Annealing device for post-treatment of silicon wafer coating

Abstract

The application discloses an annealing device for post-treatment of silicon wafer coating, comprising: an annealing furnace with an inlet, an outlet, an air inlet assembly and five cavities, the five cavities being a temperature rising transition cavity, a temperature rising cavity, a temperature maintaining cavity, a temperature falling cavity and a temperature falling transition cavity, the horizontal projection of the temperature rising cavity being U-shaped; a transmission mechanism comprising a transfer assembly and two transmission assemblies, each transmission assembly comprising a driving unit and a transmission roller; an on-off assembly arranged between adjacent two cavities and having an intercepting mode and a passing mode. The annealing device for post-treatment of silicon wafer coating reduces the length of the temperature maintaining furnace by the U-shaped temperature maintaining cavity, controls the connection and disconnection of adjacent two cavities by the on-off assembly, reduces the diffusion of heat energy, realizes transition by the temperature rising transition cavity and the temperature falling transition cavity, improves the heat energy utilization rate, slows down the temperature change rate of the material, and improves the annealing quality.

Description

Technical Field

[0001] The present invention relates to the technical field of photovoltaic cell film coating processing, and in particular to an annealing device for silicon wafer post-coating processing. Background Art

[0002] Annealing is an important step in the production and processing of solar cells. It is usually carried out after coating. The silicon wafer is heated to a certain temperature, maintained for a period of time, and then slowly cooled. Through this treatment, the internal stress of the material can be eliminated, the microstructure of the material can be improved, and the stability and performance can be improved, which is beneficial to increase electron mobility and reduce resistivity, thereby improving the photoelectric conversion efficiency of solar cells.

[0003] In the prior art, Chinese invention patent publication number CN118173647A discloses a method and device for matching a Poly process with an annealing process. By providing an annealing device in the annealing process, heat energy recovery and reuse are achieved, thereby achieving better energy-saving effects. However, in the above-mentioned annealing apparatus, the annealing box is open at both ends, and the conveyor rack passes through both ends of the annealing box. During the annealing process, heat easily leaks from both ends of the annealing box, increasing energy consumption, lowering the temperature inside the annealing box, and reducing annealing efficiency. Moreover, the conveyor rack has a single transmission direction, from one end of the annealing box to the other end of the annealing box. Since annealing requires a certain amount of time, the annealing box requires a longer length, which increases the length requirements of the processing workshop. Moreover, heating and cooling are performed at both ends of the annealing box, which increases the length of the air duct, thereby increasing the heat energy transmission loss in the air duct during equipment operation. In addition, the air duct in the device can only transfer excess heat from the cooling process to the heating stage, and cannot fully and reasonably utilize the excess heat from the insulation process. In other words, the heat energy utilization efficiency and energy saving effect are limited. In addition, in the above-mentioned annealing apparatus, when the silicon wafer passes through the annealing box, the silicon wafer is heated and cooled rapidly, and the temperature gradient inside the silicon wafer is increased, thereby increasing the direction of thermal stress and thermal shock, generating excessive internal stress and defects, and reducing the annealing quality.

[0004] Therefore, it is necessary to improve the annealing device used for post-coating treatment of silicon wafers in the prior art. Summary of the Invention

[0005] The purpose of the present invention is to overcome the defects existing in the prior art and provide an annealing device for silicon wafer post-coating treatment that reduces heat energy loss, improves annealing efficiency and heat energy utilization, further improves energy saving effects and reduces length size requirements, slows down the temperature change rate and improves annealing quality.

[0006] To achieve the above technical effects, the technical solution of the present invention is: an annealing device for post-treatment of silicon wafer coating, comprising:

[0007] An annealing furnace is a horizontal strip-shaped annealing furnace having an inlet, an outlet, an air inlet assembly, and five cavities. The five cavities are a heating transition chamber, a heating chamber, a heat preservation chamber, a cooling chamber, and a cooling transition chamber, which are sequentially distributed. The heating chamber is connected to the air inlet assembly and has a U-shape in horizontal plane projection. The rest extend in a direction parallel to the length of the annealing furnace. The inlet and the outlet are connected to the heating transition chamber and the cooling transition chamber, respectively.

[0008] A transmission mechanism, the transmission mechanism includes a transfer component located in the heat preservation chamber and two transmission components facing each other and in opposite transmission directions, the transfer component is arranged between the output end of one transmission component and the input end of the other transmission component to sequentially pass the material through the inlet, the five cavities and the outlet, each transmission component includes a drive unit and a transmission roller rotating around its own axis in the annealing furnace, the transmission rollers are distributed side by side along a direction parallel to the length of the annealing furnace and their axes are parallel to the width of the annealing furnace, the transmission rollers of each transmission component include active rollers distributed at intervals and with a distribution spacing less than the length of the material, and the drive unit drives the active rollers to rotate;

[0009] A heating component is provided in the heating chamber, the heat preservation chamber and the cooling chamber;

[0010] The on-off component is arranged between two adjacent cavities and has an intercepting form and a passing form. The on-off component in the intercepting form is used to block two adjacent cavities, and the on-off component in the passing form is used to allow materials to pass between two adjacent cavities. An in-place signal sensor is arranged adjacent to the feed side of each on-off component.

[0011] Preferably, in order to achieve the blocking and connection of two adjacent cavities, the on-off assembly includes an upper partition, a lower partition, a movable partition and a movable unit, the upper partition and the lower partition are respectively fixed above and below the transmission surface of the transmission assembly, and the movable unit drives the movable partition to move between the interception station and the passage station, so that the on-off assembly switches between the interception form and the passage form, and the movable path of the movable partition intersects with the transmission surface of the transmission assembly and passes through the gap between two adjacent transmission rollers.

[0012] Preferably, to facilitate the movement of the movable partition, the upper partition, the lower partition and the movable partition are all arranged vertically, the top surface of the lower partition is opposite to the bottom surface of the movable partition, the movable unit is a lifting unit that drives the movable partition to move in the vertical direction, and the movable partition is in contact with the upper partition.

