Automatic control method and system for production line gluing machine

Abstract

The invention relates to the field of gluing control, and discloses an automatic control method and system for an assembly line gluing machine, and the method comprises the steps: controlling a gluing clamp to fix a kitchenware plate when the kitchenware plate moves to a gluing position, obtaining a plate image of the kitchenware plate, and determining a gluing region of the kitchenware plate according to the plate image; and gluing is conducted according to the gluing area, a glue solution image of the gluing area after gluing is obtained, a gluing length adjusting parameter, a gluing flow adjusting parameter and a gluing height adjusting parameter are determined according to the glue solution image, and parameters of a gluing head are adjusted according to the gluing length adjusting parameter, the gluing flow adjusting parameter and the gluing height adjusting parameter. When the glue solution length value of the glue solution outline is too large or too small, the gluing length is adjusted to be a proper value through the gluing length adjusting parameters. According to the device, the gluing amount and the gluing position on the kitchenware panel can be accurately controlled.

Description

Technical Field

[0001] The present application relates to the technical field of glue coating control, and more specifically, to an automatic control method and system for an assembly line glue coating machine. Background Art

[0002] In the manufacturing of modern kitchen equipment, the connection between kitchenware panels (such as countertops, cabinet panels, etc.) and other kitchenware structures (such as brackets, back panels, etc.) is a key step to ensure the structural stability of the product. Traditional kitchen equipment is generally connected by mechanical fixing (such as screws, bolts) and welding. Although the general mechanical fixing method can provide strong connection strength, the mechanical fixing connection method is complex to install, has an unsightly appearance, and is prone to rust.

[0003] As an efficient and reliable connection method, connecting kitchenware boards with glue has gradually become an important way to connect boards in kitchenware manufacturing. Gluing technology achieves bonding between the board and other structures by applying or dotting an appropriate amount of glue on the joints between the board and other structures. When applying glue, since the size of kitchenware boards is generally large, the amount of glue applied on the kitchenware panel is large, and kitchenware boards often need to be glued at multiple locations. It is difficult to apply glue evenly on the kitchenware boards by manual gluing, resulting in poor gluing effect on the kitchenware boards. At the same time, the existing automatic glue control method is difficult to meet the requirements of accurately controlling the amount and position of glue on the kitchenware panel. Summary of the invention

[0004] The purpose of this application is to provide an automatic control method and system for an assembly line glue coating machine, which solves the technical problem of difficulty in accurately controlling the amount and position of glue coating on kitchenware panels, and achieves the technical effect of accurately controlling the amount and position of glue coating on kitchenware panels.

[0005] An automatic control method for an assembly line gluing machine provided in an embodiment of the present application comprises: when a kitchen plate moves to a gluing position, controlling a gluing fixture to fix the kitchen plate, obtaining a plate image of the kitchen plate, and determining a gluing area of ​​the kitchen plate according to the plate image; gluing according to the gluing area, and obtaining a glue liquid image of the gluing area after gluing, determining a glue length adjustment parameter, a glue flow adjustment parameter, and a glue height adjustment parameter according to the glue liquid image, and adjusting parameters of a gluing head according to the glue length adjustment parameter, the glue flow adjustment parameter, and the glue height adjustment parameter.

[0006] In a possible implementation, a glue coating length adjustment parameter, a glue coating flow adjustment parameter and a glue coating height adjustment parameter are determined according to a glue image, including: determining a glue contour of a glue coating area, determining a glue length value of the glue contour, and determining a width sequence value of the glue in the length direction according to the glue contour; determining a maximum width value and a minimum width value of the width sequence value, and determining a width difference between the maximum width value and the minimum width value in the width sequence value as a width fluctuation value; when the glue length value is greater than or equal to a preset glue length value, determining a glue coating length adjustment parameter to reduce a preset glue coating length, and when the glue length value is less than a preset glue length value, determining a glue coating length adjustment parameter to increase a preset glue coating length; when the minimum width value is less than a preset width value, determining a glue coating flow adjustment parameter to increase a preset glue coating flow; and when the width fluctuation value is greater than a preset width fluctuation value, determining a glue coating height adjustment parameter to reduce a preset glue coating height value.

[0007] In another possible implementation, the method also includes: obtaining a first glue contour within a first length range at the first end of the glue contour and a second glue contour within a second length range at the second end of the glue contour; determining a first area corresponding to the first glue contour, and determining a second area of ​​the second glue contour, and when the difference between the first area and the second area is greater than a preset area difference, prompting an adjustment to the stability of the glue coating flow rate.

[0008] In another possible implementation, the method also includes: obtaining the sequential glue pressure value of the glue coating head during the gluing process, and when the difference between the first area and the second area is greater than the preset area difference, and the maximum pressure value of the sequential glue pressure value is greater than the preset maximum pressure value, prompting to replace the glue in the glue coating head.

