Full-automatic nano-silver laminating and dispensing system and method, electronic equipment and storage medium

Abstract

The invention discloses a nano-silver full-automatic laminating and dispensing system and method, electronic equipment and a storage medium, and the system comprises a visual recognition module which is used for carrying out photographing processing when a suction nozzle on the nano-silver full-automatic laminating and dispensing system sucks a to-be-processed chip, obtaining a chip picture containing the to-be-processed chip, and sending the chip picture to a chip processing module; analyzing and processing the chip photo to obtain a position state of the chip to be processed in the chip photo; the four-axis movement module is used for adjusting the position of the chip to be processed according to the position state, controlling four axes in the nano-silver full-automatic laminating system to move and moving a suction nozzle to specific positions, the four axes comprise an X axis, a Y axis, a Z axis and an R axis, and the specific positions comprise a material taking position, a photographing position, a dispensing position and a laminating position; the dispensing processing module is used for carrying out dispensing processing on the to-be-processed chip; and the bonding processing module is used for carrying out bonding processing on the to-be-processed chip after the dispensing processing. And the dispensing and laminating efficiency, accuracy and consistency are improved.

Description

Technical Field

[0001] The present application relates to the field of glue dispensing technology, and in particular to a nano-silver fully automatic laminating glue dispensing system, method, electronic equipment and storage medium. Background Art

[0002] The traditional manual glue dispensing and bonding process is: base cleaning → baking → taking out the base → taking out the film → thawing for one hour → assembling the glue dispensing machine → dispensing → assembling the base limit cover → manually clamping the patch → installing the pressure block → pressing the pressure block as shown below → visually checking the coordinate position → visually checking the bonding cavity → manual coordinate correction with tweezers → manual cavity correction with tweezers → baking → visually checking the overflow glue status → scraping glue → measuring conductivity → transferring to the next step.

[0003] Since the glue dispensing and bonding are done manually, there are several disadvantages, including: Disadvantage 1: Poor consistency of glue dispensing position; Disadvantage 2: Uncontrollable glue type and appearance, low efficiency; Disadvantage 3: Uncontrollable glue thickness and inconsistent wavelength; Disadvantage 4: Poor patch accuracy and easy to produce angle deviation; Disadvantage 5: High coupling difficulty and uncontrollable glue overflow; Disadvantage 6: Easy to conduct the base and cos, and the patch position is uncontrollable; Disadvantage 7: Poor consistency of glue dispensing and patch.

[0004] That is, the traditional manual glue dispensing bonding method has the problems of low glue dispensing efficiency and low glue dispensing accuracy. Summary of the invention

[0005] The purpose of the embodiments of the present application is to provide a nano-silver fully automatic bonding and dispensing system, method, electronic device and storage medium to solve the technical problems of low dispensing efficiency and low dispensing accuracy in the related art.

[0006] In a first aspect, the present application provides a nano-silver fully automatic lamination and dispensing system, comprising:

[0007] A visual recognition module is used to take a photo when the nozzle on the nano-silver fully automatic bonding and dispensing system sucks the chip to be processed, obtain a chip photo containing the chip to be processed, and analyze and process the chip photo to obtain the position state of the chip to be processed in the chip photo;

[0008] A four-axis motion module is used to adjust the position of the chip to be processed according to the position state, and to control the four axes in the nanosilver automatic bonding system to move, so as to move the nozzle to a specific position, wherein the four axes include an X-axis, a Y-axis, a Z-axis and an R-axis, and the specific positions include a material taking position, a photographing position, a glue dispensing position and a bonding position;

[0009] A glue dispensing processing module, used for performing glue dispensing processing on the chip to be processed;

[0010] The bonding processing module is used to perform bonding processing on the chip to be processed after the glue dispensing processing.

[0011] In a second aspect, the present application provides a nano-silver fully automatic bonding and dispensing method, comprising:

[0012] Receive an input job request, analyze and process the job request, and obtain a job requirement corresponding to the job request;

[0013] When the operation requirement is dispensing and laminating, the suction nozzle is controlled to move to the material taking position to suck the chip to be processed;

[0014] Controlling the photographing state to perform photographing processing to obtain a chip photo containing the chip to be processed, and analyzing and processing the chip state to obtain a position state of the chip to be processed in the chip photo;

[0015] Controlling the four axes to adjust according to the position state, so as to adjust the chip to be processed to an initial state;

[0016] According to the initial position and the glue dispensing position in the initial state, the four axes are controlled to be adjusted so as to move the chip to be processed to the glue dispensing position, and perform glue dispensing on the chip to be processed;

[0017] When it is detected that the dispensing of the chip to be processed is completed, the chip to be processed after the dispensing treatment is moved to the bonding position according to the dispensing position and the bonding position, and the bonding process is performed on the chip to be processed after the dispensing treatment;

[0018] When it is detected that the chip to be processed after the glue dispensing process has completed the bonding process, the four axes are controlled to be adjusted according to the first storage position and the bonding position to move the processed chip to be processed to the first storage position.

[0019] In a third aspect, an embodiment of the present application provides an electronic device, comprising a processor, a memory, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps in any one of the above-mentioned fully automatic nano-silver bonding and dispensing methods when executing the computer program.

[0020] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in any of the above-mentioned fully-automatic nanosilver bonding and dispensing methods are implemented.