[0013] Preferably, in order to facilitate the control of the degree of connectivity between two adjacent cavities, the top surface of the lower partition and the bottom surface of the movable partition are respectively provided with lower ridges and upper ridges that extend along the width direction of the annealing furnace and have the same height. The lower ridges and the upper ridges are spaced apart along the length direction parallel to the annealing furnace, and the projections of the lower ridges and the upper ridges on the horizontal plane are separated.

[0014] Preferably, in order to transfer the material on the output end of one transmission component to the input end of another transmission component, the projection of the transfer component on the horizontal plane is separated from the projection of the transmission roller on the horizontal plane, and the transfer component includes a support unit distributed along the length direction of the annealing furnace, and the support unit includes a support bar and a lifting unit that drives the support bar to move up and down and adjust the angle, and the movable path of the support bar passes through the transmission surface of the transmission component.

[0015] Preferably, in order to achieve smooth transfer of materials, two lifting units are provided in the support unit, one of which has an output end rotatably connected to the support bar, and the other has an output end rotatably connected to a sliding member that slidably cooperates with the support bar.

[0016] Preferably, in order to facilitate monitoring of the annealing temperature in the five cavities, temperature sensors are provided in the five cavities.

[0017] Preferably, in order to make full use of the heat in the annealing furnace, reduce heat damage and achieve energy saving, the insulation chamber is a heating chamber, the temperature rising transition chamber is a heating chamber, the temperature rising chamber and the temperature falling chamber are both heat recovery chambers, and the annealing furnace is connected with a reflux component, which is used to introduce the heat in at least one of the heating chamber and the heat recovery chamber into at least one of the heat recovery chamber and the heat receiving chamber, so as to reduce the difference between the actual temperature and the preset temperature in the temperature rising transition chamber, the temperature rising chamber, the insulation chamber and the temperature falling chamber.

[0018] Preferably, in order to fully utilize the thermal energy and reduce the difference between the actual temperature and the preset temperature in each cavity during operation, the annealing furnace is provided with three heating inlets respectively connected to the heating transition cavity, the heating cavity and the cooling transition cavity, and three heat supply outlets respectively connected to the heating cavity, the cooling transition cavity and the insulation cavity. The reflux component includes a reflux channel, a draft fan arranged in the reflux channel and a switching valve unit arranged at both ends of the reflux channel. The switching valve unit has a first guide port and three second guide ports connected to the reflux channel. The three second guide ports of one switching valve unit are respectively connected to the three heating inlets, and the three second guide ports of the other switching valve unit are respectively connected to the three heat supply outlets. The switching valve unit includes a valve core and an adjustment unit. The adjustment unit drives the valve core to move to adjust the connection state of the first guide port and the three second guide ports.

[0019] Preferably, in order to realize the connection and disconnection between the first guide port and any number of the three second guide ports in the switching valve unit, and to facilitate the selection of the heat supply source and the heat receiving target, the switching valve unit includes a valve cylinder, the first guide port is arranged at the end of the valve cylinder, the three second guide ports are arranged on the circumferential side wall of the valve cylinder, the circumferential inner wall of the valve core is sealed with the circumferential outer edge of the valve cylinder, the adjustment unit drives the valve core to rotate around its own axis, and a central blind hole connected to the first guide port is provided on the coaxial centerline of the valve cylinder, and a side through hole connected to the central blind hole is also provided on the side wall of the valve cylinder.

[0020] In summary, compared with the prior art, the annealing device for post-treatment of silicon wafer coating of the present invention reduces the length of the insulation furnace through the U-shaped insulation chamber, reduces the length requirement of the workshop, controls the connection and disconnection of two adjacent cavities through the on-off component, switches the on-off component to the blocking state when no material passes through, reduces the diffusion of heat energy to the outside, achieves energy saving, and realizes the transition before heating and after cooling through the heating transition chamber and the cooling transition chamber, improves the utilization rate of heat energy while slowing down the temperature change rate of the material, thereby improving the annealing quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a structural diagram of the first embodiment;

[0022] Figure 2 yes Figure 1 Explosion diagram of

[0023] Figure 3 yes Figure 1 Schematic diagram of part of the structure;

[0024] Figure 4 yes Figure 3 Explosion diagram of

[0025] Figure 5 yes Figure 3 Schematic diagram of part of the structure;

[0026] Figure 6 yes Figure 1 Schematic diagram of part of the structure;

[0027] Figure 7 yes Figure 6 Explosion diagram of

[0028] Figure 8 yes Figure 1 Schematic diagram of part of the structure from another perspective;

[0029] Figure 9 is a schematic cross-sectional structural diagram of the first embodiment;

[0030] Figure 10 yes Figure 9 Front view of

[0031] Figure 11 yes Figure 10 A magnified view of part A;

[0032] Figure 12 is a schematic structural diagram of the support unit of the first embodiment;

[0033] Figure 13 yes Figure 12 Explosion diagram of

[0034] Figure 14 is a schematic structural diagram of the second embodiment;

[0035] Figure 15 yes Figure 14 A top view of

[0036] Figure 16 yes Figure 14 Schematic diagram of part of the structure;

[0037] Figure 17 yes Figure 16 Explosion diagram of

[0038] Figure 18 This is a schematic structural diagram of the valve cartridge according to the second embodiment;

[0039] Figure 19 is a structural schematic diagram of the valve core of the second embodiment;

[0040] In the figure: 1, annealing furnace; 11, bottom plate; 12, side plate; 121, diverter hole; 13, top plate; 131, heating inlet; 132, heating outlet; 133, strip port; 134, connecting pipe; 135, connecting cover; 14, middle partition; 15, baffle; 151, bracket; 16, temperature sensor; 17, air intake shell; 171, air intake hole; 18, air intake pipe; 181, air intake valve; 19, positioning plate; 1 01. Feeding port; 102. Discharging port; 103. Air inlet assembly; 104. Heating transition chamber; 105. Heating chamber; 106. Insulation chamber; 107. Cooling chamber; 108. Cooling transition chamber; 2. Transmission assembly; 21. Drive unit; 211. Active unit; 2111. Active motor; 2112. Active gear; 2113. Driven ring gear; 212. Driven unit; 2121. Driven wheel; 2122 , connecting rod; 22, transmission roller; 221, active roller; 3, support unit; 31, support bar; 311, support roller; 312, limit plate; 313, sliding frame; 32, lifting unit; 33, sliding member; 34, protective cover; 4, heating component; 41, heating rod; 42, heating cover; 5, on-off component; 51, in-position signal sensor; 52, upper partition; 53, lower partition; 531, lower convex strip; 54, Movable unit; 541. Movable motor; 542. Screw; 543. Solenoid; 55. Sealing cover; 56. Movable partition; 561. Upper ridge; 562. Recess; 6. Return channel; 61. Drainage fan; 62. Drainage shell; 7. Switching valve unit; 71. Valve cylinder; 711. First guide port; 712. Second guide port; 72. Valve core; 721. Center blind hole; 722. Side through hole; 73. Adjustment unit. DETAILED DESCRIPTION

