Multi-layer copper bar fixing device clamp and machining device

Abstract

The invention relates to a multilayer copper bar fixing device clamp and a processing device.The multilayer copper bar fixing device clamp comprises a base plate, a base, a quick pressing clamp, a plurality of height limiting blocks and limiting columns, the base is fixedly connected to the middle of the upper portion of the base plate, the quick pressing clamp is arranged at the top of the base, the height limiting blocks are arranged on the base plate, and the limiting columns are arranged on the base plate; the limiting column is arranged on the base plate and is close to the height limiting block, the height limiting block and the limiting column are matched to support multiple layers of copper bars, a protruding piece is arranged on one side of the top of the height limiting block and supports one side of the bottom of the copper bar arranged at the stacking high position, and the pressing portion of the quick pressing clamp fixes the copper bar at the high position. The multi-layer copper bar can be efficiently and stably clamped and fixed, it is ensured that the position of the copper bar is accurate in the dispensing machining process, and the machining quality problem caused by displacement is avoided.

Description

Technical Field

[0001] The present application relates to the technical field of new energy component processing, and in particular to a multi-layer copper busbar fixing device clamp and processing device. Background Art

[0002] At present, copper busbars are widely used in the manufacturing of new energy structural parts, such as electric vehicle battery packs, photovoltaic inverters, etc., and are an important part of modern industrial production. With the continuous improvement of product quality and production efficiency, higher requirements are put forward for the processing accuracy and stability of copper busbars. In this context, the processing technology and equipment of copper busbars are constantly improving, which has promoted the rapid development of the entire industry.

[0003] In order to achieve effective clamping and fixing of copper bars in the prior art, one of the most common methods is to set a fixed fixture on the processing table, and place and fix the copper bars on the fixture manually or pneumatically. When the copper bars are fixed to the specified position, it is difficult to align accurately, so the installer needs to repeatedly adjust the position of the copper plate. This error accumulation may cause the installation accuracy of the entire copper bar to be seriously reduced, affecting the reliability of the product; because the copper bars are not fixed reasonably with clips, as the copper bars move for a long time, they will gradually move in the clips, loosening the copper bars at the fixed position of the glue, thereby affecting the processing accuracy of the copper bars; and when glue is applied to stacked multi-layer copper bars, if multiple fixing fixtures are used, it will not only occupy the processing space, but also be cumbersome to install and fix, affecting the processing efficiency.

[0004] In view of the above-mentioned related technologies, it is necessary to propose a multi-layer copper busbar fixing device and processing device to solve one of the above-mentioned technical problems. Summary of the invention

[0005] In order to solve one of the above-mentioned technical problems, the present application provides a multi-layer copper busbar fixing device clamp and processing device.

[0006] The present application provides a multi-layer copper busbar fixing device and processing device using the following technical solutions: A multi-layer copper busbar fixing device clamp comprises: a substrate, a base, a quick-pressing clamp, a plurality of height-limiting blocks and a limiting column, wherein the base is fixedly connected to the upper middle part of the substrate, the quick-pressing clamp is arranged on the top of the base, the height-limiting block is arranged on the substrate, the limiting column is arranged on the substrate and is arranged close to the height-limiting block, the height-limiting block cooperates with the limiting column to support multi-layer copper busbars, a convex piece is arranged on the top side of the height-limiting block to support the bottom side of the copper busbar arranged at a high position of the stack, and the pressing part of the quick-pressing clamp fixes the high-position copper busbar.

[0007] By adopting the above technical solution, it is possible to achieve efficient and stable clamping and fixation of multi-layer copper busbars, ensuring the accurate position of the copper busbars during the dispensing process and avoiding processing quality problems caused by displacement; at the same time, the design of the device enables multiple copper busbars to be processed at the same time, thereby improving production efficiency; in particular, the coordinated use of height limit blocks and limit columns can provide stable support between copper busbars of different heights, ensuring that the relative position between the copper busbars remains unchanged, further improving processing accuracy.

