch valve 6 n0 Remain unchanged.

[0148] Control three: Electric valve F 1 16. Electric valve F 2 17. Electric valve F 3 18 and electric valve F 4 19 control, used according to the heat storage tank G 1 26 Water temperature monitoring value and heat pump system R 1 The working state controls whether the cooling water in the first cooling water loop 49 passes through the heat pump system R 1 Evaporator E 1 20. For details, refer to Figure 4 , the control logic of control three is as follows:

[0149] Step S1: If the user has started the heat pump system R 1 , then execute step S2, otherwise execute step S3;

[0150] Step S2: If T 1 ≥T 1,set , then execute step S3, otherwise execute step S4;

[0151] Step S3: Electric valve F 1 16. Electric valve F 4 19 are closed at the same time, and the electric valve F 2 17. Electric valve F 3 18 are turned on at the same time, and step S1 is continued;

[0152] Step S4: Electric valve F 1 16. Electric valve F 4 19 are opened at the same time, and the electric valve F 2 17. Electric valve F 3 18 are closed at the same time, and step S1 is continued;

[0153] Among them, step S1 is the first step executed in control three;

[0154] T 1 It is the heat storage tank G 1 Water temperature monitoring value within 26, T 1,set It is the heat storage tank G 1 Every 10 seconds, the first temperature sensor 24 and the second temperature sensor 38 are respectively T 1 and heat storage tank G 2 Water temperature within 40°C 2 Conduct a data collection;

[0155] T 1,set Lower than the heat storage tank G 2 Water temperature setting value T within 40 2,set .

[0156] Control 4: Electric valve F 5 30. Electric valve F 6 31. Electric valve F 7 32 and electric valve F 8 33 control, used according to the heat storage tank G 2 Water temperature monitoring value within 40 and heat pump system R 2 The working state controls whether the cooling water in the second cooling water loop 51 passes through the heat pump system R 2 Evaporator E 2 34. For details, refer to Figure 5 , the control logic of control four is as follows:

[0157] Step S1: If the user has started the heat pump system R 2 , then execute step S2, otherwise execute step S3;

[0158] Step S2: If T 2 ≥T 2,set , then execute step S3, otherwise execute step S4;

[0159] Step S3: Electric valve F 5 30. Electric valve F 8 33 are closed at the same time, and the electric valve F 6 31. Electric valve F 7 32 are turned on at the same time, and step S1 is continued;

[0160] Step S4: Electric valve F 5 30. Electric valve F 8 33 are opened at the same time, and the electric valve F 6 31. Electric valve F 7 32 are closed at the same time, and step S1 is continued;

[0161] Among them, step S1 is the first step executed in control 4;

[0162] T 2 It is the heat storage tank G 2 Water temperature monitoring value within 40, T 2,set It is the heat storage tank G 2 Every 10 seconds, the second temperature sensor 38 and the first temperature sensor 24 are simultaneously T 2 and heat storage tank G 1 Water temperature T within 26 1 Conduct a data collection;

[0163] T 2,set Higher than the heat storage tank G 1 Water temperature setting value T within 26 1,set .

[0164] Example 3

[0165] This embodiment provides a working method of an intelligent computing immersion precision liquid cooling device with step-by-step waste heat recovery, which is specifically as follows:

[0166] In this embodiment, the coolant of the second circulation system passes through the plate heat exchanger B 2 15 The heat generated by each server is transported to the second cooling water loop 51. The user has turned on the heat pump system R 2 The second temperature sensor 38 detects that the heat storage tank G 2 Water temperature within 40°C 2 Lower than the set value T 2,set At this time, the electric valve F 5 30. Electric valve F 8 33 are opened at the same time, and the electric valve F 6 31. Electric valve F 7 32 are closed at the same time. 4 Driven by 36, the cooling water in the second cooling water loop 51 is transferred from the plate heat exchanger B 2 15 flows out and enters evaporator E 2 34, then from the evaporator E 2 34 outflow, through cooling tower L 2 35 Return to plate heat exchanger B 2 15 The heat is transferred to the condenser C through the refrigerant circulation in the second refrigerant loop 54. 2 The hot water in the second hot water loop 56 of 37 is pumped into the water pump S 5 41 and water pump S 6 43, hot water from condenser C 2 37 flows out through the heat storage tank G 2 40, enter the hot user terminal Y 2 42, provide users with high-temperature hot water, which then passes through the heat storage tank G 2 40 Return condenser C 2 37. When the user uses high-temperature hot water, the expansion tank P 2 39 constant pressure water replenishment function, heat storage tank G 2 The water volume within 40 is constantly replenished.

