High efficiency led substrate heater for deposition applications

Abstract

An optical array disposed in a susceptor, the susceptor configured to deposit a material on a substrate, the optical array including an array of a plurality of optical elements, windows, and pinholes. The optical element is disposed on a printed circuit board (PCB). The optical element is configured to emit light. The window includes an optically transparent material covering an optical element disposed on the printed circuit board. An array of pinholes is disposed between the optical element and the window. The pinhole is vertically aligned with the optical element to direct light emitted by the optical element through the window to heat the substrate.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of U.S. Provisional Patent Application No. 63 / 388,704, filed on July 13, 2022, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] The present disclosure relates generally to semiconductor processing systems and, more particularly, to a high efficiency light emitting diode (LED) substrate heater for deposition applications. Background Art

[0003] The background description provided here is for the purpose of generally presenting the background of the present disclosure. The work of the currently designated inventors within the scope described in this background section and aspects of the specification that were not determined to be prior art at the time of filing the application are neither explicitly nor implicitly admitted to be prior art against the present disclosure.

[0004] Substrate processing systems typically include multiple processing chambers (also referred to as processing modules) that are used to perform deposition, etching, and other processes on substrates such as semiconductor wafers. Examples of processes that can be performed on a substrate include chemical vapor deposition (CVD), plasma enhanced CVD (PECVD), chemical enhanced plasma vapor deposition (CEPVD), atomic layer deposition (ALD), epitaxial deposition, sub-atmospheric CVD, plasma enhanced ALD (PEALD), and a variety of other deposition processes that require the substrate to be exposed to high temperatures. Examples of other processes that can be performed on a substrate include etching (e.g., chemical etching, plasma etching, reactive ion etching, etc.) and cleaning processes.

[0005] During processing, the substrate is placed on a substrate support or susceptor such as a pedestal or chuck (ESC) in a processing chamber of a substrate processing system. In some processes, during deposition, a gas mixture containing one or more precursors is introduced into the processing chamber, and a plasma can be excited to initiate a chemical reaction. In other processes, during etching, a gas mixture containing an etching gas is introduced into the processing chamber, and a plasma can be excited to initiate a chemical reaction. A computer-controlled robot is used to transfer the substrate from one processing chamber to another in the order in which the substrates are to be processed. Summary of the invention

[0006] An optical array disposed in a base configured to deposit a material on a substrate comprises an array of multiple optical elements, a window, and pinholes. The multiple optical elements are disposed on a printed circuit board (PCB). The optical elements are configured to emit light. The window comprises an optically transparent material covering the optical elements disposed on the printed circuit board. The array of pinholes is disposed between the optical elements and the window. The pinholes are vertically aligned with the optical elements to direct the light emitted by the optical elements through the window to heat the substrate.

[0007] In additional features, the optical array further comprises a lens disposed between the optical element and the pinhole. The lens is aligned with the optical element and the pinhole to focus the light from the optical element to the pinhole.

[0008] In additional features, the optical element includes a lens to focus the light from the optical element to the pinhole.

[0009] In additional features, the array of pinholes comprises a metal or a dielectric material.

[0010] In additional features, the array of pinholes is integrated with the window in an integral assembly.

[0011] In additional features, the array of pinholes is coated with a reflective material on a side facing the window. The reflective material does not cover the pinholes.

[0012] In additional features, the array of pinholes is coated with an anti-reflective material on a side facing the optical element.

[0013] In additional features, the window is coated with an anti-reflective material on the side facing the optical element; and is coated with a material that is anti-reflective for the wavelength of the light emitted by the optical element and reflective for infrared wavelengths on the side facing the substrate.

[0014] In additional features, the window is coated with an anti-reflective material on a side facing the optical element. The window also includes a reflective material coated on the anti-reflective material. The reflective material includes a metal film and the pinhole.

[0015] In additional features, the optical element comprises a light emitting diode.

[0016] In additional features, the optical element includes a light emitting diode configured to emit light having a wavelength between 530 nm and 1000 nm.

[0017] In additional features, the optical array is circular.The optical elements and the pinholes are arranged in concentric circles from an inner diameter to an outer diameter of the optical array.

[0018] In additional features, the optical array further comprises a lens disposed between the optical element and the pinhole. The optical array is circular. The optical element, the pinhole and the lens are disposed in concentric circles from an inner diameter to an outer diameter of the optical array. The lens is aligned with the optical element and the pinhole to converge the light from the optical element to the pinhole.

[0019] In additional features, the pinhole is cylindrical.

[0020] In additional features, the pinhole is conical with its base facing the optical element.

[0021] In additional features, the PCB further includes one or more driver circuits configured to control power supplied to the optical element.

[0022] In additional features, the PCB further includes one or more driver circuits configured to control the operation of selected ones of the optical elements.

[0023] In additional features, the PCB further includes a driver circuit configured to control the light emitted by the optical element. The driver circuit is disposed on the same side of the PCB as the optical element, on an opposite side of the PCB, or on both sides of the PCB.

[0024] In additional features, the optical array further includes a heat sink attached to a side of the PCB opposite to a side of the PCB on which the optical elements are disposed.

[0025] In additional features, the window is sealingly attached to the PCB.

[0026] In additional features, a system includes the optical array and the base. The base includes: a stem; and a base mounted to the stem. The optical array is disposed in the base of the base.

[0027] In additional features, the base and the optical array are coplanar.

[0028] In additional features, the base and the optical array are circular. The optical array has an outer diameter that is less than or equal to an outer diameter of the base.

[0029] In additional features, the base and the optical array are circular. The outer diameter of the array is less than or equal to the outer diameter of the substrate.

[0030] In additional features, the base and the optical array are circular. The outer diameter of the array is at least equal to the outer diameter of the substrate.

[0031] In additional features, the base further includes a shaft and an actuator. The shaft is disposed through the stem, the base, and the center of the array. The actuator is coupled to the shaft and configured to move the substrate relative to the base.

[0032] In additional features, the base further comprises an axis and an actuator. The axis is disposed through the center of the rod, the base, and the array. The actuator is coupled to the axis and configured to move the substrate vertically relative to a plane in which the base is located.

[0033] In additional features, the base further comprises a shaft and an actuator. The shaft is disposed through the center of the stem, the base, and the array. The actuator is coupled to the shaft and configured to rotate the substrate relative to the base.

[0034] In additional features, the base further comprises a shaft and an actuator. The shaft is arranged to pass through the center of the stem, the base and the array. The shaft comprises a conduit and a plurality of holes, the conduit being adapted to receive a gas, the plurality of holes being in fluid communication with the conduit near a first end of the shaft proximate the array. The actuator is coupled to a second end of the shaft and configured to move the substrate vertically relative to a plane in which the base is located. When the shaft is raised above the array, the plurality of holes radially supply the gas above the window.

[0035] In additional features, the array of pinholes is connected to ground potential.