[0009] In another possible implementation, the method also includes: determining a glue pressure change variance value based on a time-series glue pressure value, and determining a glue width change variance value based on a width sequence value of the glue width; when the glue pressure change variance value is greater than a preset glue pressure change variance value, and the glue width change variance value is greater than a preset glue width change variance value, a prompt is given to clean the glue outlet of the glue coating head.

[0010] In another possible implementation, the method further includes: determining a first boundary of the kitchen board to which the first end of the glue contour is close, and determining a first boundary distance from the first end of the glue contour to the first boundary; determining a second boundary of the kitchen board to which the second end of the glue contour is close, and determining a second boundary distance from the second end of the glue contour to the second boundary; when the first boundary distance or the second boundary distance is greater than or equal to a preset boundary distance, determining a glue coating length adjustment parameter to increase the preset glue coating length; when the first boundary distance or the second boundary distance is less than the preset boundary distance, determining a glue coating length adjustment parameter to reduce the preset glue coating length; when the difference between the first boundary distance or the second boundary distance is greater than or equal to the preset boundary distance difference, prompting to clean the glue outlet of the glue coating head.

[0011] In another possible implementation, a first glue contour in which the first end of the glue contour is within a first length range and a second glue contour in which the second end of the glue contour is within a second length range are obtained, including: the first end of the glue contour is an end close to the starting glue dispensing position, the second end of the glue contour is an end close to the ending glue dispensing position, the first length range is greater than the second length range, and the first glue contour in which the first end of the glue contour is within the first length range and the second glue contour in which the second end of the glue contour is within the second length range are obtained.

[0012] An embodiment of the present application also provides an automatic control system for an assembly line glue coating machine, comprising a unit for executing any of the methods described above.

[0013] An embodiment of the present application also provides an automatic control system for an assembly line glue coating machine, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements any of the methods described above when executing the computer program.

[0014] An embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method described in any one of the above items is implemented.

[0015] An embodiment of the present application also provides a computer program product, including a computer program, which implements the steps of any of the methods described above when executed by a processor.

[0016] Compared with the prior art, the embodiments of the present invention have the following beneficial effects:

[0017] The embodiment of the present application provides an automatic control method for an assembly line gluing machine, the method comprising: when a kitchen plate moves to a gluing position, controlling a gluing fixture to fix the kitchen plate, obtaining a plate image of the kitchen plate, and determining a gluing area of ​​the kitchen plate according to the plate image; gluing according to the gluing area, and obtaining a glue liquid image of the gluing area after gluing, determining a gluing length adjustment parameter, a gluing flow adjustment parameter, and a gluing height adjustment parameter according to the glue liquid image, and adjusting the parameters of the gluing head according to the gluing length adjustment parameter, the gluing flow adjustment parameter, and the gluing height adjustment parameter. The method in the embodiment of the present application can control the gluing parameters according to the gluing effect, improves the effect of applying a large amount of glue on the kitchen plate, and ensures the production effect of the kitchen plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0019] Figure 1 A schematic flow chart of an automatic control method for an assembly line glue coating machine provided in an embodiment of the present application;

[0020] Figure 2 A schematic diagram of a working scenario of an automatic control method for an assembly line glue coating machine provided in an embodiment of the present application;

[0021] Figure 3 It is a schematic diagram of the glue coating area of ​​the kitchenware board in the embodiment of the present application;

[0022] Figure 4 A schematic diagram of the working process of an automatic control method for an assembly line glue coating machine provided in an embodiment of the present application;

[0023] Figure 5 This is a schematic diagram of the kitchenware board after gluing is completed in the embodiment of the present application;

[0024] Figure 6 This is a schematic diagram of the glue liquid profile obtained by applying glue in the embodiment of the present application;

[0025] Figure 7 A schematic diagram of the logical structure of an automatic control system for an assembly line glue coating machine provided in an embodiment of the present application;

[0026] Figure 8 A schematic diagram of the physical structure of an automatic control system for an assembly line gluing machine provided in an embodiment of the present application. DETAILED DESCRIPTION

[0027] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.

[0028] It should also be understood that the term “and / or” used in the specification and appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0029] As used in the specification and appended claims of this application, the term "if" can be interpreted as "when" or "uponce" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "uponce it is determined" or "in response to determining" or "uponce [described condition or event] is detected" or "in response to detecting [described condition or event]", depending on the context.

[0030] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0031] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0032] The existing automatic glue control method is difficult to meet the requirements of accurately controlling the glue amount and glue position on the kitchen panel.

[0033] Based on the above reasons, the embodiment of the present application provides an automatic control method for an assembly line gluing machine, and the method includes: when the kitchenware plate moves to the gluing position, controlling the gluing fixture to fix the kitchenware plate, and obtaining the plate image of the kitchenware plate, and determining the gluing area of ​​the kitchenware plate according to the plate image; gluing according to the gluing area, and obtaining the glue liquid image of the gluing area after gluing, determining the gluing length adjustment parameter, the gluing flow adjustment parameter and the gluing height adjustment parameter according to the glue liquid image, and adjusting the parameters of the gluing head according to the gluing length adjustment parameter, the gluing flow adjustment parameter and the gluing height adjustment parameter. The method in the embodiment of the present application can control the gluing parameters according to the gluing effect, improves the effect of applying a large amount of glue on the kitchenware plate, and ensures the production effect of the kitchenware plate.