[0021] The embodiment of the present application provides a nanosilver automatic laminating and dispensing system, method, electronic device and storage medium, the system includes a visual recognition module, which is used to take a photo when the nozzle on the nanosilver automatic laminating and dispensing system sucks the chip to be processed, obtain a chip photo containing the chip to be processed, and analyze and process the chip photo to obtain the position state of the chip to be processed in the chip photo; a four-axis motion module, which is used to adjust the position of the chip to be processed according to the position state, and control the four axes in the nanosilver automatic laminating system to move, and move the nozzle to a specific position, wherein the four axes include X axis, Y axis, Z axis and R axis, and the specific position includes material taking position, photo taking position, dispensing position and laminating position; a dispensing processing module, which is used to perform dispensing processing on the chip to be processed; and a laminating processing module, which is used to perform laminating processing on the chip to be processed after the dispensing processing. The chip position and state are uniformly adjusted in real time based on the four axes, while improving the accuracy and consistency of dispensing and laminating, and improving the efficiency of dispensing and laminating. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a structural schematic diagram of a nano-silver fully automatic laminating and dispensing system provided in an embodiment of the present application;

[0023] Figure 2 This is a schematic diagram of a chip photo provided in an embodiment of the present application;

[0024] Figure 3 is another schematic diagram of a chip photo provided in an embodiment of the present application;

[0025] Figure 4 This is a structural schematic diagram of a nano-silver fully automatic laminating and dispensing system provided in an embodiment of the present application;

[0026] Figure 5 It is a block diagram of a visual recognition module provided in an embodiment of the present application;

[0027] Figure 6 It is a block diagram of a four-axis motion module provided in an embodiment of the present application;

[0028] Figure 7 is another block diagram of a four-axis motion module provided in an embodiment of the present application;

[0029] Figure 8 It is a schematic diagram of the four-axis motion direction provided in an embodiment of the present application;

[0030] Fig. 9 It is a schematic diagram of a block diagram of a dispensing processing module provided in an embodiment of the present application;

[0031] Fig.10is a schematic diagram of a dispensing pattern provided in an embodiment of the present application;

[0032] Fig.11 It is a schematic diagram of a block diagram of a bonding adhesive processing module provided in an embodiment of the present application;

[0033] Fig.12 This is a schematic diagram of a process of a fully automatic nano-silver lamination and dispensing method provided in an embodiment of the present application;

[0034] Fig.13 is a structural schematic diagram of an electronic device provided in an embodiment of the present application;

[0035] Fig.14 This is another structural schematic diagram of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0037] It should be understood that the various steps described in the method embodiments of the present disclosure may be performed in different orders and / or in parallel. In addition, the method embodiments may include additional steps and / or omit the steps shown. The scope of the present disclosure is not limited in this respect.

[0038] The term "including" and its variations used herein are open inclusions, i.e., "including but not limited to". The term "based on" means "based at least in part on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". The relevant definitions of other terms will be given in the following description.

[0039] In the related technology, when dispensing and bonding the chip, the traditional manual dispensing and bonding method is usually adopted. Based on the specific operation process, there are certain disadvantages, such as poor consistency of dispensing position; uncontrollable appearance of glue type and low efficiency; uncontrollable glue thickness and inconsistent wavelength; poor patch accuracy and easy angle deviation; high coupling difficulty and uncontrollable glue overflow; easy conduction of the base and cos, uncontrollable patch position; poor consistency of dispensing and bonding, resulting in low dispensing and bonding efficiency.

[0040] In order to solve the technical problems existing in the related art, the present application embodiment provides a nano silver fully automatic bonding and dispensing system, see Figure 1 , Figure 1 1 is a structural schematic diagram of a nano-silver fully-automatic bonding and dispensing system provided in an embodiment of the present application, wherein the nano-silver fully-automatic bonding and dispensing system 100 comprises: a visual recognition module 101, which is used to take a photo when the nozzle on the nano-silver fully-automatic bonding and dispensing system sucks the chip to be processed, obtain a chip photo containing the chip to be processed, and analyze and process the chip photo to obtain the position state of the chip to be processed in the chip photo; a four-axis motion module 102, which is used to adjust the position of the chip to be processed according to the position state, and control the four axes in the nano-silver fully-automatic bonding system to move, and move the nozzle to a specific position, wherein the four axes include an X-axis, a Y-axis, a Z-axis and an R-axis, and the specific position includes a material picking position, a photographing position, a dispensing position and a bonding position; a dispensing processing module 103, which is used to perform dispensing processing on the chip to be processed; and a bonding processing module 104, which is used to perform bonding processing on the chip to be processed after the dispensing processing.

[0041] In one embodiment, when the nanosilver fully automatic bonding and dispensing system 100 completes the automatic dispensing and bonding process, it is first necessary to ensure that the chip is in a suitable state and position, wherein the state can usually be reflected in whether it is horizontal and whether the position matches the bonding object, and the position can usually be reflected in a specific position in three-dimensional space. After the control chip is in a position suitable for dispensing and bonding, the chip to be processed will be dispensed and bonded according to actual needs, and then the processed chip to be processed will be obtained after the dispensing and bonding process is completed.

[0042] Exemplarily, the chip to be processed is sucked by the nozzle provided on the nano-silver automatic bonding and dispensing system 100. When the chip to be processed sucked by the nozzle is processed, the visual recognition module 101 is used to identify and analyze the chip to be processed to determine whether the chip to be processed can be currently processed by dispensing and bonding. Specifically, after the nozzle sucks the chip to be processed, the visual recognition module 101 will control the corresponding camera to take a photo to obtain a chip photo containing the chip to be processed, and then determine the position state of the chip to be processed by analyzing the photo.

[0043] In order to perform subsequent dispensing and laminating processing, it is necessary to control the four-axis motion module 102 to perform four-axis movement control to achieve position adjustment of the suction nozzle, and then achieve position adjustment of the chip to be processed. When the four-axis motion module 102 performs position adjustment, it can move the chip to be processed to a specific position to perform specific operations, such as sucking the chip at the material picking position to move it to the dispensing position and the laminating position. At the same time, it can also be moved to other positions according to actual needs, wherein the specific positions that can be moved can include the material picking position, the photo taking position, the dispensing position and the laminating position.

[0044] In the actual operation process, when the nano-silver fully automatic bonding and dispensing system 100 is operating, it responds to the received automatic dispensing and bonding instructions, controls the suction nozzle to suck the chip, and then controls the four-axis motion module 102 to move the chip to be processed to a specific position, such as controlling the suction nozzle to move to the photo position when photo processing is required, controlling the suction nozzle to move to the dispensing position when dispensing processing is required, and controlling the suction nozzle to move to the bonding position when bonding processing is required.

[0045] At the same time, when controlling the operation of the four-axis motion module 102, the position state of the chip to be processed can also be adjusted to ensure that the chip to be processed can be accurately bonded to the bonding object, which is convenient for subsequent dispensing and bonding operations. In actual applications, when the nozzle sucks the chip to be processed, the current position of the chip to be processed is not necessarily in a suitable state, so it is necessary to adjust the position state of the chip to be processed, such as controlling the chip to be processed to rotate and / or translate.