[0167] The present invention can effectively realize precise cooling through two sets of cooling liquid circulation systems. Specifically, since the traditional immersion liquid cooling cabinet usually adopts diffuse cooling completely, the server motherboard with a low calorific value and the computing power chip with a high calorific value are cooled indiscriminately. The cooling liquid flow rate on the surface of the computing power chip is seriously attenuated compared with the cooling liquid flow rate at the liquid supply branch port, so it is difficult to cool the computing power chip to the maximum extent. The second circulation system of the present invention is specifically used to provide cooling liquid for the computing power chip. The diameter of all pipelines of this circulation system is generally smaller than the diameter of each corresponding pipeline of the first circulation system adopting diffuse cooling, so as to ensure that the cooling liquid flow rate of each second circulation liquid supply branch is less than the cooling liquid flow rate of each corresponding first circulation liquid supply branch, and the cooling liquid flow rate of each second circulation liquid supply branch is much higher than the cooling liquid flow rate of each corresponding second circulation liquid supply branch. In the second circulation system, after the action of the cooling liquid pump, the cooling liquid passes through the second circulation liquid supply branch and flows through the surface of the computing power chip at a higher flow rate, which is more ideal than the cooling effect of completely adopting diffuse cooling.

[0168] The present invention can realize the step-by-step recovery of waste heat through two waste heat recovery systems. Specifically, the waste heat recovery system on the high temperature side and the waste heat recovery system on the medium temperature side in the present invention correspond to the second circulation system and the first circulation system respectively. The coolant in the second circulation system has the characteristics of small flow rate and high flow rate, and directly cools the computing power chip with high heat density. Therefore, compared with the complete use of diffuse liquid supply, the temperature difference between the coolant supply and the coolant return is higher. Therefore, in the plate heat exchanger B 2 On the water side, the temperature difference between the outlet water temperature and the inlet water temperature will also increase, and the water temperature in the second cooling water loop will increase accordingly. If the user has started the heat pump system R 2 , and the electric valve F 5 And electric valve F 8 If both are turned on, the evaporator E 2 The water inlet temperature on the water side also increases, which helps to improve the R 2 The high-temperature side waste heat recovery system transfers heat to the condenser water side through the refrigerant cycle, and then passes through the second hot water loop to the heat user end Y 2 While providing high temperature hot water, it also reduces the cooling tower L 2 energy consumption, thereby achieving energy conservation and carbon reduction in the intelligent computing center and surrounding buildings.

[0169] The present invention monitors the temperature of each server mainboard and the temperature of each computing chip in the cabinet, and flexibly adjusts the opening of the main pipe valve and each branch pipe valve, thereby effectively adjusting the coolant supply to each server, realizing precise cooling of the liquid-cooled cabinet, and reducing the energy consumption of the cooling system while ensuring that the temperature of each server mainboard and the temperature of each computing chip are within a safe range.

[0170] The embodiments described above are only descriptions of the preferred modes of the present invention, and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary technicians in this field should all fall within the protection scope determined by the claims of the present invention.