[0034] In some scenarios, an automatic control method for an assembly line gluing machine according to an embodiment of the present application can be applied to the production of kitchenware, and can efficiently and stably connect kitchenware panels and the fixed structure of the kitchenware, thereby improving the connection effect and aesthetics of the kitchenware panels.

[0035] The following is a detailed description of an automatic control method for an assembly line glue coating machine provided in an embodiment of the present application with reference to specific examples.

[0036] Figure 1 A flow chart of an automatic control method for an assembly line glue coating machine provided in an embodiment of the present application is shown as follows: Figure 1 As shown, the method includes S110 to S120, and S110 to S120 are described in detail below.

[0037] S110, when the kitchen board moves to the gluing position, the gluing fixture is controlled to fix the kitchen board, and a board image of the kitchen board is acquired, and a gluing area of ​​the kitchen board is determined according to the board image.

[0038] In the embodiment of the present application, when gluing the kitchen utensil plates, the kitchen utensil plates can be conveyed through a conveyor line, and the kitchen utensil plates can be sequentially glued on the conveyor line.

[0039] In the embodiment of the present application, when gluing the kitchen utensil plates through the conveyor line, in order to ensure the gluing efficiency and gluing accuracy of the kitchen utensil plates, it is necessary to quickly adjust the gluing parameters through the method in the embodiment of the present application to ensure the gluing effect of the conveyor line on the kitchen utensil plates.

[0040] Exemplarily, the kitchen utensil board may be a glass board. When the method accurately performs the gluing process, the efficiency of connecting and fixing the glass kitchen utensil board can be ensured, and the aesthetics of the kitchen utensil board after connection and fixing can be ensured.

[0041] Figure 2A schematic diagram of a working scenario of an automatic control method for an assembly line glue coating machine provided in an embodiment of the present application is shown as follows: Figure 2 As shown, in the embodiment of the present application, when gluing the kitchen board 1, the kitchen board 1 can be moved to the gluing position, the gluing clamp 11 is controlled to fix the kitchen board, and the board image of the kitchen board 1 is obtained, and the gluing area of ​​the kitchen board 1 is determined according to the board image, and then the gluing head 12 can be used to apply glue on the kitchen board 1.

[0042] When determining the glue coating area, the glue coating area of ​​the kitchenware board 1 can be determined according to the board image through an image recognition model.

[0043] Figure 3 Schematic diagram of the glue coating area of ​​the kitchenware board in the embodiment of the present application. Figure 3 As shown, the glue-coated area on the kitchen utensil board 1 may be two glue-coated areas 1 a.

[0044] Figure 4 A schematic diagram of the working process of an automatic control method for an assembly line glue coating machine provided in an embodiment of the present application is shown in FIG. Figure 4 As shown, the kitchen board 1 can be positioned by the gluing fixture 11, and the board image of the kitchen board 1 can be detected by the image acquisition component 13 on the gluing head 12. The image acquisition component 13 can be electrically connected to the image recognition component, and the image recognition component is used to identify the gluing area 1a on the board image.

[0045] Exemplarily, the glue coating head 12 can be driven by the lateral driving assembly 14 to move laterally and longitudinally, and glue coating can be performed by the movement of the glue coating head 12 .

[0046] Exemplarily, the gluing area 1a on the kitchen board 1 can be controlled and adjusted by programming a preset gluing program. The preset gluing program can be used to precisely control the gluing area 1a of the kitchen board 1, thereby achieving gluing controlled by the preset gluing program.

[0047] Illustratively, a sensing area for detecting kitchen boards 1 can be provided on the conveyor line, and a photoelectric sensor for detecting kitchen boards is provided on the sensing area. When it is detected that the kitchen boards 1 enter the sensing area, the kitchen boards 1 can be clamped and positioned by the gluing clamps 11 provided on both sides of the conveyor line, and then the kitchen boards 1 can be glued by the gluing equipment.

[0048] After the glue is applied to the kitchenware board 1, the glue-applying clamps 11 on both sides of the conveyor line stop clamping and positioning the kitchenware board 1, and the kitchenware board 1 can continue to be conveyed by the conveyor belt for subsequent processing.

[0049] S120, apply glue according to the glue application area, and obtain a glue liquid image of the glue application area after glue application, determine glue application length adjustment parameters, glue application flow adjustment parameters and glue application height adjustment parameters according to the glue liquid image, and adjust the parameters of the glue application head according to the glue application length adjustment parameters, glue application flow adjustment parameters and glue application height adjustment parameters.

[0050] After determining the glue coating area, glue can be applied according to the glue coating area, and a glue liquid image of the glue coating area after glue coating can be obtained. The glue liquid image can also be collected by the image acquisition component 13, and then the glue coating quality can be detected based on the glue liquid image, thereby improving the glue coating effect of the glue liquid.