[0036] Further scope of applicability of the present disclosure will become apparent from the detailed description, claims and drawings.The detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The present disclosure will be more fully understood from the detailed description and accompanying drawings, in which:

[0038] Figure 1A It is shown that according to the present disclosure Figure 1B An example of an optical array used in a pedestal in the system shown, the optical array heating the substrate;

[0039] Figure 1BAn example of a system for processing a substrate according to the present disclosure is shown;

[0040] Figure 2 It is shown that according to the present disclosure Figure 1B A plan view of an optical array used in a base in the system shown, the optical array heating the substrate;

[0041] Figure 3 Shows Figure 2 A cross-sectional view of an optical array;

[0042] Figures 4A-4D Shown in detail Figure 2 Examples of optical arrays;

[0043] Figures 5A-5D Shows Figure 2 Another example of an optical array;

[0044] Figure 6 Shows Figure 2 A plan view of a pinhole array used in an optical array;

[0045] Figure 7 Shows Figure 2 A plan view of a lens used in an optical array;

[0046] Figure 8 It is shown that according to the present disclosure Figure 1B The base used in the system is used to control Figure 2 A block diagram of a system of an optical array that heats a substrate; and

[0047] Fig. 9 as well as Fig.10 The invention shows the use of vacuum clamping and the inclusion of Figure 2 An example of a base for an optical array that can be used Figure 1B In the system, the substrate is heated.

[0048] Among the drawings, reference numerals may be repeated to identify similar and / or identical elements. DETAILED DESCRIPTION

[0049] Typically, a resistive heating pedestal or base is used to heat the substrate. The pedestal contains a heat conductor, which is typically made of a metal such as aluminum, that houses a heater element that heats the conductor. During processing, the conductor diffuses heat to heat the substrate disposed on the pedestal. Gas conduction between the substrate and the heated pedestal, combined with radiation, thermally couples the substrate to the pedestal.

[0050] Resistive heated pedestals have limited ability to tune or adjust localized heating of the substrate in a recipe-controlled manner because the heating elements for localized heating are difficult to implement in the bulk of the pedestal. The ability to tune or adjust localized heating of the substrate is further limited because the thermal conductors dissipate heat locally to improve the overall temperature uniformity across the pedestal. In contrast, materials with lower thermal conductivity, such as ceramics, have difficulty balancing a thermal resistance low enough to achieve localized heating with a fracture toughness and thermal shock resistance high enough to prevent unintended fracture. Another limiting factor in thermal uniformity of the substrate is the different radiative and conductive heat losses near the chamber walls and in different parts of the substrate, which need to be compensated by the heaters in the form of different heating powers.

[0051] In contrast, an optical array such as an LED array in or on a pedestal can be used to heat the substrate. Unlike other heating elements, an optical array contains optical elements, such as LEDs, that emit light to optically heat the substrate. The optical array can adjust or tune the local heating of the substrate in a recipe-controlled manner. Although the substrate can be heated by light of shorter wavelengths, light-induced corrosion occurs at wavelengths below 530nm. Therefore, the wavelength used for optical heating of the substrate is preferably selected between 530nm and 1000nm. Optical array-based heating can provide recipe-controlled, highly adjustable substrate heating to adjust thermal uniformity, improve unit processing, and compensate for upstream or downstream processing issues.

[0052] In vacuum deposition applications, the optical array is encapsulated in a sealed housing. Light from the optical array is irradiated onto the substrate through an optically transparent window (usually made of quartz or sapphire). In some examples, the substrate and the optical array can be stationary relative to each other. Alternatively, the substrate and the optical array can rotate relative to each other.

[0053] The window needs to be kept clean to prevent the optical transmission efficiency of the window from being offset by parasitic deposition on the window surface. In applications where the substrate is placed directly on the window, a cleaning scheme such as edge cleaning via an annulus or annular arrangement formed by gas cleaning holes can be used to keep the window clean. Alternatively, if the substrate is separated from the window and the process pressure is above a threshold (e.g., at least 40 Torr or so), a cross-flow gas cleaning arrangement using the Coanda effect can be used. Alternatively, the window can be periodically dry chemically cleaned. These features can also be used for aqueous (wet) deposition applications.

[0054] From an environmental, social and governance (ESG) perspective, LEDs outperform other heating elements. LED heating can be less efficient from an electrical to thermal energy conversion perspective. However, due to the lower temperature of the LEDs, LED heating prevents radiation loss to other parts of the process chamber. Specifically, because the LEDs provide directional heating, the optical array heats only the substrate and not the process chamber. In addition, LED heating can also provide zoned heating control for purely thermal, non-plasma applications. Therefore, LED heating provides a more efficient wafer heating system compared to other forms of heating.

[0055] Typically, an optical array-based heater can convert about 1 / 3-1 / 2 of the electrical power provided to the LED into optical power. About 60% of the optical power will heat the substrate, and 40% will be reflected back from the substrate. The reflected power will heat the LED printed circuit board, the metal core printed circuit board (metal core PCB) that provides power to the LED printed circuit board, and the heat sink located below the metal core printed circuit board. The LED printed circuit board is usually coated with white paint to reduce heat absorption. However, compared to the total surface area of ​​the LED printed circuit board, the surface area occupied by the LED and its associated electrical contact pads is large. In addition, some of the wasted heat will heat the electronic devices on the metal core printed circuit board that provide power to the LED PCB, and set an upper limit on the available working substrate temperature during processing. In order to overcome this limitation, it is necessary to improve the optical heating efficiency of the optical array-based heater. The present disclosure provides a system that can minimize the optical power absorbed by the LED printed circuit board and maximize the optical power that can be used to heat the substrate.

[0056] Specifically, a pinhole array including small holes is disposed above the LED array. The pinhole array may be made of metal or a dielectric material (e.g., glass coated with a dielectric material). A focusing layer is disposed between the LED array and the pinhole array to focus light from the LEDs through the small holes in the pinhole array. For example, the focusing layer may include a focusing lens array that is a single component made using printing or other manufacturing methods. Alternatively, the LED array may be made so that each LED includes a built-in lens.

[0057] The pinhole array is coated with a super reflective coating (such as barium sulfate, dielectric film, or metal and dielectric film) on the side opposite to the LED (i.e., the side facing the substrate). The super reflective coating does not cover the pinholes themselves, but covers the remaining surface area of ​​the pinhole array. Optionally, an anti-reflective coating can also be applied on the side of the pinhole array facing the LED. Due to these coatings, the pinhole array can maximize the light power from the LED through the window to heat the substrate.

[0058] In addition, the window disposed above the LED array may be coated with an appropriate coating to reduce the amount of light reflected back through the window and reduce infrared heat transfer from the substrate to the LED array. Specifically, the first coating applied to the substrate-facing side of the window (i.e., the wafer-facing side) may reflect the secondary light reflected from the bottom surface of the substrate back to the bottom surface of the substrate. Therefore, the first coating improves the optical heating efficiency of the LED array. The first coating may have anti-reflective properties at the wavelength of light emitted by the LED to transfer light from the pinhole array to the substrate (i.e., the wafer). In addition, the first coating may have reflective properties at infrared wavelengths to reduce infrared heat transfer from the substrate to the LED array. Preferably, a second anti-reflective coating is also applied to the LED-facing side of the window so that the maximum light from the pinhole array passes through the window to heat the substrate (i.e., the wafer). The second coating may also have reflective properties at infrared wavelengths to reduce infrared heat transfer from the substrate to the LED array.

[0059] Alternatively, the pinhole array need not be a separate element. Instead, a layer of reflective coating may be applied over the anti-reflective coating on the LED-facing side of the window to form the pinholes in the layer of reflective coating itself. That is, the pinholes may be provided in the layer of reflective coating itself. Thus, a window having an anti-reflective coating on the top and bottom surfaces and having a layer of reflective coating providing the pinholes may be manufactured as an integral assembly, rather than manufacturing the window and the pinhole array as two separate components.