[0041] The following embodiments are further described in conjunction with the accompanying drawings and examples. The following embodiments are only used to more clearly illustrate the technical solutions of the present invention and are not intended to limit the scope of protection of the present invention.

[0042] First embodiment

[0043] like Figures 1-13 As shown, the annealing device for silicon wafer post-coating treatment according to the first embodiment of the present invention includes:

[0044] Annealing furnace 1, annealing furnace 1 is horizontal and long, annealing furnace 1 has a feed port 101, a discharge port 102, an air inlet assembly 103 and five cavities, the five cavities are a heating transition chamber 104, a heating chamber 105, a heat preservation chamber 106, a cooling chamber 107 and a cooling transition chamber 108 distributed in sequence, the heating chamber 105 is connected to the air inlet assembly 103 and the horizontal plane projection is U-shaped, and the rest extend along the length direction parallel to the annealing furnace 1, the feed port 101 and the discharge port 102 are connected to the heating transition chamber 104 and the cooling transition chamber 108 respectively;

[0045] The transmission mechanism includes a transfer component located in the heat preservation chamber 106 and two transmission components 2 facing each other and with opposite transmission directions. The transfer component is arranged between the output end of one transmission component 2 and the input end of the other transmission component 2 to sequentially pass the material through the inlet 101, the five cavities and the outlet 102. Each transmission component 2 includes a drive unit 21 and a transmission roller 22 that rotates around its own axis in the annealing furnace 1. The transmission rollers 22 are arranged side by side parallel to the length direction of the annealing furnace 1 and their axes are parallel to the width direction of the annealing furnace 1. The transmission rollers 22 of each transmission component 2 include active rollers 221 that are spaced apart and the distribution spacing is less than the length of the material. The drive unit 21 drives the active rollers 221 to rotate;

[0046] The heating component 4 is arranged in the temperature rising chamber 105, the temperature holding chamber 106 and the temperature dropping chamber 107;

[0047] The on-off component 5 is arranged between two adjacent cavities and has an intercepting form and a passing form. The on-off component 5 in the intercepting form is used to block two adjacent cavities, and the on-off component 5 in the passing form is used to allow materials to pass between two adjacent cavities. An in-place signal sensor 51 is arranged adjacent to the feed side of each on-off component 5.

[0048] When the device is running, the heating component 4 always keeps running, heating the gas in the heating chamber 105, the heat preservation chamber 106 and the cooling chamber 107, so that the temperature in the heating chamber 105, the heat preservation chamber 106 and the cooling chamber 107 increases, and when the on-off components 5 at the head and tail ends are switched to the pass state, the heat in the heating chamber 105 is transferred to the heating transition chamber 104, so that the temperature of the heating transition chamber 104 is between the outside temperature and the temperature in the heating chamber 105. Similarly, the temperature of the cooling transition chamber 108 is between the outside temperature and the temperature in the cooling chamber 107. In this way, when the material enters Before entering the heating chamber 105, it passes through the heating transition chamber 104 in advance, and before entering the outside world from the cooling chamber 107, it passes through the cooling transition chamber 108. That is, before heating, it is preheated by using the heat transferred from the heating chamber 105 to the heating transition chamber 104, and after cooling, it is used to slow down the descent speed of the silicon wafer material (hereinafter referred to as "material"). In this way, not only the diffused heat is fully utilized, the thermal energy utilization rate is improved, and energy saving is achieved, but also the rate of change of material temperature is slowed down, avoiding excessive temperature change of the material during annealing and reducing the annealing quality.

[0049] Specifically, during the heating stage, the material passes through the heating transition chamber 104 to slow down the heating rate, thereby preventing the material from generating thermal stress or thermal shock damage due to rapid temperature changes. During the heating process, if the temperature rises too quickly, the temperature gradient inside the material will increase, thereby increasing the risk of thermal stress and thermal shock.

[0050] Similarly, the design of the cooling transition chamber 108 can also slow down the cooling speed, avoiding excessive internal stress and defects in the material during rapid cooling. During the cooling process, if the cooling rate is too fast, the temperature gradient inside the material will also increase, which may cause defects such as deformation or cracks inside the material.

[0051] The on-off component 5 is switched between the pass and interception modes. In the interception mode, the connection between the two cavities can be blocked to avoid the diffusion of heat and ensure the independence between the two adjacent cavities. The in-place signal sensor 51 is used to detect whether there is material on the feed side of the on-off component 5. When material is detected, the on-off component 5 is adjusted to the pass state to facilitate the passage of the material, and then the on-off component 5 is restored to the interception state to reduce the transfer of heat to the outside and reduce the heat energy loss, thereby helping to achieve energy saving and improve annealing efficiency.

[0052] In addition, in this embodiment, unlike the prior art, the horizontal projection of the insulation chamber 106 adopts a U-shaped design, and the transmission mechanism includes two transmission components 2. Since the horizontal projection of the insulation chamber 106 is U-shaped, the material changes its transmission direction when passing through the insulation chamber 106. The transfer component is used to transfer the material on the output end of one of the transmission components 2 to the input end of the other transmission component 2 to ensure continuous transmission of the material, so that the material can pass through the feed port 101, five cavities and the discharge port 102 in turn to complete the smooth transformation of temperature rise transition, temperature rise, insulation, cooling and temperature fall transition, which not only improves the annealing quality, but also the U-shaped insulation chamber 106 can shorten the overall length of the device, thereby reducing the length requirement of the device for the production workshop.