[0008] Optionally, a height-equalizing block is provided on the substrate, the height-equalizing block is provided between a plurality of the limiting columns, a convex rod is provided on the top of the height-equalizing block, and the convex rod is inserted into an opening on one side of the copper busbar.

[0009] By adopting the above technical solution, the setting of equal-height blocks can ensure that the multi-layer copper busbar maintains the same height during the clamping process, effectively avoiding processing errors caused by unevenness; the convex rod is inserted into the opening of the copper busbar, which further improves the positioning accuracy of the copper busbar and ensures the smooth progress of subsequent gluing and other processes.

[0010] Optionally, a hole positioning block is provided at the top edge of the substrate, the hole positioning block is provided close to one side of the height limiting block, and the hole positioning block is used to position a plurality of openings at the edge of the copper busbar.

[0011] By adopting the above technical solution, the hole positioning block can accurately locate multiple openings at the edge of the copper busbar, ensuring that the multi-layer copper busbar remains accurately aligned during the fixing and processing process, thereby improving the consistency and reliability of the product.

[0012] A multi-layer copper busbar processing device, comprising: A processing table, wherein a support frame is provided on the processing table, and a glue dispensing mechanism is provided on the support frame for performing glue dispensing processing on the multi-layer copper busbar; A carrier frame is arranged on the processing table, a plurality of carrier bases are arranged on the carrier frame at equal intervals, and a fixing device clamp is arranged on the carrier base; The support frame is provided with an adjustment seat, one end of the adjustment seat is provided with an adjustment cylinder, the output end of the adjustment cylinder is provided with a connecting rod, the rod head of the connecting rod is fixedly connected with an insert block, the tail end of the support base is provided with a slot, and the insert block is inserted into the slot.

[0013] By adopting the above technical solution, the support frame and glue dispensing mechanism arranged on the processing table can perform precise glue dispensing processing on the multi-layer copper busbar; the adjusting cylinder on the adjusting seat can drive the connecting rod to move, so that the plug block can be inserted into or withdrawn from the slot of the bearing base, thereby adjusting the position of the bearing base; this design enables the multi-layer copper busbar to be easily fine-tuned during the processing, thereby improving the processing accuracy and efficiency; at the same time, the matching method of the plug block and the slot ensures the stability of the fixation and avoids displacement problems caused by vibration or other external factors.

[0014] Optionally, a limiting hole is provided through the tail end of the bearing base, the limiting hole passes through the slot and the insert block, a threaded rod is provided in the limiting hole, and both ends of the threaded rod are fixed relative to the side surface of the bearing base by nuts.

[0015] By adopting the above technical solution, the setting of the limit hole and the threaded rod can effectively enhance the connection stability between the plug block and the slot, prevent the bearing base from shifting due to vibration during the processing, thereby ensuring the processing accuracy and quality of the multi-layer copper busbar; at the same time, the structural design of fixing the two ends of the threaded rod with nuts makes the adjustment more convenient and quick, and improves the overall flexibility and adaptability of the device.

[0016] Optionally, a bracket is provided on the supporting base, and the bracket is in a "▽" shape. The top of the bracket is connected to the bottom of the substrate. A driving motor is provided on the supporting base, and the output end of the driving motor is connected to the bottom of the bracket for changing the horizontal position of the substrate.

[0017] By adopting the above technical solution, precise horizontal position adjustment of the substrate is achieved; specifically, the design of the bracket enables the substrate to be firmly fixed on the supporting base, and the coordinated use of the drive motor and the bracket can flexibly control the position change of the substrate, thereby ensuring the precise alignment and stable fixation of the multi-layer copper busbar during the processing, thereby improving the processing accuracy and production efficiency.