[0060] In an integrated assembly, the anti-reflective coating between the reflective coating and the window is formed by a blanket coating process (e.g., blanket deposition of a film). However, in the presence of a reflective coating underneath the anti-reflective coating, the anti-reflective coating will act as a reflective coating. The design of the anti-reflective coating is such that the anti-reflective coating nominally allows all light to pass through the pinhole without reflection. For example, a reflective coating comprising a metal layer is little affected by the coating underneath the metal layer because the skin depth of the metal is small compared to the thickness of the metal.

[0061] If a dielectric film is used to form the reflective layer, the anti-reflective coating will interact with the reflective layer, complicating the thin film design because all the dielectric layers of the anti-reflective coating and the reflective layer need to be considered. In contrast, if a metal film is used in the reflective layer, the electromagnetic field of the light cannot pass through the metal film, and the light cannot interact with the anti-reflective coating, thereby simplifying the design of the metal film. Since the metal film in the reflective layer is thick enough (i.e., much thicker than the skin depth of the metal), any material used to form the reflective layer (and the pinholes) under the metal film will not affect the function of the reflective layer and the anti-reflective coating. When the thickness of the metal film is much greater than the skin depth, the metal film makes the anti-reflective coating invisible to light. If the reflective layer is made of a dielectric film, this function cannot be achieved.

[0062] The net effect of the system is to significantly increase the optical power provided to the substrate by the LED array by reusing secondary light reflected from the substrate to heat the substrate and reducing heat conduction from the substrate to the LED array. The reflective pinhole array significantly increases the surface area of ​​the reflective surface of the pinhole array to well over 90% and reduces the optical power used to heat the electronics that power the LEDs. As a result, the system increases the usable operating temperature of optical array-based heaters in various processes for processing substrates and reduces heat sink losses.

[0063] Figure 1A An example of an optical array 10 according to the present disclosure is shown. The optical array 10 includes an LED array 12, a lens array 14, and a pinhole array 16. The LED array 12 includes a plurality of LEDs 22. The lens array 14 includes a plurality of lenses 24. The pinhole array 16 includes a plurality of pinholes 26. The LEDs 22, the lenses 24, and the pinholes 26 are vertically aligned with each other. Figure 2-7 As described, the LED 22 is disposed on a metal-based PCB, and a transparent window is disposed above the pinhole array 16. The substrate 30 is located above the optical array 10 (ie, above the window).

[0064] As shown by the arrows, the light emitted by each LED 22 is focused by the corresponding lens 24 through the corresponding pinhole 26 onto the substrate 30. Some of the light incident on the substrate 30 is absorbed by the substrate 30 and used to heat the substrate 30. Most of the light incident on the substrate 30 is usually reflected back from the bottom of the substrate 30. However, the light reflected back from the substrate 30 cannot pass through the surface of the pinhole array 16, but is reflected back to the bottom of the substrate 30, where another part of this light is again absorbed by the substrate 30, and the cycle continues. To enhance this effect, the surface of the pinhole array 16 facing the substrate 30 is coated with a reflective coating to reflect the wavelengths that are most easily absorbed by the surface. As a result, the heating efficiency of the optical array 10 is improved. These and other features of the present disclosure will be described in detail below. Reference Figure 1B-10 The optical array 10 as the optical array 150 will be described in further detail.

[0065] The remainder of this disclosure is organized as follows. In Section 1, reference is made to Figure 1B An example of a system for processing a substrate according to the present disclosure is shown and described. The system provides an example of an environment in which reference can be implemented Figure 2-10 The optical array and base shown and described. In Part 2, reference Figure 2-8 As shown and described in Figure 1B An example of an optical array used in the base of the system for heating the substrate. In Section 3, refer to Fig. 9 and Fig.10 An example of using vacuum clamping and a base containing an optical array is shown and described. Figure 1B Used in the system to heat the substrate. Part 1: Examples of Substrate Handling Systems

[0066] Figure 1B An example of a substrate processing system is shown, hereinafter referred to as system 100. System 100 can be used to process a substrate using a chemical vapor deposition (CVD), plasma enhanced CVD (PECVD), chemical enhanced plasma vapor deposition (CEPVD), atomic layer deposition (ALD), or plasma enhanced ALD (PEALD) process.

[0067] The system 100 includes a processing chamber 101 and a gas distribution system 102. The gas distribution system 102 includes a plurality of gas sources 104, a plurality of valves 106 connected to the gas sources 104, and a plurality of mass flow controllers (MFCs) 108 connected to the valves 106. The gas sources 104 supply various gases, including process gases, precursors, purge gases, inert gases, cleaning gases, etc. The MFCs 108 control the mass flow of the gases.

[0068] In some applications, the gas distribution system 102 further includes a gas delivery system 110 to supply one or more vaporized precursors via one or more valves 112. One or more gases from the MFC 108 and, when used, one or more vaporized precursors are supplied to a mixing manifold 114. The gas or gas mixture from the mixing manifold 114 is supplied to the processing chamber 101 via a valve assembly (e.g., a pulse valve manifold or PVM assembly) 116.

[0069] The process chamber 101 includes a showerhead 120 and a base 130. The showerhead 120 is connected to the top plate of the process chamber 101. The showerhead 120 receives a gas or a mixed gas from the mixing manifold 114 via a valve assembly 116. The showerhead 120 includes a base 122 and a rod 124. The rod 124 extends from the center of the base 122 and is connected to the top plate of the process chamber 101. The base 122 is cylindrical and includes a plurality of through holes (not shown) through which the gas or the mixed gas is supplied into the process chamber 101.

[0070] The susceptor 130 includes a base 132 and a stem 134. The stem 134 is generally cylindrical or Y-shaped, and a conical (i.e., the top of the Y-shape) portion is connected to the bottom of the base 132. The stem 134 extends from the base 132 and is connected to the bottom of the processing chamber 101. The base 132 is also cylindrical. During processing, a substrate 140 is disposed on the top surface of the base 132 of the susceptor 130.

[0071] Although not shown, the base 132 of the pedestal 130 may include lift pins to hold, lower, and raise the substrate 140 relative to the base 132 of the pedestal 130. Optionally, a shaft (shown and described below) extending through the rod 134 and the base 132 of the pedestal 130 may be used to hold, lower, and raise the substrate 140 relative to the base 132 of the pedestal 130. The lift pins and shaft may be used in combination to hold, lower, and raise the substrate 140 relative to the base 132 of the pedestal 130.

[0072] The substrate 140 can be clamped to the base 132 using one of a variety of clamping schemes. Examples of clamping schemes include vacuum clamping, electrostatic clamping, and mechanical clamping. Fig. 9 as well as Fig.10 An example of a pedestal 130 that includes vacuum clamping and may be used with a processing chamber 101 is shown and described.

[0073] The base 132 includes an optical array (e.g., an LED array) 150 to heat the substrate 140, as shown and described in detail below. The optical array 150 includes optical elements (e.g., LEDs), lenses, a pinhole array, and a transparent window (hereinafter referred to as Figure 2-8 The LED emits light having a wavelength preferably selected between 530 nm and 1000 nm for optical heating of the substrate 140. Through the transparent window, light from the LED, lens, and pinhole array in the optical array 150 is incident on the bottom surface of the substrate 140 to heat the substrate 140.