Claims

1. An intelligent immersion precision liquid cooling device with step-by-step waste heat recovery, characterized in that: include: A cabinet (13), wherein the cabinet (13) comprises a plurality of servers arranged in an array; the servers comprise a cooling package (1), a computing chip (2) and a server motherboard (3); the computing chip (2) is fixedly connected to the surface of the server motherboard (3); the cooling package (1) is covered on the outside of the computing chip (2) and is connected to the server motherboard (3); the computing chip (2) comprises: a CPU, a GPU and an APU; a memory, a hard disk and a power module are also installed on the server motherboard (3); A first circulation system, which is arranged inside and outside the cabinet (13) and is used to guide waste heat from components other than the computing chip (2) on the server in the liquid pool; A second circulation system, which is arranged inside and outside the cabinet (13) and is used to extract waste heat from the computing chip (2); a first waste heat recovery system, arranged outside the cabinet (13), for recovering waste heat from components other than the computing chip (2) in the liquid pool; the first waste heat recovery system comprises: a plate heat exchanger B1 (14), a first cooling water loop (49), a first hot water loop (55), an electric valve F1 (16), an electric valve F4 (19), a water pump S1 (22), a cooling tower L1 (21), a first bypass pipeline (50), an electric valve F2 (17), an electric valve F3 (18), a heat storage tank G1 (26), a first temperature sensor (24), an expansion water tank P1 (25), a water pump S2 (27), a heat user terminal Y1 (28), a water pump S3 (29) and a heat pump system R1; The heat pump system R1 comprises: an evaporator E1 (20), a first refrigerant loop (53) and a condenser C1 (23); A second waste heat recovery system arranged at an interval from the first waste heat recovery system, for recovering waste heat from the computing power chip (2); the second waste heat recovery system comprises: a plate heat exchanger B2 (15), a second cooling water loop (51), a heat pump system R2, a second temperature sensor (38), a heat storage tank G2 (40), a water pump S5 (41), a water pump S6 (43), an expansion water tank P2 (39), a cooling tower L2 (35), a water pump S4 (36), a second bypass pipeline (52), an electric valve F5 (30), an electric valve F6 (31), an electric valve F7 (32), a heat user terminal Y2 (42), an electric valve F8 (33) and a second hot water loop (56); The heat pump system R2 comprises: an evaporator E2 (34), a second refrigerant loop (54) and a condenser C2 (37).

2. The intelligent immersion precision liquid cooling device for waste heat cascade recovery according to claim 1 is characterized in that: A first inlet, a second inlet and an outlet are sequentially arranged at intervals on a side of the cabinet (13) close to the plate heat exchanger B1 (14); The first circulation system comprises: A first liquid return main pipe (48), a common pipeline (45) and a first liquid supply main pipe (4) connected in sequence; A liquid supply orifice plate (9) disposed on one side of the server, the liquid supply orifice plate (9) being provided with a plurality of liquid supply holes (8) disposed at intervals along an arrangement direction of the plurality of servers; Part of the first liquid return main pipe (48) is arranged inside the plate heat exchanger B1 (14), and the liquid inlet end of the first liquid return main pipe (48) passes through the outlet and extends into the cabinet (13); The common pipeline (45) is connected to a coolant pump S (12); The first liquid supply main pipe (4) is provided with a main pipe valve V 01 (10), one end of the first liquid supply main pipe (4) away from the common pipeline (45) passes through the first inlet and extends into the cabinet (13); a portion of the first liquid supply main pipe (4) disposed in the cabinet (13) is connected to a plurality of first circulating liquid supply branch pipes (44) at intervals, the first circulating liquid supply branch pipes (44) passing through the liquid supply holes (8), and the plurality of first circulating liquid supply branch pipes (44) are disposed in one-to-one correspondence with the plurality of liquid supply holes (8).

3. The intelligent immersion precision liquid cooling device for waste heat cascade recovery according to claim 2 is characterized in that: The second circulation system comprises: A second liquid return main pipe (47), the common pipeline (45) and a second liquid supply main pipe (5) connected in sequence; The liquid outlet end of the cooling package (1) is connected to a second circulating liquid return branch pipe (46); The liquid inlet end of the second liquid return main pipe (47) passes through the outlet and extends into the cabinet (13), and is connected to the liquid outlet end of the second circulating liquid return branch pipe (46); The second liquid supply main pipe (5) is provided with a main pipe valve V 02 (11), an end of the second liquid supply main pipe (5) away from the common pipeline (45) passes through the second inlet and extends into the cabinet (13); The second liquid supply main pipe (5) is arranged in a portion of the cabinet (13) and is connected to a plurality of second circulating liquid supply branch pipes (7) at intervals; one end of the second circulating liquid supply branch pipe (7) away from the second liquid supply main pipe (5) is connected to a liquid inlet end of the cooling package (1); each of the second circulating liquid supply branch pipes (7) is connected to a branch pipe valve (6); and the diameter of the second circulating liquid supply branch pipe (7) is smaller than the diameter of the first circulating liquid supply branch pipe (44).