[0046] Specifically, when adjusting the position state of the chip to be processed, after obtaining the chip photo and analyzing and processing the chip photo, determine whether to perform position adjustment and how to perform position adjustment based on the position state of the chip to be processed in the chip photo, so as to ensure that the adjusted chip to be processed is in the center of the field of view of the photographing device, such as the chip center point of the chip to be processed after adjustment coincides with the center point of the field of view of the photographing device.

[0047] Typically, after the nozzle sucks up the chip to be processed at the material picking position, a photograph is taken using the camera on the nano-silver fully automatic bonding and dispensing system 100 to determine whether the chip to be processed is in the center of the field of view of the camera. If it is determined that the chip to be processed is not in the center of the field of view, adjustments such as movement and / or rotation are required.

[0048] For example, refer to Figure 2 , Figure 2 is a schematic diagram of a chip photo provided in the embodiment of the present application. Figure 2 In the chip photo, the chip to be processed is not in the center of the field of view, and the chip to be processed is not in the correct orientation. At this time, when adjusting the position of the chip to be processed, the chip to be processed can be moved and rotated based on the chip center and the field of view center of the chip to be processed, and the chip to be processed can be adjusted to the correct orientation, that is, the appropriate orientation, while ensuring that the chip center and the field of view center coincide.

[0049] For example, refer to Figure 3 , Figure 3 is another schematic diagram of the chip photo provided in the embodiment of the present application. Figure 3In the chip photo, the chip to be processed is not in the center of the field of view, but the chip to be processed is in the positive position. At this time, when adjusting the position, you only need to move the chip to be processed until the center of the chip coincides with the center of the field of view.

[0050] In actual applications, if the suction nozzle itself can ensure that the chip is in a horizontal state, then when adjusting the position of the chip to be processed, it is only necessary to control the chip to be processed to move and / or rotate on a horizontal plane. If the suction nozzle itself cannot ensure that the chip is in a horizontal state, then when adjusting the position of the chip to be processed, it is also necessary to control the suction nozzle itself to perform horizontal adjustments to ensure that the chip to be processed is in a horizontal state, and at the same time, the position of the chip to be processed is moved and / or rotated, which is related to the specific settings of the nano-silver fully-automatic bonding and dispensing system 100.

[0051] Furthermore, when the four-axis motion module 102 controls the movement of the four axes, the four axes on the nano-silver fully automatic bonding and dispensing system 100 are controlled to move respectively to realize the movement of the chip to be processed, and the four axes include the X-axis, the Y-axis, the Z-axis and the R-axis, wherein the plane formed by the movement of the R-axis is the XY plane, which is used to rotate and adjust the chip. By adjusting the four axes, the chip sucked by the nozzle is moved to a specific position, and at the same time, it is ensured that the chip can be accurately dispensed and / or bonded. Figure 4 , Figure 4 It is a structural schematic diagram of the nano silver fully automatic bonding and dispensing system provided in an embodiment of the present application. When controlling the movement of the four axes (XYZR axes), the driving is based on the corresponding motors, including the X-axis motor, the Y-axis motor, the Z-axis motor and the R-axis motor. At the same time, when performing photo processing, the upper camera and the lower camera are used to perform photo processing to obtain a chip photo containing a chip to be processed, and then based on the analysis and processing of the chip photo, the motor is controlled to drive the four axes to move, so as to perform dispensing and bonding processing on the processing device (chip to be processed).

[0052] After the position of the chip to be processed is adjusted, the dispensing processing module 103 is used to perform dispensing processing on the chip to be processed, and after the dispensing processing is completed, the bonding processing module 104 is used to perform bonding processing on the chip to be processed after the dispensing processing.

[0053] Further, refer to Figure 5 , Figure 5It is a block diagram of a visual recognition module provided by an embodiment of the present application, wherein the visual recognition module 101 includes a state detection unit 1011, an image acquisition unit 1012 and an image processing unit 1013. The state detection unit 1011 is used to detect whether the nozzle on the nanosilver automatic bonding and dispensing system sucks the chip to be processed; the image acquisition unit 1012 is used to control the image acquisition device to take pictures and obtain a chip photo containing the chip to be processed; the image processing unit 1013 is used to analyze and process the chip photo, and the chip center point in the chip photo.

[0054] Specifically, the visual recognition module 101 works only after determining that the nozzle has sucked up the chip to be processed. Therefore, during the operation, the state detection unit 1011 is used to determine whether the nozzle has sucked up the chip to be processed, and then after determining that the nozzle has sucked up the chip to be processed, the image acquisition unit 1012 is controlled to perform photo processing to obtain a chip photo containing the chip to be processed. Finally, the image processing unit 1013 is controlled to analyze and process the obtained chip photo to determine the center point of the chip in the chip photo.

[0055] Exemplarily, the determined chip center point is the position state of the chip to be processed in the chip photo. When the four-axis motion module 102 adjusts the position of the chip to be processed according to the obtained position state, the obtained chip center point is compared with the center of the field of view of the photographing device to adjust the position of the chip to be processed according to the comparison result.

[0056] In actual applications, when the suction nozzle sucks the chip to be processed, it sucks it at the material picking position, and then controls and adjusts it to a state where it can be photographed. Therefore, when photographing is performed based on the image acquisition unit 1012, the image processing unit 1012 also includes: a position detection subunit 10121, which is used to detect whether the chip to be processed is in the photographing position, and generates a photographing instruction when it is determined that the chip to be processed is in the photographing position; a photographing processing subunit 10122, which is used to receive and respond to the photographing instruction to control the image acquisition device to perform photographing processing, and obtain a chip photo containing the chip to be processed.