[0053] In the transmission component 2, the driving unit 21 drives each active roller 221 to rotate around its own axis, and the distance between adjacent active rollers 221 is smaller than the length of the material, so that the material placed flat on the transmission roller 22 can be subjected to the transmission force of at least one active roller 221, thereby realizing the translation of the material.

[0054] like Figure 1-Figure 5As shown, in this embodiment, the annealing furnace 1 includes a horizontal bottom plate 11, and vertically arranged side plates 12 and a middle partition plate 14 are fixed above the bottom plate 11. The horizontal plane projection of the side plate 12 is U-shaped. One end of the middle partition plate 14, both ends of the side plate 12 and one end of the bottom plate 11 are all horizontal. There is a gap between the other end of the middle partition plate 14 and the middle part of the side plate 12, and the gap length is greater than the material length. A top plate 13 is fixed on the top of the side plate 12 and the middle partition plate 14. Two on-off components 5 are provided on both sides of the middle partition plate 14 and between the two inner walls of the side plate 12. Four baffles 15 are provided between the end of the middle partition plate 14 and the end of the side plate 12. Among the baffles 15, two are fixed on one side of the middle partition plate 14 and are respectively fixed below the top plate 13 and above the bottom plate 11 to form an inlet 101, and the other two baffles 15 are fixed on the other side of the middle partition plate 14 and are respectively fixed below the top plate 13 and above the bottom plate 11 to form an outlet 102. The bottom plate 11, side plate 12, top plate 13, middle partition plate 14 and baffles 15 cooperate with each other to enclose and form the inner cavity of the annealing furnace 1, while dividing the inner cavity of the annealing furnace 1 into five cavities, namely the temperature rising transition chamber 104, the temperature rising chamber 105, the heat preservation chamber 106, the temperature falling chamber 107 and the temperature falling transition chamber 108.

[0055] like Figure 2-Figure 4 As shown, the air intake assembly 103 faces away from the open side of the side panel 12. The air intake assembly 103 includes an air intake pipe 18 and air intake shells 17 disposed above and below the air intake pipe 18, respectively. The air intake shells 17 are U-shaped and enclose the side panel 12 to form an air intake cavity. The side panel 12 is provided with evenly distributed diverter holes 121 that communicate with the air intake cavity. Air intake holes 171 are provided on the opposing surfaces of the two air intake shells 17. The air intake pipe 18 is a T-shaped pipe, one end of which is provided with an air intake valve 181, and the other two ends are respectively connected to the two air intake holes 171. When the air intake valve 181 is opened, protective gas and reaction gas can be input into the two air intake shells 17 through the air intake pipe 18. After the gas enters the air intake cavity, it enters the insulation cavity 106 through the evenly distributed air intake holes 171, ensuring uniform gas distribution within the insulation cavity 106.

[0056] A bracket 151 distributed along the length direction of the annealing furnace 1 is provided at the gap between the middle of the side plate 12 and the middle partition 14. The bracket 151 is fixed above the bottom plate 11 and is used to support the end positions of the two transmission components 2 and the transmission rollers 22 near the end positions.

[0057] The specific structure of the transmission component 2 can be referred to Figure 2-Figure 5As shown, in the transmission assembly 2, the transmission rollers 22 are evenly spaced along the length direction of the annealing furnace 1. The transmission roller 22 located in the middle of the side plate 12 is supported by the bracket 151. For the remaining transmission rollers 22, one end of the roller shaft of the transmission roller 22 is rotatably connected to the middle partition plate 14, and the other end rotates on the side wall of the side plate 12 and is flush with the outer surface of the side plate 12. In the transmission assembly 2, the spacing between adjacent active rollers 221 is three times the spacing between adjacent transmission rollers 22. The transmission rollers 22 are distributed on the same horizontal plane, and the tops of the transmission rollers 22 are combined to form a transmission surface.

[0058] The driving unit 21 is arranged outside the annealing furnace 1. In order to drive each active roller 221 in the transmission component 2 to rotate at the same speed, the driving unit 21 includes a driving unit 211 and a driven unit 212, wherein the driven unit 212 includes a driven wheel 2121 fixedly connected to the active roller 221 coaxially, and adjacent driven wheels 2121 are hinged by a connecting rod 2122; the driving unit 211 includes an active motor 2111 fixed to the ground, and the output end of the active motor 2111 is fixedly connected to the active gear 2112 coaxially, and the active gear 2112 is meshed with a driven ring gear 2113, and the circumferential inner wall of the driven ring gear 2113 is fixedly connected to the circumferential outer edge of one of the driven wheels 2121.

[0059] After adopting the above structure, the active motor 2111 is started, driving the active gear 2112 to rotate around its own axis, acting on the driven ring gear 2113, so that the driven wheel 2121 fixedly connected to the driven ring gear 2113 on the same axis rotates, and the driven wheel 2121 acts on other driven wheels 2121 through the connecting rod 2122, so that the driven wheels 2121 rotate synchronously at the same speed, thereby driving each active roller 221 to rotate at the same speed.

[0060] The heating assembly 4 includes two heating units respectively arranged above and below the transmission surface of the transmission assembly 2. The heating units include heating rods 41 distributed at intervals. The axial direction of the heating rods 41 is parallel to the width direction of the annealing furnace 1. A heating cover 42 is provided on the side of the heating rods 41 facing away from the transmission surface of the transmission assembly 2. The heating cover 42 is used to guide the heat generated by the heating rods 41 during operation to radiate toward the transmission surface of the transmission assembly 2 to heat the material on the transmission surface. The heating rods 41 can use a variety of heating media, such as infrared lamps.

[0061] A further improvement is that the on-off assembly 5 includes an upper partition 52, a lower partition 53, a movable partition 56 and a movable unit 54. The upper partition 52 and the lower partition 53 are respectively fixed above and below the transmission surface of the transmission assembly 2. The movable unit 54 drives the movable partition 56 to move between the interception position and the passage position, so that the on-off assembly 5 switches between the interception form and the passage form. The movable path of the movable partition 56 intersects with the transmission surface of the transmission assembly 2 and passes through the gap between two adjacent transmission rollers 22 therein; the upper partition 52, the lower partition 53 and the movable partition 56 are all arranged vertically, and the top surface of the lower partition 53 is opposite to the bottom surface of the movable partition 56. The movable unit 54 is a lifting unit that drives the movable partition 56 to move in the vertical direction, and the movable partition 56 is in contact with the upper partition 52.