4. The intelligent immersion precision liquid cooling device for waste heat cascade recovery according to claim 3 is characterized in that: The first waste heat recovery system also includes: The first cooling water loop (49) is sequentially arranged through the plate heat exchanger B1 (14), the evaporator E1 (20), the cooling tower L1 (21) and the water pump S1 (22); the electric valve F1 (16) and the electric valve F4 (19) are respectively arranged at the inlet end and the outlet end of the water side of the evaporator E1 (20); The inlet end and the outlet end of the first bypass pipeline (50) are both connected to the first cooling water loop (49), and are connected in parallel to the electric valve F1 (16), the evaporator E1 (20), and the electric valve F4 (19); the electric valve F2 (17) and the electric valve F3 (18) are respectively arranged at the inlet end and the outlet end of the first bypass pipeline (50); The first hot water loop (55) is sequentially arranged through the condenser C1 (23), the heat storage tank G1 (26), the water pump S2 (27), the heat user end Y1 (28), the heat storage tank G1 (26) and the water pump S3 (29); the heat storage tank G1 (26) is connected to an expansion water tank P1 (25) and a first temperature sensor (24).

5. The intelligent immersion precision liquid cooling device for waste heat cascade recovery according to claim 4 is characterized in that: The second waste heat recovery system also includes: The second cooling water loop (51) is sequentially arranged through the plate heat exchanger B2 (15), the evaporator E2 (34), the cooling tower L2 (35) and the water pump S4 (36); the electric valve F5 (30) and the electric valve F8 (33) are respectively arranged at the inlet and outlet of the water side of the evaporator E2 (34); The inlet end and the outlet end of the second bypass pipeline (52) are both connected to the second cooling water loop (51), and are connected in parallel to the electric valve F5 (30), the evaporator E2 (34), and the electric valve F8 (33); the electric valve F6 (31) and the electric valve F7 (32) are respectively arranged at the inlet end and the outlet end of the second bypass pipeline (52); The second hot water loop (56) is sequentially arranged through the condenser C2 (37), the heat storage tank G2 (40), the water pump S5 (41), the heat user end Y2 (42), the heat storage tank G2 (40) and the water pump S6 (43); the heat storage tank G2 (40) is connected to an expansion water tank P2 (39) and a second temperature sensor (38).

6. A control method for the intelligent immersion precision liquid cooling device for waste heat cascade recovery as claimed in any one of claims 1 to 5, characterized in that: Includes the following four controls: Control 1: Main pipe valve V 01 (10) is used to control the flow rate of the cooling liquid of the first circulation system according to the operating temperature of the server mainboard (3) at the same time; Control 2: Control of the branch pipe valve (6), which is used to adjust the coolant flow rate of the second circulation liquid supply branch pipe (7) according to the operating temperature of each computing power chip (2), so as to ensure that the coolant of the second circulation system is distributed as needed; Control three: control of the electric valve F1 (16), the electric valve F2 (17), the electric valve F3 (18) and the electric valve F4 (19), for controlling whether the cooling water in the first cooling water loop (49) passes through the evaporator E1 (20) of the heat pump system R1 according to the water temperature monitoring value in the heat storage tank G1 (26) and the working state of the heat pump system R1; Control four: Control of the electric valve F5 (30), the electric valve F6 (31), the electric valve F7 (32) and the electric valve F8 (33), for controlling whether the cooling water in the second cooling water loop (51) passes through the evaporator E2 (34) of the heat pump system R2 according to the water temperature monitoring value in the heat storage tank G2 (40) and the working state of the heat pump system R2.

7. The control method of the intelligent immersion precision liquid cooling device with waste heat cascade recovery according to claim 6 is characterized in that: The control logic of the control one is as follows: Step S1: Real-time monitoring of temperature T n , if T n ≥T n,set2 , then execute step S2, otherwise execute step S5; Step S2: If α 01 =α 01,max , then execute step S3, otherwise execute step S4; Step S3: Let α 01 Remain unchanged and continue to execute step S1; Step S4: Set α 01 Adjust to α 01,max , continue to execute step S1; Step S5: α 01 As (T n -T n,set1 ) decreases, and continues to execute step S6; Step S6: If T n ≤T n,set1 , then execute step S7, otherwise execute step S8; Step S7: If α 01 =α 01,min , then execute step S3, otherwise execute step S9; Step S8: α 01 As (T n -T n,set1 ) increases, and step S1 is continued; Step S9: Set α 01 Adjust to α 01,min , continue to execute step S1; Among them, step S1 is the first step executed in control one; Temperature T n is the maximum value of the operating temperatures of all server motherboards (3) in the cabinet (13) at the same time; T n,set2 and T n,set1 The temperature T n Maximum and minimum setting values; α 01 Main pipe valve V 01 (10) Valve opening monitoring value; α 01,max With α 01,min They are main pipe valve V 01 (10) Valve opening α 01 The maximum and minimum setting values.