[0057] That is, in the entire nano-silver fully automatic laminating and dispensing system 100, specific positions are named based on needs and functions, including material taking position, photographing position, dispensing position and laminating position. When different operations need to be performed, the chip to be processed sucked by the nozzle needs to be moved to the corresponding position, and then the corresponding work can be performed. Therefore, when performing photographing processing, the chip to be processed needs to be moved to the photographing position, and the position detection subunit 10121 is used to detect whether the chip to be processed is in the photographing position, and then a photographing instruction is generated when it is determined to be in the photographing position to control the photographing processing subunit 10122 to perform photographing processing.

[0058] It should be noted that when determining whether the chip to be processed is in the photographing position, the position of the nozzle can be determined by determining whether it is in the photographing position, specifically by obtaining the data of the XYZ axis in the current four axes to determine the position of the nozzle in three-dimensional space, and comparing it with the photographing position to determine whether it is in the photographing position. That is, after the nozzle is controlled to suck the chip to be processed, the XYZ axis in the four axes can be controlled to adjust according to the position information of the set photographing position to control the nozzle to move to the photographing position.

[0059] Further, refer to Figure 6 , Figure 6 It is a block diagram of a four-axis motion module provided in an embodiment of the present application. Specifically, the four-axis motion module 102 includes: a first positioning unit 1021, a first compensation unit 1022 and a first control unit 1023. Among them, the first positioning unit 1021 is used to obtain the center point of the photo in the chip photo; the first compensation unit 1022 is used to calculate the first motion compensation values ​​corresponding to the four axes according to the position state and the center point of the photo; the first control unit 1023 is used to control the four axes according to the first motion compensation value to adjust the position of the chip to be processed.

[0060] Specifically, when the four-axis motion module 102 performs position adjustment according to the position state of the chip to be processed in the chip photo, it processes the chip to be processed to ensure that the chip to be processed is in a suitable position. In order to improve the bonding efficiency, before the dispensing and bonding process, it is necessary to control the chip to be processed to be in the center of the field of view of the camera device, such as the chip center point of the chip to be processed coincides with the center of the field of view and the chip to be processed is in the positive orientation. Therefore, the center point of the photo of the chip photo is positioned by controlling the first positioning unit 1021, wherein the center point of the photo can be equivalent to the center of the field of view, and then the first supplementary unit 1022 is used to calculate the motion compensation based on the position state of the chip to be processed (i.e., the chip center point) and the center of the photo (i.e., the field of view center), and obtain the first motion compensation value for the mobile processing of the chip to be processed, and finally control the first control unit 1023 to control the four axes to move to a suitable position based on the obtained first motion compensation value, that is, move until the chip center point coincides with the center of the photo, and the chip to be processed is in the positive orientation state.

[0061] Further, refer to Figure 7 , Figure 7It is another block diagram of the four-axis motion module provided in the embodiment of the present application. Specifically, the four-axis motion module 102 also includes: a second positioning unit 1024, a second compensation unit 1025 and a second control unit 1026. Among them, the second positioning unit 1024 is used to obtain the position information of the four axes, and to obtain the target position contained in the control instruction for controlling the suction nozzle, wherein the target position is any one of the specific positions; the second compensation unit 1025 is used to calculate the second motion compensation values ​​corresponding to the four axes respectively according to the position information and the target position; the second control unit 1026 is used to control the four axes according to the second motion compensation to move the suction nozzle to the target position.

[0062] Specifically, when the four-axis motion module 102 controls the nozzle to move to a specific position, it is necessary to perform motion compensation calculations based on the current position of the nozzle and the target position to which it needs to move, so as to determine how to adjust the four-axis. Therefore, when controlling the movement of the nozzle, the second positioning unit 1024 is first used to obtain the current position information of the four-axis, and to determine the target position to which the nozzle needs to be moved, and the target position is one of the aforementioned specific positions, and then the second compensation unit 1025 is used to calculate based on the current position information of the four-axis and the target position to obtain the second motion compensation value for moving the nozzle to the target position, and finally the second control unit 1026 is controlled to adjust the four-axis based on the second motion compensation value until the nozzle is controlled to reach the target position.

[0063] It should be noted that the position status of the four axes can be determined based on specific numbers. For example, the corresponding scale values ​​​​can be set for the four axes, including the values ​​​​of the XYZ axes and the angle value of the R axis. They can be represented by a coordinate, such as (x, y, z, r), which represent the values ​​​​corresponding to X, Y, Z, and R, respectively. By determining the coordinates of the target position, it can be determined how to control and adjust the four axes.

[0064] In addition, when controlling the four axes for adjustment, the movement direction of the four axes during adjustment can refer to Figure 8 , where direction 1 is the X-axis movement direction, direction 2 is the Y-axis movement direction, direction 3 is the Z-axis movement direction, and direction 4 is the R-axis movement direction. It can be simply obtained that the X, Y and Z axes move back and forth in their respective directions, and the R axis rotates on the plane of the X-axis and Y-axis travel. It should be noted that at this time, the suction nozzle can ensure that the chip to be processed is in a horizontal state when it absorbs the chip to be processed, that is, the suction nozzle can also have a horizontal function, so that there is no need to perform horizontal operation again after sucking the chip to be processed.

[0065] Reference Fig. 9 , Fig. 9It is a block diagram of the glue dispensing processing module provided in the embodiment of the present application. Specifically, the glue dispensing processing module 103 includes a parameter acquisition unit 1031, a glue dispensing calculation unit 1032 and a glue dispensing processing unit 1033. Among them, the parameter acquisition unit 1031 is used to obtain the physical parameters of the chip to be processed, wherein the physical parameters include the length and width of the step and the length of the snowflake line segment; the glue dispensing calculation unit 1032 is used to calculate according to the physical parameters to obtain the glue dispensing position for the glue dispensing processing of the chip to be processed; the glue dispensing processing unit 1033 is used to control the glue dispensing device to perform glue dispensing processing on the chip to be processed according to the glue dispensing position.

[0066] Specifically, when performing glue dispensing processing on different chips, the suitable glue dispensing methods may be different. The reasons for the differences may be reflected in the chip size, chip purpose, chip material, etc. Therefore, when performing glue dispensing processing on the chip to be processed, the parameter acquisition unit 1031 is used to obtain the physical parameters of the chip to be processed, including the step length and snowflake line length of the chip, and then the glue dispensing calculation unit 1032 calculates the specific glue dispensing position according to the physical parameters, and finally the glue dispensing processing unit 1033 controls the corresponding glue dispensing device to perform glue dispensing processing according to the glue dispensing position.