[0062] Specifically, such as Figures 6-11 As shown, the bottom of the lower partition 53 is fixedly connected to the bottom plate 11, the two side walls are fixedly connected to the opposite surfaces of the side plates 12 and the middle partition 14, the top is located below the transmission surface of the transmission component 2, and a strip opening 133 is provided on the top plate 13. The strip opening 133 extends along the width direction of the annealing furnace 1, and upper partitions 52 are provided on both sides of the bottom surface of the strip opening 133. The bottom surface of the upper partition 52 is located above the transmission surface of the transmission component 2, and the two side walls of the upper partition 52 are fixedly connected to the opposite surfaces of the side plates 12 and the middle partition 14 respectively.

[0063] A movable partition 56 is fitted between the two upper partitions 52, and the bottom surface of the movable partition 56 is opposite to the top surface of the lower partition 53. The two ends of the movable partition 56 are sealed with the opposite surfaces of the side plate 12 and the middle partition 14 respectively, and a recess 562 is also provided on the top of the movable partition 56; a sealing cover 55 covering the strip opening 133 and facing downward is fixed above the top plate 13, and the lifting unit includes a movable motor 541 fixed above the sealing cover 55 and facing downward, and the output end of the movable motor 541 is fixed with a screw 542 that passes through the top of the sealing cover 55 and extends into the recess 562 coaxially, the screw 542 is vertically arranged and threadedly connected to a solenoid 543, and the solenoid 543 is fixedly connected to the inner wall of the recess 562.

[0064] After adopting the above structure, the movable motor 541 in the movable unit 54 is started, driving the screw 542 to rotate around its own axis, acting on the solenoid 543, so that the solenoid 543 can drive the movable partition 56 to move in the vertical direction under the action of the two upper partitions 52 and the opposite surfaces of the side panels 12 and the middle partition 14. When the bottom surface of the movable partition 56 moves below the transmission surface of the transmission component 2, the on-off component 5 can intercept the material. When the bottom surface of the movable partition 56 abuts the top surface of the lower partition 53, the on-off component 5 is in an intercepting state, which can block the two adjacent cavities. When the movable partition 56 moves above the bottom of the upper partition 52, the on-off component 5 is in a passing state, which facilitates the material to enter the other cavity from one cavity.

[0065] The top surface of the lower partition 53 and the bottom surface of the movable partition 56 are respectively provided with a lower ridge 531 and an upper ridge 561 extending along the width direction of the annealing furnace 1 and having the same height. The lower ridge 531 and the upper ridge 561 are spaced apart along the length direction parallel to the annealing furnace 1, and the projections of the lower ridge 531 and the upper ridge 561 on the horizontal plane are spaced apart.

[0066] Specifically, such as Figure 11 As shown, after adopting the above structure, when there is a gap between the bottom of the upper ridge 561 and the top surface of the lower partition 53, there is a gap between the top of the lower ridge 531 and the bottom surface of the movable partition 56, and there is a gap between the upper ridge 561 and the lower ridge 531. Through the above gaps, a maze structure is formed. On the one hand, it can reduce the heat transfer between the two adjacent cavities and reduce heat energy loss. On the other hand, the reaction gas and the protective gas can flow between the two adjacent cavities, which facilitates annealing.

[0067] A further improvement is that the projection of the transfer assembly on the horizontal plane is separated from the projection of the transmission roller 22 on the horizontal plane, and the transfer assembly includes a support unit 3 distributed along the length direction of the annealing furnace 1, and the support unit 3 includes a support bar 31 and a lifting unit 32 that drives the support bar 31 to move up and down and adjusts the angle, and the movable path of the support bar 31 passes through the transmission surface of the transmission assembly 2; there are two lifting units 32 in the support unit 3, one of which is rotatably connected to the support bar 31 at its output end, and the other is rotatably connected to a sliding member 33 that slides with the support bar 31 at its output end.

[0068] Specifically, such as Figure 5 、 Figure 12 and Figure 13 As shown, a positioning plate 19 is fixed above the bottom plate 11. The positioning plate 19 is higher than the transmission surface of the transmission component 2 and is adjacent to the middle of the side plate 12. The positioning plate 19 is opposite to the feed port 101, which is convenient for intercepting the material transmitted by the transmission component 2 corresponding to the feed port 101. The two support units 3 perform periodic motion, and regularly transfer the material intercepted by the positioning plate 19 from the output end of one of the transmission components 2 to the input end of the other transmission component 2.

[0069] In the support unit 3, the horizontal projection of the support bar 31 extends along the width direction of the annealing furnace 1. Above the support bar 31, support rollers 311 are arranged at intervals along its length direction. The axis of the support roller 311 is parallel to the length direction of the annealing furnace 1, and the support roller 311 rotates around its own axis above the support bar 31.

[0070] A limiting plate 312 is fixed above the end of the support bar 31 opposite to the discharge port 102, and a sliding frame 313 is fixed below the other end. The two lifting units 32 are electric push rods, and the shells of the electric push rods are fixed above the base plate 11. The top of the output end of one of them is rotatably connected to the end of the bottom of the support bar 31 close to the limiting plate 312, and the top of the output end of the other is rotatably connected to a sliding member 33, and the sliding member 33 slides on the sliding frame 313; the support unit 3 also includes a protective cover 34, which encloses the base plate 11 to form a protective cavity, and the shell of the electric push rod is arranged in the protective cavity to prevent the electric push rod from being affected by the high temperature in the insulation cavity 106.