[0074] The substrate 140 can be heated while being held above the optical array 150 (e.g., by lift pins or by a shaft that passes through the optical array 150). The substrate 140 can be heated while it is resting on the optical array 150 and not clamped (e.g., on a table as shown and described below). The substrate 140 can be heated while it is resting on the optical array 150 by being clamped to the pedestal 130 using any of the clamping methods described above.

[0075] A purge gas (e.g., an inert gas) from one of the gas sources 104 is supplied to the stem 134 via valve 152. The purge gas flows radially over and across the optical array 150 window to clean the window and maintain the transparency of the window, as explained in detail below. An example of a pedestal 130 including an optical array 150 and a purge mechanism that can be used in a processing chamber 101 will be described below with reference to Fig. 9 and Fig.10 Provide detailed explanation.

[0076] In some applications (e.g., in PECVD and PEALD processes), plasma may be used to process a substrate 140. The system 100 includes a radio frequency (RF) system 142 for generating plasma in the processing chamber 101. The RF system 142 includes an RF generator 144 and a matching circuit 146. When the pedestal 130 is grounded, the RF system 142 supplies RF power to the showerhead 120. Alternatively, although not shown, RF power may be supplied to the pedestal 130 when the showerhead 120 is grounded. The RF power activates a gas or a gas mixture supplied through the showerhead 120 and generates plasma between the showerhead 120 and the substrate 140 disposed on the pedestal 130.

[0077] The showerhead 120 and the base 130 include temperature sensors 126, 136 to sense the temperature of the showerhead 120 and the base 130. The showerhead 120 and the base 130 include cooling channels (not shown). A coolant circulates through the cooling channels to control the temperature of the showerhead 120 and the base 130. A coolant supply source 160 can supply coolant to the cooling channels in the showerhead 120 and the base 130 via valves 162, 164.

[0078] One or more actuators, shown generally at 170, may be used to move the base 130 relative to the spray head 120. One of the actuators 170 may also be used to move and rotate a shaft (at Fig. 9 and 10 140. The purge gas for cleaning the windows of the optical array 150 is supplied through a conduit in the shaft through a valve 152, as described below with reference to Fig. 9 and 10 Displayed and described.

[0079] A vacuum pump 180 is connected to the bottom of the process chamber 101 through a valve 182. The vacuum pump 180 is used to maintain a vacuum in the process chamber 101 and to exhaust reactants and process byproducts from the process chamber 101. In addition, when vacuum chucking is used, the vacuum pump 180 is connected to the stem 134 of the pedestal 130 through a valve 184. The vacuum pump 180 maintains a vacuum through an annular volume around the shaft in the stem 134 of the pedestal 130 (as shown and described below) to clamp the substrate 140 to the pedestal 130.

[0080] In addition, the rod portion 134 includes a pipe (such as Fig. 9 and 10 1 ), electrical connections are provided through the conduits to a number of electrical components disposed in the base 132 of the pedestal 130. For example, the electrical components include the optical array 150, the temperature sensors 126, 136, and other electrical components disposed in the base 132 of the pedestal 130 (e.g., clamping electrodes when the pedestal 130 includes an electrostatic chuck).

[0081] The controller 190 controls various elements of the system 100 (e.g., the gas distribution system 102, valves, the RF system 142, the optical array 150, the coolant supply 160, the actuator 170, the vacuum pump 180, etc.). The controller 190 receives data from the temperature sensors 126, 136 and controls the temperature of the showerhead 120 and the pedestal 130 by controlling the optical array 150 and the coolant supply 160. These and other features of the system 100 are described in more detail below. Part 2: Optical Arrays

[0082] Figure 2-8 Several examples of optical arrays 150 are shown. Figure 2 A top view of the optical array 150 is shown. Figure 3 The optical array 150 is shown along Figure 2 The cross-sectional view along line AA is shown in FIG. Figures 4A-4D A first example (implementation) of an optical array 150 is shown in which the array of pinholes is implemented as a single element. Figures 5A-5D A second example (implementation) of an optical array 150 is shown in which the pinhole array is integrated with the window (ie, the window and pinhole array are a unitary component). Figure 6 A top view of the pinhole array is shown, showing that the pinholes coincide with the LEDs. Figure 7 A top view of the lens array is shown, showing the lenses coincident with the LEDs. Figure 8 The circuit block diagram of controlling the optical array 150 is shown in FIG. Figure 2-8 Describe in detail.

[0083] exist Figure 21 , the optical array 150 is generally circular and has a radius that is less than the outer diameter (OD) of the base 132 of the base 130. The radius of the optical array 150 is approximately equal to or at least equal to the radius of the substrate 140. For example, the optical array 150 includes a plurality of LEDs 200 disposed on a printed circuit board (PCB) 201. The PCB 201 can be a metal-based PCB. For example, the LEDs 200 are disposed on the PCB 201 in concentric circles 202. Although only a few concentric circles 202 are shown for illustrative purposes, the number of concentric circles 202 can vary. For example, the concentric circles 202 can be denser than those shown. Further, the number of LEDs 200 in each concentric circle 202 can be greater than the number shown. Therefore, the concentric circles 202 and the LEDs 200 are more densely disposed in the optical array 150 than shown. The concentric circles 202 and the LEDs 200 extend from an inner annular region 204 of the optical array 150 to the OD of the optical array 150. The LED 200 emits light having a wavelength preferably selected between 530 nm and 1000 nm for optical heating of the substrate 140. The light emitted by the LED 200 heats the substrate 140 optically.

[0084] The LEDs 200 may be arranged in different patterns of concentric circles 202. For example, the LEDs 200 in some concentric circles 202 may be arranged more densely than in other concentric circles 202. For example, the LEDs 200 in some portions (e.g., regions or quadrants) of the optical array 150 may be arranged more densely than in other portions of the optical array 150. Further, the size, brightness, and / or wavelength of the LEDs 200 may vary from one concentric circle 202 or portion to another. Any combination of these and additional features of the LEDs 200 may be used in the optical array 150.

[0085] The optical array 150 includes one or more driver circuits (hereinafter referred to as drivers) 206 disposed on the PCB 201. Although multiple drivers 206 are shown, a single driver 206 may be used. When used, the following description of the driver 206 applies to the single driver. The driver 206 controls the LED 200 as described in detail below. For example, the driver 206 may be disposed on the PCB 201 on the same side as the LED 200, on the opposite side of the PCB 201, or on both sides of the PCB 201. For example, one or more drivers 206 may be arranged along different radii on the PCB 201. For example, the drivers 206 may be disposed on the PCB 201 in a regular pattern or an irregular pattern (e.g., randomly). The following reference will be made to Figure 8 Driver 206 is described in further detail.

[0086] exist Figure 3In the embodiment, the optical array 150 further includes a window 210, a lens (such as a convex lens) 220, and a pinhole array 222. The lens 220 is disposed above the LED 200. For example, the lens 220 can be in the form of a lens array (such as Figure 7 As shown), it is arranged on the top of LED 200. Figure 7 As shown, the lenses 220 in the lens array are also arranged in the concentric circles 202, so that the lenses 220 are aligned or coincident with the LEDs 200. Alternatively, the lenses 220 can be integrated into the LEDs 200. That is, each LED can include a lens. In any implementation, the lenses 220 can converge (i.e., focus) the light emitted by the LEDs onto the pinholes in the pinhole array 222.