[0018] Optionally, the dispensing mechanism includes a dispensing rack, a delivery pump, a dispensing tube and a glue supply cylinder. The dispensing rack is slidably arranged on the support rack, the delivery pump is installed at the front end of the dispensing rack, the dispensing tube is clamped on the dispensing rack, the delivery pump is connected to the dispensing tube, the glue supply cylinder is arranged on the side of the dispensing rack, and the delivery pump is connected to the glue supply cylinder.

[0019] By adopting the above technical solution, precise dispensing processing of multi-layer copper busbars is achieved; specifically, the dispensing mechanism includes a dispensing frame slidably set on a support frame, a delivery pump installed at the front end of the dispensing frame, a dispensing tube clamped on the dispensing frame, and a glue supply cylinder arranged on the side of the dispensing frame and connected to the delivery pump; this design makes the dispensing process more flexible and precise, and can adapt to multi-layer copper busbars at different positions and heights, thereby improving production efficiency and product quality.

[0020] Optionally, a fixed block is provided on the dispensing rack, a fixed rod is fixedly connected to the bottom of the fixed block, a rotating motor is nested at the lower end of the fixed rod, a rotating block is provided at the output end of the rotating motor, a wiping plate is provided at one end of the rotating block, and the wiping plate is provided below the dispensing tube for wiping glue at the nozzle of the dispensing tube.

[0021] By adopting the above technical solution, the fixed block on the dispensing rack can firmly install the fixed rod, and the rotating motor at the lower end of the fixed rod drives the rotating block to rotate, so that the wiping plate can move under the dispensing tube, effectively removing the residual glue during the dispensing process, avoiding blockage or contamination caused by glue accumulation, and improving the dispensing quality and efficiency.

[0022] Optionally, the fixed rod includes an upper rod, a lifting cylinder and a lower rod, the upper rod is connected to the bottom of the fixed block, the lifting cylinder is nested in the bottom of the upper rod, the lower rod is fixedly connected to the output end of the lifting cylinder, and the rotating motor is nested in the bottom of the lower rod.

[0023] By adopting the above technical solution, the structural design of the fixed rod enables the rotating motor to move up and down, thereby driving the wiping plate to adjust its height; this adjustability improves the adaptability and flexibility of the equipment, allowing the wiping plate to be more accurately aligned with the nozzles of the dispensing tubes of different lengths or positions, ensuring that residual glue can be effectively removed each time it is used, avoiding blockages caused by glue accumulation; at the same time, the application of the lifting cylinder simplifies the operating process, reduces manual intervention, and improves work efficiency.

[0024] Optionally, the wiping plate includes a rotating bottom plate and an adsorption cotton layer, the rotating bottom plate is connected to one end of the rotating block, and the adsorption cotton layer is arranged on the top of the rotating bottom plate.

[0025] By adopting the above technical solution, the residual glue at the nozzle of the dispensing tube can be effectively cleaned to prevent the glue from drying and clogging the dispensing tube, thereby improving the dispensing accuracy and the stability of equipment operation; the rotating bottom plate is connected to the rotating block, making the wiping action more flexible and accurate, adapting to the needs of different angles and positions, and ensuring that the nozzle can be kept clean before each dispensing; the design of the adsorption cotton layer increases the contact area, improves the cleaning efficiency, and reduces the wear on the nozzle.

[0026] In summary, the present application includes at least one of the following beneficial technical effects: 1. The design of the fixture clamp enables multi-layer copper busbars to be effectively fixed at different heights and numbers of layers, solving the problem of narrow application range of traditional fixtures and enhancing the versatility and flexibility of the device; the coordinated use of the quick-press clamp, height limit block and limit column ensures the stability and safety of the copper busbar during processing, prevents the processing accuracy from being affected by looseness or deformation, and thus improves the overall production efficiency and product quality; 2. During the process of dispensing glue on the copper busbar, the wiper plate can be used to more accurately align the nozzles of the dispensing tubes of different lengths or positions, ensuring that residual glue can be effectively removed each time it is used to avoid blockages caused by glue accumulation; at the same time, the application of the lifting cylinder simplifies the operating process, reduces manual intervention, and improves work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a three-dimensional view of a multi-layer copper busbar fixture clamp in the present application.