[0071] When the material is transferred, the two jacking units 32 first lower the support bar 31 and the support roller 311 to the bottom of the transmission surface of the transmission component 2, and adjust the support bar 31 to a horizontal state, and then the output ends of the two jacking units 32 move upward at the same speed, pushing the support bar 31 upward to pass through the support surface of the transmission component 2, so that the support roller 311 horizontally supports the material, and the jacking unit 32 correspondingly connected to the sliding member 33 continues to operate, while the other jacking unit 32 stops operating, so that the support bar 31 is tilted, driving one end of the limit plate 312 to the ground, and through the tilted support bar 31, it is convenient for the material to slide down through the support roller 311 until it contacts the limit plate 312, and then the two jacking units 32 control the support bar 31 to move downward, so that the support roller 311 is located below the transmission surface of the transmission component 2, and the support unit 3 is separated from the material, thereby completing the material transfer operation between the two transmission components 2.

[0072] A further improvement is that each of the five cavities is provided with a temperature sensor 16. Specifically, the temperature sensor 16 is fixed below the top plate 13. The temperature sensor 16 facilitates monitoring the temperature in the five cavities to adjust the heating power of the heating rod 41, reduce the difference between the actual temperature in each cavity and the preset temperature, and improve the annealing quality.

[0073] Second embodiment

[0074] like Figures 14-19 As shown, the annealing device for post-coating treatment of silicon wafers according to the second embodiment of the present invention is based on the first embodiment, with the difference that the holding chamber 106 is a heating chamber, the temperature rising transition chamber 104 is a heating chamber, the temperature rising chamber 105 and the temperature falling chamber 107 are both reheating chambers, and the annealing furnace 1 is connected to a reflow component, which is used to introduce heat from at least one of the heating chamber and the reheating chamber into at least one of the reheating chamber and the heating chamber, so as to reduce the difference between the actual temperature and the preset temperature in the temperature rising transition chamber 104, the temperature rising chamber 105, the holding chamber 106 and the temperature falling chamber 107.

[0075] In this embodiment, the insulation chamber 106 is a heating chamber, that is, a heat source. When its internal temperature is too high, it can provide heat to the other three chambers through the reflux component; the temperature rising transition chamber 104 is a heating chamber. When its internal temperature is too low, it can receive heat from any one to three of the other three chambers through the reflux component, that is, one to three chambers among the temperature rising chamber 105, the insulation chamber 106 and the temperature cooling chamber 107; and the temperature rising chamber 105 and the temperature cooling chamber 107 serve as heat recovery chambers, that is, they can serve as a heat source. When the internal temperature of the temperature rising transition chamber 104 is too low and the internal temperature of the temperature rising transition chamber 104 is too high, they can provide heat to the temperature rising transition chamber 104 through the reflux component, and can also receive heat from the insulation chamber 106 through the reflux component when the internal temperature of the temperature rising transition chamber 104 is too low. In addition, when the temperature of one of the temperature rising chamber 105 and the temperature cooling chamber 107 is too low and the other is too high, the cavity with the higher temperature can serve as a heat source and provide heat to the cavity with the lower temperature through the reflux component. Through the above-mentioned method, the heat energy utilization rate of the inner cavity of the annealing furnace 1 can be further improved, thereby reducing heat energy loss and achieving energy saving.

[0076] A further improvement is that the annealing furnace 1 is provided with three heated inlets 131 respectively connected to the heating transition chamber 104, the heating chamber 105, and the cooling transition chamber 108, and three heat supply outlets 132 respectively connected to the heating chamber 105, the cooling transition chamber 108, and the insulation chamber 106. The reflux component includes a reflux channel 6, a draft fan 61 arranged in the reflux channel 6, and a switching valve unit 7 arranged at both ends of the reflux channel 6. The switching valve unit 7 has a first guide port 711 and three second guide ports 712 connected to the reflux channel 6. The three second guide ports 712 of one switching valve unit 7 are respectively connected to the three heated inlets 131, and the three second guide ports 712 of the other switching valve unit 7 are respectively connected to the three heat supply outlets 132. The switching valve unit 7 includes a valve core 72 and an adjustment unit 73. The adjustment unit 73 drives the valve core 72 to move to adjust the connection state of the first guide port 711 and the three second guide ports 712.

[0077] Specifically, the three heating inlets 131 and the three heating outlets 132 are all arranged on the top plate 13 and are in the shape of through holes. The three heating outlets 132 are connected one-to-one to the top of the heating chamber 105, the insulation chamber 106 and the cooling chamber 107. The three heating inlets 131 are connected one-to-one to the top of the heating transition chamber 104, the heating chamber 105 and the cooling chamber 107. The top plate 13 is also fixed with six downward connecting covers 135. The top of the connecting cover 135 is fixedly connected with a connecting pipe 134. The end of the connecting pipe 134 away from the connecting cover 135 is fixedly connected with the second guide port 712 in the switching valve unit 7. The bottoms of the six connecting covers 135 are respectively connected one-to-one with the three heating inlets 131 and the three heating outlets 132; the middle part of the return channel 6 is fixedly connected with a drainage shell 62, and a drainage fan 61 is arranged in the drainage shell 62.

[0078] The movement of the valve core 72 is controlled by the regulating unit 73, thereby controlling the connection state between the first guide port 711 and the three second guide ports 712 in the switching valve unit 7, so that the first guide port 711 can be flexibly connected or disconnected with the three second guide ports 712. The specific operation is that when the actual temperature in the four cavities of the heating transition chamber 104, the heating chamber 105, the heat preservation chamber 106 and the cooling chamber 107 is consistent with the preset temperature, the drainage fan 61 stops running, and the first guide port 711 and the three second guide ports 712 in the two switching valve units 7 are disconnected. At this time, the four cavities are relatively independent and the heat transfer is small; and when the actual temperature in the four cavities of the heating transition chamber 104, the heating chamber 105, the heat preservation chamber 106 and the cooling chamber 107 is relatively high, the heat transfer is small, and the heat transfer is small. When the temperature is too low and some temperatures are relatively too high, in the switching valve unit 7 corresponding to the three heating outlets 132, the regulating unit 73 controls the movement of the valve core 72 so that the first guide port 711 is connected to the second guide port 712 corresponding to the cavity with relatively high temperature. In the switching valve unit 7 corresponding to the three heating inlets 131, the regulating unit 73 controls the movement of the valve core 72 so that the first guide port 711 is connected to the second guide port 712 corresponding to the cavity with relatively low temperature. After the switching is completed, the ventilation fan 61 is started, so that the hot air in the cavity with a higher temperature enters the return channel 6 after passing through the heat outlet 132, the second guide port 712 and the first guide port 711 in the switching valve unit 7 corresponding to the heat outlet 132 in turn. Along the return channel 6, the high-temperature air can pass through the first guide port 711 and the second guide port 712 in another switching valve unit 7 in turn, and then enter the cavity with a lower temperature through the heated inlet 131, thereby realizing full utilization of thermal energy, reducing thermal energy loss, and achieving energy saving.