[0051] After obtaining the glue liquid image, the glue coating length adjustment parameter, the glue coating flow adjustment parameter and the glue coating height adjustment parameter can be determined according to the glue liquid image. The glue coating length adjustment parameter is used to adjust the glue coating length of the glue coating head, the glue coating flow adjustment parameter is used to adjust the flow of the glue liquid of the glue coating head, and the glue coating height adjustment parameter is used to adjust the height of the glue coating head when coating glue. The parameters of the glue coating head are adjusted according to the glue coating length adjustment parameter, the glue coating flow adjustment parameter and the glue coating height adjustment parameter to achieve the influence on the glue coating parameters.

[0052] Figure 5 Schematic diagram of the kitchenware board after gluing is completed in the embodiment of the present application. Figure 5 As shown, after the kitchenware board 1 is glued, two glue strips are formed in two glued areas 1a.

[0053] The beneficial effect of the above-mentioned implementation method is that by obtaining the glue liquid image of the glue coating area after gluing, the glue coating length adjustment parameter, the glue coating flow adjustment parameter and the glue coating height adjustment parameter are determined according to the glue liquid image, and the parameters of the glue coating head are adjusted according to the glue coating length adjustment parameter, the glue coating flow adjustment parameter and the glue coating height adjustment parameter, thereby improving the control effect of gluing kitchen boards on the production line, and greatly improving the gluing accuracy and production aesthetics of the kitchen boards.

[0054] The beneficial effect of the above implementation method is that by acquiring the glue liquid image of the glued area in real time after the glue is applied, the glue control effect on the kitchen utensil board can be quickly improved, thereby improving the glue application effect on the kitchen utensil board.

[0055] In some implementations, in the above S120, the glue coating length adjustment parameter, the glue coating flow adjustment parameter and the glue coating height adjustment parameter are determined according to the glue liquid image, including S121 to S122, and S121 to S122 are specifically described below.

[0056] S121, determine the glue contour of the glue coating area, determine the glue length value of the glue contour, and determine the width sequence value of the glue in the length direction according to the glue contour. Determine the maximum width value and the minimum width value of the width sequence value, and determine the width difference between the maximum width value and the minimum width value in the width sequence value as the width fluctuation value.

[0057] When adjusting the glue coating parameters, the glue contour of the glue coating area can be determined first. The glue contour is the shape of the glue formed by the glue coating. Then, the glue coating parameters can be adjusted according to the glue contour.

[0058] After determining the glue profile, the glue length value of the glue profile can be determined. The glue length value reflects the length control characteristics of the glue coating head during glue coating.

[0059] After determining the glue liquid profile, the width sequence value of the glue liquid in the length direction can be determined according to the glue liquid profile. The width sequence value characterizes the width change characteristics of the glue liquid in the length direction of the glue liquid profile. The width sequence value reflects the flow control characteristics of the glue liquid amount by the glue coating head during glue coating.

[0060] After determining the glue profile, the maximum width value and the minimum width value of the width sequence value may be further determined, and the width difference between the maximum width value and the minimum width value in the width sequence value may be determined as the width fluctuation value.

[0061] Figure 6 Schematic diagram of the glue liquid profile obtained by glue coating in the embodiment of the present application, as shown in Figure 6 As shown, the length of the glue contour may be L, and the width sequence value may be a sequence consisting of widths d at different positions along the length direction.

[0062] S122. When the glue length value is greater than or equal to the preset glue length value, the glue coating length adjustment parameter is determined to reduce the preset glue coating length. When the glue length value is less than the preset glue length value, the glue coating length adjustment parameter is determined to increase the preset glue coating length. When the minimum width value is less than the preset width value, the glue coating flow adjustment parameter is determined to increase the preset glue coating flow. When the width fluctuation value is greater than the preset width fluctuation value, the glue coating height adjustment parameter is determined to reduce the preset glue coating height value.

[0063] When adjusting the glue coating parameters, when the glue liquid length value is greater than or equal to the preset glue liquid length value, it means that the glue coating length of the glue coating head is too long. In order to adjust the glue coating length to a suitable value, the glue coating length adjustment parameter can be determined to reduce the preset glue coating length to appropriately reduce the glue coating length; when the glue liquid length value is less than the preset glue liquid length value, the glue coating length adjustment parameter can be determined to increase the preset glue coating length to appropriately increase the glue coating length;

[0064] Exemplarily, the preset glue coating length may be 1 mm, 3 mm or 5 mm.

[0065] When adjusting the gluing parameters, when the minimum width value is less than the preset width value, it means that the gluing effect at the narrowest part of the glue liquid contour obtained under the current gluing parameters is poor. At this time, the gluing flow rate can be appropriately increased to ensure that the narrowest part of the glue liquid contour meets the quality requirements, and then the glue flow rate adjustment parameter can be determined to increase the glue flow rate by the preset glue flow rate.