[0028] Figure 2 This is a three-dimensional view of a multi-layer copper busbar stacked on a multi-layer copper busbar fixing device clamped by the present application (without a quick-press clamp).

[0029] Figure 3 It is a three-dimensional view of a processing device for a multi-layer copper busbar in the present application.

[0030] Figure 4 This is a three-dimensional view of a multi-layer copper busbar processing device (without a fixing device clip) in the present application.

[0031] Figure 5 It is a cross-sectional view of a supporting base of a multi-layer copper busbar processing device in the present application.

[0032] Figure 6 yes Figure 3 A schematic diagram of the enlarged structure at point A in the middle.

[0033] Figure 7 yes Figure 3 A magnified schematic diagram of the structure at point B in the middle.

[0034] In the figure: 1, substrate; 11, equal height block; 12, convex rod; 13, hole positioning block; 2, base; 3, quick press clamp; 4, height limit block; 41, convex piece; 5, limit column; 6, processing table; 61, support frame; 611, translation cylinder; 62, dispensing mechanism; 621, dispensing frame; 622, delivery pump; 623, dispensing tube; 624, glue supply cylinder; 63, driving cylinder; 7, bearing frame; 71, bearing base; 711, Slot; 712, limit hole; 713, threaded rod; 714, bracket; 715, drive motor; 72, adjustment seat; 73, adjustment cylinder; 74, connecting rod; 75, plug-in block; 8, fixing block; 81, fixing rod; 811, upper rod; 812, lifting cylinder; 813, lower rod; 82, rotating motor; 83, rotating block; 84, wiping plate; 841, rotating bottom plate; 842, adsorption cotton layer; 9, copper busbar. DETAILED DESCRIPTION

[0035] The following is combined with the accompanying drawings Figure 1-Figure 7 This application is described in further detail.

[0036] Example 1, reference Figure 1 and Figure 2 The embodiment of the present application discloses a multi-layer copper busbar fixing device clamp, comprising: a substrate 1, a base 2, a quick-pressing clamp 3, a plurality of height-limiting blocks 4 and a limiting column 5. The base 2 is fixedly connected to the upper middle part of the substrate 1, the quick-pressing clamp 3 is arranged on the top of the base 2, the height-limiting block 4 is arranged on the substrate 1, and the limiting column 5 is arranged on the substrate 1 and is arranged near the height-limiting block 4. The height-limiting block 4 and the limiting column 5 cooperate to support the multi-layer copper busbar 9. A convex piece 41 is arranged on the top side of the height-limiting block 4 to support the bottom side of the copper busbar 9 arranged at a high position of the stack. The pressing part of the quick-pressing clamp 3 fixes the high-position copper busbar 9.

[0037] By adopting the above technical scheme, the effective clamping and fixing of the multi-layer copper busbar 9 can be achieved; specifically, the design of the fixing device clamp further improves the functionality and reliability of the device; the base 2 and the quick-pressing clamp 3 fixed on the substrate 1 can not only quickly put the multi-layer copper busbar 9 in place, but also apply uniform pressure to the copper busbar 9 during the processing to ensure that each layer of copper busbar 9 fits tightly; the coordinated use of the height limiting block 4 and the limiting column 5 can effectively support the stacking of copper busbars 9 of different heights, and the convex piece 41 design on the top of the height limiting block 4 can provide additional support at the bottom of the copper busbar 9 at a higher position to prevent the copper busbar 9 from deforming or falling off when subjected to force; the pressing part of the quick-pressing clamp 3 can reliably fix the high-position copper busbar 9 in the final stage to ensure the safety and efficiency of the entire processing process; overall, the device realizes the precise clamping and fixing of the multi-layer copper busbar 9 through the synergistic effect of multiple structures, thereby improving production efficiency and product quality.