[0079] A further improvement is that the switching valve unit 7 includes a valve cylinder 71, a first guide port 711 is arranged at the end of the valve cylinder 71, three second guide ports 712 are arranged on the circumferential side wall of the valve cylinder 71, the circumferential inner wall of the valve core 72 is sealed with the circumferential outer edge of the valve cylinder 71, and the adjustment unit 73 drives the valve core 72 to rotate around its own axis. A central blind hole 721 connected to the first guide port 711 is provided on the valve cylinder 71 coaxially, and a side through hole 722 connected to the central blind hole 721 is also provided on the side wall of the valve cylinder 71.

[0080] Specifically, the valve cylinder 71 is fixed directly above the sealing cover 55 and is vertically arranged. The adjustment unit 73 is a stepper motor, whose motor housing is fixed in the sealing cover 55 and is arranged upward. Its output shaft coaxially seals through the top of the sealing cover 55 and the bottom of the valve cylinder 71, and is then fixedly connected to the valve core 72 coaxially. Three second guide ports 712 are provided on the side wall of the valve cylinder 71. The circumferential outer edge of the connecting pipe 134 at the end away from the connecting cover 135 is fixedly connected to the circumferential inner wall of the second guide port 712. The top of the valve cylinder 71 is provided with a first guide port 711 fixedly connected to the end of the return channel 6. The first guide port 711 is coaxial with the valve cylinder 71. The three second guide ports 712 are correspondingly arranged at three axial positions and three radial positions of the valve cylinder 71. The projection of the center of the three second guide ports 712 on the horizontal plane, when combined with the perpendicular line of the axis of the valve cylinder 71, forms a T-shape. The top of the valve core 72 is provided with a central blind hole 721 coaxially, and the central blind hole 721 is directly connected to the first guide port 711. The bottom of the valve core 72 is fixedly connected to the output shaft of the regulating motor coaxially; the outer diameter of the valve core 72 is consistent with the inner diameter of the valve cylinder 71, so that the circumferential outer edge of the valve core 72 is sealed with the circumferential inner wall of the valve cylinder 71, and the top and bottom of the valve core 72 are respectively sealed with the inner top wall and inner bottom wall of the valve cylinder 71; the side wall of the valve core 72 is provided with a plurality of holes distributed along its own axial direction and connected to the central blind hole 721. The heart blind hole 721 corresponds to the three layers of connected side through holes 722, and the three layers of side through holes 722 correspond to the three second guide ports 712. There are four side through holes 722 in each of the three layers. Among them, the four side through holes 722 in the bottom layer are distributed in a circular array on the semicircle of the side wall of the valve core 72. The side through holes 722 in the middle layer are distributed in a circular array on the circumference of the side wall of the valve core 72 in units of two. The four side through holes 722 in the top layer are distributed in a circular array on the circumference of the side wall of the valve core 72.

[0081] After adopting the above structure, the rotation of the valve core 72 is controlled by the adjustment unit 73. Each time the rotation angle is 45°, it can be selected whether the side through hole 722 on the valve core 72 is docked with the second guide port 712 on the valve cylinder 71. When docked, the first guide port 711 can be connected to the second guide port 712 through the central blind hole 721 and the side through hole 722 in sequence. Otherwise, the second guide port 712 is opposite to the outer wall of the valve core 72, so that the second guide port 712 is separated from the first guide port 711. In this way, according to the rotation angle of the valve core 72, the communication state of the first guide port 711 and the three second guide ports 712 can be flexibly controlled.

[0082] For easy distinction, the three second guide ports 712 are marked as A1, A2 and A3 respectively. In the initial rotation state, the three second guide ports 712 are all connected to the first guide port 711. The valve core 72 rotates 45° each time around its own axis, and a rotation state diagram as shown in the following figure can be obtained (wherein the A1 state represents the connection state between A1 and the first guide port 711).

[0083] rotation angle A1 status A2 status A3 status 0° Connectivity Connectivity Connectivity 45° Connectivity Connectivity disconnect 90° Connectivity disconnect Connectivity 135° Connectivity disconnect disconnect 180° disconnect Connectivity Connectivity 225° disconnect Connectivity disconnect 270° disconnect disconnect Connectivity 315° disconnect disconnect disconnect

[0084] According to the above table, the device can select four cavities, namely the temperature rising transition chamber 104, the temperature rising chamber 105, the heat preservation chamber 106 and the temperature falling chamber 107. Among them, the part of the cavity with a higher temperature passes through one of the switching valve units 7, flows into the other switching valve unit 7 through the reflux channel 6, and then enters the part of the cavity with a lower temperature, thereby fully utilizing heat energy, reducing heat energy loss, and achieving energy saving and environmental protection.