[0066] Exemplarily, when the glue coating head is coating glue, the glue coating flow rate may be a constant value, and the preset glue coating flow rate may be 1% to 5% of the current glue coating flow rate.

[0067] When adjusting the gluing parameters, when the width fluctuation value is greater than the preset width fluctuation value, it means that the width fluctuation amplitude of the gluing profile under the current gluing flow rate is large. At this time, it means that the height from the gluing head to the kitchen board is too large, resulting in the glue falling distance being too long, causing the width fluctuation amplitude of the glue profile to be too large. At this time, in order to reduce the width fluctuation amplitude of the glue profile, the gluing height adjustment parameter can be determined to reduce the gluing height by the preset gluing height value to improve the stability of the width of the glue profile.

[0068] Exemplarily, a laser distance sensor for detecting the distance between the gluing head and the kitchen board may be provided on the gluing head, so that feedback adjustment of the distance between the gluing head and the kitchen board can be performed.

[0069] The beneficial effect of the above implementation method is that when the glue length value of the glue profile is too large or too small, the glue coating length can be adjusted to a suitable value by adjusting the glue coating length parameter, thereby ensuring the accuracy of the glue length.

[0070] The beneficial effect of the above implementation is that when the gluing effect at the narrowest part of the glue liquid profile obtained by gluing under the current gluing parameters is poor, the width of the glue liquid can be ensured to meet the requirements by increasing the gluing flow rate.

[0071] The beneficial effect of the above-mentioned implementation method is that when the height from the gluing head to the kitchenware board is too large, resulting in too long a distance for the glue to fall and too large fluctuation in the width of the glue profile, the stability of the width of the glue profile can be improved by reducing the gluing height by a preset gluing height value.

[0072] In some implementations, the above method further includes S210 to S220, and S210 to S220 are described in detail below.

[0073] S210, obtaining a first glue contour in which a first end of the glue contour is within a first length range, and a second glue contour in which a second end of the glue contour is within a second length range.

[0074] like Figure 6 As shown, in order to further evaluate the glue coating quality, a first glue contour within a first length range at the first end A of the glue contour and a second glue contour within a second length range at the second end B of the glue contour can be obtained, and then the glue coating quality can be detected based on the first glue contour and the second glue contour.

[0075] For example, Figure 6 As shown, the length of the first length range may be L1, the length of the second length range may be L2, and the first glue profile and the second glue profile are Figure 6 The shaded area in .

[0076] S220, determining a first area corresponding to the first glue contour, and determining a second area corresponding to the second glue contour, and when a difference between the first area and the second area is greater than a preset area difference, prompting to increase the stability of the glue coating flow rate.

[0077] After obtaining the first glue contour and the second glue contour, the first area corresponding to the first glue contour and the second area of ​​the second glue contour can be determined. The first area and the second area can characterize the gluing effect at both ends of the glue during gluing.

[0078] Exemplarily, when determining the first area and the second area, the area of ​​the contour may be calculated using a function for calculating the area of ​​a contour provided by an image processing library.

[0079] After obtaining the first area and the second area, when the difference between the first area and the second area is greater than the preset area difference, it means that the difference in the amount of glue applied between the two ends of the glue is too large, which may cause insufficient connection stability of the glue to the kitchen utensil board and the external structure, and thus it may be suggested to increase the stability of the glue flow rate to improve the connection stability of the glue.

[0080] The beneficial effect of the above-mentioned implementation method is that by obtaining a first glue contour within a first length range at the first end of the glue contour and a second glue contour within a second length range at the second end of the glue contour, and determining whether it is necessary to adjust the glue coating stability based on the areas of the first glue contour and the second glue contour, the stability of the glue coating process is improved.

[0081] In some implementations, the above method also includes: obtaining the sequential glue liquid pressure value of the gluing head during the gluing process, and when the difference between the first area and the second area is greater than the preset area difference, and the maximum pressure value of the sequential glue liquid pressure value is greater than the preset maximum pressure value, prompting to replace the glue in the gluing head.

[0082] When conducting glue coating quality inspection, in order to further accurately detect the glue coating quality, the sequential glue liquid pressure value of the glue coating head during the gluing process can be obtained. The sequential glue liquid pressure value is the glue liquid pressure of the gluing process in sequence. The glue liquid pressure value can be detected by a pressure sensor set on the glue delivery pipe.

[0083] When testing the gluing effect, when the difference between the first area and the second area is greater than the preset area difference, it means that the gluing stability at both ends of the glue liquid is poor during gluing, and the gluing effect may be unstable due to excessive viscosity of the glue liquid. At the same time, when the maximum pressure value of the sequential glue liquid pressure value is greater than the preset maximum pressure value, it means that the viscosity of the glue liquid is too high, resulting in the maximum pressure value in the sequential glue liquid pressure value being too large, which can prompt the glue liquid in the gluing head to be replaced to improve the stability of the gluing process.

[0084] Exemplarily, the preset maximum pressure value may be 110% to 120% of the standard pressure value.