[0038] refer to Figure 1In this embodiment, more specifically, a height-contact block 11 is provided on the substrate 1, and the height-contact block 11 is provided between a plurality of limit posts 5. A convex rod 12 is provided on the top of the height-contact block 11, and the convex rod 12 is inserted into an opening on one side of the copper busbar 9. The setting of the height-contact block 11 can ensure that the multi-layer copper busbar 9 maintains the same height during the clamping process, and effectively avoids processing errors caused by unevenness; the convex rod 12 is inserted into the opening of the copper busbar 9, which further improves the positioning accuracy of the copper busbar 9 and ensures the smooth progress of subsequent dispensing and other processes.

[0039] refer to Figure 1 In the present embodiment, more specifically, a hole positioning block 13 is provided at the top edge of the substrate 1. The hole positioning block 13 is provided on one side close to the height limiting block 4. The hole positioning block 13 is used to position a plurality of openings at the edge of the copper busbar 9. The hole positioning block 13 can accurately position a plurality of openings at the edge of the copper busbar 9, ensuring that the multi-layer copper busbar 9 maintains precise alignment during the fixing and processing process, thereby improving the consistency and reliability of the product.

[0040] The implementation principle of a multi-layer copper busbar fixing device clamp of the embodiment of the present application is as follows: the base 2 and the quick-pressing clamp 3 fixed on the substrate 1 at the fixing device clamp apply uniform pressure to the copper busbar 9 during the processing to ensure that each layer of the copper busbar 9 fits tightly; the coordinated use of the height limiting block 4 and the limiting column 5 can effectively support the stacking of copper busbars 9 of different heights, and the convex piece 41 design on the top of the height limiting block 4 can provide additional support to the bottom of the copper busbar 9 at a higher position to prevent the copper busbar 9 from deforming or falling off when subjected to force, thereby ensuring the safety and efficiency of the entire processing process.

[0041] Example 2, reference Figure 3 and Figure 4 , a multi-layer copper busbar processing device includes: a processing table 6 and a carrier frame 7.

[0042] A support frame 61 is provided on the processing table 6, and a glue dispensing mechanism 62 is provided on the support frame 61 for performing glue dispensing processing on the multi-layer copper busbar 9; a bearing frame 7 is provided on the processing table 6, and a plurality of bearing bases 71 are provided on the bearing frame 7, and the bearing bases 71 are arranged on the bearing frame 7 at equal intervals, and a fixing device clamp is provided on the bearing base 71; an adjusting seat 72 is provided on the bearing frame 7, and an adjusting cylinder 73 is provided at one end of the adjusting seat 72, and a connecting rod 74 is provided at the output end of the adjusting cylinder 73, and an insert block 75 is fixedly connected to the rod head of the connecting rod 74, and a slot 711 is provided at the tail end of the bearing base 71, and the insert block 75 is inserted into the slot 711.

[0043] The support frame 61 and the glue dispensing mechanism 62 arranged on the processing table 6 can perform precise glue dispensing processing on the multi-layer copper busbar 9; the multiple equally spaced supporting bases 71 on the supporting frame 7 enable the multi-layer copper busbar 9 to maintain a stable position during the processing, avoiding quality problems caused by position offset; the adjusting cylinder 73 on the adjusting seat 72 can drive the connecting rod 74 to move, thereby allowing the plug block 75 to insert or withdraw from the slot 711 of the supporting base 71, thereby adjusting the position of the supporting base 71; this design enables the multi-layer copper busbar 9 to be easily fine-tuned during the processing, thereby improving the processing accuracy and efficiency; at the same time, the matching mode of the plug block 75 and the slot 711 ensures the stability of the fixation, avoiding displacement problems caused by vibration or other external factors.