[0087] The pinhole array 222 may be implemented as a separate element, as described below with reference to Figures 4A-4D In an alternative design, the pinhole array 222 may be integrated into the window 210 as an integral component, as described below with reference to Figures 5A-5D When used as a single element, the pinhole array 222 is made of metal or a dielectric material (e.g., glass coated with a dielectric material). Figure 6 As shown, a plurality of holes are drilled in the pinhole array 222. Similar to the lens 220, holes are drilled in the pinhole array 222 in the concentric circle 202 so that the holes are also aligned or coincident with the LED 200. Therefore, the LED 200, the lens 220, and the holes in the pinhole array 222 (i.e. Figures 4A-5B The pinholes 223 shown in FIG. 1 are aligned vertically with each other. The holes in the lens 220 and the pinhole array 222 provide a straight path for light from the LED 200 to the window above the optical array 150 and through the window to the substrate 140 (as shown in FIGS. 1 , 9 and 10 ). Figures 5A-5D Give a description.

[0088] In any implementation, the window 210 comprises an optically transparent, chemically resistant, and electrically insulating material, such as quartz or sapphire. The window 210 comprises an opening in a central region that coincides with the inner annular region 204 of the optical array 150. The diameter of the opening matches the diameter of the inner annular region 204 of the optical array 150. The inner and outer peripheries of the window 210 are sealedly connected to the inner and outer peripheries of the optical array 150, respectively. Therefore, the optical array 150 and the window 210 form a sealed housing in which the LED 200, the PCB 201, the lens 220, and the pinhole array 222 are all accommodated. The heat sink 205 is attached to the bottom surface of the PCB 201. The heat sink 205 can remove heat from the PCB 201.

[0089] Figures 4A-4D A first example of an optical array 150 is shown in further detail. Figure 4AIn the embodiment, the pinhole array 222 is implemented as a separate element. The pinhole array 222 includes pinholes 223 drilled through the pinhole array 222 as described above. When the substrate of the pinhole array 222 is thin, the pinholes 223 may be straight through, such as Figure 4A as well as Figure 4B Alternatively, when the thickness of the substrate is large or large enough, the pinhole 223 may have a countersunk hole shape that takes into account the convergence angle of the focused light. Figure 4C and Figure 4D Two non-limiting examples of pinholes 223 having a countersunk shape are shown. Although the pinholes 223 shown in the figures are generally circular, cylindrical, and conical, the pinholes 223 may have other shapes.

[0090] The pinhole array 222 further includes a first coating 224, which is applied to a first side opposite to the LED 200 (i.e., the side facing the substrate 140). For example, the first coating 224 includes an optical super-reflective material (e.g., barium sulfate, a dielectric film, or a metal and a dielectric film). The first coating 224 does not cover the pinholes 223 in the pinhole array 222, but covers the remaining surface area of ​​the pinhole array 222, such as Figure 4B Optionally, a second coating 226 comprising an anti-reflective material may also be applied on a second side of the pinhole array 222 facing the LED 200. With these coatings 224, 226, the pinhole array 222 can transmit the maximum optical power from the LED 200 through the window 210 to heat the substrate 140.

[0091] In addition, the window 210 may be coated with an appropriate coating to reduce the amount of light reflected back through the window and reduce infrared heat transfer from the substrate to the LED array. Specifically, the first coating 228 is applied to the side facing the substrate 140. The first coating 228 can reflect secondary light reflected from the bottom surface of the substrate 140 back to the bottom surface of the substrate 140, as shown by the dotted arrow. Therefore, the first coating 228 improves the optical heating efficiency of the LED array.

[0092] The first coating 228 may be anti-reflective at the wavelength of light emitted by the LED 200 to transmit light from the pinhole array 222 to the substrate 140. In addition, the first coating 228 may be reflective at infrared wavelengths to reduce infrared heat transfer from the substrate 140 to the optical array 150. A second coating 230 comprising an anti-reflective material is also preferably applied on the side facing the LED 200. The second coating 230 can maximize the light from the pinhole array 222 through the window 210 to heat the substrate 140. The second coating 230 may also be reflective at infrared wavelengths to reduce infrared heat transfer from the substrate 140 to the optical array 150.

[0093] Figures 5A-5DA second example of an optical array 150 is shown that includes an alternative design of a pinhole array 222. In the alternative design, the pinhole array 222 is not a separate element. Instead, a layer of reflective coating 232 is applied over the second coating 230 on the LED-facing side of the window 210 to provide pinholes 223 in the layer of reflective coating 232. That is, the pinholes 223 are provided in the layer of the reflective coating 232 itself, such as Figure 5B As shown, to form a pinhole array 222. Figure 4A and Figure 4B Similar to the pinholes 223 in the pinhole array 222 shown and described above, the pinholes 223 in the reflective coating 232 layer are also arranged in concentric circles 202. Therefore, the window 210 having anti-reflective coatings (i.e., first and second coatings 228, 230) on the upper and lower surfaces and having the reflective coating 232 containing the pinholes 223 is manufactured as an integral component. In addition, as shown Figure 5C and Figure 5D As shown, Figure 5A and 5B The shape of the pinhole 223 shown may also be similar to that of the above reference Figure 4C and Figure 4D Pinholes 223 in pinhole array 222 are shown and described.

[0094] In the integral assembly, the anti-reflective coating (i.e., the second coating 230) between the reflective coating 232 and the window 210 is formed by a blanket coating process (e.g., blanket deposition of a thin film). However, in the case where the reflective coating 232 is present under the anti-reflective coating, the anti-reflective coating (i.e., the second coating 230) acts as a reflective coating. The design of the anti-reflective coating (i.e., the second coating 230) is such that the anti-reflective coating (i.e., the second coating 230) nominally allows all light to pass through the pinhole 223 without reflection. The reflective coating 232 including the metal film 234 is hardly affected by any other coating under the metal film 234, for example, because the skin depth of the metal in the metal film 234 is less than the thickness of the metal film 234.

[0095] Since the metal film 234 is used in the reflective coating 232, the electromagnetic field of the light cannot pass through the metal film 234, and the light cannot interact with the anti-reflective coating (i.e., the second coating 230). Since the metal film 234 in the reflective coating 232 is thick enough (i.e., the thickness is much greater than the skin depth of the metal in the metal film 234), any material used to form the reflective coating 232 (and the pinhole 223) below the metal film 234 will not affect the functions of the reflective coating 232 and the anti-reflective coating (i.e., the second coating 230). When the thickness of the metal film 234 is much greater than the skin depth of the metal in the metal film 234, the metal film 234 makes the anti-reflective coating (i.e., the second coating 230) invisible to light.

[0096] The coating material includes alternating dielectric films of low refractive index and high refractive index. Examples of coating materials for the coating include MgF2, TiO2, Ta2O5, Al2O3, ZrO2, SiO2. The thickness of the coating is selected to maximize anti-reflection or reflection performance. For example, for a single film coating, a thickness of λ / 4 can be used for anti-reflection (destructive interference) and a thickness of λ / 2 can be used for reflection (constructive interference), where λ is the wavelength of light emitted by LED 200. Other design considerations include the wavelength range and incident angle of the light.