8. The control method of the intelligent immersion precision liquid cooling device with waste heat cascade recovery according to claim 6 is characterized in that: The control logic of the second control is as follows: Step S1: Real-time monitoring of the temperature T of the computing chip (2) n0 , if T n0 ≥T n0,set2 , then execute step S2, otherwise execute step S5; Step S2: If α Vn =α Vn,max , then execute step S3, otherwise execute step S4; Step S3: Let α Vn Remain unchanged and continue to execute step S1; Step S4: Set α Vn Adjust to α Vn,max , continue to execute step S1; Step S5: α Vn As (T n0 -T n0,set1 ) decreases, and continues to execute step S6; Step S6: If T n0 ≤T n0,set1 , then execute step S7, otherwise execute step S8; Step S7: If α Vn =α Vn,min , then execute step S3, otherwise execute step S9; Step S8: α Vn As (T n0 -T n0,set1 ) increases, and step S1 is continued; Step S9: Set α Vn Adjust to α Vn,min , continue to execute step S1; Among them, step S1 is the first step executed in control 2; T n0,set2 and T n0,set1 They are respectively the temperature of the computing chip (2) T n0 Maximum and minimum setting values; α Vn is the valve opening monitoring value of the branch valve (6); α Vn,max With α Vn,min They are respectively the maximum setting value and the minimum setting value of the valve opening of the branch valve (6).

9. The control method of the intelligent immersion precision liquid cooling device with waste heat cascade recovery according to claim 6 is characterized in that: The control logic of the control three is as follows: Step S1: If the user has started the heat pump system R1, then execute step S2, otherwise execute step S3; Step S2: If T1 ≥ T 1,set , then execute step S3, otherwise execute step S4; Step S3: The electric valve F1 (16) and the electric valve F4 (19) are closed at the same time, and the electric valve F2 (17) and the electric valve F3 (18) are opened at the same time, and step S1 is continued; Step S4: the electric valve F1 (16) and the electric valve F4 (19) are opened at the same time, and the electric valve F2 (17) and the electric valve F3 (18) are closed at the same time, and the step S1 is continued; Among them, step S1 is the first step executed in control three; T1 is the water temperature monitoring value in the heat storage tank G1 (26), T 1,set is the set value of the water temperature in the heat storage tank G1 (26); every 10 seconds, the first temperature sensor (24) and the second temperature sensor (38) simultaneously collect data on T1 and the water temperature T2 in the heat storage tank G2 (40); T 1,set Lower than the water temperature setting value T in the heat storage tank G2 (40) 2,set .

10. The control method of the intelligent immersion precision liquid cooling device with waste heat cascade recovery according to claim 6 is characterized in that: The control logic of the control four is as follows: Step S1: If the user has started the heat pump system R2, then execute step S2, otherwise execute step S3; Step S2: If T2 ≥ T 2,set , then execute step S3, otherwise execute step S4; Step S3: The electric valve F5 (30) and the electric valve F8 (33) are closed at the same time, and the electric valve F6 (31) and the electric valve F7 (32) are opened at the same time, and then the step S1 is continued; Step S4: the electric valve F5 (30) and the electric valve F8 (33) are opened at the same time, and the electric valve F6 (31) and the electric valve F7 (32) are closed at the same time, and the step S1 is continued; Among them, step S1 is the first step executed in control 4; T2 is the water temperature monitoring value in the heat storage tank G2 (40), T 2,set is the set value of the water temperature in the heat storage tank G2 (40); every 10 seconds, the second temperature sensor (38) and the first temperature sensor (24) simultaneously collect data on T2 and the water temperature T1 in the heat storage tank G1 (26); T 2,set Higher than the water temperature setting value T in the heat storage tank G1 (26) 1,set .

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