[0044] refer to Figure 5 In the present embodiment, more specifically, a limiting hole 712 is provided at the rear end of the bearing base 71, and the limiting hole 712 passes through the slot 711 and the plug block 75. A threaded rod 713 is provided in the limiting hole 712, and both ends of the threaded rod 713 are fixed by nuts relative to the side of the bearing base 71. The setting of the limiting hole 712 and the threaded rod 713 can effectively enhance the connection stability between the plug block 75 and the slot 711, and prevent the bearing base 71 from shifting due to vibration during the processing, thereby ensuring the processing accuracy and quality of the multi-layer copper bus 9; at the same time, the structural design that the two ends of the threaded rod 713 are fixed by nuts makes the adjustment more convenient and quick, and improves the overall flexibility and adaptability of the device.

[0045] refer to Figure 4 In this embodiment, more specifically, the glue dispensing mechanism 62 includes a glue dispensing frame 621, a delivery pump 622, a glue dispensing tube 623 and a glue supply cylinder 624. The glue dispensing frame 621 is slidably arranged on the support frame 61, the delivery pump 622 is installed at the front end of the glue dispensing frame 621, the glue dispensing tube 623 is clamped on the glue dispensing frame 621, the delivery pump 622 is connected to the glue dispensing tube 623, and the glue supply cylinder 624 is arranged on the side of the glue dispensing frame 621, and the delivery pump 622 is connected to the glue supply cylinder 624, thereby realizing the precise glue dispensing processing of the multi-layer copper busbar 9; a translation cylinder 611 is arranged on the support frame 61, and the output end of the translation cylinder 611 is connected to the glue dispensing frame 621, and the glue supply cylinder 624 is used to dispensing the glue. The glue dispensing frame 621 moves horizontally, and a driving cylinder 63 is arranged on the processing table 6. The output end of the driving cylinder 63 is connected to the support frame 61 to realize the height adjustment of the support frame 61, so as to cooperate with the glue dispensing mechanism 62 to dispense glue to the copper bus 9; specifically, the glue dispensing frame 621 on the support frame 61, the delivery pump 622 installed at the front end of the glue dispensing frame 621, the glue dispensing tube 623 clamped on the glue dispensing frame 621 and the glue supply cylinder 624 arranged on the side of the glue dispensing frame 621 and connected to the delivery pump 622; this design makes the glue dispensing process more flexible and precise, can adapt to multi-layer copper bus bars 9 at different positions and heights, and improve production efficiency and product quality.

[0046] The implementation principle of a multi-layer copper busbar processing device according to an embodiment of the present application is as follows: the support frame 61 and the glue dispensing mechanism 62 arranged on the processing table 6 can perform precise glue dispensing on the multi-layer copper busbar 9, and the adjusting cylinder 73 on the adjusting seat 72 can drive the connecting rod 74 to move, thereby allowing the insert block 75 to be inserted into or withdrawn from the slot 711 of the bearing base 71, thereby adjusting the position of the bearing base 71, thereby cooperating with the fixing device clamp to fix the copper busbar 9 for use, and cooperating with the glue dispensing mechanism 62 to perform glue dispensing on the copper busbar 9 on the fixing device clamp.

[0047] Example 3, reference Figure 4 The difference between this embodiment and the second embodiment is that: a bracket 714 is provided on the bearing base 71, and the bracket 714 is in a "▽" shape. The top of the bracket 714 is connected to the bottom of the substrate 1, and a driving motor 715 is provided on the bearing base 71. The output end of the driving motor 715 is connected to the bottom of the bracket 714, which is used to change the horizontal position of the substrate 1, thereby realizing the precise horizontal position adjustment of the substrate 1; specifically, the design of the bracket 714 enables the substrate 1 to be firmly fixed on the bearing base 71, and at the same time, the coordinated use of the driving motor 715 and the bracket 714 can flexibly control the position change of the substrate 1, thereby ensuring the precise alignment and stable fixation of the multi-layer copper busbar 9 during the processing, thereby improving the processing accuracy and production efficiency.