[0097] Figure 6 A top view of the pinhole array 222 is shown. Figure 4A and Figure 4B as shown, or implemented as a separate component Figure 5A and Figure 5B As shown as a whole (i.e., integrated into a single component with the window 210), the views shown are the same. As described above, the pinholes 223 are arranged in the same concentric circles 202 as the LEDs 200. Therefore, regardless of the implementation of the pinhole array 222, the pinholes 223, the lens 220, and the LEDs 200 are vertically aligned with each other as described above.

[0098] Figure 7 A top view of the lens 220 is shown. Whether the lens 220 is in the form of a lens array (i.e., as a separate element) or is integrated into the LED 200 as described above, the view shown is the same. In addition, as described above, the lens 220 and the LED 200 are arranged in the same concentric circle 202. Therefore, regardless of which implementation scheme the lens 220 adopts, the pinhole 223, the lens 220 and the LED 200 are vertically aligned with each other as described above. Specifically, each lens 220 is vertically aligned with the corresponding LED 200, and each pinhole 223 is vertically aligned with the corresponding lens 220 and the corresponding LED 200. Therefore, the pinhole 223, the lens 220 and the LED are collinear and provide a straight path for light from the LED 200, through the lens 220, the pinhole 223 and the window 210 to the substrate 140.

[0099] Figure 8A circuit for controlling the LED 200 is shown. Each driver 206 may control a group (cluster) of LEDs 200. The controller 190 may control the LEDs 200 by controlling the driver 206. For example, after the substrate 140 is loaded into the process chamber 101, the driver 206 may supply power to the LED 200 at a first power level to preheat the substrate 140 and hold the substrate 140 above the pedestal 130 before the substrate 140 is lowered onto the pedestal 130 to deposit a film on the substrate 140. Subsequently, after the substrate 140 is preheated for a predetermined amount of time, the driver 206 may supply a smaller amount of power to the LED 200 at a second power level to heat the substrate 140 before or after the substrate 140 is lowered onto the pedestal 130. Subsequently, after the film is deposited on the substrate 140, the driver 206 may supply a smaller amount of power to the LED 200 at a third power level before the substrate 140 is lifted off the pedestal 130 and removed from the process chamber 101.

[0100] Additionally, in any of the above steps, the driver 206 may further control the power supplied to the LEDs 200. For example, each driver 206 may control the duty cycle (on / off time) of the corresponding LED 200. For example, each driver 206 may control the intensity (brightness) of the corresponding LED 200. For example, the controller 190 may control the driver 206 so that only the LEDs in selected concentric circles 202 or portions thereof are turned on or off at different times. For example, the controller 190 may control the driver 206 so that only one or more LEDs 200 in a group (e.g., a region or portion of the optical array 150) are turned on or off at different times. For example, the controller 190 may control the driver 206 so that the LEDs 200 or different portions of the LEDs 200 may output different amounts of light (i.e., optical heating power) at different times. The driver 206 may gradually or stepwise control the power supplied to the LEDs 200. Any combination of these and additional controls may be used to control the LEDs 200.

[0101] In some examples, some or all of the control provided by controller 190 can be offloaded (in the form of hardware, firmware, or a combination thereof) to one or more drivers 206. In some examples, one or more drivers 206 can control the remaining drivers 206. In addition, substrate 140 can be rotated relative to optical array 150, as described below. Controller 190 and / or driver 206 can control LEDs 200 differently before and after substrate 140 is rotated. Thus, optical heating of different portions of substrate 140 can be controlled by controlling one or more and LEDs 200.

[0102] exist Figure 1B When used in the base 130 shown, the optical array 150 and the window 210 may include the above reference Figure 2-7Any implementation of the lens 220 and pinhole 223 described above. For example, the optical array 150 may include the lens 220 in the form of a lens array or the lens 220 integrated with the LED 200. For example, the optical array 150 may include the pinhole array 222, which may be a separate element or as an integral component (i.e., integrated with the window 210). In addition, any combination of these implementations of the lens 220 and the pinhole 223 may be used.

[0103] When made of a metal material and implemented as a separate element, or when made of a reflective coating 232 including a metal film 234, the pinhole array 222 can produce a Faraday shield. Specifically, the pinhole array 222 can prevent the light emitted by the LED 200 from generating electromagnetic interference with the radio frequency system 142 used to generate plasma in the processing chamber 101. To prevent interference, when implemented in the base 130, such as Fig. 9 and Fig.10 As shown, pinhole array 222 may be grounded (ie, connected to ground potential). Part 3: Vacuum clamping

[0104] Fig. 9 and Fig.10 An example of an optical array 150 implemented in a pedestal 130 is shown when vacuum clamping is used to clamp the substrate 140 to the pedestal 130. In addition, these figures show a cleaning mechanism for keeping the window 210 clean and a rotation mechanism for rotating the substrate 140 relative to the optical array 150 in addition to the vacuum clamping. Fig. 9 An example of vacuum clamping is shown. Fig.10 The window 210 is shown being swept as the substrate 140 is lifted and rotated from the pedestal 130. Alternatively, although not shown, any other clamping schemes (e.g., electrostatic clamping and mechanical clamping) may be used to clamp the substrate 140 to the pedestal 130 containing the optical array 150.

[0105] exist Fig. 9 , the optical array 150 is disposed together with the window 210 in an annular cavity 138 formed in the base 132 of the pedestal 130. The annular cavity 138 is formed by removing material from the top surface of the base 132 of the pedestal 130 outside the central area of ​​the top surface of the base 132 of the pedestal 130. The depth of the annular cavity 138 is equal to the height of the optical array 150 and the window 210. The optical array 150 is coplanar with the base 132 of the pedestal 130. Therefore, the top surface of the window 210 is flush with the top edge 139 of the base 132 of the pedestal 130. During processing, the substrate 140 is disposed on the top surface of the window 210. The following vacuum clamping is used to clamp the substrate 140 to the pedestal 130.

[0106] The stem 134 of the base 130 includes an axis 250. The axis 250 extends through the center of the stem 134 and the base 132 of the base 130. The axis 250 includes a T-shaped end (i.e., a horizontal portion forming the top of the T-shape) and a distal end (i.e., a vertical portion forming the bottom of the T-shape). The T-shaped end of the axis 250 extends through the inner annular region 204 of the optical array 150, the opening of the window 210, and the central region of the top surface of the base 132 of the base 130. The top surface of the T-shaped end of the axis 250 is flush with the top surface of the window 210. The bottom surface of the T-shaped end of the axis 250 is flush with and placed on the central region of the top surface of the base 132 of the base 130. The diameter of the T-shaped end of the axis 250 is slightly smaller than the diameter of the inner annular region 204 of the optical array 150 and the opening of the window 210.

[0107] The distal end of the shaft 250 extends through the bottom end of the stem 134 of the pedestal 130. The distal end of the shaft 250 extends through the vacuum pump 180 attached to the bottom end of the stem 134 of the pedestal 130. One of the actuators 170 is attached to the distal end of the shaft 250. The actuator 170 can move the shaft 250 through the vacuum pump 180 and through the stem 134 and base 132 of the pedestal 130 to raise and lower the substrate 140. Fig.10 , when raised, the substrate 140 is held by the T-shaped end of the shaft 250. The actuator 170 can also rotate the shaft 250 to rotate the substrate 140 relative to the optical array 150 when raised.