[0067] In practical applications, when dispensing glue, the dispensing pattern can be different according to the needs. The dispensing pattern is determined based on the dispensing position. Specifically, the dispensing pattern can be three-stroke snowflake or eight-stroke dispensing (see Fig.10 , Fig.10 It is a schematic diagram of the dispensing pattern provided in the embodiment of the present application), and it can also be other methods. In order to facilitate subsequent use, the dispensing method corresponding to different chips can be pre-set, and then the specific physical parameters of the chip to be processed and other information can be calculated to determine the specific dispensing position.

[0068] It should be noted that after the glue dispensing process is completed, the bonding process can be carried out according to actual needs. When performing the bonding process, the chip to be processed after the glue dispensing process needs to be moved to the bonding position. In actual applications, the glue dispensing position and the bonding position can be the same position or two different positions. When set to the same position, the name is adjusted based on the different operations performed, that is, it is called the glue dispensing position when performing the glue dispensing process, and it is called the bonding position when performing the bonding process.

[0069] In addition, in practical applications, the glue dispensing processing module 103 may also be provided with a corresponding pressure sensor to control the uniformity of glue overflow during glue dispensing, thereby achieving a better heat dissipation function.

[0070] Reference Fig.11 , Fig.11It is a block diagram of a bonding glue processing module provided in an embodiment of the present application. Specifically, the bonding processing module 104 includes: a pressure detection unit 1041 and a bonding processing unit 1042. The pressure detection unit 1041 is used to obtain the bonding pressure value during the bonding process; the bonding processing unit 1042 is used to control the bonding pressure value to be within the standard pressure range, and perform bonding processing on the chip to be processed after the glue dispensing process.

[0071] Specifically, after completing the glue dispensing process, the bonding process can be performed according to actual needs. When performing the bonding process, the bonding processing unit 1042 is controlled to perform the bonding process. At the same time, when performing the bonding process, it is necessary to ensure that the bonding pressure is within an appropriate range. Therefore, the pressure detection unit 1041 will also be used to detect the pressure in real time, and then the bonding process is performed by controlling the bonding and processing unit 1042 to ensure that the pressure during bonding is within the set pressure range.

[0072] Furthermore, after completing the dispensing and bonding process of the chip to be processed, the processed chip to be processed can also be moved to a corresponding storage space, that is, the nanosilver fully automatic bonding dispensing system 100 also includes a post-processing module, which is used to move the processed chip to the storage space after determining that the dispensing and bonding process of the chip to be processed is completed, so as to facilitate the dispensing and bonding process of the next chip.

[0073] In addition, for this system, in addition to completing the dispensing and bonding operations at the same time, it can also only complete the dispensing or bonding work, which is determined according to actual needs. That is, when controlling the operation of the nano-silver fully automatic bonding dispensing system 100, the set pre-processing module can be used to analyze and process the received operation instructions to determine whether the work to be completed is dispensing, bonding, and dispensing and bonding, so as to accurately complete the corresponding work.

[0074] At the same time, in order to ensure the safety and stability of the operation of the nano-silver fully automatic bonding and dispensing system 100, an anti-collision and anti-foolproof function can also be set. By setting adjustment thresholds and adjustment standard values ​​on the four axes, when abnormalities in the four-axis movement are detected, abnormal feedback and warnings can be given, and the four-axis movement can be stopped and the dispensing machine can be turned off.

[0075] Reference Fig.12 , Fig.12 It is a flow chart of the nano-silver fully automatic bonding and dispensing method provided in an embodiment of the present application, which is applied to the nano-silver fully automatic bonding and dispensing system described above, wherein the method includes steps S1201 to S1207.

[0076] Step S1201, receiving an inputted job request, analyzing and processing the job request, and obtaining a job requirement corresponding to the job request;

[0077] Step S1202, when the operation requirement is dispensing and bonding, the suction nozzle is controlled to move to the material taking position to suck the chip to be processed;

[0078] Step S1203, controlling the photographing device to perform photographing processing to obtain a chip photo containing the chip to be processed, and analyzing the chip status to obtain the position status of the chip to be processed in the chip photo;

[0079] Step S1204, controlling the four axes to adjust according to the position state, so as to adjust the chip to be processed to the initial state;

[0080] Step S1205, according to the initial position and the glue dispensing position in the initial state, the four axes are controlled to be adjusted to move the chip to be processed to the glue dispensing position, and glue dispensing is performed on the chip to be processed;

[0081] Step S1206, when it is detected that the dispensing of the chip to be processed is completed, the chip to be processed after the dispensing process is moved to the bonding position according to the dispensing position and the bonding position, and the bonding process is performed on the chip to be processed after the dispensing process;

[0082] Step S1207, when it is detected that the chip to be processed after the dispensing process has completed the bonding process, the four axes are controlled to be adjusted according to the first storage position and the bonding position to move the processed chip to be processed to the first storage position.

[0083] Specifically, when processing, after receiving the job request input by the operator, the job request is analyzed and processed to obtain the job requirements corresponding to the job request. In fact, the job requirement is any one of dispensing, bonding, and dispensing and bonding. Here, taking the job requirement of dispensing and bonding the chip as an example, during the operation, it is first necessary to obtain the chip to be processed at the material picking position, and then perform dispensing and bonding on the chip to be processed.

[0084] Exemplarily, during the processing, when obtaining the chip to be processed, the nozzle is controlled to move to the material picking position to absorb the chip to be processed, and the control of the nozzle is realized based on the adjustment of four axes. By controlling the movement of the XYZ axis among the four axes, the nozzle is moved to the material picking position to absorb the chip to be processed, and the position of the nozzle can be represented by coordinates. After the chip to be processed is absorbed, the position state of the chip to be processed needs to be adjusted to ensure that the chip to be processed is in the correct orientation. At this time, the chip state containing the chip to be processed is obtained by controlling the photographing device to perform photographing processing, and then the position state of the chip to be processed is obtained through analysis and processing, so as to adjust the chip to be processed according to the position state, so that the chip to be processed is in the initial state, wherein the initial state is that the chip center point of the chip to be processed coincides with the center of the photo (the center of the field of view of the photographing device), and the chip to be processed is in the correct orientation. For details, please refer to Figure 2 or Figure 3 The position of the chip to be processed after adjustment.