[0048] Example 4, reference Figure 4 and Figure 6 The difference between this embodiment and the second embodiment is that: a fixed block 8 is provided on the dispensing frame 621, and a fixed rod 81 is fixedly connected to the bottom of the fixed block 8. A rotating motor 82 is nested at the lower end of the fixed rod 81. A rotating block 83 is provided at the output end of the rotating motor 82. A wiping plate 84 is provided at one end of the rotating block 83. The wiping plate 84 is provided below the dispensing tube 623 to wipe the glue at the tube mouth of the dispensing tube 623. The fixed block 8 on the dispensing frame 621 can stably install the fixed rod 81. The rotating motor 82 at the lower end of the fixed rod 81 drives the rotating block 83 to rotate, so that the wiping plate 84 can move below the dispensing tube 623, effectively removing the residual glue in the dispensing process, avoiding blockage or pollution caused by glue accumulation, and improving the dispensing quality and efficiency.

[0049] refer to Figure 6In the present embodiment, more specifically, the fixed rod 81 includes an upper rod 811, a lifting cylinder 812 and a lower rod 813. The upper rod 811 is connected to the bottom of the fixed block 8, the lifting cylinder 812 is nested at the bottom of the upper rod 811, the lower rod 813 is fixedly connected to the output end of the lifting cylinder 812, and the rotating motor 82 is nested at the bottom of the lower rod 813. The structural design of the fixed rod 81 enables the rotating motor 82 to move up and down, thereby driving the wiping plate 84 to adjust its height; this adjustability improves the adaptability and flexibility of the equipment, so that the wiping plate 84 can be more accurately aligned with the nozzle of the dispensing tube 623 of different lengths or positions, ensuring that the residual glue can be effectively removed each time it is used, avoiding blockage caused by glue accumulation; at the same time, the application of the lifting cylinder 812 simplifies the operation process, reduces manual intervention, and improves work efficiency.

[0050] refer to Figure 6 In the present embodiment, more specifically, the wiping plate 84 includes a rotating bottom plate 841 and an adsorption cotton layer 842. The rotating bottom plate 841 is connected to one end of the rotating block 83. The adsorption cotton layer 842 is arranged on the top of the rotating bottom plate 841, which can effectively clean the residual glue at the nozzle of the dispensing tube 623, prevent the glue from drying and clogging the dispensing tube 623, and improve the dispensing accuracy and equipment operation stability; the rotating bottom plate 841 is connected to the rotating block 83, so that the wiping action is more flexible and accurate, adapting to the needs of different angles and positions, and ensuring that the nozzle can be kept clean before each dispensing; the design of the adsorption cotton layer 842 increases the contact area, improves the cleaning efficiency, and reduces the wear on the nozzle.

[0051] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A multi-layer copper busbar fixing device clamp, characterized in that: include: A substrate (1), a base (2), a quick-pressing clamp (3), a plurality of height-limiting blocks (4) and a limiting column (5); the base (2) is fixedly connected to the upper middle part of the substrate (1); the quick-pressing clamp (3) is arranged on the top of the base (2); the height-limiting block (4) is arranged on the substrate (1); the limiting column (5) is arranged on the substrate (1) and is arranged close to the height-limiting block (4); the height-limiting block (4) and the limiting column (5) cooperate to support multiple layers of copper bars (9); a convex piece (41) is arranged on one side of the top of the height-limiting block (4) to support the bottom side of the copper bar (9) arranged at a high position of the stack; the pressing part of the quick-pressing clamp (3) fixes the high-position copper bar (9).

2. A multi-layer copper busbar fixing device clamp according to claim 1, characterized in that: The base plate (1) is provided with an equal height block (11), the equal height block (11) is arranged between a plurality of the limit columns (5), a convex rod (12) is arranged on the top of the equal height block (11), and the convex rod (12) is inserted into an opening on one side of the copper busbar (9).