[0108] The conduit 252 is drilled through the shaft 250. The conduit 252 is coaxial with the shaft 250. The conduit 252 extends through the shaft 250 to the T-shaped end of the shaft 250. The shaft 250 includes a plurality of holes 254 drilled radially through the T-shaped end of the shaft 250. Near the T-shaped end of the shaft 250, one end of the conduit 252 is connected to the plurality of holes 254. The distal end of the conduit 252 extends beyond the distal end of the shaft 250. The distal end of the conduit 252 passes through the valve 152 (shown in FIG. Figure 1B ) is connected to one of the gas sources 104. Figure 3 In B, as shaft 250 raises substrate 140, a purge gas is supplied via conduit 252. The purge gas flows through conduit 252, exits through aperture 254, and flows radially through and over window 210 in the direction of the arrows shown to clean window 210.

[0109] The stem 134 of the base 130 further includes a conduit 256 through which electrical connectors (e.g., insulated wires or conductors) that connect electrical components in the base 132 of the base 130 are routed. The distal end of the electrical connector is connected to the controller 190 (shown in FIG. Figure 1B). The conduit 256 is drilled through and extends through the stem 134 of the base 130. The conduit 256 extends into the base 132 of the base 130 to the inner annular region 204 of the optical array 150. The conduits 252, 256 are coaxial with the shaft 250. The diameter of the conduit 256 is greater than the diameter of the shaft 250.

[0110] The stem 134 of the base 130 further includes a conduit 258. The diameter of the conduit 258 is greater than the diameter of the conduit 256 and less than the diameter of the stem 134 of the base 130. The conduits 258, 252, 256 and the shaft 250 are coaxial. A first end of the conduit 258 is in fluid communication with the vacuum pump 180. A second end of the conduit 258 extends through the stem 134 of the base 130 and into the base 132 of the base 130. The second end of the conduit 258 extends into the base 132 of the base 130 to a point below the optical array 150. At the second end, the conduit 258 is connected to a first set of conduits (or channels) 260 drilled radially through the base 132 of the base 130 below the optical array 150. The conduits 260 extend to the OD of the base 132 of the base 130. The conduits 260 are in fluid communication with the conduits 258.

[0111] A second set of conduits 262 is bored through the base 132 of the pedestal 130 perpendicular to the first set of conduits 260. Conduits 262 extend from conduits 260 through the optical array 150 and the window 210. Conduits 262 are in fluid communication with conduits 260 and 258. Thus, when the substrate 140 is to be clamped to the pedestal 130, the controller 190 activates the vacuum pump 180 and opens the valve 184 (shown in FIG. Figure 1B ) to create a vacuum in the conduits 258, 260, 262. The vacuum in the conduits 258, 260, 262 causes the substrate 140 to be clamped to the pedestal 130. After the substrate is clamped to the pedestal 130, the controller 190 controls the optical array 150 to heat the substrate 140 as described above, depending on the process to be performed on the substrate 140.

[0112] exist Fig.10 In the embodiment of the present invention, when the substrate 140 needs to be rotated relative to the optical array 150, the controller 190 controls the vacuum pump 180 and the valve 184 so that the vacuum in the pipes 258, 260, 262 is reduced. The vacuum in the pipes 258, 260, 262 is sufficiently reduced to allow the shaft 250 to lift the substrate 140. The controller 190 activates the actuator 170 so that the shaft 250 lifts and rotates the substrate 140. In some applications, the substrate 140 can be lifted and kept stationary, and the base 130 can be rotated to rotate the optical array 150 relative to the substrate 140.

[0113] When the substrate 140 is raised, the controller 190 opens the valve 152 (shown in FIG. Figure 1B252 and through holes 254. The purge gas flows through the conduit 252 and holes 254, radially over and across the window 210, such as Fig.10 . The purge gas flowing over and across window 210 removes any material that may be deposited on window 210. Controller 190 controls valves 152 and 184 (shown in FIG. Figure 1B ), so that the vacuum pump 180 continues to pump the pipes 258, 260, 262 and the processing chamber 101 (shown in Figure 1B Thus, the material removed from the window 210 is discharged out of the processing chamber 101.

[0114] Subsequently, the actuator 170 lowers the shaft 250 to place the substrate 140 again on the pedestal 130. The vacuum then clamps the substrate 140, as described above. The optical array 150 again heats the substrate 140, as described above. This process is repeated as necessary until processing of the substrate 140 is complete.

[0115] The foregoing description is merely illustrative in nature and is in no way intended to limit the present disclosure, its application or use. The broad teachings of the present disclosure can be implemented in various forms. Therefore, although the present disclosure includes specific examples, the true scope of the present disclosure should not be so limited, because other modifications will become apparent upon studying the drawings, description and appended claims.

[0116] It should be understood that one or more steps in the method may be performed in different orders (or simultaneously) without changing the principles of the present disclosure. In addition, although each embodiment is described above as having certain features, any one or more of those features described with respect to any embodiment of the present disclosure may be implemented in the features of any other embodiment and / or combined with the features of any other embodiment, even if the combination is not explicitly described. In other words, the described embodiments are not mutually exclusive, and the permutation of one or more embodiments with respect to each other remains within the scope of the present disclosure.

[0117] Various terms are used to describe the spatial and functional relationships between elements (e.g., between modules, between circuit elements, between semiconductor layers, etc.), including "connected," "engaged," "coupled," "adjacent," "next to," "on top of," "above," "below," and "disposed." Unless the relationship between a first and a second element is explicitly described as "direct," when such a relationship is described in the above disclosure, the relationship can be a direct relationship, in which there are no other intervening elements between the first and second elements, but can also be an indirect relationship, in which there are one or more intervening elements (spatially or functionally) between the first and second elements. As used herein, the phrase "at least one of A, B, and C" should be interpreted to mean a logical (A or B or C), using a non-exclusive logical OR, and should not be interpreted to mean "at least one of A, at least one of B, and at least one of C."

[0118] In some implementations, the controller is part of a system, which may be part of the above examples. Such a system may include a semiconductor processing device, which includes one or more processing tools, one or more chambers, one or more platforms for processing, and / or specific processing components (wafer pedestals, gas flow systems, etc.). These systems may be integrated with electronics for controlling their operation before, during, and after processing of semiconductor wafers or substrates. The electronics may be referred to as a "controller," which may control various components or subcomponents of one or more systems.

[0119] Depending on the processing requirements and / or system type, the controller can be programmed to control any of the processes disclosed herein, including the delivery of process gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, position and operation settings, wafer transfer into and out of tools and other transfer tools and / or load locks connected or docked with a particular system.

[0120] In general, a controller may be defined as an electronic device having various integrated circuits, logic, memory, and / or software that receive instructions, issue instructions, control operations, enable cleaning operations, enable endpoint measurements, etc. The integrated circuits may include chips in the form of firmware that store program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and / or one or more microprocessors or microcontrollers that execute program instructions (e.g., software).