[0085] After the chip to be processed is in the appropriate position, subsequent gluing and bonding processes will be carried out. When performing the gluing and bonding processes, the four axes are also controlled for adjustment to achieve moving the chip to be processed to the gluing position and the bonding position. For example, when performing the gluing process, the compensation value for the motion adjustment of the four axes can be calculated based on the initial position and the gluing position in the initial state, and then the four axes are adjusted separately according to the compensation value to move the chip to be processed to the gluing position. Similarly, when performing the bonding process after completing the gluing process, the compensation value for the motion adjustment of the four axes can be calculated based on the gluing position and the bonding position, and then the four axes are adjusted separately according to the compensation value to move the chip to be processed to the bonding position.

[0086] Of course, after completing the gluing and bonding process on the chip to be processed, the processed chip to be processed can be moved to the corresponding storage space, such as the first storage position, so as to facilitate the gluing and bonding process on the next chip to be processed.

[0087] In addition, the operation requirement processing is glue dispensing and laminating, or it can be only glue dispensing or only laminating. For example, when the operation requirement is glue dispensing, the suction nozzle is controlled to move to the material picking position to absorb the chip to be processed, and steps S1103 to S1105 are executed. When the glue dispensing process is completed, the four axes are controlled to adjust according to the second storage position and the glue dispensing position to move the processed chip to the second storage position. For another example, when the operation requirement is laminating, the suction nozzle is controlled to move to the second storage position to absorb the chip to be processed, and the chip to be processed is subjected to laminating process, and the chip to be processed after laminating process is stored in the third storage position.

[0088] It should be noted that pressure detection is also required during dispensing and bonding. For example, during dispensing, the pressure sensor is used to control the uniformity of glue overflow to ensure better heat dissipation function. During bonding, the pressure sensor is used to control the bonding pressure to avoid problems such as bonding failure caused by excessive bonding pressure.

[0089] In summary, the present application discloses a nano-silver fully automatic laminating and dispensing system, including a visual recognition module, which is used to take photos when the nozzle on the nano-silver fully automatic laminating and dispensing system sucks the chip to be processed, obtain a chip photo containing the chip to be processed, and analyze and process the chip photo to obtain the position state of the chip to be processed in the chip photo; a four-axis motion module, which is used to adjust the position of the chip to be processed according to the position state, and control the four axes in the nano-silver fully automatic laminating system to move, and move the nozzle to a specific position, wherein the four axes include the X-axis, the Y-axis, the Z-axis and the R-axis, and the specific position includes the material taking position, the photographing position, the dispensing position and the laminating position; a dispensing processing module, which is used to perform dispensing processing on the chip to be processed; and a laminating processing module, which is used to perform laminating processing on the chip to be processed after the dispensing processing. The chip position and state are uniformly adjusted in real time based on the four axes, which improves the accuracy and consistency of dispensing and laminating, and improves the efficiency of dispensing and laminating.

[0090] Also, see Fig.13 , Fig.13 is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application, and the electronic device may be a mobile terminal such as a smart phone, a tablet computer, or the like. Fig.13 As shown, the electronic device 1300 includes a processor 1301 and a memory 1302. The processor 1301 is electrically connected to the memory 1302.

[0091] Processor 1301 is the control center of electronic device 1300. It uses various interfaces and lines to connect various parts of the entire electronic device. It executes various functions of electronic device 1300 and processes data by running or loading applications stored in memory 1302 and calling data stored in memory 1302, thereby monitoring electronic device 1300 as a whole.

[0092] In this embodiment, the processor 1301 in the electronic device 1300 will load the instructions corresponding to the processes of one or more applications into the memory 1302 according to the following steps, and the processor 1301 will run the application stored in the memory 1302, thereby implementing any step in the nanosilver fully automatic bonding and dispensing method provided in the above embodiment.

[0093] The electronic device 1300 can implement the steps in any embodiment of the nano-silver fully-automatic bonding and dispensing method provided in the embodiments of the present application. Therefore, it can achieve the beneficial effects that can be achieved by any nano-silver fully-automatic bonding and dispensing method provided in the embodiments of the present application. Please refer to the previous embodiments for details and will not be repeated here.

[0094] See also Fig.14 , Fig.14is another structural schematic diagram of an electronic device provided in an embodiment of the present application, such as Fig.14 As shown, Fig.14 The specific structural block diagram of the electronic device provided in the embodiment of the present application is shown, and the electronic device can be used to implement the nano-silver automatic bonding and dispensing method provided in the above embodiment. The electronic device 1400 can be a mobile terminal such as a smart phone or a laptop computer.

[0095] The RF circuit 1410 is used to receive and send electromagnetic waves, realize the mutual conversion between electromagnetic waves and electrical signals, and thus communicate with a communication network or other devices. The RF circuit 1410 may include various existing circuit elements for performing these functions, such as antennas, radio frequency transceivers, digital signal processors, encryption / decryption chips, user identity module (SIM) cards, memories, etc. The RF circuit 1410 can communicate with various networks such as the Internet, corporate intranets, wireless networks, or communicate with other devices through wireless networks. The above-mentioned wireless networks may include cellular telephone networks, wireless local area networks, or metropolitan area networks. The above-mentioned wireless networks can use various communication standards, protocols and technologies, including but not limited to Global System for Mobile Communication (GSM), Enhanced Data GSM Environment (EDGE), Wideband Code Division Multiple Access (WCDMA), Code Division Multiple Access (CDMA), Time Division Multiple Access (TDMA), Wireless Fidelity (Wi-Fi) (such as Institute of Electrical and Electronics Engineers standards IEEE 802.11a, IEEE 802.11b, IEEE802.11g and / or IEEE802.11n), Voice over Internet Protocol (VoIP), Worldwide Interoperability for Microwave Access (Wi-Max), other protocols for email, instant messaging and short messages, and any other suitable communication protocols, even those that have not yet been developed.