[0085] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. An annealing device for post-treatment of silicon wafer coating, characterized in that: include: An annealing furnace (1), the annealing furnace (1) is in the shape of a horizontal strip, the annealing furnace (1) has an inlet (101), an outlet (102), an air inlet assembly (103) and five cavities, the five cavities being a heating transition chamber (104), a heating chamber (105), a heat preservation chamber (106), a cooling chamber (107) and a cooling transition chamber (108) distributed in sequence, the heating chamber (105) being connected to the air inlet assembly (103) and having a U-shape in horizontal plane projection, and the rest extending in parallel with the length direction of the annealing furnace (1), the inlet (101) and the outlet (102) being respectively connected to the heating transition chamber (104) and the cooling transition chamber (108); A transmission mechanism, the transmission mechanism comprising a transfer component located in the heat preservation chamber (106) and two transmission components (2) facing each other and having opposite transmission directions, the transfer component being arranged between the output end of one of the transmission components (2) and the input end of the other transmission component (2) so as to sequentially pass the material through the inlet (101), the five cavities and the outlet (102), each transmission component (2) comprising a driving unit (21) and a transmission roller (22) rotating around its own axis in the annealing furnace (1), the transmission rollers (22) being arranged side by side parallel to the length direction of the annealing furnace (1) and axially parallel to the width direction of the annealing furnace (1), the transmission rollers (22) of each transmission component (2) comprising active rollers (221) distributed at intervals and having a distribution interval smaller than the length of the material, the driving unit (21) driving the active rollers (221) to rotate; A heating component (4), the heating component (4) being arranged in the heating chamber (105), the heat preservation chamber (106) and the cooling chamber (107); The on-off assembly (5) is arranged between two adjacent cavities and has an intercepting form and a passing form. The on-off assembly (5) in the intercepting form is used to block the two adjacent cavities, and the on-off assembly (5) in the passing form is used to allow materials to pass between the two adjacent cavities. An in-position signal sensor (51) is provided adjacent to the feed side of each on-off assembly (5).

2. The annealing device for post-treatment of silicon wafer coating according to claim 1, characterized in that: The on-off assembly (5) comprises an upper partition (52), a lower partition (53), a movable partition (56) and a movable unit (54), wherein the upper partition (52) and the lower partition (53) are respectively fixed above and below the transmission surface of the transmission assembly (2), and the movable unit (54) drives the movable partition (56) to move between the interception position and the passage position, so that the on-off assembly (5) switches between the interception form and the passage form, and the movable path of the movable partition (56) intersects with the transmission surface of the transmission assembly (2) and passes through the gap between two adjacent transmission rollers (22).

3. The annealing device for post-treatment of silicon wafer coating according to claim 2, characterized in that: The upper partition (52), the lower partition (53) and the movable partition (56) are all arranged vertically, the top surface of the lower partition (53) is opposite to the bottom surface of the movable partition (56), the movable unit (54) is a lifting unit that drives the movable partition (56) to move in the vertical direction, and the movable partition (56) is in contact with the upper partition (52).

4. The annealing device for post-treatment of silicon wafers after coating according to claim 3, characterized in that: The top surface of the lower partition (53) and the bottom surface of the movable partition (56) are respectively provided with a lower convex strip (531) and an upper convex strip (561) both extending along the width direction of the annealing furnace (1) and having the same height. The lower convex strip (531) and the upper convex strip (561) are both spaced apart along the length direction parallel to the annealing furnace (1), and the projections of the lower convex strip (531) and the upper convex strip (561) on the horizontal plane are spaced apart.

5. The annealing device for post-treatment of silicon wafer coating according to claim 1, characterized in that: The projection of the transfer assembly on the horizontal plane is spaced from the projection of the transmission roller (22) on the horizontal plane. The transfer assembly includes a support unit (3) distributed along the length direction of the annealing furnace (1). The support unit (3) includes a support bar (31) and a lifting unit (32) for driving the support bar (31) to move up and down and adjust the angle. The movable path of the support bar (31) passes through the transmission surface of the transmission assembly (2).

6. The annealing device for post-treatment of silicon wafer coating according to claim 5, characterized in that: The supporting unit (3) is provided with two lifting units (32), the output end of one of which is rotatably connected to the supporting bar (31), and the output end of the other is rotatably connected to a sliding member (33) that slidably cooperates with the supporting bar (31).

7. The annealing device for post-treatment of silicon wafers after coating according to claim 1, characterized in that: Temperature sensors (16) are provided in each of the five cavities.

8. The annealing device for post-treatment of silicon wafers after coating according to claim 7, characterized in that: The heat preservation chamber (106) is a heat supply chamber, the temperature rising transition chamber (104) is a heat receiving chamber, the temperature rising chamber (105) and the temperature falling chamber (107) are both heat recovery chambers, and the annealing furnace (1) is connected to a reflow assembly, and the reflow assembly is used to introduce heat in at least one of the heat supply chamber and the heat recovery chamber into at least one of the heat recovery chamber and the heat receiving chamber, so as to reduce the difference between the actual temperature in the temperature rising transition chamber (104), the temperature rising chamber (105), the heat preservation chamber (106) and the temperature falling chamber (107) and the preset temperature.

9. The annealing device for post-treatment of silicon wafers after coating according to claim 8, characterized in that: The annealing furnace (1) is provided with three heating inlets (131) respectively connected to the heating transition chamber (104), the heating chamber (105), and the cooling transition chamber (108), and three heat supply outlets (132) respectively connected to the heating chamber (105), the cooling transition chamber (108), and the heat preservation chamber (106). The reflux component includes a reflux channel (6), a flow-inducing fan (61) arranged in the reflux channel (6), and a switching valve unit (7) arranged at both ends of the reflux channel (6). The switching valve unit (7) has a function of connecting to the reflux channel (6). The first guide port (711) and three second guide ports (712) are connected to each other, wherein the three second guide ports (712) of one switching valve unit (7) are connected to the three heating inlets (131) respectively, and the three second guide ports (712) of another switching valve unit (7) are connected to the three heating outlets (132) respectively, and the switching valve unit (7) includes a valve core (72) and an adjusting unit (73), and the adjusting unit (73) drives the valve core (72) to move so as to adjust the connection state of the first guide port (711) and the three second guide ports (712).

10. The annealing device for post-treatment of silicon wafers after coating according to claim 9, characterized in that: The switching valve unit (7) includes a valve cylinder (71), the first guide port (711) is arranged at the end of the valve cylinder (71), and the three second guide ports (712) are arranged on the circumferential side wall of the valve cylinder (71). The circumferential inner wall of the valve core (72) is sealed with the circumferential outer edge of the valve cylinder (71). The regulating unit (73) drives the valve core (72) to rotate around its own axis. A central blind hole (721) communicating with the first guide port (711) is provided on the coaxial center line of the valve cylinder (71), and a side through hole (722) communicating with the central blind hole (721) is also provided on the side wall of the valve cylinder (71).

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