[0121] Program instructions may be instructions sent to a controller in the form of various individual settings (or program files) that define operating parameters for performing a particular process on or for a semiconductor wafer or system. In some embodiments, the operating parameters may be part of a recipe defined by a process engineer to accomplish one or more processing steps during the fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or dies of a wafer.

[0122] In some implementations, the controller can be part of or coupled to a computer that is integrated with the system, coupled to the system, otherwise networked to the system, or a combination thereof. For example, the controller can be in the "cloud" or all or part of a wafer fab host system that can allow remote access to wafer processing. The computer can enable remote access to the system to monitor the current progress of manufacturing operations, check the history of past manufacturing operations, check trends or performance standards of multiple manufacturing operations, to change parameters of a current process, set processing steps to follow a current process, or start a new process.

[0123] In some examples, a remote computer (e.g., a server) can provide a process recipe to the system over a network (which can include a local network or the Internet). The remote computer can include a user interface that enables input or programming of parameters and / or settings, which are then sent from the remote computer to the system. In some examples, the controller receives instructions in the form of data that specify parameters for each process step to be performed during one or more operations. It should be understood that the parameters can be specific to the type of process to be performed and the type of tool that the controller is configured to interface with or control.

[0124] Thus, as described above, the controller may be distributed, for example, by including one or more discrete controllers networked together and working toward a common purpose (e.g., processing and control as described herein). An example of a distributed controller for such a purpose is one or more integrated circuits on a chamber that communicate with one or more integrated circuits remotely (e.g., at a platform level or as part of a remote computer), which combine to control processing on the chamber.

[0125] Exemplary systems may include, but are not limited to, plasma etching chambers or modules, deposition chambers or modules, spin rinse chambers or modules, metal plating chambers or modules, cleaning chambers or modules, chamfer edge etching chambers or modules, physical vapor deposition (PVD) chambers or modules, chemical vapor deposition (CVD) chambers or modules, atomic layer deposition (ALD) chambers or modules, atomic layer etching (ALE) chambers or modules, ion implantation chambers or modules, track chambers or modules, and any other semiconductor processing system that may be associated with or used in the manufacture and / or preparation of semiconductor wafers.

[0126] As described above, depending on one or more processing steps to be performed by the tool, the controller can communicate with one or more other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout the factory, a host computer, another controller, or tools used in material transport to transport wafer containers to and from tool locations and / or load ports in a semiconductor manufacturing facility.

Claims

1. An optical array disposed in a base, the base being configured to deposit material on a substrate, the optical array comprising: a plurality of optical elements disposed on a printed circuit board (PCB), wherein the optical elements are configured to emit light; a window comprising an optically transparent material covering the optical element disposed on the printed circuit board; and An array of pinholes is disposed between the optical element and the window, wherein the pinholes are vertically aligned with the optical element to direct the light emitted by the optical element through the window to heat the substrate.

2. The optical array according to claim 1, further comprising a lens, wherein the lens is disposed between the optical element and the pinhole, and the lens is aligned with the optical element and the pinhole to converge the light from the optical element to the pinhole. 3 . The optical array of claim 1 , wherein the optical element comprises a lens to focus the light from the optical element to the pinhole.

4. The optical array of claim 1, wherein the array of pinholes comprises a metal or a dielectric material.

5. The optical array of claim 1, wherein the array of pinholes is integrated with the window in an integral assembly.

6. The optical array of claim 1, wherein the array of pinholes is coated with a reflective material on a side facing the window, the reflective material not covering the pinholes.

7. The optical array of claim 1, wherein the array of pinholes is coated with an anti-reflective material on a side facing the optical element.

8. The optical array of claim 1, wherein the window: A side facing the optical element is coated with an anti-reflective material; and A material having anti-reflective properties for the wavelength of the light emitted by the optical element and reflective properties for infrared wavelengths is coated on the side facing the substrate.

9. The optical array according to claim 1, wherein the window is coated with an anti-reflection material on a side facing the optical element, the window further comprises a reflective material coated on the anti-reflection material, the reflective material comprising a metal film and the pinhole.

10. The optical array of claim 1, wherein the optical elements comprise light emitting diodes.

11. The optical array of claim 1, wherein the optical elements comprise light emitting diodes configured to emit light having a wavelength between 530 nm and 1000 nm.

12. The optical array of claim 1, wherein the optical array is circular, and wherein the optical elements and the pinholes are arranged in concentric circles from an inner diameter to an outer diameter of the optical array.

13. The optical array according to claim 1, further comprising: a lens disposed between the optical element and the pinhole; in, The optical array is circular; wherein the optical element, the pinhole and the lens are arranged in concentric circles from the inner diameter to the outer diameter of the optical array; and The lens is aligned with the optical element and the pinhole to converge the light from the optical element to the pinhole.

14. The optical array of claim 1, wherein the pinholes are cylindrical.

15. The optical array according to claim 1, wherein the pinhole is conical in shape with its base facing the optical element.

16. The optical array of claim 1, wherein the PCB further comprises one or more driver circuits configured to control power supplied to the optical elements.

17. The optical array of claim 1, wherein the PCB further comprises one or more driver circuits configured to control operation of selected ones of the optical elements.

18. An optical array according to claim 1, wherein the PCB further comprises a driver circuit, wherein the driver circuit is configured to control the light emitted by the optical element, wherein the driver circuit is disposed on the same side of the PCB as the optical element, on the opposite side of the PCB, or on both sides of the PCB.

19. The optical array of claim 1, further comprising a heat sink attached to a side of the PCB opposite to a side of the PCB on which the optical elements are disposed.

20. The optical array of claim 1, wherein the window is sealingly attached to the PCB.

21. A system comprising: The optical array according to claim 1; and The base comprises: a shaft; and a base portion mounted to the stem portion, Wherein the optical array is disposed in the base of the base.

22. The system of claim 21, wherein the base and the optical array are coplanar.

23. The system of claim 21, wherein the base and the optical array are circular, and wherein an outer diameter of the optical array is less than or equal to an outer diameter of the base.

24. The system of claim 21, wherein the base and the optical array are circular, and wherein an outer diameter of the array is less than or equal to an outer diameter of the substrate.

25. The system of claim 21, wherein the base and the optical array are circular, and wherein an outer diameter of the array is at least equal to an outer diameter of the substrate.

26. The system of claim 21, wherein the base further comprises: an axis disposed through the center of the stem, the base, and the array; as well as An actuator is coupled to the shaft and configured to move the substrate relative to the susceptor.

27. The system of claim 21, wherein the base further comprises: an axis disposed through the center of the stem, the base, and the array; as well as An actuator is coupled to the shaft and is configured to move the substrate vertically relative to a plane in which the base lies.

28. The system of claim 21, wherein the base further comprises: an axis disposed through the center of the stem, the base, and the array; as well as An actuator is coupled to the shaft and configured to rotate the substrate relative to the base.

29. The system of claim 21, wherein the base further comprises: a shaft disposed through the stem, the base, and the center of the array, wherein the shaft includes a conduit for receiving a gas and a plurality of holes in fluid communication with the conduit near a first end of the shaft proximate the array; as well as an actuator coupled to the second end of the shaft and configured to move the substrate vertically relative to a plane in which the base lies, Wherein when the shaft is raised above the array, the plurality of holes supply the gas radially above the window.

30. The system of claim 21, wherein the array of pinholes is connected to ground potential.

Images