[0096] The memory 1420 can be used to store software programs and modules, such as the program instructions / modules corresponding to the nanosilver fully-automatic bonding and dispensing method in the above-mentioned embodiment. The processor 1480 executes various functional applications and the nanosilver fully-automatic bonding and dispensing method by running the software programs and modules stored in the memory 1420.

[0097] The memory 1420 may include a high-speed random access memory, and may also include a non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some examples, the memory 1420 may further include a memory remotely arranged relative to the processor 1480, and these remote memories may be connected to the electronic device 1400 via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0098] The input unit 1430 can be used to receive uploaded digital or character information, and generate keyboard, mouse, joystick, optical or trackball signal input related to user settings and function control. Specifically, the input unit 1430 may include a touch-sensitive surface 1431 and other input devices 1432. The touch-sensitive surface 1431, also known as a touch display screen or touchpad, can collect user touch operations on or near it (such as operations performed by the user using any suitable object or accessory such as a finger, stylus, etc. on or near the touch-sensitive surface 1431), and drive the corresponding connection device according to a pre-set program. Optionally, the touch-sensitive surface 1431 may include a touch detection device and a touch controller. Among them, the touch detection device detects the user's touch direction, detects the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts it into touch point coordinates, and then sends it to the processor 1480, and can receive and execute commands sent by the processor 1480. In addition, the touch-sensitive surface 1431 may be implemented in various types such as resistive, capacitive, infrared, and surface acoustic wave. In addition to the touch-sensitive surface 1431, the input unit 1430 may further include other input devices 1432. Specifically, the other input devices 1432 may include, but are not limited to, one or more of a physical keyboard, a function key (such as a volume control key, a switch key, etc.), a trackball, a mouse, a joystick, and the like.

[0099] The display unit 1440 can be used to display information input by the user or information provided to the user and various graphical user interfaces of the electronic device 1400, which can be composed of graphics, text, icons, videos and any combination thereof. The display unit 1440 may include a display panel 1441, and optionally, the display panel 1441 may be configured in the form of LCD (Liquid Crystal Display), OLED (Organic Light-Emitting Diode), etc. Further, the touch-sensitive surface 1431 may cover the display panel 1441, and when the touch-sensitive surface 1431 detects a touch operation on or near it, it is transmitted to the processor 1480 to determine the type of the touch event, and then the processor 1480 provides corresponding visual output on the display panel 1441 according to the type of the touch event. Although in the figure, the touch-sensitive surface 1431 and the display panel 1441 are implemented as two independent components to implement input and output functions, in some embodiments, the touch-sensitive surface 1431 and the display panel 1441 can be integrated to implement input and output functions.

[0100] The electronic device 1400 may also include at least one sensor 1450, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor may include an ambient light sensor and a proximity sensor, wherein the ambient light sensor may adjust the brightness of the display panel 1441 according to the brightness of the ambient light, and the proximity sensor may generate an interrupt when the flip cover is closed or closed. As a type of motion sensor, the gravity acceleration sensor can detect the magnitude of acceleration in each direction (generally three axes), and can detect the magnitude and direction of gravity when stationary. It can be used for applications that identify the posture of the mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer, tapping), etc.; as for other sensors such as gyroscopes, barometers, hygrometers, thermometers, infrared sensors, etc. that can also be configured in the electronic device 1400, they will not be repeated here.

[0101] The audio circuit 1460, the speaker 1461, and the microphone 1462 can provide an audio interface between the user and the electronic device 1400. The audio circuit 1460 can transmit the received audio data to the speaker 1461 after converting the received audio data into an electrical signal, which is converted into a sound signal for output; on the other hand, the microphone 1462 converts the collected sound signal into an electrical signal, which is received by the audio circuit 1460 and converted into audio data, and then the audio data is processed by the output processor 1480 and sent to another terminal through the RF circuit 1410, or the audio data is output to the memory 1420 for further processing. The audio circuit 1460 may also include an earplug jack to provide communication between an external headset and the electronic device 1400.

[0102] The electronic device 1400 can help the user receive requests, send information, etc. through the transmission module 1470 (such as a Wi-Fi module), which provides the user with wireless broadband Internet access. Although the transmission module 1470 is shown in the figure, it is understandable that it is not a necessary component of the electronic device 1400 and can be omitted as needed without changing the essence of the invention.

[0103] The processor 1480 is the control center of the electronic device 1400. It uses various interfaces and lines to connect various parts of the entire mobile phone. By running or executing software programs and / or modules stored in the memory 1420, and calling data stored in the memory 1420, it executes various functions of the electronic device 1400 and processes data, thereby monitoring the electronic device as a whole. Optionally, the processor 1480 may include one or more processing cores; in some embodiments, the processor 1480 may integrate an application processor and a modem processor, wherein the application processor mainly processes the operating system, user interface, and application programs, etc., and the modem processor mainly processes wireless communications. It can be understood that the above-mentioned modem processor may not be integrated into the processor 1480.

[0104] The electronic device 1400 also includes a power supply 1490 (such as a battery) for supplying power to various components. In some embodiments, the power supply can be logically connected to the processor 1480 through a power management system, so that the power management system can manage charging, discharging, and power consumption management. The power supply 1490 can also include any components such as one or more DC or AC power supplies, recharging systems, power failure detection circuits, power converters or inverters, and power status indicators.

[0105] Although not shown, the electronic device 1400 also includes a camera (such as a front camera, a rear camera), a Bluetooth module, etc., which will not be described in detail here. Specifically in this embodiment, the display unit of the electronic device is a touch screen display, and the mobile terminal also includes a memory, and one or more programs, wherein one or more programs are stored in the memory, and are configured to be executed by one or more processors to implement any step of the nano-silver fully automatic bonding and dispensing method provided in the above embodiment.

[0106] In specific implementation, the above modules can be implemented as independent entities, or can be arbitrarily combined and implemented as the same or several entities. The specific implementation of the above modules can be found in the previous method embodiments, which will not be repeated here.