[0085] The beneficial effect of the above-mentioned implementation method is that when the viscosity of the glue liquid is too high, resulting in poor glue coating stability at both ends of the glue liquid during coating, and when the maximum pressure value in the sequential glue liquid pressure value is too large, it can prompt to replace the glue liquid in the glue coating head to improve the stability of the glue coating process.

[0086] In some implementations, the above method also includes: determining the glue pressure change variance value based on the time-series glue pressure value, and determining the glue width change variance value based on the width sequence value of the glue width. When the glue pressure change variance value is greater than the preset glue pressure change variance value, and the glue width change variance value is greater than the preset glue width change variance value, it is prompted to clean the glue outlet of the glue coating head.

[0087] When conducting glue coating detection, in order to further improve the glue coating detection effect, the glue liquid pressure change variance value can be determined according to the time-series glue liquid pressure value. The glue liquid pressure change variance value characterizes the fluctuation of the glue liquid pressure during the glue coating process, and then it can be determined whether the glue coating process needs to be regulated according to the fluctuation of the glue liquid pressure.

[0088] After obtaining the fluctuation of glue liquid pressure during the glue coating process, the glue liquid width variation variance value can also be determined according to the width sequence value of the glue liquid width. The glue liquid width variation variance value characterizes the fluctuation of the glue liquid width, and then the stability of the glue coating state can be detected by the fluctuation of the glue liquid width.

[0089] When performing glue coating status detection, when the glue liquid pressure change variance value is greater than the preset glue liquid pressure change variance value, and the glue liquid width change variance value is greater than the preset glue liquid width change variance value, it means that the glue coating pressure fluctuation amplitude detected from the fluctuation of the glue liquid pressure is too large, and the glue coating width fluctuation amplitude detected from the perspective of the glue coating width is too large. Based on this, it can be judged that the stability of the gluing process is insufficient, indicating that the stability of the gluing head may be insufficient, resulting in poor gluing effect, and then it can be prompted to clean the glue outlet of the gluing head to improve the stability of the gluing effect.

[0090] The beneficial effect of the above-mentioned implementation method is that it can detect whether the fluctuation amplitude of the glue coating pressure is too large from the fluctuation of the glue liquid pressure, and detect whether the fluctuation amplitude of the glue coating width is too large from the perspective of the glue coating width, and then judge whether the stability of the gluing process meets the requirements, and then judge whether the glue outlet of the glue coating head causes unstable glue discharge, which can improve the detection effect of the stability of the gluing process.

[0091] In some implementations, the above method further includes S310 to S320, and S310 to S320 are described in detail below.

[0092] S310, determining a first boundary of the kitchen board to which the first end of the glue contour is close, and determining a first boundary distance from the first end of the glue contour to the first boundary; determining a second boundary of the kitchen board to which the second end of the glue contour is close, and determining a second boundary distance from the second end of the glue contour to the second boundary.

[0093] In order to detect the quality of glue coating, Figure 6 As shown, the first boundary of the kitchen board to which the first end of the glue contour is close can be determined through image recognition, and a first boundary distance By1 from the first end of the glue contour to the first boundary can be determined. The first boundary distance represents the length from the glue contour to the boundary of the kitchen board, and then the gluing position of the first end of the glue contour can be judged according to the first boundary distance.

[0094] In order to detect the quality of glue coating, Figure 6 As shown, the second boundary of the kitchen board that the second end of the glue contour is close to through image recognition can be determined, and the second boundary distance By2 from the second end of the glue contour to the second boundary can be determined. The second boundary distance represents the length from the glue contour to the boundary of the kitchen board, and then the gluing position of the second end of the glue contour can be judged according to the second boundary distance.

[0095] S320: When the first boundary distance or the second boundary distance is greater than or equal to the preset boundary distance, the gluing length adjustment parameter is determined to increase the preset gluing length. When the first boundary distance or the second boundary distance is less than the preset boundary distance, the gluing length adjustment parameter is determined to decrease the preset gluing length. When the difference between the first boundary distance and the second boundary distance is greater than or equal to the preset boundary distance difference, a prompt is given to clean the glue outlet of the gluing head.

[0096] In an embodiment of the present application, when the lengths from the glue contour to the first boundary or the second boundary of the kitchen utensil plate are the same, after obtaining the first boundary distance and the second boundary distance, when the first boundary distance or the second boundary distance is greater than or equal to the preset boundary distance, it indicates that the first boundary distance or the second boundary distance may be too large due to the fact that the glue coating length is too short. At this time, the glue coating length adjustment parameter can be determined to increase the preset glue coating length to ensure that the glue coating length meets the requirements.

[0097] In an embodiment of the present application, when the first boundary distance or the second boundary distance is smaller than the preset boundary distance, it may indicate that the first boundary distance or the second boundary distance is too small due to excessive glue coating length. At this time, the glue coating length adjustment parameter may be determined to increase the preset glue coating length to ensure that the glue coating length meets the requirements.