3. A multi-layer copper busbar fixing device clamp according to claim 1, characterized in that: A hole positioning block (13) is provided at the top edge of the substrate (1), and the hole positioning block (13) is provided close to one side of the height limiting block (4). The hole positioning block (13) is used to position a plurality of openings at the edge of the copper busbar (9).

4. A multi-layer copper busbar processing device, characterized in that: include: A processing table (6), wherein a support frame (61) is provided on the processing table (6), and a glue dispensing mechanism (62) is provided on the support frame (61) for performing glue dispensing processing on the multi-layer copper busbar (9); A carrier frame (7) is arranged on the processing table (6), and a plurality of carrier bases (71) are arranged on the carrier frame (7), and the carrier bases (71) are arranged on the carrier frame (7) at equal intervals, and a fixing device clamp according to any one of claims 1 to 3 is arranged on the carrier base (71); The bearing frame (7) is provided with an adjustment seat (72), one end of the adjustment seat (72) is provided with an adjustment cylinder (73), the output end of the adjustment cylinder (73) is provided with a connecting rod (74), the rod head of the connecting rod (74) is fixedly connected with an insert block (75), the rear end of the bearing base (71) is provided with a slot (711), and the insert block (75) is inserted into the slot (711).

5. The processing device for a multi-layer copper busbar according to claim 4, characterized in that: A limiting hole (712) is provided at the rear end of the bearing base (71), the limiting hole (712) passes through the slot (711) and the insert block (75), a threaded rod (713) is provided in the limiting hole (712), and two ends of the threaded rod (713) are fixed relative to the side surface of the bearing base (71) by nuts.

6. The processing device for a multi-layer copper busbar according to claim 4, characterized in that: The bearing base (71) is provided with a bracket (714), the bracket (714) is in a "▽" shape, the top of the bracket (714) is connected to the bottom of the substrate (1), and the bearing base (71) is provided with a driving motor (715), the output end of the driving motor (715) is connected to the bottom of the bracket (714), and is used to change the horizontal position of the substrate (1).

7. The processing device for a multi-layer copper busbar according to claim 4, characterized in that: The glue dispensing mechanism (62) comprises a glue dispensing frame (621), a delivery pump (622), a glue dispensing tube (623) and a glue supply cylinder (624); the glue dispensing frame (621) is slidably arranged on the support frame (61); the delivery pump (622) is installed at the front end of the glue dispensing frame (621); the glue dispensing tube (623) is clamped on the glue dispensing frame (621); the delivery pump (622) is connected to the glue dispensing tube (623); the glue supply cylinder (624) is arranged on the side of the glue dispensing frame (621); and the delivery pump (622) is connected to the glue supply cylinder (624).

8. The processing device for a multi-layer copper busbar according to claim 7, characterized in that: The glue dispensing frame (621) is provided with a fixed block (8), the bottom of the fixed block (8) is fixedly connected with a fixed rod (81), the lower end of the fixed rod (81) is embedded with a rotating motor (82), the output end of the rotating motor (82) is provided with a rotating block (83), one end of the rotating block (83) is provided with a wiping plate (84), the wiping plate (84) is arranged corresponding to the bottom of the glue dispensing tube (623), and is used to wipe the glue at the tube mouth of the glue dispensing tube (623).

9. The multi-layer copper busbar processing device according to claim 8, characterized in that: The fixed rod (81) comprises an upper rod (811), a lifting cylinder (812) and a lower rod (813); the upper rod (811) is connected to the bottom of the fixed block (8); the lifting cylinder (812) is nested in the bottom of the upper rod (811); the lower rod (813) is fixedly connected to the output end of the lifting cylinder (812); and the rotating motor (82) is nested in the bottom of the lower rod (813).

10. The multi-layer copper busbar processing device according to claim 8, characterized in that: The wiping plate (84) comprises a rotating bottom plate (841) and an adsorption cotton layer (842); the rotating bottom plate (841) is connected to one end of the rotating block (83); and the adsorption cotton layer (842) is arranged on the top of the rotating bottom plate (841).

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