[0107] Those skilled in the art can understand that all or part of the steps in the various methods of the above embodiments can be completed by instructions, or by controlling related hardware through instructions, and the instructions can be stored in a computer-readable storage medium and loaded and executed by a processor. To this end, an embodiment of the present application provides a storage medium, which stores a plurality of instructions, and when the instructions are executed by the processor, any step in the nanosilver fully automatic bonding and dispensing method provided in the above embodiments can be implemented.

[0108] The storage medium may include: a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, etc.

[0109] Since the instructions stored in the storage medium can execute the steps in any embodiment of the nanosilver fully-automatic bonding and dispensing method provided in the embodiments of the present application, the beneficial effects that can be achieved by any nanosilver fully-automatic bonding and dispensing method provided in the embodiments of the present application can be achieved. Please see the previous embodiments for details and will not be repeated here.

[0110] The above is a detailed introduction to a nano-silver fully automatic laminating and dispensing method, device, electronic device and storage medium provided in the embodiments of the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and its core idea of ​​the present application; at the same time, for those skilled in the art, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application. Moreover, for those of ordinary skill in the art, without departing from the principles of the present application, several improvements and modifications can be made, and these improvements and modifications are also regarded as the scope of protection of the present application.

Claims

1. A nano silver fully automatic laminating and dispensing system, characterized in that: include: A visual recognition module is used to take a photo when the nozzle on the nano-silver fully automatic bonding and dispensing system sucks the chip to be processed, obtain a chip photo containing the chip to be processed, and analyze and process the chip photo to obtain the position state of the chip to be processed in the chip photo; A four-axis motion module is used to adjust the position of the chip to be processed according to the position state, and to control the four axes in the nanosilver automatic bonding system to move, so as to move the nozzle to a specific position, wherein the four axes include an X-axis, a Y-axis, a Z-axis and an R-axis, and the specific positions include a material taking position, a photographing position, a glue dispensing position and a bonding position; A glue dispensing processing module, used for performing glue dispensing processing on the chip to be processed; The bonding processing module is used to perform bonding processing on the chip to be processed after the glue dispensing processing.

2. The nano-silver fully automatic laminating and dispensing system according to claim 1, characterized in that: The visual recognition module comprises: A status detection unit, used to detect whether the nozzle on the nano-silver fully automatic bonding and dispensing system has sucked the chip to be processed; An image acquisition unit, used to control the image acquisition device to perform photo processing to obtain a chip photo containing the chip to be processed; An image processing unit is used to analyze and process the chip photo, at the center point of the chip in the chip photo.

3. The nano-silver fully automatic laminating and dispensing system as claimed in claim 2, characterized in that: The image acquisition unit comprises: A position detection subunit, used for detecting whether the chip to be processed is in the photographing position, and generating a photographing instruction when it is determined that the chip to be processed is in the photographing position; The photographing processing subunit is used to receive and respond to the photographing instruction to control the image acquisition device to perform photographing processing to obtain a chip photo containing the chip to be processed.

4. The nano-silver fully automatic laminating and dispensing system according to claim 1, characterized in that: The four-axis motion module comprises: A first positioning unit, used to obtain a photo center point in the chip photo; A first compensation unit, configured to calculate first motion compensation values ​​corresponding to the four axes respectively according to the position state and the center point of the photo; The first control unit is used to control the four axes according to the first motion compensation value to adjust the position of the chip to be processed.

5. The nano-silver fully automatic laminating and dispensing system according to claim 1, characterized in that: The four-axis motion module further includes: A second positioning unit is used to obtain the position information of the four axes and obtain the target position included in the control instruction for controlling the nozzle, wherein the target position is any one of the specific positions; A second compensation unit, configured to calculate second motion compensation values ​​corresponding to the four axes respectively according to the position information and the target position; The second control unit is used to control the four axes according to the second motion compensation to move the suction nozzle to the target position.

6. The nano-silver fully automatic laminating and dispensing system according to claim 1, characterized in that: The dispensing processing module comprises: A parameter acquisition unit, used to acquire physical parameters of the chip to be processed, wherein the physical parameters include step length and width, and snowflake line segment length; A glue dispensing calculation unit, used to calculate according to the physical parameters to obtain a glue dispensing position for performing glue dispensing processing on the chip to be processed; The glue dispensing processing unit is used to control the glue dispensing device to perform glue dispensing processing on the chip to be processed according to the glue dispensing position.

7. The nano-silver fully automatic laminating and dispensing system according to claim 1, characterized in that: The lamination processing module comprises: A pressure detection unit, used to obtain a laminating pressure value during laminating processing; The laminating processing unit is used to control the laminating pressure value to be within a standard pressure range, and perform laminating processing on the chip to be processed after the glue dispensing processing.

8. A nano-silver fully automatic laminating and dispensing method, applied to the nano-silver fully automatic laminating and dispensing system according to any one of claims 1 to 7, characterized in that: The method comprises: Receive an input job request, analyze and process the job request, and obtain a job requirement corresponding to the job request; When the operation requirement is dispensing and laminating, the suction nozzle is controlled to move to the material taking position to suck the chip to be processed; Controlling the photographing state to perform photographing processing to obtain a chip photo containing the chip to be processed, and analyzing and processing the chip state to obtain a position state of the chip to be processed in the chip photo; Controlling the four axes to adjust according to the position state, so as to adjust the chip to be processed to an initial state; According to the initial position and the glue dispensing position in the initial state, the four axes are controlled to be adjusted so as to move the chip to be processed to the glue dispensing position, and perform glue dispensing on the chip to be processed; When it is detected that the dispensing of the chip to be processed is completed, the chip to be processed after the dispensing treatment is moved to the bonding position according to the dispensing position and the bonding position, and the bonding process is performed on the chip to be processed after the dispensing treatment; When it is detected that the chip to be processed after the glue dispensing process has completed the bonding process, the four axes are controlled to be adjusted according to the first storage position and the bonding position to move the processed chip to be processed to the first storage position.

9. An electronic device, characterized in that: The electronic device comprises a processor, a memory, and a computer program stored in the memory and executable on the processor, and the processor implements the steps in the method according to claim 8 when executing the computer program.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in the method according to claim 8 are implemented.

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