[0098] In an embodiment of the present application, when the difference between the first boundary distance or the second boundary distance is greater than or equal to the preset boundary distance difference, it means that the difference in the distance from the glue coating contour to the boundaries at both ends of the kitchen board is too large, which may be due to a malfunction in the glue discharge process of the glue coating head, resulting in poor glue coating quality. At this time, it can be prompted to clean the glue outlet of the glue coating head.

[0099] The beneficial effect of the above-mentioned implementation method is that when the lengths from the glue contour to the first boundary or the second boundary of the kitchen board are the same, if the first boundary distance or the second boundary distance is too large due to the glue coating length being too short, the glue coating length adjustment parameter is determined to increase the preset glue coating length to ensure that the glue coating length meets the requirements.

[0100] The beneficial effect of the above-mentioned implementation method is that when the length from the glue contour to the first boundary or the second boundary of the kitchen board is the same, the glue coating length is too large, resulting in the first boundary distance or the second boundary distance being too small, and the glue coating length adjustment parameter is determined to increase the preset glue coating length to ensure that the glue coating length meets the requirements.

[0101] The beneficial effect of the above-mentioned implementation method is that when the lengths from the glue contour to the first boundary or the second boundary of the kitchen board are the same, the difference in the distance from the glue coating contour to the boundaries at both ends of the kitchen board is too large, which may be due to a malfunction in the glue discharge process of the glue coating head, resulting in excessive deviation in the glue coating position, prompting the glue outlet of the glue coating head to be cleaned to ensure that the glue coating position meets the requirements.

[0102] In some implementations, in the above-mentioned S210, a first glue contour in which the first end of the glue contour is within a first length range and a second glue contour in which the second end of the glue contour is within a second length range are obtained, including: the first end of the glue contour is an end close to the start dispensing position, the second end of the glue contour is an end close to the end dispensing position, the first length range is greater than the second length range, and the first glue contour in which the first end of the glue contour is within the first length range and the second glue contour in which the second end of the glue contour is within the second length range are obtained.

[0103] In order to ensure the detection effect of the glue coating quality, the first end of the glue contour can be determined as the end close to the starting position of gluing, and the second end of the glue contour can be determined as the end close to the ending position of gluing. Since the glue at the starting point of gluing has glue falling time, the glue coating effect close to the starting point of gluing needs to be ensured when performing glue coating quality detection. The first length range can be set to be larger than the second length range to ensure the gluing effect at the starting point of gluing.

[0104] When performing glue coating quality detection, a first glue contour within a first length range can be obtained at the first end of the glue contour and a second glue contour within a second length range can be obtained. Subsequently, the glue coating quality can be detected according to the first glue contour and the second glue contour by the above-mentioned method, thereby realizing glue coating quality detection of a larger glue coating range close to the start of glue coating, thereby ensuring the glue coating quality detection effect.

[0105] Exemplarily, the first length range is a glue profile within 0-80 mm.

[0106] Exemplarily, the second length range is a glue profile within 0-50 mm.

[0107] The beneficial effect of the above implementation method is that in order to ensure the gluing effect near the starting point of gluing when performing gluing quality inspection, the first length range is set to be larger than the second length range, which can ensure the gluing effect at the starting point of gluing.

[0108] An embodiment of the present application also provides an automatic control system for an assembly line glue coating machine, comprising a unit for executing any of the methods described above.

[0109] Figure 7 A schematic diagram of the logical structure of an automatic control system for an assembly line glue coating machine provided in an embodiment of the present application is shown as follows: Figure 7As shown, the system 2 of this embodiment includes a processing unit 21, a storage unit 22 and a transceiver unit 23. The processing unit 21 is used to process data, the storage unit 22 is used to store data, and the transceiver unit 23 is used to send and receive data. The processing unit 21, the storage unit 22 and the transceiver unit 23 cooperate with each other to implement the above method. The beneficial effects of the embodiment of the present application have been described in the above method and will not be repeated here.

[0110] An embodiment of the present application also provides an automatic control system for an assembly line glue coating machine, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements any of the methods described above when executing the computer program.

[0111] Figure 8 A schematic diagram of the physical structure of an automatic control system for an assembly line glue coating machine provided in an embodiment of the present application is shown in FIG. Figure 8 As shown, the system 3 of this embodiment includes: at least one processor 30 ( Figure 8 Only one processor 30 is shown in the figure), a memory 31, and a computer program 32 stored in the memory 31 and executable on the at least one processor 30. When the processor 30 executes the computer program 32, the steps in any of the above-mentioned method embodiments are implemented. The beneficial effects of the embodiments of the present application have been described in the above-mentioned methods and will not be repeated here.

[0112] It should be noted that the information interaction, execution process, etc. between the above-mentioned systems / units are based on the same concept as the method embodiment of the present application. Their specific functions and technical effects can be found in the method embodiment part and will not be repeated here.

[0113] Those skilled in the art can clearly understand that, for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In practical applications, the above-mentioned function allocation can be completed by different functional units and modules as needed, that is, the internal structure of the system can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated in a processing unit, or each unit can exist physically separately, or two or more units can be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, which will not be repeated here.

[0114] An embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in the above-mentioned method embodiments can be implemented.

[0115] An embodiment of the present application provides a computer program product. When the computer program product runs on a mobile terminal, the mobile terminal can implement the steps in the above-mentioned method embodiments when executing the computer program product.

[0116] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present application implements all or part of the processes in the above-mentioned embodiment method, which can be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium, and the computer program can implement the steps of the above-mentioned various method embodiments when executed by the processor. Among them, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium can at least include: any entity or device that can carry the computer program code to the camera / terminal device, recording medium, computer memory, read-only memory (ROM, Read-Only Memory), random access memory (RAM, RandomAccess Memory), electric carrier signal, telecommunication signal and software distribution medium. For example, a USB flash drive, a mobile hard disk, a magnetic disk or an optical disk. In some jurisdictions, according to legislation and patent practice, computer-readable media cannot be electric carrier signals and telecommunication signals.

[0117] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0118] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0119] In the embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the modules or units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0120] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0121] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. An automatic control method for an assembly line glue coating machine, characterized in that: The method comprises: When the kitchen board moves to the gluing position, the gluing fixture is controlled to fix the kitchen board, and a board image of the kitchen board is obtained, and the gluing area of ​​the kitchen board is determined according to the board image; Glue is applied according to the glue application area, and a glue liquid image of the glue application area after glue application is obtained, and glue application length adjustment parameters, glue application flow adjustment parameters and glue application height adjustment parameters are determined according to the glue liquid image, and the parameters of the glue application head are adjusted according to the glue application length adjustment parameters, glue application flow adjustment parameters and glue application height adjustment parameters.

2. The method according to claim 1, characterized in that The glue coating length adjustment parameters, glue coating flow adjustment parameters and glue coating height adjustment parameters are determined according to the glue liquid image, including: Determine the glue contour of the glue coating area, determine the glue length value of the glue contour, and determine the width sequence value of the glue in the length direction according to the glue contour; determine the maximum width value and the minimum width value of the width sequence value, and determine the width difference between the maximum width value and the minimum width value in the width sequence value as the width fluctuation value; When the glue liquid length value is greater than or equal to the preset glue liquid length value, the glue coating length adjustment parameter is determined to reduce the preset glue coating length; when the glue liquid length value is less than the preset glue liquid length value, the glue coating length adjustment parameter is determined to increase the preset glue coating length; when the minimum width value is less than the preset width value, the glue coating flow adjustment parameter is determined to increase the preset glue coating flow; when the width fluctuation value is greater than the preset width fluctuation value, the glue coating height adjustment parameter is determined to reduce the preset glue coating height value.

3. The method according to claim 2, characterized in that The method further comprises: Acquire a first glue contour within a first length range at a first end of the glue contour and a second glue contour within a second length range at a second end of the glue contour; A first area corresponding to the first glue liquid contour is determined, and a second area corresponding to the second glue liquid contour is determined. When the difference between the first area and the second area is greater than a preset area difference, it is prompted to adjust the stability of the glue coating flow rate.

4. The method according to claim 3, characterized in that The method further comprises: The sequential glue pressure value of the glue coating head during the glue coating process is obtained. When the difference between the first area and the second area is greater than the preset area difference, and the maximum pressure value of the sequential glue pressure value is greater than the preset maximum pressure value, a prompt is given to replace the glue in the glue coating head.

5. The method according to claim 4, characterized in that The method further comprises: The glue pressure change variance value is determined according to the time series glue pressure value, and the glue width change variance value is determined according to the width sequence value of the glue width. When the glue pressure change variance value is greater than the preset glue pressure change variance value, and the glue width change variance value is greater than the preset glue width change variance value, it is prompted to clean the glue outlet of the glue coating head.

6. The method according to claim 5, characterized in that The method further comprises: Determine a first boundary of the kitchenware board that the first end of the glue contour is close to, and determine a first boundary distance from the first end of the glue contour to the first boundary; determine a second boundary of the kitchenware board that the second end of the glue contour is close to, and determine a second boundary distance from the second end of the glue contour to the second boundary; When the first boundary distance or the second boundary distance is greater than or equal to the preset boundary distance, the glue coating length adjustment parameter is determined to increase the preset glue coating length; when the first boundary distance or the second boundary distance is less than the preset boundary distance, the glue coating length adjustment parameter is determined to reduce the preset glue coating length; when the difference between the first boundary distance or the second boundary distance is greater than or equal to the preset boundary distance difference, it is prompted to clean the glue outlet of the glue coating head.

7. An automatic control system for a production line glue coating machine, characterized in that: Comprising means for performing the method according to any one of claims 1 to 6.

8. An automatic control system for an assembly line glue coating machine, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the method according to any one of claims 1 to 6 is implemented.

9. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the method according to any one of claims 1 to 6 is implemented.

10. A computer program product, comprising a computer program, characterized in that When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.

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